JP2003213488A - Electric contact member - Google Patents

Electric contact member

Info

Publication number
JP2003213488A
JP2003213488A JP2002012385A JP2002012385A JP2003213488A JP 2003213488 A JP2003213488 A JP 2003213488A JP 2002012385 A JP2002012385 A JP 2002012385A JP 2002012385 A JP2002012385 A JP 2002012385A JP 2003213488 A JP2003213488 A JP 2003213488A
Authority
JP
Japan
Prior art keywords
plating
alloy
alloy plating
plating layer
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002012385A
Other languages
Japanese (ja)
Inventor
Masaki Ito
雅樹 伊藤
Yukio Hiraoka
幸雄 平岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP2002012385A priority Critical patent/JP2003213488A/en
Publication of JP2003213488A publication Critical patent/JP2003213488A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Contacts (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve corrosion and abrasion resistances even when the plating layer of Au or an Au alloy is made thinner on an electric contact point or a connector member of which the electrically contacting surface of the electric contact point or connectors is plated with Au or Au alloy. <P>SOLUTION: In the electrical contact member which is composed of a conductive base metal having the electrically contacting surface plated with Au or an Au alloy, a PdCo alloy plating layer is interposed between the base metal and the Au or Au alloy plating layer. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は,導電用基体金属の
電気的接触表面にAuまたはAu合金めっきを施してな
る電気的接触用部材に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric contact member obtained by plating an electric contact surface of a conductive base metal with Au or an Au alloy.

【0002】[0002]

【従来の技術】電気接点やコネクター類では,耐摩耗性
や耐食性あるいは導電性の改善を目的として,導電用基
体金属の表面に,Sn,Ag,Au,Pd等のめっきま
たはそれらの合金めっきが施されている。そのうち,特
に信頼性の要求される部品では硬質AuまたはAu合金
めっきが施され,これらよりもさらに耐摩耗性に優れた
AuF/PdNi(AuフラッシュめっきされたPdN
i合金めっき)も,標準的な仕様として電気接点やコネ
クター類に採用されるようになった。
2. Description of the Related Art In the case of electrical contacts and connectors, plating of Sn, Ag, Au, Pd, etc. or their alloy plating is performed on the surface of a conductive base metal for the purpose of improving wear resistance, corrosion resistance or conductivity. It has been subjected. Among them, hard Au or Au alloy plating is applied to parts that require particularly high reliability, and AuF / PdNi (Au flash-plated PdN that has even better wear resistance than these is used.
i alloy plating) has also come to be adopted as standard specifications for electrical contacts and connectors.

【0003】[0003]

【発明が解決しようとする課題】AuまたはAu合金め
っきは高価であり,AuF/PdNiも高価である。し
たがって,その薄膜化によるコスト削減が望まれるが,
硬質Auめっきの場合にはめっき厚をあまり薄くすると
ピンホールが増えるので耐食性が低下するという問題が
あり,AuF/PdNiめっきでは薄膜化すると耐摩耗
性が膜厚に比例して低下するという問題があり,その特
質を失う結果となる。
Au or Au alloy plating is expensive, and AuF / PdNi is also expensive. Therefore, cost reduction by thinning the film is desired,
In the case of hard Au plating, there is a problem that if the plating thickness is too thin, the number of pinholes increases, so the corrosion resistance decreases, and in AuF / PdNi plating, there is a problem that the wear resistance decreases in proportion to the film thickness when the film thickness is reduced. Yes, it results in the loss of that quality.

【0004】本発明の課題はこのような問題を解決する
ことにあり,AuまたはAu合金めっき層を薄膜化し,
さらにPdを含む合金めっき層を薄膜化しても,優れた
耐食性,耐摩耗性を具備する電気的接触用部材を得るこ
とにある。
An object of the present invention is to solve such a problem, and to reduce the thickness of Au or Au alloy plating layer,
Further, it is to obtain an electrical contact member having excellent corrosion resistance and wear resistance even if the alloy plating layer containing Pd is thinned.

【0005】[0005]

【課題を解決するための手段】本発明によれば,導電用
基体金属の電気的接触表面にAuまたはAu合金めっき
を施してなる電気的接触用部材において,該基体金属と
AuまたはAu合金めっき層の間にPdCo合金めっき
層を介在させたことを特徴とする電気的接触用部材を提
供する。さらに本発明は,導電用基体金属の電気的接触
表面にAuまたはAu合金めっきを施してなる電気的接
触用部材において,該基体金属とAuまたはAu合金め
っき層の間にNiめっき層とPdCo合金めっき層を,
Niめっき層を基体金属側にして介在させたことを特徴
とする電気的接触用部材を提供するものである。いずれ
の場合も,AuまたはAu合金めっき層はその最外表面
に封孔処理を施すことができる。
According to the present invention, there is provided an electrical contact member comprising an electrically contacting surface of an electrically conductive base metal plated with Au or an Au alloy, and the base metal and Au or Au alloy plating. There is provided a member for electrical contact characterized in that a PdCo alloy plating layer is interposed between the layers. Further, the present invention relates to an electrical contact member obtained by plating an electrical contact surface of a conductive base metal with Au or an Au alloy, wherein a Ni plating layer and a PdCo alloy are provided between the base metal and the Au or Au alloy plating layer. Plating layer,
The present invention provides a member for electrical contact, characterized in that a Ni plating layer is provided on the metal side of the base material. In any case, the Au or Au alloy plating layer can be subjected to a sealing treatment on the outermost surface thereof.

【0006】[0006]

【発明の実施の形態】電気接点やコネクタ類の表面処理
として,AuまたはAu合金めっきを施す場合,コスト
低減の点から硬質Auめっき(例えばAuCoめっき)
のめっき厚を薄くするとピンホールが増えるので耐食性
が低下する。この薄膜化による耐食性の低下は,ピンホ
ールを埋める封孔処理(潤滑処理とも呼ばれる)によっ
て或る程度抑制できるが,その効果は不十分であり,局
部電池形成による腐食を抑えることが必要である。Pd
Ni合金めっきしてから硬質Auめっきすると耐食性は
改善されるが,膜厚を薄くすると耐摩耗性は低下してし
まう。この場合,最外表面を潤滑処理した場合でも耐摩
耗性の向上に対して不十分であり,基本的にはめっき皮
膜の硬度を上げて摩耗量を減少させることが必要である
ところ,PdNi合金めっきでは硬度の向上作用が十分
ではないものと考えられる。
BEST MODE FOR CARRYING OUT THE INVENTION When Au or Au alloy plating is applied as a surface treatment for electrical contacts and connectors, hard Au plating (for example, AuCo plating) is used from the viewpoint of cost reduction.
If the plating thickness is reduced, pinholes increase and corrosion resistance decreases. The reduction in corrosion resistance due to this thinning can be suppressed to some extent by a sealing treatment (also called lubrication treatment) that fills the pinholes, but its effect is insufficient and it is necessary to suppress corrosion due to local battery formation. . Pd
Corrosion resistance is improved by Ni alloy plating and then hard Au plating, but wear resistance deteriorates when the film thickness is reduced. In this case, even if the outermost surface is lubricated, it is insufficient to improve the wear resistance, and basically it is necessary to increase the hardness of the plating film to reduce the wear amount. It is considered that the plating does not sufficiently enhance the hardness.

【0007】ところが,PdNi合金めっきに代えて,
PdCo合金めっきを施してから硬質Auめっきする
と,耐食性と耐摩耗性が共に向上することがわかった。
However, instead of PdNi alloy plating,
It has been found that when the hard Au plating is performed after the PdCo alloy plating is applied, both the corrosion resistance and the wear resistance are improved.

【0008】本発明はこの知見に基いてなされたもので
あり,電気接点やコネクタを構成する基体金属(銅また
は銅合金,鉄または鉄合金など)の電気的接触表面に対
し,耐食性や耐熱性を付与すべくAuまたはAu合金め
っきを施す場合に,PdCo合金めっきを施してから,
AuまたはAu合金めっきを施すようにしたものであ
る。これによって,AuまたはAu合金めっきのめっき
厚を薄くしても十分な耐食性を維持でき,しかも非常に
耐摩耗性に優れた電気的接触表面とすることができる。
The present invention has been made on the basis of this finding, and has corrosion resistance and heat resistance with respect to the electric contact surface of the base metal (copper or copper alloy, iron or iron alloy, etc.) that constitutes the electric contacts and the connector. In order to apply Au or Au alloy plating to give the following, after applying PdCo alloy plating,
Au or Au alloy plating is applied. As a result, sufficient corrosion resistance can be maintained even if the plating thickness of Au or Au alloy plating is reduced, and an electrical contact surface with extremely excellent wear resistance can be obtained.

【0009】そのさい,基体金属に下地処理として,無
光沢Niめっきを施してから,PdCo合金めっきを中
間めっき層として施し,その上にAuまたはAu合金め
っき層を上層めっきとして形成するのが望ましく,この
Niめっきの下地処理によって密着性の良好なめっき層
を得ることができる。
At that time, it is desirable to apply a dull Ni plating to the base metal as a base treatment, then apply a PdCo alloy plating as an intermediate plating layer, and form an Au or Au alloy plating layer as an upper plating on it. A plating layer having good adhesion can be obtained by the base treatment of this Ni plating.

【0010】一般に,めっき表面の耐食性の向上には,
めっき層−素材の間,或いはめっき層−めっき層の間の
電位差を小さくするのが有効である。この点からすれ
ば,Auめっき/Niめっき/Cu素材からなる構成よ
りも,中間めっき層として,PdNi合金めっき層を介
在させ,AuFめっき/PdNiめっき/Niめっき/
Cu素材からなる構成とする方が耐食性に優れることに
なる。しかし,後者の場合には薄膜化した場合に耐摩耗
性の向上は期待できない(例えば後記の比較例2)。し
かし,中間めっき層としてPdCoめっき層を介在させ
ると,PdNiめっき層を介在させた場合と同等の耐食
性を示しながら,後述の摩耗試験の結果では,約2倍以
上の耐摩耗性を示すようになることがわかった。
Generally, in order to improve the corrosion resistance of the plated surface,
It is effective to reduce the potential difference between the plating layer and the material or between the plating layer and the plating layer. From this point of view, a PdNi alloy plating layer is interposed as an intermediate plating layer and AuF plating / PdNi plating / Ni plating / rather than the structure of Au plating / Ni plating / Cu material.
The corrosion resistance is better when the structure is made of Cu material. However, in the latter case, improvement in wear resistance cannot be expected when the film is thinned (for example, Comparative Example 2 described later). However, when the PdCo plated layer is interposed as the intermediate plated layer, the corrosion resistance is the same as when the PdNi plated layer is interposed, but the wear test results described below show that the wear resistance is about twice or more. I found out.

【0011】したがって,中間めっき層としてPdCo
合金めっきを採用すると,PdNi合金めっきの場合よ
りも,1/2の膜厚で同等の耐摩耗性特性が得られるこ
とになり,それでも耐食性の低下は認められないので,
メタルコストが半減するという経済効果を有することが
判明した。さらに,中間めっき層としてのPdCo合金
めっき中のCo重量%および膜厚について種々試験した
ところ,Co重量%については5〜60重量%の範囲
内,膜厚については0.05μm以上であればAuまた
はAu合金めっきめっき処理品の耐食性と耐摩耗性の向
上に十分に寄与できることがわかった。中間めっき層と
してのPdCo合金めっきの膜厚は,厚くなるほど耐摩
耗性の向上に寄与するが,生産性とコストを考慮すると
最大2.0μm程度まで,好ましくは0.02〜0.5μ
m程度であるのがよい。
Therefore, PdCo is used as the intermediate plating layer.
When alloy plating is adopted, equivalent wear resistance characteristics can be obtained with a film thickness of 1/2 compared with the case of PdNi alloy plating, and yet corrosion resistance is not deteriorated.
It was found to have an economic effect of reducing the metal cost by half. Further, various tests were performed for Co weight% and film thickness in the PdCo alloy plating as the intermediate plating layer. As a result, the Co weight% was in the range of 5 to 60 weight%, and the film thickness was 0.05 μm or more. Alternatively, it was found that it can sufficiently contribute to the improvement of the corrosion resistance and wear resistance of the Au alloy plated product. The film thickness of the PdCo alloy plating as the intermediate plating layer contributes to the improvement of wear resistance as it becomes thicker, but considering productivity and cost, it is up to about 2.0 μm, preferably 0.02 to 0.5 μm.
It is good to be about m.

【0012】このPdCo合金めっき層の上に形成する
上層めっきとしてのAuまたはAu合金めっきの膜厚
は,本発明の目的からして薄いほどよく,通常は0.2
μm以下,好ましくは0.02〜0.10μmの範囲に調
整するのがよい。
For the purpose of the present invention, the film thickness of Au or Au alloy plating as the upper layer plating formed on the PdCo alloy plating layer is preferably as thin as possible.
It is preferable to adjust the thickness to less than or equal to μm, preferably 0.02 to 0.10 μm.

【0013】上層のAuまたはAu合金めっきの後に施
す潤滑処理(封孔処理)は,使用環境にもよるが,耐食
性と耐摩耗性の向上に対してある程度の効果がある。
The lubrication treatment (sealing treatment) performed after the Au or Au alloy plating of the upper layer has some effect on the improvement of corrosion resistance and wear resistance, although it depends on the use environment.

【0014】[0014]

【実施例】〔実施例1〕本例では,電解めっきにより,
脱脂処理し活性化した純銅板(25mm×50mm×
0.3mmt)の表面に,下層めっきとして2μmの無
光沢Niめっき,中間めっきとして0.4μmのPdC
o合金めっき(Co:30重量%),そして上層めっき
として0.1μmのAuフラッシュめっきを順に形成
し,最後に潤滑処理を施した。各電解めっきのめっき浴
組成と,潤滑処理液は次のとおりである。
[Example] [Example 1] In this example, by electrolytic plating,
Pure copper plate that has been degreased and activated (25 mm x 50 mm x
0.3mmt), 2μm matte Ni plating as lower layer plating, 0.4μm PdC as intermediate plating
O alloy plating (Co: 30% by weight), and Au flash plating of 0.1 μm as an upper layer plating were sequentially formed, and finally lubricated. The composition of the plating bath for each electrolytic plating and the lubricating treatment liquid are as follows.

【0015】「無光沢Niめっき浴」 スルファミン酸ニッケル(Niとして):100g/L 塩化ニッケル : 15g/L ホウ酸 : 30g/L"Matte Ni plating bath" Nickel sulfamate (as Ni): 100 g / L Nickel chloride: 15g / L Boric acid: 30 g / L

【0016】「PdCo合金めっき浴」(ルーセントテ
クノロジーズ社製の次の7種の試薬を下記の量比で混合
した) Pd PCl Make-up, Pd as metal : 30g/L PCl Cobalt Make-up, Co as metal : 8g/L PCl Conducting Salt : 40g/L PCl Additive : 20mL/L Additive IV : 10mL/L PCl Ligand :150mL/L Additive M2C : 1mL/L
"PdCo alloy plating bath" (the following 7 kinds of reagents manufactured by Lucent Technologies were mixed in the following quantitative ratio) Pd PCl Make-up, Pd as metal: 30 g / L PCl Cobalt Make-up, Co as metal: 8 g / L PCl Conducting Salt: 40 g / L PCl Additive: 20 mL / L Additive IV: 10 mL / L PCl Ligand: 150 mL / L Additive M2C: 1 mL / L

【0017】 「Auフラッシュめっき浴」(AuCo合金めっき浴:日本高純度化学株式会社 製の次の3種の試薬を下記の量比で混合した) 建浴用塩オーロブライトBA :標準濃度 建浴用添加剤オーロブライトBB(Coとして):200ppm シアン金カリウム(Auとして) : 6g/L[0017] "Au flash plating bath" (AuCo alloy plating bath: Nippon Kojundo Chemical Co., Ltd.) The following three kinds of reagents manufactured by the above were mixed in the following quantitative ratios) Bath salt for construction bath Aurobrite BA: Standard concentration Aurobrite BB (as Co) for building bath: 200ppm Potassium cyanide potassium (as Au): 6 g / L

【0018】 「潤滑処理浴」(ケミカル電子株式会社製の下記試薬) KD-Au100W :200mL/L[0018] "Lubrication bath" (Chemical Electronics Co., Ltd. reagent below) KD-Au100W: 200mL / L

【0019】前記の各々の電解めっき条件は次のとおり
である。 pH 浴温(℃) 電流密度(A/dm2) 膜厚 (μm) 無光沢Niめっき 4.0 50 4 2 PdCo合金めっき 7.2 50 4 0.4 AuCo合金めっき 4.0 50 1 0.1
The electroplating conditions for each of the above are as follows. pH Bath temperature (° C) Current density (A / dm 2 ) Film thickness (μm) Matte Ni plating 4.0 50 4 2 PdCo alloy plating 7.2 50 4 0.4 AuCo alloy plating 4.0 50 0.1 0.1

【0020】得られた処理品を次の耐薬品性試験,熱安
定性試験および耐摩耗性試験に供した。
The treated product thus obtained was subjected to the following chemical resistance test, thermal stability test and abrasion resistance test.

【0021】「耐薬品性試験」:供試片に対してJIS H
8616による硝酸ばっき試験を行ない,25℃で2時間放
置後までの接触抵抗値を測定した。接触抵抗は4端子法
により,測定荷重25gのもとで,被測定区間に一定電
流を流しながら被測定区間に現れる電圧(IR電圧)を
測定した。耐薬品性の評価は,硝酸ばっき試験開始時の
接触抵抗値(初期値)に対する25℃×2時間放置時の
接触抵抗値の変化量(ΔmΩ)で行った。ΔmΩが高い
ほど耐薬品性が良くないことを示す。 「熱安定性試験」:供試片を大気中の150℃に960
時間保持したあとの接触抵抗値を測定し,この昇温処理
前の供試片の接触抵抗値(初期値)に対する変化量(Δ
mΩ)で評価した。接触抵抗は耐薬品試験の場合と同様
に測定した。ΔmΩが高いほど耐薬品性が良くないこと
を示す。 「耐摩耗試験」:直径5mmの銅製のピンに対し供試片
と同じ条件でめっき処理する。このピンを供試片の表面
に垂直に立て,ピンの軸方向に100gの荷重を付与し
た状態で,ピン先端を供試片の表面に同一軌道上を往復
動させて引き掻く。そのさい,ピン先端の往復距離を1
2.5mmの一定とし,周波数0.5Hz(30サイクル
/分)で往復動させ,供試片の母材(銅板)が見えるま
でのサイクル数を計測する。このサイクル数が大きいほ
ど,耐摩耗性に優れる。
"Chemical resistance test": JIS H for specimens
A nitric acid exposure test according to 8616 was performed, and the contact resistance value after standing for 2 hours at 25 ° C was measured. The contact resistance was measured by the four-terminal method under a measurement load of 25 g, and the voltage (IR voltage) appearing in the measured section was measured while applying a constant current to the measured section. The chemical resistance was evaluated by the amount of change (ΔmΩ) in the contact resistance value at 25 ° C. for 2 hours with respect to the contact resistance value (initial value) at the start of the nitric acid exposure test. The higher ΔmΩ indicates the poorer chemical resistance. "Thermal stability test": Specimen at 960 at 150 ° C in air
The contact resistance value after holding for a period of time was measured, and the amount of change (Δ
It was evaluated by mΩ). The contact resistance was measured as in the chemical resistance test. The higher ΔmΩ indicates the poorer chemical resistance. "Abrasion resistance test": A copper pin having a diameter of 5 mm is plated under the same conditions as the test piece. The pin is erected vertically on the surface of the test piece, and with the load of 100 g applied in the axial direction of the pin, the tip of the pin is reciprocated on the surface of the test piece in the same orbit and scratched. At that time, the round trip distance of the pin tip is 1
With a constant 2.5 mm, reciprocate at a frequency of 0.5 Hz (30 cycles / minute) and measure the number of cycles until the base metal (copper plate) of the test piece is visible. The larger the number of cycles, the better the wear resistance.

【0022】このようにして評価した処理品の耐薬品
性,熱安定性および耐摩耗性を表1に総括して示した
が,いずれも良好である。
The chemical resistance, thermal stability and wear resistance of the treated products evaluated in this way are summarized in Table 1, all of which are good.

【0023】〔実施例2〕PdCo合金めっきのめっき
厚みを0.2μmとした以外は,実施例1の処理と試験
を繰り返した。得られた処理品の耐薬品性,熱安定性お
よび耐摩耗性を表1に総括して示した。
Example 2 The treatment and test of Example 1 were repeated except that the PdCo alloy plating had a plating thickness of 0.2 μm. The chemical resistance, thermal stability and wear resistance of the obtained treated products are summarized in Table 1.

【0024】〔実施例3〕PdCo合金めっき浴におけ
る「PCl Cobalt Make-up, Co as metal 」を8g/Lか
ら16g/Lに変更し,そのめっき厚みを0.2μmと
した以外は,実施例1の処理と試験を繰り返した。得ら
れた処理品の耐薬品性,熱安定性および耐摩耗性を表1
に総括して示した。
[Example 3] Example 3 except that the "PCl Cobalt Make-up, Co as metal" in the PdCo alloy plating bath was changed from 8 g / L to 16 g / L and the plating thickness was 0.2 μm. The treatment of 1 and the test were repeated. Table 1 shows the chemical resistance, thermal stability and wear resistance of the obtained treated products.
The summary is shown in.

【0025】〔比較例1〕中間めっきとして,0.4μ
m厚みのPdCo合金めっきに代えて,0.4μm厚み
のPdNi合金めっき(Ni:20重量%)を施した以
外は,実施例1の処理と試験を繰り返した。得られた処
理品の耐薬品性,熱安定性および耐摩耗性を表1に示し
た。なおPdNi合金めっきは,下記の浴を用いて下記
条件で行った。
[Comparative Example 1] As an intermediate plating, 0.4 μ
The treatment and test of Example 1 were repeated except that the PdCo alloy plating having a thickness of 0.4 μm was replaced with the PdNi alloy plating having a thickness of 0.4 μm (Ni: 20 wt%). Table 1 shows the chemical resistance, thermal stability and wear resistance of the obtained treated product. The PdNi alloy plating was performed using the following bath under the following conditions.

【0026】「PdNi合金めっき浴」(ルーセントテ
クノロジーズ社製の次の4種の試薬を下記の量比で混合
した) Pd M2 Make-up, Pd as metal:20g/L Ni M2 Make-up, Ni as metal:10g/L Conducting Salt #5 :50g/L Buffer M2 Salt :10g/L
"PdNi alloy plating bath" (the following four types of reagents manufactured by Lucent Technologies were mixed in the following quantitative ratio) Pd M2 Make-up, Pd as metal: 20 g / L Ni M2 Make-up, Ni as metal: 10g / L Conducting Salt # 5: 50g / L Buffer M2 Salt: 10g / L

【0027】PdNi合金めっきの「電解条件」:浴p
H= 7.5,浴温=40℃,電流密度=4Adm2, めっき厚
み= 0.4μm
"Electrolytic conditions" for PdNi alloy plating: bath p
H = 7.5, bath temperature = 40 ° C., current density = 4 Adm 2 , plating thickness = 0.4 μm

【0028】〔比較例2〕PdNi合金めっきの厚みを
0 .2 μmとした以外は,比較例1の処理と試験を繰り
返した。得られた処理品の耐薬品性,熱安定性および耐
摩耗性を表1に示した。
[Comparative Example 2] The thickness of the PdNi alloy plating was
The treatment and test of Comparative Example 1 were repeated except that the thickness was changed to 0.2 μm. Table 1 shows the chemical resistance, thermal stability and wear resistance of the obtained treated product.

【0029】〔比較例3〕PdCo合金めっきを行わな
かった以外は,実施例1と同様の処理を繰り返した。す
なわち,同じ銅板表面に実施例1と同じく2μmの無光
沢Niめっきを施し,その上に直接Au硬質めっきを形
成し,最後に潤滑処理(封孔処理)を施した。ただし,
Au硬質めっき(AuCo合金めっき)の厚みについて
は,0.1μm(実施例1)から0.5μmに増加した。
得られた処理品の耐薬品性,熱安定性および耐摩耗性を
表1に示した。
Comparative Example 3 The same process as in Example 1 was repeated except that PdCo alloy plating was not performed. That is, the same copper plate surface was plated with 2 μm of dull Ni as in Example 1, directly coated with Au hard plating, and finally lubricated (sealed). However,
The thickness of the Au hard plating (AuCo alloy plating) increased from 0.1 μm (Example 1) to 0.5 μm.
Table 1 shows the chemical resistance, thermal stability and wear resistance of the obtained treated product.

【0030】[0030]

【表1】 [Table 1]

【0031】表1の結果に見られるように,中間めっき
として,PdCo合金めっきを施すと耐薬品性が向上す
ることのほか,耐摩耗性が向上することがわかる。とく
に,従来の中間めっきとしてのPdNi合金めっきと比
較すると,耐摩耗性が著しく良好である。
As can be seen from the results in Table 1, in addition to the chemical resistance being improved by applying PdCo alloy plating as the intermediate plating, the wear resistance is also improved. Especially, compared with the conventional PdNi alloy plating as the intermediate plating, the wear resistance is remarkably good.

【0032】[0032]

【発明の効果】以上説明したように,本発明によれば,
PdCo合金めっきを施してからAuまたはAu合金め
っきを施すようにしたから,AuまたはAu合金めっき
層を薄膜化しても優れた耐食性および耐摩耗性を具備す
る電気的接触用部材を提供できる。
As described above, according to the present invention,
Since the PdCo alloy plating is applied and then the Au or Au alloy plating is applied, it is possible to provide an electrical contact member having excellent corrosion resistance and wear resistance even if the Au or Au alloy plating layer is thinned.

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01H 1/02 H01H 1/02 E 1/04 1/04 E H01R 13/03 H01R 13/03 D Fターム(参考) 4K024 AA03 AA11 AA12 AA24 AB02 AB03 BA02 BA09 BB09 BB10 DB10 GA03 GA04 GA16 4K044 AA02 AA06 AB10 BA06 BA08 BB03 BB04 BC01 BC02 BC11 BC14 CA18 CA59 5G050 AA03 AA11 AA29 AA33 BA04 BA08 CA01 EA05 EA09 FA01 5G307 BA04 BB02 BB04 BC01 BC09 BC10 Front page continuation (51) Int.Cl. 7 Identification code FI theme code (reference) H01H 1/02 H01H 1/02 E 1/04 1/04 E H01R 13/03 H01R 13/03 DF term (reference) 4K024 AA03 AA11 AA12 AA24 AB02 AB03 BA02 BA09 BB09 BB10 DB10 GA03 GA04 GA16 4K044 AA02 AA06 AB10 BA06 BA08 BB03 BB04 BC01 BC02 BC11 BC14 CA18 CA59 5G050 BCA03 AA11 A02 A09 29

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 導電用基体金属の電気的接触表面にAu
またはAu合金めっきを施してなる電気的接触用部材に
おいて,該基体金属とAuまたはAu合金めっき層の間
にPdCo合金めっき層を介在させたことを特徴とする
電気的接触用部材。
1. Au on the electrically contacting surface of a conductive base metal.
Alternatively, an electrical contact member obtained by applying Au alloy plating, wherein a PdCo alloy plated layer is interposed between the base metal and Au or Au alloy plated layer.
【請求項2】 導電用基体金属の電気的接触表面にAu
またはAu合金めっきを施してなる電気的接触用部材に
おいて,該基体金属とAuまたはAu合金めっき層の間
にNiめっき層とPdCo合金めっき層を,Niめっき
層を基体金属側にして介在させたことを特徴とする電気
的接触用部材。
2. Au on the electrically contacting surface of the conductive substrate metal.
Alternatively, in a member for electrical contact obtained by applying Au alloy plating, a Ni plating layer and a PdCo alloy plating layer are interposed between the base metal and Au or Au alloy plating layer, with the Ni plating layer being the base metal side. A member for electrical contact characterized by the above.
【請求項3】 AuまたはAu合金めっき層はその最外
表面に潤滑処理が施されている請求項1または2に記載
の電気的接触用部材。
3. The member for electrical contact according to claim 1, wherein the outermost surface of the Au or Au alloy plating layer is lubricated.
JP2002012385A 2002-01-22 2002-01-22 Electric contact member Pending JP2003213488A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002012385A JP2003213488A (en) 2002-01-22 2002-01-22 Electric contact member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002012385A JP2003213488A (en) 2002-01-22 2002-01-22 Electric contact member

Publications (1)

Publication Number Publication Date
JP2003213488A true JP2003213488A (en) 2003-07-30

Family

ID=27649608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002012385A Pending JP2003213488A (en) 2002-01-22 2002-01-22 Electric contact member

Country Status (1)

Country Link
JP (1) JP2003213488A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007141505A (en) * 2005-11-15 2007-06-07 Fujikura Ltd Flexible flat cable terminal part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007141505A (en) * 2005-11-15 2007-06-07 Fujikura Ltd Flexible flat cable terminal part

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