JP2003234613A - Antenna element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To laminate and integrally mold a power feeding patch and a power feeding circuit element, to improve a manufacture property and reliability, to suppress the generation of a surface wave mode and to form an excellent radiation pattern. <P>SOLUTION: The power feeding circuit part is constituted of a microstrip line. A part of a one side ground conductor serving also as a connector attaching tool is counterbored and the microstrip line and the tool are prevented from interfering. Also, by counterboring a part of a dielectric, a structure in which a connector and the connection part of a power feeding circuit can be connected by soldering from an upper surface is attained. Also, in the case of constitution for the purpose of band widening for instance, by turning the substrate of the dielectric to the same size as the power feeding patch and making the dielectric forming a non power feeding patch individual for each antenna element, the generation of the surface wave mode which is the problem in a conventional technique is suppressed and the structure forming the excellent radiation pattern is attained. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna element used for an antenna installed on the ground, an antenna mounted on a moving body, or an array antenna composed of a plurality of antenna elements.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional microstrip antenna, which is shown, for example, in Proceedings S6-5 of the National Conference of the Institute of Electronics and Communication Engineers of 1979. In the figure,
1 is a feeding patch, 2 is a dielectric substrate, 3 is an antenna ground conductor, 4 is a feeding point, 5 is a feeding pin that feeds power to the feeding point,
6 is a short pin for conducting the center of the feeding patch 1 and the antenna ground plane conductor 3; 7 is a dielectric substrate for forming a triplate line provided on the back surface of the antenna ground conductor;
Reference numeral 8 is a conductor in the triplate line (feeding circuit), 9 is a coaxial connector, and 10 is a chassis for mounting a connector serving as a ground conductor on one side of the triplate line. FIG. 6 shows a configuration example for widening the frequency characteristics of the conventional microstrip antenna. Reference numeral 11 is a parasitic patch, and 12 is a dielectric substrate for forming the parasitic patch.
10 is the same as in FIG. The microstrip antenna shown in FIG. 6 inputs an RF signal from the coaxial connector 9 in the figure, feeds it to the feeding patch 1 through the conductor 8 in the triplate line, and radiates it.

[0003]

In a substrate such as a printed circuit board on which a circuit pattern is formed by etching and then laminated, it is difficult to connect the conductor in the tri-plate and the power feeding patch through the through hole.
It is difficult to integrally form the power feeding patch and the power feeding circuit section, and in order to achieve a wider band, when the parasitic patch and the dielectric substrate forming the dielectric substrate are attached, the antenna elements are arrayed. When excited, a surface wave mode was generated in the dielectric, and the radiation pattern collapsed, which was a problem.

Further, since a resistor chip and the like cannot be mounted in the triplate, it is impossible to form a power supply circuit having an isolation port. Further, if a feeding circuit is formed on the radiation surface of the antenna in order to solve this problem, the radiation pattern is disturbed.

The present invention has been made in order to solve the above problems. With the structure described in the claims, it is possible to integrally laminate the power feeding patch and the power feeding circuit section, and to improve manufacturability and reliability. You can improve your sex. Further, it is intended to suppress the generation of the surface wave mode and form a good radiation pattern.

[0006]

SUMMARY OF THE INVENTION An antenna element according to the present invention is an antenna element composed of a planar feed circuit and a feed element formed on a multilayer dielectric substrate, wherein the feed element is formed on the upper surface of a first dielectric substrate. Then, the ground conductor of the planar antenna is formed on the lower surface of the first dielectric substrate, and the microstrip line is formed on the lower surface of the second dielectric substrate attached to the lower surface of the first dielectric substrate. A chassis plate attached to the lower surface of the second dielectric substrate is provided, and the chassis plate is engraved so that the planar circuit contact portion has a space so as not to contact the planar circuit, and A coaxial connector for inputting an RF signal to the microstrip line is embedded in the chassis plate, and an inner conductor of the coaxial connector is attached to the microstrip line. The inner conductor of the coaxial connector, which is connected to the line, penetrates through the inside of the through hole provided in the microstrip line to the upper surface of the second dielectric substrate, and the first conductor is formed at the portion where the inner conductor penetrates. A hole is provided in the first dielectric substrate so that the inner conductor can be seen from the upper surface of the dielectric substrate.

Further, in the third dielectric substrate provided on the upper surface of the first dielectric substrate so as not to cover up the holes of the first dielectric substrate, the feeding element is provided on the third dielectric substrate. May be configured.

A shorting pin may be provided for electrically connecting the center of the power feeding element formed on the third dielectric substrate to the chassis plate portion.

Furthermore, the short pin may be provided with a stress relief structure.

It is also possible to form a circularly polarized wave generation circuit in the power feeding circuit of the second dielectric substrate and generate circularly polarized wave by feeding power at two orthogonal power feeding positions.

The array antenna may be formed by surrounding the power feeding circuit with a ground conductor and forming a number of the antenna elements described in the first to sixth aspects on the same substrate.

Further, a low dielectric constant material (εr <3.0) may be used for the third dielectric substrate.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. 1 is a diagram showing a first embodiment of the present invention, 13 is a microstrip line, 14 is a jig counterbore, 15 is a dielectric counterbore, and 1 to 5, 7, 9, 10 are shown in FIG. Is the same as.

A part of the one-side ground conductor / connector mounting jig of the one-side ground conductor / connector mounting chassis 10 is provided with a counterbore like a jig counterbore portion 14 so that the microstrip line 13 and the jig do not interfere with each other. . Further, by attaching the dielectric counterbore portion 15 to a part like the dielectric counterbore portion 15, the connection portion between the coaxial connector 9 and the microstrip line 13 can be connected by soldering from the upper surface.

In the antenna element composed of the microstrip line 13 and the feeding patch 1 formed on the multilayer dielectric substrate 2, the feeding patch 1 is formed on the upper surface of the first dielectric substrate 2, and the first dielectric substrate 2 is formed. Antenna ground conductor 3 on the underside of
And the microstrip line 1 is formed on the lower surface of the second dielectric substrate 7 which is attached to the lower surface of the first dielectric substrate 2.
Make up three.

A chassis plate 10 attached to the lower surface of the second dielectric substrate 7 is provided.
Is engraved so that the planar circuit contact portion has a recess so as not to contact the microstrip line 13, and a coaxial connector 9 for inputting an RF signal to the microstrip line 13 is attached to the chassis plate 10. It is embedded.

The inner conductor of the coaxial connector 9 is connected to the microstrip line 13, and the inner conductor 9 of the coaxial connector passes through the through hole provided in the microstrip line 13 and the upper surface of the second dielectric substrate 7. Penetrates into. In addition, the microstrip line 13 penetrates the triplate line dielectric substrate 7 and the dielectric substrate 2 by the feeding pin 5, and is connected to the feeding patch 1 at the feeding point 4.

In this antenna element, a hole is provided in the first dielectric substrate 2 so that the inner conductor can be seen from the upper surface of the first dielectric substrate 2 in the portion where the inner conductor penetrates.

According to the above, by adopting the structure of the microstrip line 13 in which the chassis plate is engraved, for example, even in a substrate such as a printed circuit board on which a circuit pattern is formed by etching, the microstrip line 13 and through holes are processed. Interlayer connection is possible, and the power feeding patch 1 and the power feeding circuit 8 can be laminated and integrally molded. Further, the number of layers is reduced as compared with the case of the triplate line structure, and the number of steps at the time of etching / through-hole processing can be reduced, leading to improvement in manufacturability.

Embodiment 2. FIG. 2 is a diagram showing a second embodiment, where 1 to 5, 7, 9, 10 are the same as FIG. 5, and 13 to 15 are the same as FIG. In the case of the configuration for widening the band, the dielectric substrate 12 has the same size as the parasitic patch 11, and the dielectric forming the parasitic patch 11 has an individual structure for each antenna element.

According to the above, the dielectric forming the parasitic patch has a separate structure for each antenna element, and the occurrence of the surface wave mode, which has been a problem in the prior art, is suppressed.
It is possible to form a good radiation pattern.

Embodiment 3. FIG. 3 is a diagram showing a third embodiment, wherein 1 to 7, 9 to 12 are shown in FIG. 5, and 13 to 15 are shown in FIG.
Is the same as. The structure is such that the center of the power feeding patch 13 formed on the dielectric substrate 2 and the chassis plate portion 10 are electrically connected to each other by the short pin 6.

According to the above, the structure in which the shorting pin 6 for electrically connecting the power feeding patch 13 on the third dielectric substrate 2 and the chassis plate portion 10 is provided allows the center of the third dielectric substrate 2 to be centered. Can be dropped to the same potential as the chassis plate 10. As a result, electrostatic breakdown due to discharge from the parasitic patch 11 can be prevented.

Fourth Embodiment FIG. 4 is a diagram showing a fourth embodiment. 1 to 7, 9 to 12 are the same as FIG. 5, and 13 to 15 are the same as FIG. A stress relief structure was formed by bending and connecting the connecting portion between the short pin 6 and the chassis.

According to the above, by providing the short pin 6 with a stress structure, the thermal stress of the short pin 6 due to temperature change can be released.

A circular polarization generating circuit is formed in the backside microstrip line of the antenna elements of Examples 1 to 3,
Further, it is possible to adopt a structure in which power is supplied at two power supply positions that are orthogonal to each other.

According to this, the microstrip line 1
By forming a circularly polarized wave generation circuit inside 3, circularly polarized wave can be generated.

The antenna elements of Examples 1 to 5 can be arrayed. The feeding circuit portion 8 on the lower surface of each antenna element may be individually structured for each antenna element.

According to this, it is possible to suppress the generation of the surface wave mode and form a good radiation pattern.

A low dielectric constant material (εr <
3.0) was used.

According to this, the electric field surface and the magnetic field surface of the antenna radiation pattern can be made to match up to a wide angle, and an antenna with a wide angle and a low axial ratio can be realized.

[0032]

As described above, according to the present invention, the microstrip line and the through-hole can be connected between layers, and the power feeding patch and the microstrip line can be laminated and integrally formed. The number of layers is reduced as compared with the case of the plate line structure, and the number of steps during etching processing of the through hole is reduced, which leads to improvement in manufacturability.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

FIG. 3 is a diagram showing a third embodiment of the present invention.

FIG. 4 is a diagram showing Embodiments 4, 5, 6, and 7 of the present invention.

FIG. 5 is a diagram showing a conventional technique.

FIG. 6 is a diagram showing a conventional technique.

[Explanation of symbols]

1 feeding patch, 2 dielectric substrate, 3 antenna ground conductor, 4 feeding point 5 feeding pin, 6 short pin, 7 tri-plate line dielectric substrate, 8 tri-plate line conductor (feeding circuit), 9 coaxial connector,
10 chassis plate, 11 parasitic patch, 1
2 dielectric substrate, 13 microstrip line,
14 jig counterbore part, 15 dielectric counterbore part

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toru Takahashi             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. F term (reference) 5J045 AA05 AB05 AB06 CA04 DA10                       FA01 FA09 GA02 GA04 HA06                       JA15 MA07 NA01

Claims (7)

[Claims] 1. An antenna element comprising a planar feeding circuit and a feeding element formed on a multilayer dielectric substrate, wherein a feeding element is formed on an upper surface of a first dielectric substrate, and a lower surface of the first dielectric substrate is formed. A chassis that constitutes an antenna ground conductor, comprises a microstrip line on the lower surface of a second dielectric substrate that is attached to the lower surface of the first dielectric substrate, and that attaches to the lower surface of the second dielectric substrate. A coaxial connector for inputting an RF signal to the microstrip line is provided with a plate, and the chassis plate is engraved so as to have a recess in the planar circuit contact portion so as not to contact the microstrip line. Embedded in the chassis plate, the inner conductor of the coaxial connector is connected to the microstrip line, and The conductor penetrates through the inside of the through hole provided in the microstrip line to the upper surface of the second dielectric substrate, and the inner conductor can be seen from the upper surface of the first dielectric substrate at the portion where the inner conductor penetrates. An antenna element, characterized in that a hole is provided in the first dielectric substrate as described above. 2. A third dielectric substrate is provided on the upper surface of the first dielectric substrate so as not to cover the holes of the first dielectric substrate, and a feeding element is provided on the third dielectric substrate. The antenna element according to claim 1, which is configured. 3. The antenna element according to claim 2, further comprising a shorting pin for electrically connecting the center of the power feeding element formed on the third dielectric substrate to the chassis plate portion. 4. The antenna element according to claim 3, wherein the short pin is provided with a stress relief structure. 5. The circularly polarized wave generating circuit is formed in the power feeding circuit of the second dielectric substrate, and circularly polarized wave is generated by feeding at two orthogonal power feeding positions. The antenna element according to claim 4. 6. A power supply circuit is surrounded by a ground conductor, and the power supply circuit is surrounded by a ground conductor.
An antenna element, wherein an array antenna is formed by forming a large number of the antenna elements according to claim 5 on the same substrate. 7. A low dielectric constant material (εr
<3.0) is used, The antenna element of any one of Claims 2-4.