JP2003220592A - Device for cutting pcb pollutant and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device capable of appropriately cutting a capacitor element for effectively cleaning the capacitor element contaminated by a PCB. <P>SOLUTION: The cutting device for cutting the PCB pollutant C is equipped with a loading table 1 for loading the PCB pollutant C, a cutting part 2 movable reciprocatively to the up and down direction on the loading table 1, and a sending part 3 capable of moving a prescribed amount of the PCB pollutant C on the loading table 1 toward the cutting part 2. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitor element cutting device and a cutting method used for pretreatment for effectively cleaning a capacitor element contaminated by PCB.

[0002]

2. Description of the Related Art Polychlorinated biphenyl (hereinafter referred to as "PCB") is excellent in stability, nonflammability, and electrical insulation, and therefore, in the past, capacitors and transformers (hereinafter referred to as "capacitors"). It was used as an insulating oil when making up. Since the PCB used in this way is not easily decomposed, it may accumulate in water, soil or the like after the used condenser or the like is disposed of, and enter the human body through food or the like.

As described above, since PCB is not easily decomposed and is harmful, its production or new use is currently prohibited. And after the toxicity was pointed out, PCB
Capacitors and the like using insulating oil containing (hereinafter, simply referred to as “insulating oil”) are stored and urgent processing is required.

Specifically, the capacitor or the like is composed of a main body, insulating oil, and a container for accommodating them, and the main body is composed of elements, insulators and other accessories.
Among these, the element is configured by winding a plurality of layers in a state where a belt-shaped electrode and a belt-shaped insulator are stacked.

When the above-mentioned capacitors and the like are discarded, the insulating oil extracted from the container is
It is required to surely decompose (detoxify) CB,
Conventionally, various treatment methods have been studied. In addition, regarding the containers and elements that make up capacitors, etc., even after the insulating oil is extracted, the insulating oil adheres to the container and the insulator of the element is impregnated with insulating oil. After removing it, it is necessary to dispose or reuse it in a safe condition.

Conventionally known methods for treating capacitors and the like contaminated by PCBs are separation methods such as vacuum heating separation in which PCBs are heated to vaporize and remove them, and solvent cleaning methods in which they are cleaned with a solvent. ing. In addition, pretreatment such as crushing, crushing, and cutting may be performed in order to facilitate cleaning.

The capacitor element is formed by alternately laminating long strips of aluminum foil and long strips of paper and winding them. Since the paper wound several dozen times is impregnated with PCB, it may be washed with a solvent or the like. It is difficult to elute PCB from this capacitor element. Therefore, in the prior art, in order to appropriately elute the PCB from the capacitor element for cleaning, it is common to perform solvent cleaning after crushing the capacitor element with a crusher.

[0008]

However, the above-mentioned prior art has the following problems.

As described above, when the capacitor element is crushed by using the crusher, the capacitor element is crushed while being subjected to a combination of pulling, crushing, friction and the like.
Consolidation, rewinding, folding back, etc. occur at the cut end of the capacitor element thus crushed.

That is, when the capacitor element is crushed by using a crusher as a pretreatment such as solvent cleaning as in the prior art, there is a problem that it is not possible to obtain a sharp cut edge where PCB is easily eluted. More specifically, the capacitor element is formed by laminating an aluminum foil having a thickness of several microns to several tens of microns and paper, and in the state after crushing using a conventional crusher, as described above. Since the aluminum foil and the paper are hardly peeled off due to the folding back and the like, there is a problem that the effect of solvent cleaning is lowered.

Further, as described above, since the aluminum foil and the paper cannot be appropriately separated (separated) from each other in the solvent cleaning step due to the presence of the folding back or the like, a cleaning process suitable for each cleaning property is carried out. Is impossible.
As a result, since it is necessary to wash the aluminum foil and the paper together, there is a problem that the amount of solvent required for washing increases.

Further, the capacitor element after being crushed by using the conventional crusher is not constant in size, shape, etc., and the capacitor element which is not properly crushed is sent to the solvent washing step etc. as it is long. In some cases. Therefore,
In the prior art, there is a problem that such a long product is sent to the subsequent cleaning step or the like, so that the stirring blade is entangled and the pipe is clogged during transportation.

When a conventional crusher or the like is used,
Since fine crushed pieces (dust) are generated, a filter is required in the system to collect these crushed pieces.
There is a problem that the device becomes complicated. Furthermore, since the crushed pieces are fine, it is difficult to separate the paper and the aluminum foil.

Therefore, the present invention has been made in order to solve the above problems of the prior art, and provides a pretreatment device for effectively cleaning a capacitor element contaminated by a PCB. Specifically, it is an object of the present invention to provide a cutting device and a cutting method capable of appropriately cutting a capacitor element.

[0015]

The first aspect of the present invention has been made to solve the above-mentioned problems of the prior art.
A cutting device for cutting CB contaminants, comprising: a mounting board on which the PCB contaminants are mounted; a cutting unit capable of reciprocating up and down on the mounting board; and the PCB contamination on the mounting board. It is characterized in that it is provided with a feeding section capable of moving an object by a predetermined amount with respect to the cutting section.

According to the cutting device according to the first aspect of the present invention thus constructed, PCB contamination is basically caused only by the shearing force of the cutting part which is provided on the mounting plate and reciprocates in the vertical direction. Since the object is cut, the cut end of the PCB contaminant becomes a sharp cut end without consolidation, rewinding, or folding back. Therefore, in the solvent cleaning step performed while stirring or the like, the constituent elements of the PCB contaminant (for example, aluminum foil and paper) are relatively easily separated, and the effect of solvent cleaning is improved. Further, for example, when processing a capacitor element, it is possible to properly separate the aluminum foil and the paper by selecting an appropriate solvent in the solvent cleaning step. A cleaning process corresponding to the washability of paper and paper) can be applied, and the amount of solvent required for cleaning can be reduced. Further, according to such a configuration, the cutting process is performed while moving the PCB contaminants by a predetermined amount by using the feeding unit.
The B contaminant is cut into a substantially uniform size. Therefore,
According to the present invention, compared to the prior art, the size of the object to be cleaned is uniform, thus eliminating uneven cleaning,
A proper cleaning effect can be obtained. Further, according to the present invention, the PCB contaminant in which the PCB remains to some extent (for example, before the cleaning treatment) is cut using the cutting unit or the like. Therefore, when performing a cutting process using the cutting device having such a configuration, the PCB plays a role of lubricating oil, and the reciprocating movement of the cutting portion (particularly, pressing and cutting for PCB contaminants) is smoothly performed. Therefore, an excessive load is not applied to the cutting device, and a required sharp cut can be obtained.

A second aspect of the present invention is a cutting device for cutting PCB contaminants, which is capable of reciprocating up and down on the mounting plate on which the PCB contaminants are mounted and on the mounting plate described above. The first cutting part and the second cutting part, and the P on the mounting board described above.
A first feed unit and a second feed unit capable of moving the CB contaminants by a predetermined amount with respect to the respective cutting units, and the PCB contaminants supplied by the first feed unit are the first feed units. The PCB that has been cut after being cut by the cutting unit of
Each of the cutting units and each of the feeding units are arranged so that contaminants are supplied to the second cutting unit by the second feeding unit and further cut.

The cutting device according to the second aspect of the present invention thus configured has the same basic configuration as the cutting device according to the first aspect, and therefore has the same effects as those of the first aspect. In addition to being able to obtain, the following effects can be obtained. The cutting device according to the second aspect,
As described above, the two cutting portions and the two feeding portions corresponding to the respective cutting portions are provided, and the PCB contaminant cut by the first cutting portion is further cut by the second cutting portion. Is configured accordingly. Therefore, according to the cutting device of this aspect, even when the second cutting is necessary, it is not necessary to change the direction of the object to be cut and place it again on the mounting board, and the size of the cutting is It can be arbitrarily selected by appropriately adjusting the movement amounts of the first and second feeding portions. Therefore, according to the cutting device of the second aspect,
Since the cutting size of PCB contaminants can be arbitrarily set, it is possible to prevent problems in each step on the downstream side of the cutting device. Specifically, by setting an appropriate cutting size, it is possible to prevent the entanglement with the stirring blade, the clogging of the pipe during transportation, and the like.

In the PCB contaminant cutting device according to the second aspect of the present invention, the cutting surface of the first cutting portion and the cutting surface of the second cutting portion should be substantially orthogonal to each other. ,
A configuration in which the first and second cutting portions are provided is preferable.

In the PCB contaminant cutting device according to the first and second aspects of the present invention, it is preferable that the PCB contaminant is provided with a guide portion for regulating the moving direction of the PCB contaminant.

According to this preferred structure, by providing the guide portion, the PCB contaminants can be appropriately moved using the feed portion (first and second feed portions in the second embodiment). Since it is performed, the cutting process using the cutting unit is performed more reliably (to a predetermined set size, etc.)
It can be carried out. In the second aspect, two guide portions corresponding to the first and second feeding portions may be provided, or one guide portion configured to correspond to each feeding portion may be provided. May be.

Further, in the PCB contaminant cutting apparatus according to the first and second aspects of the present invention, when the PCB is to be cut using the cutting unit, the PCB contaminant is fixed and the feeding unit is used. It is preferable that the PCB contaminant is provided in a non-fixed state when it is moved by using a holding part.

According to this preferred structure, by providing the pressing portion, stable PCB contaminant cutting processing is performed when the cutting portion is activated, and smooth PCB contaminant movement processing is performed when the feeding portion is activated. be able to. In addition, in the second aspect, a plurality of pressing portions corresponding to the first and second cutting portions or the first and second feeding portions may be provided.

Further, the method for cutting PCB contaminants according to the present invention is the above-mentioned PC in a state where a predetermined amount of PCB remains.
It is characterized in that the B contaminant is supplied to any of the above-described cutting devices to perform the cutting.

According to this structure, the cutting process is performed with a predetermined amount of PCB (amount capable of functioning as lubricating oil) remaining, so that the cutting device can be smoothly processed without applying an excessive load. It can be performed.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

<First Embodiment> FIG. 1 is a schematic perspective view of a cutting device according to a first embodiment of the present invention. As shown in FIG. 1, the cutting device according to the present embodiment includes a mounting board 1 on which a capacitor element C (corresponding to “PCB contaminant” of the present invention) provided inside a capacitor or the like can be mounted. A cutter unit 2 (corresponding to the “cutting unit” of the present invention) capable of reciprocating up and down on the mounting board 1 and a predetermined amount of the capacitor element C mounted on the mounting board 1 (for example, ,
A feed unit 3 that can be moved (at intervals of about 10 mm to 40 mm), and a capacitor element C on the mounting board 1 using the feed unit 3.
When moving the capacitor element C, a guide portion 4 that restricts the moving direction of the capacitor element C, a holding portion 5 that can fix the capacitor element C, and the like are used.

In this embodiment, the mounting board 1 is formed so that the PCB contaminants can be mounted thereon and the cutter section 2, the guide section 4, and the holding section 5 can be installed. Further, in the present embodiment, the mounting board 1 is formed in a rectangular shape, but the present invention is not limited to this configuration, and any shape can be selected as necessary. Further, in the present embodiment, the feeding portion 3 is provided outside the mounting board 1, but the present invention is not limited to this configuration and may be provided on the mounting board 1.

The cutter unit 2 is provided on the mounting board 1 as described above, and is configured to reciprocate up and down (in the direction of arrow X) on the mounting board 1. This cutter unit 2
For example, it is formed by using steel, superalloy, ceramic or the like. The cutter unit 2 is configured to reciprocate at a predetermined timing in cooperation with the feeding unit 3, the pressing unit 5, and the like. The configuration of the cutter unit is not limited to this, and may have any configuration as long as the capacitor element C can be cut at a predetermined timing.

The feed unit 3 includes a feed plate 3a configured to come into contact with the capacitor element C, a shaft 3b connected to the feed plate 3a, and a drive unit 3c capable of reciprocating the shaft 3b. It is configured using. The feed unit 3 is configured to reciprocate the feed plate 3a in the arrow Y direction by using the drive unit 3c and the shaft 3b. When the capacitor element C is cut, the feed plate 3a is used.
Thus, the capacitor element C is moved in the direction of the cutter unit 2 by a predetermined interval. Note that the feeding unit is not limited to such a configuration, and may have any configuration as long as it can supply the capacitor elements C in the direction of the cutter unit 2 at predetermined intervals. Further, the width, height, etc. of the feed plate 3a are formed in such a size that the capacitor element C can be supplied to the cutter portion 2 to the end without interfering with the pressing portion 5 and the like.

The guide portion 4 is provided in accordance with the size (width in the direction perpendicular to the moving direction) of the capacitor element C, which is a PCB contaminant that is moved and supplied on the mounting board 1. Is composed of a pair of plate-like members 4 provided along both sides of the capacitor element C. In addition,
The guide portion is not limited to such a configuration, and may have any configuration as long as the moving direction of the capacitor element C can be appropriately regulated.

The holding portion 5 is attached to one of the guide portions 4 (one of the pair of plate-like members 4) and is configured to be rotatable in the arrow Z direction about the attaching portion 5a. . When the pressing portion 5 is rotated so as to come into contact with the capacitor element C (in the state shown by the solid line in FIG. 1), the pressing portion 5 functions to fix the capacitor element C, and is separated from the capacitor element C. If it is rotated (without contacting the capacitor element C) (in the state shown by the broken line in FIG. 1), the capacitor element C is not fixed. The pressing portion is not limited to such a configuration as long as the capacitor element C can be appropriately fixed during cutting. Further, the size and installation position of the holding portion are determined so that the capacitor element C can be fixed to the end even if the capacitor element C becomes small due to cutting.

The cutting device according to the present embodiment is constructed as described above and is used in the pretreatment stage of the detoxification treatment (cleaning treatment, etc.) of PCB contaminants.

As described above, the treatment of PCB contaminants includes the treatment of insulating oil containing PCB and the like and the treatment of each component impregnated with PCB (or the PCB adhered). The components impregnated with the PCB need to be cleaned to some degree after being made fine. In particular, regarding a capacitor element that constitutes a capacitor, it is difficult to remove the PCB because the component paper such as paper is impregnated with PCB.

Therefore, the cutting device according to the present embodiment is
It will be used to properly remove the PCB remaining in such a capacitor element or the like. Hereinafter, specific functions and their effects will be described.

First, in the case of decontaminating a PCB-contaminated capacitor, the external appearance of the capacitor is inspected, dimensions and weights are measured, and then the insulating oil (PCB-containing insulating oil) in the capacitor is recovered. Then, for each component of the capacitor, cutting processing or the like is appropriately performed. Regarding the internal components of the capacitor, after removing it from the capacitor container,
The element insulating paper enclosing the capacitor element and the like is peeled off, and the paper is divided into a spacer wound with paper and a capacitor element wound with aluminum foil and paper overlaid. Then, the divided capacitor elements are cut by the cutting device according to the present embodiment. FIG. 1 shows a state in which such a capacitor element is actually transferred.

As shown in FIG. 1, the capacitor element C is
When it is transferred and placed on the mounting board 1, it is placed between the guide portions 4 provided on the mounting board 1 (mounting step). Then, the capacitor element C is moved to the cutter unit 2 side along the guide unit 4 by driving the feeding unit 3 (moving process).

The capacitor element C sent to the end surface of the cutter section 2 by the sending section 3 and the guide section 4 is
Further, by driving the feeding section 3, the sheet is further fed to the cutter section 2 side by a predetermined amount (for example, 15 mm) (predetermined amount feeding step), and then fixed by the pressing section 5 (fixing step). In this fixing, the pressing portion 5 is driven so as to come into contact with the capacitor element C as shown by the solid line in FIG. 1, but when the feeding portion 3 is driven, as shown by the broken line in FIG. It is in a state of not touching.

Next, by driving the cutter portion 2 with respect to the fixed capacitor element C, the capacitor element C is cut into slices having a predetermined thickness (cutting step). The width of this cutting is preferably 40 mm or less, more preferably 15 mm or less. The length is preferably about 50 mm to 100 mm. The cleaning process for the capacitor element C is usually performed a plurality of times.
May be before the primary cleaning or after the primary cleaning,
The point is a PCB that can cut smoothly
If it contains, it does not matter about the order of the treatment. For example, as the primary cleaning, steam cleaning,
Examples include spray cleaning and immersion cleaning.

After performing the cutting process in the cutter unit 2,
The pressing portion 5 is released (as indicated by the broken line in FIG. 1) (release step), the predetermined amount feeding step and fixing step for the capacitor element C are performed again, and then the cutting step is performed.

That is, in the cutting apparatus according to the present embodiment, the predetermined amount feeding step, the fixing step, the cutting step, and the cutting step until the cutting processing of the capacitor element C supplied onto the mounting board 1 is completed. The release process will be repeated. Then, after the cutting process for one capacitor element C is completed, after the cut capacitor element is transferred to the next step, the placing step and the moving step for the other capacitor element C are performed,
The predetermined amount feeding process, the fixing process, the cutting process, and the releasing process described above are repeatedly performed.

Generally, the capacitor element C has a thickness of 20 mm to 30 mm and a width of 100 mm to 250 mm,
Since the length is about 400 mm to 800 mm, it is necessary to cut the capacitor element C twice in order to obtain the above-described preferable width and length. For example,
As shown in FIG. 1, the capacitor element C, which is cut in a predetermined direction, is supplied again to the cutter unit 2 side by the feeding unit 3 on the mounting board 1 and cut in a direction orthogonal to the previous cutting. Good.

The capacitor element C cut into a predetermined size as described above is then sent to a solvent cleaning step, a vacuum heating / drying step, and the like. In the solvent cleaning step, for example, the cleaning treatment and the separation treatment (separation due to the difference in specific gravity of the paper, aluminum, and the solvent) are performed while being put into a separation tank equipped with a stirrer that stores a chlorine-based organic solvent and stirred. It will be. By using the cutting device according to this embodiment, the following effects can be obtained.

First, according to the cutting apparatus of the present embodiment, the capacitor element C is cut only by the shearing force of the vertically reciprocating cutter portion 2 provided on the mounting board 1. Unlike the above, the cut end of the capacitor element C is a sharp one that is not consolidated, rolled up, or folded back. Therefore, in the solvent cleaning step performed while stirring or the like, the aluminum foil forming the capacitor element C and the paper are sufficiently separated. In this way, when the paper is cut by the cutting device according to the present embodiment, the paper (PCB
Since it is possible to properly separate the impregnated material) and the aluminum foil (PCB non-impregnated material), perform a suitable cleaning treatment for each,
The cleaning effect for each can be enhanced. Also,
Since the separation cleaning can be performed in this manner, the amount of solvent required for cleaning can be reduced. Furthermore, since it is possible to separate and wash the decontamination process in the initial stage, it is possible to perform a process suitable for each in the separated state also in the subsequent processes. For example, final inspections and the like can be received separately, and even when recycling or the like is performed, it is not necessary to perform complicated separation processing after cleaning.

Further, according to the present embodiment, since the cutting process is performed while moving the capacitor element C by the predetermined amount by using the feeding portion 3, the capacitor element C is cut into a substantially uniform size. Therefore, the size of the object to be cleaned becomes more uniform as compared with the conventional technique (crusher or the like), so that it is possible to eliminate uneven cleaning and obtain an appropriate cleaning effect.

Furthermore, according to the present embodiment, the cutting process is performed with a certain amount of PCB remaining. Therefore, when the cutting process is performed, the PCB plays a role of lubricating oil, and the reciprocating movement of the cutter unit 2 (particularly, the pressing operation for the capacitor element C) is smoothly performed. That is,
According to this embodiment, the PC with which the capacitor element C is impregnated
By the lubrication effect of B, the element is smoothly cut without applying an excessive load to the cutting device, and the required sharp cut can be obtained more easily. Therefore, as described above, it is possible to improve the subsequent solvent cleaning effect and the like.

Further, according to the present embodiment, since the guide portion 4 is provided, the movement of the capacitor element C using the feeding portion 3 is appropriately performed, so that the cutting process using the cutter portion 2 is performed more reliably. To (to a preset size etc.)
It can be carried out.

Further, according to this embodiment, the cutter unit 2
The cutter unit is provided because it can hold the capacitor element C in a fixed state when the cutting process is performed by using the pressing unit 5 and can fix the capacitor element C in a non-fixed state when the feeding unit 3 moves the cutter unit. It is possible to perform stable cutting of the capacitor element C when the second operation is performed, and smooth movement of the capacitor element C when the feeding unit 3 is operated.

Second Embodiment Next, FIG. 2 shows a schematic perspective view of a cutting device according to a second embodiment of the present invention. As shown in FIG. 2, the cutting device according to the present embodiment includes a capacitor element C (“PCB contaminant” of the present invention).
(Corresponding to the first cutting part) of the present invention, a first cutter part 12 (corresponding to the "first cutting part" of the present invention) capable of reciprocating up and down on the mounting plate 10, and Second cutter 22
(Corresponding to the "second cutting section" of the present invention) and this mounting board 1
The first feed unit 13 and the second feed unit 23, which can move the capacitor element C placed on 0, by a predetermined amount, and the feed unit 13 and 23 are used to move the capacitor element C on the mounting board 10. In doing so, the first guide portion 14 and the second guide portion 24 that regulate the moving direction of the capacitor element C are used.

Note that, in FIG. 2 showing the second embodiment, in order to avoid complication of the drawing, description of the holding portion for fixing and non-fixing the capacitor elements C and C ′ is omitted. is doing.

Also in this embodiment, as in the first embodiment, the mounting board 10 mounts the capacitor element C, which is a PCB contaminant, on the mounting board 10, and the cutters 12, 22 and the guides 14, 24. Is formed so that it can be installed. Also,
In the present embodiment, the mounting board 10 has a shape determined according to the feeding direction (or shearing direction) of the capacitor element C. That is, the two cutter parts 12,
The mounting board 10 is formed so that the mounting board 22 can be arranged in a horizontal right angle direction when viewed from the moving direction of the capacitor element C.
Further, in the present embodiment as well, as in the first embodiment, the feeding portions 13 and 23 are provided outside the mounting board 10, but the present invention is not limited to this configuration and is provided on the mounting board 10. May be.

Cutters 12 and 22 and feeds 13 and 2
The specific configuration of No. 3 is the same as that described in the first embodiment, except for the number of installations and installation positions.

Basically, the guide portions 14 and 24 are also
The first guide portion 14 functions as the one described in the first embodiment, and the first guide portion 14 connects the capacitor element C to the first cutter portion 1.
The second guide portion 24 is used to regulate the moving direction when moving in two directions, and the second guide portion 24 cuts the capacitor element C ′ cut by the first cutter portion 12 into the second cutter. It is used to regulate the moving direction when moving in the direction of the portion 22.

Although the pressing portion is not shown in FIG. 2, the pressing portion is also provided in front of the cutter portions 12 and 22 in the present embodiment as in the first embodiment. The elements C and C ′ are provided so as to be fixed or not fixed. Then, the capacitor elements C and C'are fixed during cutting, and the capacitor elements C and C'are not fixed during movement.

The cutting apparatus according to this embodiment is configured as described above, and, like the apparatus described in the first embodiment, the decontamination process (cleaning process, etc.) for PCB contaminants.
Used in the pretreatment stage of. The functions and effects thereof are basically the same as those of the first embodiment, and the functions unique to the present embodiment include the following points.

As shown in FIG. 2, in the cutting device according to the present embodiment, the first cutter unit 12 is arranged in a state where the two cutter units 12 and 22 are arranged in the horizontal right angle direction as viewed from the moving direction of the capacitor element C. The capacitor element C is cut into slices, and the capacitor element C ′ thus cut into slices is further cut into several pieces (in strips) by the second cutter section 22. Then, the feed amount of the capacitor elements C and C ′ can be appropriately adjusted for both the feed units 13 and 23.

Since the cutting device according to the present embodiment is constructed and functions as described above, a long element which is obtained by the crusher used in the prior art does not occur, and the feeding unit 13, By appropriately adjusting the feed amount of 23, it is possible to obtain a cutting element of any size. Also,
As in the case of the first embodiment, even when the second cutting is necessary, it is not necessary to change the direction of the cutting element and place it again on the mounting board, and the cutting is performed by the first cutter unit 12. After that, the second cutter portion 22 is provided in a direction substantially orthogonal to the cutting direction at that time.
Since the cutting is performed in step 1, the preferable cutting size described above can be easily obtained.

That is, according to the present embodiment, it is not necessary to replace the cutting element even if the second cutting is required.
Regarding the size of the cutting, by appropriately adjusting the movement amount by the first and second feeding portions 13 and 23,
It can be arbitrarily selected. Therefore, according to the cutting device according to the second embodiment, it is possible to arbitrarily set the cutting size of PCB contaminants such as the capacitor element C based on a simpler operation. It is possible to prevent the trouble in. Specifically, by setting an appropriate cutting size, it is possible to prevent the entanglement with the stirring blade, the clogging of the pipe during transportation, and the like.

The present invention is not limited to the above embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.

In each of the above-mentioned embodiments, the case where the capacitor element is cut as the PCB contaminant has been described, but the cutting apparatus according to the present invention can be applied to other than the capacitor element. For example, it can be applied to the case of cutting a spacer or the like in a capacitor. Further, the present invention is applicable not only to PCB contaminants but also to the cutting of non-contaminated capacitor elements currently used.

In the above embodiment, the case where one cutter portion 2 is used in the first embodiment and the case where two cutter portions 12 and 22 are used in the second embodiment have been described. However, the cutting device is not limited to this configuration, and the cutting device may be configured using three or more cutter parts (corresponding to the “cutting part” of the present invention) as necessary. However, in this case, it is preferable to appropriately provide a feeding portion, a guide portion, a pressing portion, and the like according to the number of cutter portions.

[0062]

As described above, the cutting device according to the present invention can feed the PCB contaminants at a predetermined interval and the PCB contaminants supplied by the feeder can be sheared as sharply as possible. It is configured by using such a cutter unit. Therefore, according to the present invention, PCB contaminants (PC
It is possible to obtain an apparatus and a method capable of appropriately performing a pretreatment for effectively cleaning or the like of a capacitor element contaminated with B). Specifically, it is possible to obtain a cutting device and a cutting method that can appropriately (without folding or the like) cut PCB contaminants such as capacitor elements.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a cutting device according to a first embodiment of the present invention.

FIG. 2 is a schematic perspective view of a cutting device according to a second embodiment of the present invention.

[Explanation of symbols]

1, 10 ... Mounting board 2, 12, 22 ... Cutter part 3, 13, 23 ... Feeding unit 4, 14, 24 ... Guide part 5: Pressing part

Claims (6)

[Claims] 1. A cutting device for cutting PCB contaminants, comprising: a mounting plate on which the PCB contaminants are mounted; a cutting unit capable of reciprocating up and down on the mounting plate; The above PC
A PCB contaminant cutting device, comprising: a feed unit capable of moving a B contaminant by a predetermined amount with respect to the cutting unit. 2. A cutting device for cutting PCB contaminants, comprising: a mounting plate on which the PCB contaminants are mounted; a first cutting unit and a second cutting unit that can reciprocate up and down on the mounting plate. And a first feeding unit and a second feeding unit capable of moving the PCB contaminants on the mounting board with respect to the respective cutting units by a predetermined amount, and the first feeding unit. After the PCB contaminant supplied by the above is cut by the first cutting unit, the cut PCB contaminant is supplied by the second feeding unit to the second cutting unit and further cut. Therefore, the cutting portion and the feeding portion are arranged so that
CB contaminant cutting device. 3. The first and second cutting portions are provided so that the cutting surface of the first cutting portion and the cutting surface of the second cutting portion are substantially orthogonal to each other. PC described in 2
B contaminant cutting device. 4. The PCB contaminant cutting device according to claim 1, further comprising a guide portion that regulates a moving direction of the PCB contaminant. 5. A pressing unit that can fix the PCB contaminants when the cutting process is performed by using the cutting unit and can fix the PCB contaminants when the cutting process is performed by using the feeding unit. The PCB contaminant cutting device according to claim 1, further comprising: 6. The PC, wherein the PCB contaminant in a state where a predetermined amount of PCB remains is supplied to the cutting device according to any one of claims 1 to 5 to perform cutting.
B Method of cutting contaminants.