KR100795736B1 - Athermal awg and awg with low power consumption using groove of changeable width - Google Patents

Abstract

In accordance with the present invention, an optical integrated circuit is disclosed having a gap across a lens or waveguide grating and an actuator for controllably positioning the optical integrated circuit on each side of the gap. As a result, the thermal sensitivity of optical integrated circuits, for example arranged waveguide gratings, is relaxed. Also disclosed is a method of fabricating an optical integrated circuit using a gap and an actuator.

Description

ATHERMAL AWG AND AWG WITH LOW POWER CONSUMPTION USING GROOVE OF CHANGEABLE WIDTH}

TECHNICAL FIELD The present invention relates to the field of optical integrated circuits, and more particularly, to apparatus and methods for providing arranged waveguides having a center wavelength regardless of temperature.

Optical integrated circuits (OICs) are used in many forms, such as 1xN optical splitters, optical switches, wavelength division multiplexers (WDMs), demultiplexers, optical add / drop multiplexers (OADMs), and the like. Such OICs are used to build optical networks in which optical signals are transmitted between optical devices to carry data. For example, traditional signals are exchanged using transmission of electrical signals through electrically conductive lines that are being replaced by optical fibers within telecommunication networks and data communications networks and circuits through which optical (eg, light) signals are transmitted. do. Such optical signals may carry data or other information via modulation techniques to transmit information over the optical network. OICs allow for branching, coupling, switching, separation, multiplexing and demultiplexing of optical signals without intermediate conversion between optical and electrical media.

Such optical circuits include planar lightwave circuits (PLCs) having optical waveguides on flat substrates, which are intended to route optical signals from one of many input optical fibers to any of many output optical fibers or optical circuits. Can be used. PLCs make it possible to achieve greater densities, larger production volumes and more functions than can be used by fiber components through the use of manufacturing techniques typically associated with the semiconductor industry. For example, PLCs include optical paths known as waveguides formed on a silicon wafer substrate using lithographic processing, where the waveguides have a refractive index greater than the chip substrate or external cladding layers to guide light rays along the optical path. It is made of a transmissive medium having. By using advanced photolithographic processes and other processes, PLCs are made to integrate multiple components and functionalities into a single optical chip.

In particular, important applications of PLCs and OICs generally include wavelength-division multiplexing (WDM), including dense wavelength-division multiplexing (DWDM). DWDM allows optical signals of different wavelengths to each convey separate information to be transmitted through a single optical channel or optical fiber within the optical network. Current multiplexed optical systems use as much as 160 wavelengths for each optical fiber.

To provide advanced multiplexing and demultiplexing (eg DWDM) and other functions within such networks, arrayed-waveguide gratings (AWGs) have been developed in the form of PLCs. Existing AWGs can provide multiplexing or demultiplexing up to 80 channels or wavelengths as close as 50 GHz. As illustrated in FIG. 1, a conventional demultiplexing AWG 2 includes a single input port 3 and multiple output ports 4. Multi-wavelength light is received at the input port 3 (eg, from the optical fiber in the network, not shown) and provided to the input lens 5 via the input optical path or waveguide 6.

The input lens 5 spreads the multi-wavelength light rays into an array of waveguides 7 sometimes called waveguide gratings. Each of the waveguides 7 has a different optical path length from the input lens 5 to the output lens 8 and results in different phase tilts at the input end to the output lens 8 depending on the wavelength. Again, this phase slope affects how light rays recombine within the output lens 8 via constructive interference. The output lens 8 thus provides different wavelengths to the output ports 4 via the individual output waveguides 9 so that the AWG 2 receives the light signals entering the input port 6. ) Can be used to demultiplex into two or more demultiplexed signals. AWG 2 may optionally be used to multiplex light signals from ports 4 into a multiplexed signal having two or more wavelength components at port 3.

A problem with OICs, such as the conventional AWG 2 of FIG. 1, is temperature sensitivity. Since waveguide materials generally have a temperature dependent refractive index, the channel wavelengths of the multi / demultiplexer shift as the temperature changes. This shift is typically on the order of 0.01 nm / E ° C. in silica-based devices and 0.1 nm / E ° C. in InP base devices. This wavelength shift can result in loss of signals and / or crosstalk in the communication system (s) using the AWG 2. As communication system (s) are designed to have progressively smaller channel spacing, even small temperature dependent wavelength shifts can have a significant effect on system performance. Currently, AWGs must have an active stabilization of the device operating temperature in order to perform acceptable. This stabilization is typically achieved by adding resistive heaters, temperature sensors, active electronic components and in some cases thermo-electric coolers. Even if the AWG is a passive filter, it currently requires active electronic components and several watts of power to work effectively.

Summary of the Invention

The following provides a simplified summary of the invention in order to provide a basic understanding of some aspects of the invention. This summary is not an extensive overview of the invention. It is not intended to identify key elements or critical elements of the invention or to delineate the scope of the invention. Rather, the sole purpose of this summary is to present some concepts of the invention in a simplified form as a prelude to the more detailed description that is presented later.

The present invention provides methods for mitigating and / or overcoming disadvantages associated with heatless optical integrated circuits and conventional optical integrated circuit (s) and other devices.

The invention further includes methods of making OICs and methods of mitigating temperature sensitivity using grooves and actuators. Significantly lower power consumption also results in the use of temperature reactive mechanical actuators in another aspect of the invention. The present invention also provides OIC devices and methods for mechanical beam steering that mitigate and / or overcome the disadvantages associated with conventional OICs and other devices. The present invention further includes a method of manufacturing OICs and a method of mitigating temperature sensitivity using actuators for mechanical beam steering in OICs.

According to one aspect of the invention, there is provided an optical integrated circuit comprising a base comprising a first region and a second region separated by a hinge, and an AWG chip on the base, wherein the groove is provided with at least one lens and waveguide grating. Across, the actuator connects the first area and the second area of the base. The base and the actuator have different coefficients of thermal expansion. The actuator expands and / or contracts with temperature changes to cause at least a portion of the AWG chip above and in the first region to move relative to a portion of the AWG chip on the second region. Thus, the wavelength shift associated with the waveguide dependent refractive index can be relaxed.

In accordance with another aspect of the present invention, an optical integrated circuit is provided that includes an AWG chip having one or more lenses and a groove across a waveguide grating. The AWG chip includes a first area and a second area connected by a hinge and separated by a groove. The actuator connects the first area and the second area of the AWG chip. The AWG chip substrate and the actuator have different coefficients of thermal expansion. The actuator expands and / or contracts with temperature changes to cause the first region of the AWG chip to move relative to the second region. Thus, the wavelength shift associated with the waveguide dependent refractive index can be relaxed.

Another aspect of the invention provides a methodology for manufacturing OIC that can mitigate wavelength shifts associated with waveguide dependent refractive index. Fabrication of the OIC involves forming grooves in the AWG chip such that grooves can be included in the AWG chip so that the actuator can include relative relative movement between different portions of the chip in response to temperature changes.

According to another aspect of the invention, actuators are provided having a first actuator body having a first coefficient of thermal expansion coupled to a second actuator body portion having a second coefficient of thermal expansion. Another aspect of the invention provides actuators for use with OICs. OICs include a first region having a waveguide, a second region having a waveguide and a connection region coupled to the first region and the second region. The connection region may include a first lens that arbitrarily couples the waveguide of the first region to the waveguide of the second region. The actuator is arranged adjacent to the first area, for example to inspire mechanical beam steering.

Another aspect of the present invention provides a methodology for producing OIC. The method comprises providing a base, forming at least one waveguide in the first region, forming at least one waveguide in the second region and at least one waveguide in the first region at least one of the second region. And forming a connection region comprising a first lens coupled to the waveguide of the lens. The first region and the second region are then scrolled to each other such that the remaining mechanical continuity is generally provided through the connection region. The actuator is then placed between the first area and the second area.

To achieve the above and related results, certain illustrative aspects of the invention are described herein in connection with the following description and the annexed drawings. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed and the present invention is intended to include all such aspects and their equivalents. Other advantages and novel features of the invention will become apparent from the following detailed description of the invention when considered in conjunction with the drawings.

1 is a schematic plan view of a conventional AWG multiplexer / demultiplexer device.

2 is a schematic plan view of a base or riser in accordance with an aspect of the present invention.

3 is a schematic plan view of an OIC in accordance with an aspect of the present invention.

4 is a cross-sectional view of the OIC of FIG. 3.

5 is a schematic plan view of another base or riser in accordance with an aspect of the present invention.

6 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

7 is a schematic plan view of another base or riser in accordance with an aspect of the present invention.

8 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

9 is a schematic plan view of another base or riser in accordance with an aspect of the present invention.

10 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

11 is a schematic plan view of another base or riser in accordance with an aspect of the present invention.

12 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

Figure 13 is a schematic plan view of an AWG chip in accordance with an aspect of the present invention.

14 is a schematic plan view of another AWG chip in accordance with an aspect of the present invention.

15 is a schematic plan view of an OIC in accordance with an aspect of the present invention.

16 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

17 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

18 is a schematic plan view of another OIC in accordance with an aspect of the present invention.

19 is a graph plotting the change in CW (y axis) versus the change in temperature (x axis) for a conventional AWG that is not temperature stable and an AWG according to an aspect of the present invention.

20 is a schematic plan view of a typical OIC.

21 is a cross-sectional view of the OIC of FIG. 20.

22 is a perspective view of an exemplary actuator in accordance with an aspect of the present invention.

23 is a cross-sectional view of one component of an actuator according to one aspect of the present invention.

24 is a schematic plan view of the OIC of FIG. 20 using the actuator of FIG. 22 in accordance with an aspect of the present invention.

25 is a perspective view of an actuator according to one aspect of the present invention.

Figure 26 is a perspective view of an actuator according to one aspect of the present invention.

27 is a schematic plan view of an actuator according to an aspect of the present invention.

28 is a schematic plan view of an actuator according to one aspect of the present invention.

29 is a cross-sectional view of an OIC using the actuator of FIG. 28 in accordance with an aspect of the present invention.

30 is a schematic plan view of an actuator according to one aspect of the present invention.

Fig. 31 is a sectional view of an actuator according to one aspect of the present invention.

32 is a schematic plan view of the actuator of FIG. 31;

33 is a sectional view of an actuator according to one aspect of the present invention.

34 is a schematic plan view of the actuator of FIG. 33.

35 is a schematic plan view of an OIC using an actuator in accordance with an aspect of the present invention.

FIG. 36 is a cross sectional view of the OIC with the actuator of FIG. 35; FIG.

37 is a schematic plan view of an OIC using an actuator in accordance with an aspect of the present invention.

38 is a schematic plan view of an OIC using an actuator in accordance with an aspect of the present invention.

FIG. 39 is a cross sectional view of the OIC with the actuator of FIG. 38; FIG.

40 is a cross-sectional view of an OIC using an actuator in accordance with one aspect of the present invention.

41 is a schematic representation of an actuator according to one aspect of the present invention.

42 is a schematic plan view of an OIC using a wedge in accordance with an aspect of the present invention.

Various aspects of the invention will now be described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout the specification. The present invention provides for the movement of temperature sensitivity of optical integrated circuits by using mechanical beam steering.

The present invention provides heatless OICs and OICs with low power consumption by using beam deflection using OIC or AWG with two or more unique regions or pieces that may be relative to each other. This relative motion results in shifts in the OIC's center wavelength (CW) or peak transmission wavelength for a given channel proportional to two pieces of motion. The OIC ensures that the magnitude of the CW change caused by two pieces of motion is the same magnitude and opposite sign for the CW change inherent in the OIC (induced by the OIC's expansion / contraction and dependence of waveguide refractive index over temperature). Otherwise, the device is then defined as having a pure CW dependence of nearly zero with temperature, having a neutral wavelength that is substantially temperature independent, and therefore heatless.

As the temperature of the OIC increases or decreases, the refractive index of the waveguide (s) in one or more regions may change. To compensate for this temperature based on the refractive index change, the actuator expands / contracts as a result of the temperature change and causes the edges of the AWG chip in the groove to move (eg rotate). The movement (rotation) caused by temperature changes corresponds to or compensates for the temperature-changed induced wavelength shifts in the waveguide (s) due to the temperature dependent refractive index. As such, the wavelength shift associated with the waveguide temperature dependent refractive index change can be relaxed. Thus, signal loss and / or crosstalk in communication system (s) using OIC can be reduced.

Generally speaking, the AWG chip is located on the base. The base has a hinge that separates and connects the first and second regions of the base. The hinge connects the first region and the second region but allows the first region and the second region of the base to move relative to each other. Typically, the hinge is a relatively narrow strip of base (or AWG substrate as described below). The actuator is connected to the first and second regions of the base, and the expansion / contraction of the actuator can induce the movement of the first and second regions with respect to the hinge. The actuator and the base have different coefficients of thermal expansion. Grooves or gaps are formed in the AWG chip at least approximately in some position on the hinge. One part or piece of the AWG chip on one side of the groove is dominant and supported by the first region of the base, while the other part or piece of AWG chip on the other side of the groove is above and in the second area of the base. Is supported by Thus, the movement of the first and second regions relative to the hinge induced by the expansion / contraction of the actuator causes the two parts or pieces of the AWG chip to move relative to each other.

Alternatively, the actuator connects two portions or pieces of the AWG chip, and the expansion / contraction of the actuator can induce the movement of the two portions or pieces of the AWG chip relative to each other. The actuator and the AWG chip substrate have different coefficients of thermal expansion. The base is constructed in such a way as to allow movement between portions or pieces of the AWG chip (as described above).

Alternatively, the mechanism includes almost half of the AWG chip, but can be applied to mirror mounted structures. In such a structure, a groove is formed by positioning the waveguide grating or lens in proximity to the mirror but not directly fixed to the mirror (allowing movement). The actuator and the AWG chip / mirror substrate have different coefficients of thermal expansion.

AWG chips containing waveguide gratings are considered in length, but the OIC may include a Mach-Zehnder interferometer. In this case, the groove traverses the arms or waveguides of the Mach-Gender device.

The width of the groove in the AWG chip or the width between the AWG chip and the mirror (also referred to as groove) is sufficient to allow movement to shift CW. In one embodiment, the groove width is at least about 1 micron and at most about 50 microns. In other embodiments, the width of the grooves is at least about 3 microns and at most 30 microns. In yet another embodiment, the width of the grooves is at least about 5 microns and at most about 25 microns. In yet another embodiment, the width of the grooves is at least about 7 microns and at most about 20 microns. The AWG chip may comprise one or more grooves. The groove or gap may be straight, curved, and may have a symmetrical or asymmetrical shape as it traverses the lens, waveguide grating, or is adjacent to the mirror. In embodiments where the groove is asymmetric, the width of the groove may change as the groove traverses the lens or waveguide gratings, but remains within the width parameters. At widths above 50 microns, insertion loss concerns begin to stand out.

The difference in coefficient of thermal expansion between the actuator and the base, between the actuator and the AWG chip substrate, or between the actuator and the AWG chip / mirror substrate is sufficient to induce the relative movement of two parts or pieces of the AWG chip by expansion / contraction of the actuator. Do. In one embodiment, the difference in thermal expansion coefficients (eg, between the actuator and the base) is at least about 25%. In another embodiment, the difference in coefficients of thermal expansion is at least about 100% (that is, the actuator can be at least twice the value of the base). In another embodiment, the difference in coefficients of thermal expansion is at least about 200% (that is, the actuator can be at least three times the value of the base). In one embodiment, the heatless OIC includes an AWG chip mounted on a base or riser with a hinge disposed below the waveguide grating, for example below the center portion of the waveguide grating. For example, referring to FIGS. 2-4, one embodiment of such an OIC and one method of making the OIC are shown.

Specifically, referring to FIG. 2, a base 10, sometimes referred to as a riser, is provided. The base 10 is configured to include a hinge 14 that separates and connects the first region 11 and the second region 13. The base is made of a material having a first coefficient of thermal expansion. The base can be made of metal, metal alloy or hard plastic material. Examples of metals include aluminum, brass, bronze, chromium, copper, gold, iron, magnesium, nickel, palladium, platinum, silver, stainless steel, tin, titanium, tungsten, zinc, zirconium, Hastelloy ^? , Kovar ^? , Invar, Monel ^? , Inconel ^? It contains one or more of these.

An actuator 12 having a second coefficient of thermal expansion different from the first coefficient of thermal expansion of the base 10 is provided to connect the first region 11 and the second region 13 of the base 10. . The base can be bent due to the hinge 14. That is, the first region 11 and the second region 13 may rotate around the hinge 14 to coincide with the arrows.

The actuators 12 are aluminum, brass, bronze, chrome, copper, gold, iron, magnesium, nickel, palladium, platinum, silver, stainless steel, tin, titanium, tungsten, zinc, zirconium, Hastelloy ^? , Kovar ^? , Invar, Monel ^? , Inconel ^? Metal, ceramic materials such as alumina or aluminum silicate, polymerizable materials such as silicone rubber or elastomer, polycarbonates, polyolefins, polyamides, polyesters, liquid crystal polymers, polymer composite materials (carbon fiber , Polymers in combination with graphite or glass fibers), and the like. An example of a polymer composite is DuPont's Zytel® ^. It is glass fiber reinforced nylon. The actuator 12 may alternatively be a mechanical assembly comprising many different materials designed to have a specific coefficient of thermal expansion as a whole (different from that of the base 10).

The mechanical actuator 12 may alternatively be a piezoelectric element, an electrostatic actuator, a solenoid, an electric motor such as a servo motor, a linear motor or a stepper motor, or a resistance heated thermal expansion member. When the actuator 12 is one of a piezoelectric element, a solenoid, an electric motor or a resistance heated thermal expansion member, one or more temperature sensors are connected to the actuator (the controller and / or the processor may be included in a feedback loop). It may be located within a waveguide grating connected to a loop. Temperature changes detected by the sensor induce a signal sent to the controller / processor, which in turn induces mechanical actuation of the actuator. In another embodiment, an actuator or block is disclosed in US patent application Ser. No. 09 / 999.692, filed Oct. 24, 2001, and currently entitled “Mechanical beam steering for optical integrated circuits.” US Pat. No. 6,603,892. And incorporated herein by reference.

Referring to FIG. 3, the AWG chip 16 is attached to the base 10 by any suitable means. For example, an adhesive, such as a UV curable adhesive, may be located between the AWG chip 16 and the base 10. The AWG chip 16 is shown having a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. The substrate of the AWG chip 16 may be made of one or more of silica, silicon, InP, GaAs, and the like. The input waveguide, waveguide grating, and output waveguide are independently lithium niobate (LiNbO 3) or other inorganic crystals, doped silica, undoped silica, glass, thermo-optic polymers, electro-optic polymers and indium phosphide And one or more of semiconductors such as (InP). Cladding layers may surround several waveguides. It is recognized that the actuator 12 may be attached to the base 10 before and after the AWG chip 16 is attached to the base 10. Although not shown, the AWG chip 16 and / or base 10 may be provided to minimize the length of the grooves 18; That is, it can be cut to significantly increase the width of the groove at locations that do not cross the waveguide grating (or lens as described below).

In this embodiment, the AWG chip 16 is disposed on the base such that the waveguide grating is directly above the hinge 14 of the base 10. A gap or groove 18 is formed in the AWG chip 16 across the waveguide grating. The groove 18 runs all the way vertically through the AWG chip 16 and may or may not split the AWG chip 16 into two distinct pieces. The AWG chip is diced in any suitable manner including using a dicing saw, water jet cutting, chemical etching, laser-water-cutter, wire-saw, EDM, and the like. One portion of the AWG chip 16 on one side of the groove 18 is supported by the first region 11 of the base 10 while the other of the AWG chip 16 on the other side of the groove 18. The part is supported by the second region 13 of the base 10.

Referring to FIG. 4, a side view of the structure of FIG. 3 is shown along the arrows of FIG. 3. The gap 18 is fully vertical through the AWG chip 16. The gap 18 is disposed at or near the center of the grating, or at or near a perpendicular angle to the waveguides of the grating. Although the inner edges of the AWG chip 16 in the grooves 18 are shown perpendicular to the surface of the base 10, the grooves 18 can be formed arbitrarily, as the light crosses the grooves 18. It is a small angle to the normal of the base surface to mitigate light reflection. For example, the groove 18 may be formed at an angle of about 5 degrees or more and about 15 degrees or less to the normal of the base surface.

Within the gaps or grooves 18, waveplates (not shown), such as half waveplates, can be formed arbitrarily. Additionally or alternatively, the gap or groove 18 may be filled with a liquid having a refractive index that substantially matches that of the waveguides of the adhesive, gel, polymer or waveguide grating. The effect is only weakly dependent on the refractive index of the material with which the refractive index matches, so that tight control of the refractive index of the substrate is not necessary. Alternatively, the inner opposing edges of the AWG chip 16 (in the groove 18) may be coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 12 changes length at a different speed than the base 10 due to differences in coefficients of thermal expansion. This causes a change in the angle between the two regions of the AWG (on both sides of the groove 18), and causes a different phase delay for different waveguides in the waveguide grating, thus causing a shift in the CW of the device. . The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

In another embodiment, the heatless OIC includes an AWG chip installed on a base or riser with a hinge located under one of the lenses. For example, referring to FIGS. 5-8, examples of such OICs and methods of making the OICs are shown.

Specifically, referring to FIG. 5, a base 20 is provided. The base 20 is configured to include a hinge 24 that separates and connects the first area 21 and the second area 23. The base is made of a material having a first coefficient of thermal expansion. An actuator 22 having a second coefficient of thermal expansion different from the first coefficient of thermal expansion of the base 20 is provided to connect the first region 21 and the second region 23 of the base 20. The base can be bent due to the hinge 24. That is, the first area 21 and the second area 23 may rotate around the hinge 24 to coincide with the arrows.

Referring to FIG. 6, the AWG chip 26 is attached to the base 20 by any suitable means. For example, the adhesive may be located between the AWG chip 26 and the base 20. AWG chip 26 is shown having a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. The base 20, substrate, actuator 22 and waveguides can be made of any materials for these features described in connection with FIGS. 2 and 3. It is appreciated that the actuator 22 may be attached to the base 10 before and after the AWG chip 26 is attached to the base 20.

In this embodiment, the AWG chip 26 is disposed on the base such that one of the lenses is directly above the hinge 24 of the base 20. A gap or groove 28 is formed in the AWG chip 26 across the lens. The groove 28 is formed in the center of the lens, near the input / output waveguide sides of the lens or near the waveguide grating side of the lens. The groove 28 runs all the way vertically through the AWG chip 26 and may or may not split the AWG chip 26 into two distinct pieces. The grooves are formed in any suitable manner including using dicing saws, water jet cutting, chemical etching, laser-water-cutters, wire-saws, EDM, and the like. One portion of the AWG chip 26 on one side of the groove 28 is supported by the first region 21 of the base 20, while the other of the AWG chip 26 on the other side of the groove 28. The portion (including the waveguide grating) is supported by the second region 23 of the base 20.

The gap or groove 28 may optionally be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. The effect is only weakly dependent on the refractive index of the material with which the refractive index matches, so that tight control of the refractive index of the substrate is not necessary. Alternatively, the inner opposing edges of the AWG chip 26 (in the groove 28) may be optionally coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 22 changes length at a different speed than the base 20 due to differences in coefficients of thermal expansion. This causes a change in the angle between the two regions of the AWG (on both sides of the groove 28), in particular between the two regions of the lens across the groove 28, the waveguide being relatively to the focus of the light. By causing the deflection of the input (or output) waveguide and part of the lens to move, the wavelengths are shifted to be focused into the waveguide grating, thus causing a shift in the CW of the device. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

Specifically, referring to FIG. 7, a base 30 is provided. The base 30 is configured to include a hinge 34 that separates and connects the first region 31 and the second region 33. The base is made of a material having a first coefficient of thermal expansion. An actuator 32 having a second coefficient of thermal expansion different from the first coefficient of thermal expansion of the base 30 is provided to connect the first region 31 and the second region 33 of the base 30. The base can be bent due to the hinge 34. That is, the first region 31 and the second region 33 may rotate around the hinge 34 to coincide with the arrows. In this embodiment, the shape of the base 30 is tailored to the shape of the AWG chip 36 described below.

Referring to FIG. 8, the AWG chip 36 is attached to the base 30 by any suitable means. For example, the adhesive may be located between the AWG chip 36 and the base 30. The AWG chip 36 is fitted to the waveguide grating arranged above it. AWG chip 36 is shown having a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. The base 30, substrate, actuator 32 and waveguides can be made of any materials for these features described in connection with FIGS. 2 and 3. It is appreciated that the actuator 32 may be attached to the base 30 before and after the AWG chip 36 is attached to the base 30.

In this embodiment, the AWG chip 36 is disposed on the base such that one of the lenses is directly above the hinge 34 of the base 30. A gap or groove 38 is formed in the AWG chip 36 across the lens. The groove 38 runs all the way vertically through the AWG chip 36 and may or may not split the AWG chip 36 into two distinct pieces. The grooves are formed in any suitable manner including using dicing saws, water jet cutting, chemical etching, laser-water-cutters, wire-saws, EDM, and the like. One portion of the AWG chip 36 on one side of the groove 38 is supported by the first region 31 of the base 30 while the other of the AWG chip 36 on the other side of the groove 38. The portion (including the waveguide grating) is supported by the second region 33 of the base 30. The shape of the AWG chip 36 may be tailored to remove a substrate that is not in proximity to any one of the input / output waveguides, lenses, waveguide gratings, and / or to allow adequate space for installation of the actuator. . Notches, protrusions and the like can be formed to encourage attachment of the actuator. For example, the AWG chip 36 of FIG. 8 has a customized shape while the AWG chip 26 of FIG. 6 does not.

The gap or groove 38 may optionally be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. The effect is only weakly dependent on the refractive index of the substrate with which the refractive index matches, so that tight control of the refractive index of the substrate is not necessary. Alternatively, the inner opposing edges of the AWG chip 36 (in the groove 38) may be optionally coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 32 changes its length at a different speed than the base 30 due to differences in the coefficients of thermal expansion. This causes a change in the angle between the two regions of the AWG (on both sides of the groove 38), in particular between the two regions of the lens across the groove 38, the waveguide being relatively to the focus of the light. By causing the deflection of the input (or output) waveguide and part of the lens to move, the wavelengths are shifted to be focused into the waveguide grating, thus causing a shift in the CW of the device. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

In another embodiment, the heatless OIC includes an AWG chip installed on a base or riser with a hinge positioned below the waveguide grating and mirror. For example, referring to FIGS. 9-10, an example of such an OIC and a method of making the OIC are shown.

Specifically, referring to FIG. 9, a base 40 is provided. The base 40 is configured to include a hinge 44 that separates and connects the first area 41 and the second area 43. An actuator 42 having a second coefficient of thermal expansion different from the first coefficient of thermal expansion of the base 40 is provided to connect the first region 41 and the second region 43 of the base 40. The base can be bent due to the hinge 44. That is, the first region 41 and the second region 43 may rotate around the hinge 44 to coincide with the arrows.

Referring to FIG. 10, AWG chip 46 and mirror 47 are attached to base 40 by any suitable means. For example, the adhesive may be located between the AWG chip 46 and the base 40. AWG chip 46 is shown having a waveguide grating and output waveguides 54 between a substrate, an input waveguide 52, a lens 50, a lens comprising a plurality of waveguides and a mirror 47. The base 40, substrate, actuator 42 and waveguides can be made of any materials for these features described in connection with FIGS. 2 and 3. AWG chip 46 and mirror 47 are positioned such that a groove or gap 48 is between them. Mirror 47 serves to reflect light from the waveguide grating back into the waveguide grating. It is recognized that the actuator 42 may be attached to the base 40 before and after the AWG chip 46 is attached to the base 40.

In this embodiment, the AWG chip 46 is disposed on the base 40 such that the waveguide grating and mirror 47 are directly above the hinge 44 of the base 40. The gap or groove 48 crosses the waveguide grating. The groove 48 completely separates the AWG chip 46 from the mirror 47. The AWG chip 46 is on one side of the groove 48 and supported by the first area 41 of the base 40, while the mirror 47 is on the other side of the groove 48 and the base ( Supported by a second region 43 of 40.

Within the gaps or grooves 48, waveplates (not shown), such as quarter waveplates, may be formed arbitrarily. Additionally or alternatively, the gap or groove 48 may be filled with a liquid having a refractive index that substantially matches that of the waveguides of the adhesive, gel, polymer or waveguide grating. The effect is only weakly dependent on the refractive index of the substrate with which the refractive index matches, so that tight control of the refractive index of the substrate is not necessary. As another alternative, the inner opposing edges of the AWG chip 46 (in the groove 48) can be polished or coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 42 changes its length at a different speed than the base 40 due to differences in the coefficients of thermal expansion. This causes a change in angle between the AWG and the mirror 47 and causes different phase delays for the different waveguides in the waveguide grating, thus causing a shift in the CW of the device. In particular, the angle to which the mirror is attached is used to select the AWG CW, and the rotation of the mirror provided by the actuator as a function of temperature is used to cancel the AWG = s thermal response. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

In another embodiment, the heatless OIC includes an AWG chip installed on a base or riser with a hinge located under the lens and mirror. For example, referring to FIGS. 11-12, one example of such an OIC and a method of making the OIC are shown.

Specifically, referring to FIG. 11, a base 60 is provided. The base 60 is configured to include a hinge 64 that separates and connects the first area 61 and the second area 63. An actuator 62 having a second coefficient of thermal expansion different from the first coefficient of thermal expansion of the base 60 is provided to connect the first region 61 and the second region 63 of the base 60. The base can be bent due to the hinge 64. That is, the first area 61 and the second area 63 may rotate around the hinge 64 to coincide with the arrows.

With reference to FIG. 12, the AWG chip 66 and the mirror 67 are attached to the base 60 by any suitable means. For example, the adhesive may be located between the AWG chip 66 and the base 60. The AWG chip 66 is a waveguide between a substrate, an input waveguide 72, a first lens 70, a folded second lens 76, a first lens 70 comprising a plurality of waveguides and a folded lens 76. It is shown having a grating and output waveguides 74. Base 60, substrate, actuator 62, and waveguides may be made of any materials for these features described in connection with FIGS. 2 and 3. AWG chip 66 and mirror 67 are positioned such that a groove or gap 68 is present between them. The mirror 67 functions to reflect light back from the folded lens 76 to the folded lens 76 so that it can enter the waveguide grating. It is appreciated that the actuator 62 may be attached to the base 60 before and after the AWG chip 66 is attached to the base 60.

In this embodiment, the AWG chip 66 and the mirror 67 are disposed on the base 60 such that the folded lens 76 and the mirror 67 are directly on the hinge 64 of the base 60. The gap or groove 68 crosses the lens 76. The groove 68 completely separates the AWG chip 66 from the mirror 67. The AWG chip 66 is on one side of the groove 68 and supported by the first area 61 of the base 60, while the mirror 67 is on the other side of the groove 68 and the base ( Supported by a second region 63 of 60.

The gap or groove 68 may be optionally ground and optionally filled with a liquid having a refractive index that substantially matches that of the waveguides of the adhesive, gel, polymer or waveguide grating. The effect is only weakly dependent on the refractive index of the substrate with which the refractive index matches, so that tight control of the refractive index of the substrate is not necessary. Alternatively, the inner opposing edges of the AWG chip 66 (in the groove 68) may be optionally coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 62 changes length at a different speed than the base 60 due to differences in the coefficients of thermal expansion. This causes a change in the angle between the lens 76 and the mirror 67 and causes a portion of the lens and the deflection of the input (or output) waveguide so that the waveguide moves relative to the focus of the light, thereby causing the wavelengths to enter the waveguide grating. It is shifted to be in focus, thus causing a shift in the CW of the device. In particular, the angle to which the mirror is attached is used to select the AWG CW, and the rotation of the mirror provided by the actuator as a function of temperature is used to cancel the AWG = s thermal response. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent.

Grooves or gaps may be formed in the AWG chip before and after installing the AWG chip on the base. Referring to FIG. 13, an AWG chip 86 suitable for mounting on the base of FIG. 2 is shown. AWG chip 86 is shown having a waveguide grating and output waveguides between a substrate, an input waveguide, a first lens, a second lens, two lenses including a plurality of waveguides. Gap or groove 88 is formed in AWG chip 86 across the waveguide grating, but not the entire chip. The AWG chip 86 is placed on the base so that the waveguide grating lies directly on the hinge 14 (referred to in FIG. 2) of the base 10. If not already formed, the gaps or grooves 88 are formed in the AWG chip 86 across the waveguide grating, but not the entire chip. Groove 88 runs all the way vertically through AWG chip 86 but does not divide AWG chip 86 into two distinct pieces. The grooves 88 are formed in any suitable manner, including wet etching or RIE. One portion 87 of the AWG chip 86 on one side of the groove 88 is supported by the first region 11 of the base 10, while the AWG chip 86 on the other side of the groove 88. The other portion 89 of) is supported by the second region 13 of the base 10.

Subsequently, the AWG chip 86 and the base (below the chip) use a waterjet, wire saw, laser, etc. to provide a structure similar to that of FIG. 3 except that the AWG chip 86 substantially overlaps the base. It is cut simultaneously in any suitable way. The cutting fits the shape of the structure around the functional features of the AWG chip 86, in particular near the groove 88, such that the groove 88 separates the AWG chip 86 into two distinct pieces, Portions of the AWG chip 86 above and below 88 no longer hold the chip in a single piece. The actuator is then added to connect two regions of the base or two pieces of chip.

Within the gaps or grooves 88, waveplates (not shown), such as half waveplates, may optionally be formed. Additionally or alternatively, the gap or groove 88 may be filled with a liquid having a refractive index that substantially matches that of the waveguides of the adhesive, gel, polymer or waveguide grating.

Referring to FIG. 14, an AWG chip 96 suitable for mounting on the base of FIG. 7 is shown. The AWG chip 96 is shown having a waveguide grating and output waveguides between a substrate, an input waveguide, a first lens, a second lens, two lenses including a plurality of waveguides.

In this embodiment, the AWG chip 96 is disposed on the base such that one of the lenses is placed directly on the hinge 24 (referred to in FIG. 5) of the base 20. A gap or groove 98 is formed in the AWG chip 96 across the lens before and after attaching the chip to the base. Groove 98 runs all the way vertically through AWG chip 96 but does not divide AWG chip 96 into two distinct pieces. The groove 98 is formed in any suitable manner. One portion 97 of the AWG chip 96 on one side of the groove 98 is supported by the first region 21 of the base 20, while the AWG chip 96 on the other side of the groove 98. The other portion 99 (including the waveguide grating) of the) is supported by the second region 23 of the base 20.

Subsequently, the AWG chip 96 and the base (below the chip) use a waterjet, wire saw, laser, etc. to provide a structure similar to that of FIG. 8 except that the AWG chip 96 substantially overlaps the base. It is cut simultaneously in any suitable way. The cutting fits the shape of the structure around the functional features of the AWG chip 96, in particular near the groove 98, so that the groove 88 separates the AWG chip 96 into two distinct pieces, Portions of AWG chip 96 above and below 88 no longer hold the chip in a single piece. The actuator is then added to connect two regions of the base or two pieces of chip.

The gap or groove 98 may be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. Alternatively, the inner opposing edges of the AWG chip 96 (in the groove 98) may be coated with an antireflective film and left exposed to air.

2-8 show AWG chips with grooves that completely separate the AWG chip into two pieces, but this groove can alternatively separate the AWG chip into two regions. In another general embodiment, an AWG chip may have a hinge, gap or groove forming two regions within the AWG chip and an actuator connecting the two regions of the AWG chip separated and connected by a hinge, optionally a conventional To the base or to the base as described in FIGS. 2, 5, 7, 9 and 11. If a base is used, the base must allow movement of the AWG chip induced by the actuator around the hinge. Since the OIC chip does not exist in two unique pieces, no base is needed.

Referring to FIG. 15, AWG chip 110 is shown having a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. The actuator 112 connects two regions of the chip divided by the grooves 116. AWG chip 110 includes a hinge 114. The substrate, actuator 112 and waveguides can be made of any materials for these features described in connection with FIGS. 2 and 3.

Gap or groove 116 is formed in AWG chip 110 across one or more lenses. The grooves 116 run vertically all the way through the AWG chip 110. The groove 116 is formed in any suitable manner including using a dicing saw, water jet cutting, chemical etching, laser-water-cutter, wire-saw, EDM, and the like. In this embodiment, chemical etching such as reactive ion etching (RIE) is preferred. Although not shown, the groove 116 could traverse the waveguide instead of the lens and the hinge 114 could be visually located on the waveguide grating.

Within the gap or groove 116, waveplates (not shown), such as half waveplates, may optionally be formed, especially when the grooves traverse the waveguide grating. Additionally or alternatively, the gap or groove 116 may be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. As another alternative, the inner opposing edges of the AWG chip 110 (in the groove 116) may be coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 112 changes length at a different rate than the substrate of the AWG chip 110 due to differences in thermal expansion coefficients. This causes a change in angle between the two regions of the AWG (on both sides of the groove 116), in particular between the two regions of the lens across the groove 116, the waveguide being relatively to the focus of the light. By causing the deflection of the input (or output) waveguide and part of the lens to move, the wavelengths are shifted to be focused into the waveguide grating, thus causing a shift in the CW of the device. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

Referring to FIG. 16, another embodiment of an AWG chip 120 is shown having a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. do. The actuator 122 connects the two regions of the chip divided by the grooves 126. AWG chip 120 includes a hinge 124. The substrate, actuator 122 and waveguides may be made of any materials for these features described in connection with FIGS. 2 and 3.

A gap or groove 126 is formed in the AWG chip 120 across one or more lenses. The grooves 126 run vertically all the way through the AWG chip 120. The groove 126 is formed in any suitable manner including using a dicing saw, water jet cutting, chemical etching, laser-water-cutter, wire-saw, EDM, and the like. In this embodiment, chemical etching such as reactive ion etching (RIE) is preferred. Although not shown, the groove 126 could traverse the waveguide instead of the lens, and the hinge 124 could be visually located on the waveguide grating.

Within the gaps or grooves 126, waveplates (not shown), such as half waveplates, may optionally be formed, especially when the grooves traverse the waveguide grating. Additionally or alternatively, the gap or groove 126 may be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. As another alternative, the inner opposing edges of the AWG chip 120 (in the groove 126) may be coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 122 changes length at a different rate than the substrate of the AWG chip 120 due to differences in thermal expansion coefficients. This causes a change in angle between the two regions of the AWG (on both sides of the groove 126), in particular between the two regions of the lens across the groove 126, with the waveguide relatively to the focus of the light. By causing the deflection of the input (or output) waveguide and part of the lens to move, the wavelengths are shifted to be focused into the waveguide grating, thus causing a shift in the CW of the device. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

Referring to FIG. 17, another embodiment of the AWG chip 130 has a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. Shown. The actuator 132 connects the two regions of the chip divided by the grooves 136. AWG chip 130 includes two hinges 134. The substrate, actuator 132 and waveguides may be made of any materials for these features described in connection with FIGS. 2 and 3.

A gap or groove 136 is formed in the AWG chip 130 across one or more lenses. The grooves 136 run vertically all the way through the AWG chip 130. The groove 136 is formed in any suitable manner including using a dicing saw, water jet cutting, chemical etching, laser-water-cutter, wire-saw, EDM, and the like. In this embodiment, chemical etching such as reactive ion etching (RIE) is preferred. Although not shown, the groove 136 could traverse the waveguide instead of the lens, and the hinges 134 could be visible above and below the waveguide grating.

Within the gap or groove 136, waveplates (not shown), such as half waveplates, may be optionally formed, especially when the grooves traverse the waveguide grating. Additionally or alternatively, the gap or groove 136 may be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. As another alternative, the inner opposing edges of the AWG chip 130 (in the groove 136) may be coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 132 changes length at a different rate than the substrate of the AWG chip 130 due to differences in the coefficients of thermal expansion. This causes a change in angle between the two regions of the AWG (on both sides of the groove 136), in particular between the two regions of the lens across the groove 136, the waveguide being relatively to the focus of the light. By causing the deflection of the input (or output) waveguide and part of the lens to move, the wavelengths are shifted to be focused into the waveguide grating, thus causing a shift in the CW of the device. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

Referring to FIG. 18, another embodiment of an AWG chip 140 has a waveguide grating and output waveguides between two lenses including a substrate, an input waveguide, a first lens, a second lens, and a plurality of waveguides. Shown. The actuator 142 connects two regions of the chip divided by the grooves 146. AWG chip 140 includes two hinges 144. The substrate, actuator 142 and waveguides can be made of any materials for these features described in connection with FIGS. 2 and 3.

A gap or groove 146 is formed in the AWG chip 140 across one or more lenses. The grooves 146 run vertically all the way through the AWG chip 140. The groove 146 is formed in any suitable manner including using a dicing saw, water jet cutting, chemical etching, laser-water-cutter, wire-saw, EDM, and the like. In this embodiment, chemical etching such as reactive ion etching (RIE) is preferred. Although not shown, the groove 146 could cross the waveguide instead of the lens, and the hinges 144 could be visible above and below the waveguide grating.

Within the gap or groove 146, a wave plate (not shown), such as a half wave plate, may optionally be formed, especially when the groove crosses the waveguide grating. Additionally or alternatively, the gap or groove 146 may be filled with a liquid having a refractive index that substantially matches that of the adhesive, gel, polymer or lens. As another alternative, the inner opposing edges of the AWG chip 140 (in the groove 146) may be coated with an antireflective film and exposed to air.

As the temperature of the structure changes, the actuator 142 changes its length at a different rate than the substrate of the AWG chip 140 due to differences in thermal expansion coefficients. This causes a change in angle between the two regions of the AWG (on both sides of the groove 146), in particular between the two regions of the lens across the groove 146, the waveguide being relatively to the focus of the light. By causing the deflection of the input (or output) waveguide and part of the lens to move, the wavelengths are shifted to be focused into the waveguide grating, thus causing a shift in the CW of the device. The actuator and base material size and shape are chosen so that the CW shift caused by thermal expansion / contraction of the actuator is exactly balanced with the CW shift in the AWG due to the change in temperature. As a result, AWG CW is temperature independent. The amount of pre-bias placed in the actuator may be adjusted to tune to the correct CW for the AWG.

In some embodiments of FIGS. 15 to 18, when the polymer occupies a groove (or between the mirror and the AWG chip) across the lens or waveguide grating, the polymer has a different desired thermal expansion coefficient from the AWG chip 110 substrate. If it has a coefficient of thermal expansion, the polymer can function as an actuator.

Referring to Figure 19, a graph showing the responses to different CW changes / temperature for a conventional AWG that is not temperature stable and a heatless AWG made in accordance with the present invention. As the graph indicates, as the temperature increases, the CW of a conventional AWG changes significantly. Conversely, as the temperature increases, the CW of the heatless AWG produced in accordance with the present invention remains substantially constant.

20 and 21, a typical optical integrated circuit (OIC) 200 is illustrated. OIC 200 includes one or more optical layers 204 deposited, for example, on substrate 208. Optical layers 204 and substrate 208 may be collectively referred to as chip 210. The optical layers 204 may extend coaxially with the substrate 208 (eg, may have substantially the same spatial boundaries). The optical layers 204 can transmit light in a controlled manner. The optical layers 204 may comprise layer (s) of silica and the substrate 208 may comprise part of a silicon wafer.

OIC 200 may further include a chip carrier 212. Chip carrier 212 may co-expand with chip 210 in certain region (s) and / or may not co-expand within other region (s). For example, in chip extension region 214, chip 210 extends physically beyond chip carrier 212. In the carrier extension region 218, the chip carrier 212 physically extends beyond the chip 210. Chip extension region 214 may be used, for example, to encourage attachment of optical fiber (s) to chip 210.

The optical layers 204 include a first region 216, a second region 220 and a connection region 224. For example, scroll-dicing may mechanically isolate the first region 216 and the second region 220 (eg, using a water-jet, laser-water-cutter, and / or wire-saw). Used to form a gap 228 between the first region 216 and the second region 220, leaving a monolithic connection through the connection region 224. In one embodiment, the chip carrier 212 co-expands with the optical layers 204 in the region of the gap 228. In another embodiment, the chip carrier 212 does not co-expand with the optical layers 204 in the region of the gap 228. In another third embodiment, the chip carrier 212 co-expands with the optical layers 204 in some portions of the gap 228 and coincide with the optical layers 204 in other portions of the gap 228. Do not expand.

The first region 216 can include a first region waveguide (s) 232 (eg, optical waveguide (s) and / or slab waveguide (s)). Second region 220 may include second region waveguide (s) 236 (eg, optical waveguide (s) and / or slab waveguide (s)). The connection area 224 may include a first lens 240. The first lens 240 can propagate light from the first region waveguide (s) 232 to the second region waveguide (s) 236. Alternatively, first lens 240 may focus light from second region waveguide (s) 236 to first region waveguide (s) 232. Optionally, OIC 200 may include a second lens 244.

Referring briefly to FIG. 21, a cross-sectional view taken along the straight lines 250-250 of the OIC of FIG. 20 is illustrated. Turning next to FIG. 22, a typical actuator 400 in accordance with one aspect of the present invention is illustrated. The actuator 400 includes a first actuator body 410 and a second actuator body 420. The actuator 400 expands and / or contracts with temperature changes. In one embodiment, the expansion of the actuator 400 being substantially linear with the temperature over the temperature range specified as “operating temperature range” (change in the length of the actuator 400 that is substantially linear to the change in temperature) and It is desirable to have (or) shrinkage. In another embodiment, actuator 400 applies focus over the operating temperature range of the OIC.

In accordance with one aspect of the present invention, actuator 400 may be used as a component of an OIC to inspire mechanical beam steering to mitigate and / or overcome the disadvantages associated with conventional optical integrated circuit (s) and other devices. Can be. For example, actuator 400 can be used in an OIC to mitigate the temperature sensitivity of the OIC. The actuator 400 has a first end 412 and a second end 416. Although AWG chips containing waveguide gratings have been considered in length, the OIC may comprise a Mach-gender interferometer.

The first actuator body portion 410 and / or the second actuator body portion 408 may comprise aluminum, brass, bronze, chromium, copper, gold, iron, magnesium, nickel, palladium, platinum, silver, stainless steel, tin, Titanium, Tungsten, Zinc, Zirconium, Hastelloy ^? , Kovar ^? , Invar, Monel ^? , Inconel ^? Metals such as alumina, ceramic materials such as alumina or aluminum silicates, polymerizable materials such as silicone rubber or elastomer, and Zytel ^? Or polyamide composites such as glass fiber reinforced nylon, polycarbonate, polyolefins, polyesters, crosslinked polymers such as silicone rubber, PEEK, polymer composite materials (e.g. carbon fibers, graphite and / or glass fibers), liquid crystals It may be made of one or more of polymers and the like.

The first actuator body 410 has a first coefficient of thermal expansion. Similarly, the second actuator body portion 408 has a second coefficient of thermal expansion. In one embodiment, the first coefficient of thermal expansion is substantially similar to the second coefficient of thermal expansion. In another embodiment, the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion. In another third embodiment, the first coefficient of thermal expansion is less than the second coefficient of thermal expansion.

When used as part of the OIC 200, the force applied by the actuator 400 can be in a direction that tends to enlarge the gap 228, in which case the actuator 400 is in a compressed state, Referred to herein as "compression-state actuators". Alternatively, the force applied may be present in a direction that tends to narrow the gap 228, in which case the actuator 400 is referred to as a "extension-state" actuator. For actuator 400 in a compressed state, the actuator may be in contact at its minimum operating temperature (e.g., first region 216) by maintaining a force (e. ) Or contact with the second region) is not lost. It must also be able to maintain contact (eg with two regions) at the minimum specified storage temperature of the device. Since the length of the actuator 400 may have a narrow tolerance and the width of the gap 228 may be applied to the manufacturing dispersion (s), it may be advantageous for the actuator 400 to have an adjustable length L _A. And therefore it can be adjusted to meet the requirements of a particular AWG (eg, after gap 228 has been cut into AWG).

Moreover, the actuator length L _A can be adjusted to provide the pass band of a particular channel of the AWG with the desired center-wavelength (CW). This adjustment can be used to correct for manufacturing dispersion (s) of optical properties of materials that can lead to some mismatch between the desired CW (eg, devised) and the manufactured CW. A third advantage of having an adjustable length is that the installation process can be simplified. Installing the actuator 400 with its final desired length can be difficult because it will exert a force (eg, between regions) at that length. Thus, while the actuator 400 is inserted into the gap 228, it is temporarily shorter than the desired final length, and subsequently extended to the final length so that force (eg, between regions) only when the actuator 400 is extended. It may be desirable to exert this effect. Furthermore, for a particular OIC geometry (eg, cut-out), deductively calculating the value of the CTE of the actuator 400 necessary to provide a beam steering precision that eliminates the effect of temperature variations on the refractive index of materials. Can be difficult. For this reason, it may be useful for the actuator 400 to have a CTE value that can be adjusted between the maximum and minimum estimates of the desired values.

The first actuator body 410 is coupled to the second actuator body 420. For example, the first actuator body portion 410 may be coupled to the second actuator body portion 420 by welding, crimping, gluing, melting, and / or other suitable coupling manner. The first actuator body portion 410 and the second actuator body portion 420 are shown cylindrical in FIG. 22, but any of the first actuator body portion 410 and / or the second actuator body portion 420 is optional. It should be appreciated that any suitable shape can be used in accordance with the present invention.

Referring briefly to FIG. 23, in one embodiment, the second actuator body portion 420 includes three component portions 430, 434, 438. The three component portions 430, 434, 438 can include suitable materials having similar or different thermal expansion coefficients. In one embodiment, one component portion 430 and the other component portion 438 include a first material having a first coefficient of thermal expansion, and second component portion 434 has a second coefficient of second thermal expansion coefficient. Contains substances. These component portions 430, 434, 438 are coupled (eg, spots) at appropriate location (s) to affect the appropriate overall thermal expansion coefficient of the second actuator body 420 and / or actuator 400. -Welded).

Next, referring to FIG. 24, the OIC of FIG. 20 using an actuator 400 in accordance with an aspect of the present invention is illustrated. For example, actuator 400 may generally be included in gap 228. The actuator 400 expands and / or contracts with temperature changes that allow at least a portion of the first region 216 and / or connection region 224 to move relative to the second region 220. The actuator 400 may be held in place (eg, physiokinetic and / or by an adhesive).

The carrier extension region (s) can be designed to encourage installation of the actuator 400. In one embodiment, the chip carrier 212 may be comprised of a first contact region 254 that includes a portion of the first region 210 and a portion of the chip carrier 212. In this embodiment, in almost the first contact region 254, a portion of the first region 210 and a portion of the chip carrier 212 may make physical contact with the actuator 400. In another embodiment, the chip carrier 212 may be comprised of a second contact region 258 that may be chip extended. The first end 412 may be in contact with the first contact region 254, and the second end 416 may be in contact with the second contact region 258.

In one embodiment, actuator 400 relates first region 216 with respect to second region 220 in response to temperature changes within the normal operating range of the device (eg, in the range of about −20 ° C. to about 95 ° C.). Allow at least about 0.5 microns to migrate to less than about 100 microns. In another embodiment, the actuator 400 causes the first region 216 to move above about 5 microns and below about 50 microns with respect to the second region 220. In a third embodiment, the actuator 400 causes the first region 216 to move above about 10 microns and below about 25 microns with respect to the second region 220. In another embodiment, actuator 400 changes the length to greater than about 0.01 micron and less than about 10 micron per temperature change. In another embodiment, actuator 400 changes the length to greater than about 0.1 micron and less than about 5 microns per degree C temperature change. In another embodiment, actuator 400 changes the length to greater than about 0.2 microns and less than about 2 microns per degree C temperature change.

In one embodiment, the connection region 224 is modified to sufficiently adjust the rotation of the first region 216 relative to the second region 220. It should be appreciated that the first region 216 and / or the second region 220 may be deformed to some extent; In this embodiment, the relative rotation is preferably adjusted primarily by deformation in the connection region 224 (eg, the connection region 224 is to a greater extent than the first region 216 or the second region 220). Preferably modified). In order to facilitate the deformation of the connection area 224, the connection area 224 is as narrow as possible without disturbing the propagation of light therethrough and also for the first area 216 and the second area 220. And may be designed and / or manufactured substantially broader than 224.

Referring briefly to FIG. 20, in one embodiment, the cross section of the connection region 224 generally has a lateral dimension L _{C that} is less than the nominal width W of the connection region 224. Thus, flexing due to external forces from the actuator is allowed as described further below. In one embodiment, the lateral dimension L _C of the cross section of the connection region 224 is greater than about 10 microns and less than about 10000 microns. In another embodiment, the lateral dimension L _C of the cross section of the connection region 224 is greater than about 100 microns and less than about 5000 microns. In yet another third embodiment, the side dimension L _C of the cross section of the connection region 224 is greater than about 500 microns and less than about 2000 microns.

Moreover, it should be appreciated that the first area 216, the connection area 224 and the second area 220 may have any suitable geometry. For example, multi-wavelength light rays are received at an input port (not shown) (eg, from an optical fiber in the network), transported through the first region waveguide (s) 232, and provided to the first lens 240. Can be. The first lens 240 can process (eg, propagate) multi-wavelength light rays into the second region waveguide (s) 226 (eg, arranged waveguide grating arms). The second region waveguide (s) 236 may then provide multi-wavelength light rays to the output port (s) (not shown).

As the temperature of the OIC 200 increases, the refractive index of the first region waveguide (s) 232 and / or the refractive index of the second region waveguide (s) 236 may change. To compensate for this temperature based on the change in refractive index, the actuator 200 expands as a result of the temperature change such that at least a portion of the first region 216 and / or the connecting region 224 is connected to the second region 220. Move (eg, rotate) in relation to it. Likewise, as the temperature of the OIC 200 decreases, the actuator 400 contracts such that at least a portion of the first region 216 and / or the connecting region 224 moves relative to the second region 220 ( Yes, rotate it. The movement (rotation) caused by the temperature change corresponds to or compensates for the temperature-change induced wavelength shifts in the first region and / or second region waveguide (s) 232, 236 due to the temperature dependent refractive index. It is believed to be. As such, the wavelength shift associated with the waveguide temperature dependent refractive index change can be relaxed. Thus, loss of signal and / or crosstalk in communication system (s) using OIC 200 may be reduced.

Next, returning to FIG. 25, one embodiment of an actuator 600 in accordance with one embodiment of the present invention is illustrated. The actuator 600 includes a first actuator body 610 and a second actuator body 620. The first actuator body portion 610 includes a boring 630 through at least a portion of the first actuator body portion 610. The first actuator body 610 has a first coefficient of thermal expansion. The second actuator body 620 has a second coefficient of thermal expansion. In this embodiment, the second actuator body portion 620 is a bore 630 of the first actuator body portion 610 to facilitate engagement of the first actuator body portion 610 and the second actuator body portion 620. Is inserted into at least part of Once the desired amount of second actuator body portion 620 is inserted into the boring 630, the first actuator body portion 610 and the second actuator body portion 620 may be welded, crimped, glued, for example. And may be joined together by any suitable means such as ing and / or melting.

Moreover, the operating characteristics of the actuator 600 (eg, overall stretching and / or compression) may be based at least in part on the amount of the second actuator body portion 620 inserted into the boring 630. For example, if the first coefficient of thermal expansion is different from the second coefficient of thermal expansion, the overall thermal characteristics of the actuator 600 are at least partially in proportion to the amount of the second actuator body portion 620 inserted into the boring 630. Based.

In one embodiment, the first actuator body portion 610 comprises an aluminum tube and the second actuator body portion 620 comprises a steel rod. The first actuator body 610 (steel rod) is inserted inside the second actuator body 620 (aluminum tube), and the length of the second actuator body 620 (aluminum tube) is By pulling the end of the actuator 600 until it is adjusted. Subsequently, the second actuator body portion 620 (aluminum tube) is crimped at the desired position to facilitate engagement of the first actuator body portion 610 to the second actuator body portion 620.

Referring briefly to FIG. 26, another embodiment of the actuator 600 shown in FIG. 25 is illustrated. In this embodiment, at least a portion of the boring 630 of the first actuator body portion 610 is provided to accommodate a threaded insert. Likewise, at least a portion of the second actuator body 620 has a thread. The second actuator body 620 is threadably threaded into the bore 630 of the first actuator body 610 to facilitate engagement of the first actuator body 610 and the second actuator body 620. Can be inserted. Although the first actuator body portion 610 and the second actuator body portion 620 are cylindrical in FIG. 25, any for the first actuator body portion 610 and / or the second actuator body portion 620. It should be appreciated that suitable shapes can be used in the present invention.

Next, returning to FIG. 27, one embodiment of an actuator 800 in accordance with an aspect of the present invention is illustrated. The actuator 800 includes a first actuator body 810 and a second actuator body 820. 27 illustrates one embodiment of a compressed-state actuator in which the length of actuator 800 can be adjusted. The first actuator body 810 includes a bore 830 through at least a portion of the first actuator body 810. The first actuator body 810 has a first coefficient of thermal expansion.

The second actuator body portion 820 includes a threaded portion 840. The second actuator body 820 has a second coefficient of thermal expansion. In this embodiment, the threaded portion 840 of the second actuator body portion 820 is adapted to facilitate the joining of the first actuator body portion 810 and the second actuator body portion 820. It is inserted into at least a portion of the boring 830 of 810. In one embodiment, once the desired amount of second actuator body portion 820 is inserted into the boring 830, the first actuator body portion 810 and the second actuator body portion 820 may be combined. . The operating characteristics (eg, overall stretching and / or compression) of the actuator 800 are based at least in part on the amount of threaded portion 840 of the second actuator body portion 820 inserted into the bore 830. can do. For example, if the first coefficient of thermal expansion is different from the second coefficient of thermal expansion, the overall thermal characteristics of the actuator 800 are threaded portions 840 of the second actuator body portion 820 inserted into the boring 830. Based at least in part on the amount).

Referring briefly to FIG. 28, another embodiment of the actuator 800 shown in FIG. 27 is illustrated. In this embodiment, the first actuator body portion 810 is adapted to receive the first contact piece 850. The second actuator body 820 can likewise be adapted to receive the second contact piece 860.

The first contact piece 850 and / or the second contact piece 860 may comprise, for example, a hard metal (eg, stainless steel) sphere or alternatively a hard metal cylinder. It should be appreciated that the first contact piece 850 and / or the second contact piece 860 may comprise any suitable material and / or geometry. The first contact piece 850 and / or the second contact piece 860 may be separated from the rest of the actuator 800 (eg, the first actuator body portion 810 and the second actuator body portion 820). Not permanently combined with).

Turning briefly to FIG. 29, a cross sectional view of an OIC 1000 having a first contact region 1004 and a second contact region 1008 is illustrated. The OIC 1000 further uses an actuator 800, a first contact piece 850 and / or a second contact piece 860.

Next, referring to FIG. 30, an actuator 1100 in accordance with an aspect of the present invention is illustrated. The actuator 1100 is one embodiment of a compression-state actuator having both its length L _A and its coefficient of thermal expansion (CTE) independently adjustable. The actuator 1100 has a first end 1104 and a second end 1108. In this embodiment, the actuator 1100 includes a first actuator body portion 1110 and a second actuator body portion 1120. The first actuator body portion 1110 includes a boring 1130 through at least a portion of the first actuator body portion 1110. The first actuator body portion 1110 has a first coefficient of thermal expansion CTE ₁ .

The second actuator body portion 1120 includes a threaded portion 1140. The second actuator body portion 1120 has a second coefficient of thermal expansion CTE ₂ . The actuator 1100 further includes a ring 1170 having a _third coefficient of thermal expansion CTE ₃ . This ring 1170 may comprise any suitable material, for example copper. Ring 1170 may be threadably coupled to threaded portion 1140 of second actuator body portion 1120. Subsequently, the threaded portion 1140 and the ring 1170 of the second actuator body portion 1120 may be threadably coupled to the first actuator body portion 1110.

The first actuator body portion 1110 and the second actuator body portion 1120 may comprise materials having different coefficients of thermal expansion. For example, the first actuator body portion 1110 may be constructed of steel and the second actuator body portion 1120 may be constructed of aluminum. The effective coefficient of thermal expansion CTE _A of the actuator 1100 is related to CTE ₁ and CTE ₂ and can be approximated by:

(L₁ × CTE₁)+(L₂ × CTE₂)L _A × CTE _A

(L ₁ × CTE ₁ ) + (L ₂ × CTE ₂ )

Where L ₁ is the distance from the threads of the ring 1170 to the first end 1104, L ₂ is the distance from the threads of the ring 1170 to the second end 1108, and L _A is the actuator. Is the distance (L _A = L ₁ + L ₂ ). Typically, coefficient CTE ₃ of ring 1170 has less impact on CTE _A than CTE ₁ and CTE ₂ .

For example, during manufacture, the ring 1170 is threaded into the first actuator body portion 1110 and the threaded portion 1140 of the second actuator body portion 1120 is threaded into the ring 1170. CTE _A is adjusted by rotating the ring 1170 relative to the first actuator body portion 1110 and relative to the second actuator body portion 1120 (eg, without affecting the length L _{A of the} actuator). Whereas, the threaded portion 1140 does not rotate relative to the first actuator body portion 1110. Thus, rotating the ring 1170 moves the threads of the ring 1170 close to the first end 1104 of the actuator 1100 or close to the second end 1108 of the actuator 1100. As the threads of the ring 1170 approach the first end 1104, CTE _A approaches its CTE ₂ (eg, the CTE of the second actuator body portion 1120). Conversely, as the threads of the ring 1170 approach the second end 1108, CTE _A approaches its CTE ₁ value.

The length L _{A of the} actuator is changed by rotating the threaded portion 1140 and the first actuator body 1110 relative to the ring 1170 in any manner not equal to the rotation to adjust CTE _A. Can be. For example, L _A can be adjusted by rotating the threaded portion 1140 in the ring 1170, while holding the ring 1170 and the first actuator body portion 1110 together without relative rotation. By rotating the threaded portion 1140 and the first actuator body 1110 relative to the ring 1170 at an appropriate ratio, L _A can be adjusted without significantly affecting CTE _A of the actuator. Based on the approximation to CTE _A above, the rotation angle a ₁ of the threaded portion 140 and the rotation angle a ₂ of the first actuator body portion are related to the following equation:

CTE₂/CTE₁ a ₁ / a ₂

CTE ₂ / CTE ₁

L _A can be adjusted without significantly affecting CTE _A.

In one embodiment, the first actuator body portion 1110 may be adapted to receive the first contact piece 1150. In addition, the second actuator body portion 1120 may be adapted to receive the second contact piece 1160. The first contact piece 1150 and / or the second contact piece 1160 may be separated from the rest of the actuator 1100 (eg, the first actuator body portion 1110 and the second actuator body portion 1120). Not permanently combined with).

Returning to FIG. 31, an actuator 1200 in accordance with an aspect of the present invention is illustrated. The actuator 1200 is one embodiment of a compression-state actuator having both its length L _A and its coefficient of thermal expansion (CTE) independently adjustable. The actuator 1200 has a first end 1204 and a second end 1208. In this embodiment, the actuator 1200 includes a first actuator body portion 1210, a second actuator body portion 1220, and a third actuator body portion 1224. The first actuator body portion 1210 includes a boring 1230 through at least a portion of the first actuator body portion 1210. The first actuator body portion 1210 has a first coefficient of thermal expansion CTE ₁ .

The second actuator body portion 1120 includes a threaded portion 1240. The second actuator body portion 1220 has a second coefficient of thermal expansion CTE ₂ . The actuator 1200 further includes a nut 1270 having a _third coefficient of thermal expansion CTE ₃ . This nut 1270 may comprise any suitable material, for example copper.

Third actuator body portion 1224 includes a threaded portion 1278. The third actuator body portion 1224 has a fourth coefficient of thermal expansion CTE ₄ . In one embodiment, the first actuator body portion 1210, the third actuator body portion 1224 and the nut 1270 are made of a first material (eg, magnesium), and the second actuator body portion 1220 is formed of a first material. It is made of a second material (eg Invar-commercial grade steel) with a different CTE than the first material. In another embodiment, first end 1204 and / or second end 1208 include slots 1272 and 1274, for example, to cross the OIC. By straddling the chip, the slots can inspire maintaining the actuator 1200 in its intended position (eg, between the first contact position and the second contact position). In addition, contact pieces (not shown) may be recessed into each of slots 1272 and 1274.

After the actuator 1200 is installed such that the slots 1272 and 1274 span the OIC, neither the second actuator body portion 1220 nor the first actuator body portion 1210 is free to rotate relative to the OIC. As a result, the second actuator body portion 1220 cannot be rotated relative to the first actuator body portion 1210 after the actuator is installed. The third actuator body portion 1224 may have a differential thread. For example, the third actuator body portion 1230 is threaded at 72 threads (t.p.i.) per inch of right hand thread at the first end 1276 and 80t.p.i. at the second end 1278. Threaded as a right hand thread. The second actuator body portion 1220 may be threaded at one end 1280 (eg, 80 t.p.i. right hand thread).

The length of the actuator 1200 maintains the first actuator body portion 1210, the nut 1270 and the second actuator body portion 1220 so that they do not rotate relative to each other, and the third actuator body portion 1230 is removed. 1 can be adjusted by rotating it relative to the actuator body portion 1210. The threads at the first end 1276 become coarser than the threads at the second end 1278, and the third actuator body portion 1230 is faster than it is translated relative to the second actuator body portion 1220. Translation relative to the actuator body portion 1210. The length adjustment provided by the rotation of the third actuator body portion 1230 is a fine adjustment (eg, the adjustment speed may be approximately 0.0014 inches per full rotation of the nut). When the length is adjusted in this way, the CTE _A of the actuator is not affected.

The CTE _A of the actuator 1200 maintains the first actuator body portion 1210, the third actuator body portion 1230 and the second actuator body portion 1220 so that they do not rotate relative to each other, and the nut 1270. ) May be adjusted by rotating relative to the third actuator body portion 1230. CTE _A is related to CTE ₁ , CTE ₂ , and CTE ₄ ; When the first actuator body portion 1210, the third actuator body portion 1224 and the nut 1270 are made of the same or similar material, CTE _A may be approximated as follows:

(L₁ × CTE₁)+(L₂ × CTE₂)L × CTE _A

(L ₁ × CTE ₁ ) + (L ₂ × CTE ₂ )

Where L ₁ is the distance from the gripping-point of the threads of the second actuator body portion 1220 to the first end 1204 and L ₂ is the gripping-point of the threads of the second actuator body portion 1220. Is the distance from the second end 1208 to L, where L is the distance of the actuator (eg, L = L ₁ + L ₂ ). "Gripping-point" means the distance of about three threads from the end of the threads closest to the first end 1204. 32 illustrates a schematic top view of an actuator 1200.

As illustrated in FIG. 33, the actuator 1500 includes a first actuator body portion 1210, a third actuator body portion 1224, a nut 1270, an end shaft 1284, and an end-ring 1282. can do. In one embodiment, the first actuator body portion 1210, the third actuator body portion 1224 and the nut 1270 are made of a first material (eg magnesium or aluminum) and the end shaft 1284 is formed of It is made of a second material (eg Invar or steel) with a different CTE than the first material.

The nut 1270, the third actuator body portion 1224 and the first actuator body portion 1210 may be configured similarly to those of the actuator 1200. End shaft 1284 is not threaded and is held in place by end-ring 1282, which is threaded into nut 1270. By rotating the third actuator body portion 1224, the length L of the actuator is adjusted as described for the actuator 1200. The length of the actuator 1500 is also adjusted by rotating the end ring 1282.

End-ring 1282 and distal axis 1284 can be configured such that end-ring 1282 can be rotated without rotating distal axis 1284, so this length adjustment is such as end-axis 1284. Slots within can be made while crossing the OIC. For example, the length adjustment speed provided by this rotation can be approximately 0.0125 inches per full rotation of the end-ring 1282. This is a coarse length adjustment than is provided by the nut 1270 and is suitable for accommodating larger length adjustments than can be provided by the rotation of the nut 1270.

34 illustrates a schematic top view of an actuator 1500. For example, at least one first recessed blind hole 1286 may be formed on the end-ring 1282. Tools designed to hold end-rings 1282 in recessed hole (s) 1286 can be used to rotate end-rings 1282 relative to distal axis 1284.

Next, referring to FIGS. 35 and 36, an actuator 1800 in accordance with one embodiment of the present invention is illustrated. This actuator 1800 is one embodiment of an extended-state actuator. In one embodiment, the actuator 1800 contacts the OIC 200 at a first contact location 1810 and a second contact location 1820, both of which are outside the gap 228. The length of the actuator 1800 is the distance between the first contact position 1810 and the second contact position 1820. The actuator 1800 typically remains extended over the entire operating range of the OIC (e.g., a force that tends to pull the first region 216 towards the second region 220 over the entire operating temperature range). Is authorized). As with compressed-state actuators, the length of the actuator 1800 increases with increasing temperature, and the increased length reflects the effect of the change in refractive index of the materials used for the OIC 200 resulting in a change in temperature. Can be configured to erase. Because actuator 1800 does not require substantial stiffness, actuator 1800 may have a relatively low mass relative to compressed-state actuators. The actuator 1800 may include, for example, a flexible metal band or wire loop. 37 shows an actuator 1800 with an OIC 200 with a cut-out 2000 of keyhole-cut shape.

38 and 39, an actuator 2100 in accordance with an aspect of the present invention is illustrated. Actuator 2100 is one embodiment of an extended-state actuator. In this embodiment, the first post 2110 extends through the hole 2112 (eg, in the first area 216), and the second post 2120 extends through the hole 2124 (eg, the first area). Through 220). The actuator 2100 includes a first wire 2130 and a second wire 2140. Wires 2130, 2140 are attached to posts 2110, 2120 with winding attachments 2142, 2144, 2146, and 2148, which may include soldering and / or crimping as part of securing the attachment. Can be. The windings 2142 and 2144 can be configured to have opposite helicality such that no pure torque is applied to the first post 2112. The windings 2146 and 2148 can be configured to have opposite helicality such that no pure torque is applied to the second post 2120.

Referring to FIG. 40, actuator 2100 may optionally include clamp 2150. Clamp 2150 may be configured to provide a method of adjusting the length of actuator 2100. For example, by crimping the clamp 2150, the center of the first wire 2130 can be drawn close to the center of the second wire 2140, thus increasing the tension of the wires 2130, 2140 and Thus, the distance between the first post 2110 and the second post 2120 is shortened (eg, the actuator 2100 is shortened). As the actuator 2100 does not require a rigid structure, it can be realized by low mass elements, which requires maintaining a compressed state. Reduced mass actuators may be desirable because when the device is subjected to shock or vibration, the parts with larger masses are at greater risk of damaging the device (OIC). Another advantage of the elongated-actuator is that it causes out-of-plane deformations of the first region 216 or the second region 220 and there is less risk of misalignment (eg, reducing the risk of buckling the chip). .

Returning to FIG. 41, another actuator 2400 is illustrated in one aspect of the invention. This actuator 2400 includes a first actuator body portion 2410 and a second actuator body portion 2420. The second actuator body portion 2420 can include a first threaded portion 2430 (eg, right hand thread) and a second threaded portion 2440 (eg, left hand thread). The first actuator body portion includes threaded bore sections 2450 and 2460 to receive each of the first threaded portion 2430 and the second threaded portion 2440.

The length of the actuator 2400 is the distance between the first end 2470 and the second end 2480. Rotating the second actuator body portion 2420 will translate the threaded bore section 2450 relative to the threaded bore section 2460 and consequently translate the actuator 2400 to change length. Actuator 2400 may be used as a compressed-state actuator with contact surfaces at locations 2470 and 2480. Alternatively, actuator 2400 may be used as an elongated-state actuator with contact surfaces at positions 2486 and 2488.

Referring to FIG. 42, an OIC 200 using a wedge 2500 is illustrated in accordance with an aspect of the present invention. Wedge 2500 is inserted into slot 2510 of OIC 200. For example, slot 2510 may be part of keyhole cut-out 2520. In one embodiment, force is applied to (or removed from) the wedge 2500 via a force actuator (not shown). In another embodiment, the wedge 2500 has a coefficient of thermal expansion. Thermal expansion and / or thermal contraction of the wedge 2500 may result in expansion and / or contraction force (s) applied to the slot 2510.

Another aspect of the invention provides methods for manufacturing an optical integrated circuit, wherein the base is provided to have at least one waveguide in the first region and at least one waveguide in the second region. A connection area for connecting the first area and the second area is further provided. The first lens is provided in the connection area, and the first area is scroll-dice from the second area. Alternatively, the first region may be separated from the second region (eg, beyond the lenses—excluding the lenses) by the patterned etching of the base. The actuator is provided between the first region and the second region.

While the present invention has been shown and described with reference to certain illustrated embodiments, it will be appreciated that equivalent changes and modifications may occur to those skilled in the art upon reading and understanding the specification and the accompanying drawings. In particular, with respect to the various functions performed by the components (assemblies, devices, systems, etc.), the terms used to describe such components (including "means" by reference) are not otherwise indicated. Unless otherwise corresponding to any component that performs the specified function of the described components (e.g., functionally equivalents), and is not structurally identical to the disclosed structure, it performs functions in the illustrated exemplary aspects of the invention. It is intended to correspond to any component.

Claims (18)

A base composed of a single piece and having a first coefficient of thermal expansion, the base comprising a first region, a second region and a hinge region, the first region and the second region being divided by a groove and connected by a hinge region; An arrayed waveguide chip supported by a base, comprising: an arrayed waveguide chip comprising a substrate, a lens, a waveguide grating optically coupled to the lens, and a groove crossing one of the lens and the waveguide grating; And An actuator having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the actuator connecting the first and second regions of the base and operative to rotate the first region of the base with respect to the second region in response to temperature changes. ; Temperature independent optical integrated circuit comprising a. The temperature independent optical integrated circuit of claim 1, wherein the second coefficient of thermal expansion is smaller than the first coefficient of thermal expansion. The temperature independent optical integrated circuit of claim 1, wherein the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion. 2. The temperature independent optical integrated circuit of claim 1, wherein the actuator is one of a piezoelectric element, an electric distortion type actuator, a solenoid, and an electric motor. 2. The temperature independent optical integrated circuit of claim 1, wherein the groove of the arrayed waveguide chip traverses a waveguide grating. 6. The temperature independent optical integrated circuit of claim 5, wherein the groove of the arrayed waveguide chip comprises a wave plate. 2. The temperature independent optical integrated circuit of claim 1, wherein the groove of the arrayed waveguide chip traverses a lens. 2. The temperature independent optical integrated circuit of claim 1, wherein the groove of the arrayed waveguide chip has a width of 1 to 50 microns. The waveguide of claim 1, wherein the groove of the arrayed waveguide chip completely crosses the arrayed waveguide chip, thereby forming first and second pieces of the arrayed waveguide chip, and the first piece of the arrayed waveguide chip. And a second piece of the arrayed waveguide chip is supported by a second region of the base. The waveguide chip of claim 1, wherein the arrayed waveguide chip comprises: at least one input waveguide optically coupled to the first lens, at least one output waveguide optically coupled to the second lens, a waveguide grating optically coupled to the first lens and the second lens; And a groove crossing the first lens, the second lens, and the waveguide grating. The temperature-independent optical integration of claim 1, wherein the arrayed waveguide chip further comprises a mirror, and wherein the groove of the arrayed waveguide chip traverses a space between the mirror and one of the lens and the waveguide grating. Circuit. An arrayed waveguide chip comprising a single piece and having a first coefficient of expansion, a lens, an optical waveguide grating optically coupled to the lens, and a groove across one of the lens and the waveguide grating, wherein the substrate of the arrayed waveguide chip An arrayed waveguide chip comprising a first region, a second region and a hinge region, wherein the first region and the second region are divided by a groove and connected by the hinge region; And An actuator having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion, wherein the first region and the second region of the arrayed waveguide chip are connected, and the first region of the arrayed waveguide chip is connected to the second region in response to temperature change. An actuator operative to rotate about; Wherein said arrayed waveguide chip is located on a base having a third coefficient of thermal expansion, said base being divided by a groove and connected by a hinge and having a first region and a second region, wherein the temperature independent optical integration includes: Circuit. 13. The temperature independent optical integrated circuit of claim 12, wherein a difference between the second coefficient of thermal expansion and the first coefficient of thermal expansion is 100% or more. 13. The temperature independent optical integrated circuit of claim 12, wherein the groove of the arrayed waveguide chip has a width of 3 to 30 microns. 13. The method of claim 12, wherein the arrayed waveguide chip comprises at least one input waveguide optically coupled to a first lens, at least one output waveguide optically coupled to a second lens, a waveguide grating optically coupled to the first lens and the second lens, And a groove crossing the first lens, the second lens, and the waveguide grating. 13. The temperature independent optical integrated circuit of claim 12, wherein the second coefficient of thermal expansion is smaller than the first coefficient of thermal expansion. Providing a base composed of a single piece and having a first coefficient of thermal expansion, said base comprising a first region, a second region and a hinge region, the first region and the second region being divided by a groove and hinged region Connected by; Attaching to the base an arrayed waveguide chip comprising a substrate, a lens and a waveguide grating optically coupled to the lens; Forming grooves in one of the lens and waveguide gratings in the arrayed waveguide chip; And Attaching an actuator having a second coefficient of thermal expansion different from the first coefficient of thermal expansion to the base, wherein the actuator connects the first region and the second region of the base and the second region of the base in response to a temperature change. Operating to rotate about an area; Method of manufacturing a temperature independent optical integrated circuit comprising a. Providing an arrayed waveguide chip comprising a single piece, a substrate having a first coefficient of thermal expansion, a lens and a waveguide grating optically coupled to the lens; Shaping the substrate of the arrayed waveguide chip to include a first region and a second region divided by a groove and connected by a hinge, the substrate remaining in a single piece; And Attaching an actuator having a second coefficient of thermal expansion different from the first coefficient of thermal expansion to the arrayed waveguide chip, wherein the actuator connects the first region and the second region of the arrayed waveguide chip and is arranged in response to temperature changes. Operative to rotate the first region of the waveguide chip with respect to the second region, the groove traversing one of the lens and the waveguide grating; Method of manufacturing a temperature independent optical integrated circuit comprising a.

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