JP2003231131A - Apparatus and method for evaluating adhesion degree related to adherend on mold surface - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily detect the adhesion degree of the adherend on the mold surface of a resin mold to evaluate the same. <P>SOLUTION: This evaluation apparatus is equipped with a lower sensor 13 and an upper sensor 14 both of which are respectively provided to the upper and rear surfaces of a sensor unit 10, an arithmetic part 20 for calculating the measured values showing the adhesion degrees of the contaminants on the mold surfaces of lower and upper molds 1 and 2 on the basis of the detection signals received from the lower and upper sensors 13 and 14, and a comparing part 21 for comparing the measured values received from the arithmetic part 20 with a predetermined reference value and supplying a predetermined warning signal when the measured values are less than the reference value. By this constitution, if the intensities of the reflected lights 16 and 18 to the irradiation lights 15 and 17 for irradiating the mold surfaces are a reference value or less, the warning signal is supplied. Therefore, the adhesion degree of the contaminant can quantitatively be evaluated and resin molding work can be made efficient and automated by cleaning based on the warning signal and a yield can be enhanced. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an evaluation device and an evaluation method for evaluating the degree of adhesion of an adhered matter adhered to the surface of a mold used for resin molding, that is, a mold surface.

[0002]

2. Description of the Related Art Conventionally, in order to evaluate the degree of adhered matter such as dirt adhered to the mold surface of a mold used for resin molding, the resin molding work is stopped and the operator This was done by visually observing the surface.

[0003]

However, according to the above-mentioned conventional evaluation of the degree of adhesion, there is a possibility that the operator may not be able to judge the degree of adhesion, for example, the degree of dirt, accurately. For this reason, the mold surface may be cleaned even with slight dirt that does not adversely affect the molded product, and the efficiency of the resin molding operation may be reduced. On the contrary, even if stains that adversely affect the molded product adhere, the extent of stains cannot be accurately determined. Therefore, the resin molding operation may be continued without cleaning, and a defective product may be produced, which may reduce the yield. Further, since the resin molding work is stopped and the dirt on the mold surface is evaluated, the efficiency of the resin molding work is reduced and the automation of the work is hindered.

The present invention has been made in order to solve the above-mentioned problems, and by quantitatively evaluating the degree of adhesion with respect to the adhered matter on the mold surface, the degree of adhesion can be accurately judged and the resin molding can be performed. An object of the present invention is to provide an evaluation device and an evaluation method for the degree of adhesion of the adhered matter on the mold surface, which is aimed at improving the efficiency and automation of the work and improving the yield.

[0005]

In order to solve the above-mentioned technical problems, an apparatus for evaluating the degree of adhesion of deposits on a mold surface according to the present invention is provided with a mold surface of a mold used for resin molding. A device for evaluating the degree of adhesion of a kimono, which comprises detecting means for detecting optical data on the mold surface, calculating means for calculating a measured value indicating the degree of adhesion based on the optical data, and the measured value and a predetermined value. When it is shown that the measured value is equal to or exceeds the reference value for the degree of adhesion by comparing with the reference value, a warning signal indicating that the degree of adhesion has reached a level that causes failure And a comparison means for generating.

According to this, the degree of adhesion of the deposit on the mold surface is quantitatively calculated as a measured value based on the optical data detected on the mold surface, and whether the measured value is equal to the reference value. Or, if it exceeds, a warning signal is generated indicating that the degree of adhesion has reached a level causing a problem. Thereby, the degree of adhesion is accurately determined based on the measured value. Further, since it is possible to execute a measure for avoiding a defect based on the warning signal, it is possible to improve the efficiency and automation of the resin molding work and improve the yield.

Further, the apparatus for evaluating the degree of adherence of the deposit on the mold surface according to the present invention is the above-mentioned evaluation apparatus, wherein the detecting means irradiates the irradiation light and detects the intensity of the reflected light with respect to the irradiation light. The calculation means is characterized by calculating a value based on the intensity of the reflected light as a measurement value.

According to this, since the intensity of the reflected light is detected, not only the adhered matter on the entire mold surface but also the place where the adhered matter is likely to adhere or the place where the adhered matter is easily removed are pinpointed. It becomes possible to evaluate the degree of.

In addition, in the evaluation apparatus for the degree of adhesion of deposits on the mold surface according to the present invention, in the above-described evaluation apparatus, the detection means captures an image of a certain area on the mold surface, and the calculation means determines the image density. It is characterized in that an area consisting of a portion exceeding a certain level is calculated as a measured value, and the comparing means compares the area with a reference value.

According to this method, an image of a fixed area on the mold surface is taken, and the degree of adhesion of the adhered matter is evaluated based on the area of the portion where the density exceeds a fixed level. The degree of adhesion can be evaluated in a short time.

In order to solve the above-mentioned technical problems, the method for evaluating the degree of adhesion of deposits on the mold surface according to the present invention is a method for assessing the deposits on the mold surface of a mold used for resin molding. A method of evaluating the degree, which comprises a step of detecting optical data on the mold surface, a step of calculating a measured value indicating the degree of adhesion based on the optical data, and a comparison between the measured value and a predetermined reference value. If it is shown that the measured value of the degree of adhesion is equal to or exceeds the reference value, the step of generating a warning signal indicating that the degree of adhesion has reached a level causing a defect. It is characterized by having.

According to this, the degree of adhesion of the deposit on the mold surface is quantitatively calculated as a measured value based on the optical data detected on the mold surface, and whether the measured value is equal to the reference value. Or, if it exceeds, a warning signal is generated that indicates that the degree of adhesion has reached a level that causes a problem. As a result, the degree of adhesion can be accurately determined based on the measured value. Further, since it is possible to take a measure to avoid the trouble based on the warning signal, it is possible to improve the efficiency and automation of the resin molding work and improve the yield.

[0013]

(First Embodiment) First Embodiment of the Present Invention
An evaluation apparatus and an evaluation method of the degree of adhesion regarding the adhered matter on the mold surface according to the embodiment will be described with reference to FIGS. 1 and 2. In this embodiment, as a mold used for resin molding, a mold used for a resin sealing device that seals an electronic component mounted on a lead frame with a resin will be described. In addition, stains attached to the mold surface will be described as an example of the deposits on the mold surface. FIG. 1 is a partial cross-sectional view showing a state in which an optical sensor included in the device for evaluating the degree of adherence of an adherent according to the present embodiment emits irradiation light and detects reflected light with respect to the irradiation light. Figure 2
It is a flowchart which shows the evaluation method of the adhesion degree regarding the adhered material which concerns on this embodiment.

In FIG. 1, a lower mold 1 and an upper mold 2 provided so as to face the lower mold 1 together constitute a resin sealing mold. The lower mold 1 is provided with a pot 3 having a cylindrical space. The pot 3 is provided with a substantially cylindrical plunger 4 which can be raised and lowered. Further, the lower mold 1 is provided with a lower cavity 5 which is a space into which the molten resin is injected, and a recess 6 in which a lead frame is disposed is provided around the lower cavity 5. Further, in the upper mold 2, a cull 7 for storing the molten resin is provided at a position substantially facing the pot 3. Furthermore, a resin flow path 8 through which the molten resin flows and an upper cavity 9 which is a space into which the molten resin is injected are provided so as to communicate with the cull 7 in sequence.

A sensor unit 10 is provided between the lower mold 1 and the upper mold 2 so as to be movable back and forth while being fixed to an arm 11. The sensor unit 10 includes a holder 12 and
Holder 1 with a predetermined distance from the surface (mold surface) of lower mold 1
2, a lower sensor 13 attached to the lower side of the upper die 2 and an upper sensor 14 attached to the upper side of the holder 12 at a predetermined distance from the die surface of the upper die 2. The lower sensor 13 includes a light emitting unit that emits the irradiation light 15 and the irradiation light 1
Reflected light 1 obtained by reflecting light 5 on the mold surface of the lower cavity 5
6 is an optical sensor having a light receiving portion for receiving light. Similarly, the upper sensor 14 is an optical sensor having a light emitting portion that emits the irradiation light 17 and a light receiving portion that receives the reflected light 18 obtained by reflecting the irradiation light 17 on the mold surface of the upper cavity 9. . The lower sensor 13 and the upper sensor 14 convert the intensities of the reflected lights 16 and 18, which are optical data detected respectively, into predetermined detection signals (for example, voltage), and these detection signals are transmitted through the signal line 19. It is supplied to the calculation unit 20 via the above. Note that these lower sensor 13 and upper sensor 14
Is an optical sensor that uses infrared light, laser, and the like in addition to visible light.

The arithmetic unit 20 calculates the detection signals from the lower sensor 13 and the upper sensor 14, respectively.
It is, for example, an A-D converter that individually calculates a measured value indicating the degree of adhesion of the adhered matter on the mold surfaces of the lower mold 1 and the upper mold 2. The comparison unit 21 compares the measured value indicating the degree of adhesion of the lower mold 1 and the upper mold 2 received from the calculation unit 20 with a predetermined reference value, and the measured value has a predetermined condition with respect to the reference value. Is a comparison circuit that supplies a predetermined warning signal via the signal line 22. Here, the calculation unit 20
Treats the value calculated based on the measured value as a new measured value as necessary, and the comparison unit 21 compares the new measured value with the reference value, and the new measured value is compared with the reference value. If a predetermined condition is satisfied, an operation of supplying a predetermined warning signal is performed.

The operation of the apparatus for evaluating the degree of adhesion according to this embodiment will be described with reference to FIGS. 1 and 2. First, as shown in FIG. 1, the sensor unit 10 is inserted between the lower mold 1 and the upper mold 2. Then, in step S1 of FIG. 2, the degree of adhered matter, that is, dirt, on the mold surface is detected. Specifically, the lower sensor 13 and the upper sensor 14 of FIG. 1 irradiate the mold surfaces of the lower cavity 5 and the upper cavity 9 with irradiation lights 15 and 17, respectively,
The received reflected lights 16 and 18 are used as optical data and their intensities are converted into electrical detection signals. Then, those detection signals are supplied to the arithmetic unit 20. Here, the greater the degree of contamination on the mold surface, the more reflected light 1 received.
The strength of 6, 18 becomes smaller. If the location on the mold surface where dirt is likely to adhere is known in advance, it is possible to detect the dirt in a pinpoint manner at that location.

Next, in step S2, the degree of dirt adhesion is quantified. Specifically, the calculation unit 20 in FIG. 1 individually determines the degree of adhesion of dirt on the mold surfaces of the lower mold 1 and the upper mold 2 based on the detection signals received from the lower sensor 13 and the upper sensor 14, respectively. Calculate and quantify. This digitization is performed, for example, by A-D converting the detection signal composed of a voltage.

Next, in step S3, a measured value V _M indicating the degree of adhesion of dirt on the mold surfaces of the lower mold 1 and the upper mold 2, respectively, based on the intensities of the reflected light 16 and the reflected light 18 received. To confirm. Here, the intensity of the reflected light is directly used as the measured value. Specifically, for example, the same point where dirt easily attaches is measured pinpoint multiple times, or the mold surface is measured at a plurality of points, and the obtained value is calculated by the calculation unit 20.
Average and make the average value the measured value V _M. Note that step S3 can be omitted if necessary, and in that case, the value quantified in step S2 is used as the measured value V _M.

Next, in step S4, the arithmetic unit 20
Thus, the measured value V _M determined in step S3 is compared with the reference value V _S that is stored in advance and includes the intensity of the reflected light. Here, the arithmetic unit 20 has the lower mold 1 and the upper mold 2 in advance.
In the mold surface of No. 3, the value of the intensity of the reflected light indicating the state of the most dirt adhered within the range where there is no problem in molding, in other words, the degree of adhesion immediately before the occurrence of molding failure is taken as the threshold value, that is, the reference value V _S. Remembered

In step S4, the comparison unit 21 compares the measured value V _M with the reference value V _S. If the measured value V _M > the reference value V _S for both the lower mold 1 and the upper mold 2, the intensity of the reflected light 16 and 18 is sufficiently large, so that the degree of dirt adhesion on the mold surface is smaller than the reference. To judge. Then, after the evaluation of the degree of adhesion is completed, the resin molding operation is continued if necessary.

On the other hand, in step S4, if at least one of the lower mold 1 and the upper mold 2 has a measured value V _M ≦ reference value V _S , that is, is the measured value V _M equal to the reference value V _S ? Or, if it is less than this, the intensity of the reflected lights 16 and 18 cannot be said to be sufficiently high. Therefore, it is determined that the degree of adhesion of dirt on the mold surface is equal to or higher than the reference, and the process proceeds to step S5. It should be noted that when judging the degree of adhesion of dirt, V _M ≧ V _S and V _M
<It can also be used V _S as a criterion.

Next, in step S5, the comparison unit 21
Generates a warning signal and outputs it to the signal line 22. A control unit (not shown) that has received the warning signal generates a signal that stops the resin molding operation and starts cleaning. As a result, a cleaner (not shown) starts its operation, and the evaluation device for the degree of adhesion waits until the cleaning is completed. And after cleaning,
Since it is necessary to evaluate the degree of dirt adhesion again, the process is returned to step S1 in FIG.

As described above, according to this embodiment, the measured value V _M , which is calculated based on the optical data of the mold surface and indicates the degree of adhesion of dirt, and the predetermined reference value V _S.
The degree of adhesion of dirt is evaluated by comparing with, and a warning signal is generated when cleaning is required.
Therefore, without causing variations among workers,
The degree of stain adhesion can be quantitatively evaluated. Further, by indicating the proper timing of cleaning by the warning signal, it is possible to improve the efficiency and automation of the resin molding work and improve the yield. Further, not only the measurement value based on the intensity of the reflected light detected at a plurality of points on the mold surface but also the measurement value detected at one point can be used. Therefore, not only the degree of dirt adhesion on the entire mold surface can be evaluated but also the degree of dirt adhesion can be evaluated in a pinpoint manner particularly at a place where dirt is likely to adhere.

A modified example of this embodiment will be described below. In the above description, the intensities of the reflected light calculated by the arithmetic unit 20 based on the detection signals generated by the lower sensor 13 and the upper sensor 14 are directly measured values V _M and reference values V _M , respectively.
_S. The present invention is not limited to this, and the following modifications are possible, and the same effects as those described above can be obtained by this modification.

Regarding the intensity of the reflected light calculated by the arithmetic unit 20, a ratio value R _M with a predetermined initial value being 100 is obtained,
The ratio value R _M and the predetermined ratio value R _TH are compared. This initial value is for the mold surface before resin molding,
The calculation unit 20 calculates each based on the detection signals generated by the lower sensor 13 and the upper sensor 14. Here, this initial value indicates the intensity of the reflected lights 16 and 18 when reflected by the plating of the mold itself, that is, the intensity of the reference reflected light. Therefore, the ratio value R _M calculated by the calculation unit 20 is the ratio value between the measured intensities of the reflected lights 16 and 18 and the intensity of the reference reflected light reflected by the plating of the mold itself, The intensity of the reference reflected light is 10
It is expressed as a percentage of 0.

In this modification, in step S4,
The calculated ratio value R _M and the predetermined ratio value R _TH are shown in FIG.
The comparison section 21 of FIG. Here, the value R _TH of the predetermined ratio is experimentally determined in advance. When the intensity of the reflected lights 16 and 18 measured by the experiment with the intensity of the reference reflected light being 100 is, for example, 95 or more, the quality of the molded product obtained by resin molding with the lower mold 1 and the upper mold 2 is improved. Suppose there was no particular problem. In this case, the value R _TH of the predetermined ratio is 95%.

In step S4, the comparison unit 21 compares the calculated ratio value R _M with the predetermined ratio value R _TH .
As a result, R _M ≧ R for both lower mold 1 and upper mold 2
_{If TH} , that is, if R _M ≧ 95%, the intensities of the reflected lights 16 and 18 are sufficiently large, and it is determined that the degree of adhesion of dirt on the mold surface is smaller than the reference. And
The evaluation of the degree of adhesion is completed. After that, the resin molding operation is continued if necessary. On the other hand, in step S4, if R _M <R _TH for at least one of the lower mold 1 and the upper mold 2, that is, if R _M <95%, it can be said that the intensities of the reflected lights 16 and 18 are sufficiently high. Therefore, it is judged that the degree of adhesion of dirt on the mold surface is above the standard. Then, the process proceeds to step S5 to perform the same operation as described above.

In the above description, the lower sensor 1
3 and the upper sensor 14 are adapted to detect the degree of adhesion of dirt on the mold surfaces of the lower mold 1 and the upper mold 2 at the same time. Not limited to this, the sensor unit 10 is provided with one optical sensor on either the lower side or the upper side, and the sensor unit 10 is inverted by the arm 11 to move the lower mold 1
Alternatively, the degree of adhesion of dirt on the mold surface of the upper mold 2 may be sequentially detected.

Further, in step S2, the degree of adhesion of dirt is quantified, but steps S2 to S3 are used.
It is also possible to evaluate the degree of stain attachment without omitting the calculation unit 20. In this case, step S
In 4, the comparison unit 21 directly compares the measured value composed of the detection signals respectively received from the lower sensor 13 and the upper sensor 14 with the reference value (for example, voltage) stored in advance. Then, if the measured value based on the reflected lights 16 and 18 is less than or equal to the reference value, it is determined that the degree of dirt adhesion on the mold surface is greater than or equal to the reference, and the process proceeds to step S5.

Further, the lower sensor 13 and the upper sensor 14
May be attached to a transfer mechanism such as a loader / unloader. In this case, since the degree of adhesion of dirt is evaluated for each resin molding as needed, the dirt on the mold can be monitored in-line. Therefore, even if dirt is suddenly attached to the mold, it is possible to prevent defective products by accurately detecting and evaluating the dirt and issuing a warning signal.

(Second Embodiment) A second embodiment of the present invention will be described with reference to FIGS. 3 and 4, which is an apparatus and method for evaluating the degree of adhesion of deposits on the mold surface. FIG. 3 is a partial cross-sectional view showing a state in which the CCD camera included in the device for evaluating the degree of adhesion regarding an adhered substance according to the present embodiment captures a certain area of a mold. Figure 4
FIG. 6 is a flow chart showing a method of evaluating the degree of adhesion regarding an adhered matter according to the present embodiment. In FIG. 3, the same components as those in the first embodiment are designated by the same reference numerals as those in FIG.

As shown in FIG. 3, in this embodiment, the first
CC in place of the sensor unit 10 in the embodiment of
The D camera 23 is attached to the arm 11. CC
The D camera 23 is capable of taking an image of both the lower cavity 5 and the upper cavity 9 by being inverted by the arm 11. In addition, the CCD camera 23
The height direction of the lower cavity 5 and the upper cavity 9 is
It is defined that the entire mold surfaces of and are in the field of view, and those mold surfaces are in focus. Further, two CCD cameras may be attached to the arm 11 so as to face upward and downward, respectively. In this case, both cavities can be photographed without reversing the arm 11.

The apparatus for evaluating the degree of adherence of an adhered matter according to this embodiment operates as follows. First, FIG.
As shown in, the CCD camera 23 is inserted between the lower mold 1 and the upper mold 2. Then, in step S1 of FIG. 4, the CCD camera 23 photographs the mold surface over the entire bottom surface of the lower cavity 5. Here, in the photographed image that is the optical data, the high-density portion is the portion where dirt is attached.

Next, in step S2, the degree of adhered matter, that is, the degree of adherence related to dirt is quantified on the basis of the imaged lower cavity 5 image. Specifically, FIG.
The calculation unit 20 binarizes the image of the lower cavity 5 on the basis of a predetermined constant level, that is, a threshold value of density. This threshold is experimentally obtained in advance.

Next, in step S3, the calculation unit 20
Of the binarized image, the area of the portion where the density exceeds the threshold value or the portion where the density is equal to or more than the threshold value, that is, the stain area is summed to obtain the measured value V _M.

Next, in step S4, the comparison unit 21 in FIG. 3 compares the measured value V _M with the reference value V _S stored in advance. The reference value V _S is a reference value related to the size of the dirt area. Then, the reference value V _S is determined in advance as follows and stored in the comparison unit 21 in FIG. That is, as the resin molding is repeated, the contaminated area gradually increases, and eventually the molded product becomes defective. Here, the total stain area immediately before is determined as the reference value V _S.

In step S4, the measured value V _M <
If the reference value V _S (or V _M ≦ V _S ), the stain area is sufficiently small, so it is determined that the degree of stain adhesion on the mold surface is smaller than the reference, and the evaluation of the extent of adhesion is completed. . After that, the resin molding operation is continued if necessary.
On the other hand, in step S4, the measured value V _M ≧ reference value V _S
If (or V _M > V _S ), it cannot be said that the stain area is sufficiently small, and therefore it is determined that the degree of stain adhesion on the mold surface is equal to or greater than the reference, and the process proceeds to step S5. Hereinafter, in step S5, the same processing as in the first embodiment is performed.

As described above, according to the present embodiment, based on the optical data of the surface of the mold, that is, the image, it is necessary to clean the degree of dirt adhesion as in the first embodiment. When it comes to, a warning signal is generated. Therefore, it is possible to quantitatively evaluate the degree of adhesion of dirt, improve the efficiency and automation of the resin molding work, and improve the yield. Further, the degree of adhesion of dirt is evaluated based on the image obtained by photographing the entire mold surface. Therefore, it is possible to evaluate the degree of adhesion of dirt on the entire mold surface in a short time.

In each of the above embodiments, the cleaning is started based on the warning signal. Not limited to this, the control unit may generate a warning signal for displaying an abnormality such as turning on a warning light. In this case,
The operator follows the procedure of stopping the resin molding operation and starting the cleaning.

Further, the received light or the photographed image was used as optical data to calculate a measured value representing the degree of dirt adhesion. Here, including the color component in the optical data,
The measured value can also be calculated. That is, in the first embodiment, the intensity of the reflected light based on the color component is measured, and the second
In the above embodiment, the density can be subjected to color shading processing as well as black and white gray processing. Therefore, depending on the type of the molten resin that causes the stain, by including the color component in the optical data, it is possible to more accurately evaluate the degree of adhesion.

As for the mold cleaning, cleaning with a brush or the like, cleaning with ultraviolet light,
Cleaning or the like by injecting a melamine resin into each cavity can be used.

Further, the sensor unit 10 is inserted between the lower mold 1 and the upper mold 2 every time resin molding is performed, or every time resin molding is performed a small number of times, to evaluate the degree of adhesion according to the present invention. You can go. In this case, the degree of adhesion of dirt on the mold surface is monitored almost in-line. Therefore, even if dirt is suddenly attached to the mold surface, it is possible to prevent defective products from occurring by accurately detecting and evaluating the dirt and issuing a warning signal. Further, the number of times of resin molding in which the degree of adhesion of stains exceeds the reference is experimentally obtained, and the degree of adhesion may be evaluated for each resin molding at a stage immediately before reaching the number of times. . In this case, the time required to evaluate the degree of adhesion can be reduced, and the efficiency of the entire resin sealing work can be improved.

Further, in each of the above-described embodiments, dirt is taken as an example of the deposit on the mold surface. The present invention is not limited to this, and the present invention can be applied to the case of evaluating the degree of adhesion of a substance formed on the mold surface in order to improve the mold releasability, that is, the release agent. In this case,
By repeating the resin molding, the release agent gradually peels off, and molding defects eventually occur. Therefore, for example, when the degree of adhesion of the release agent is evaluated by the intensity of the reflected light, the intensity of the reflected light increases due to the release of the release agent. Therefore, the criteria for determination are as follows. That is, the comparison unit 21 compares the measured value V _M with the predetermined reference value V _S, and the measured value V _M <for both the lower mold 1 and the upper mold 2.
With the reference value V _S , the intensities of the reflected lights 16 and 18 are sufficiently small. Therefore, the degree of adhesion of the release agent on the mold surface is larger than the standard, and the releasability is good, so it is judged that there is no problem. On the other hand, if the measured value V _M ≧ reference value V _S , the intensities of the reflected lights 16 and 18 cannot be said to be sufficiently small. Therefore, the degree of adhesion of the release agent on the mold surface is below the reference, and it is determined that the releasability has deteriorated, and the comparison unit 21 generates a warning signal.

Further, a case has been described in which the degree of adherence of dirt, which is an adhered matter, is evaluated for the mold used in the resin sealing device. The present invention is not limited to this, and the present invention can be applied to other resin molding dies including injection dies and the like.

Further, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately changed and selected and adopted within a range not departing from the gist of the present invention. It is a thing.

[0047]

According to the present invention, the degree of adhesion of the adhered matter on the mold surface is evaluated based on the optical data of the mold surface, and when the degree of adhesion reaches a level causing a problem, A warning signal is generated. Therefore, the degree of adhesion is quantitatively evaluated while suppressing variations. In addition, the warning signal indicates that the degree of adhesion has reached a level that causes defects, and based on this, it is possible to take measures to avoid defects, improving the efficiency and automation of resin molding work and improving yield. And become possible. Therefore,
INDUSTRIAL APPLICABILITY The present invention has an excellent practical effect of providing an evaluation apparatus and an evaluation method of the degree of adhesion regarding the adhered matter on the mold surface, which enables the efficiency and automation of the resin molding work and the improvement of the yield. It is a thing.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a state in which an optical sensor included in an adhesion degree evaluation device for an adherend according to a first embodiment of the present invention emits irradiation light and detects reflected light with respect to the irradiation light. Is.

FIG. 2 is a flow chart showing a method of evaluating the degree of adhesion regarding an adhered matter according to the first embodiment of the present invention.

FIG. 3 is a partial cross-sectional view showing a state in which a CCD camera included in the device for evaluating the degree of adhesion regarding an adhered substance according to the second embodiment of the present invention photographs a fixed area of a mold.

FIG. 4 is a flow chart showing a method of evaluating the degree of adherence of an adherent matter according to the second embodiment of the present invention.

[Explanation of symbols]

1 Lower mold 2 Upper mold 3 pots 4 Plunger 5 Lower cavity 6 recess 7 Cal 8 resin flow paths 9 Upper cavity 10 sensor unit 11 arms 12 holder 13 Lower sensor (detection means) 14 Upper sensor (detection means) 15,17 Irradiation light 16,18 reflected light 19,22 signal line 20 Calculation unit (calculation means) 21 comparison unit (comparison means) 23 CCD camera (detection means)

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F065 AA58 CC00 DD06 FF04 FF10                       GG04 JJ05 JJ26 MM14 MM24                       PP02 PP22 QQ03 QQ04 QQ08                       QQ24 QQ25 QQ31 RR08 SS09                 2G051 AA07 AB20 BA01 BB01 CA01                       CA04 CA07 CB01 EB01                 4F202 AH37 AM14 AM23 AP19 AQ01                       CA12 CA30 CB17 CK06 CK89                       CS02 CS04

Claims (4)

[Claims] 1. A device for evaluating the degree of adhesion of deposits on a mold surface of a mold used for resin molding, comprising: detection means for detecting optical data on the mold surface; Computation means for calculating a measured value representing the degree of adhesion based on the above, and comparing the measured value with a predetermined reference value, the measured value for the degree of adhesion is equal to or exceeds the reference value. If it is indicated, the degree of adherence with respect to the adhered matter on the mold surface is provided with a comparison means for generating a warning signal indicating that the degree of adherence has reached a degree causing a malfunction. Evaluation device. 2. The apparatus for evaluating the degree of adhesion of deposits on a mold surface according to claim 1, wherein the detecting means irradiates irradiation light to detect the intensity of reflected light with respect to the irradiation light, and the computing means A device for evaluating the degree of adhesion of an object on a mold surface, wherein a value based on the intensity of the reflected light is calculated as the measured value. 3. The apparatus for evaluating the degree of adherence of deposits on a mold surface according to claim 1, wherein the detecting means captures an image of a certain area on the mold surface, and the computing means has a constant density of the image. An apparatus for evaluating the degree of adhesion of deposits on a mold surface, wherein an area consisting of a portion exceeding a level is calculated as the measured value, and the comparing means compares the area with the reference value. 4. A method for evaluating the degree of adhesion of deposits on the mold surface of a mold used for resin molding, comprising the step of detecting optical data on the mold surface, and based on the optical data. A step of calculating a measured value representing the degree of adhesion, comparing the measured value with a predetermined reference value, and showing that the measured value is equal to or exceeds the reference value for the degree of adhesion. And a warning signal indicating that the degree of adhesion has reached a level that causes a problem, the method for evaluating the degree of adhesion of deposits on a mold surface.