JP2003215170A - Current sensor - Google Patents

Current sensor

Info

Publication number
JP2003215170A
JP2003215170A JP2002016260A JP2002016260A JP2003215170A JP 2003215170 A JP2003215170 A JP 2003215170A JP 2002016260 A JP2002016260 A JP 2002016260A JP 2002016260 A JP2002016260 A JP 2002016260A JP 2003215170 A JP2003215170 A JP 2003215170A
Authority
JP
Japan
Prior art keywords
current sensor
magnetic
core
magnetic gap
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002016260A
Other languages
Japanese (ja)
Inventor
Tadashi Kimura
義 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
NEC Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp
Priority to JP2002016260A priority Critical patent/JP2003215170A/en
Publication of JP2003215170A publication Critical patent/JP2003215170A/en
Pending legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive current sensor easy to be assembled, and requiring no adjustment. <P>SOLUTION: In this current sensor having a core butted with a pair of core pieces comprising ferromagnetic substance to form a closed magnetic path including a magnetic gap, and an IC built-in MR element arranged inside the magnetic gap, the paired core pieces formed into U-shaped core pieces having step differences in respective open parts, respective one-side end parts are butted each other, and the other-side end parts are opposed each other so as to form the magnetic gap. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、コイルと感磁素子
を用いて電流を検出する電流センサに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a current sensor that detects a current using a coil and a magnetic sensing element.

【0002】[0002]

【従来の技術】図3は、従来の一般的な電流センサの説
明図であり、図3(a)は、電流検出部と回路基板との
組み合わせ前の状態図であり、図3(b)は、電流検出
部と回路基板とを組み立てた状態を示す図、図3(c)
は、図3(b)の全体をモールド処理して電流センサを
形成した図である。
2. Description of the Related Art FIG. 3 is an explanatory view of a conventional general current sensor, FIG. 3 (a) is a state diagram before combination of a current detection portion and a circuit board, and FIG. FIG. 3C is a diagram showing a state in which the current detection unit and the circuit board are assembled.
FIG. 4 is a diagram in which a current sensor is formed by molding the whole of FIG. 3 (b).

【0003】ここで、図3において、電流センサは、1
箇所の磁気ギャップを有する磁性コア10と、直接、前
記磁性コアに巻線を施し、プラスチック製のフォルダ1
4に収納し、電子部品が実装されたセラミック基板11
に取り付ける。個々の回路調整については、セラミック
基板11のシート状態にて、所定の電圧に入るよう、レ
ーザーにて回路素子を全数トリミングして調整を行う。
Here, in FIG. 3, the current sensor is 1
A magnetic core 10 having a magnetic gap at one location and a plastic folder 1 which is formed by directly winding the magnetic core.
Ceramic board 11 housed in 4 and mounted with electronic components
Attach to. For individual circuit adjustment, all the circuit elements are trimmed with a laser so that a predetermined voltage is applied in the sheet state of the ceramic substrate 11 for adjustment.

【0004】従来の電流センサの組立工程について、以
下に示す。図3において、まずギャップを有する磁性コ
ア10に巻線材にて巻線を行い、固定用のフォルダー1
4に収納し、電流検出部12を得る。
The assembly process of the conventional current sensor will be described below. In FIG. 3, first, a magnetic core 10 having a gap is wound with a winding material, and a fixing folder 1 is attached.
4 to obtain the current detector 12.

【0005】抵抗を印刷したセラミック基板11に、電
流検出部12を取り付け、接着剤で固定する。電流検出
器のリード線2本をセラミック基板指定のスルホール穴
に挿入し、半田ディップし固定する。最終的には、含浸
材にて外装をディップして電流センサ15を得る。
A current detecting portion 12 is attached to a ceramic substrate 11 on which a resistor is printed, and fixed with an adhesive. Insert the two lead wires of the current detector into the through-holes specified on the ceramic board, and then dip and fix them with solder. Finally, the current sensor 15 is obtained by dipping the exterior with an impregnating material.

【0006】この電流センサは、以下のようにして使用
される。測定しようとする電流を製品端子のA、Bに接
続し電流検出部へ流す。この際に、電磁誘導作用によっ
て生じた磁束が磁性コアに沿って閉磁路を形成する。こ
の閉磁路中にある磁気ギャップの感磁素子13によって
磁束密度を検出する。この結果、磁束密度と比例関係に
ある電流を検出する。
This current sensor is used as follows. The current to be measured is connected to the product terminals A and B and is passed to the current detector. At this time, the magnetic flux generated by the electromagnetic induction action forms a closed magnetic path along the magnetic core. The magnetic flux density is detected by the magnetic sensitive element 13 in the magnetic gap in the closed magnetic circuit. As a result, a current proportional to the magnetic flux density is detected.

【0007】[0007]

【発明が解決しようとする課題】しかし、上記例も含
め、従来の電流センサにおいては、感磁素子からでた出
力を増幅し、更に、コンパレータ回路にてL、Hの信号
に変換しており、個々に電圧のトリミング調整が必要
で、電子部品、実装状態を考えると、安価なセンサを供
給することが困難になってきた。
However, in the conventional current sensor including the above example, the output from the magnetic sensitive element is amplified and further converted into L and H signals by the comparator circuit. Since it is necessary to individually adjust the voltage trimming, it becomes difficult to supply an inexpensive sensor considering the electronic components and the mounting state.

【0008】また、使用している感磁素子は、熱履歴を
持ちやすく、特性が安定するまで時間がかかる。また、
吸湿すると、特性が変化するため、扱いが困難である。
作業上、熱を加える工程があるため、これらの性質は、
工程内での停滞等、製造工程における煩わしい作業の原
因となっていた。
Further, the magneto-sensitive element used is likely to have a thermal history, and it takes time for the characteristics to stabilize. Also,
When it absorbs moisture, its characteristics change, which makes it difficult to handle.
In terms of work, there is a process of applying heat, so these properties are
This has been a cause of troublesome work in the manufacturing process such as stagnation in the process.

【0009】また、磁性コアは、一体のものを使用して
おり、セラミック基板との固定方法は、接着材での仮固
定後、最終的には、フェノール樹脂での固定であり、フ
ェノール樹脂の乾燥は、高温で乾燥させるため、感磁素
子の特性が不安定になりやすかった。
Further, the magnetic core is an integral one, and the method of fixing the magnetic core to the ceramic substrate is temporary fixing with an adhesive and finally fixing with a phenol resin. Since the drying is performed at a high temperature, the characteristics of the magnetic sensitive element are likely to be unstable.

【0010】本発明の課題は、低コストで、組立て易
い、また調整を必要としない電流センサを提供すること
である。
It is an object of the present invention to provide a current sensor that is low in cost, easy to assemble and does not require adjustment.

【0011】[0011]

【課題を解決するための手段】前記技術的課題を解決す
るために、本発明の電流センサでは、従来の感磁素子か
ら、IC内蔵MR素子に変更する。本素子には、L→H
切り替えの回路が内蔵してあり、磁性コアのギャップ、
巻数で磁気感度を決定すれば、周辺回路の削減または、
調整工数の削減が可能であることを特徴とする電流セン
サが得られる。
In order to solve the above technical problems, in the current sensor of the present invention, the conventional magnetic sensing element is changed to the MR element with a built-in IC. This element has L → H
The switching circuit is built-in, the gap of the magnetic core,
If the magnetic sensitivity is determined by the number of turns, reduction of peripheral circuits or
A current sensor characterized in that the number of adjustment steps can be reduced can be obtained.

【0012】また、本発明によれば、磁性コアをL型の
2分割コアに構成し、巻線ボビン片の中央を中空部に
し、巻き線ボビン片の両サイドからL型のコアを挿入
し、磁性コア同士の接続は、ピン構造、リベット構造も
くしはハトメ構造によって接続固定することを特徴とす
る電流センサが得られる。
Further, according to the present invention, the magnetic core is formed into an L-shaped two-divided core, the center of the winding bobbin piece is hollow, and the L-shaped core is inserted from both sides of the winding bobbin piece. A magnetic sensor is obtained in which the magnetic cores are connected and fixed by a pin structure, a rivet structure or an eyelet structure.

【0013】また、本発明によれば、IC内蔵MR素子
のバラツキを調整する方法として、素子周辺または、上
下面に薄板の磁性材料を設置することで、バイアス効果
でバラツキを押さえることで、調整工数の削減が可能で
ある電流センサが得られる
Further, according to the present invention, as a method of adjusting the variation of the MR element with built-in IC, by installing a thin magnetic material around the element or on the upper and lower surfaces, the variation is suppressed by the bias effect. A current sensor that can reduce man-hours can be obtained.

【0014】また、本発明によれば、セラミック基板と
磁性コアとの押さえとして、成形品のケースを使用する
ことで、簡易に押さえることができ、感磁素子に悪影響
を与えない特性が安定した電流検出器が得られる。
Further, according to the present invention, by using the case of the molded product as the pressing between the ceramic substrate and the magnetic core, the pressing can be easily carried out and the characteristic which does not adversely affect the magnetic sensitive element is stabilized. A current detector is obtained.

【0015】[0015]

【実施例】以下、図面を参照して、本発明の実施例によ
る電流センサを説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A current sensor according to an embodiment of the present invention will be described below with reference to the drawings.

【0016】図1は、本発明の実施例による電流センサ
の説明図である。図1(a)は、分解斜視図であり、図
1(b)は、電流センサの斜視図である。図2は、本発
明の実施例による電流センサの樹脂ケースによる固定の
説明図である。図2(a)は、電流センサ単体の平面図
であり、図2(b)は、樹脂ケースによって電流センサ
が固定された状態を示す図である。
FIG. 1 is an explanatory diagram of a current sensor according to an embodiment of the present invention. FIG. 1A is an exploded perspective view, and FIG. 1B is a perspective view of a current sensor. FIG. 2 is an explanatory view of fixing the current sensor according to the embodiment of the present invention with a resin case. 2A is a plan view of the current sensor alone, and FIG. 2B is a view showing a state in which the current sensor is fixed by a resin case.

【0017】図1にて、本発明の電流センサは、強磁性
体から成るコの字型コア20a,20bと巻線60を施
すボビン30,回路基板40、バイアス用磁性材料80
とを有している。ボビン30には、角形の貫通孔を有す
る筒状部に巻線60が巻線されており、そのリード線
は、ボビン30の端子に直接巻き付けて半田上げされて
いる。
Referring to FIG. 1, the current sensor of the present invention comprises a U-shaped core 20a, 20b made of a ferromagnetic material, a bobbin 30 provided with a winding 60, a circuit board 40, and a bias magnetic material 80.
And have. A winding 60 is wound around a cylindrical portion having a rectangular through hole on the bobbin 30, and the lead wire is directly wound around the terminal of the bobbin 30 and soldered.

【0018】磁性コア20は、開放部が段差を持つコの
字型コア20aおよび20bとから成る。まず、片方の
コの字型コア20aをボビンの前記貫通孔に挿入し、逆
の貫通孔からIC内蔵MR素子を実装した基板を挿入す
る。バイアスコアとして、あらかじめ素子周辺または、
上下面に薄板の磁性材料20を設置して置く。さらに、
コの字型コア20aおよび20bとが一箇所のハトメ9
0にて突き合わせ面において突き合わされ、コの字型コ
ア20aと20bとの固定用ハトメ90にて接続され
る。ここで、固定構造はハトメ90には限定されず、ピ
ン構造、またはリベット構造でも良い。
The magnetic core 20 is composed of U-shaped cores 20a and 20b whose open portions have steps. First, one U-shaped core 20a is inserted into the through hole of the bobbin, and the substrate on which the MR element with a built-in IC is mounted is inserted from the opposite through hole. As a bias core, in advance around the element or
A thin magnetic material 20 is installed and placed on the upper and lower surfaces. further,
Eyelet 9 with U-shaped cores 20a and 20b in one place
No. 0 is abutted on the abutting surface, and the U-shaped cores 20a and 20b are connected by a fixing eyelet 90. Here, the fixing structure is not limited to the eyelet 90, and may be a pin structure or a rivet structure.

【0019】また、樹脂カバー50a,50bは、両サ
イドから挟み込む形状とし、磁性コアを押さえる構造に
することで、耐振動性が向上し、信頼性が高まる。
Further, the resin covers 50a and 50b are shaped so as to be sandwiched from both sides and have a structure that holds down the magnetic core, so that vibration resistance is improved and reliability is increased.

【0020】この電流センサは、以下のようにして使用
される。測定しようとする電流を製品端子のA、Bに接
続し電流センサへ流す。この際に、電磁誘導作用によっ
て生じた磁束か磁性コアに沿って閉磁路を形成する。こ
の閉磁路中にある磁気ギャップの感磁素子によって磁束
密度を検出する。この結果、磁束密度と比例関係にある
電流を検出する。
This current sensor is used as follows. The current to be measured is connected to the product terminals A and B and sent to the current sensor. At this time, the magnetic flux generated by the electromagnetic induction action forms a closed magnetic path along the magnetic core. The magnetic flux density is detected by the magnetic sensitive element of the magnetic gap in the closed magnetic circuit. As a result, a current proportional to the magnetic flux density is detected.

【0021】[0021]

【発明の効果】本発明による電流検出器は、IC内蔵M
R素子を使用することで、周辺回路の削除、および素子
のバラツキ調整として、磁性材料を素子周辺または、上
下面に薄板を貼り付けることで、調整工数の削減ができ
る。
The current detector according to the present invention has a built-in IC M
By using the R element, the number of adjustment steps can be reduced by attaching a thin plate around the element or on the upper and lower surfaces of the magnetic material for deleting the peripheral circuit and adjusting the variation of the element.

【0022】また、一対のコア片が、それぞれL型にな
っているため、各一方の端部が互いに突き合わさり、各
他方の端部が互いに対向して磁気ギャップを形成するた
め、突き合わせ面が一箇所となり、漏れ磁束が小さく、
感度が良い。また、L型の固定方法は、ピン構造、リベ
ット構造、もくしはハトメ構造によって行うため、従来
の外装フェノール樹脂で固定するより、はるかに信頼性
は高い。
Further, since the pair of core pieces are each L-shaped, one end of each abuts each other, and the other end of each abuts each other to form a magnetic gap. There is only one place, the leakage flux is small,
It has good sensitivity. Further, since the L-shaped fixing method is performed by a pin structure, a rivet structure, and a comb structure, it is much more reliable than fixing with a conventional exterior phenol resin.

【0023】また、樹脂カバーで全体を覆うことで、従
来の熱を印加して乾燥させる必要性がないため、IC内
蔵MR素子に対して熱等による悪影響を及ぼすことは、
無い。さらに、樹脂カバーを両サイドからはめ込むこと
で、基板と磁性コアの固定もできるため、耐振動性にも
強い。
Further, by covering the whole with a resin cover, there is no need to apply heat to dry the conventional MR element, so that the MR element with a built-in IC may be adversely affected by heat or the like.
There is no. Furthermore, by fitting the resin cover from both sides, it is possible to fix the substrate and the magnetic core, which is also highly resistant to vibration.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例による電流センサの説明図。図
1(a)は、分解斜視図、図1(b)は、電流センサの
斜視図。
FIG. 1 is an explanatory diagram of a current sensor according to an embodiment of the present invention. FIG. 1A is an exploded perspective view, and FIG. 1B is a perspective view of a current sensor.

【図2】本発明の実施例による電流センサの樹脂ケース
による固定の説明図。図2(a)は、電流センサ単体の
平面図、図2(b)は、樹脂ケースによって電流センサ
が固定された状態を示す図。
FIG. 2 is an explanatory view of fixing a current sensor according to an embodiment of the present invention with a resin case. 2A is a plan view of the current sensor alone, and FIG. 2B is a view showing a state in which the current sensor is fixed by a resin case.

【図3】従来の一般的な電流センサの説明図。図3
(a)は、電流検出部と回路基板との組み合わせ前の状
態図、図3(b)は、電流検出部と回路基板とを組み立
てた状態を示す図、図3(c)は、図3(b)の全体を
モールド処理して電流センサを形成した図。
FIG. 3 is an explanatory diagram of a conventional general current sensor. Figure 3
3A is a state diagram before the current detection unit and the circuit board are combined, FIG. 3B is a diagram showing a state in which the current detection unit and the circuit board are assembled, and FIG. The figure which formed the electric current sensor by mold-processing the whole (b).

【符号の説明】[Explanation of symbols]

10,20 磁性コア 20a,20b (開放部が段差を持つ)コの字型コ
ア 11 セラミック基板 12 電流検出部 13 感磁素子 14 フォルダ 15 電流センサ 30 ボビン 40 回路基板 50a,50b 樹脂カバー 60 巻線 70 IC内蔵MR素子 80 バイアス用磁性材料 90 ハトメ
10, 20 Magnetic cores 20a, 20b (open portion has a step) U-shaped core 11 Ceramic substrate 12 Current detector 13 Magnetic sensing element 14 Folder 15 Current sensor 30 Bobbin 40 Circuit board 50a, 50b Resin cover 60 Winding 70 MR element with built-in IC 80 Magnetic material for bias 90 Eyelet

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 磁気ギャップを含む閉磁路を形成するよ
うに強磁性体からなる一対のコア片を突き合わせて成る
コアと、前記磁気ギャップ内に配置されるIC内蔵MR
素子とを有する電流センサにおいて、前記一対のコア片
は、それぞれ開放部が段差を持つコの字型コアとし、各
一方の端部が互いに突き合わされると共に、各他方の端
部が互いに対向して、前記磁気ギャップを形成すること
を特徴とする電流センサ。
1. A core formed by abutting a pair of core pieces made of a ferromagnetic material so as to form a closed magnetic circuit including a magnetic gap, and an IC built-in MR arranged in the magnetic gap.
In the current sensor having an element, the pair of core pieces are U-shaped cores each having an open portion with a step, each one end is abutted against each other, and each other end is opposed to each other. And forming the magnetic gap.
【請求項2】 前記磁気ギャップ内に発生する磁気量を
検出する素子は、IC内蔵MR素子であることを特徴と
する請求項1に記載の電流センサ。
2. The current sensor according to claim 1, wherein the element that detects the amount of magnetism generated in the magnetic gap is an MR element with a built-in IC.
【請求項3】 前記IC内蔵MR素子の近傍に磁性材料
を配置し、磁気バイアスを利用して、IC内蔵MR素子
感度のバラツキを調整したことを特徴とする請求項1ま
たは2に記載の電流センサ。
3. The current according to claim 1, wherein a magnetic material is arranged in the vicinity of the MR element with a built-in IC, and a variation in sensitivity of the MR element with a built-in IC is adjusted by utilizing a magnetic bias. Sensor.
【請求項4】 前記電流センサでの基板と、磁気ギャッ
プを形成したコアを、2個の樹脂カバーを挟みこむこと
で固定したことを特徴とする請求項1ないし3のいずれ
かに記載の電流センサ。
4. The current sensor according to claim 1, wherein the substrate of the current sensor and the core having a magnetic gap are fixed by sandwiching two resin covers. Sensor.
JP2002016260A 2002-01-25 2002-01-25 Current sensor Pending JP2003215170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002016260A JP2003215170A (en) 2002-01-25 2002-01-25 Current sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002016260A JP2003215170A (en) 2002-01-25 2002-01-25 Current sensor

Publications (1)

Publication Number Publication Date
JP2003215170A true JP2003215170A (en) 2003-07-30

Family

ID=27652377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002016260A Pending JP2003215170A (en) 2002-01-25 2002-01-25 Current sensor

Country Status (1)

Country Link
JP (1) JP2003215170A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148675B2 (en) 2004-04-23 2006-12-12 Denso Corporation Ring type current sensor
JP2008506944A (en) * 2004-07-16 2008-03-06 リエゾン、エレクトロニク−メカニク、エルウエム、ソシエテ、アノニム Current sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148675B2 (en) 2004-04-23 2006-12-12 Denso Corporation Ring type current sensor
JP2008506944A (en) * 2004-07-16 2008-03-06 リエゾン、エレクトロニク−メカニク、エルウエム、ソシエテ、アノニム Current sensor
JP4796060B2 (en) * 2004-07-16 2011-10-19 リエゾン、エレクトロニク−メカニク、エルウエム、ソシエテ、アノニム Current sensor

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