JP2002171649A - Wire binding apparatus of distributing board - Google Patents

Wire binding apparatus of distributing board

Info

Publication number
JP2002171649A
JP2002171649A JP2000365798A JP2000365798A JP2002171649A JP 2002171649 A JP2002171649 A JP 2002171649A JP 2000365798 A JP2000365798 A JP 2000365798A JP 2000365798 A JP2000365798 A JP 2000365798A JP 2002171649 A JP2002171649 A JP 2002171649A
Authority
JP
Japan
Prior art keywords
binding band
binding
wiring
band
distribution board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000365798A
Other languages
Japanese (ja)
Inventor
Koji Mizuno
浩司 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawamura Electric Inc
Original Assignee
Kawamura Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Electric Inc filed Critical Kawamura Electric Inc
Priority to JP2000365798A priority Critical patent/JP2002171649A/en
Publication of JP2002171649A publication Critical patent/JP2002171649A/en
Pending legal-status Critical Current

Links

Landscapes

  • Distribution Board (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Package Frames And Binding Bands (AREA)
  • Clamps And Clips (AREA)
  • Patch Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To simplify work for binding wires and prevent a loss of binding bands. SOLUTION: A wire binding apparatus 2 comprises a resinous binding band 4 and a resinous mounting tool 5 for mounting the binding band inside a case 1 of a distributing board. A clip 7 for clipping the binding band 4 is integrally formed on a base 6 of the mounting tool 5. The clip 7 is provided with a hooking piece 8 for hooking the binding band 4 and a pair of left and right holding pieces 9 for pressing the binding band 4 to the hooking piece 8 and holding the curved binding band 4. Slits 11, in which the binding band is inserted or detached in the direction of width, are formed between the hooking piece 8 and the holding pieces 9.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、分電盤内で配線を
結束する装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for binding wiring in a distribution board.

【0002】[0002]

【従来の技術】従来、図8に示すように、分電盤内に取
付具51を設け、取付具51の孔52に結束バンドを5
3を通し、結束バンド53の上に配線54を載せて結束
する装置が知られている。また、図9に示すように、分
電盤内にL字形の掛止具55を設け、掛止具55に結束
バンド53を引っ掛けて、配線54を結束する装置も知
られている。
2. Description of the Related Art Conventionally, as shown in FIG. 8, a fitting 51 is provided in a distribution board, and a binding band 5 is inserted into a hole 52 of the fitting 51.
A device is known in which a wire 54 is placed on a binding band 53 through a wire 3 and bound. Further, as shown in FIG. 9, there is also known an apparatus in which an L-shaped hooking tool 55 is provided in a distribution board, a binding band 53 is hooked on the hooking tool 55, and the wiring 54 is bound.

【0003】[0003]

【発明が解決しようとする課題】ところが、図8に示す
従来装置によると、結束バンド53を取付具51に位置
決めできないため、結束時にバンド53の結着部56が
配線54の下に隠れ、作業し難いという問題点があっ
た。図9に示す従来装置の場合は、結束バンド53を掛
止具55に取り付けておくことができないため、バンド
53を製品と別に包装する必要があり、開梱時に結束バ
ンド53を他の包装材と一緒に誤って処分してしまうこ
とがあった。
However, according to the conventional apparatus shown in FIG. 8, since the binding band 53 cannot be positioned on the fixture 51, the binding portion 56 of the band 53 is hidden under the wiring 54 at the time of binding, so that the work is difficult. There was a problem that it was difficult to do. In the case of the conventional apparatus shown in FIG. 9, since the binding band 53 cannot be attached to the hook 55, it is necessary to package the band 53 separately from the product. Was accidentally disposed of along with.

【0004】そこで、本発明の課題は、配線結束作業を
簡略化できるとともに、結束バンドの紛失を防止できる
分電盤の配線結束装置を提供することにある。
It is an object of the present invention to provide a wiring bundling apparatus for a distribution board which can simplify a wiring bundling operation and prevent a binding band from being lost.

【0005】[0005]

【課題を解決するための手段】上記の課題を解決するた
めに、請求項1の発明による配線結束装置は、配線を結
束する結束バンドと、結束バンドを分電盤ケースの内側
に取り付ける取付具とからなり、取付具に結束バンドを
挟み着ける挟着部を設けたことを特徴とする。
According to a first aspect of the present invention, there is provided a wiring bundling apparatus, comprising: a bundling band for bundling wiring; and a fixture for mounting the bundling band inside a distribution board case. Wherein the attachment has a clamping portion for clamping the binding band.

【0006】請求項2の発明による配線結束装置は、配
線をより簡単に結束できるように、挟着部が結束バンド
を引っ掛ける掛止片と、結束バンドを掛止片に押し付け
て湾曲状に保持する保持片とを含むことを特徴とする。
According to a second aspect of the present invention, in a wiring bundling apparatus, a clipping portion is provided to hold a binding band, and the binding band is pressed and held in a curved shape so as to bind the wiring more easily. And a holding piece to be formed.

【0007】請求項3の発明による配線結束装置は、結
束バンドを取付具に簡単に装着できるように、掛止片と
保持片との間に結束バンドを幅方向に挿脱する溝を形成
したことを特徴とする。
In the wiring bundling apparatus according to the third aspect of the present invention, a groove for inserting and removing the binding band in the width direction is formed between the hooking piece and the holding piece so that the binding band can be easily attached to the fixture. It is characterized by the following.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。図1〜図3に示すように、この実
施形態のホーム分電盤においては、分電盤ケース1の一
端部内側に2基の配線結束装置2が配設されている。各
結束装置2は、配線3を結束する樹脂製の結束バンド4
と、結束バンド4を分電盤ケース1の内側に取り付ける
樹脂製の取付具5とから構成されている。取付具5のベ
ース6には、結束バンド4を挟み着ける挟着部7が一体
成形されている。
Embodiments of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 to 3, in the home distribution board of this embodiment, two wiring bundling devices 2 are arranged inside one end of a distribution board case 1. Each binding device 2 includes a resin binding band 4 for binding the wiring 3.
And a resin fixture 5 for attaching the binding band 4 to the inside of the distribution board case 1. A holding portion 7 for holding the binding band 4 is integrally formed with the base 6 of the attachment 5.

【0009】図3〜図5に示すように、挟着部7には、
結束バンド4を引っ掛ける掛止片8と、結束バンド4を
掛止片8に押し付けて湾曲状に保持する左右一対の保持
片9とが設けられている。掛止片8は上端がベース6か
ら切り離された側面コ字形に形成され、外面に2条の補
強リブ10が突設されている。そして、掛止片8と保持
片9との間に、結束バンド4を幅方向に挿脱する溝11
が形成されている。
As shown in FIG. 3 to FIG.
A hook 8 for hooking the binding band 4 and a pair of left and right holding pieces 9 for pressing the strap 4 against the hook 8 and holding it in a curved shape are provided. The hooking piece 8 is formed in a U-shape in a side face with an upper end separated from the base 6, and has two reinforcing ribs 10 protruding from an outer surface thereof. A groove 11 for inserting and removing the binding band 4 in the width direction is provided between the hooking piece 8 and the holding piece 9.
Are formed.

【0010】上記構成の配線結束装置2においては、掛
止片8の上端を開き、結束バンド4を幅方向から溝11
に挿入して挟着部7に挟み着けておく。こうすれば、結
束バンド4を取付具5によって分電盤ケース1に実装で
き、製品と一体化して出荷することが可能になる。従っ
て、従来とは異なり、開梱時に結束バンド4を包装材と
一緒に処分してしまうおそれがなく、配線結束作業を速
やかに開始することができる。
In the wiring bundling apparatus 2 having the above structure, the upper end of the hook 8 is opened, and the binding band 4 is
Into the holding section 7. By doing so, the binding band 4 can be mounted on the distribution board case 1 by the fixture 5, and can be shipped integrally with the product. Accordingly, unlike the related art, there is no possibility that the binding band 4 is disposed together with the packaging material at the time of unpacking, and the wiring binding operation can be started immediately.

【0011】結束作業に際しては、結束バンド4の上に
配線3を載せ、結束バンド4を結着部12で結着して配
線3を結束する。この場合、結束バンド4が挟着部7に
位置決めされ、かつ掛止片8と保持片9とにより湾曲状
に保持されているので、結着部12が配線3の下に隠れ
るおそれがなく、結着部12及びバンド先端部を容易に
摘み上げることもできて、結束作業を簡単かつ迅速に行
うことができる。
At the time of the binding operation, the wiring 3 is placed on the binding band 4, and the binding band 4 is bound by the binding portion 12 to bind the wiring 3. In this case, since the binding band 4 is positioned at the holding portion 7 and is held in a curved shape by the hooking piece 8 and the holding piece 9, there is no possibility that the binding portion 12 is hidden under the wiring 3. The binding portion 12 and the tip of the band can be easily picked up, so that the binding operation can be performed easily and quickly.

【0012】なお、本発明は上記実施形態に限定される
ものではなく、以下に例示するように、本発明の趣旨を
逸脱しない範囲で各部の形状並びに構成を適宜に変更し
て実施することも可能である。 (1) 図6に示すように、掛止片8を上端が開いた側
面L字形に形成すること。 (2) 図7に示すように、結束バンド4を一回転させ
て取付具5に取り付け、結束バンド4に曲り癖をつけ
て、結束作業をしやすくしておくこと。 (3) 図1及び図7とは異なり、結束バンド4を開い
た状態(図5に鎖線で示す状態)で取付具5に取り付け
ておくこと。 (4) 結着部12がない結束バンドを用い、このバン
ドを別部品で結着すること。 (5) 本発明の配線結束装置をホーム分電盤以外の各
種分電盤に適用すること。
The present invention is not limited to the above embodiment, but may be carried out by appropriately changing the shape and configuration of each part without departing from the spirit of the present invention as exemplified below. It is possible. (1) As shown in FIG. 6, the engaging piece 8 is formed in an L-shaped side surface with an open upper end. (2) As shown in FIG. 7, the binding band 4 is attached to the fixture 5 by making one turn, and the binding band 4 is bent so as to facilitate the binding operation. (3) Unlike FIGS. 1 and 7, the binding band 4 must be attached to the fixture 5 in an open state (indicated by a chain line in FIG. 5). (4) Use a binding band having no binding portion 12 and bind the band with another component. (5) The wiring bundling device of the present invention is applied to various distribution boards other than the home distribution board.

【0013】[0013]

【発明の効果】以上詳述したように、請求項1の発明に
よれば、取付具に結束バンドを挟み着ける挟着部を設け
たので、結束バンドを取付具に位置決めして、配線結束
作業を簡略化できるとともに、結束バンドを分電盤ケー
スに実装して、結束バンドの紛失を防止できるという優
れた効果を奏する。
As described in detail above, according to the first aspect of the present invention, since the attaching portion is provided with the holding portion for holding the binding band, the binding band is positioned on the attaching device, and the wiring bundling operation is performed. And the binding band is mounted on the distribution board case, so that the binding band can be prevented from being lost.

【0014】請求項2の発明によれば、挟着部に掛止片
と保持片とを設けたので、結束バンドを湾曲状に保持し
て、配線をより簡単に結束できる効果がある。
According to the second aspect of the present invention, since the hooking piece and the holding piece are provided in the holding portion, the binding band is held in a curved shape, so that the wiring can be more easily bound.

【0015】請求項3の発明によれば、掛止片と保持片
との間に溝を形成したので、結束バンドを幅方向から取
付具に簡単に装着できる効果がある。
According to the third aspect of the present invention, since the groove is formed between the hooking piece and the holding piece, there is an effect that the binding band can be easily attached to the fixture from the width direction.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態を示すホーム分電盤の部分
平面図である。
FIG. 1 is a partial plan view of a home distribution board showing one embodiment of the present invention.

【図2】図1の配線結束装置の分解図である。FIG. 2 is an exploded view of the wiring binding device of FIG.

【図3】図1の配線結束装置の組付図である。FIG. 3 is an assembly diagram of the wiring binding device of FIG. 1;

【図4】図3のA‐A線断面図である。FIG. 4 is a sectional view taken along line AA of FIG. 3;

【図5】図4のB‐B線断面図である。FIG. 5 is a sectional view taken along line BB of FIG. 4;

【図6】配線結束装置の変更例を示す断面図である。FIG. 6 is a sectional view showing a modified example of the wiring binding device.

【図7】結束バンドの別の取付形態を示す分電盤の部分
平面図である。
FIG. 7 is a partial plan view of the distribution board showing another attachment form of the binding band.

【図8】従来例を示す配線結束装置の分解図である。FIG. 8 is an exploded view of a wiring binding device showing a conventional example.

【図9】別の従来例を示す配線結束装置の断面図であ
る。
FIG. 9 is a cross-sectional view of a wiring binding device showing another conventional example.

【符号の説明】[Explanation of symbols]

1・・分電盤ケース、2・・配線結束装置、3・・配
線、4・・結束バンド、5・・取付具、6・・ベース、
7・・挟着部、8・・掛止片、9・・保持片、10・・
補強リブ、11・・溝、12・・結着部。
1. distribution board case, 2. wiring binding device, 3. wiring, 4. binding band, 5. mounting fixture, 6. base,
7 ··· Nipping part, 8 ··· Hook piece, 9 ··· Holding piece, 10 ···
Reinforcement ribs, 11 grooves, 12 binding parts.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 配線を結束する結束バンドと、結束バン
ドを分電盤ケースの内側に取り付ける取付具とからな
り、取付具に結束バンドを挟み着ける挟着部を設けてな
る分電盤の配線結束装置。
A wiring for a distribution board, comprising: a binding band for binding a wiring; and a fixture for attaching the binding band to the inside of a distribution board case, wherein the fitting has a clamping portion for clamping the binding band. Binding unit.
【請求項2】 挟着部が結束バンドを引っ掛ける掛止片
と、結束バンドを掛止片に押し付けて湾曲状に保持する
保持片とを含む請求項1記載の分電盤の配線結束装置。
2. The wiring bundling device for a distribution board according to claim 1, wherein the holding portion includes a hook that hooks the binding band, and a holding piece that presses the binding band against the hook and holds the binding band in a curved shape.
【請求項3】 掛止片と保持片との間に、結束バンドを
幅方向に挿脱する溝を形成した請求項2記載の分電盤の
配線結束装置。
3. The wiring bundling device for a distribution board according to claim 2, wherein a groove for inserting and removing the binding band in the width direction is formed between the hooking piece and the holding piece.
JP2000365798A 2000-11-30 2000-11-30 Wire binding apparatus of distributing board Pending JP2002171649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000365798A JP2002171649A (en) 2000-11-30 2000-11-30 Wire binding apparatus of distributing board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000365798A JP2002171649A (en) 2000-11-30 2000-11-30 Wire binding apparatus of distributing board

Publications (1)

Publication Number Publication Date
JP2002171649A true JP2002171649A (en) 2002-06-14

Family

ID=18836508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000365798A Pending JP2002171649A (en) 2000-11-30 2000-11-30 Wire binding apparatus of distributing board

Country Status (1)

Country Link
JP (1) JP2002171649A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011024318A (en) * 2009-07-15 2011-02-03 Hitachi Ltd Control board
JP2013141847A (en) * 2012-01-10 2013-07-22 Yazaki Corp Binding band attaching structure, and binding band attaching method
JP2013207144A (en) * 2012-03-29 2013-10-07 Nohmi Bosai Ltd Electronic apparatus and electronic apparatus housing applied to the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04193179A (en) * 1990-11-26 1992-07-13 Nissho Corp Clamp
JPH07264732A (en) * 1994-03-18 1995-10-13 Kawamura Denki Sangyo Kk Power distribution panel
JPH0965520A (en) * 1995-08-25 1997-03-07 Matsushita Electric Works Ltd Distribution board
JP2000201407A (en) * 1998-12-31 2000-07-18 Tempearl Ind Co Ltd Ground relay terminal for panelboard

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04193179A (en) * 1990-11-26 1992-07-13 Nissho Corp Clamp
JPH07264732A (en) * 1994-03-18 1995-10-13 Kawamura Denki Sangyo Kk Power distribution panel
JPH0965520A (en) * 1995-08-25 1997-03-07 Matsushita Electric Works Ltd Distribution board
JP2000201407A (en) * 1998-12-31 2000-07-18 Tempearl Ind Co Ltd Ground relay terminal for panelboard

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011024318A (en) * 2009-07-15 2011-02-03 Hitachi Ltd Control board
JP2013141847A (en) * 2012-01-10 2013-07-22 Yazaki Corp Binding band attaching structure, and binding band attaching method
JP2013207144A (en) * 2012-03-29 2013-10-07 Nohmi Bosai Ltd Electronic apparatus and electronic apparatus housing applied to the same

Similar Documents

Publication Publication Date Title
US5601261A (en) Band clip
JP2980587B1 (en) Fixture
US5004194A (en) Pipe/wire gripping and fixing clamp
JP2818138B2 (en) Lock legs and belt clamps for mounting components
JP2002171649A (en) Wire binding apparatus of distributing board
JPH0629524Y2 (en) Unity band
JP2008114925A (en) Needle package
JPH0735269A (en) Binding band
JP2733431B2 (en) Tying tool
KR102192229B1 (en) Wire harness fixing module
JP2000115963A (en) Retainer for wire bundle
JP2006292117A (en) Belt clamp
JP2001177958A (en) Long object support device for mounting shape steel
KR100219085B1 (en) Wiring strap
JP3066504U (en) Electrical wiring processing structure in pachinko machines
JP2000333331A (en) Support for cable-lead wire
KR200152693Y1 (en) A harness fixture for a vehicle
CN201051635Y (en) Wiring harness fixing part with binding belt
JP2006280036A (en) Band attaching type clamp
JP2001128342A (en) Holder for a bundle of line material
JPH0322561Y2 (en)
KR200235858Y1 (en) packing band
KR200228335Y1 (en) wire holder
JP2000308240A (en) Retaining tool of bundle of wire
KR20060053802A (en) Strap clip for wireharness

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080507

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080707

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080729