JP2003188147A5 - - Google Patents
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- Publication number
- JP2003188147A5 JP2003188147A5 JP2002322565A JP2002322565A JP2003188147A5 JP 2003188147 A5 JP2003188147 A5 JP 2003188147A5 JP 2002322565 A JP2002322565 A JP 2002322565A JP 2002322565 A JP2002322565 A JP 2002322565A JP 2003188147 A5 JP2003188147 A5 JP 2003188147A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/007606 | 2001-11-07 | ||
| US10/007,606 US6663736B1 (en) | 2001-11-07 | 2001-11-07 | Method for making a bonded sapphire structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003188147A JP2003188147A (ja) | 2003-07-04 |
| JP2003188147A5 true JP2003188147A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2005-12-22 |
Family
ID=27608942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002322565A Pending JP2003188147A (ja) | 2001-11-07 | 2002-11-06 | サファイア結合構造体の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6663736B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JP2003188147A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103864452B (zh) * | 2012-12-10 | 2015-10-21 | 富泰华精密电子（郑州）有限公司 | 面板及其制造方法 |
| US9915756B2 (en) | 2015-07-28 | 2018-03-13 | Raytheon Company | Large area format sapphire windows via transient liquid phase bonding |
| RU2630811C1 (ru) * | 2017-03-13 | 2017-09-13 | федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") | Способ формирования полых монокристаллических цилиндрических трубок |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124800A (ja) * | 1988-07-04 | 1990-05-14 | Hiroaki Aoshima | 一体同化した合成コランダムの単結晶構造体の製造方法 |
| US4939101A (en) * | 1988-09-06 | 1990-07-03 | General Electric Company | Method of making direct bonded wafers having a void free interface |
| US4925608A (en) * | 1988-09-27 | 1990-05-15 | Norton Company | Joining of SiC parts by polishing and hipping |
| US5201977A (en) * | 1989-08-09 | 1993-04-13 | Hiroaki Aoshima | Process for producing structures from synthetic single-crystal pieces |
| US5423942A (en) | 1994-06-20 | 1995-06-13 | Texas Instruments Incorporated | Method and apparatus for reducing etching erosion in a plasma containment tube |
| US6284085B1 (en) * | 1997-04-03 | 2001-09-04 | The Board Of Trustees Of The Leland Stanford Junior University | Ultra precision and reliable bonding method |
| US6012303A (en) * | 1997-06-11 | 2000-01-11 | Saphikon, Inc. | Eutectic bonding of single crystal components |
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2001
- 2001-11-07 US US10/007,606 patent/US6663736B1/en not_active Expired - Lifetime
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2002
- 2002-11-06 JP JP2002322565A patent/JP2003188147A/ja active Pending