JP2003219535A - Wiring storage pit for clean room - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem of a floor in an underfloor area of the clean room, such as a semiconductor manufacturing factory, being provided with a wiring storage pit for storing electric wires for electrical apparatuses or the like, where electric charges are apt to gather, however, a conventional wiring storage pit for a clean room causes troubles in semiconductor manufacture, because it has no complete antistatic measures. <P>SOLUTION: In this wiring storage pit 47 for the clean room, the inner surface of a pit hole 22 is formed out of a conductor plate (mold form 1), so as to make the surface of the floor 21 subjected to conductive treatment, the surface of a lid 2, and the conductor plate to be electrically conducting with each other. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring accommodating pit in a clean room used for semiconductor manufacturing or the like.

[0002]

2. Description of the Related Art Conventionally, a wiring storage pit for accommodating wiring of electric equipment is provided on the floor of an underfloor area of a clean room such as a semiconductor manufacturing factory.

[0003]

Electric charges easily accumulate in the wiring storage pits, but in the conventional wiring storage pits of a clean room, antistatic measures cannot be said to be perfect and cause troubles in semiconductor manufacturing. was there.

[0004]

In the wiring accommodating pit of the clean room according to claim 1, the inner surface of the pit hole is formed of a conductor plate, and the floor surface and lid surface subjected to the conductive treatment are electrically connected to the conductor plate. . According to the second aspect, the bottom side wall surface and the bottom surface of the inner surface of the pit hole are connected by the inclined surface. Claim 3
The above conductive treatment was carried out with a conductive paint with little gas emission.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIG.
~ It demonstrates based on FIG. First, an outline of a clean room of a semiconductor manufacturing factory in which the wiring storage pit according to the present embodiment is adopted will be described with reference to FIG. The clean room has a three-layer structure. That is, the process area 10 in which precision equipment necessary for semiconductor manufacturing and inspection is installed.
And an underfloor area 20 and a ceiling area 30. The floor of the process area 10 is a perforated floor (grating) 11, and the ceiling of the process area 10 is a perforated ceiling 12.
Has become. An air conditioner 31 and an air cleaning filter 32 are provided in the ceiling area 30. Process area 1
An air circulation space 10A is provided on the side of 0, whereby the air is purified by the air cleaning filter 32 and circulates in each area 10, 20, 30 as shown by the arrow. Further, a front room equipped with an air shower is provided between the entrance 40 and the outside, and a person entering the clean room enters the clean room after performing air cleaning in the front room. The front room is the door 40a on the clean room side
And the outside door form a closed space. Reference numeral 41 denotes an entrance / exit between the air circulation space 10A and the process area 4,
1a is a door of this entrance / exit 41, 42 is a pillar, 43 and 44 are fireproof coated beams, 45 is a double sash window, 46 is a corridor, 47
Is a wiring storage pit for storing wiring.

Next, details of the wiring storage pit 47 according to the embodiment will be described with reference to FIGS. The construction method of the wiring storage pit 47 is as follows. First, when constructing the floor 21 of the underfloor area 20, the wiring storage pit 47
An underfloor area 20 is formed by forming a concrete driving form 1 with a galvalume steel plate which is a conductor plate forming the inner surface of the wiring storage pit 47 at the position where the The concrete floor 21 of is constructed. As a result, the inner surface of the pit hole 22 formed in the concrete floor 21 is formed by the mold 1. The wall 100 and the bottom 101 of the formwork 1 are fixed to the concrete with concrete screws 102. On the upper part of the mold 1 is a receiving frame portion 1A for receiving the lid 2.
Are formed. The lid 2 is made of steel plate and has a receiving frame portion 1A
The holding portion 2b is mounted on the receiving surface 1d of the above and keeps the lid upper surface 2a substantially flush with the floor surface 21a. The floor surface 21a of the floor 21 is provided with a conductive treatment layer 3 formed by applying conductive coating so as to cover the upper end 1t of the receiving frame portion 1A, and is configured to be electrically connected to the receiving frame portion 1A. Although not shown, the wall surface 1a on the surface of the lid 2 and the inner surface of the mold 1
Also, a conductive treatment layer formed by applying a conductive paint is provided. Further, the holding portion 2b is fixed to the receiving surface 1d by a long screw 4, and in order to secure conduction between the receiving surface 1d and the lid 2 and for vibration isolation, the holding portion 2b is electrically conductive on the lower portion of the holding portion 2b or on the receiving surface 1d. A rubber 5 is provided. In addition, each of the conductive treatment layers is formed by using a conductive paint that emits less gas. In addition, as shown in FIG. 2, a conductor plate 6 in which the bottom side and the bottom surface 1b of the wall surface 1a of the mold 1 are formed of a galvalume steel plate.
And the inclined surface 7 is formed. The conductor plate 6
Is a long one and functions like a skirting board.
It is fixed to the wall 100 and the bottom 101 with screws 103.

According to the above, the mold 1 made of a galvalume steel plate and the surface of the floor 21 having the conductive treatment layer on the surface and the surface of the lid 2 are electrically connected to each other. By grounding the frame 1, the mold 1 and the conductive treatment layer have a uniform potential, and the charging current of the mold 1 and the conductive treatment layer can be quickly released to the ground. Further, since the conductive treatment layer is also provided on the inner wall surface 1a of the mold 1 which is most easily charged with electric charges, the antistatic effect in the wiring storage pit 47 can be improved. Further, it is possible to prevent dust from adhering due to static electricity and reduce dust contamination in the clean room. Further, since the inclined surface 7 is provided on the bottom side of the inner surface of the form 1, dust accumulation at the bottom corner of the pit can be prevented, and dust contamination in the clean room can be prevented. Further, with the above-described antistatic and dust prevention structure, it is possible to prevent the generation of gas caused by the reaction of organic substances due to electrostatic sparks and reduce the gas pollution in the clean room. Further, since the conductive treatment layer is formed by using a conductive paint having a small gas emission, it is possible to suppress the gas emission from the conductive treatment layer and the gas generation from the concrete, and cause a trouble in semiconductor manufacturing. It is possible to suppress the gas that becomes. That is, gas pollution in the clean room can be reduced.

[0008]

According to the first aspect of the present invention, the inner surface of the hole is formed of the conductor plate, and the conductive surface and the surface of the floor and the lid are electrically connected to each other, so that the antistatic effect is excellent. You can get the wiring storage pit in the clean room. According to the second aspect, since the inclined surface is provided on the bottom side of the inner surface of the pit hole, dust accumulation at the bottom corner of the pit can be prevented, and dust contamination in the clean room can be prevented. According to the third aspect, since the conductive treatment is performed with the conductive paint having a small gas emission, the gas contamination in the clean room can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view of a wiring storage pit in a clean room according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the bottom of the wiring storage pit according to the embodiment.

FIG. 3 is a cross-sectional view showing an outline of a clean room adopting the wiring storage pit according to the embodiment.

[Explanation of symbols]

1 Formwork (conductor plate), 1a wall surface, 1b bottom surface, 7 inclined surface, 22 pit holes.

Continued front page    (72) Inventor Takahisa Yamada             No. 2 Tsukutocho, Shinjuku-ku, Tokyo Co., Ltd.             Kumagai Gumi Tokyo Head Office (72) Inventor Hiroshi Kakuhama             26-20 Tatemachi, Aoba-ku, Sendai City, Miyagi Prefecture Stock Association             Company Kumagaya Gumi Tohoku Branch (72) Inventor Katsunori Nakazawa             26-20 Tatemachi, Aoba-ku, Sendai City, Miyagi Prefecture Stock Association             Company Kumagaya Gumi Tohoku Branch (72) Inventor Hirokazu Suzuki             No. 2 Tsukutocho, Shinjuku-ku, Tokyo Co., Ltd.             Kumagai Gumi Tokyo Head Office (72) Inventor Kenji Muraoka             26-20 Tatemachi, Aoba-ku, Sendai City, Miyagi Prefecture Stock Association             Company Kumagaya Gumi Tohoku Branch (72) Inventor Masayasu Miura             13-1, Kita 2-jo Nishi, Chuo-ku, Sapporo-shi, Hokkaido               Kumagai Gumi Hokkaido Branch F term (reference) 3L058 BF09                 5G357 DA05 DB01 DC05 DD02 DD06                       DD14 DE03 DE08                 5G363 AA09 BA01 DB11 DB25

Claims (3)

[Claims] 1. A wiring storage pit which is formed on a floor of a clean room and is formed by covering a pit hole extending along the floor with a lid, wherein the inner surface of the pit hole is formed of a conductive plate and is subjected to a conductive treatment. A wiring storage pit in a clean room, characterized in that the floor surface and the lid surface are electrically connected to the conductor plate. 2. The inner surface of the pit hole is connected to the bottom side wall surface and the bottom surface by an inclined surface.
Wiring storage pit in the clean room described in. 3. The wiring accommodating pit for a clean room according to claim 1 or 2, wherein the conductive treatment is performed with a conductive paint having a small gas emission.