JP2003201458A - Reactive adhesive composition and adhesive sheet thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reactive adhesive composition and a reactive adhesive sheet excellent in storage stability and having excellent heat resistance, adhesiveness and stress-relaxation property. <P>SOLUTION: This reactive adhesive composition comprises (a) an olefinic copolymer having epoxy groups in the molecule, (b) a compound having two or more functional groups reacting with epoxy groups in the molecule and (c) a block copolymer having an aromatic vinyl compound polymer block (c1) and a conjugated diene compound polymer block (c2). <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a reactive adhesive composition and a reactive adhesive sheet. INDUSTRIAL APPLICABILITY The reactive adhesive composition of the present invention can form an adhesive layer having excellent adhesiveness and heat resistance by being cured in a relatively short time. An adhesive sheet having the adhesive layer is used for fixing electronic parts and the like, and in particular, for adhering a metal reinforcing material used in an electronic part such as an IC package and a heat-resistant film such as a polyimide film or an IC.
It can be advantageously used for fixing chips and the like.

[0002]

2. Description of the Related Art Various adhesives are used for the purpose of improving reliability in fixing electronic parts and the like. In particular, structural bonding applications such as fixing of flexible printed wiring boards and reinforcing materials, fixing of circuit boards used for semiconductor devices such as ball grid arrays and reinforcing plates or heat dissipation plates, and manufacturing processes such as temporary fixing during parts transportation. In the above adhesive application,
Adhesives are being used more often.

In such applications, a polyimide film is used for a flexible circuit board, and a metal material or a glass epoxy plate is used for a reinforcing material. Good adhesion to is required. In addition, in such applications, it has high heat resistance to withstand the high temperature of 200 ° C or higher, which is the condition of solder reflow at the time of mounting components, and it is possible to perform low-pressure, low-temperature, short-time adhesion treatment for the purpose of improving productivity. Is required.

Heretofore, epoxy adhesives and polyimide adhesives have been studied as adhesives used for bonding electronic parts and the like. in recent years,
An adhesive sheet having low elasticity and low water absorption has been demanded from the requirements of thermal stability in a pressure cooker test and the like imposed on semiconductor devices and good stress relaxation in a temperature cycle test.

As an adhesive for an adhesive sheet capable of satisfying both the requirements of low elasticity and high heat resistance, a polymer having an epoxy group introduced in its main chain is compounded with a compound having reactivity with the polymer to crosslink. -It is known that it is cured.
As the polymer into which the epoxy group is introduced, an ethylene copolymer having an epoxy group in the molecule is particularly preferable in terms of adhesiveness and low water absorption. A conventionally known reaction can be used for crosslinking / curing the ethylene-based copolymer, and examples of the compound that can be used in the reaction include, for example, Bond First Technical Data, page 5 [Sumitomo Chemical Co., Ltd., published in May 1996]. It is described in. Among them, at least one selected from an epoxy resin, a phenol resin, an acid anhydride, and a carboxylic acid is preferably used from the viewpoint of reactivity.

However, the compound has poor compatibility with the ethylene copolymer. In particular, among the above compounds, those having an aromatic ring in the structure have poor compatibility. Therefore, the adhesive composition containing them has a problem in storage stability which causes phase separation or bias over time.

[0007]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems that a reactive adhesive composition and a reactive adhesive sheet using a conventional ethylene-based copolymer have, and solves the above problems. Excellent stability, excellent heat resistance, adhesiveness,
An object of the present invention is to provide a reactive adhesive composition having stress relaxation property and a reactive adhesive sheet.

[0008]

As a result of intensive studies to solve the above problems, the present inventors have found that the adhesive composition shown below can achieve the above object, and have completed the present invention. .

That is, the present invention relates to an olefin copolymer (a) having an epoxy group in the molecule, a compound (b) having two or more functional groups which react with an epoxy group in the molecule, and an aromatic vinyl compound polymer. The present invention relates to a reactive adhesive composition comprising a block copolymer (c) having a united block (c1) and a conjugated diene compound polymer block (c2).

The above-mentioned reactive adhesive composition of the present invention is usually obtained by adding a block copolymer (c) as a compatibilizing agent to an olefin-based copolymer (a) which has a low polarity and a limited compatible resin. ) Is included. As a result, even when a compound having an aromatic ring or the like as a skeleton is used as the compound (b) which is a curing agent, the reactive adhesive composition can suppress phase separation and segregation over time. Excellent storage stability. Further, the reactive adhesive composition of the present invention uses the olefin-based copolymer (a) and has heat resistance, adhesiveness and stress relaxation property.

In the reactive adhesive composition, the compound (b) is preferably at least one selected from epoxy resins, phenol resins, acid anhydrides and carboxylic acids. As the compound (b), a compound having two or more functional groups capable of reacting with an epoxy group in the molecule can be used without particular limitation, but the compounds exemplified above are preferable. It is particularly suitable when the compound (b) has an aromatic ring.

In the above reactive adhesive composition, the aromatic vinyl compound polymer block (c1) of the block copolymer (c) and the conjugated diene compound polymer block (c2)
The weight ratio of (c1) / (c2) = 10/90 to 40/6
It is preferably 0.

Aromatic vinyl compound polymer block (c
When the proportion of 1) is small, the compatibility when the compound (b) has an aromatic ring is low, so the proportion of the aromatic vinyl compound polymer block (c1) is 10% by weight or more, and further 15% by weight or more. Is preferred. On the other hand, if the proportion of the aromatic vinyl compound polymer block (c1) increases, the compatibility with the olefin-based copolymer (a) tends to deteriorate, so the aromatic vinyl compound polymer block (c)
The proportion of 1) is preferably 40% by weight or less, more preferably 30% by weight or less.

In the reactive adhesive composition, the content of the block copolymer (c) component is 5 to 150 parts by weight based on 100 parts by weight of the total amount of the olefinic copolymer (a) and the compound (b). Part is preferable, and more preferably 5 to 5.
The amount is 0 parts by weight, more preferably 10 to 40 parts by weight.
If it is less than 5 parts by weight, the function as a compatibilizing agent tends to be low and the storage stability of the adhesive composition and the adhesive sheet tends to be lowered, and if it is more than 150 parts by weight, the adhesiveness tends to be lowered.

In the above reactive adhesive composition, the content of the compound (b) is 1 with respect to 100 parts by weight of the total amount of the olefin copolymer (a) and the block copolymer (c).
To 150 parts by weight, more preferably 3 to 100 parts by weight.
Parts by weight, more preferably 5 to 50 parts by weight. If the amount is less than 1 part by weight, the curing is insufficient and the heat resistance tends to decrease, and if it exceeds 150 parts by weight, the adhesiveness tends to decrease.

The reactive adhesive composition of the present invention may further contain an epoxy group curing accelerator. By adding a curing accelerator, the curing start temperature can be set arbitrarily, and it can be used for a wide range of materials from materials having a relatively low heat resistance temperature such as polyester to adhesion of high heat resistance materials such as polyimide.

The present invention is also characterized in that one or both sides of the substrate are
A reactive adhesive sheet having an adhesive layer formed from the reactive adhesive composition. The reactive adhesive sheet having the adhesive composition of the present invention as an adhesive layer,
Good storage stability, excellent heat resistance, adhesiveness, and stress relaxation. The present invention also relates to an electronic component assembled by using the adhesive layer formed on the reactive adhesive sheet.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The olefin copolymer (a) containing an epoxy group in the molecule used in the adhesive composition of the present invention is, for example, a polymer or copolymer of ethylene or propylene, ethylene. Examples thereof include polymers obtained by copolymerizing or graft-polymerizing a monomer having an epoxy group such as glycidyl (meth) acrylate in a vinyl acetate copolymer or an ethylene- (meth) acrylate copolymer. The olefin-based copolymer (a) may be used alone or in combination of two or more.

The olefin-based copolymer (a) contains at least 5 monomer units of ethylene or propylene.
0% by weight, and the monomer unit content of the monomer having an epoxy group is 2 to 30% by weight, and further 5 to
It is preferably 15% by weight. If it is less than 2% by weight, the adhesiveness tends to be poor, and the number of origins of crosslinking tends to be small, resulting in poor heat resistance after curing. On the other hand, when it is more than 30% by weight, the elastic modulus after curing tends to increase and the stress relaxation property tends to decrease, and the hygroscopicity of the epoxy group also increases the hygroscopicity of the adhesive layer, resulting in moisture absorption during solder reflow. There is a problem that peeling occurs due to vapor pressure due to vaporization of the water.

The olefin copolymer (a) is preferably an ethylene copolymer. Specific examples thereof include an ethylene-glycidyl methacrylate copolymer, an ethylene-glycidyl methacrylate-vinyl acetate copolymer, an ethylene-glycidyl methacrylate-vinyl acetate copolymer and the like. Such an olefin-based copolymer (a) can be obtained from, for example, a product group called Pond First manufactured by Sumitomo Chemical Co., Ltd.

As the compound (b) used as a curing agent for the olefinic copolymer (a), a compound having two or more functional groups capable of reacting with an epoxy group in the molecule can be used without particular limitation. The compound (b) undergoes a crosslinking / curing reaction with the epoxy group in the olefin-based copolymer (a),
Improves heat resistance.

As the compound (b), various conventionally known compounds can be used. In particular, an epoxy resin, a phenol resin, an acid anhydride and a carboxylic acid are preferably used from the viewpoint of reactivity with the epoxy group in the olefin-based copolymer (a).
As the compound (b), those having an aromatic ring are particularly preferable. As the compound (b), one type may be used alone, or two or more types may be used in combination.

Specific examples of the compound (b) include glycidylamine type epoxy resin, bisphenol F type epoxy resin, bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, naphthalene type. Epoxy resin, aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, epoxy resin such as halogenated epoxy resin; phenol resin such as phenol novolac resin, cresol novolac resin and xylene resin; There are acid anhydrides such as maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and succinic anhydride; carboxylic acids such as pyromellitic acid and trimellitic acid, and block carboxylic acids to which vinyl ether is added. It is.

The block copolymer (c) of the present invention is a compatibilizing agent for the olefin copolymer (a) and the compound (b) compound, and is an aromatic vinyl compound polymer block (c).
1) and a conjugated diene compound polymer block (c2), and has a structure compatible with both. Examples of the aromatic vinyl compound polymer block (c1) include a styrene polymer block, and examples of the conjugated diene compound polymer block (c2) include a butadiene polymer block or an isoprene polymer block. As the block copolymer (c), block copolymers of SIS type, SBS type, SIBS type and the like can be used without particular limitation.

Further, as the block copolymer (c),
It is preferable to use the hydride of the block copolymer (c) because of its good thermal stability. The block copolymer (c) is hydrogenated to such an extent that the olefinically unsaturated double bond is saturated. Hydrogenated butadiene-styrene block copolymers are commercially available as SEBS, and hydrogenated propylene-styrene block copolymers are commercially available as SEPS. The block copolymer (c) of the present invention may be carboxylic acid-modified with maleic acid, acrylic acid or its anhydride. The carboxylic acid-modified block copolymer (c) is an olefin-based copolymer (a).
It has reactivity with and is preferable from the viewpoint of heat resistance. Particularly, as the block copolymer (b) of the present invention, a hydride of the carboxylic acid-modified block copolymer (b) is preferable. Examples of commercially available products of the block copolymer (b) include Tuftec M series (manufactured by Asahi Kasei Kogyo Co., Ltd.) and Kraton FG1901X (manufactured by Shell Japan Co., Ltd.).

The adhesive composition of the present invention usually contains the olefinic copolymer (a), the compound (b) and the block copolymer (c) in the above proportions, and further contains an epoxy group. Can be included. As the curing accelerator, various imidazole compounds and their derivatives, amine catalysts, phosphorus catalysts, dicyandiamide,
A hydrazine compound and a microencapsulated product thereof can be used. The compounding amount of such a curing accelerator is
Although it can be appropriately selected depending on the desired curing rate, it is usually 10 parts by weight or less based on 100 parts by weight of the solid content of the adhesive composition. Preferably about 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, still more preferably 0.5 to 3 parts by weight.
Parts by weight.

Further, the adhesive composition of the present invention may contain an inorganic filler. The inclusion of an inorganic filler is preferable because it has the effects of controlling the linear expansion coefficient, imparting heat resistance, imparting electrical conductivity and thermal conductivity, and the like. As the inorganic filler, silica, alumina, aluminum hydroxide,
Examples include magnesium hydroxide, boron nitride, aluminum nitride, boron carbide, and other metal powders. The inorganic filler is preferably surface-treated with a silane coupling agent, particularly from the viewpoint of improving compatibility with resin and adhesion.

Furthermore, in the adhesive composition of the present invention, various known publicly known organic fillers, pigments, antioxidants, silane coupling agents, tackifiers, etc. can be used within a range that does not deteriorate the properties of the adhesive sheet. Additives can be added if necessary.

The adhesive sheet of the present invention is produced by forming an adhesive layer of the adhesive composition on a base material. The adhesive layer is formed by mixing and stirring the adhesive composition without a solvent and extruding the adhesive composition into a release-treated film by a hot-melt coating method, after dissolving the adhesive composition in a solvent and applying it to the release-treated film, the solvent is then applied. And a method in which the adhesive composition is rapidly stirred in water or a solvent to form an aqueous dispersion, which is applied to a release treatment film to dry the water. Among these, the method of using a solvent is preferable because the adhesive sheet can be prepared at a low temperature.

The solvent is not particularly limited, but aromatic solvents such as toluene and xylene have good solubility and are preferably used. Examples of the release-treated film include plastic films such as polyester, polyolefin, polyamide, and polyimide, and release liners obtained by subjecting glassine paper, high-quality paper laminated with polyethylene, and the like to release treatment such as silicone and fluorine.

As the substrate, polyimide, polyamide,
Polyetherimide, polyamideimide, polyester, polyphenylene sulfide, polycarbonate, polytetrafluoroethylene, plastic film substrates such as polyether ether ketone, and porous substrates thereof,
Nonwoven fabric substrates such as cellulose, polyamide, polyester and aramid, metal film substrates such as aluminum foil and SUS foil, steel wool substrates, metal mesh substrates and the like are included. When a peelable film is used as the substrate, the adhesive layer formed on the peelable film can be transferred onto the substrate.

The reactive adhesive sheet may be provided with an adhesive layer on one side or both sides of the substrate. The obtained adhesive film can be used in the form of a sheet or tape. The thickness of the adhesive layer of the adhesive film is 10 to 2
The thickness is preferably about 00 μm.

The reactive adhesive sheet of the present invention thus obtained has little phase separation, resin segregation and the like and is excellent in storage stability over time, and has heat resistance when used for fixing electronic parts. It has an adhesive layer with excellent adhesiveness.

[0034]

EXAMPLES The present invention will be described more concretely with reference to Examples of the present invention. In the following, "parts" means "parts by weight".

Example 1 Ethylene-glycidyl methacrylate copolymer (Sumitomo Chemical Co., Ltd., Bond First E), maleic acid-modified block copolymer hydride (Asahi Kasei Co., Ltd.,
Tuftec M1943), phenol resin (Showa High Polymer Co., Ltd., Shonor BRG-555) and imidazole-based curing accelerator (Shikoku Chemicals Co., Ltd., C ₁₁ Z).
Are mixed so that the composition ratios shown in Table 1 are obtained, and the concentration is 20
A solution of the adhesive composition was prepared by dissolving it in a toluene solvent at 80 ° C. so as to have a weight percentage.

A solution of this adhesive composition was applied as a release liner to a release-treated film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment in an atmosphere of 60 ° C., and then at 3 ° C. at 120 ° C. A layer of a thermosetting adhesive having a thickness of 50 μm was formed by drying for a minute to prepare a reactive adhesive sheet.

Example 2 Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (manufactured by Sumitomo Chemical Co., Ltd., Bondfast 7M), hydride of maleic acid-modified block copolymer (manufactured by Asahi Kasei Co., Ltd., Tuftec M1943),
Phenolic resin (Showa High Polymer Co., Ltd., Shonor B)
RG-555) and imidazole curing accelerator (manufactured by Shikoku Chemicals Co., Ltd., C ₁₁ Z) blended so that the Table 1, respectively, the composition ratio, the toluene solvent at room temperature to a concentration of 20 wt% It melt | dissolved and created the solution of the adhesive composition.

A solution of this adhesive composition is applied as a release liner on a release-treated film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment at room temperature, and then dried at 120 ° C. for 3 minutes. Thus, a layer of a thermosetting adhesive having a thickness of 50 μm was formed to prepare a reactive adhesive sheet.

Examples 3, 4 Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bondfast 7M), hydride of maleic acid-modified block copolymer (Asahi Kasei Co., Ltd.) Manufactured by Tuftec M1943),
Epoxy resin (Japan Epoxy Resin Co., Ltd., YX
-4000), phenol resin (manufactured by Showa Polymer Co., Ltd.,
Shonol BRG-555) and imidazole curing accelerator (manufactured by Shikoku Chemicals Co., Ltd., C ₁₁ Z) and respectively blended so that the first composition ratio table, toluene at room temperature to a concentration of 20 wt% It melt | dissolved in the solvent and created the solution of the adhesive composition.

A solution of this adhesive composition is applied as a release liner on a release-treated film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment at room temperature, and then dried at 120 ° C. for 3 minutes. Thus, a layer of a thermosetting adhesive having a thickness of 50 μm was formed to prepare a reactive adhesive sheet.

Comparative Example 1 Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bondfast 7M), phenol resin (Showa Highpolymer Co., Ltd.,
Shonol BRG-555) and imidazole curing accelerator (manufactured by Shikoku Chemicals Co., Ltd., C ₁₁ Z) and respectively blended so that the first composition ratio table, toluene at room temperature to a concentration of 20 wt% It melt | dissolved in the solvent and created the solution of the adhesive composition.

A solution of this adhesive composition was applied at room temperature to a release-treated film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment as a release liner, and then dried at 120 ° C. for 3 minutes. Thus, a layer of a thermosetting adhesive having a thickness of 50 μm was formed to prepare a reactive adhesive sheet.

Comparative Example 2 Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (manufactured by Sumitomo Chemical Co., Ltd., Bondfast 7M), hydride of maleic acid-modified block copolymer (manufactured by Asahi Kasei Co., Ltd., Tuftec M1943),
Epoxy resin (Japan Epoxy Resin Co., Ltd., YX
-4000), phenol resin (manufactured by Showa Polymer Co., Ltd.,
Shonol BRG-555) and imidazole curing accelerator (manufactured by Shikoku Chemicals Co., Ltd., C ₁₁ Z) and respectively blended so that the first composition ratio table, toluene at room temperature to a concentration of 20 wt% It melt | dissolved in the solvent and created the solution of the adhesive composition.

A solution of this adhesive composition is applied as a release liner on a mold-release treated film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to mold release treatment at room temperature, and then dried at 120 ° C. for 3 minutes. Thus, a layer of a thermosetting adhesive having a thickness of 50 μm was formed to prepare a reactive adhesive sheet.

The reactive adhesive sheets of Examples 1 to 4 and Comparative Examples 1 and 2 above were subjected to an adhesive strength test, a solder heat resistance test and a storage stability test by the following methods. The results are shown in Table 1.

<90 ° Peel Adhesive Strength> An adhesive sheet having a width of 10 mm and a length of 50 mm was adhered to a polyimide film having a thickness of 75 μm, which was adhered to SUS (BA304). This sample was pressure-bonded under a press condition of 200 ° C. × 1 MPa × 1 second and cured by a heat treatment in a hot air oven of 150 ° C. for 2 hours, and then a temperature of 23 ° C. and a humidity of 65%
After being left for 30 minutes under an atmosphere condition of RH, it was pulled in a 90 ° direction at a pulling rate of 50 mm / min under an atmosphere condition of 23 ° C., and the center value was taken as 90 ° peel adhesive strength (N / cm).

<Solder heat resistance> By the adhesive layer of the adhesive sheet, SUS (BA304) and polyimide film (75
(.mu.m) were bonded together so that air bubbles would not enter between them. A sample obtained by cutting this into 30 mm square is 200 ° C.
After press-bonding under a pressing condition of × 1 MPa × 1 second and curing for 2 hours by heat treatment at 150 ° C, 35 ° C / 80% RH
After leaving it in the humidified condition of 168 hours, SUS (BA30
4) was turned up, and the solder bath melted at 240 ° C. was treated in a floating state for 60 seconds. Visually observe the sheet pasting state after processing, and see if foaming of the adhesive and abnormal adhesion (floating,
The presence or absence of wrinkles, peeling, and misalignment was determined, and evaluated as ◯: no change / abnormality, x: change / abnormality.

<Storage Stability> The adhesive sheet was stored in an atmosphere of −30 ° C. for 500 hours, and the segregation of the resin on the release liner surface and the state of layer separation were visually observed. ◯: No change / abnormality, ×: Heavy release of the release liner / segregation was evaluated.

[0049]

[Table 1] In Table 1, ethylene-based copolymer (a): in Example 1, an ethylene-glycidyl methacrylate copolymer (Sumitomo Chemical Co., Ltd., Bondfast E, glycidyl methacrylate content 12% by weight), in other examples Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bondfast 7M, glycidyl methacrylate content 6% by weight, methyl acrylate 30% by weight), compound (b): epoxy resin ( Japan Epoxy Resin Co., Ltd., YX-400
0) and a phenolic resin (Showa High Polymer Co., Ltd., Shonor BRG-555), and a block copolymer (c): a hydride of a maleic acid-modified block copolymer (Asahi Kasei Co., Ltd.). , Tuftec M1943, the weight ratio of the aromatic vinyl compound polymer block (c1) to the conjugated diene compound polymer block (c2) is (c1) / (c
2) = 20/80), which is a curing accelerator: an imidazole curing accelerator (C ₁₁ Z manufactured by Shikoku Chemicals Co., Ltd.).

As is clear from Table 1 above, each of the reactive adhesive sheets of Examples 1 to 4 of the present invention was added in the atmosphere of −30 ° C. by adding the block copolymer (c) as the compatibilizer. It is excellent in storage stability even when it is stored, and it is also excellent in adhesiveness and heat resistance. On the other hand, the block copolymer (c) shown in Comparative Example
In the case of no addition, the adhesive sheet is excellent in adhesiveness and heat resistance at the initial stage of preparation, but is poor in storage stability due to segregation of the resin due to storage.

Continued front page    F-term (reference) 4J004 AA05 AA07 AA13 AB04                 4J040 DA031 DM012 EB032 EC002                       EC231                 5F047 BA34 BB03

Claims (8)

[Claims] 1. An olefin-based copolymer (a) having an epoxy group in the molecule, a compound (b) having two or more functional groups that react with an epoxy group in the molecule, and an aromatic vinyl compound polymer block ( Block copolymer (c) having c1) and a conjugated diene compound polymer block (c2)
A reactive adhesive composition comprising: 2. The reactive adhesive composition according to claim 1, wherein the compound (b) is at least one selected from epoxy resins, phenol resins, acid anhydrides and carboxylic acids. 3. The weight ratio of the aromatic vinyl compound polymer block (c1) to the conjugated diene compound polymer block (c2) of the block copolymer (c) is (c1) / (c2) =
It is 10 / 90-40 / 60, The reactive adhesive composition of Claim 1 or 2 characterized by the above-mentioned. 4. The content of the block copolymer (c) component is 5 to 150 parts by weight based on 100 parts by weight of the total amount of the olefinic copolymer (a) and the compound (b). The reactive adhesive composition according to claim 1. 5. The content of the compound (b) is 1 based on the total amount of the olefin copolymer (a) and the block copolymer (c).
The reactive adhesive composition according to claim 1, which is 1 to 150 parts by weight with respect to 00 parts by weight. 6. The reactive adhesive composition according to claim 1, further comprising an epoxy group curing accelerator. 7. The method according to any one of claims 1 to 6 on one side or both sides of the substrate.
A reactive adhesive sheet having an adhesive layer formed from the reactive adhesive composition according to any one of 1. 8. An electronic component assembled by using the adhesive layer formed on the reactive adhesive sheet according to claim 7.