JP2003222756A - Optical fiber fixing tool, its manufacturing method and optical semiconductor module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical fiber fixing tool having high reliability. <P>SOLUTION: The optical fiber fixing tool comprises a ferrule 1 having a through hole 1a in an axial direction, and an optical fiber 2 inserted and held through a buffer layer 3 in the through hole 1a. The ferrule 1 is formed of a shape memory material, and a thermoplastic elastomer-based resin or plastic deformable soft material is used as the buffer layer 3. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical fiber fixture used for applications such as optically connecting an optical fiber connector to a light receiving element or a light emitting element, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, information communication by optical signals using an optical fiber as a high-speed and large-capacity communication means has been widely performed in terms of the amount and speed of information transmission. These information transmissions are
It is expected to have a wide range of applications including maintenance as a communication network and data transfer between information devices.

In information transmission using these optical fibers, as shown in FIG. 7, an optical fiber fixture holding the optical fiber in a through hole of a ferrule, a laser diode (hereinafter referred to as LD) 29 as an optical semiconductor element, And lens 3
0 is placed in the package 28, one end of the optical fiber is optically connected to the LD 29, the other end of the optical fiber is provided outside the package 28, and the optical fiber cord 31 is connected to the tip of the pigtail type. Optical semiconductor modules are widely used.

When the above-mentioned optical fiber fixture is assembled in the package 28, the optical axis is aligned and then fixed to the package 28 by soldering, and internal components are oxidized by oxygen and humidity in the air during long-term operation. Nitrogen that does not react with metal is sealed in the internal space of the package 28 so as not to cause troubles such as communication failure, and chromium, chromium-gold alloy, and gold are sequentially placed in the opening portion so that oxygen and humidity do not flow. The applicant has proposed that a thin film is formed, a thick film of nickel and gold is formed on the thin film, and the thick film portion is joined by solder (see Japanese Patent Laid-Open No. 2001-42172).

As shown in FIG. 8, the optical fiber fixture has an optical fiber 22 inserted into a through hole 21a of a ferrule 21 and joined by a solder 23.

Further, a method has been proposed in which the ferrule 21 is formed of a shape memory alloy, and after inserting the optical fiber 22 into the through hole 21a, the ferrule 21 is heated to reduce the diameter of the through hole 21a to firmly fix the ferrule 21. (JP-A-61
No. 28910).

[0007]

However, although the conventional optical fiber fixture does not cause a problem when it is adopted on the ground, it is adopted in the repeater of the submarine cable due to the spread of the optical fiber. In the unlikely event that a failure occurs, the cost of pulling up and replacing it will be enormous, and thus more severe reliability will be required.

However, in the conventional optical fiber fixture, the optical fiber 22 is joined by the solder 23, and in order to improve the tensile strength, the silica glass forming the core portion of the optical fiber is metallized with a uniform thickness. Then, the thermal expansion coefficient of the quartz glass of the optical fiber 22 is 0.5 × 10 ⁻⁶ / ° C.
Since the thermal expansion coefficient of chromium used for metallization on the outer circumference of the optical fiber 22 is 45 × 10 ⁻⁶ / ° C. and the thermal expansion coefficient of nickel is 13 to 14 × 10 ⁻⁶ / ° C., which is large, stress occurs at the boundary portion. It has a defect that microcracks are easily generated on the surface of quartz glass.

When the ferrule 21 is formed of a shape memory alloy, when the ferrule 21 is heated to reduce the diameter of the through hole 21a and the optical fiber 22 is fixed, the ferrule 21 is moved to the core of the optical fiber 22. Since the stress is directly transmitted, the tensile strength is easily deteriorated and the optical fiber 22 is apt to be cracked.

Further, when the surface roughness of the through hole 21a of the ferrule 21 is rough, the optical fiber 22 and the ferrule 21
However, it has a defect that air gap cannot be maintained due to a gap at the interface.

The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to provide an optical fiber fixture having high reliability and an optical semiconductor module using the same.

[0012]

In view of the above conventional problems, the optical fiber fixture of the present invention has a ferrule having a through hole in the axial direction and a light inserted and held in the through hole via a buffer layer. An optical fiber fixture comprising a fiber, characterized in that the ferrule is formed of a shape memory material and a thermoplastic elastomer resin or a plastically deformable soft metal is used as a buffer layer.

The optical fiber fixture of the present invention is characterized by using a polyamide hot melt adhesive as the thermoplastic elastomer resin.

Furthermore, the optical fiber fixture of the present invention is characterized in that an In alloy is used as the plastically deformable soft metal.

Furthermore, the optical fiber fixture of the present invention is characterized in that the shape memory material has a coefficient of thermal expansion at -40 ° C to + 85 ° C of 10 ppm / ° C or less.

Furthermore, in the optical fiber fixture of the present invention, the diameter of the through hole of the ferrule is 0.20 to 0.30 mm below the transformation temperature of the shape memory material, and 0.13 to 0. It is characterized by being 15 mm.

Furthermore, according to the method for manufacturing an optical fiber fixture of the present invention, the outer peripheral surface of the optical fiber can be plastically deformed or plastically deformed under the environment below the transformation temperature of the shape memory material forming the ferrule. While applying a soft metal, insert it into the through hole of the ferrule,
Airtight sealing is achieved by increasing the temperature above the transformation temperature and reducing the diameter of the through holes.

Further, in the optical semiconductor module of the present invention, the optical semiconductor element and the optical fiber fixture according to any one of claims 1 to 5 are arranged in a package, and the optical semiconductor element and the fiber fixture are provided. It is characterized by being optically connected.

According to the optical fiber fixture of the present invention, since the ferrule is formed of a shape memory material and a thermoplastic elastomer resin or a plastically deformable soft metal is used as the buffer layer, the stress applied to the optical fiber is reduced. Can be made uniform and reduced, and the airtight characteristic of the gap between the ferrule and the optical fiber can be maintained and firmly fixed.

Further, according to the optical fiber fixture of the present invention, since the polyamide hot melt adhesive is used as the thermoplastic elastomer resin, a buffer layer is formed on the ferrule at a low temperature to prevent thermal stress such as thermal stress. The damage can be reduced, the airtightness of the gap between the ferrule and the optical fiber can be maintained, and the tensile strength can be increased.

Further, according to the optical fiber fixing device of the present invention, since the In alloy is used as the plastically deformable soft metal, it is possible to perform the above operation at the same low temperature as the buffer layer made of the polyamide hot melt adhesive. A buffer layer is formed on the ferrule to reduce thermal damage such as thermal stress, and the gap between the ferrule and the optical fiber can be sealed to enhance the tensile strength.

Furthermore, according to the optical fiber fixture of the present invention, since the shape memory material has a coefficient of thermal expansion of 10 ppm / ° C or less at -40 ° C to + 85 ° C, the ferrule expands and contracts due to the outside temperature. Thereby, mechanical deterioration of the buffer layer can be reduced.

Further, according to the optical fiber fixture of the present invention, the diameter of the through hole of the ferrule is 0.20 to 0.30 mm below the transformation temperature of the shape memory material, and 0.13 to above the transformation temperature. Since it is 0.15 mm, it is possible to easily insert the optical fiber having the buffer layer below the transformation temperature into the ferrule, and to provide a clearance that can hold the optical fiber when the ferrule is reduced in diameter above the transformation temperature, Can be firmly fixed.

Further, according to the method for manufacturing an optical fiber fixture of the present invention, a thermoplastic elastomer-based resin or plastic deformation is applied to the outer peripheral surface of the optical fiber in an environment below the transformation temperature of the shape memory material forming the ferrule. While applying a possible soft metal, insert it into the through hole of the ferrule,
Since the airtight sealing is achieved by raising the temperature above the transformation temperature and reducing the diameter of the through-hole, only by heating the ferrule above the transformation temperature, the airtight characteristic of the gap between the ferrule and the optical fiber is maintained and firmly. Can be fixed.

Further, according to the optical semiconductor module of the present invention, the optical semiconductor element and the optical fiber fixture are arranged in the package, and the optical semiconductor element and the fiber fixture are optically connected. When the optical fiber fixture is assembled to the optical semiconductor module, the outside air does not enter the package and the optical semiconductor element such as the LD is not deteriorated, and a highly reliable optical semiconductor module can be obtained.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view showing an embodiment of an optical fiber fixing tool of the present invention. A ferrule 1 having a through hole 1a in the axial direction, and a through hole 1a inserted and held through a buffer layer 3 are held. And an optical fiber 2.

The ferrule 1 of the present invention is, for example, Ti-N.
In addition to i-based alloys, Cu-Zn-Al-based, Cu-Au-Ni
It is made of a shape memory material such as Cu-based alloy such as Cu-based alloy, and by heating it above the transformation temperature, the diameter of the through hole 1a of the ferrule 1 can be reduced with a stable volume change rate and change rate, and the optical fiber 2 is firmly fixed. be able to.

Further, it is preferable to use a Ni—Ti type alloy as a shape memory material forming the ferrule 1 and it is excellent in corrosion resistance. Therefore, when it is used as an optical semiconductor module, it can be used as an optical semiconductor element even in long-term use. It is possible to prevent rust from adhering to the surface or the tip of the optical fiber and reduce the optical connection loss.

Furthermore, the shape memory effect material of the ferrule 1 has a coefficient of thermal expansion of 10 ppm at -40 ° C to + 85 ° C.
It is preferably equal to or lower than / ° C., and the mechanical deterioration of the buffer layer 3 due to the expansion and contraction of the ferrule 1 due to the outside air temperature is reduced, so that fixing with high airtightness can be performed.

The diameter of the through hole 1a of the ferrule 1 is 0.20 below the transformation temperature of the shape memory material.
0.30 mm, 0.13 to 0.15 mm above the transformation temperature
And the diameter of the optical fiber 2 is 0.125.
Since the thickness is mm, the thickness of the buffer layer 3 interposed between the through hole 1a and the optical fiber 2 is reduced to half or less by the diameter reduction of the ferrule 1 to firmly fix the optical fiber 2.
And it can be fixed airtightly.

Further, a buffer layer 3 is formed on the inner peripheral surface of the through hole 1a of the ferrule 1, and the buffer layer 3 is specified to be a thermoplastic elastomer resin or a plastically deformable soft metal. Since the through-hole 1a is plastically deformed as the diameter of the through-hole 1a is reduced, the stress applied to the optical fiber 2 can be uniformly reduced and the airtight characteristic of the gap between the ferrule 1 and the optical fiber 2 can be maintained. When the stress applied to the optical fiber 2 becomes non-uniform, the stress concentrates on a part of the optical fiber 2, so that the optical connection loss tends to increase.

It is preferable to use a polyamide hot melt adhesive as the thermoplastic elastomer resin. Since these resins have a low softening point, they are unlikely to cause thermal damage such as thermal stress on the optical fiber and have a high elastic modulus. The stress applied to the optical fiber 2 can be relieved, and the optical fiber 2 can be firmly fixed while maintaining hermeticity.

Specific examples of the polyamide resin include polyesteramide elastomer and the like, and a resin having a composition in which an appropriate amount of vinyl acetate, ethylene-vinyl acetate copolymer and the like are mixed can be used, and at 100 to 200 ° C. It is preferable that it is softened and adhered to the optical fiber 2.

As the soft metal capable of plastic deformation, Au, Ag, In and Cu are used, and it is preferable to use an In alloy such as In based solder such as AgIn solder.
This is because the In alloy has a low melting point, and thus the buffer layer 3 can be easily formed in close contact without damaging the optical fiber 2. This is because when the high temperature buffer layer 3 is formed on the optical fiber 2 at room temperature, cracks occur in the optical fiber 2 and the tensile strength is sharply reduced.

Next, a method of manufacturing the optical fiber fixture of the present invention will be described.

First, as shown in FIG. 2 (a), a UV resin or molybdenum-based masking 4 is applied to the tip of quartz glass forming the core of the optical fiber 2, and an elastomer such as hot melt is melted by heating. The buffer layer 3 made of an elastomer resin is formed on the peripheral surface of the optical fiber 2 by dipping it in the resin bath 5.

Next, the ferrule 1 is applied to, for example, Ti-Ni.
Through-hole 1a at room temperature due to the shape memory material of the base alloy
The ferrule 1 is formed so that the diameter is 0.13 mm (smaller than the outer diameter of the optical fiber 2 on which the buffer layer 3 is formed).

Next, it is cooled to about -20 ° C. by using a refrigerant such as dry ice or liquid nitrogen or a refrigerating device so that the temperature becomes lower than the transformation temperature of the Ti—Ni alloy.

To increase the diameter of the through hole 1a of the ferrule 1 in the cooled state to, for example, 0.2 mm,
As shown in FIG. 2B, the through hole 1a of the ferrule 1 is pressurized by the high-pressure liquid 6 in the direction of the arrow to mechanically expand the diameter of the through hole 1a. Means for mechanically increasing the diameter of the through hole 1a can be achieved by inserting and removing a tapered rod or the like having a diameter substantially the same as the diameter of the through hole 1a, but the surface of the through hole 1a is not worn. So be careful.

Next, as shown in FIG. 2C, the tip of the optical fiber 2 having the buffer layer 3 formed therein is inserted into the through hole 1a of the ferrule 1 obtained.

Next, the temperature of the ferrule 1 is raised by heating the ferrule 1 by a method of directly contacting a soldering iron or a burner or a method of heating with laser light or infrared rays. Here, it is preferable that the shape memory effect is generated at a temperature as low as possible, because the thermal stress applied to the optical fiber 2 is small.

Then, the ferrule 1 automatically returns to the original diameter at the time of molding, and the inserted optical fiber 2 is shown in FIG. 2 (d).
As described above, the interference fit occurs, and the optical fiber 2 is firmly fixed.

The shape memory material forming the ferrule 1 had a reversible heat recovery function in which the deformation was restored when heated to the transformation temperature or higher and deformed and then cooled to a temperature lower than the transformation temperature. Similar effects can be obtained even with a shape memory material or a shape memory material having an irreversible heat recovery function that does not return to the original state after cooling.

However, when a shape memory material having a reversible heat recovery function is used, the optical fiber fixture cannot be used in an environment below the transformation temperature, so caution is required.

The optical fiber 2 used here can be used regardless of single mode (SM) or multimode (MM),
In addition, PMF (POLARIZATION MAINT
An optical fiber such as ENANCE FIBER) that maintains the polarization polarity can be used without any problem in polarization as long as the stress applied to the optical fiber is small as in the present invention.

Next, various examples of the tip shape of the optical fiber 2 will be described with reference to FIG.

3 (a) and 3 (b) are spherical shapes having diameters equal to or larger than the optical fiber diameter, and (c) to (f).
Is a flat surface or an inclined surface at a right angle to the outer circumference of the optical fiber or an oblique spherical shape with an R shape attached thereto, and (g) is a wedge shape.

By having such various shapes of the tip surface, it is possible to have a lens action and an antireflection action,
It can be used according to the intended use.

When the optical semiconductor module 7 is constructed using the optical fiber fixture obtained as described above, the optical fiber fixture is used as a fiber stub as shown in FIG. The optical fiber 2 is provided with an LD 9 which is an optical semiconductor element and a lens 10, and the end face of the optical fiber 2 and the LD 9 are optically connected.
The optical fiber cord 11 can be inserted into the other end of the optical fiber and brought into contact with the end face of the optical fiber 2 to exchange optical signals.

The optical fiber of the present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the gist of the present invention, and the effects of the present invention can be obtained. You can

[0052]

EXAMPLES Next, examples of the present invention will be described.

First, in order to obtain an optical fiber fixture sample as shown in FIG. 1, a Ni-Ti alloy containing 50 atomic% of titanium, 47 atomic% of nickel and 3 atomic% of iron, 50 atomic% of copper and 40 atomic% of gold. , A ferrule made of a Cu-Au-Ni-based alloy containing 10 atomic% of nickel was formed.

Next, as a buffer layer on the outer circumference of the optical fiber,
As shown in Table 1, a polyamide hot-melt resin that softens at 120 ° C., a silicone resin that is soft at room temperature and hardens by air drying, and AgI that is an In alloy with a melting point of 120 ° C.
n solder, PbSu solder with a melting point of 180 ° C., melting point 220
The AgSn solder at a temperature of ℃ was applied and inserted and held in the through hole of the ferrule.

As a comparative example, a sample made of a Ti—Ni alloy without a buffer layer and a sample made of Kovar alloy with a buffer layer formed by AuSn solder were prepared.

In order to measure the airtightness of each of the obtained samples, the temperature range was -40 ° C to + 85 ° C, and the temperature change rate was 10 ° C.
Fig. 5 under a temperature cycle of 1 minute / minute and a residence time of 30 minutes.
As shown in FIG. 5, the optical fiber fixture is inserted into the through hole of the silicone rubber 13 set in the holder 12, and the exhaust gas 14 is exhausted inside the leak detector body.
The He leak amount is measured by spraying. And
The number of cycles at 1 × 10 ⁻⁹ atm · cc / sec was measured.

In order to measure the tensile strength, the temperature range of each sample was −40 ° C. to + 85 ° C., and the temperature change rate was 10 ° C.
After performing 700 cycles of temperature cycle of 30 minutes / min and a residence time of 30 minutes, the ferrule 1 is mechanically fixed and the optical fiber 2 is pulled by a push-pull gauge in the pulling direction of the arrow as shown in FIG. The strength was measured.

The results are shown in Table 1.

[0059]

[Table 1]

The diameters of the through holes in the table indicate the diameters at the working temperature above the transformation temperature. As is clear from Table 1, the samples (Nos. 1 to 23) of the present invention have 500 cycles. Airtightness is 1 × 10 ^-9 atm · cc / s even if exceeded
The tensile strength of 3.5 to 27 N is maintained at ec or less.

In particular, the diameter of the through hole of the ferrule is 0.13 to
0.15 mm sample (No. 2 to 4, 6, 8 to 10, 1
2, 13, 15 to 17, 20 to 22) have an airtight property of 1 × 10 ⁻⁹ atm · cc / sec or less and a tensile strength of 15 even after 600 cycles, regardless of the material used for the buffer layer. ~ 27N is maintained.

Samples (No. 2 to 4, 8 to 1) in which the buffer layer is made of polyamide hot melt resin or In alloy
0, 15 to 17, 20 to 22) has an airtightness of 1 × 10 ⁻⁹ atm · cc / sec or less and a tensile strength of 16 to 27 N even after 800 cycles.

On the other hand, the sample of the conventional example (No. 24)
Has an airtightness of 1 × 10 ⁻⁹ atm · c at 100 cycles.
The tensile strength deteriorates up to 3.5 N because the stress is directly applied to the optical fiber because of the deterioration of c / sec or more.

Similarly, the sample of the conventional example (No. 25)
Has an airtightness of 1 × 10 ⁻⁹ atm · c at 450 cycles.
The tensile strength deteriorates to 10 N because the deterioration due to c / sec or more and the stress due to the expansion and contraction of the ferrule are directly applied to the optical fiber through the AuSn solder.

[0065]

According to the optical fiber fixture of the present invention, since the ferrule is formed of a shape memory material and a thermoplastic elastomer resin or a plastically deformable soft metal is used as the buffer layer, the optical fiber is fixed to the optical fiber. Such stress can be uniformly and reduced, and the airtight characteristic of the gap between the ferrule and the optical fiber can be maintained and firmly fixed.

Further, according to the optical fiber fixture of the present invention, since the polyamide hot melt adhesive is used as the thermoplastic elastomer resin, a buffer layer is formed on the ferrule at a low temperature to prevent thermal stress such as thermal stress. The damage can be reduced, the airtightness of the gap between the ferrule and the optical fiber can be maintained, and the tensile strength can be increased.

Further, according to the optical fiber fixture of the present invention, since the In alloy is used as the plastically deformable soft metal, the above-mentioned polyamide layer hot melt adhesive is used at the same low temperature as the buffer layer. A buffer layer is formed on the ferrule to reduce thermal damage such as thermal stress, and the gap between the ferrule and the optical fiber can be sealed to enhance the tensile strength.

Furthermore, according to the optical fiber fixture of the present invention, the shape memory material has a coefficient of thermal expansion of 10 ppm / ° C. or less at −40 ° C. to + 85 ° C. Thereby, mechanical deterioration of the buffer layer can be reduced.

Furthermore, according to the optical fiber fixture of the present invention, the diameter of the through hole of the ferrule is 0.20 to 0.30 mm below the transformation temperature of the shape memory material, and 0.13 to above the transformation temperature. Since it is 0.15 mm, it is possible to easily insert the optical fiber having the buffer layer below the transformation temperature into the ferrule, and to provide a clearance that can hold the optical fiber when the ferrule is reduced in diameter above the transformation temperature, Can be firmly fixed.

Further, according to the method for manufacturing an optical fiber fixture of the present invention, a thermoplastic elastomer-based resin or plastic deformation is applied to the outer peripheral surface of the optical fiber in an environment below the transformation temperature of the shape memory material forming the ferrule. While applying a possible soft metal, insert it into the through hole of the ferrule,
Since the airtight sealing is achieved by raising the temperature above the transformation temperature and reducing the diameter of the through-hole, only by heating the ferrule above the transformation temperature, the airtight characteristic of the gap between the ferrule and the optical fiber is maintained and firmly. Can be fixed.

Furthermore, according to the optical semiconductor module of the present invention, the optical semiconductor element and the optical fiber fixture are arranged in the package, and the optical semiconductor element and the fiber fixture are optically connected. When the optical fiber fixture is assembled to the optical semiconductor module, the outside air does not enter the package and the optical semiconductor element such as the LD is not deteriorated, and a highly reliable optical semiconductor module can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of an optical fiber fixture of the present invention.

2 (a) to 2 (d) are explanatory views showing a method for manufacturing the optical fiber fixture of the present invention.

3 (a) to 3 (g) are partial enlarged views showing the tip of the optical fiber of the present invention.

FIG. 4 is a cross-sectional view showing an optical semiconductor module using the optical fiber fixture of the present invention.

FIG. 5 is an explanatory diagram showing a method for measuring an airtight characteristic of an optical fiber fixture.

FIG. 6 is an explanatory diagram showing a method for measuring the tensile strength of an optical fiber fixture.

FIG. 7 is a cross-sectional view showing a conventional optical semiconductor module.

FIG. 8 is a sectional view showing a conventional optical fiber fixture.

[Explanation of symbols]

1: Ferrule 1a: Through hole 2: Optical fiber 3: Buffer layer 4: Masking 5: Elastomer resin tank 6: High pressure liquid 7: Optical semiconductor module 8: Package 9: Laser diode 10: Lens 11: Optical fiber cord 12: Holder 13: Silicon rubber 14: Exhaust 15: He gas 21: Ferrule 21a: Through hole 22: Optical fiber 23: Solder 28: Package 29: Laser diode 30: Lens 31: Optical fiber cord

Claims (7)

[Claims] 1. An optical fiber fixture comprising a ferrule having a through hole in the axial direction and an optical fiber inserted and held in the through hole via a buffer layer, wherein the ferrule is formed of a shape memory material. At the same time, an optical fiber fixture characterized in that a thermoplastic elastomer resin or a plastically deformable soft metal is used as a buffer layer. 2. The optical fiber fixture according to claim 1, wherein a polyamide hot melt adhesive is used as the thermoplastic elastomer resin. 3. The optical fiber fixture according to claim 1, wherein an In alloy is used as the soft metal capable of plastic deformation. 4. The shape memory material is −40 ° C. to + 85 ° C.
The optical fiber fixture according to any one of claims 1 to 3, wherein the coefficient of thermal expansion is 10 ppm / ° C or less. 5. The diameter of the through hole of the ferrule is 0.20 to 0.30 mm below the transformation temperature of the shape memory material,
The optical fiber fixture according to any one of claims 1 to 4, wherein the optical fiber fixture has a transformation temperature of 0.13 to 0.15 mm. 6. A thermoplastic elastomer resin or a plastically deformable soft metal is applied to the outer peripheral surface of the optical fiber in an environment below the transformation temperature of the shape memory material forming the ferrule, and the through hole of the ferrule is formed. Insert into
The method for manufacturing an optical fiber fixture according to claim 1, wherein the temperature is raised to the transformation temperature or higher and the diameter of the through hole is reduced to hermetically seal. 7. An optical semiconductor element and the optical fiber fixture according to any one of claims 1 to 5 are arranged in a package, and the optical semiconductor element and the fiber fixture are optically connected. Optical semiconductor module.