JP2003232958A - Optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module in which the power consumption is small and the mechanical strength is excellent. <P>SOLUTION: An optical component 1 is housed in a package 2, the temperature of the optical component 1 is adjusted by a temperature adjustment element 5. The face 9 of an optical component supporting part 7 having an elastic member 8 is brought into substantially linear contact with the edge part of the optical component 1, and the optical component 1 is supported by the optical component supporting part 7. The thermal conduction quantity from the optical component 1 to the package 2 side is decreased and the power consumption of the temperature adjustment element 5 is decreased by not bringing the optical component 1 into plane contact with the optical component supporting part 7 but bringing the component 1 into substantially linear contact with the part 7. An impulsive force given to the optical component 1 is relaxed by the elastic member 8. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an optical module used in an optical communication system or the like.

[0002]

BACKGROUND ART In optical communication, optical branching, optical switch,
Optical components having functions such as wavelength division multiplexing are widely used. Although various optical components are formed, an optical component having an optical waveguide circuit in which an optical waveguide circuit is formed on a substrate has been put into practical use because of its integration and mass productivity. The optical waveguide circuit is generally formed by providing an optical waveguide circuit made of a quartz material on a substrate such as silicon or quartz.

FIG. 5 and FIG. 6 are views showing examples of optical waveguide circuits, and these optical waveguide circuits are formed by forming a waveguide forming region 10 on a substrate 11.

FIG. 5 shows an example of the configuration of an optical waveguide circuit in which a 1 × 8 optical branching waveguide circuit is formed as an optical waveguide circuit. FIG. 6 shows a configuration example of an optical waveguide circuit in which an arrayed waveguide diffraction grating circuit is formed as an optical waveguide circuit.
Arrayed waveguide diffraction gratings are used for wavelength division multiplexing communication, and various circuit configurations have been proposed.

As shown in FIG. 5, the 1 × 8 optical branching waveguide circuit includes one optical input waveguide 12 and eight optical output waveguides 16.
And an optical input waveguide 12 and an optical output waveguide 16
It has a plurality of branch portions 17 between and.

Further, as shown in FIG. 6, the circuit of the arrayed waveguide diffraction grating has at least one optical input waveguide 12
A first slab waveguide 13 connected to the output end of the optical input waveguide 12; an array waveguide 14 connected to the output end of the first slab waveguide 13; and an array waveguide 14
Has a second slab waveguide 15 connected to the output end thereof and a plurality of optical output waveguides 16 connected in parallel to the output end of the second slab waveguide 15.

The arrayed waveguide 14 propagates the light derived from the first slab waveguide 13, and is formed by arranging a plurality of channel waveguides 14a in parallel.
The lengths of the adjacent channel waveguides 14a are different from each other by a set amount (ΔL).

The optical output waveguides 16 are provided so as to correspond to the numbers of signal lights having different wavelengths which are demultiplexed or combined by, for example, an arrayed waveguide diffraction grating, and constitute the arrayed waveguide 14. Channel waveguide 1
Usually, a large number of 4a, such as 100, are provided. However, in FIG. 6, these channel waveguides 14a and the optical output waveguides 1 are shown for simplification of the drawing.
6 and the number of each of the optical input waveguides 12 are simply shown.

In the arrayed-waveguide diffraction grating circuit, when wavelength-multiplexed light is introduced into one optical input waveguide 12 as shown in FIG. 6, the wavelength-multiplexed light passes through the optical input waveguide 12. Is introduced into the first slab waveguide 13, spreads by the diffraction effect, and enters the arrayed waveguide 14,
Propagate through the arrayed waveguide 14.

The light propagating through the arrayed waveguide 14 reaches the second slab waveguide 15, and further, the optical output waveguide 1
However, since the lengths of all the channel waveguides 14a of the arrayed waveguide 14 are different from each other, the phases of the individual lights are shifted after propagating through the arrayed waveguide 14, The wavefront of the focused light is tilted according to the amount of deviation,
The position where light is collected is determined by this tilt angle. Therefore, different wavelengths of light can be output from different optical output waveguides 16.

For example, as shown in FIG. 7, an optical component 1 having an optical waveguide circuit including the circuit of the arrayed waveguide diffraction grating and the optical branching waveguide circuit is housed in a package 2 and used as an optical module. . Incidentally, (a) of the same figure is a perspective view of the optical module, (b) of the same figure shows a view of the inside of the optical module seen through from above, and (c) of the same figure shows (b) of the same figure. It is an AA sectional view.

The optical module shown in FIG. 1 has a first optical fiber 3 (3a) connected to one end of the optical component 1 and a second optical fiber 3 (3b) connected to the other end of the optical component 1. And have. These optical fibers 3 (3a, 3b) are
One end of each is connected to the optical component 1, and the other end is pulled out from the package 2 to the outside of the package. The optical fibers 3 (3a, 3b) are fixed to the package 2 with an adhesive 23.

The first and second optical fibers 3a and 3b are each formed of an optical fiber tape formed by arranging a plurality of optical fibers in parallel, and the optical fiber array 21 is provided on the connection end face of the optical fiber tape. Is provided. The connection between the first and second optical fibers 3a and 3b and the optical component 1, that is, the connection between the optical fiber array 21 and the optical component 1 is performed by fixing an adhesive with an adhesive.

A chip upper plate 20 is attached to the connection end face of the optical component 1 to connect the optical component 1 to the optical fiber array 21 at each end of the first and second optical fibers 3a and 3b. It is more stable.

The package 2 has a package body 2a and a lid portion 2b. The package 2 is mainly formed of a metal such as aluminum or stainless steel or a plastic, and by housing the optical component 1 and the connecting portion between the optical component 1 and the optical fiber 3 (3a, 3b) in the package 2. , Protect these.

Since the optical module is assumed to be used in a temperature range of 0 ° C. to 70 ° C., for example, the optical module is required to have no change in characteristics within the temperature range in which it is used. The operating temperature range of the optical module is in the range of -5 ° C to 65 ° C, 0 to 65 ° C, 0 to 55 ° C, and the like. Therefore, it is necessary to adjust the temperature of the optical component 1 such as the arrayed-waveguide diffraction grating, in which the temperature change greatly affects the optical characteristics.

Therefore, in the optical module as shown in FIG. 7, a temperature adjusting element (not shown) such as a heater is provided in the package 2 to heat and hold the optical component 1 at a constant value of 70 to 80 ° C., for example. A configuration to which the method is applied is used.

In the optical module provided with such a temperature control element, it is required to reduce the power consumption of the temperature control element as much as possible. For example, it is required that the maximum power consumption be 5 W or less within the operating temperature range.

In order to realize this low power consumption, various package structures have been devised. For example, JP-A-11
The Japanese Patent No. 014844 proposes an invention named "Method for mounting heater heating waveguide and package thereof".

According to this proposal, an optical component is floated and accommodated in a package through 1 to 4 columns, and the area of the column fixing surface is set to 0.03 to 1.0 cm ^2. It proposes a configuration that reduces the amount of heat conduction to the side to reduce the power consumption of the heater.

[0021]

Therefore, the inventor of the present invention
An optical module using the configuration proposed above was prototyped, and it was confirmed whether the configuration could achieve low power consumption of the optical module. As shown in FIG. 8, the prototype optical module accommodates the optical component 1 in the package 2 and supports the optical component 1 by providing columns 30 at four corners of the optical component 1, respectively.

A temperature adjusting element 5 is provided on the lower side of the optical component 1. Here, the temperature adjusting element 5 is formed by a heater. On the upper side of the optical component 1, the optical component 1
A temperature sensing element 40 for detecting the temperature of is provided. The temperature measuring element 40 is formed of a platinum resistance element.

Conventionally, when the temperature adjusting element 5 is provided on the lower side of the optical component 1, a soaking plate is provided between the optical component 1 and the temperature adjusting element 5. However, in this prototype, the soaking plate is used. Was omitted.

The component structure of the prototype optical module shown in FIG. 8 is as shown in Table 1, and the contact area between the support column 30 and the optical component 1 and the contact area between the support column 30 and the package 2 are reduced to reduce the optical component 1. 3. By reducing the amount of heat conduction from the package to the package 2 side, the power consumption of the temperature control element 5 is reduced to 4.
I was able to get 2W.

[0025]

[Table 1]

The resistance of the platinum resistance element in Table 1 is a value at 0 ° C., and the size of the support column indicates the contact area between the upper surface of one support column 30 and the heat equalizing plate 12. In addition, the power consumption measurement value of the temperature adjustment element 5 is, for example, 0 to 7 for the environmental temperature.
It is the maximum value of power consumption when 0 ° C. and the set temperature of the optical module are 70 to 80 ° C.

However, the structure of the optical module of the above prototype has a problem that the impact strength is weak because the impact applied to the package 2 is directly transmitted to the optical component 1 through the support column 30.

For example, when the present inventor performed an impact test on the optical module of the above-mentioned prototype example by applying an impact of 500 G × 5 times to the optical module in three mutually perpendicular directions,
As shown in Table 2, in all the samples (prototypes), the optical component 1 was cracked or the optical component 1 was damaged.

[0029]

[Table 2]

The optical component as a product must pass the set reliability test (impact test (500 G × 5 times) here, and the optical module in which the optical component 1 is damaged cannot be used. If the optical component 1 is cracked, its insertion loss fluctuation is large, and this optical module cannot be used. Thus, the weak impact strength of the optical module is very problematic.

The present invention has been made to solve the above-mentioned conventional problems, and an object thereof is to provide an optical module having good mechanical strength such as impact strength and low power consumption. is there.

[0032]

In order to achieve the above object, the present invention has the following constitution as means for solving the problem. That is, the first invention has a package and an optical component housed in the package,
The optical component is held substantially in line contact with an optical component holding portion provided in the package, the optical component holding portion is formed of an elastic member, and the elastic member is attached to the optical component. The structure that alleviates the impact applied is a means for solving the problem.

In addition to the structure of the first invention, the second invention has a structure having a temperature adjusting element for adjusting the temperature of the optical component as means for solving the problem.

Further, in a third aspect of the invention, in addition to the configuration of the first or second aspect of the invention, the optical component has a configuration having an optical waveguide circuit in which an optical waveguide circuit is formed on a substrate. I am trying.

[0035]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the description of the present embodiment, the same reference numerals will be given to the same names as those in the conventional example, and duplicate description thereof will be omitted or simplified.

1 (a) to 1 (c) show the configuration of the essential parts of an embodiment of an optical module according to the present invention. FIG. 3A shows the optical module of the present embodiment,
It is the figure which looked through the inside from the upper part. 1B is a sectional view taken along the line AA of FIG. 1A, and FIG. 1C is a sectional view taken along the line BB of FIG.

As shown in these drawings, the optical module of this embodiment has a package 2 and an optical component 1 housed in the package 2 without being fixed. The optical component 1 is an optical waveguide circuit in which a circuit of an arrayed waveguide diffraction grating is formed on a substrate 11 as shown in FIG.

The package 2 is made of polyphenylene sulfide resin. The package 2 has a package body 2a and a lid portion 2b, and the size of the package 2 is 127 mm × 58 mm × 12 mm.

An optical component holder 7 is provided in the package 2. As shown in FIG. 1C, the optical component holder 7 is a portion C shown in FIG. Substantially in line contact (in section C, substantially in line with the line perpendicular to the paper surface).

The optical component holder 7 is formed by an elastic member 8 having a shape shown in FIG. 2A and elastically deformed when a force in the direction of arrow A shown in FIG. 2B is applied. Has been done. The elastic member 8 is formed of Viton which is a rubber member.

In this embodiment, the optical component 1 is used as described above.
Are held in line contact with the optical component holder 7 housed in the package 2, the optical component holder 7 has an elastic member 8, and the impact applied to the optical component 1 by the elastic member 8 It is characterized by a configuration that alleviates.

The optical component 1 is held in such a manner that it is supported from both upper and lower sides by the optical component holding portion 7, and the surface of the optical component 1 (the upper surface of the optical component 1 in FIGS. 1B and 1C). And the lid portion 2b of the package 2 are 2 mm, and the surface of the optical component 1 on the substrate side (the lower surface of the optical component 1 in FIGS. 1B and 1C) and the package body 2a are 2 mm. Is.

FIG. 2 (c) is a perspective view showing how the optical component 1 is held by the optical component holding portion 7. As shown in FIG. 2, the elasticity forming each optical component holding portion 7 is elastic. The members 8 (8a to 8h) support the optical component 1 by sandwiching it from above and below in the mode shown in FIG. 2 (b).

The elastic member 8 (8a ...
8d) the upper surface 18 is the package 2 (not shown in the figure)
The elastic member 8 (8e ...
The bottom surface 19 of 8h) is the package body 2a of the package 2.
It is adhesively fixed to the inner wall of the.

Then, each elastic member 8 (8a-8
The surface 9 on the opposite side of the top surface 18 and the bottom surface 19 in (h) forms an inclined surface, and is substantially in line contact with the edge portion of the optical component 1 including the chip upper plate 20. This substantially line contact region is a region C indicated by a thick line in FIG. 2D, and the contact line length is 5 m.
m.

As shown in FIG. 1, a temperature adjusting element 5 for adjusting the temperature of the optical component 1 is provided on the surface of the optical component 1 on the substrate side, and the temperature adjusting element 5 is directly bonded to the optical component 1. Has been done. Further, a temperature measuring body 40 is provided on the front surface side of the optical component 1 and is fixed by adhesion. By providing the temperature adjusting element 5 and the temperature measuring body 40, the optical component 1 according to the present embodiment can be maintained at a constant temperature of 70 to 80 ° C., for example.

The temperature adjusting element 5 is formed of a silicon rubber heater, and has an electric resistance value of 3Ω and a size of 30 mm × 20 mm × 2 mm. The temperature sensing element 40 is a platinum resistance element and has an electric resistance value of 100 at 0 ° C.
Ω, the size is 1.6 mm × 3.2 mm × 1.0 mm.

To the optical component 1, one end side of at least one (here, two) optical fibers 3 (3a, 3b) is connected, and the other end side of these optical fibers 3 (3a, 3b) is connected. It is pulled out from the package 2 to the outside of the package.

The first optical fiber 3a is connected to one end side of the optical component 1, the second optical fiber 3b is connected to the other end side of the optical component 1, and the first optical fiber 3a is connected from one end side of the package 2. The second optical fiber 3b is pulled out from the other end side of the package 2. Each of the first and second optical fibers 3 (3a, 3b) is an optical fiber tape formed by arranging eight optical fiber core wires in parallel.

Optical fiber holding members 4 (4a, 4b) are arranged in the optical fiber drawing region of the package 2 so as to prevent the package 2 from coming off. Each of the optical fiber retaining members 4 (4a, 4b) has the shape shown in FIG. Optical fiber retaining member 4 (4a, 4
b) and the package 2 are arranged in the X direction and the Y direction with a slight space therebetween.

The optical fibers 3 (3a, 3b) are inserted into the optical fiber retaining members 4 (4a, 4b) and fixed by the adhesive 23. Figure 1 (b)
As shown in FIG.
The adhesive 23 is provided on almost the entire region of the longitudinal direction of (4a, 4b).
It may be provided in a part of 4b) in the longitudinal direction. First
The optical fiber 3a is fixed to the first optical fiber retaining member 4a, and the second optical fiber 3b is fixed to the second optical fiber retaining member 4b.

The first optical fiber holding member 4 (4a) and the second optical fiber holding member 4 (4b) are arranged in the optical fiber longitudinal direction at positions spaced from each other in the optical fiber longitudinal direction (Z direction in the figure). First brim portions 4a1, 4b1 and second brim portions 4a2, 4b2 protruding in the intersecting direction
And a first flange portion 4a1, 4b1 and a second flange portion 4
With a2 and 4b2, the wall of the optical fiber drawing area of the package 2 is sandwiched from both sides with a gap.

With the above-described structure, in this embodiment, the optical fiber retaining member 4 (4a, 4b) and the package 2 are relatively movable in the optical fiber longitudinal direction, and as described above, the optical fiber retaining member is held. Member 4 (4a, 4
b) is arranged in the package 2 in a state that it does not come off.

The first optical fiber holding member 4 (4a) and the second optical fiber holding member 4 (4b) are provided with optical fiber leading portions 4a3 and 4b3 adjacent to the first flange portions 4a1 and 4b1, respectively. Optical fiber pull-out section 4
a3 is fixed to the first flange 4a1 with an adhesive, and the optical fiber pull-out portion 4b3 is fixed with an adhesive to the first flange 4b.
It is fixed at 1.

The optical fiber lead-out portions 4a3 and 4b3 are made of viton (rubber), and the portions of the first and second optical fiber holding members 4 (4a, 4b) other than the optical fiber lead-out portions 4a3 and 4b3 are made of polyphenylene. It is made of sulfide resin.

The first flange portions 4a1 and 4b1 are arranged outside the package 2, and the second flange portions 4a2 and 4b2 are arranged inside the package 2. The distance between the first flange portion 4a1 of the first optical fiber retaining member 4a and the package 2 is d.
1. Second flange portion 4a2 of first optical fiber retaining member 4a
The distance between the package 2 and the package 2 is d2, the distance between the second flange 4b2 of the second optical fiber retaining member 4b and the package 2 is d3, and the first flange 4b of the second optical fiber retaining member 4b.
The distance between 1 and the package 2 is d4.

The values of the intervals d1, d2, d3 and d4 are
Both are variables, and the relationship between these intervals is d1> d
3 and d4> d2. When manufacturing the optical module, the values of d1, d2, d3, and d4 are set to 0.5 mm, 0.5 mm, 0, and 1.0 mm, respectively, and the movement of the first and second optical fiber holding members 4a and 4b. The possible distance is 0.5 mm.

In this embodiment, by forming the distance between the optical fiber retaining member 4 (4a, 4b) and the package 2 as described above, the optical fiber retaining member 4 (4a, 4b) and the package 2 are separated from each other. The relative movement range is such that when tensile stress is applied to the optical fiber 3 (3a, 3b), the tensile stress is applied to the optical component 1 and the connecting portion between the optical component 1 and the optical fiber 3 (3a, 3b). It is within the range that can suppress.

In the present embodiment, the optical fiber retaining member 4 (4a, 4b) and the package 2 are formed by forming the space between the optical fiber retaining member 4 (4a, 4b) and the package 2 as described above. The relative movement range between the package 2 and the optical fiber retaining member 4 is due to thermal expansion and contraction of the package 2 due to temperature change within the operating temperature range.
It is formed to be larger than the relative displacement amount with (4a, 4b).

As described above, the optical fiber holding member 4 (4a, 4b) is provided at the lead-out portion of the optical fiber 3 (3a, 3b) from the package 2, and the optical fiber holding member 4 (4a, 4b) is provided. ) And package 2
The configuration in which the interval between the above and the above is formed is described in Japanese Patent Application No. 2001-306524 (not yet published) previously proposed by the present applicant.

The optical fiber holding member 4 (4
The actions and effects of the arrangement configuration of a, 4b) are as described in detail in this proposal, and the description of the actions and effects of the above configuration is omitted in this specification.

In this embodiment, the optical component 1 is as described above.
Is held by the optical component holder 7 provided in the package 2 substantially in line contact, so that the heat of the optical component 1 heated by the temperature adjusting element 5 is conducted from the optical component 1 to the package 2 side. Can be made smaller. Therefore,
The optical component 1 can be efficiently heated and kept warm, and the power consumption of the temperature control element 5 can be reduced.

Further, according to this embodiment, since the optical component holding portion 7 is formed by the elastic member 8 (8a to 8h), the impact applied to the optical component 1 from the package 2 side can be alleviated. It is possible to prevent the optical component 1 from cracking or the optical component 1 from being damaged.

Table 3 shows the results of the impact test and vibration test of the optical module of this embodiment. The impact test and the vibration test were successively performed in this order. The result of the impact test shows the result of measuring the insertion loss fluctuation value after the impact was applied 500 G × 5 times in the directions of three axes perpendicular to each other. The results of the vibration test show the results of measuring the amount of fluctuation in insertion loss after applying vibrations of 10 to 55 Hz in the directions of three axes perpendicular to each other. The variation of the insertion loss after the vibration test is the variation from before the impact test.

[0065]

[Table 3]

As is clear from Table 3, there is no sample whose insertion loss is deteriorated by the impact test and the vibration test,
The example of this embodiment can realize an optical module having high mechanical strength.

Further, in the optical module of this embodiment, since the optical component 1 is held substantially in line contact with the optical component holding portion 7 provided in the package 2, the temperature control element 5 is provided.
Thus, the rate at which the heat of the heated optical component 1 is conducted from the optical component 1 to the package 2 side can be reduced. Therefore, the optical component 1 can be efficiently heated and kept warm, and the power consumption of the temperature control element 5 can be reduced.

Further, according to the present embodiment, since the optical component holder 7 is substantially in line contact with the four corners of the optical component 1, the optical component holder 7 and the optical component 1 are in contact with each other. Part can be moved away from the center of the heating part by the temperature control element 5,
This enables even lower power consumption.

Actually, when the present inventor arranged the optical module of the present embodiment in an atmosphere having an environmental temperature of 0 ° C. and measured the power consumption with the temperature adjusting element 5 set at 80 ° C., the power consumption was 3 It was 0.85W. That is, in the optical module of the present embodiment example, the power consumption of the temperature adjustment element 5 can be reduced as compared with the configuration of FIG.

It should be noted that the present invention is not limited to the above-mentioned embodiments, but can take various modes. For example,
In the above embodiment, the optical component holding portion 7 is the elastic member 8 and the elastic member 8 is formed of Viton. However, it may be formed of a member having rubber elasticity other than Viton.

Further, as shown in FIG. 4, the optical component holding portion 7
The elastic member 8 and the block member 3 formed of a spring.
8 may be included. In this case, the elastic member 8 is fixed to the package 2 side and the surface 9 of the block member 38 is fixed.
Is substantially brought into line contact with the optical component 1 to hold the optical component 1, and the elastic member 8 is elastically deformed by the force in the direction A in the figure, so that the impact applied to the optical component 1 is caused by the elastic member 8. The configuration will be relaxed. Also in this case, the same effect as that of the above-described embodiment can be obtained.

Further, the disposition form, shape, number and the like of the optical component holding portion 7 are not particularly limited and may be set appropriately.

Further, although the optical fiber holding member 4 (4a, 4b) is provided in the above embodiment, the optical fiber holding member 4 (4a, 4b) may be omitted. Also, when the optical fiber retaining member 4 (4a, 4b) is provided, its shape, size, forming method, etc. are not particularly limited and may be set appropriately. For example, the optical fiber retaining member made of a plastic material is retained. Member 4 (4
a, 4b) may be integrally formed with the optical fiber 3 (3a, 3b).

Furthermore, in the above embodiment, the optical fibers 3 (3a, 3b) are connected to both ends of the optical component 1, but the optical fiber 3 may be connected only to one end of the optical component 1.

Further, in the above embodiment, the optical fiber 3 (3a, 3b) is an optical fiber tape, but the optical fiber applied to the optical module of the present invention may be a single optical fiber.

Further, in the above embodiment, the optical component 1 is used.
Is an optical component 1 of an optical waveguide circuit having a circuit of an arrayed waveguide diffraction grating, but the optical component applied to the optical module of the present invention is not particularly limited and is appropriately set. An optical waveguide circuit having a 1 × 8 optical waveguide circuit may be used.

Further, an optical module other than the optical waveguide circuit may be applied to form the optical module. Examples of optical components include optical fiber type couplers, optical fiber gratings,
There are optical components such as optical fibers, optical crystals, and optical components using multilayer filters.

Further, in the above embodiment, the temperature adjusting element 5 is a heater and the temperature adjusting element 5 is provided on the lower surface of the optical component 1, but the temperature adjusting element 5 may be provided on the upper surface of the optical component 1. In this case as well, the power consumption of the temperature adjusting element 5 can be reduced as in the case where the temperature adjusting element 5 is provided on the lower surface of the optical component 1, and an optical module having good mechanical strength can be realized. I confirmed that I can do it.

[0079]

According to the present invention, the optical component housed in the package is held substantially in line contact with the optical component holding portion provided in the package. Therefore, from the optical component to the package side. It is possible to reduce the heat conduction of the optical component, efficiently control the temperature of the optical component, and reduce the power consumption for temperature control.

Further, according to the present invention, the optical component holding portion is formed to have an elastic member, and the elastic member absorbs the impact applied to the optical component. A good optical module can be realized.

Further, according to the present invention, according to the structure having the temperature adjusting element for adjusting the temperature of the optical component, the temperature of the optical component can be adjusted with smaller power consumption in the temperature adjusting element due to the above effect. Even if the optical component is an optical component whose characteristics change depending on temperature, the characteristics can be maintained.

Further, according to the present invention, the optical component has the optical waveguide circuit in which the circuit of the optical waveguide is formed on the substrate. Therefore, by appropriately setting various circuit configurations formed in the optical waveguide circuit, It is possible to accurately form an optical module having various functions such as branching, multiplexing, and demultiplexing.

[Brief description of drawings]

FIG. 1 is a main part configuration diagram showing an embodiment of an optical module according to the present invention.

FIG. 2 is an explanatory diagram of an optical component holding portion in the optical module of the above-described embodiment and the optical component holding form thereof.

FIG. 3 is an explanatory view showing an optical fiber retaining member applied to the optical module of the above-described embodiment.

FIG. 4 is an explanatory diagram showing a configuration of an optical component holding portion applied to another embodiment of the optical module according to the present invention.

FIG. 5 is an explanatory diagram showing an example of an optical waveguide circuit having a 1 × 8 optical waveguide circuit.

FIG. 6 is an explanatory diagram showing an example of an optical waveguide circuit having a circuit of an arrayed waveguide diffraction grating.

FIG. 7 is an explanatory diagram showing a configuration example of a conventional optical module.

FIG. 8 is an explanatory diagram showing an optical module prototyped by the present inventor.

[Explanation of symbols]

1 Optical parts 2 packages 3 optical fiber 3a First optical fiber 3b Second optical fiber 4 Optical fiber retaining member 5 Temperature control element 7 Optical component holder 8, 8a-8h elastic member

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kanji Tanaka             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. (72) Inventor Kazuhisa Kashihara             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. F-term (reference) 2H037 AA01 BA24 DA02 DA04 DA11                       DA35 DA38                 2H047 KA03 LA12 LA19 MA05 QA04                       RA08 TA01 TA11

Claims (3)

[Claims] 1. A package and an optical component housed in the package, wherein the optical component is held in line contact with an optical component holding portion provided in the package. The optical module is characterized in that the optical component holding portion is formed to have an elastic member, and the elastic member is configured to absorb a shock applied to the optical component. 2. The optical module according to claim 1, further comprising a temperature adjusting element for adjusting the temperature of the optical component. 3. The optical module according to claim 1, wherein the optical component has an optical waveguide circuit in which an optical waveguide circuit is formed on a substrate.