JP2003231549A - Binding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a binding device which can easily disassemble waste home electric appliances and reuse them. <P>SOLUTION: The binding device to bind and fix works 3 comprises a binding band 1 which is bound around the works 3 to substantially bind the works 3, and a band binding component 2 which is formed of a shape memory material, and fitted to the binding band 1 to bind and unbind the binding band 1, and has the binding function of the works 3 during the use at normal temperature, and loses the binding function when heated. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a binding device used for fixing wiring of electric appliances and the like, and more particularly to a binding device which can be easily bound and released.

[0002]

2. Description of the Related Art Conventionally, a tying device such as a tying band made of resin is highly convenient because it can be tied very easily, and is often used for tying and fixing the position of wiring of electric appliances and the like.

This is one in which a groove is formed in the binding band and the binding portion is integrated with the binding band itself, and the end portion of the band is inserted into the binding portion while the binding band is wound. As a result, the groove engages with the band binding portion and is bound, so that the binding band does not advance in the loosening direction. Therefore, when fixing wiring etc., simply wrap the binding band around the wiring, insert it into the binding section and tighten it.
Wiring can be bound.

In recent years, according to the Waste Home Appliance Recycling Law, electronic devices and home appliances have come to be reused from the viewpoint of environmental protection, and the products can be disassembled more easily. The development of coupling members, separation parts, etc. is progressing.

[0005]

However, when disassembling electronic devices and home electric appliances, the above-mentioned binding band has a structure that does not loosen once bound, so the binding band had to be cut during disassembly. . When the number of binding points increases, each must be cut, which is one of the causes of the increase in disassembly cost.

Further, the cut binding band cannot be reused and becomes a waste, which is not preferable in terms of environmental protection.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to solve the above-mentioned problems and to provide a binding device which can easily disassemble a waste home electric appliance or the like and can be reused.

[0008]

DISCLOSURE OF THE INVENTION The present invention is a binding device for binding and fixing objects to be bound, and a binding band that is wrapped around the objects to be bound and substantially binds the objects to be bound. It is made of a memory material, is attached to the binding band, and is composed of a band binding component that binds and releases the binding band. When used at room temperature, it has a binding function for the binding object, and the binding is performed by heating. A binding device characterized by loss of function.

Further, in the present invention, in the above binding device, the binding band includes a band portion, an insertion portion in which a hole for inserting the band binding component is formed at one end of the band portion, and the like. A bundling device comprising a bundling portion having a hole for inserting the inserting portion and a hole for inserting the band binding component at an end thereof.

Further, the present invention is the above binding device, wherein the binding band is at least partially formed of a shape memory material.

That is, according to the present invention, in a binding device for fixing an object to be bound, at least a part of the binding band is formed of a shape memory alloy, has a binding function in normal use, and binds it by heating. A binding band that can be easily released from binding by losing its function is obtained.

Further, in the above-mentioned binding device, the binding band for substantially binding the objects to be bound is held in the binding function by the band binding component formed of the shape memory alloy. Using the shape recovery function of, the shape changes due to temperature change and the holding function as a band binding part is lost, so the binding can be released and the binding band can be reused without cutting the binding band. .

Further, in the above binding device, a plurality of holes are formed in the binding band, and the binding portion is integrated with the binding band itself, and the binding band is wound around the object to be bound. The binding band is bound by aligning the hole formed in the binding band with the hole formed in the binding portion and inserting the band binding component.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 is a perspective view of the binding band according to the embodiment of the present invention. As shown in FIG. 2, the binding band 1 has a binding portion 12 integrated with itself, an insertion portion 11 is formed at one end (tip) of the band portion 10, and a binding portion 12 is formed at the other end. ing. The insertion portion 11 and the binding portion 12 are respectively formed with a plurality of holes 11a and holes 12a for inserting the band binding components.
Then, the binding portion 12 is provided with a hole 12b for inserting the insertion portion 11.

FIG. 3 is a diagram showing a shape of the band binding component in the embodiment of the present invention during binding and after heating. As shown in FIG. 3, the band binding component is formed of a shape memory alloy, and when it is straight and is inserted into the hole of the binding band and then twisted, it has the same shape. When the binding is released, the shape is restored to the original linear shape by heating, and the binding is easily released by pulling it out.

FIG. 1 is a perspective view showing a state in which a binding band and a band binding component according to an embodiment of the present invention bind an object to be bound. As shown in FIG. 1, the binding band 1 is wound around the binding object 3 and then the insertion portion 11 is inserted into the hole 12
After being inserted into b and tightened, the hole 11a is aligned with the hole 12a, the band binding component 2 is inserted and then twisted, so that the binding band 1 is bound.

At room temperature, the binding band 1 has a binding function and loses its binding function when the temperature reaches or exceeds the shape recovery temperature of the band binding component 2 formed of a shape memory alloy.

In this way, the binding band that loses the binding function by heating can release the binding of many wirings, and the electric appliances and the like can be more easily disassembled. Further, since the binding can be released without cutting the binding band, the binding band can be reused.

Here, the binding band is preferably made of resin like the binding band generally used conventionally, but may be made of other material such as metal.

As the shape memory alloy used in the embodiment of the present invention, first, an alloy having a composition of Ni 49.5 at% and the balance Ti was hot worked and cold worked to produce a φ1 wire rod. Next, as shape memory processing, 425 ℃ in a linear state
It was formed by processing for 30 minutes. The shape recovery temperature at this time was about 75 ° C.

Further, in the present embodiment, Ni49.5a is used.
Although a material composed of an alloy with a composition of t% and the balance of Ti is used, 50 to 52 at% TiNi alloy or this TiN is used.
A part of Ni or Ti of the i alloy is replaced with a third element, for example,
It may be substituted with Fe, Cr, V, Mn, Zr, Co, Cu, etc., and Fe-based and Cu-based shape memory alloys may also be used.

[0023]

As described above, by applying the binding device of the present invention to electronic devices and home electric appliances, disassembling and disassembling can be performed quickly and easily and efficiently at the time of disposal or recycling thereof. It can be applied to disassemble and dismantle a large number of home appliances.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a binding band and a band binding component according to an embodiment of the present invention bind an object to be bound.

FIG. 2 is a perspective view of the binding band according to the embodiment of the present invention.

FIG. 3 is a diagram showing a shape of the band tying component during bundling and after heating according to the embodiment of the present invention.

[Explanation of symbols]

1 unity band 2 band binding parts 3 Bundled objects 10 band section 11 Insert 11a hole 12 unity part 12a hole 12b hole

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C22K 1:00 C22K 1:00

Claims (3)

[Claims] 1. A binding device for binding and fixing an object to be bound, comprising a binding band wrapped around the object to be bound and substantially binding the object to be bound, and the binding band. Attached to the binding band,
A banding device comprising a band binding component to be released, having a binding function for the objects to be bound when used at room temperature, and losing the binding function by heating. 2. The binding device according to claim 1, wherein the binding band includes a band portion, an insertion portion having a hole formed at one end of the band portion for inserting the band binding component, and the other end. A bundling device comprising: a bundling part in which a hole for inserting the insertion part and a hole for inserting the band bundling component are formed. 3. The binding device according to claim 1, wherein at least a part of the binding band is formed of a shape memory material.