JP2003198098A - Circuit board of multiple unit boards and method for evaluating dimensional accuracy - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board of multiple unit boards in which a dimensional accuracy of a base board can be simply evaluated and individual unit boards can be cut with high dimensional accuracy. <P>SOLUTION: The circuit board of multiple unit boards comprises a plurality of circuit board regions 2 having wiring conductors each made of a conductor layer in its interior and on a surface thereof and aligned laterally and longitudinally and integrally arrayed and formed, and a waste margin region 3 surrounding the plurality of the regions 2 on an outer periphery of a substantially square flat plate-shape base board 1 in which a plurality of insulating layers and conductor layers of organic materials are laminated at a central part of the board 1. A lattice-like pattern 4a made of the conductor layers disposed in parallel with the alignment of the regions 2 at lateral and longitudinal intervals of 50 to 200 μm are provided and covered in ranges of a width and a length of 0.5 to 2.5 mm on a dimensional measuring region 4, on for corners of the region 3 and through holes smaller than a diameter at an interval are formed on the region 4. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-cavity structure in which a large number of wiring board regions, which are wiring boards for mounting electronic components such as semiconductor elements and resistors, are arranged in a mother board having a large area. The present invention relates to a wiring board and a method for evaluating its dimensional accuracy.

[0002]

2. Description of the Related Art Conventionally, an insulating layer formed by impregnating a glass fiber base material with a thermosetting resin and a conductor layer such as a copper foil are used as a wiring board used for mounting electronic components such as semiconductor elements and resistors. There is known a multilayer printed wiring board formed by alternately laminating a plurality of wiring conductors made of. This multilayer printed wiring board has a protective solder resist layer deposited on its surface so as to expose a part of the wiring conductor,
Further, nickel plating and gold plating are sequentially deposited on the surface of the wiring conductor exposed from the solder resist in order to prevent oxidation of the wiring conductor.

Such a multi-layer printed wiring board is a mother board having a large area formed by alternately laminating a plurality of insulating layers made by impregnating a glass fiber base material with a thermosetting resin and conductor layers made of copper foil or the like. A plurality of wiring board regions, each of which is a multi-layer printed wiring board having wiring conductors formed of conductor layers on the inside and the surface thereof, are formed vertically and horizontally in an integrated array, and each wiring of the multi-cavity wiring board is formed. It is manufactured by subjecting the surface of the substrate area to solder resist processing and nickel / gold plating processing, and then cutting into individual multilayer printed wiring boards. In order to separate the multi-cavity wiring board into individual multilayer printed wiring boards, first, a reference hole is formed on the outer peripheral portion of the mother board by drilling or the like, and the reference hole is used as a reference for each wiring board area. A method of dividing the boundary into individual pieces by a cutting program that automatically cuts according to the design value of the mother board is adopted.

[0004]

However, in the conventional multi-cavity wiring board, when the heating step and the drying step are performed by solder resist processing or nickel / gold plating processing, expansion / contraction, warpage, and waviness occur in the mother board. As a result, the dimensional accuracy of the mother board deteriorates. As a result, the relative positional relationship between each wiring board area and the design dimension in the mother board becomes incorrect. As a result, when the mother board is cut into individual pieces by the cutting program according to the design dimension values, the wiring board The area is cut and the resulting multilayer printed wiring board becomes defective in dimension, and electronic components cannot be accurately mounted on this multilayer printed wiring board, or this multilayer printed wiring board is connected to an external electrical circuit. There is a problem in that it may not be possible to accurately connect to the board.

The present invention has been completed in view of the above problems in the prior art, and an object thereof is to easily evaluate the dimensional accuracy of a mother substrate, and based on the result, a machining program for the mother substrate. The present invention provides a multi-cavity wiring board and a method for evaluating the dimensional accuracy thereof, by which the boundary of each wiring board region is accurately cut to obtain a multilayer printed wiring board with accurate dimensions. .

[0006]

A multi-cavity wiring board of the present invention is a substantially rectangular flat plate formed by laminating a plurality of insulating layers and conductor layers obtained by impregnating a glass fiber base material with a thermosetting resin. In the central portion of the mother board, a plurality of wiring board regions having wiring conductors composed of conductor layers on the inside and the surface of the mother board are formed vertically and horizontally and integrally, and a plurality of wirings are formed on the outer peripheral portion of the mother board. A multi-cavity wiring substrate formed by forming a frame-shaped discarding margin region surrounding the substrate region, and arranged in parallel on the surface of the four corners of the discarding margin region with vertical and horizontal intervals of 50 to 200 μm. The grid-like pattern consisting of the conductor layers is applied in the width and length range of 0.5 to 2.5 mm to provide the dimension measurement area, and the dimension measurement area is provided with the through holes whose diameter is smaller than the vertical and horizontal intervals. Characterized by being formed It is something.

Further, the method for evaluating the dimensional accuracy of a multi-cavity wiring board of the present invention is a substantially rectangular flat plate formed by laminating a plurality of insulating layers and conductor layers obtained by impregnating a glass fiber base material with a thermosetting resin. A plurality of wiring board regions having wiring conductors formed of conductor layers on the inside and surface of the mother board are vertically and horizontally arranged integrally in the central portion of the mother board, and a plurality of wiring board regions are formed on the outer periphery of the mother board. Is formed in parallel with the arrangement of the wiring board areas at the vertical and horizontal intervals of 50 to 200 μm on the surfaces of the four corners of the discarding area of the multi-cavity wiring board formed by forming a frame-shaped discarding area surrounding the wiring board area. A dimension-measuring region is provided in which a grid-like pattern consisting of a conductor layer is applied in a width and length range of 0.5 to 2.5 mm, and then the center position of the dimension-measuring region in the design dimension of the mother board is provided. , The diameter is smaller than the vertical and horizontal intervals The dimensional accuracy of the mother substrate is evaluated by forming a through hole and then measuring the deviation between the through hole and the actual center position of the dimension measuring region.

According to the multi-cavity wiring board of the present invention, the vertical and horizontal intervals are arranged parallel to the arrangement of the wiring board areas on the surfaces of the four corners of the discarding margin area provided on the outer peripheral portion of the mother board. 0.5-2.5m in a grid pattern consisting of
Since the dimension measuring region is provided in the range of the width and length of m, and the through hole having the diameter smaller than the vertical and horizontal intervals is formed in the dimension measuring region, the through hole and the dimension measuring region are formed. By measuring the deviation from the center position of the mother board, the dimensional accuracy of the mother board can be evaluated easily and accurately. Based on the result, the cutting process program of the mother board is corrected and the boundary of each wiring board area is corrected. Can be accurately cut to obtain a multilayer printed wiring board having accurate dimensions.

Further, according to the method for evaluating the dimensional accuracy of a multi-cavity wiring board according to the present invention, a frame-shaped discarding margin area surrounding the wiring board area is provided on the outer peripheral portion of the mother board on which a plurality of wiring board areas are arranged. On the surface of the four corners of the discarding area of the multi-cavity wiring board formed by forming a grid pattern consisting of conductor layers arranged in parallel with the wiring board area at an interval of 50 to 200 μm. A dimension measurement area is attached in a width and length range of 2.5 mm, and then a through hole with a diameter smaller than the vertical and horizontal intervals is provided at the center position of the dimension measurement area in the design dimension of the mother board. Then, the dimensional accuracy of the mother board is evaluated by measuring the deviation between the through hole and the actual center position of the dimensional measurement area. Can be evaluated. Therefore, it is possible to correct the cutting processing program of the mother board based on the result and accurately cut the boundary of each wiring board region to obtain a multilayer printed wiring board having accurate dimensions.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Next, a multi-cavity wiring board of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of a multi-cavity wiring board of the present invention, and FIG. 2 is an enlarged plan view of a dimension measuring region. In these figures, 1 is a mother substrate, 2 is a wiring substrate region, 3
Is a discarding margin area, and mainly constitutes the multi-cavity wiring board of the present invention.

The mother substrate 1 is a substantially rectangular flat plate formed by laminating a plurality of insulating layers formed by impregnating a glass fiber base material with a thermosetting resin such as epoxy resin and a conductor layer formed of copper foil. , Its thickness is 0.1 to 3 mm, and its vertical and horizontal dimensions are 2.
It is about 00 to 600 mm.

In the central portion of the mother board 1, a large number of wiring board regions 2 each having a wiring conductor formed of a conductor layer such as a copper foil or a copper plating film inside and on the surface thereof are formed vertically and horizontally in an array. ing. In addition, each wiring board region 2 is a region that becomes a wiring board by being divided into individual pieces. Further, in the outer peripheral portion of the mother substrate 1, a rectangular frame-shaped discarding margin region 3 having a width of about 5 to 50 mm is formed so as to surround the plurality of wiring substrate regions 2 arranged and formed in the central portion. This discard area 3
Has a dimension measuring region 4 for facilitating the handling of the mother substrate 1 and evaluating the dimension accuracy of the mother substrate 1 on the surfaces of the four corners.

Dimensional measurement area 4 formed in the waste area 3
Is an area for evaluating the dimensional accuracy of the mother board 1,
As shown in the enlarged plan view of the main part in FIG.
The grid-shaped patterns 4a having a size of 200 μm and arranged in parallel with the arrangement of the wiring board regions 2 are applied in a range of a width W and a length L of 0.5 to 2.5 mm, respectively. This pattern 4a
Is made of copper foil or the like, and is formed by photolithography at the same time as forming the wiring conductor on the surface layer of the mother substrate 1. The width of the pattern 4a is about 20 to 70 μm, and the thickness of the pattern 4a is about 5 to 50 μm.

Thereafter, a solder resist layer having a thickness of 10 to 70 μm made of a thermosetting resin such as an epoxy resin is coated on each surface so as to expose a part of the wiring conductor deposited on the surface. The surface of the wiring conductor that is exposed from the solder resist layer after being formed by adhesion has a thickness of 1
It is formed by sequentially depositing nickel plating having a thickness of about 10 μm and gold plating having a thickness of about 0.1 to 3 μm.

After that, a solder resist layer is adhered on the surface, and nickel and gold plating is adhered on the surface of the wiring conductor.
Through holes 5 are drilled at predetermined positions in the dimension measurement region 4.
The through hole 5 has a diameter of about 20 to 150 μm and is formed by a conventionally known laser or the like.

In the next step, the mother board 1 is cut into individual wiring boards in the cutting process.
The dimensional accuracy of the mother substrate 1 can be easily and accurately evaluated by recognizing the deviation from the finished center position of the mother board 1 with the grid pattern 4a formed in the dimension measuring region 4 as a guide, for example, by an image recognition device. Since it is possible to correct the automatic cutting processing program, a large number of wiring boards with accurate dimensions can be manufactured collectively at the same time.

Further, according to the multi-cavity wiring board and the method of evaluating the dimensional accuracy thereof of the present invention, the deviation between the through hole 5 and the actual center position of the dimensional measurement area 4 is measured as the dimensional measurement area 4.
The dimensional accuracy of the mother substrate 1 can be easily and accurately evaluated by recognizing, for example, an image recognizing device using the lattice-shaped pattern 4a formed in the above as a guide. Therefore, based on the evaluation result, the cutting program for dividing the mother board 1 into individual wiring boards is corrected to accurately cut the boundaries of the respective wiring board regions 2 to form a multilayer printed wiring board having accurate dimensions. Obtainable.

If the width W and the length L of the dimension measuring area 4 are less than 0.5 mm, the area to be recognized is too small when the dimension measuring area is recognized by, for example, an image recognition device. It tends to be difficult to accurately recognize the dimensional accuracy of the substrate 1, and if it exceeds 2.5 mm, the recognition accuracy tends to decrease because it is necessary to reduce the magnification of image recognition. Therefore, it is preferable that the width W and the length L of the dimension measurement region 4 be in the range of 0.5 to 2.5 mm.

The vertical and horizontal intervals of the pattern 4a are 50 μm.
If it is less than 20%, it tends to be difficult to accurately form the lattice-shaped pattern 4a having such a narrow interval.
If it exceeds 0 μm, it becomes difficult to evaluate the dimensional accuracy of the mother substrate 1 precisely. Therefore, the vertical and horizontal intervals of the pattern 4a are preferably in the range of 50 to 200 μm.

Further, when the diameter of the through hole 5 is larger than the vertical and horizontal intervals of the pattern 4a, the through hole 5 and the dimension measuring region 4 are formed.
There is a tendency that it becomes difficult to accurately and easily recognize the deviation from the actual center position by using the grid pattern 4a formed in the dimension measurement region 4 as a guide. Therefore, the diameter of the through hole 5 is specified to be smaller than the vertical and horizontal intervals of the pattern 4a.

Thus, according to the multi-cavity wiring board and the method for evaluating the dimensional accuracy thereof of the present invention, the through holes 5 and the dimension measuring area 4 formed in the dimension measuring area 4 of the discarding margin area 3 of the mother substrate 1 are formed. The dimensional accuracy of the mother board 1 is accurately evaluated by measuring the deviation from the actual center position, and based on the evaluation result, the cutting program for separating the mother board 1 into individual wiring boards is corrected. By accurately cutting the boundary of each wiring board region 2, it is possible to collectively obtain a large number of multilayer printed wiring boards having accurate dimensions.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention.

[0024]

According to the multi-cavity wiring board of the present invention,
On the surface of the four corners of the discard area provided on the outer periphery of the mother board, a grid-like pattern consisting of conductor layers arranged in parallel with the alignment of the wiring board area with a vertical and horizontal spacing of 50 to 200 μm is 0.5 to 2.5.
A dimension measuring area is provided in a width and length range of mm, and a through hole having a diameter smaller than the vertical and horizontal intervals is formed in the dimension measuring area. By measuring the deviation from the center position of the mother board, the dimensional accuracy of the mother board can be evaluated easily and accurately. Based on the result, the cutting process program of the mother board is corrected and the boundary of each wiring board area is corrected. Can be accurately cut to obtain a multilayer printed wiring board having accurate dimensions.

According to the method for evaluating the dimensional accuracy of a multi-cavity wiring board, a frame-shaped discarding margin area surrounding the wiring board area is formed on the outer peripheral portion of the mother board on which a plurality of wiring board areas are formed. On the surface of the four corners of the discarding area of the multi-cavity wiring board, the grid-like pattern consisting of conductor layers arranged in parallel with the wiring board area with a vertical and horizontal spacing of 50 to 200 μm is 0.5 to 2.5 mm. Is provided in the range of width and length of the through hole, and the through hole having a diameter smaller than the vertical and horizontal intervals is provided at the center position of the size measuring area in the design dimension of the mother board. Form, and then
Since the dimensional accuracy of the mother substrate is evaluated by measuring the deviation between the through hole and the actual center position of the dimensional measurement region, the dimensional accuracy of the mother substrate can be easily and accurately evaluated. Therefore, it is possible to correct the cutting processing program of the mother board based on the result and accurately cut the boundary of each wiring board region to obtain a multilayer printed wiring board having accurate dimensions.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an embodiment of a multi-cavity wiring board of the present invention.

FIG. 2 is an enlarged plan view of an essential part of the multi-cavity wiring board shown in FIG.

[Explanation of symbols]

1 ... Mother board 2 ·· Wiring board area 3 ... Solder resist layer 4 ・ ・ Dimension measurement area 4a ... Lattice pattern W ... width L: Length 5 ... through holes

Claims (2)

[Claims] 1. A wiring conductor comprising the conductor layer in the center of a substantially rectangular flat plate-shaped mother substrate formed by laminating a plurality of insulating layers and conductor layers obtained by impregnating a glass fiber base material with a thermosetting resin. A plurality of wiring board regions having the inside and the surface of the mother board are vertically and horizontally arranged in an integrated manner, and a frame-shaped discarding margin region surrounding the plurality of wiring board areas is provided on an outer peripheral portion of the mother board. A multi-cavity wiring substrate formed by forming conductors on the surface of the four corners of the discarding region, the grid consisting of the conductor layers arranged in parallel with the wiring substrate region at vertical and horizontal intervals of 50 to 200 μm. The pattern has a dimension measuring region applied in a width and length range of 0.5 to 2.5 mm, and through holes having a diameter smaller than the vertical and horizontal intervals are formed in the dimension measuring region. Is characterized by Multi-piece wiring board. 2. A wiring conductor comprising the conductor layer in the center of a substantially rectangular flat plate-shaped mother board formed by laminating a plurality of insulating layers and conductor layers formed by impregnating a glass fiber base material with a thermosetting resin. A plurality of wiring board regions having the inside and the surface of the mother board are vertically and horizontally arranged in an integrated manner, and a frame-shaped discarding margin region surrounding the plurality of wiring board areas is provided on an outer peripheral portion of the mother board. A multi-cavity wiring board formed by forming on the four corner surfaces of the discarding margin area, the grid-like pattern consisting of the conductor layers arranged in parallel with the arrangement of the wiring board areas with vertical and horizontal intervals of 50 to 200 μm. Is 0.
A dimension measurement region is provided in a width and length range of 5 to 2.5 mm, and then, at the center position of the dimension measurement region in the design dimension of the mother substrate, the diameter is the vertical and horizontal intervals. Forming a through hole smaller than that, and then measuring the deviation between the through hole and the actual center position of the dimension measuring region to evaluate the dimensional accuracy of the mother substrate. Evaluation method of dimensional accuracy of wiring board.