JP2003197654A - Method of manufacturing semiconductor device and manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce product failures in a sealing step of a semiconductor chip. <P>SOLUTION: A method of manufacturing a semiconductor device includes the sealing of at least a part of a semiconductor chip 18. The sealing is performed by dropping resin 30 from the tip of a needle 42. At least a part of an excessive drop 32 remaining on the tip of the needle 42 is forcibly removed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method and manufacturing apparatus.

[0002]

BACKGROUND OF THE INVENTION In a method of manufacturing a semiconductor device, it is known that a plurality of semiconductor chips are mounted on a tape and each semiconductor chip is sealed with a resin by potting. In this step, the amount of liquid resin is adjusted with a dispenser, and the resin is dropped from a needle. When sealing a plurality of semiconductor chips, for example, the semiconductor chips are continuously sealed while the tape is conveyed relative to the needle.

However, conventionally, in the potting process, the resin sometimes dripped from the needle to a region other than the sealing region. For example, when there are a series of defective parts on which semiconductor chips are not mounted, it is not necessary to provide resin on the defective parts, so there is a gap between the resin drops, and the resin that collects at the tip of the needle may drop during that interval. It was
The resin dripping from the needle could not be prevented only by controlling the dispenser.

The present invention is intended to solve the above-mentioned problems, and an object thereof is to reduce defective products in a semiconductor chip sealing process.

[0005]

(1) A method of manufacturing a semiconductor device according to the present invention includes sealing at least a part of a semiconductor chip by dropping resin from a tip of the needle, Forced removal of at least a portion of the extra droplets that collect at the tip of the.

According to the present invention, at the time of dropping the resin from the tip of the needle, at least a part of the extra droplets accumulated at the tip of the needle is forcibly removed before and after the dropping. Therefore, it is possible to prevent the excessive drops from accumulating and dropping onto the product. Moreover, since the amount of the extra drops can be reduced, it is possible to prevent the amount of resin to be sealed from unnecessarily increasing. Therefore, product defects can be reduced.

(2) In this method of manufacturing a semiconductor device, a plurality of the semiconductor chips are mounted on a tape before the sealing step, and the tape is reeled in the sealing step.
It may be conveyed to the reel.

According to this, since a plurality of semiconductor chips can be sealed by a flow operation, the production efficiency can be improved.

(3) In this method of manufacturing a semiconductor device, in the encapsulating step, the tape is conveyed between a first area where the tape is conveyed and a second area which is apart from the tape. The needle may be moved back and forth, and at least a part of the residual droplet may be forcibly removed during the reciprocation.

According to this, it is possible to more reliably prevent the resin from dripping on the product by making the needle stand by in the second area, if necessary.

(4) In this method of manufacturing a semiconductor device, the tape has a plurality of defective portions on which the semiconductor chips are not mounted, and in the sealing step, while the defective portions continuously pass, The reciprocating movement of the needle may be performed.

(5) In this method of manufacturing a semiconductor device, at least a part of the extra drops may be transferred to the member by contacting the extra drops with a member.

According to this, the process is simple because it is only necessary to bring the members into contact with each other. Further, since the residual drops removed from the needle are transferred to the member, the processing of the residual drops is easy.

(6) In this method of manufacturing a semiconductor device, at least a part of the extra drops may be dropped by bringing a member into contact with the extra drops.

According to this, the process is simple because it is sufficient to bring the members into contact with each other.

(7) In this method of manufacturing a semiconductor device, the member is a plate-shaped member having a surface, and the tip of the needle passes above the surface relative to the plate-shaped member. By doing so, at least a part of the extra droplets may be transferred to the surface.

(8) In this method of manufacturing a semiconductor device, the member is a thread member, and the tip of the needle is moved relative to the thread member in a direction intersecting a straight line of the thread member. By doing so, the filamentous member may be brought into contact with a part of the residual droplet.

(9) In this method of manufacturing a semiconductor device, at least a part of the extra drops may be dropped by injecting gas into the extra drops.

(10) In this method of manufacturing a semiconductor device, at least a part of the extra droplet may be dropped by vibrating the needle.

(11) In the semiconductor device manufacturing apparatus according to the present invention, at least the resin supply portion for dropping the resin from the tip of the needle to seal at least a part of the semiconductor chip and the residual droplets accumulated at the tip of the needle. A resin removing means for forcibly removing a part thereof.

According to the present invention, when the resin is dropped from the tip of the needle, at least a part of the extra droplets accumulated at the tip of the needle can be forcibly removed before and after the dropping. Therefore, it is possible to prevent the excessive drops from accumulating and dropping onto the product. Moreover, since the amount of the extra drops can be reduced, it is possible to prevent the amount of resin to be sealed from unnecessarily increasing. Therefore, product defects can be reduced.

(12) In this semiconductor device manufacturing apparatus, the plurality of semiconductor chips may be mounted on a tape, and the tape manufacturing apparatus may further include a tape carrying section for carrying the tape reel-to-reel.

According to this, since a plurality of semiconductor chips can be sealed by a flow operation, the production efficiency can be improved.

(13) In this semiconductor device manufacturing apparatus, a first area in which the tape transport section is arranged and a second area in which the tape transport section is separated from each other,
Further, the resin supply unit may be capable of reciprocating between the first and second areas, and the resin removing unit may be disposed between the first and second areas.

According to this, it is possible to more reliably prevent the resin from dripping on the product by making the needle stand by in the second area, if necessary.

(14) In this semiconductor device manufacturing apparatus, the tape has a plurality of defective portions on which the semiconductor chips are not mounted, and the resin supply portion is such that the defective portions are continuous in the tape transport portion. The reciprocating movement may be performed during passage.

(15) In this semiconductor device manufacturing apparatus, the resin removing means may include a member that comes into contact with the residual droplet, and at least part of the residual droplet may be transferred by the member.

According to this, the process is simple because it is only necessary to bring the members into contact with each other. Further, since the residual drops removed from the needle are transferred to the member, the processing of the residual drops is easy.

(16) In this semiconductor device manufacturing apparatus, the resin removing means may include a member that comes into contact with the residual droplet, and at least a part of the residual droplet may be dropped by the member.

According to this, the process is simple since it is sufficient to bring the members into contact with each other.

(17) In this semiconductor device manufacturing apparatus, the member is a plate-shaped member having a surface, and the resin removing means causes the tip of the needle to move relatively to the plate-shaped member. At least a portion of the extra drops may be transferred to the surface by passing over the surface.

(18) In this semiconductor device manufacturing apparatus, the member is a thread-like member, and the resin removing means linearly moves the tip of the needle relative to the thread-like member. The filamentous member may be brought into contact with a part of the extra droplet by moving in a direction intersecting with.

(19) In this semiconductor device manufacturing apparatus, the resin removing means may drop at least a part of the extra droplets by injecting a gas into the extra droplets.

(20) In this semiconductor device manufacturing apparatus, the resin removing means may drop at least a part of the residual droplet by vibrating the needle.

[0035]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.

(First Embodiment) FIG. 1 is a schematic view of a tape (for example, a TAB tape) used in this embodiment. In FIG. 1, a tape 1 on which a semiconductor chip 18 is bonded (eg, ILB; Inner Lead Bonding)
0 is shown.

The tape 10 has a substrate (base substrate) 11. The material of the substrate 11 may be either an organic material or an inorganic material, or a composite structure of these materials. As the substrate 11 formed of an organic material, for example, a flexible substrate made of polyimide resin can be used. FPC as a flexible substrate
(Flexible Printed Circuit) and TAB (Tape Autom
Tapes used in ated Bonding technology may be used.

The substrate 11 shown in FIG. 1 has a long shape and has a plurality of sprocket holes 12 formed at the ends thereof.
A sprocket (not shown) is fitted in the sprocket hole 12 so that the substrate 11 or the tape 10 can be conveyed reel-to-reel.

A hole 14 is formed in the substrate 11.
In the TAB tape, the holes 14 are called device holes. A semiconductor chip 18 is arranged inside the hole 14. The hole 14 is preferably formed slightly larger than the outer shape of the semiconductor chip 18.

The plane shape of the semiconductor chip 18 is generally rectangular. A plurality of electrodes 19 (see FIG. 2) are formed on one surface of the semiconductor chip 18. The electrode 19 has at least one side of the surface of the semiconductor chip 18 (in many cases, 2
(4 sides). In addition, the electrode 19 is
There are cases where they are lined up at the ends of the surface of the semiconductor chip 18 and cases where they line up at the center. Each electrode 19 is often composed of a thin and flat pad made of aluminum or the like, and a bump formed on the pad. When no bump is formed, only the pad serves as the electrode 19. Electrode 19
A passivation film (not shown) is formed on the semiconductor chip 18 while avoiding at least a part of the above. The passivation film can be formed of, for example, SiO ₂ , SiN, polyimide resin, or the like.

At least one outer lead hole 16 may be formed in the substrate 11 (a plurality of outer lead holes 16 may be provided in FIG. 1). The outer lead hole 16 is formed around the arrangement position of the semiconductor chip 18. For example, hole 1
When 4 is rectangular, outer leads 16 may be formed as elongated holes extending in parallel with each side of the rectangle. The lead 20 can be formed so as to extend over the outer lead hole 16, and the portion of the lead 20 on the outer lead hole 16 can be used as an external terminal (outer lead 24).

Leads 20 having portions to be external terminals are formed on the substrate 11. The lead 20 has a portion (for example, an inner lead 22) joined to the electrode 19 of the semiconductor chip 18 as shown in FIG. 2, and a portion that serves as an external terminal as shown in FIG. 1 (for example, an outer lead 24).
And both are connected. The inner lead 22 projects inside the hole 14. Also, the lead 20
May be extended further than the outer lead 24 to provide a test pad.

The lead 20 is made of copper (Cu), chrome (C).
r), titanium (Ti), nickel (Ni), titanium tungsten (Ti-W), gold (Au), aluminum (A
l), nickel vanadium (NiV), or tungsten (W) may be laminated or formed in any one layer. The lead 20 may be attached to the substrate via an adhesive material (not shown) to form a three-layer substrate (or three-layer tape). In this case, after applying photolithography, the lead 2 is etched.
Form 0. Alternatively, the leads 20 may be formed on the substrate without an adhesive to form a two-layer substrate (two-layer tape). For example, the lead 20 may be formed by sputtering or the additive method of forming the lead 20 by electroless plating may be applied.

The lead 20 is preferably plated with solder, tin, gold, nickel or the like. It is preferable that the metal plating is performed so that a eutectic crystal is formed because metal bonding can be easily achieved. A bump may be formed on the lead 20 at a joint with another conductive member (for example, the electrode 19 of the semiconductor chip 18). Some of the leads 20
The land may have a larger area than the line portion. This land has a function of sufficiently securing an electrical connection portion.

In the present embodiment, the tape 10 shown in FIG.
(A plurality of semiconductor chips 18 are mounted) is prepared, and a semiconductor chip sealing step is performed. The manufacturing apparatus according to the present embodiment includes a resin supply unit 40 and a tape transport unit 50.
And a resin removing means.

As shown in FIG. 2, the resin supply unit 40 has a needle (or nozzle) 42, and the liquid (or paste) resin 30 can be dropped from the tip of the needle 42. The diameter of the needle 42 is determined according to the viscosity of the resin 30 and the amount dropped per unit time. In addition,
In the present embodiment, the resin supply unit 40 is used as a drawing type potting.

The resin supply section 40 is used for the tape 10 to be conveyed.
It is possible to move on a virtual plane parallel to the plane. In that case, the resin supply unit 40 may be movable in the transport direction of the tape 10 and in a direction orthogonal to the transport direction.
For example, the resin supply unit 40 may be moved by a control robot (not shown).

The resin supply section 40 includes a dispenser (not shown). The dispenser applies pressure to the resin 30 to push the resin 30 out of the needle 40. Thereby, the resin 30 can be dripped without excess or deficiency. Alternatively, the dispenser may be provided with a structure that sucks the resin 30 and prevents the resin 30 from dropping from the needle 40.

As shown in FIG. 2, the tape transport unit 50 is
The tape feeding unit 52 and the tape winding unit 54 are included. By reeling out the tape 10 from the tape feeding section 52 and winding it by the tape winding section 54,
Reel transfer is possible. According to this, since the plurality of semiconductor chips 18 can be processed (for example, sealed) by a flow operation, the production efficiency can be improved.

As shown in FIG. 3, this manufacturing apparatus has a first
And second areas 60, 62. First area 6
At 0, a tape transport unit 50 for transporting the tape 10 reel-to-reel is arranged. The second area 62 is
It is arranged apart from the tape transport unit 50. For example, second
The area 62 may be located in the left-right direction (right direction in FIG. 3) when viewed from the direction in which the tape 10 is transported. The resin supply unit 40 can reciprocate between the first and second areas 60 and 62. In that case, as described below, the resin supply unit 40 may reciprocate while the one or more defective portions 34 of the tape 10 pass through. According to this, the needle 42 can be made to stand by in the 2nd area 62 as needed, and the resin 30 can be more certainly prevented from dripping on a product.

As shown in FIG. 4, the resin removing means (including the member 70 in FIG. 4) forcibly removes at least a part (all or part) of the extra droplet 32 accumulated at the tip of the needle 42. That is, the extra drops 32 are removed by a means different from the control for dropping the resin 30 of the resin supply unit 40 (for example, control by the dispenser). As shown in FIG.
The resin removing means may be arranged between the first and second areas 60 and 62. By doing so, the resin supply unit 40
The resin drops 32 can be removed during the reciprocating movement between the first and second areas 60, 62.

The resin removing means brings the member (the thread member 70 in FIGS. 3 and 4) into contact with the extra droplet 32,
It may be one that removes at least a part of the extra drops 32. In that case, at least a part of the extra droplet 32 may be transferred to the member or dropped from the tip of the needle 42. In the case of transferring, it is not necessary to have a tray for receiving the extra drops 32, and therefore the treatment of the extra drops 32 is simple.
The member is preferably not in contact with the tip of the needle 42. This causes the needle 42 to bend,
It is possible to prevent the extra drops 32 from scattering.

In the example shown in FIGS. 3 and 4, the resin removing means includes a thread member 70. The thread member 70 refers to a member having a three-dimensional elongated shape. The resin removing means moves the tip of the needle 42 relative to the thread member 70 in a direction intersecting a straight line of the thread member 70,
The filamentous member 70 may be brought into contact with part of the extra droplet 32. The thread member 70 may be a metal wire, a plastic wire, a thread, or the like. Regardless of which material is used, it is preferable that tensile stress is applied to both ends thereof. The diameter of the filamentous member 70 may be smaller than the length of the extra droplet 32 accumulated at the tip of the needle 42 (the length in the direction in which gravity is applied). As a result, a part of the extra drop 32 can be divided with the filamentous member 70 as a boundary, so that a part of the extra drop 32 can be reliably removed.

The semiconductor device manufacturing apparatus according to this embodiment is configured as described above, and the semiconductor device manufacturing method will be described below.

As shown in FIG. 2, a tape 1 on which at least one (generally a plurality of) semiconductor chips 18 are mounted.
0 is prepared, and the tape 10 is set in the tape transport unit 50 shown in FIG. More specifically, the tape 10 is stretched over the tape sending section 52 and the tape winding section 54 so that reel-to-reel transfer can be performed. Note that, as shown in FIG. 3, the tape 10 has a plurality of defective portions 34 on which the semiconductor chips 18 are not mounted.

Then, the resin 30 is dropped on the tape 10. Specifically, the resin 30 is provided on the semiconductor chip 18 by the potting method. The resin 30 is a resin supply unit 40.
It is dripped from the tip of the needle 42. The resin 30 generally seals a part of the surface of the semiconductor chip 18. For example, the surface of the semiconductor chip 18 on which the electrodes 19 are formed is covered with the resin 30. Also, the resin 30
Thus, the joint between the electrode 19 and the lead 20 (specifically, the inner lead 22) is covered.

A plurality of semiconductor chips 18 are continuously sealed by reel-to-reel transfer. As shown in FIG. 3, the resin supply unit 40 may be moved to the second area 62 while the one or more defective portions 34 of the tape 10 pass below the resin supply unit 40. In that case, the resin supply unit 40 may be moved when a plurality of (three in FIG. 3) defective portions 34 are continuous. Thus, the resin supply unit 4
0 is made to stand by in the second area 62 while the defective portion 34 of the tape 10 passes, and is returned to the first area 60 before the good portion (non-defective product) 36 on which the semiconductor chip is mounted passes.
In the second area 62, a tray (not shown) for receiving the resin 30 from the resin supply unit 40 is preferably arranged.

The resin supply unit 40 is provided in the first and second areas 6
During the reciprocating movement between 0 and 62, at least a part of the extra droplet 32 is forcibly removed. Specifically, the drop 32 is removed during either the movement from the first to the second area 62, the movement from the second to the first area 62, or both. In that case, the residual droplet 32 may be removed while moving the resin supply unit 40.
May be temporarily stopped during the movement to remove the extra droplet 32.

For example, as shown in FIG. 3, first and second
The filamentous member 70 is disposed between the areas 60 and 62 of the resin supply unit 40 so as to intersect with the moving direction of the resin supply unit 40.
The extra droplet 32 may be removed by passing 0 through the thread member 70. In that case, the thread member 70 may be fixed in its position, or may be moved in the direction opposite to the moving direction of the resin supply unit 40.

As shown in FIG. 4, at least a part of the extra droplet 32 may be transferred to the thread member 70, or dropped from the tip of the needle 42. Note that it is preferable to arrange a tray (not shown) for receiving the resin 30 from the resin supply unit 40 below the thread member 70.

The extra drops 32 may be removed a plurality of times while one tape 10 is being conveyed reel-to-reel. In that case, the second drop 32 may be brought into contact with a part different from the part with which the drop 32 is first contacted by moving the filamentous member 70 in the linear direction.

Further, at least a part of the extra droplet 32 is
It may be removed in the area 60. In that case, the thread member 7
0 is arranged in the first area 60. By doing so, even when the resin supply unit 40 is not allowed to stand by in the second area 62, the extra droplet 32 can be removed. Alternatively, it is not necessary to make the resin supply unit 40 stand by in the second area 62 in order to prevent the resin 30 from dripping.

Alternatively, the semiconductor chip 18 of the tape 10
The extra droplet 32 may be removed each time the is sealed. Thereby, the amount of resin for each semiconductor chip 18 can be made constant. Therefore, the quality of each semiconductor device can be kept constant.

According to the present embodiment, at the time of dropping the resin 30 from the tip of the needle 42, at least a part of the extra droplet 32 accumulated at the tip of the needle 42 is forcibly removed before and after the dropping. Therefore, it is possible to prevent the excess drops 32 from being accumulated too much and dripping on the product (the finished product portion of the tape 10). Moreover, since the amount of the extra drops 32 can be reduced, it is possible to prevent the amount of resin to be sealed from unnecessarily increasing. Further, as compared with the case of pre-dripping (dripping intentionally) in order to prevent resin dripping, the resin 30 is not wasted, so that the material cost can be suppressed. Therefore, product defects can be reduced.

After the above steps, the resin 30 provided on the tape 10 is cured (pre-cure and post-cure). In addition, well-known processes may be performed in manufacturing TCP (Tape Carrier Package).

(Second Embodiment) FIG. 5 is a diagram showing a method and a device for manufacturing a semiconductor device according to the present embodiment. In the present embodiment, the resin removing means includes the plate member 80 having the surface 82.

The plate member 80 may be a metal plate, a plastic plate, a ceramic plate, a sponge or the like. The surface 82 is large enough to transfer (apply) the extra droplet 32. The surface 82 is preferably a flat surface, but may be a curved surface.

The resin removing means uses the tip of the needle 42 as
By passing above the surface 82 relative to the plate-shaped member 80, at least a part of the extra droplet 32 is transferred to the surface 82.
May be transferred to. In that case, it is preferable that the tip of the needle 42 is not in contact with the surface 82. When the surface 82 of the plate member 80 is a flat surface, the surface 82 may be arranged parallel to the moving direction of the needle 42 or may be arranged obliquely. When the surface 82 is slanted and brought into contact with the extra droplet 32, the resin supply section 40 is set to the extra droplet 3
It may be stopped when the second member contacts the plate member 80.

The other configurations and effects are as described in the first embodiment.

(Third Embodiment) FIG. 6 is a diagram showing a method and an apparatus for manufacturing a semiconductor device according to this embodiment. In the present embodiment, the resin removing unit drops at least a part of the extra droplet 32 without contacting the extra droplet 32.

As shown in FIG. 6, at least a part of the extra droplet 32 may be dropped by injecting a gas (air or gas) with the injector 90, for example. In that case, the resin supply unit 40 may be stopped and the gas may be injected, or the gas may be injected while the resin supply unit 40 is moved.

Alternatively, the needle 42 (resin supply unit 4
At least a part of the extra drops 32 may be dropped by vibrating 0). For example, the resin supply unit 40
In the second area 62 after moving from the area 60 of
The needle 42 is caused by colliding with an object not shown.
May be vibrated.

The other configurations and effects are as described in the first embodiment.

FIG. 7 is a diagram showing a circuit board on which the semiconductor device manufactured by the manufacturing method according to the above-described embodiment is mounted. The semiconductor device shown in FIG. 7 includes a substrate 26 obtained by cutting the tape 11 from the substrate 11, leads 20 provided on the substrate 26, a semiconductor chip 18, and a resin 30 as a sealing material. These details are as described above. It is preferable that at least the surface of the lead 20 supported by the substrate 26 is covered with the protective film 28. Examples of the protective film 28 include solder resist.

As the circuit board 100, it is general to use an organic substrate such as a glass epoxy substrate. The circuit board 100 has a wiring pattern 102 made of, for example, copper or the like.
Are formed so as to form a desired circuit, and the wiring pattern 102 and the outer leads 24 of the semiconductor device are joined.

As an electronic device having a semiconductor device to which the present invention is applied, a notebook personal computer 200 is shown in FIG. 8 and a mobile phone 300 is shown in FIG.

The present invention is not limited to the above-mentioned embodiment, but various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and result). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Further, the present invention includes a configuration having the same effects as the configurations described in the embodiments or a configuration capable of achieving the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

[Brief description of drawings]

FIG. 1 is a diagram showing a tape used in a first embodiment.

FIG. 2 is a diagram showing a manufacturing method and a manufacturing apparatus of a semiconductor device according to the first embodiment.

FIG. 3 is a diagram showing a manufacturing method and a manufacturing apparatus of a semiconductor device according to the first embodiment.

FIG. 4 is a diagram showing a manufacturing method and a manufacturing apparatus of a semiconductor device according to the first embodiment.

FIG. 5 is a diagram showing a manufacturing method and a manufacturing apparatus of a semiconductor device according to a second embodiment.

FIG. 6 is a diagram showing a manufacturing method and a manufacturing apparatus of a semiconductor device according to a second embodiment.

FIG. 7 is a diagram showing a circuit board according to an embodiment to which the present invention is applied.

FIG. 8 is a diagram showing an electronic device according to an embodiment to which the present invention is applied.

FIG. 9 is a diagram showing an electronic device according to an embodiment to which the present invention is applied.

[Explanation of symbols]

10 tapes 18 semiconductor chips 30 resin 32 extra drops 34 Defective part 40 Resin supply section 42 needle 50 Tape transport section 60 First Area 62 Second Area 70 Filiform member 80 Plate-shaped member 82 sides

Claims (20)

[Claims] 1. A semiconductor device comprising: sealing at least a part of a semiconductor chip by dropping a resin from a tip of a needle; and forcibly removing at least a part of an extra drop accumulated at the tip of the needle. Production method. 2. The method of manufacturing a semiconductor device according to claim 1, wherein a plurality of the semiconductor chips are mounted on a tape before the sealing step, and the tape is reel-to-reel in the sealing step. A method for manufacturing a semiconductor device to be transported. 3. The method of manufacturing a semiconductor device according to claim 2, wherein, in the sealing step, between a first area where the tape is conveyed and a second area which is apart from the tape. The method of manufacturing a semiconductor device, wherein the needle is reciprocated, and at least a part of the residual droplet is forcibly removed during the reciprocation. 4. The method of manufacturing a semiconductor device according to claim 3, wherein the tape has a plurality of defective portions on which the semiconductor chips are not mounted, and the defective portions continuously pass through in the sealing step. Between,
A method of manufacturing a semiconductor device, wherein the reciprocating movement of the needle is performed. 5. The method of manufacturing a semiconductor device according to claim 1, wherein a member is brought into contact with the extra droplet to transfer at least a part of the extra droplet to the member. Production method. 6. The method of manufacturing a semiconductor device according to claim 1, wherein at least a part of the extra drops is dropped by bringing a member into contact with the extra drops. 7. The method of manufacturing a semiconductor device according to claim 5, wherein the member is a plate-shaped member having a surface, and a tip of the needle is formed on the surface of the plate relative to the plate-shaped member. A method for manufacturing a semiconductor device, wherein at least a part of the extra droplets is transferred to the surface by passing therethrough. 8. The method for manufacturing a semiconductor device according to claim 5, wherein the member is a thread-shaped member, and the tip of the needle is relatively positioned with respect to the thread-shaped member. The method for manufacturing a semiconductor device, wherein the thread member is brought into contact with a part of the extra droplet by moving in a direction intersecting the straight line. 9. The method of manufacturing a semiconductor device according to claim 1, wherein at least a part of the extra drops is dropped by injecting gas into the extra drops. 10. The method of manufacturing a semiconductor device according to claim 1, wherein at least a part of the extra droplets is dropped by vibrating the needle. 11. A resin supply unit for dropping resin from a tip of a needle to seal at least a part of a semiconductor chip, and a resin removing means for forcibly removing at least a part of a residual drop accumulated at the tip of the needle. An apparatus for manufacturing a semiconductor device, including: 12. The semiconductor device manufacturing apparatus according to claim 11, wherein the plurality of semiconductor chips are mounted on a tape, and the semiconductor device further includes a tape transfer section for transferring the tape reel-to-reel. apparatus. 13. The semiconductor device manufacturing apparatus according to claim 12, further comprising: a first area in which the tape transport section is arranged, and a second area in which the tape transport section is separated from the first area. Including, the resin supply unit is capable of reciprocating between the first and second areas, and the resin removing unit is for manufacturing a semiconductor device arranged between the first and second areas. apparatus. 14. The semiconductor device manufacturing apparatus according to claim 13, wherein the tape has a plurality of defective portions on which the semiconductor chips are not mounted, and the resin supply unit has the defective portions in the tape transport unit. An apparatus for manufacturing a semiconductor device, which performs the reciprocating movement while continuously passing. 15. The apparatus for manufacturing a semiconductor device according to claim 11, wherein the resin removing unit has a member that contacts the residual droplet, and the member removes at least one of the residual droplets. Device for manufacturing semiconductor device for transferring parts. 16. The semiconductor device manufacturing apparatus according to claim 11, wherein the resin removing unit has a member that contacts the residual droplet, and the member removes at least one of the residual droplets. Semiconductor device manufacturing equipment that drops parts. 17. The apparatus for manufacturing a semiconductor device according to claim 15, wherein the member is a plate-shaped member having a surface, and the resin removing unit relatively positions the tip of the needle with respect to the plate-shaped member. Device for manufacturing a semiconductor device, wherein at least a part of the extra droplet is transferred onto the surface by passing over the surface. 18. The semiconductor device manufacturing apparatus according to claim 15 or 16, wherein the member is a thread-shaped member, and the resin removing unit causes the tip of the needle to move relative to the thread-shaped member. And a semiconductor device manufacturing apparatus for bringing the filamentous member into contact with a part of the residual droplet by moving the filamentous member in a direction intersecting a straight line of the filamentous member. 19. The semiconductor device manufacturing apparatus according to claim 11, wherein the resin removing unit injects gas into the extra drops to drop at least a part of the extra drops. Equipment manufacturing equipment. 20. The semiconductor device manufacturing apparatus according to claim 11, wherein the resin removing unit vibrates the needle to drop at least a part of the residual droplet. Manufacturing equipment.