JP2003209288A - Led illumination system - Google Patents

Led illumination system

Info

Publication number
JP2003209288A
JP2003209288A JP2002344159A JP2002344159A JP2003209288A JP 2003209288 A JP2003209288 A JP 2003209288A JP 2002344159 A JP2002344159 A JP 2002344159A JP 2002344159 A JP2002344159 A JP 2002344159A JP 2003209288 A JP2003209288 A JP 2003209288A
Authority
JP
Japan
Prior art keywords
led
lighting system
illumination
led lighting
semiconductor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002344159A
Other languages
Japanese (ja)
Other versions
JP4285981B2 (en
Inventor
Joachim Reill
ライル ヨアヒム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2003209288A publication Critical patent/JP2003209288A/en
Application granted granted Critical
Publication of JP4285981B2 publication Critical patent/JP4285981B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024Details of scanning heads ; Means for illuminating the original
    • H04N1/028Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/02815Means for illuminating the original, not specific to a particular type of pick-up head
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024Details of scanning heads ; Means for illuminating the original
    • H04N1/028Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/02815Means for illuminating the original, not specific to a particular type of pick-up head
    • H04N1/0282Using a single or a few point light sources, e.g. a laser diode
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024Details of scanning heads ; Means for illuminating the original
    • H04N1/028Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/02815Means for illuminating the original, not specific to a particular type of pick-up head
    • H04N1/02885Means for compensating spatially uneven illumination, e.g. an aperture arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED illumination system with which a surface can be illuminated with a predetermined homogenous illumination intensity distribution, and which has a simple construction and is inexpensive to produce. <P>SOLUTION: In the LED illumination system between at least one LED element and the surface to be illuminated, an illumination optical system which deflect emitted light asymmetrically relative to the main beam direction of the LED element is arranged. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、LED素子の主放
射方向に関してとりわけ対称に光を放射する少なくとも
1つのLED素子を有する、所定の照明強度分布で面を
照明するためのLED照明システムに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lighting system for illuminating a surface with a predetermined illumination intensity distribution, the LED lighting system having at least one LED element that emits light particularly symmetrically with respect to a main emission direction of the LED element.

【0002】[0002]

【従来の技術】特許文献1には、複数の光源と、放射さ
れた光をその長手方向に沿って導き、照明される物体へ
放射する1つの光導体とを有する照明装置が記載されて
いる。光導体の放射面はレンズの形態で実施されてお
り、そのため比較的強度の高い光は照明される物体の位
置に集束することができる。
2. Description of the Related Art Japanese Unexamined Patent Publication (Kokai) No. 2004-242242 discloses an illuminating device having a plurality of light sources and one light guide which guides the emitted light along its longitudinal direction and emits it to an object to be illuminated. . The emitting surface of the light guide is embodied in the form of a lens, so that relatively high intensity light can be focused at the location of the illuminated object.

【0003】この種の照明装置は、多少なりとも広がり
をもった対象物の照明、例えば対象物のスキャン又は模
写のための照明に適している。したがって光は、要求さ
れた照明を最小の光量で供給できるように、対象物上で
できるだけ広く集束する。
Illumination devices of this kind are suitable for illuminating an object which is more or less expansive, for example for illuminating the object for scanning or copying. The light is therefore focused as broadly as possible on the object so that the required illumination can be provided with a minimum amount of light.

【0004】これに対して、広い面の照明に使用される
照明システムでは、異なることが要求される。この目的
のために、照明システムは、照明される面をある一定の
予め定められた照明強度分布で照射することができなく
てはならない。例えば、照明される面上のテクスト又は
色表現は、テクストの読み取りが過度に阻害されないよ
うに、又は実際には存在しない色の違いが色表現内に存
在するように見せるために、広範囲に亘って面が均一に
照明されることを必要とする。
On the other hand, different illumination systems are used to illuminate a wide area. For this purpose, the illumination system must be able to illuminate the illuminated surface with a certain predetermined illumination intensity distribution. For example, the text or color representation on the illuminated surface may be extensive so that the reading of the text is not unduly disturbed or that a color difference that does not actually exist is present in the color representation. Surface needs to be uniformly illuminated.

【0005】しかし、従来の照明システムは不満足な結
果をもたらすか、又はその構造にコストがかかり、高価
である。
However, conventional lighting systems give unsatisfactory results, or their construction is costly and expensive.

【0006】[0006]

【特許文献1】EP−A−1 017 222[Patent Document 1] EP-A-1 017 222

【0007】[0007]

【発明が解決しようとする課題】本発明の課題は、照明
される面を所定の照明強度分布で、とりわけ均一な照明
強度分布で照明することができ、しかも単純な構造を有
し、安価に製造され得る冒頭に述べた形式のLED照明
システムを提供することである。
An object of the present invention is to illuminate a surface to be illuminated with a predetermined illumination intensity distribution, in particular with a uniform illumination intensity distribution, and also to have a simple structure and at a low cost. To provide an LED lighting system of the type mentioned at the outset which can be manufactured.

【0008】[0008]

【課題を解決するための手段】上記課題は、少なくとも
1つのLED素子と照明されるべき面との間に、放射さ
れた光をLED素子の主放射方向に関して非対称に偏向
する照明光学系が配置されているLED照明システムに
より解決される。
SUMMARY OF THE INVENTION The above-mentioned problem is that an illumination optical system is provided between at least one LED element and a surface to be illuminated, which deflects emitted light asymmetrically with respect to the main emission direction of the LED element. Is solved by the existing LED lighting system.

【0009】[0009]

【発明の実施の形態】本発明によれば、LED照明シス
テムにおいて、少なくとも1つのLED半導体本体と照
明される面との間に、放射された光をLED半導体の主
放射方向に関して非対称に偏向する照明光学系が配置さ
れている。
According to the invention, in an LED lighting system, the emitted light is deflected asymmetrically with respect to the main emission direction of the LED semiconductor, between at least one LED semiconductor body and the illuminated surface. An illumination optical system is arranged.

【0010】非対称的偏向は、面の形状とは無関係に、
目的に合った面の照明の調整を可能とする。それゆえ、
任意の形状の面において、対称に放射された光の非対称
的偏向により、光源から表面上の点までの可変の距離及
び光線が面に当たるときの可変の角度を配慮することが
可能である。
The asymmetric deflection is independent of the shape of the surface,
It is possible to adjust the illumination of the surface that suits the purpose. therefore,
Due to the asymmetrical deflection of symmetrically emitted light in a surface of arbitrary shape, it is possible to account for a variable distance from the light source to a point on the surface and a variable angle at which the light ray strikes the surface.

【0011】1つの実施形態では、照明システムは面の
均一な照明に適応するよう定められている。特に、照明
システムを、曲面の均一な照明に、とりわけ凸面又は凹
面の均一な照明に適応させてもよい。
In one embodiment, the illumination system is defined to accommodate uniform illumination of the surface. In particular, the illumination system may be adapted for uniform illumination of curved surfaces, in particular for convex or concave illumination.

【0012】しかしながら、照明システムを目的に合わ
せて面の非均一な照明に使用することも可能である。例
えば、所定の面領域を光学的に強調又は目立たなくさせ
るために使用することも可能である。
However, it is also possible to use the illumination system in a targeted manner for non-uniform illumination of the surface. For example, it may be used to optically enhance or obscure a given surface area.

【0013】有利な実施形態では、照明光学系は1つ又
は複数のレンズ素子により形成されている。照明される
面が例えばレンズ素子の側から見て凹ならば、レンズ素
子は例えばLEDの方向には凹面を有し、照明される面
の方向には凸面を有する。
In an advantageous embodiment, the illumination optics are formed by one or more lens elements. If the illuminated surface is, for example, concave when viewed from the side of the lens element, the lens element has, for example, a concave surface in the direction of the LED and a convex surface in the direction of the illuminated surface.

【0014】しかし、有利には、相応の照明光学系は1
つ又は複数のフレネルレンズにより形成されていてもよ
い。
However, advantageously, the corresponding illumination optics is 1
It may be formed by one or a plurality of Fresnel lenses.

【0015】有利な実施形態では、照明システムは、様
々なスペクトル領域で放射する複数のLED半導体本体
を有する。
In an advantageous embodiment, the lighting system comprises a plurality of LED semiconductor bodies emitting in different spectral regions.

【0016】これに関して次のような実施形態が特に実
用的である。すなわち、様々なスペクトル領域で放射さ
れるLED半導体本体の光が補完し合って白色光となる
ような実施形態、例えば3つのLED半導体本体が設け
られており、これらのLED半導体本体から赤、緑及び
青の光が放出される実施形態が特に実用的である。
In this regard, the following embodiments are particularly practical. That is, an embodiment is provided in which the light of the LED semiconductor bodies emitted in the various spectral regions complement each other into white light, for example three LED semiconductor bodies, from which the red and green LED semiconductor bodies are emitted. And embodiments in which blue light is emitted are particularly practical.

【0017】有利には、1つ又は複数のLED半導体本
体は、GaN半導体材料,InGaN半導体材料,Al
GaN半導体材料,InAlGaN半導体材料,ZnS
半導体材料,ZnSe半導体材料,CdZnS半導体材
料又はCdZnSe半導体材料を含んでおり、目的に合
わせて可視光、赤外電磁放射線又は紫外電磁放射線を放
射する。
Advantageously, the one or more LED semiconductor bodies are GaN semiconductor material, InGaN semiconductor material, Al
GaN semiconductor material, InAlGaN semiconductor material, ZnS
It includes a semiconductor material, a ZnSe semiconductor material, a CdZnS semiconductor material, or a CdZnSe semiconductor material, and emits visible light, infrared electromagnetic radiation, or ultraviolet electromagnetic radiation depending on the purpose.

【0018】代替案においては、照明システム内で白色
光を発生させるために、放射方向で見て半導体本体に後
置され、かつ有利には半導体本体とレンズとの間に配置
された1つ又は複数のルミネセンス変換素子が使用され
る。これには、例えば青色光を放射する半導体本体の場
合、青色光の一部を黄色光又は緑色光又は赤色光に変換
し、半導体本体の青色光と混合するルミネセンス変換素
子が適している。
In an alternative, one or more, which is arranged in radial direction behind the semiconductor body and is preferably arranged between the semiconductor body and the lens, for producing white light in the illumination system. A plurality of luminescence conversion elements are used. For this, for example, in the case of a semiconductor body emitting blue light, a luminescence conversion element is suitable which converts part of the blue light into yellow light or green light or red light and mixes it with the blue light of the semiconductor body.

【0019】1つの実施形態では、LED半導体本体と
照明光学系は照明モジュールを形成しており、共通のモ
ジュールハウジング内に配置されている。
In one embodiment, the LED semiconductor body and the illumination optics form an illumination module and are located in a common module housing.

【0020】モジュールハウジングの壁は、照明光学系
の構成部材であるフレネルレンズで形成してもよい。も
ちろん、このフレネルレンズが照明光学系に必要な唯一
のレンズであってもよい。その場合、特に単純でコンパ
クトな照明システムの構造が得られる。
The wall of the module housing may be formed by a Fresnel lens which is a constituent member of the illumination optical system. Of course, this Fresnel lens may be the only lens required for the illumination optical system. In that case, a particularly simple and compact construction of the illumination system is obtained.

【0021】本発明の別の有利な実施形態、特徴及び詳
細は、従属請求項、実施例の説明及び図面から明らかと
なる。
Further advantageous embodiments, features and details of the invention are apparent from the dependent claims, the description of the examples and the drawings.

【0022】以下、本発明を実施例に基づいて図面と関
連させてより詳細に説明する。そのつど、本発明の理解
にとって重要な要素だけが図示される。
Hereinafter, the present invention will be described in more detail based on embodiments with reference to the drawings. In each case, only those elements that are important to the understanding of the invention are shown.

【0023】[0023]

【実施例】図1に断面で概略的に示されている実施例に
よるLED照明システム1は、例えば、曲面5の広範囲
に亘る均一な照明のためのものである。なお、曲面5は
例えばグラフである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An LED lighting system 1 according to the embodiment shown schematically in cross section in FIG. 1 is for uniform illumination over a large area of a curved surface 5, for example. The curved surface 5 is, for example, a graph.

【0024】支持体上に取り付けられたLED素子2は
作動時に照明に必要な光を放射する。放射された光を補
正しないと、専門家にとっては直ちに明らかであるよう
に、複数の理由から、曲面5の均一な照明は得られな
い。
The LED element 2 mounted on the support emits the light required for illumination during operation. If the emitted light is not corrected, it will be immediately apparent to the expert that a uniform illumination of the curved surface 5 cannot be obtained for several reasons.

【0025】第1に、LED素子2の放射特性は、曲面
5の占める立体角Ωの全体に亘って一定なのではなく、
主放射方向9回りの角度領域内に最大の強度を有してい
る。第2に、LED素子2から曲面5までの距離は可変
であり、第3に、長手方向の広がりに沿った面5の曲率
とともに、面に当たる光線の入射角も変化する。
First, the radiation characteristic of the LED element 2 is not constant over the entire solid angle Ω occupied by the curved surface 5,
It has the maximum intensity in the angular region around the main radiation direction 9. Secondly, the distance from the LED element 2 to the curved surface 5 is variable, and thirdly, with the curvature of the surface 5 along the expansion in the longitudinal direction, the incident angle of the light ray striking the surface also changes.

【0026】それでも曲面5の広範囲に亘る均一な照明
を達成するために、この曲面5とLED素子2との間
に、照明光学系として、放射光をLED素子2の主放射
方向9に関して相応に非対称的に偏向するレンズ4が配
置されている。
Nevertheless, in order to achieve a uniform illumination of the curved surface 5 over a wide area, the emitted light is correspondingly provided as an illumination optical system between the curved surface 5 and the LED element 2 with respect to the main emission direction 9 of the LED element 2. A lens 4 is arranged which asymmetrically deflects.

【0027】図1において矢印による幾何学的光線6と
して表されたLED素子2からの放射光の強度分布は、
主放射方向9に関して少なくとも近似的に対称である。
照明光学系4は光線6を偏向し、光線6が非対称的に分
布した光線8として曲面5に当たるようにする。このた
めに、照明光学系4は非対称的な形のレンズ4であり、
LED素子2の方を向いた面41は凹であり、曲面5の
方を向いた面42は凸、例えば放物線状に凸である。
The intensity distribution of the emitted light from the LED element 2, represented as a geometrical ray 6 by the arrow in FIG.
It is at least approximately symmetrical about the main radiation direction 9.
The illumination optical system 4 deflects the light ray 6 so that the light ray 6 strikes the curved surface 5 as a light ray 8 having an asymmetric distribution. For this reason, the illumination optical system 4 is a lens 4 having an asymmetrical shape,
The surface 41 facing the LED element 2 is concave, and the surface 42 facing the curved surface 5 is convex, for example, parabolic convex.

【0028】偏向の程度は、ちょうど、曲面5の不均一
な照明をもたらす上記の効果及び場合によっては別の効
果が補償されるように決められており、その結果、曲面
5の表面には均一な照明強度が生じる。この補償は、例
えばそれ自体従来技術において公知であるように、外側
レンズ面42及び内側レンズ面41の曲率を選択するこ
とにより行われる。
The degree of deflection is determined in such a way that the above-mentioned effect and, in some cases, other effects which lead to uneven illumination of the curved surface 5 are compensated, so that the surface of the curved surface 5 is uniform. Lighting intensity is generated. This compensation is done, for example, by selecting the curvatures of the outer lens surface 42 and the inner lens surface 41, as is known per se in the prior art.

【0029】LED素子2及び照明光学系4の全体構成
は、有利には共通のモジュールハウジング内に収納され
ている。
The overall construction of the LED element 2 and the illumination optics 4 is preferably housed in a common module housing.

【0030】図1の実施例は簡略化のために1つのLE
D素子2しか有していないように描かれているが、専門
家にとっては、ただ1つのLED素子の代わりに、複数
のLED素子が照明システム内に設けられてもよいこと
は明らかである。とりわけ、LED素子は、放射される
面5に所望の色の印象を得るために、様々なスペクトル
の色を発するようにすることができる。
The embodiment of FIG. 1 has one LE for simplicity.
Although depicted as having only D elements 2, it is clear to the expert that instead of just one LED element, multiple LED elements may be provided in the lighting system. In particular, the LED element can be made to emit colors of different spectra in order to obtain the desired color impression on the emitting surface 5.

【0031】これは、本発明の別の実施例を示す図2の
照明システム11において実現されている。3つのLE
D素子12a,12b,12cは、全体として白色光が
放射されるように、赤(650nm)、緑(530n
m)ないし青(470nm)のスペクトル領域で放射す
る。代替的には、白色光の放射のために、青色発光ダイ
オードを、青色光をより長い波長の放射線に変換する変
換物質とともに使用してもよい。
This is implemented in the lighting system 11 of FIG. 2 which illustrates another embodiment of the present invention. 3 LEs
The D elements 12a, 12b, and 12c have red (650 nm) and green (530n) so that white light is emitted as a whole.
m) to the blue (470 nm) spectral region. Alternatively, for the emission of white light, blue light emitting diodes may be used with conversion materials that convert blue light into longer wavelength radiation.

【0032】3つのLED素子12a〜cは支持体3上
に取り付けられており、照明システム1と同様に、図2
には示されていない面を照明するよう定められている。
The three LED elements 12a-c are mounted on a support 3 and, like the illumination system 1, are shown in FIG.
It is designed to illuminate surfaces not shown in.

【0033】照明されるべき面に所望の照明強度を生じ
させる照明光学系は、この実施形態では、フレネルレン
ズ14により形成されている。フレネルレンズ14をほ
ぼ同じ最大厚の放射状ゾーンに分割することにより、非
常に平らなレンズが実現される。
The illumination optical system for producing the desired illumination intensity on the surface to be illuminated is formed by the Fresnel lens 14 in this embodiment. By dividing the Fresnel lens 14 into radial zones of approximately the same maximum thickness, a very flat lens is achieved.

【0034】これにより、フレネルレンズ14はモジュ
ールハウジング17の壁を形成することができ、コンパ
クトで独立した照明システムの実施が可能になる。ま
た、フレネルレンズ14は、照明強度の他の分布パター
ンが望まれるときには、相応に適合されたフレネルレン
ズにより単純に交換可能である。
This allows the Fresnel lens 14 to form the wall of the module housing 17, allowing a compact and independent illumination system to be implemented. Also, the Fresnel lens 14 can simply be replaced by a correspondingly adapted Fresnel lens when other distribution patterns of illumination intensity are desired.

【0035】上記実施例及び本発明全般にとって有利な
LED素子2,12a〜12bとして、市販の表面取付
可能なLED素子が使用されている。図3にはこのよう
なLED素子が概略的に示されている。この図では、L
EDプラスチックハウジング21内にそれぞれ少なくと
も1つのLED半導体本体20が配置されている。有利
には、LED半導体本体20はLEDプラスチックハウ
ジング21の反射装置22内にある。なお、反射装置2
2は、有利には、LED半導体本体20から放射された
光を集束させるものである。反射装置22に代わって又
は付加的に、LED半導体本体20から放射された光を
集束させるために、集束レンズ23をLED半導体本体
20に後置してもよい。集束レンズ23は、有利にはL
EDプラスチックハウジング21に固定されている。
Commercially available surface-mountable LED elements are used as the LED elements 2 and 12a to 12b which are advantageous for the above-described embodiments and the present invention in general. FIG. 3 schematically shows such an LED device. In this figure, L
At least one LED semiconductor body 20 is arranged in each ED plastic housing 21. Advantageously, the LED semiconductor body 20 is in the reflector 22 of the LED plastic housing 21. The reflection device 2
2 advantageously focuses the light emitted from the LED semiconductor body 20. Instead of or in addition to the reflector 22, a focusing lens 23 may be placed behind the LED semiconductor body 20 in order to focus the light emitted from the LED semiconductor body 20. The focusing lens 23 is preferably L
It is fixed to the ED plastic housing 21.

【0036】これに代わって、照明モジュール内におい
て、LED素子として、ハウジングを備えていない1つ
又は複数のLED半導体チップをチップ支持体3上に取
り付けてもよい。しかし、モジュールハウジング7は、
例えば密度に関して、例えば上で図3に関連して説明し
たようなハウジングを備えたLED素子を使用した場合
よりも、高い要求を満たさなければならない。
Alternatively, one or more LED semiconductor chips without a housing may be mounted on the chip carrier 3 as LED elements in the lighting module. However, the module housing 7
For example, in terms of density, higher demands have to be fulfilled than with the use of LED elements with housings as described for example in connection with FIG. 3 above.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例によるLED照明システ
ムの断面を概略的に示す。
FIG. 1 schematically shows a cross section of an LED lighting system according to a first embodiment of the present invention.

【図2】本発明の第2の実施例によるLED照明システ
ムの断面を概略的に示す。
FIG. 2 schematically shows a cross section of an LED lighting system according to a second embodiment of the present invention.

【図3】照明システムでの使用に有利なLED素子の断
面を概略的に示す。
FIG. 3 schematically shows a cross section of an LED element that is advantageous for use in a lighting system.

【符号の説明】[Explanation of symbols]

1 LED照明システム 2 LED素子 3 支持体 4 照明光学系 5 照明される面 6 光線 7 モジュールハウジング 8 光線 9 主放射方向 11 照明システム 12a〜12c LED素子 14 照明光学系 17 モジュールハウジング 20 LED半導体本体 21 LEDプラスチックハウジング 22 反射装置 23 集束レンズ 41 LED素子の方を向いたレンズ素子の面 42 曲面の方を向いたレンズ素子の面 Ω 曲面の占める立体角 1 LED lighting system 2 LED element 3 support 4 Illumination optical system 5 Illuminated surface 6 rays 7 Module housing 8 rays 9 Main radiation direction 11 Lighting system 12a to 12c LED element 14 Illumination optical system 17 Module housing 20 LED semiconductor body 21 LED plastic housing 22 Reflector 23 Focusing lens 41 The surface of the lens element facing the LED element 42 The surface of the lens element facing the curved surface Ω Solid angle occupied by curved surface

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // F21Y 101:02 F21S 1/02 G (72)発明者 ヨアヒム ライル ドイツ連邦共和国 ツァイトラルン ハウ プトシュトラーセ 40 Fターム(参考) 5F041 AA14 CA34 CA40 CA41 CA42 CA43 DB09 EE11 EE25 FF11─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 Identification code FI Theme Coat (reference) // F21Y 101: 02 F21S 1/02 G (72) Inventor Joachim Ryle Germany Federal Republic of Germany Zeitrunrun Hauptstraße 40 F Term (reference) 5F041 AA14 CA34 CA40 CA41 CA42 CA43 DB09 EE11 EE25 FF11

Claims (15)

【特許請求の範囲】[Claims] 【請求項1】 所定の照明強度分布で面(5)を照明す
るためのLED照明システムであって、 LED素子(2;12a〜c)の主放射方向(9)に関
して例えば対称に光を放射する少なくとも1つのLED
素子(2;12a〜c)を有する形式のLED照明シス
テムにおいて、 前記少なくとも1つのLED素子(2;12a〜c)と
前記照明されるべき面(5)との間に、放射された光
(6)を前記LED素子(2;12a〜c)の主放射方
向(9)に関して非対称に偏向する照明光学系(4;1
4)が配置されていることを特徴とする、LED照明シ
ステム。
1. An LED illumination system for illuminating a surface (5) with a predetermined illumination intensity distribution, which emits light eg symmetrically with respect to a main emission direction (9) of an LED element (2; 12a-c). At least one LED
In an LED lighting system of the type having elements (2; 12a-c), the emitted light (between the at least one LED element (2; 12a-c) and the surface (5) to be illuminated ( An illumination optical system (4; 1) that asymmetrically deflects 6) with respect to the main emission direction (9) of the LED elements (2; 12a-c).
4) LED lighting system, characterized in that
【請求項2】 前記システムは前記面(5)を均一に照
明するよう調整及び決定されている、請求項1記載のL
ED照明システム。
2. The L according to claim 1, wherein the system is adjusted and determined to illuminate the surface (5) uniformly.
ED lighting system.
【請求項3】 前記システムは曲面(5)、例えば凸面
又は凹面を均一に照明するよう調整及び決定されてい
る、請求項1又は2に記載のLED照明システム。
3. LED lighting system according to claim 1 or 2, wherein the system is adjusted and determined to illuminate a curved surface (5), for example convex or concave, uniformly.
【請求項4】 前記照明光学系はレンズ素子(4;1
4)により形成されている、請求項1から3のいずれか
1項に記載のLED照明システム。
4. The illumination optical system comprises a lens element (4; 1).
LED lighting system according to any one of claims 1 to 3, which is formed by 4).
【請求項5】 前記LED素子(2)の方を向いた前記
レンズ素子の面(41)は凹であり、曲面(5)の方を
向いた前記レンズ素子の面(42)は凸、例えば放物線
状に凸である、請求項4記載のLED照明システム。
5. The surface (41) of the lens element facing the LED element (2) is concave and the surface (42) of the lens element facing the curved surface (5) is convex, eg The LED lighting system according to claim 4, wherein the LED lighting system is parabolic convex.
【請求項6】 前記照明光学系は1つ又は複数のフレネ
ルレンズ(14)により形成されている、請求項1から
5のいずれか1項に記載のLED照明システム。
6. The LED illumination system according to claim 1, wherein the illumination optical system is formed by one or more Fresnel lenses (14).
【請求項7】 前記LED素子(2;12a〜c)のう
ちの1つは、GaN半導体材料,InGaN半導体材
料,AlGaN半導体材料,InAlGaN半導体材
料,ZnS半導体材料,ZnSe半導体材料,CdZn
S半導体材料又はCdZnSe半導体材料を含んでい
る、請求項1から6のいずれか1項に記載のLED照明
システム。
7. One of said LED elements (2; 12a-c) is a GaN semiconductor material, InGaN semiconductor material, AlGaN semiconductor material, InAlGaN semiconductor material, ZnS semiconductor material, ZnSe semiconductor material, CdZn.
7. The LED lighting system according to claim 1, comprising an S semiconductor material or a CdZnSe semiconductor material.
【請求項8】 前記LED素子(2;12a〜c)のう
ちの1つは、作動時に可視光、赤外電磁放射線又は紫外
電磁放射線を放射する、請求項1から7のいずれか1項
に記載のLED照明システム。
8. The method according to claim 1, wherein one of the LED elements (2; 12 a-c) emits visible light, infrared electromagnetic radiation or ultraviolet electromagnetic radiation when activated. The described LED lighting system.
【請求項9】 前記システムは、様々なスペクトル領域
で放射する複数のLED素子(12a〜c)を有する、
請求項1から8のいずれか1項に記載のLED照明シス
テム。
9. The system comprises a plurality of LED elements (12a-c) emitting in various spectral regions.
The LED lighting system according to claim 1.
【請求項10】 前記LED素子(12a〜c)の放射
光は白色光へ補完される、請求項9記載のLED照明シ
ステム。
10. LED lighting system according to claim 9, wherein the emitted light of the LED elements (12a-c) is complemented by white light.
【請求項11】 前記LED素子(2;12a〜c)の
少なくとも1つと前記照明光学系は、照明モジュールを
形成しており、共通のモジュールハウジング(7;1
7)内に配置されている、請求項1から10のいずれか
1項に記載のLED照明システム。
11. At least one of the LED elements (2; 12a-c) and the illumination optics form an illumination module and a common module housing (7; 1).
LED lighting system according to any one of claims 1 to 10, arranged in 7).
【請求項12】 前記照明光学系は、前記モジュールハ
ウジング(17)を形成するフレネルレンズ(14)を
有する、請求項11記載のLED照明システム。
12. The LED illumination system according to claim 11, wherein the illumination optics comprises a Fresnel lens (14) forming the module housing (17).
【請求項13】 前記LED素子は、LEDプラスチッ
クハウジングを備えた表面取付可能なLED素子であ
る、請求項1から12のいずれか1項に記載のLED照
明システム。
13. The LED lighting system according to claim 1, wherein the LED element is a surface-mountable LED element having an LED plastic housing.
【請求項14】 前記LEDプラスチックハウジング
は、LED半導体本体内にある反射装置を有する、請求
項13記載のLED照明システム。
14. The LED lighting system of claim 13, wherein the LED plastic housing has a reflector within the LED semiconductor body.
【請求項15】 前記LEDプラスチックハウジング
は、放射方向において前記LED半導体本体に後置され
た例えば前記LEDプラスチックハウジング上に取り付
けられた集束レンズを有する、請求項13又は14に記
載のLED照明システム。
15. LED lighting system according to claim 13 or 14, wherein the LED plastic housing has a focusing lens mounted in the radial direction behind the LED semiconductor body, for example mounted on the LED plastic housing.
JP2002344159A 2001-11-28 2002-11-27 LED lighting system Expired - Fee Related JP4285981B2 (en)

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