JP2003207549A - Electronic circuit inspection device and electronic circuit inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection sensor capable of easily inspecting a disconnection in the middle of a pattern, a partial notch, or a short-circuit to an adjacent pattern, regardless of the shape of a conductive pattern which is an inspection object, for example, even in the case of a branch pattern. <P>SOLUTION: This device is equipped with a holding means for holding information of the reference conductive pattern which is the inspection object, and at least sensor elements having respectively the size below the line width of the conductive pattern which is the inspection object are disposed mutually close matrically. A threshold is set, for binarizing a detection result from a field sensor capable of detecting the field intensity generated from the conductive pattern which is the inspection object to which an inspection signal is supplied (S60). The detection result from the field sensor is binarized (S62) based on the set threshold (S60), and a characteristic point of the binarized binary information is extracted (S66), and compared with the reference conductive pattern information held by the holding means (S68, 70), to thereby determine the quality of the inspection object pattern by the comparison result (S72). <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit inspection device and an electronic circuit inspection method used for inspecting a circuit board having a fine wiring pattern.

[0002]

2. Description of the Related Art In order to inspect a circuit board having a fine pattern, conventionally, a large number of pins are applied to respective terminals of a board to be inspected and an inspection signal is applied to the pins. In this method, since a large number of pins are applied to the substrate, a load is applied to the substrate, and therefore rubber is applied to the substrate for the purpose of reducing the load.

For this reason, there has been a problem of poor contact at the portion where the rubber is pressed. In order to solve this problem, for example, in Patent Document 1 filed by the present applicant, signals are picked up in a non-contact manner using a probe (electrode) having a size larger than the width of a wiring pattern to be inspected. Then, a method of inspecting a defective board is implemented.

Further, in Patent Document 2, as shown in FIG.
Disclosed is a sensor C having electrodes (stimulators) 11A and 11B that generate inspection signals toward a substrate and a plurality of electrodes 12A, 12B, 12C, ... For receiving radiation signals from the substrate. The idea common to Patent Document 1 and Patent Document 2 is that the pattern lines are collectively and non-contactly inspected by an electrode having a size enough to cover the plurality of pattern lines.

Further, in Patent Document 3, a large number of sensor electrodes arranged in an array at regular intervals are brought close to a substrate to be inspected, and the sensor electrodes are electrostatically connected to a measured point of an electronic circuit. There is disclosed a sensor probe for inspecting a substrate, which is capable of measuring the potential distribution of a substrate under test in a non-contact manner by being coupled to

[0006]

[Patent Document 1] JP-A-9-264919

[Patent Document 2] Japanese Patent Application Laid-Open No. 8-278342

[Patent Document 3] Japanese Unexamined Patent Publication No. 8-327708

[0007]

However, the sensor probe used in Patent Document 1 and Patent Document 2 is intended to inspect a circuit pattern having a pitch and a size of a normal printed circuit board. However, the degree of integration is low, and therefore sufficient accuracy can be obtained by forming the sensor electrode portion by a method such as machining or simple etching.

These prior art sensor probes use electrodes of a size large enough to cover a plurality of pattern lines in order to eliminate the need for high positioning accuracy. Therefore, for example, circuit patterns of about 50 μm and 50 μm or less are used. Could not be inspected with high resolution, and it could not be applied to a circuit board in which a pattern is branched into a plurality of patterns on the way.

Further, for example, it is impossible to inspect a defective state in which the pattern is not completely broken and a part is broken.

Further, in the sensor probe described in Patent Document 3, in order to inspect the substrate to be inspected, the inspection pattern position of the substrate to be inspected for which a signal should be detected is determined in advance, and the inspection relating to any sensor electrode is performed. It was necessary to move the sensor probe so that it was right under the pattern position, and then detect the signal. As a result, accurate measurement is impossible unless the sensor probe can be positioned, so that precise positioning control is required and the structure of the inspection device is complicated. Further, for example, in the case of a fine pattern, the positioning accuracy cannot be ensured, and the quality inspection may be insufficient. Further, although the sensor is positioned on the back surface of the mounting board, the external terminals of the mounting components are projected on this surface, the gap between the sensor and the pattern surface is very large, and the sensitivity is very low. Therefore, there is a strong possibility that the influence of the peripheral pattern cannot be avoided.

[0011]

The present invention has been made for the purpose of solving the above-mentioned problems. For example, even if a fine wiring pattern or a pattern to be inspected is in any state, An object of the present invention is to provide an electronic circuit inspection device and an electronic circuit inspection method capable of performing inspection.

As one means for achieving the above object, for example, the following configuration is provided.

That is, a sensor for inspecting an electronic circuit for inspecting a conductive pattern formed on an electronic circuit, the sensors being arranged in a matrix in close proximity to each other, at least according to the line width of the conductive pattern to be inspected. A sensor element having a predetermined area and an insulating layer formed on at least a surface of the sensor element, the sensor element being positioned in proximity to the conductive pattern of the inspection object and generated by the conductive pattern of the inspection object. A sensor for inspecting an electronic circuit, which is capable of detecting a radiation wave.

Further, for example, the sensor element includes an electrode whose one side is less than the line width of the conductive pattern to be inspected, and the insulating layer is an insulating layer covering the electrode.

Further, for example, the sensor element is characterized in that one side includes an electrode having a width (about 1/3) of the line width of the conductive pattern to be inspected.

Further, for example, the sensor elements arranged in a matrix are arranged over the entire wiring pattern arrangement area of the electronic substrate to be inspected.

Alternatively, an inspection signal supply means for supplying an AC signal to one of the inspection target conductive patterns of the inspection target electronic circuit, the electronic circuit inspection sensor according to any one of claims 1 to 4, and an electronic circuit Detecting means for detecting the intensity of the radiated wave detected by each of the sensor elements of the circuit inspection sensor, and recognizing means for recognizing the area radiating the radiated wave based on the detection result of the detecting means. The inspection system is characterized in that the quality of the inspection target conductive pattern can be determined by comparing the recognized region radiating the radiated wave with the inspection target conductive pattern.

[0018]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. 2 and 3
FIG. 3 is a diagram illustrating a configuration of a sensor probe board according to an embodiment of the present invention. FIG. 2 is a bottom view of the configuration of an area-type sensor probe board 20 used in the inspection system according to the embodiment of the present invention as seen from below, and FIG. 3 is another sensor according to the embodiment. It is the bottom view which looked at the linear type sensor probe board 50 which is a probe board from the bottom.

The area-type sensor probe board 20 shown in FIG. 2 has a large number of sensor elements 21, which are arranged in a two-dimensional (matrix-like) manner at close intervals.
21 ... The present embodiment is not limited to the sensor probe board 20 shown in FIG. 2 described above, and is arranged in a row with a mutual spacing close to each other, as in the linear type sensor probe board 50 shown in FIG. 3, for example. It is also possible to have a structure having a plurality of sensor elements 21, 21 ,.

The sensor probe board 2 shown in FIG.
0, or in the sensor probe board 50 shown in FIG. 3, each sensor element is slightly separated from the other sensor elements, and is separated by an electromagnetic wave (electric field or magnetic field) shield.

Each sensor element 21 is formed in a substantially square shape, and its size is determined by the line width of the circuit pattern on the board to be inspected. In order to specify the defective portion, it is preferable that the size is less than the line width of the pattern line (for example, about 1/2 to 1/3). In the following description of the present embodiment, the case where the size of each sensor element 21 is set to 1/3 of the line width of the pattern line will be described as an example for convenience of description.

FIG. 4 is a schematic diagram for explaining how individual sensor elements 21 are connected to their corresponding pads. In FIG. 4, 30 is a bonding pad that is connected to one of the sensor elements by a lead wire, and each sensor element is, for example, the sensor probe board 20 (or 50).
Are connected to the pads arranged in a row on the side surface of the device by a lead wire (wiring pattern).

In the example of FIG. 4, the sensor element at the upper left end is connected to the uppermost pad, and the second sensor element from the upper left is connected to the second pad. Note that all the lead wires are embedded in the sensor probe board 20 (or 50).

The sensor probe board according to the present embodiment inspects a fine wiring pattern as produced by a semiconductor manufacturing process. Therefore, the space between the pads is also narrow. Therefore, the lead wire (not shown) between the pad and the inspection device for picking up the signal from each pad is connected to the pad 30 by bonding.

FIG. 5 is a diagram for explaining how the radiation wave from the pattern on the substrate is radiated toward the sensor element which is separated from the pattern and is kept in a non-contact state. With reference to FIG. 5, description will be given of how a radiation wave from the end of the pattern line reaches each of the sensor elements 21a and 21b when the inspection signal (including the AC component) is applied to the pattern line to be inspected.

In the example shown in FIG. 5, since the pattern line does not extend to the sensor element 21b, the radiation wave received by the sensor element 21b is weaker than the signal received by the sensor element 21a, and the amplitude of the signal is small. It will be low. As can be seen from the example of FIG. 5, in the sensor probe of the present embodiment, the individual sensor elements are arranged close to each other, so that a plurality of sensor elements simultaneously receive signals from the pattern line to be inspected. The size of each sensor element is so small that it can be detected, and the intensity of the received signal from each sensor element in the non-contact state changes depending on the distance between each sensor element and the pattern line. Has become.

As a result, it is also possible to detect the pattern in which the inspection signal is emitted by comparing the detection signal levels from a plurality of sensor elements.

FIG. 6 is a sectional view showing the structure of the sensor element of the present embodiment. Hereinafter, a configuration example of one sensor element (sensor element) according to the present embodiment will be described with reference to FIG.

In the sensor probe according to the present embodiment, silicon dioxide is formed on the bottommost silicon (Si) base 30.
An insulating layer 31 of (SiO ₂ ) is formed. Further, a bridge pillar 41 made of a conductive metal material such as aluminum is formed on the insulating layer 31 so as to face upward, and a sensor electrode plate 40 is formed on the top of the bridge pillar 41. The bridge post 41 and the electrode plate 40 form one sensor element.

An example of the sensor element formed by the bridge column 41 and the electrode plate 40 will be described with reference to FIG. FIG. 7 is a diagram for explaining the arrangement of electrodes, bridge wires, and lead wires in the sensor element of this embodiment.

The bridge pillar 41 is connected to an aluminum or copper lead wire 50b (lead wire 50 formed of an aluminum film in the example of FIG. 6). The lead wire 50a in FIG. 7 is a lead wire from another sensor element (not shown). The bridge column 41 bridges between the electrode of the sensor element and the lead wire, and has a columnar shape, which can be useful for improving the degree of integration.

As shown in FIG. 6, a wiring layer is formed on the insulating layer 31. As shown in FIG. 7, this wiring layer is a layer including lead wires (50, 50a, 50b) that propagate the signal detected by the sensor to the pad. Although the shield layer 33 is formed on the wiring layer 50, a first insulating layer 32 is provided between the shield layer 33 and the wiring layer 50 for the purpose of insulating the two. This first
The insulating layer 32 is made of, for example, SOG (spin of glass).

Further, on the insulating layer 32, the bridge pillar 41
Also, a shield layer 33 formed of, for example, an aluminum film is formed on a portion excluding the peripheral portion.

The insulating layers 34 and 3 are formed on the shield layer 33.
And 5 are formed. The insulating layers 34 and 35 are, for example, SO
It is formed of G (spin of glass). The existence of the two insulating layers formed of the same material is due to the manufacturing reason described later.

An electrode plate 40 is provided on the bridge pillar 41. The electrode plate 40 has an area corresponding to the wiring width of the circuit board to be inspected, and as described above, in the present embodiment, it is formed so as to have a length of one side of about 1/3 of the wiring width. Has been done.

The sectional shape of the electrode plate 40 may be set so as to have a curvature according to the sectional shape of the wiring pattern to be inspected. The shield layer 33 is an electrode plate 40.
Prevents other sensor elements from picking up the signal received by the other sensor element from the lead (denoted as 50x) through which the signal passes. That is, the shield layer 33 ensures a high SN ratio.

The bridge column 41 is insulated by the SOG extending from the insulating layer 34 so as not to come into contact with the shield layer 33. Needless to say, the formation of the bridge pillar 41 is an example and may be obtained by other methods or steps.

The sensor probe board described with reference to FIGS. 6 and 7 is manufactured using a semiconductor process because the individual sensor elements are fine. Hereinafter, with reference to FIGS. 8 to 19, the sensor probe board 20 (5
An example of the manufacturing process (0) will be described. 8 to 19
FIG. 9 is a diagram for explaining a process of forming the sensor element of the present embodiment example shown in FIG. 6 using a semiconductor process. Although FIGS. 8 to 19 show a manufacturing process of one sensor element for convenience of description, as a matter of course, a process of forming all the sensor elements by a semiconductor process is implicitly shown.

First, in the step of FIG.
Insulating layer 31 of silicon dioxide by oxidizing the surface of
To form. The oxidation is performed by placing the base 30 in, for example, a CVD device (not shown) and sending oxygen gas into the device.

After the insulating layer 31 of silicon dioxide is formed, the wiring layer 50b is subsequently formed as shown in FIG. That is, a photoresist is applied on the insulating layer 31,
A pattern of lead wires of all sensor elements is drawn on the coated surface, and a pattern portion of the lead wires is masked (draw a mask pattern). Although only one sensor element is shown in FIG. 9 and subsequent figures, each layer is similarly formed in a plurality of adjacent sensor elements in the same process.

After that, exposure is performed, then the resist layer in the unmasked portion is removed, and a reaction gas containing an aluminum element is placed in a CVD apparatus (C
DV chamber), and the pattern of the lead wire 50b is formed on the insulating layer 31.

Next, as shown in FIG. 10, the insulating layer 32 is formed.
Are formed at least to a height at which the lead wire 50b of the wiring layer is hidden. Further, as shown in FIG.
A shield layer 33 made of aluminum metal is formed thereon.

Next, as shown in FIG. 12, the shield layer 3
By removing the bridge pillar 41 forming part of 3
Form 0. The size of the opening 70 may be such that SOG can enter between the bridge pillar 41 and the shield layer 33 so that the bridge pillar 41 does not contact the shield layer 33 in FIG. 6. That is, the opening 70 is larger than the cross-sectional area of the bridge column 41.

Since the bridge column 41 is formed in the opening 70 later, the bridge column 4 is formed at the time of formation.
An opening 70 (that is, a mask pattern forming the opening 70) is positioned and formed so that the wire 1 can be connected to the lead wire 50b.

The formation of the opening 70 is performed by applying an inert film to the surface portion other than the position where the opening 70 is formed, and then forming the shield layer 3
A reaction gas for removing 3 (for example, aluminum in the example of FIG. 6) is introduced into the CVD apparatus (CDV chamber) in which the base 30 is placed. Since this reaction gas does not react with the SOG layer 32, the layers below the SOG are not removed.

Next, the shield layer 3 in which the opening 70 is formed
As shown in FIG. 13, an insulating layer 34 made of SOG is formed on the No. 3 substrate. At this time, SOG penetrates into the inside of the opening 70 to form an insulating film. The steps shown in FIG. 14 are: a step of applying an inactive film on the insulating layer 34, a step of forming an opening 80 in the film, and a step shown in FIG.
Forming the bridge post 41.

The opening 80 is for later forming the bridge post 41 (FIG. 6). As described above, since the bridge pillar 41 should not contact the shield layer 33, the size of the opening 80 is smaller than the size of the opening 70, but the position of the opening 80 that defines the position of the bridge pillar 41 is Although it is positioned so as to be in a concentric circle (or concentric rectangle) position with 70 and the bridge column 41 is in contact with the lead wire 50b, its size is larger than the opening 70.

First, an inactive film is applied on the insulating layer 34. The exposure removes the inert material at the position where the opening 80 is formed. Next, the SOG of the insulating layer 34, the SOG that has entered the opening 70, and the active gas for removing the SOG of the insulating layer 32 are placed in the CVD apparatus (CDV) where the base 30 is placed.
Chamber) to remove SOG.

The holes 81 formed by removing the SOG of the insulating layer 32 should reach the wiring layer 50 from the insulating layer 34, as shown in FIG. Next, an active gas containing an aluminum element is introduced into the CVD apparatus (CDV chamber) on which the base 30 is placed, and the inside of the hole 81 is formed of aluminum metal. By this film formation, the wiring layer 50 is connected to the aluminum conductor, and the wiring layer 50 is connected to the insulating layer 34.
The bridge post 41 reaching the top of the bridge is completed.

Since an inert film is unnecessary, as shown in FIG.
Remove this. The top of the bridge post 41 substantially coincides with the surface of the insulating layer 34.

Next, the process of forming the electrode 40 will be described with reference to FIG. First, an inactive film is applied on the insulating layer 34, and the film material at the position of 83 is removed to form the opening 83 in the inactive film, as shown in FIG.

A reaction gas containing aluminum metal is introduced into the CVD apparatus (CDV chamber) in which the base 30 is placed, and a film is formed in the opening 83 by aluminum.

After that, the inactive film on the surface is removed. Then, as shown in FIG. 18, the electrode 4 is placed on the bridge pillar 41.
0 is formed. The opening 83 may have any shape, but its position is the position of the bridge column 41 (that is, the position of the mask pattern for forming the opening 70).
Must match.

Finally, the insulating layer 35 is formed as shown in FIG. The insulating layer 35 not only insulates the electrode 40 but also protects it. Thus, the sensor probe board having the cross sectional structure shown in FIG. 6 is completed. A polishing step may be added to ensure the flatness of the sensor surface.

In this embodiment, since the surface of the electrode 40 is protected by the insulating layer 35, the electrode 40 and the inspection object are electrically connected even if the sensor probe board is brought into contact with the inspection object. It does not happen, and is kept electrostatically coupled.

For this reason, when it is necessary to minimize the distance between the wiring pattern and the electrode 40 of the sensor probe board as in the case of inspecting an extremely small wiring pattern, the insulating layer 35 of the sensor probe is to be inspected. Even if they are closely attached, good inspection results can be obtained.

When the insulating layer 35 of the sensor probe is in contact with the object to be inspected, the distance between the electrode 40 and the object to be inspected is kept substantially constant, so that a stable detection result can be obtained.

The process of manufacturing the sensor board according to the present embodiment is not limited to the order of the processes shown in FIGS. Further, in the above-described sensor board manufacturing process, the bridge pillar 41 is formed after the insulating layer 34 is formed. This is to prevent the bridge pillar 41 from being bent and formed by vertically forming the aluminum film in the hole 81 at one time in the vertical direction.

However, the sensor of the present invention does not require the degree of integration such as IC and LSI, and the bridge pillar 41
The slight bending of the is not a problem. Therefore, it is possible to modify the process so as to form the holes for forming the bridge columns 41 each time the layers are formed.

<Inspection Method of this Embodiment> Next, an inspection method of inspecting a certain wiring pattern line 60 using the sensor probe board 20 of this embodiment manufactured as described above will be described. Since many sensor elements are formed on the sensor probe board 20 of the present embodiment, only the detection states of some of the sensor elements will be specifically exemplified in the following description.

FIG. 20 is a diagram showing an example of the positional relationship between the two when inspecting a certain wiring pattern line 60 in the inspection system using the sensor probe board 20 of the present embodiment.

In FIG. 20, individual sensor elements are shown in a square shape by a chain line, and are arranged in a matrix as shown. (1,1) shown in chain line,
(1,2), ... Are coordinate values that conveniently represent the position of each sensor element. The sensor element of the present embodiment is shown in FIG.
As shown in 0, the pattern line 60 to be inspected has a line width of, for example, about three sensor elements (a side of the sensor element is approximately (1/3) of the pattern to be inspected). .

As shown in FIG. 5, each of the sensor elements shown in FIG. 20 can output a detection signal corresponding to the distance to the pattern line.

FIG. 21 shows the pattern line 60 shown in FIG.
7 shows a distribution of detection results of detection signals that may be obtained in the positional relationship between the sensor element and the sensor element. In FIG. 21, the numerical values of 0 to 100 shown above the coordinate values of the sensor elements indicate the relative intensities of the received signals, and the individual sensor elements when the strongest received signal is 100 with respect to the applied inspection signal. Is the relative value of the signal detected at.

As shown in FIG. 21, in general, the pattern line 6
The distribution of the signal intensity along the distribution of the conductive metal portion of 0 is shown.

For example, in the case where the detection result can be visually confirmed by using the detection result, the relative strength of the output detection signal of each sensor element is determined by using the difference in the detection signal level between the sensor elements. When the brightness is modulated and displayed on a display device such as a CRT, the display state shown in FIG. 22 is obtained.

As a result, the user can visually confirm the wiring pattern detected by the sensor probe board 20 of the present embodiment only by looking at the brightness distribution displayed on the CRT display device.

Although FIG. 22 shows the detection result of a normal wiring pattern, the case of inspecting a pattern line having a broken portion as shown in FIG. 23 will be described. The signal intensity distribution that may be obtained in the relationship between the pattern line and the sensor element in the case shown in FIG. 23 is as shown in FIG. 24, for example.

FIG. 24 shows a distribution of relative values of signal intensity when the pattern line of FIG. 23 is inspected, and FIG. 25 shows a luminance distribution display example of the signal. The user can easily compare the luminance distribution in the normal state and the luminance distribution as shown in FIG. 25 to recognize the difference, and can know the disconnection position or the short circuit position from the luminance distribution.

In the examples shown in FIGS. 24 and 25, not only can the disconnection portion be reliably detected, but as will be described later, the inspection signal is also supplied to the pattern at the disconnection destination. Also, it is an example explaining that the disconnection state can be reliably detected. For example, when the inspection signal is not supplied to the wiring pattern prior to the disconnection portion, the inspection signal is not detected from the wiring pattern prior to the disconnection portion. Therefore, it goes without saying that the wiring pattern defect can be detected more easily.

In the conventional inspection method, it is possible to detect only when the inspection signal is not sent from the broken portion first, but in the present embodiment, as shown in FIGS. 24 and 25, Even if the wiring pattern is disconnected in the middle thereof and adjacent wiring patterns are short-circuited before and after the disconnection, the short-circuited portion and the disconnection portion can be reliably detected.

In order to automatically judge the quality of these inspection results, the detection result of the present embodiment may be sent to, for example, a computer or the like, and a normal pattern serving as a standard and the detected pattern may be compared. When the user's decision is requested, for example, only the portion that is expected to be the defective portion may be enlarged and displayed so that the user can judge.

<Structure of the inspection system according to the present embodiment>
The inspection system using the sensor probe board 20 of the present embodiment will be described below with reference to FIG. FIG. 26
FIG. 1 is a diagram showing a configuration of an inspection system according to an example of the present embodiment.

In FIG. 26, reference numeral 200 denotes a circuit board to be inspected placed on a mounting table (not shown). Circuit board 20
0, the sensor probe board 20 is mounted on the fine pattern area of the circuit board 200 to be particularly inspected.

The sensor probe board 20 is shown in FIGS.
As described above, the pad 30 is provided for taking out the detection output from the sensor electrode 40 of each sensor element to the inspection device main body side, but in FIG. 26, the pad is not shown for simplification. Each signal line from the pad is cable 2
It is shown in FIG.

Probes are in contact with the wide pattern line portions of the circuit board 200 for each pattern line. In the example of FIG. 26, the inspection signal from the predetermined oscillator 211 is transmitted to the left probe group via the cable 201,
It is applied to the probe group on the right side via a cable 202.

Reference numeral 240 denotes a matrix board, which has therein at least as many analog switches or relays 241 as the number of contact probes. For example, one terminal of each switch or relay is to ground,
The other terminal is configured to be connectable to the oscillator 211. All switches or relays are controllers 22
Controlled by 0.

For example, the controller 220 may include a switch or relay 241 connected to a contact probe that is in contact with a pattern that supplies a test signal.
Outputs a selection signal 229 so that the signal is connected to the oscillator 211 side. Then, the signal from the oscillator 211 is output in a pattern for supplying the inspection signal.

At this time, if the selection signal 229 is output so that the terminals of all other switches or relays are grounded, the inspection signal is input only to one probe (one pattern line) and the other probe (other Pattern line) can be grounded.

If the switch or relay connected to another contact probe is controlled to a free state in which it is not connected to any contact probe, the test signal is supplied only to the pattern to which the test signal should be supplied, and the other patterns are Can be controlled in the open state.

Output signals of all the sensor elements 21, ... On the sensor probe board 20 are collectively input to the controller 220 via the signal cable 26.

The detailed structure of the controller 220 will be described below with reference to FIG. FIG. 27 is a diagram showing a detailed configuration of the controller according to the present embodiment.

As shown in FIG. 27, the controller 220
Has a CPU 221 inside. The CPU 221 includes an analog multiplexer 222 and an A / D converter 22.
3. Control the I / O port 224. That is, the signals from the sensor elements in the signal cable 26 are sequentially selected by the analog multiplexer 222 under the control of the CPU 221, are A / D converted by the A / D converter 223, and are stored in the memory 225.

<Control Procedure> With reference to FIGS. 28 to 30, the inspection control procedure of the inspection system having the above-described configuration of the present embodiment will be described. FIG. 28 is a flowchart showing the control procedure of the entire inspection system.

First, in step S12, the circuit board to be inspected is positioned. As the positioning method, for example, a positioning marker provided in advance on the circuit board is detected by image processing or the like, and the circuit board is positioned so that the marker matches a predetermined coordinate value.

This positioning method is not limited to the above example, and it goes without saying that positioning may be performed by any method. For example, the circuit board to be inspected may be transported to the circuit board holding portion that is positioned and fixed in advance.

Then, as shown in FIG. 26, each inspection probe of the sensor probe board 20 of the present embodiment is brought into contact with a wiring pattern of a predetermined circuit board to be inspected to enable an inspection signal supply.

At the same time, the sensor element of the sensor probe is positioned and placed on the inspection target pattern. In this case as well, since the insulating layer 35 is interposed between the sensor electrode 40 and the pattern to be inspected, the sensor electrode 40 and the pattern to be inspected can be reliably maintained in an electrically non-contact state.

In a succeeding step S14, a probe to which the inspection signal is applied is selected. Then, step S16
The switch (relay) of the matrix board 240 is selectively controlled so that the probe to which the inspection signal is applied is connected to the oscillator 211. The number of the selected probe is represented by i.

Next, in step S18, the switches (relays) of the matrix board 240 are selectively controlled, and the probes other than i selected in step S14 are grounded (grounded).
To do. The probes other than i selected in step S14 may be controlled to the open state without being grounded.

The selection of these probes is performed by the controller 220 so as to set the switch selection signal 229 so that the switch element 241 corresponding to the probe i is connected to the oscillator 211, and for all probes other than the probe i. The switch element 241 corresponding to (1) selects the ground terminal.

Thus, the inspection signal is applied to the wiring pattern connected to the probe i on the circuit board, and the probe i
All wiring patterns connected to the probes other than are grounded.

The subsequent steps S20 to S26 are executed for all the sensor elements 2 on the sensor probe board 20.
This is a process of sequentially A / D converting the outputs from 1 ...

That is, in step S20, the sensor element counter j is initialized (j = 1), and in step S22, the output of the sensor element j is selected by the multiplexer 222.
The output of this sensor element j is sent to the A / D converter 223.

In the A / D converter 223, the following step S2
In 3, the sent analog output signal of the sensor element j is A / D converted to a corresponding digital signal, sent to the memory 225, and written in a predetermined area of the memory 225.

Next, in step S24, the counter j is set to 1
Increment by one to control the next sensor element (j + 1). Then, in step S26 (j)
It is checked whether or not the value of is greater than or equal to the maximum value (the number of sensor elements formed on the sensor probe board 20).

When the value of (j) is not more than the maximum value,
Since the signal values for all the sensor elements of the sensor probe board 20 have not yet been fetched in the memory 225, the process returns to step S22, the detection signal values of the next sensor element are fetched in the memory 225, and the processing is performed.
The processing operation of step S24 is repeated for all the sensor elements.

On the other hand, in step S26, when the value of (j) becomes larger than the maximum value, the signal values of all the sensor elements of the sensor probe board 20 are stored in the memory 2.
25 means that it has been incorporated. Therefore, the process proceeds from step S26 to step S28, and the detection signal output from the sensor element loaded in the memory 225 is read out and a predetermined image processing is performed. The image processing is performed by, for example, C in FIG.
It is performed under the control of the PU 221.

In the following step S30, the brightness is modulated according to the image processing result. Then, in the next step S32, C is displayed in order to display the brightness modulation result on the display screen of the CRT 230.
The RT controller 226 is controlled.

By displaying on the CRT 230, the CRT
22 or 25 is displayed on the display screen 230.
You will see a display like. Therefore, the user can monitor this display and determine the probe i (the wiring pattern connected to the probe i) to be inspected.

The actual display is performed by displaying only the detection results from the sensor element that has obtained the detection result of a certain level or higher and the sensor elements in the vicinity thereof, and omitting the display of the part where no detection signal is obtained. The quality of the inspection pattern can be checked more easily.

Alternatively, the detected portion may be enlarged and automatically scroll-displayed on the screen, and the detected portion determined to have a pattern defect by the image processing executed by the controller 220 may be stopped and displayed. Good.

After the wiring pattern supplied with the inspection signal from the probe is displayed on the CRT 230 in step S32, the process proceeds to step S34, and it is determined whether or not all the planned probes have been selected. If the inspection signals have not been supplied to all the probes, the process proceeds to step S36, and the frame memory 225 in which the inspection results of the electric field intensity distribution radiated from the wiring pattern to which the inspection signals have been previously supplied are stored. To clear.
Then, returning to step S14, the next probe i (i +
Select 1). Then, the processing from step S16 onward is repeated.

When the control in step S34 described above is not performed automatically but is performed by the user's selection, the process proceeds to step S36 after waiting for an instruction from the user. In this case, an icon (not shown, for example, a "NEXT" button) that instructs to move to the inspection of the next probe is displayed on the CRT 230, and the user desires to inspect another wiring pattern, for example. At this time, if the icon (not shown, for example, "NEXT" button) displayed on the CRT 230 is selected, the control procedure proceeds from step S34 to step S36, and then returns to the processing of step S14 to proceed to the next probe. i (i +
1) is selected, and the processing from step S16 is repeated.

This is because, for example, when one serious defective portion is found, it is clear that the inspection target is a defective product, and therefore it is not necessary to continue the inspection thereafter. Automatically from step S34 to step S36
Even when performing the transition control to the CRT 230, if the inspection result that is expected to be the defect of the inspection target is obtained,
It may be controlled to stop the screen display and wait for the user's instruction.

When the detection result pattern is displayed on the CRT 230, it is preferable to display the numbers of the selected probe and the inspected wiring pattern as shown in FIG. 22, for example.

The wiring pattern number can be easily known from the design data (CAD data) of the circuit board to be inspected, and the pattern number and the probe number can be associated with each other based on the data.

With this display, the user can confirm the number of the wiring pattern currently inspected and the quality of the wiring pattern.
It is possible to make a determination while checking the probe number of the connection destination.

<Batch Display Control> The above description is an example of sequentially displaying the inspection results obtained from the sensor element for each probe (each pattern line) on the CRT. However, the present invention is not limited to the above example, and all the inspection results of the inspection target (all pattern lines of the inspection target) may be controlled to be collectively displayable.

Another inspection system control for controlling all the inspection results of the inspection object (all pattern lines of the inspection object) to be collectively displayed will be described below with reference to FIG. FIG. 29
Is a flowchart for explaining an example in which all the inspection results of the inspection target (all pattern lines of the inspection target) are collectively displayed, and the control procedure of FIG. Only the part related to is shown. Figure 2
The feature of the control shown in 9 is that the images of all the pattern lines are displayed collectively.

The flowchart of FIG. 29 shows only the control portion which replaces the control of steps S28 to S34 of the flowchart of FIG. In step S26 of the control procedure shown in FIG. 28, one pattern line (probe i)
If the signals from all the sensor elements are stored in the memory 225, the process proceeds to step S40 in FIG. 29, and it is determined whether the user wants the collective display or the individual pattern lines. Check.

The user pre-designates whether the batch display or the display for each pattern line is desired using an icon button (not shown in the drawing) displayed on the CRT 230. Alternatively, an instruction may be given when the process of step S26 is completed and the process first proceeds to step S40, and thereafter, control may be performed such that the process corresponding to the instruction result is automatically performed in accordance with the instruction at this time.

In the processing of step S40, when the user's instruction is to display individual pattern lines, the process proceeds to step S50, the probe number j selected so far is stored in the register [Pi], and the memory is stored in the memory. The inspection result is controlled to be read from the inspection result storage area corresponding to the probe number j therein.

Subsequently, in step S52, the inspection result from the sensor element obtained for the pattern line i to which the inspection signal is supplied from the probe of the probe number j in the memory 225 is read out, and the image processing is performed similarly to step S28. Then, the processed image is brightness-modulated.

Then, in step S54, the luminance-modulated inspection result is displayed on the CRT 230. Then, in the next step S56, as in step S34 of FIG.
After confirming that the user wants to display the next pattern line and that the display inspection of all patterns has not been completed, the process proceeds to step S58, and the inspection signal is supplied from the probe of the probe number j of the memory 225. The stored content of the inspection result from the sensor element obtained for the pattern line i that has been displayed is cleared (to prevent overlapping display), and the process returns to step S14.

On the other hand, in step S40, when the user desires collective display, the process proceeds to step S42, and the image Pi from the sensor element obtained for the pattern line i this time is obtained.
In (j), the image Pi-1 (j) from the sensor element obtained for the previous pattern line i-1 is subjected to the logical sum operation.

By controlling in this way, the images of all the pattern lines with i from 1 to i are stored in the memory 225. Then, the process proceeds to step S44.

In step S44, it is confirmed whether or not the images of all the pattern lines have been stored in the memory 225. If the images of all the pattern lines are not stored in the memory 225, the process returns to step S14 and the process for the next probe is performed.

In this manner, the inspection signals are sequentially supplied to the probes to be inspected and the inspection signals from the inspection object pattern are stored in the memory, and in step S44, the images of all the pattern lines are stored in the memory 225. If it is in the state of being, the process proceeds to step S46, the inspection results from the sensor elements obtained for all the pattern lines in the memory 225 are read out, image processing is performed in the same manner as in step S28, and then the processed image is subjected to luminance Modulate.

Then, in step S48, the luminance-modulated inspection results are collectively displayed on the display screen of the CRT 230. As a result, the inspection results for all the pattern lines to be inspected can be visually checked at the same time.

Depending on the setting of the inspection system, whether the above-mentioned individual pattern display or collective display is fixed is fixed in advance, and the display according to the standard setting is made unless otherwise specified. You may control. For example, it is conceivable that the standard setting is such that collective display is performed.

<Details of Normalization Processing> It is preferable that the predetermined image processing in steps S28 and S52, 46 in the above description can be changed according to the target circuit board. That is, step S28 in the above description,
In the predetermined image processing in steps S52 and S46, in order to perform the brightness modulation on the inspection result, the processing is performed so that the inspection result becomes the information capable of performing the brightness conversion, for example, the inspection result is expressed by the brightness. However, the present invention is not limited to the case where the result of the above brightness modulation is displayed on the display screen of the CRT, and a predetermined color is assigned to each output value of the sensor element and the display is made so that the color can be used for discrimination. May be.

As described above, a modified example of the predetermined image processing of the present embodiment in which a predetermined color is assigned to each output value of the sensor element and displayed so as to be discriminable by color will be described below with reference to FIG. Explained. FIG. 30 is a flowchart illustrating a modified example of the predetermined image processing according to this embodiment.

In step S50 of FIG. 30, the user is urged to select a reference value for expressing the output signal from the sensor element as a percentage.

As described with reference to FIG. 21 and the like, the output signal from the sensor element varies depending on the distance between the sensor probe board and the circuit board and the like, but the variation is fixed depending on the circuit board. The reference value is used for normalizing the output signal from the sensor element to match the dynamic range of the CRT 230.

Specifically, for example, the controller 220
Prepare multiple reference values corresponding to the type of circuit board with
It is conceivable to control so as to instruct which one of the reference values is selected.

In the following step S52, the output signal from each sensor element is normalized by the selected reference value. Note that the selection of the normalization reference value in step S50 is
Even if the user does not select it, the system can automatically allocate it if the circuit board to be inspected is known. This improves the operability for the user.

When the inspection system automatically assigns the reference value and further the user can change the reference value within a predetermined range (for example, a range of 10%), the hidden failure It may also appear when the location is displayed.

The signal value normalized in step S52 is
In step S54, the signal is multivalued by a predetermined multivalued method. In step S56, a color is assigned to the multi-valued output signal value for each value.

For example, if the value of the detection signal is [100], a normal pattern exists, so "black" is assigned, and if the value of the detection signal is [50], there is a possibility of pattern disconnection. "Red" is assigned and the value of the detection signal is [0
0], the inspection signal is not detected, and there is no pattern to which the inspection signal is supplied.
Should be assigned. By such color-based display, the distinguishability of defective parts is improved.

It is also possible to further subdivide each value of the detection signal and allocate many colors. Figure 2
2, 10 different colors may be assigned according to the case of the luminance modulation shown in FIG.

<Pattern Recognition Processing> FIG. 31 is a flow chart relating to a control procedure aiming at further improvement of the identification of the defective portion. Step S of the flow chart of FIG.
It aims at the further improvement of the identification of the defective part instead of 28 to step S32. The details of the control aiming at the further improvement of the identification of the defective portion will be described below with reference to FIG.

When the process of step S26 of FIG. 28 is completed, the process moves to step S60 of FIG.
A user is made to select the threshold value used for the binarization process performed in 62.

In the following step S62, the output signal of the sensor element is binarized using this threshold value. In this binarization, the digital signal obtained in step S23 may be binarized as it is and stored in the memory.

Note that the threshold value used for the binarization processing in step S26 can be selected even if the user does not select it.
If the circuit board to be inspected is known, the system can automatically allocate it. This improves the operability for the user.

Alternatively, the maximum value of the detection signals is obtained, or the average value of the detection values of the several sensors having the highest detection level is obtained, and the obtained value and

[0] Above, the minimum value of detection values or the average value of the detection values of the few sensors with the lowest detection level is obtained, and if the value near the middle is used as the threshold value for the binarization processing, the detection result of the sensor element is detected. The binarization process can be performed using the relative value of, and the accuracy of the detection result of the pattern to be inspected can be further improved.

When the inspection system automatically assigns a threshold value and then the user can change the threshold value within a predetermined range (for example, a range of 10%), the hidden failure point is detected. If it is displayed, it will appear.

In the next step S64, the binarized signal is labeled to detect a continuous area. In step S66, the feature amount is extracted for each continuous region. In the case of a normal wiring pattern, the continuous area should correspond to one pattern line. Therefore, the features of the present embodiment include the length of the continuous region, the length of the continuous region in the direction orthogonal to the longitudinal direction (that is, the line width of the pattern = known), the barycentric position of the continuous region, and the continuous position. The position of the inflection point existing in the area, the shape of the skeleton line of the continuous area, and the like.

If a plurality of continuous areas are obtained for one pattern line, it is considered that there is a disconnection. Therefore, in step S68,
A reference feature amount of the wiring pattern i (a reference feature amount of a normal wiring pattern i which is obtained in advance and stored in a predetermined memory) is read.

Then, in step S70, the pattern line i
The matching is performed by comparing the actually obtained feature amount with the reference feature amount read in step S68.

In step S72, a defective portion is detected based on the matching result in step S70. In detecting a defective portion, for example, when the length of the continuous region in the image corresponding to the detected pattern line is short, it is determined that there is a defect (disconnection).

On the other hand, if the center of gravity position is deviated although the length does not change, it is determined that a part of the pattern is missing. If the total length of the continuous area is zero,
Alternatively, if it is longer and the number of inflection points is increased, it is determined that there is a short circuit.

In the case where there is a short circuit between different pattern lines, if all the probes in contact with other pattern lines are grounded as described above, the pattern line to be inspected will also be grounded, No continuous quantity is detected in all areas. Therefore, in this case, a short circuit can be detected by not detecting anything.

In step S74, the obtained image of the pattern line and the reference feature amount of the pattern line are displayed in an overlapping manner (or in parallel). In the case of overlapping display, the colors of the image of the obtained pattern line and the image of the reference feature amount are made different from each other so that blend display is performed.

The defective portion obtained in step S72 may be displayed together with this display.

According to the control procedure of FIG. 31 explained above,
The inspection system can recognize the defective portion by using the pattern matching method and display it to the user.

In the above embodiment, if the electrodes (terminals) for inputting the inspection signal have a width that does not interfere with the sensor probe board and can contact the probe, the substrate It can be any position above.
However, in practice, it is preferable to use the terminal terminal of the circuit board 200.

According to the embodiment described above, the following operational effects can be obtained. (1) By manufacturing a sensor board using a semiconductor process, the size of each sensor element can be miniaturized, and a circuit board having a fine wiring pattern can be inspected. (2) In the above-described embodiment, since the shield layer is provided between the electrode layer and the lead wire layer, noise is reduced and reception sensitivity is improved. Therefore, the electrode 4 of the sensor element of the sensor board is reduced.
Even when the area of 0 is small and the received signal strength is extremely small, it is possible to prevent the problem of crosstalk from other cells (sensor elements) that cannot be predicted by a normal IC memory circuit. (3) By using the above sensor board, the signal from the pattern can be detected in a non-contact manner with the pattern on the work substrate to be inspected, so that it is possible to reliably detect the signal from the target pattern without positioning with high precision of the sensor board. A signal can be detected, and a defect inspection can be performed up to a minute level.

[Other Embodiments] As described above, the finer the sensor element, the higher the resolution, but the cost and labor required to prepare the sensor board, and the output signal from the element. The strength becomes smaller. Therefore, a preamplifier may be provided for each sensor element on the board. In this case, the preamplifier may be composed of transistor elements, for example, and the transistor elements of all the sensor elements may be of active matrix type.

In addition, the above-mentioned sensor probe board 20
(Or 50) the uppermost insulating layer 35 of each sensor element is
In order to shorten the distance to the inspection work and improve the sensor sensitivity, the thickness is preferably thin.

Further, in the actual inspection, it is preferable that the dielectric constant of the insulating layer 35 is low in order to increase the sensor sensitivity.

Further, the sensor board of this embodiment is shown in FIG.
As shown in, it is formed on the silicon substrate 30. This is because the sensor element is formed on the silicon substrate, so that the flatness of the entire sensor board is improved.

When the flatness is improved, the distance between the work substrate to be inspected and the electrode can be made constant, and as a result, the variation in the measured value between the sensor elements can be reduced. At this point, the bridge pillar 41 may be extended downward to the silicon substrate 30 (to the silicon dioxide substrate 31 in FIG. 6). Further, if flatness is not required, the sensor element may be formed on the silicon dioxide substrate 31.

It is preferable that the sensor board of the above-described embodiment is integrated into a single board including a signal processing circuit. 32 shows
It is a figure which shows an example which formed the sensor part and the signal processing part on the same silicon (Si) substrate.

In FIG. 32, 400 and 300 are the same single silicon (Si) substrate. Electronic circuits 401, 402, 403 are formed on the silicon substrate 400. A connector 404 is provided at one end of the silicon substrate 400.

These electronic circuits are constituted by a hybrid circuit or a monolithic circuit, 401 is a preamplifier (or multiplexer), 402 is an amplifier, 4
Reference numeral 03 is a filter (for signal processing).

The same number of sensor elements 21 as those in FIG. 6 are formed on the silicon substrate 300, that is, the sensor probe board 20 is formed.

In the example shown in FIG. 32, the sensor probe board 20 is formed by growing electrodes, bridge pillars, etc. in the back direction of the paper surface, and FIG. 33 shows a state in which the silicon substrate 300 is turned upside down. That is, FIG. 33 shows that many round electrodes 40 are formed on the surface of the sensor probe board 20.

Referring to FIG. 32, the signal line 301 for propagating the signal from each sensor element is connected to the above-mentioned preamplifier 401. The silicon substrate 400 shown in FIG. 32 is attached to an inspection unit (not shown) by a connector 404.

As described above, by integrally forming the sensor board and the signal processing circuit board, stable measurement with less noise can be performed. Moreover, by integrating, the downsizing of the inspection system is achieved and the portability is increased. For example, if the sensor unit is a work board 500
Can be placed close to the work substrate 500 or placed on the work substrate 500 to bring the uppermost insulating layer 35 close to the upper portion of the work substrate 500 to be inspected.

Although the CVD method is used in the above-described embodiments, the film layer can be formed by vapor deposition or sputtering, and the method for forming the film layer is not limited.

Although the lead wire layer is formed of aluminum in the above-described embodiments, copper (Cu) or silver (Ag) may be used instead of aluminum (Al). Since the present invention does not depend on the type of material of the lead wire layer, it may be used in addition to aluminum (Al), copper (Cu), and silver (Ag) in the future with the progress of semiconductor technology. It is easy to apply other conductor materials to the manufacturing process of the sensor probe of the present invention.

In the above-mentioned embodiment, as an insulator
Although SOG was used, other insulators or passivation may be used.

[0164]

As described above, according to the present invention,
It is possible to provide an electronic circuit inspecting apparatus and an electronic circuit inspecting method capable of accurately inspecting a fine wiring pattern regardless of the state of a pattern to be inspected.

In particular, the inspection signal of the conductive pattern to be inspected, which is supplied with the inspection signal, is provided by providing the sensor elements having a size smaller than the line width of the conductive pattern to be inspected, which are arranged in a matrix form close to each other. It becomes possible to two-dimensionally detect the intensity of the radiation wave radiated from the conductive region, to detect the inspection signal conductive region shape of the conductive pattern to be inspected, and the reference pattern which is a normal pattern. By performing the pattern matching, it becomes possible to easily and accurately inspect all defective points such as disconnection in the middle of the pattern, partial cutout, short circuit with an adjacent pattern, even in the case of a branch pattern.

Further, since it is not necessary to position the sensor strictly, it is possible to easily inspect even a fine pattern.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a sensor probe of an inspection device according to a conventional example.

FIG. 2 is a bottom view illustrating the configuration of the area type sensor probe board according to the embodiment of the present invention.

FIG. 3 is a bottom view illustrating the configuration of the line type sensor probe board according to the present embodiment.

FIG. 4 is a schematic diagram illustrating a positional relationship between pads and sensor elements in the area type sensor probe board according to the present embodiment.

FIG. 5 is a diagram illustrating a manner in which a radiated wave from a pattern on a substrate of the present embodiment is radiated toward a sensor element which is separated from the pattern and is maintained in a non-contact state.

FIG. 6 is a cross-sectional view showing the configuration of the sensor element according to the present embodiment.

FIG. 7 is a diagram illustrating the arrangement of electrodes, bridge wires, and lead wires in the sensor element according to the present embodiment.

FIG. 8 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 by using a semiconductor process. FIG.

9 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process. It is a figure.

FIG. 10 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 11 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 12 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

13 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 14 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 15 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

16 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 17 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 18 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 19 is a diagram illustrating a process of forming the sensor element shown in FIG. 6 using a semiconductor process.

FIG. 20 is a diagram showing a positional relationship between the two when inspecting a wiring pattern line to be inspected in the inspection system using the sensor board of the present embodiment.

FIG. 21 is a diagram showing a distribution of output values from each sensor element of the sensor board shown in FIG. 20.

22 is a diagram showing a display mode when a distribution of output values from each sensor element of the sensor board shown in FIG. 20 is brightness-modulated and displayed.

FIG. 23 is a diagram illustrating a layout relationship between a circuit pattern having a defective portion to be inspected and a sensor probe board according to the present embodiment.

FIG. 24 is a diagram showing a distribution of output values from each sensor element of the sensor board shown in FIG. 23.

25 is a diagram showing a display mode when the distribution of output values from each sensor element of the sensor board shown in FIG. 23 is luminance-modulated and displayed.

FIG. 26 is a diagram illustrating a configuration of an inspection system according to the present embodiment.

FIG. 27 is a diagram showing a configuration of a controller according to the present embodiment.

FIG. 28 is a flowchart illustrating a control procedure according to the present embodiment.

FIG. 29 is a flowchart illustrating a control procedure according to a modified example of display according to the present embodiment.

FIG. 30 is a flowchart illustrating a control procedure according to a modified example of normalization of the present embodiment.

FIG. 31 is a flowchart illustrating a control procedure according to a modified example of automation of defect detection according to the present embodiment.

FIG. 32 is a diagram illustrating a configuration according to a modified example of the sensor probe according to the present embodiment.

FIG. 33 is a perspective view of the probe shown in FIG. 32 as seen from the electrode side.

Continued front page    F term (reference) 2F063 AA13 AA41 BA26 BB02 BC05                       DA05 DC08 DD07 EB05 FA08                       LA19 MA05                 2G011 AA01 AD02 AE01                 2G014 AA02 AA03 AB59 AC10                 2G132 AA00 AD15 AE14 AF15 AL12

Claims (8)

[Claims] 1. An electronic circuit inspection device for inspecting a conductive pattern formed on an electronic circuit and supplied with an inspection signal, comprising: holding means for holding reference conductive pattern information of an inspection target, and at least an inspection target. An electric field sensor capable of detecting the electric field strength generated from the conductive pattern of the inspection object to which the inspection signal is supplied, the sensor elements having a size smaller than the line width of the conductive pattern are arranged in a matrix in close proximity to each other, Setting means for setting a threshold value for binarizing the detection result from the electric field sensor, and binarizing means for binarizing the detection result from the electric field sensor based on the threshold value set by the setting means. Determination means for comparing the binarized information binarized by the binarizing means with the reference conductive pattern information held by the holding means and for judging the quality of the inspection target pattern based on the comparison result Electronic circuit testing apparatus, characterized in that it comprises a. 2. A sensor element of the electric field sensor is covered with an insulating layer, the electric field sensor is positioned and mounted on the conductive pattern of the inspection object, and the intensity of the radiated wave detected by the electric field sensor is inspected. The electronic circuit inspection device according to claim 2. 3. The determination means detects a continuous area from the binarized information to calculate a skeletal line of the continuous area, and compares the skeletal lines of the continuous area obtained from the reference conductive pattern information to perform the inspection. The electronic circuit inspection apparatus according to claim 1 or 2, wherein the quality of the target conductive pattern can be determined. 4. The skeletal line of the continuous region is obtained by labeling a binarized signal to obtain the length of the continuous region and the line width of the pattern, and obtaining the shape of the skeletal line of the continuous region from the position of the center of gravity of the continuous region. 4. The electronic circuit inspection device according to claim 3, wherein 5. A holding means for holding pattern information of a reference conductive pattern to be inspected, which is formed on an electronic circuit and to which an inspection signal is supplied, and a sensor element having a size at least smaller than a line width of the conductive pattern to be inspected. Are arranged in a matrix in close proximity to each other, and an electric field sensor capable of detecting an electric field intensity generated from the conductive pattern of the inspection object to which the inspection signal is supplied is provided, for inspecting the conductive pattern of the inspection object. An electronic circuit inspection method in an electronic circuit inspection device, wherein a threshold for binarizing the detection result from the electric field sensor is set, and the detection result from the electric field sensor is binarized based on the set threshold, It is characterized in that the binarized binarized information is compared with the reference conductive pattern information held by the holding means, and the quality of the inspection target pattern is determined by the comparison result. Electronic circuit test method. 6. The sensor element of the electric field sensor is covered with an insulating layer, and the electric field sensor is positioned and mounted on the conductive pattern to be inspected to inspect the radiated wave intensity detected by the electric field sensor. The electronic circuit inspection method according to claim 5, wherein 7. The quality of the inspection target pattern is determined by detecting a continuous region from the binarized information, calculating a skeletal line of the continuous region, and comparing skeletal lines of the continuous region obtained from the reference conductive pattern information. The electronic circuit inspection method according to claim 5 or 6, wherein the quality of the conductive pattern to be inspected is determined. 8. The skeletal line of the continuous area is obtained by labeling a binarized signal to obtain the length of the continuous area and the line width of the pattern, and obtaining the shape of the skeletal line of the continuous area from the position of the center of gravity of the continuous area. 8. The electronic circuit inspection method according to claim 7.