JP2003222738A - Manufacturing method for wiring board and wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for efficiently exposing an optical fiber without damaging the optical fiber and to provide a wiring board that is manufactured by the method when exposing a certain length of optical fiber to connect the optical fiber that is laid on the wiring board to components. <P>SOLUTION: The manufacturing method of a wiring board features a process for laying an optical fiber on the surface of the adhesive layer of the first member comprising the adhesive layer and a base (1), a process for forming a separation layer at a specific location between the optical fiber that is laid on the first member and the adhesive layer (2), a process for arranging and stacking the second member comprising the adhesive layer and a film layer and the first member so that the two adhesive layers oppose each other (3), and a process for removing the second member in contact with the separation layer to expose the optical fiber (4). <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board manufacturing method and a wiring board manufactured by the manufacturing method.

[0002]

2. Description of the Related Art Since optical transmission is capable of high-speed and large-capacity information transmission, WAN (WideArea Network) is used.
It has been used for a long distance communication network such as an ork), but in recent years, it has been proposed and developed to use this optical transmission inside a device for optical communication. An optical wiring board that is responsible for connection between parts and boards is given as a main part constituting such a device. This is to form a wiring pattern using an optical fiber or a waveguide on a base material. In particular, a wiring board on which an optical fiber is laid has been highly expected due to its characteristics such as low loss and crossing capability. As a specific example of such a wiring board, for example, Japanese Laid-Open Patent Publication No. 1-180505 discloses a wiring forming method in which an optical fiber is laid on a substrate via an adhesive layer. It is described that an optical fiber was laid on an ABS resin substrate on which an acrylic adhesive layer was formed using a laying tool. JP-A-11-119033
The publication discloses a wiring board in which one or more optical fibers are laid on a rigid substrate using a one-stroke technique. Further, Japanese Patent Application Laid-Open No. 11-119034 discloses a wiring board manufacturing apparatus that attaches an optical fiber to an adhesive or an adhesive by utilizing the bending stress of the optical fiber.

[0003]

By the way, in order to connect the optical fiber of the optical wiring board and the component, it is necessary to expose the optical fiber of a certain length from the substrate of the optical wiring board in advance. In particular, as the number of parts to be connected increases, the number of exposed optical fibers also increases, and the handling thereof becomes difficult. Particularly, efficient exposure without damaging the optical fiber is essential for manufacturing the optical wiring board. However, none of the techniques disclosed above are explicitly stated as to their method. Therefore, the present inventors
The present invention has been completed by paying attention to the fact that a release layer that is easily peeled off is previously formed between the exposed optical fiber and the adhesive.

[0004]

That is, the gist of the present invention is a method of manufacturing a wiring board including the following steps (1) to (4). (1) A step of laying an optical fiber on the surface of the adhesive layer of the first member including the adhesive layer and the base material. (2) A step of forming a release layer at a predetermined position between the optical fiber laid on the first member and the adhesive layer. (3) A step of arranging and stacking a second member including an adhesive layer and a film layer and the first member so that the two adhesive layers face each other. (4) A step of exposing the optical fiber by removing the second member in contact with the release layer.

It is also preferable to include a step of removing the first member in contact with the release layer. Furthermore, it is preferable to form a release layer on at least one of the optical fiber, the adhesive layer of the first member, and the adhesive layer of the second member. It is preferable to apply a shaping agent and dry it, and to apply a release film. Furthermore, it is preferable to lay an optical fiber while applying a load and ultrasonic vibration. The gist of the present invention is also a wiring board manufactured by the method for manufacturing a wiring board described in any of the above.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. 1A to 1E are schematic cross-sectional views of main manufacturing steps of a wiring board manufactured by an embodiment of the manufacturing method of the present invention. FIG. 1A shows a first member 3 including an adhesive layer 1 and a base material 2. The first member 3 can be manufactured by applying an adhesive as the adhesive layer 1 to one surface of the base material 2 to a thickness of, for example, 20 to 200 μm, more preferably about 100 μm.

The base material 2 may be a rigid plate-like material or a flexible film-like material. In particular, substrates and films for printed wiring boards are preferable. For example, a laminated board made of phenol resin, epoxy resin, or polyimide resin or a film made of PET or polyimide resin is suitable. Further, those having printed wirings may be used for these substrates and films. Examples of the film include Kapton 200H, a product name of Toray-DuPont, and Lumirror S56, a product name of Toray Industries, Inc. Examples of the plate-shaped product include Hitachi Chemical Co., Ltd. product name MCL-E-679.

The adhesive used for the adhesive layer 1 of the first member 3 is not particularly specified, and any adhesive can be used. Moreover, you may use a pressure sensitive adhesive, so-called adhesive. For example, the product name of GE Toshiba Silicone
YR3286, TSR1521, Dow Corning product name DK Q9-900
9, Sumitomo 3M product name F-9473PC and the like.

Step (1): Next, as shown in FIG. 1B, the optical fiber 4 is formed on the surface of the adhesive layer 1 of the first member 3.
Are laid in a predetermined pattern. As the optical fiber, commercially available ones can be used. For example, in the case of a glass optical fiber, a single mode optical fiber such as SM-1005 (UV) (outside size 250 μm) manufactured by Hitachi Cable Ltd. / 125 CPC6 and Hitachi Cable company product name GI-50 / 125, QSI-85 / 125, SI-8
Examples of multi-mode optical fibers such as 5/150 and plastic optical fibers include Mitsubishi Rayon's product name Esca, Asahi Glass' product name Lucina, Toray's product name Reitera PFU, and Asahi Kasei product name Luminous. To be

As for the wiring of the optical fiber, it is preferable to lay the optical fiber while applying a load and ultrasonic vibration,
Therefore, it is preferable to use a wire laying machine because at least the wire laying position, load, and ultrasonic amplitude can be numerically controlled. The wiring position is the Cartesian coordinate system (x, y, z) or the polar coordinate system (r, θ,
It may be described in any coordinate system such as z). The height direction indicates the z-axis direction of the coordinate system. Further, it is more preferable that the wire laying machine is capable of numerically controlling the feed amount of the optical fiber and the movement of the wire laying head and the wire laying table. For example, an optical fiber wiring machine manufactured by Hitachi Chemical Co., Ltd. can be used.

Although not shown separately, a second member is prepared separately. The second member 9 includes an adhesive layer 7 and a film layer 8
(See FIG. 1 (d)). The second member 9 is preferably the same as the first member when the substrate 2 of the first member is in the form of a film, in terms of simplification of the manufacturing process, but may be different. Like the first member, the second member can be manufactured by applying an adhesive to one surface of the film. The film used for the film layer 8 may be the film used for the substrate 2, and for example, a film made of PET or polyimide resin is suitable. The adhesive used for the adhesive layer 7 is not particularly specified, and any adhesive can be used, but it is preferably the same as the adhesive layer 1 of the first member.

Step (2): Next, as shown in FIG. 1C, a release layer 6 is formed at a predetermined portion 5 between the optical fiber 4 and the adhesive layer 1, which is to be exposed. Specifically, the release layer 6
As a first forming method of forming a release agent, a release agent is applied to at least one of an optical fiber, an adhesive layer of a first member, and an adhesive layer of a second member at a predetermined location, and then dried. There is a method of making it. As a second forming method, a method of attaching a release film to at least one of the optical fiber at a predetermined position, the adhesive layer of the first member, and the adhesive layer of the second member can be mentioned. You may use these two methods together. The release agent and the release film can be easily applied to the subsequent member removing step by applying or sticking the release agent and the release film over the entire circumference where the optical fiber 4 at a predetermined position contacts the two adhesive layers. For example, by wrapping the release film around the optical fiber 4 at the predetermined position 5, as shown in FIG.
A release layer 6 having release film layers (not shown) above and below the optical fiber 4 is formed.

As the release agent and release film, generally commercially available ones can be used. For example, a liquid release agent manufactured by Seimi Chemical as a release agent Product name Mold Spat K644
Is a release film for Sumitomo 3M Co., Ltd.
9415PC etc. are mentioned.

Step (3): Next, these two members are arranged and laminated so that the adhesive layers face each other. By this laminating process, the optical fiber is sandwiched between the two adhesive layers, and the adhesive layers in the portions where the optical fiber is not present are separated from each other as shown in FIG.
It is fused and cured as shown in (d). The laminating condition depends on the composition of the adhesive, but generally the pressure is 0.1 to 0.5 MP.
The conditions of a, temperature of 50 to 150 ° C. and pressurizing time of 30 to 180 seconds are preferable. The laminate obtained in this laminating step is cut into a predetermined outer shape, if necessary.

Step (4): Next, as shown in FIG. 1E, the second member 9 in contact with the release layer 6 is removed to expose the optical fiber 4. That is, the film layer 8 and the adhesive layer 7, which are the second member 9 at the predetermined portion 5 on which the release layer 6 is formed, are peeled off between the optical fiber and the adhesive layer to expose the optical fiber 4. In addition, it is preferable to remove the first member 3 in contact with the release layer. Then, the remainder of the adhesive adhered to the optical fiber 4 at the predetermined position 5 is wiped off with ethanol or the like.

By using the above method, the optical fiber can be easily exposed. In addition, the adhesive remaining on the optical fiber can be easily removed by wiping. further,
A wiring board is obtained through a predetermined outer shape process, cleaning process, and the like. The wiring board of the present invention can be manufactured by the manufacturing method of the present invention as described above.

[0017]

EXAMPLE An example of the present invention will be described with reference to FIG. The present invention is not limited to the examples. (1) Toray DuPont Co., Ltd. product name Kapton 200H was prepared as the film-like substrate 2, and the adhesive layer 1 of Dow Corning Co., Ltd. product name DK Q9-9009 was formed to a thickness of 100 μm on one surface thereof. A film with an adhesive, which is the first member 3 as shown in FIG.

(2) Hitachi Chemical Co., Ltd. capable of numerically controlling the wiring position, load, ultrasonic wave amplitude, optical fiber feed amount, wiring head and table movement, etc. on the surface of the adhesive layer 1 of the film with adhesive. Product name SM1005 which is a single mode optical fiber 4 made by Hitachi Cable using an optical fiber wiring machine.
A predetermined pattern was laid with (UV) (outer diameter 250 μm) (see FIG. 1B).

(3) A liquid release agent (product name: Mold Spat K644) manufactured by Seimi Chemical Co., Ltd. is applied to the surfaces of the optical fiber 4 and the adhesive layer 1 at predetermined locations 5 to be exposed and dried to release the release layer. 6 was formed (see FIG. 1 (c)).

(4) As the second member 9, the same film with adhesive as that prepared in (1) was placed on the above (3) so that the adhesive layers 1 and 7 face each other. ,pressure
Lamination was performed under the conditions of 0.1 Mpa, temperature of 120 ° C., and pressing time of 30 seconds (see FIG. 1D). (5) Cut out into a predetermined outer shape.

(6) Predetermined portion 5 to which the release agent has been applied above
The first and second members of the adhesive layer 1, 7 and the optical fiber 4
It was peeled off between and to expose the optical fiber (Fig. 1
(See (e)). (7) The adhesive remaining on the optical fiber was wiped off with ethanol.

By using the above method, the optical fiber could be easily exposed. In addition, it was confirmed that the adhesive remaining on the optical fiber can be easily removed by wiping, and damage to the coating layer of the optical fiber can be suppressed.

[0023]

As described above, according to the present invention, the optical fiber can be easily exposed. In addition, it is easy to wipe off the adhesive remaining on the optical fiber,
It is possible to suppress damage to the coating layer of the optical fiber. Thus, the wiring board on which the optical fiber is laid can be manufactured with good work efficiency and manufacturing yield even if the number of parts connected to the optical fiber increases.

[Brief description of drawings]

FIG. 1A to FIG. 1E are schematic cross-sectional views of main manufacturing steps of a wiring board obtained by an embodiment of a manufacturing method of the present invention.

[Explanation of symbols]

1 Adhesive layer 2 base materials 3 First member 4 optical fiber 5 Specified place (exposed part of optical fiber) 6 Release layer 7 Adhesive layer 8 film layers 9 Second member

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahiro Kato             Hitachi Chemical, 1500 Ogawa, Shimodate City, Ibaraki Prefecture             Shimodate Office of Industry Co., Ltd. F-term (reference) 2H038 CA52                 5E338 AA12 AA16 BB28 BB80 CD12                       EE32

Claims (6)

[Claims] 1. A method for manufacturing a wiring board, comprising the following steps (1) to (4). (1) A step of laying an optical fiber on the adhesive layer surface of a first member composed of an adhesive layer and a base material, (2) a predetermined distance between the optical fiber laid on the first member and the adhesive layer A step of forming a release layer at a location, (3) a second member consisting of an adhesive layer and a film layer, and the first member are arranged so that the two adhesive layers face each other, Laminating step, (4) removing the second member in contact with the release layer to expose the optical fiber. 2. The method for manufacturing a wiring board according to claim 1, further comprising the step of removing the first member in contact with the release layer. 3. A release agent is applied to at least one of the optical fiber, the adhesive layer of the first member and the adhesive layer of the second member and dried to form a release layer. 1 or 2
A method for manufacturing a wiring board according to. 4. A release layer is formed by attaching a release film to at least one of the optical fiber, the adhesive layer of the first member, and the adhesive layer of the second member. 4. The method for manufacturing a wiring board according to any one of 3 above. 5. The method for manufacturing a wiring board according to claim 1, wherein the optical fiber is laid while applying a load and ultrasonic vibration. 6. A wiring board manufactured by the method for manufacturing a wiring board according to claim 1.