JP2003214767A - Dripping device - Google Patents
Dripping deviceInfo
- Publication number
- JP2003214767A JP2003214767A JP2002011608A JP2002011608A JP2003214767A JP 2003214767 A JP2003214767 A JP 2003214767A JP 2002011608 A JP2002011608 A JP 2002011608A JP 2002011608 A JP2002011608 A JP 2002011608A JP 2003214767 A JP2003214767 A JP 2003214767A
- Authority
- JP
- Japan
- Prior art keywords
- warm air
- substrate
- dripping
- drying box
- blowing nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Solid Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はその表面に金属皮膜
を形成させた絶縁フィルムヘ電気めっき後の最終水切り
工程についてのものである。TECHNICAL FIELD The present invention relates to a final draining step after electroplating an insulating film having a metal film formed on its surface.
【0002】[0002]
【従来の技術】近年電子機器の小型化に伴い使用される
電子部品も小型化が要求される様になってきている。こ
のような電子部品の1つにフレキシブル配線板がある。
このフレキシブル配線板を製造するために用いられる基
板として、絶縁体フィルム表面に直接導電層を設けった
ものがある。例えば、絶縁体フィルム上にスパッタリン
グ法や無電解メッキ法や蒸着法により直接導電層を設け
た金属被覆基板である。これらの基板を用いれば、これ
らの基板は導電層と絶縁体との問に接着剤層などの第3
層を含まないため、電気特性の良い高密度の配線板が得
られる。このため、これらの基板は非常に大きな注目を
集めている。2. Description of the Related Art In recent years, with the miniaturization of electronic equipment, electronic components used are also required to be miniaturized. A flexible wiring board is one of such electronic components.
As a substrate used for manufacturing this flexible wiring board, there is one in which a conductive layer is directly provided on the surface of an insulating film. For example, it is a metal-coated substrate in which a conductive layer is directly provided on an insulating film by a sputtering method, an electroless plating method, or a vapor deposition method. If these substrates are used, these substrates may have a third layer such as an adhesive layer as well as a conductive layer and an insulator.
Since no layer is included, a high-density wiring board having good electrical characteristics can be obtained. Therefore, these substrates have received a great deal of attention.
【0003】これらの基板が実用化されるに伴い、これ
らの基板材料を低コストで製造する技術が求められ、種
々の方法が検討されるようになった。その中の有力な方
法の一つが絶縁フィルム表面に極めて薄い金属皮膜を無
電解メッキや蒸着などの方法で形成し、その後電気めっ
き法により金属皮膜を所定の厚みまで厚くするものであ
る。As these substrates have been put into practical use, a technique for producing these substrate materials at low cost has been required, and various methods have been studied. One of the most effective methods is to form an extremely thin metal film on the surface of the insulating film by a method such as electroless plating or vapor deposition, and then increase the metal film to a predetermined thickness by electroplating.
【0004】ところで、電気めっき後の最終工程では、
水洗後、水切り工程が一般的に設けられている。最終工
程で、水切りや、乾燥が不十分であると、基板表面に水
滴が残り、外観ムラや、酸化の原因となり、品質が低下
するからである。By the way, in the final step after electroplating,
After washing with water, a draining step is generally provided. This is because if water is not drained or dried in the final step, water droplets remain on the surface of the substrate, which causes unevenness in appearance and oxidation, which deteriorates the quality.
【0005】[0005]
【発明が解決しようとする課題】本発明は上記状況の下
に行われたものであり、電子部品用基材として金属被覆
基板を電気めっきにより製造するに際し、安価で、確実
に水切りを可能とする装置の提供を目的とするものであ
る。SUMMARY OF THE INVENTION The present invention has been made under the above circumstances, and when manufacturing a metal-coated substrate as a base material for electronic parts by electroplating, it is possible to reliably drain water at low cost. The purpose of the present invention is to provide a device.
【0006】[0006]
【課題を解決するための手段】上記課題を解決する本発
明は、フィルム状導体をリール・トウ・リール方式でめ
っき槽外部で給電して電気メッキを施して基板を得るた
めの製造工程の最終水切り乾燥工程で用いられる水切り
装置であり、前段に設けられたゴム硬度40〜50の水
切りゴムローラと、後段に設けられた温風吹き当てノズ
ルと排気ノズルとを有する乾燥ボックスとから構成され
るものである。そして、好ましくは温風吹き当てノズル
より吹き出された温風が乾燥ボックス内を通過する基板
表面に吹き当てられるようにされているものであり、よ
り好ましくは該吹き当てノズルが、吹き当て方向が可変
なように回転可能に設けられているものである。SUMMARY OF THE INVENTION The present invention for solving the above-mentioned problems is a final step of a manufacturing process for obtaining a substrate by supplying electric power to a film conductor in a reel-to-reel system outside a plating tank to perform electroplating. A draining device used in a draining and drying step, which comprises a draining rubber roller having a rubber hardness of 40 to 50 provided in a preceding stage, and a drying box having a warm air blowing nozzle and an exhaust nozzle provided in a subsequent stage. Is. And, it is preferable that the warm air blown out from the warm air blowing nozzle is blown to the substrate surface passing through the inside of the drying box, and more preferably, the blowing nozzle has a blowing direction. It is rotatably provided so as to be variable.
【0007】[0007]
【発明の実施の形態】フィルム状導体をリール・トウ・
リール方式で電気メッキされた後、水洗された搬送され
る基板に付着している水は、水切りゴムローラで絞り落
とされる。そして、絞りきれなかった基板表面の残水
は、温風用ノズルから吹きつけられる温風によって、吹
き飛ばされ、乾燥される。BEST MODE FOR CARRYING OUT THE INVENTION
After being electroplated by the reel system, the water adhering to the transported substrate that has been washed with water is squeezed out by a drain rubber roller. Then, the residual water on the surface of the substrate that cannot be squeezed is blown off and dried by the warm air blown from the hot air nozzle.
【0008】しかし、通常使われているゴム硬度60程
度のゴムローラでは、完全に水は、切れず、部分的に大
きな水滴が残ってしまい、次工程での温風による吹き飛
ばし除去する工程で完全に吹き飛ばすことができず、完
全に乾燥できず、基板に乾燥むらによるシミついてしま
い、基板外観を悪化させてしまう。However, in a commonly used rubber roller having a rubber hardness of about 60, the water is not completely cut off, and large water droplets remain partially, so that the water is completely blown away by the warm air in the next step. It cannot be blown off, cannot be completely dried, and stains are formed on the substrate due to uneven drying, which deteriorates the appearance of the substrate.
【0009】また、ゴムローラの変わりに、スポンジロ
ーラを設置し、水滴を微細化して次工程での温風による
吹き飛ばし、乾燥を容易にすることも考えられるが、ス
ポンジローラは、汚れやすく、基板にその汚れが、再付
着するという問題がある。It is also conceivable to install a sponge roller instead of the rubber roller to make water droplets fine and blow them off with warm air in the next step to facilitate drying. There is a problem that the dirt is redeposited.
【0010】さらに、ゴムローラの変わりにバキューム
ローラを設置し、水分を吸引除去することが提案されて
いるが、装置が非常に高価になってしまう問題がある。Further, it has been proposed to install a vacuum roller instead of the rubber roller to suck and remove water, but there is a problem that the apparatus becomes very expensive.
【0011】本発明者らは鋭意、研究した結果、最終水
切り乾燥工程で、前段に水切りローラとしてゴム硬度4
0〜50のゴムローラを設置し、その後、乾燥ボックス
内で温風乾燥することにより前記課題を解決できること
を見いだした。本発明において乾燥ボックス内では乾燥
用の温風を吹き当てる温風吹き当てノズルと温風を乾燥
ボックス外へ排出する排気ノズルとを設ける。こうする
ことにより、乾燥ボックス内で温風に流れがつき、かつ
乾燥ボックス内の温度の上昇による影響を低減できる。The inventors of the present invention have earnestly studied and as a result, in the final draining and drying step, the rubber hardness of 4 was used as the draining roller in the preceding stage.
It was found that the above problem can be solved by installing a rubber roller of 0 to 50 and then drying with warm air in a drying box. In the present invention, a warm air blowing nozzle for blowing warm air for drying and an exhaust nozzle for discharging the warm air out of the drying box are provided in the drying box. By doing so, warm air can flow in the drying box, and the influence of the temperature increase in the drying box can be reduced.
【0012】ゴムローラのゴム硬度が50を越えると、
ゴムローラと基板との接触が、全幅に対して、確保でき
ないため、水切り性が悪くなり、基板表面に水滴が残っ
てしまう。また、逆に、ゴム硬度が40を下回ると、ゴ
ム中の可塑剤成分が溶出して、基板に付着してめっきむ
ら等の原因になる。また、ゴム硬度が40を下回ると、
メガロス等の増加によって、搬送性が悪化し、シワ発生
の原因になってしまう。When the rubber hardness of the rubber roller exceeds 50,
Since the contact between the rubber roller and the substrate cannot be ensured over the entire width, the water draining property deteriorates and water drops remain on the substrate surface. On the contrary, when the rubber hardness is less than 40, the plasticizer component in the rubber is eluted and adheres to the substrate to cause uneven plating. If the rubber hardness is less than 40,
Due to the increase of megaloss and the like, the transportability is deteriorated and wrinkles are caused.
【0013】本発明のように乾燥ボックス内に温風の吹
き当てと温風の排出とを組み合わせることで、温風で吹
き飛ばした水分を速やかに、除去することができ、水切
り、乾燥された基板を高生産性で製造することが達成で
きる。By combining the blowing of warm air and the discharge of warm air in the drying box as in the present invention, the water blown off by the warm air can be quickly removed, and the drained and dried substrate is dried. Can be achieved with high productivity.
【0014】[0014]
【実施例】次に実施例を用いて本発明をさらに説明す
る。
(実施例)次に実施例を用いて本発明を説明する。EXAMPLES Next, the present invention will be further described with reference to examples. (Examples) Next, the present invention will be described using examples.
【0015】片面に厚さ0.2μmの銅被膜を設けた厚
さ50μm、幅508mmの銅被覆ポリイミドフィルム
の銅被膜上に最終銅厚みが15μmとなるようにロール
・トウ・ロール方式で電気銅めっきを行った。銅被覆ポ
リイミドフィルムの搬送速度は35m/hrとした。使
用した銅メッキ液は硫酸銅を主体とする通常のものであ
る。Electrolytic copper by a roll-to-roll system so that the final copper thickness is 15 μm on the copper coating of a copper-coated polyimide film having a thickness of 50 μm and a width of 508 mm with a copper coating having a thickness of 0.2 μm provided on one side. Plated. The transport speed of the copper-coated polyimide film was 35 m / hr. The copper plating solution used is a normal one mainly containing copper sulfate.
【0016】メッキ槽をでた後、図1の様に、乾燥ボッ
クスの前にゴム硬度40〜50の水切り用ゴムローラを
設置し、乾燥ボックス内に温風吹き当てノズルと排気ノ
ズルを設置して、乾燥処理を行った。なお、図1におい
て、温風吹き当てノズルは、温風の吹き出し方向を調節
できるように回転可能となっており、温風が全量銅被服
ポリイミドフィルム表面に当たるように調節した。After leaving the plating tank, as shown in FIG. 1, a water draining rubber roller having a rubber hardness of 40 to 50 is installed in front of the drying box, and a hot air blowing nozzle and an exhaust nozzle are installed in the drying box. , And dried. In FIG. 1, the hot air blowing nozzle was rotatable so that the blowing direction of the hot air could be adjusted, and the hot air was adjusted so that the entire amount of the hot air hits the surface of the copper-coated polyimide film.
【0017】得られた基板を調べたところ十分に乾燥さ
れ、表面状態の良好な基板であることがわかった。When the obtained substrate was examined, it was found that the substrate was sufficiently dried and had a good surface condition.
【0018】(比較例1)水切りローラとして用いるゴ
ムローラのゴム硬度を60とした以外は実施例と同様に
して基板を得た。得られた基板を調べたところ、基板表
面に水滴が残り、乾燥むらが発生していた。(Comparative Example 1) A substrate was obtained in the same manner as in the example except that the rubber hardness of the rubber roller used as the draining roller was changed to 60. When the obtained substrate was examined, water droplets remained on the substrate surface and uneven drying occurred.
【0019】(比較例2)水切りローラとして用いるゴ
ムローラのゴム硬度を30とした以外は実施例と同様に
して基板を作成した。しかしながら、基板にシワが発生
したので製造を中止した。(Comparative Example 2) A substrate was prepared in the same manner as in Example except that the rubber hardness of the rubber roller used as the draining roller was changed to 30. However, the production was discontinued because wrinkles occurred on the substrate.
【0020】[0020]
【発明の効果】本発明では、適切なゴム硬度の水切りロ
ーラと、乾燥ボックス内で温風乾燥をするため、水切り
と乾燥とがより確実にできる。また、乾燥ボックスはボ
ックスと温風吹き当てノズルと排気ノズルより構成する
ため、極めて安価にできる。According to the present invention, since the water draining roller having an appropriate rubber hardness and the warm air drying in the drying box are performed, the water draining and the drying can be performed more reliably. Further, since the drying box is composed of the box, the hot air blowing nozzle and the exhaust nozzle, it can be made extremely inexpensive.
【図1】本発明の水切り装置例を示した図である。FIG. 1 is a diagram showing an example of a water draining device of the present invention.
1−−−乾燥ボックス 2−−−ゴムローラ 3−−−温風吹き当てノズル 4−−−排気ノズル 5−−−基板 6−−−金属ローラ 1 --- drying box 2 --- Rubber roller 3 −−− Warm air blowing nozzle 4 --- Exhaust nozzle 5 --- substrate 6 --- Metal roller
Claims (3)
式でめっき槽外部で給電して電気メッキを施して基板を
得るための製造工程の水切り乾燥工程で用いられる水切
り装置であり、前段に設けられたゴム硬度40〜50の
水切りゴムローラと、後段に設けられた温風吹き当てノ
ズルと排気ノズルとを有する乾燥ボックスとから構成さ
れる水切り装置。1. A drainer used in a draining and drying process of a manufacturing process for obtaining a substrate by supplying electricity to a film conductor in a reel-to-reel system outside a plating tank to perform electroplating, and is provided in a preceding stage. A drainer including a draining rubber roller having a rubber hardness of 40 to 50, and a drying box having a hot air blowing nozzle and an exhaust nozzle provided in a subsequent stage.
が乾燥ボックス内を通過する基板表面に吹き当てられる
ようにされている請求項1記載の水切り装置。2. The drainer according to claim 1, wherein the warm air blown out from the warm air blowing nozzle is blown against the surface of the substrate passing through the inside of the drying box.
変なように回転可能に設けられている請求項1又は2記
載の水切り装置。3. The drainer according to claim 1, wherein the warm air blowing nozzle is rotatably provided so that the blowing direction can be changed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002011608A JP2003214767A (en) | 2002-01-21 | 2002-01-21 | Dripping device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002011608A JP2003214767A (en) | 2002-01-21 | 2002-01-21 | Dripping device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003214767A true JP2003214767A (en) | 2003-07-30 |
Family
ID=27649042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002011608A Pending JP2003214767A (en) | 2002-01-21 | 2002-01-21 | Dripping device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003214767A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010194413A (en) * | 2009-02-23 | 2010-09-09 | Nippon Steel Corp | Draining device for steel plate |
CN105989931A (en) * | 2015-03-20 | 2016-10-05 | 昭和电线电缆系统株式会社 | A superconducting wire manufacturing method and a superconducting wire manufacturing device |
CN109968559A (en) * | 2019-05-10 | 2019-07-05 | 勐腊田野橡胶销售有限责任公司 | A kind of rubber processing drying line |
-
2002
- 2002-01-21 JP JP2002011608A patent/JP2003214767A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010194413A (en) * | 2009-02-23 | 2010-09-09 | Nippon Steel Corp | Draining device for steel plate |
CN105989931A (en) * | 2015-03-20 | 2016-10-05 | 昭和电线电缆系统株式会社 | A superconducting wire manufacturing method and a superconducting wire manufacturing device |
JP2016178041A (en) * | 2015-03-20 | 2016-10-06 | 昭和電線ケーブルシステム株式会社 | Method for manufacturing superconducting wire rod, and apparatus for manufacturing superconducting wire rod |
CN109968559A (en) * | 2019-05-10 | 2019-07-05 | 勐腊田野橡胶销售有限责任公司 | A kind of rubber processing drying line |
CN109968559B (en) * | 2019-05-10 | 2021-03-23 | 勐腊田野橡胶销售有限责任公司 | Rubber processing drying line |
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