JP2003178902A - Resistor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistor in which the reliability of electrical connections between upper-surface electrodes and side-face electrodes can be improved. <P>SOLUTION: A pair of upper-surface electrodes 12 formed on one main surface of a substrate 11 is constituted in double-layered structures each consisting of a first upper-surface electrode layer 14, a second lower-surface electrode layer 15 formed to overlap the electrode layer 14 at least partially, and a contact layer 16 lying upon the electrode layers 14 and 15. Consequently, the reliability of the electrical connections between the upper-surface electrodes 12 and side-face electrodes can be improved. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and its manufacturing method, and more particularly to a fine resistor and its manufacturing method.

[0002]

2. Description of the Related Art As a conventional resistor of this type, a resistor having a four-layer structure on a side surface electrode disclosed in Patent Document 1 is disclosed.
It has been known.

In this resistor, as shown in FIG. 26, a resistance layer 3 is provided so as to straddle a pair of upper surface electrode films 2 provided at both ends of the upper surface of the substrate 1 and inside the end surface of the substrate 1. At the same time, a pair of U-shaped side surface electrodes 4 electrically connected to the pair of upper surface electrode films 2 are provided on the end surface of the substrate 1. The side surface electrode 4 has a NiCr thin film, a Ti thin film, or a Cr thin film electrically connected to the upper surface electrode film 2 at the lowermost layer.
A U-shaped first metal thin film 5 made of a thin film, a second metal thin film 6 made of a low-resistance Cu thin film which is superposed on the first metal thin film 5, and a second metal thin film 6 being superposed on the second metal thin film 6. It has a four-layer structure of a first metal plating film 7 made of a Ni plating film, and a second metal plating film 8 made of a Pb-Sn plating film or a Sn plating film, which overlaps the first metal plating film 7. Was there.

[0004]

[Patent Document 1] Japanese Unexamined Patent Publication No. 3-80501

[0005]

However, in the above-described conventional resistor, the pair of upper surface electrode films 2 are simply provided at both ends of the upper surface of the substrate 1 and inside the end surface of the substrate 1. Because of the structure, the connection area between the first metal thin film 5 and the upper surface electrode film 2 in the side surface electrode 4 having a four-layer structure is small, and as a result, the electrical connection reliability between the upper surface electrode film 2 and the side surface electrode 4 is improved. It had a problem of low productivity.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a resistor capable of improving the reliability of electrical connection between an upper surface electrode and a side surface electrode, and a method for manufacturing the same. .

[0007]

In order to achieve the above object, the present invention has the following constitution.

According to a first aspect of the present invention, there is provided a substrate, a pair of upper surface electrodes formed on one main surface of the substrate, and a resistor provided so as to be electrically connected to the pair of upper surface electrodes. A body and a protective layer provided so as to cover at least the resistor, and the pair of upper surface electrodes are formed so as to at least partially overlap the first upper surface electrode layer and the first upper surface electrode layer. It has a multi-layer structure of a second upper surface electrode layer provided and an adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer. According to this structure, one main surface of the substrate is formed. A pair of upper surface electrodes formed on the first upper surface electrode layer, a second upper surface electrode layer provided so as to at least partially overlap the first upper surface electrode layer, and the first upper surface electrode layer. And a multilayer structure of an adhesion layer that overlaps the second upper surface electrode layer. Therefore, when manufacturing a resistor with a multi-sheet sheet substrate, in the resistance value measurement at the time of trimming to correct the resistance value between the pair of upper surface electrodes, the presence of the first upper surface electrode layer causes In addition to the second upper surface electrode layer, the probe can be brought into contact with the second upper surface electrode layer of the adjacent resistor, which is particularly advantageous in manufacturing a small-sized resistor. Further, when the side surface electrode is formed on the edge of the substrate, when the side surface electrode is formed by the thin film technique, the side surface electrode and the side surface electrode are formed due to the presence of the adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer. The connection area with the upper surface electrode can be increased, which has the effect of improving the electrical connection reliability between the upper surface electrode and the side surface electrode.

According to a second aspect of the invention, in particular, the second upper surface electrode layer is provided inside the edge of the upper surface of the substrate. According to this configuration, the second upper surface electrode layer is formed. , Since it is provided inside the edge of the upper surface of the substrate, when dividing a multi-sheet sheet substrate into individual pieces or strips,
The second top electrode layer is not present in the division, and as a result,
It has an effect that peeling and burrs of the upper electrode layer do not occur.

According to a third aspect of the present invention, in particular, the first upper surface electrode layer forming the upper surface electrode and the adhesion layer are flush with each other at the edge of the substrate. For example, since the first upper surface electrode layer and the adhesion layer forming the upper surface electrode are configured to be flush with the edge of the substrate, when the side surface electrode is formed on the edge of the substrate by the thin film technique, This has the effect that the side surface electrode made of a thin film can be continuously and stably formed on the edge of the substrate and the edge of the first upper surface electrode layer and the adhesion layer on the edge of the substrate.

According to a fourth aspect of the present invention, in particular, of the first upper surface electrode layer, the second upper surface electrode layer, and the adhesion layer which form the upper surface electrode, only the second upper surface electrode layer is electrically connected to the resistor. According to this configuration, only the second upper surface electrode layer of the first upper surface electrode layer, the second upper surface electrode layer, and the adhesion layer forming the upper surface electrode has the resistance. Since it is configured to be electrically connected to the body, the resistance value does not change even if the adhesion layer is formed, and this allows good ohmic contact to be maintained. This has the effect of obtaining a highly reliable resistor that does not change.

According to a fifth aspect of the present invention, in particular, among the first upper surface electrode layer, the second upper surface electrode layer and the adhesive layer which form the upper surface electrode, the maximum height in the thickness direction of the adhesive layer is The first upper surface electrode layer, the second upper surface electrode layer and the adhesion layer constituting the upper surface electrode are configured to be higher than the maximum height in the thickness direction of the first upper surface electrode layer. Among these, since the maximum height in the thickness direction of the adhesion layer is configured to be higher than the maximum height in the thickness direction of the first upper surface electrode layer, the side surface electrode is formed on the edge of the substrate by thin film technology. When formed, the presence of the adhesion layer can increase the contact area between the upper surface electrode and the side surface electrode made of a thin film, which can improve the electrical connection reliability between the upper surface electrode and the side surface electrode. I have.

According to a sixth aspect of the present invention, in particular, a pair of substantially U-shaped side surface electrodes electrically connected to at least the first upper surface electrode layer and the adhesion layer are provided on the edge of the substrate. According to this structure, since a pair of side electrodes of a substantially U-shape that are electrically connected to at least the first upper surface electrode layer and the adhesion layer are provided at the edge of the substrate, the upper surface electrode The side electrode and the side electrode are electrically connected in a stable state, which has the effect of obtaining a highly reliable resistor.

According to a seventh aspect of the present invention, in particular, the side surface electrode is formed of a Cr thin film, a Ti thin film, a Cr-based alloy thin film, or a Ti-based alloy thin film which is located on the edge side of the substrate and has good adhesion to the substrate. A first thin film made of any one of the above, a second thin film made of a Cu-based alloy thin film electrically connected to the first thin film, and a first thin film made of nickel plating covering at least the second thin film. The multi-layered structure includes a plating film and a second plating film that covers at least the first plating film. According to this structure, the second thin film electrically connected to the first thin film is formed. Since it is composed of a Cu-based alloy thin film,
The additive metal forming the Cu-based alloy thin film and the constituent metal of the first thin film form a total solid solution at the interface between the first thin film and the second thin film, whereby the first thin film is formed. And has the effect of improving the adhesion of the second thin film.

In the invention described in claim 8, in particular, the second thin film forming the side surface electrode is formed of a Cu-Ni alloy thin film in which Cu is contained in an amount of 1.6 wt% or more. According to the configuration, the second thin film forming the side surface electrode is C
Since it is composed of a Cu-Ni alloy thin film in which u contains 1.6% by weight or more of Ni, the Ni component of the Cu-Ni alloy thin film and the constituent metal of the first thin film should form a solid solution at all rates. This has the effect of improving the adhesion between the first thin film and the second thin film.

According to a ninth aspect of the present invention, in particular, the first thin film and the second thin film forming the side surface electrode are formed in a substantially L shape from the back surface to the side surface of the substrate. For example, since the first thin film and the second thin film forming the side surface electrode are formed in a substantially L shape from the back surface of the substrate to the side surface, the first thin film and the second thin film are formed by the thin film technique. In this case, it can be easily formed from only the rear surface side of the substrate toward the upper surface side of the substrate, which has the effect of improving productivity.

According to a tenth aspect of the invention, a step of providing a plurality of pairs of first upper surface electrode layers on the upper surface of the sheet-shaped substrate,
Providing a plurality of pairs of second upper surface electrode layers electrically connected to the plurality of pairs of first upper surface electrode layers; and a plurality of plurality of electrically connected to the plurality of pairs of second upper surface electrode layers. A step of providing a resistor, a step of providing a plurality of protective layers so as to cover at least the plurality of resistors, and a step of correcting a resistance value between the plurality of pairs of second upper surface electrode layers in the plurality of resistors. A step of trimming, a step of providing a plurality of pairs of adhesion layers so as to overlap the plurality of pairs of the first upper surface electrode layers and the second upper surface electrode layers, and a plurality of the plurality of pairs of first layers on the sheet-like substrate. Forming a plurality of slit-shaped first dividing portions for separating the upper surface electrode layer, the second upper surface electrode layer, and the plurality of pairs of adhesion layers into a plurality of strip-shaped substrates; On multiple strip-shaped substrates on the substrate,
And a step of forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portion so that the plurality of resistors are individually separated and divided into individual substrates. According to this manufacturing method, the step of providing a plurality of pairs of first upper surface electrode layers on the upper surface of the sheet-shaped substrate, and the plurality of pairs electrically connected to the plurality of pairs of first upper surface electrode layers Second
The step of providing a plurality of pairs of adhesion layers so as to overlap the plurality of pairs of the first upper surface electrode layers and the plurality of pairs of the second upper surface electrode layers. When a resistor is manufactured on a strip-shaped substrate, in the resistance value measurement at the time of trimming in order to correct the resistance value between the plurality of pairs of second upper surface electrode layers, the presence of the first upper surface electrode layer causes In addition to the two upper surface electrode layers, the probe can be brought into contact with the second upper surface electrode layer of the adjacent resistor, which is particularly advantageous in manufacturing a small-sized resistor. Further, when the side surface electrode is formed on the edge of the substrate, when the side surface electrode is formed by the thin film technique, the side surface electrode and the side surface electrode are formed due to the presence of the adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer. , First
It is possible to increase the connection area between the upper surface electrode layer, the second upper surface electrode layer, and the upper surface electrode formed of the adhesion layer, and thereby improve the reliability of electrical connection between the upper surface electrode and the side surface electrode. It has the effect of being able to.

According to the eleventh aspect of the present invention, in particular, the plurality of slit-shaped first divided portions are formed by dicing, and according to this manufacturing method, it is not necessary to classify the individual substrates. Therefore, the process is not complicated, and the dicing can be easily performed using general dicing equipment for semiconductors and the like.

According to a twelfth aspect of the present invention, in particular, a plurality of second divided portions are formed by dicing. According to this manufacturing method, it is not necessary to classify the individual substrate, so that the steps can be performed. It is possible to eliminate the complexity of
The dicing also has an effect that it can be easily performed using general dicing equipment for semiconductors and the like.

In a thirteenth aspect of the present invention, in particular, a plurality of second divided portions are formed by a laser, and then the second divided portions are divided into individual substrates. Thus, according to this manufacturing method, there is an effect that the second divided portion is not singulated each time it is formed, but it is singulated in two steps. The resistor has an effect that it can be performed by using a general dividing facility.

According to a fourteenth aspect of the present invention, in particular, an unnecessary area portion is formed at an end portion of a sheet-shaped substrate, and a plurality of slit-shaped first divided portions are formed by a plurality of strip-shaped substrates. The strip-shaped substrate is formed so as to be in a state in which the strip-shaped substrates are connected to each other. According to this manufacturing method, the plurality of strip-shaped substrates are unnecessary regions even after the plurality of slit-shaped first divided portions are formed. Since the sheet-shaped substrate is not divided into a plurality of strip-shaped substrates, the sheet having an unnecessary area portion is formed even after the plurality of slit-shaped first divided portions are formed. Since the post-process can be performed in the state of the substrate having a striped shape, it has the effect of simplifying the design of the manufacturing method.

According to a fifteenth aspect of the present invention, a step of providing a plurality of pairs of first upper surface electrode layers on the upper surface of the sheet-like substrate,
Providing a plurality of pairs of second upper surface electrode layers electrically connected to the plurality of pairs of first upper surface electrode layers; and a plurality of plurality of electrically connected to the plurality of pairs of second upper surface electrode layers. A step of providing a resistor, a step of providing a plurality of first protective layers containing glass as a main component so as to cover the plurality of resistors, and a plurality of pairs of second upper surface electrode layers in the plurality of resistors. Trimming in order to correct the resistance value of the above, a step of providing a plurality of pairs of adhesion layers so as to overlap the plurality of pairs of the first upper surface electrode layer and the second upper surface electrode layer, and at least the glass A step of providing a plurality of second protective layers made of a resin layer so as to cover the plurality of first protective layers as a component, and the plurality of pairs of the first upper surface electrode layers, the second Separate the top electrode layer and adhesion layer of the A plurality of slit-shaped first dividing portions for forming a plurality of strip-shaped substrates, and the plurality of strip-shaped substrates in the sheet-shaped substrate are individually divided into the plurality of resistors to be divided into individual substrates. So that the slit-shaped first
And a step of forming a plurality of second divided portions in a direction orthogonal to the divided portions. According to this manufacturing method, a plurality of pairs of first upper surface electrode layers are formed on the upper surface of the sheet-shaped substrate. Providing, providing a plurality of pairs of second upper surface electrode layers electrically connected to the plurality of pairs of first upper surface electrode layers, and providing a plurality of pairs of the first upper surface electrode layers and second upper surfaces Since a step of providing a plurality of pairs of adhesion layers so as to overlap with the electrode layers is provided, when a resistor is manufactured using a plurality of sheet-like substrates, the resistance value between the plurality of pairs of second upper surface electrode layers is In the resistance value measurement at the time of trimming for correction, the presence of the first upper surface electrode layer causes the presence of the first upper surface electrode layer,
The probe can be brought into contact with the second upper electrode layer of the adjacent resistor, which is particularly advantageous in manufacturing a small resistor. Further, when the side surface electrode is formed on the edge of the substrate, when the side surface electrode is formed by the thin film technique, the presence of the adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer causes
It is possible to increase the connection area between the side surface electrode and the upper surface electrode composed of the first upper surface electrode layer, the second upper surface electrode layer, and the adhesion layer, and thereby to electrically connect the upper surface electrode and the side surface electrode. The reliability can be increased. And a step of providing a plurality of first protective layers containing glass as a main component so as to cover the plurality of resistors, and a resin layer so as to cover at least the plurality of first protective layers containing glass as a main component. Since a step of providing a plurality of second protective layers is provided, it is possible to prevent cracks from occurring during laser trimming in the first protective layer containing glass as a main component, thereby reducing current noise. In addition to that, by covering the entire resistor with the second protective layer made of a resin layer, it is possible to secure the resistance characteristic excellent in the moisture resistance characteristic.

According to a sixteenth aspect of the present invention, in particular, a plurality of pairs of adhesion layers made of a conductive resin are provided so as to overlap the plurality of pairs of the first upper surface electrode layer and the second upper surface electrode layer. The step of providing a plurality of first protective layers containing glass as a main component so as to cover the resistors, and trimming in order to correct the resistance value between the plurality of pairs of second upper surface electrode layers in the plurality of resistors. According to this manufacturing method, the formation temperature of the first protective layer containing glass as a main component is 600 ° C. or higher.
Moreover, since the formation temperature of the adhesive layer made of a conductive resin is around 200 ° C., the resistance value does not change after trimming and resistance value correction.

According to a seventeenth aspect of the present invention, in particular, a plurality of pairs of adhesion layers made of a conductive resin are provided so as to overlap the plurality of pairs of the first upper surface electrode layer and the second upper surface electrode layer. The step of providing a plurality of first protective layers containing glass as a main component so as to cover the resistors, and trimming in order to correct the resistance value between the plurality of pairs of second upper surface electrode layers in the plurality of resistors. And a step of providing a plurality of second protective layers made of a resin layer so as to cover at least the plurality of first protective layers containing glass as a main component, According to this manufacturing method, the formation temperature of the first protective layer containing glass as a main component is 6
Since the formation temperature of the second protective layer made of a resin layer and the adhesion layer made of a conductive resin is about 200 ° C. at a temperature of 00 ° C. or higher, the resistance value change after trimming and resistance value correction Has the effect of never occurring.

According to the eighteenth aspect of the present invention, in particular, a plurality of slit-shaped first divided portions are formed by dicing, and according to this manufacturing method, it is not necessary to classify the individual substrates. Therefore, the process is not complicated, and the dicing can be easily performed using general dicing equipment for semiconductors and the like.

According to the nineteenth aspect of the present invention, in particular, a plurality of second divided portions are formed by dicing. According to this manufacturing method, the size classification of the individual substrate is not necessary, and therefore the process is performed. It is possible to eliminate the complexity of
The dicing also has an effect that it can be easily performed using general dicing equipment for semiconductors and the like.

In the invention as set forth in claim 20, in particular, a plurality of second divided portions are formed by a laser, and then the second divided portions are divided and divided into individual substrates. Thus, according to this manufacturing method, there is an effect that the second divided portion is not singulated each time it is formed, but it is singulated in two steps. The resistor has an effect that it can be performed by using a general dividing facility.

According to a twenty-first aspect of the present invention, in particular, an unnecessary area portion is formed at an end of a sheet-shaped substrate, and a plurality of slit-shaped first divided portions are formed by a plurality of strip-shaped substrates. The strip-shaped substrate is formed so as to be in a state in which the strip-shaped substrates are connected to each other. According to this manufacturing method, the plurality of strip-shaped substrates are unnecessary regions even after the plurality of slit-shaped first divided portions are formed. Since the sheet-shaped substrate is not divided into a plurality of strip-shaped substrates, the sheet having an unnecessary area portion is formed even after the plurality of slit-shaped first divided portions are formed. Since the post-process can be performed in the state of the substrate having a striped shape, it has the effect of simplifying the design of the manufacturing method.

[0029]

DETAILED DESCRIPTION OF THE INVENTION A resistor according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a resistor according to an embodiment of the present invention, and FIG. 2 is a top view of the same resistor excluding side electrodes.

As shown in FIGS. 1 and 2, the resistor according to the embodiment of the present invention has a pair of upper surface electrodes 12 on the upper surface of a substrate 11, and the pair of upper surface electrodes 12 is provided.
It is configured by having a resistor 13 between them.

The pair of upper surface electrodes 12 provided on the upper surface of the substrate 11 made of alumina or the like includes a first upper surface electrode layer 14 and a second upper surface electrode layer 15 which are sequentially formed from the substrate 11 side.
And the adhesion layer 16 have a multilayer structure. The first upper surface electrode layer 14 is provided from the entire edge of the upper surface of the substrate 11 in the longitudinal direction toward the center thereof.
It is made of u, resin, or the like, and is for increasing at least the probe contact area when the resistance value is corrected (laser trimming). The second upper surface electrode layer 15 is formed so that a part thereof overlaps with the first upper surface electrode layer 14 from a position distant from the longitudinal edge of the upper surface of the substrate 11 toward the center side toward the center. It is made of Ag and the like. Further, the adhesion layer 16 is formed of the first and second upper surface electrode layers 14, 15
And is formed so as to be flush with the first upper surface electrode layer 14 at the edge of the substrate 11, which is made of Ag, resin or the like, and is composed of at least the side surface electrode and the upper surface electrode 12 which will be described later. It is provided to improve the electrical connection of the. In this case, the maximum height of the adhesion layer 16 in the thickness direction is configured to be higher than the maximum height of the first upper surface electrode layer 14 in the thickness direction, which is the contact between the side surface electrode and the upper surface electrode 12. This is to increase the area.

The resistor 13 is provided so as to extend between the pair of upper surface electrodes 12, and is made of ruthenium oxide or the like. In this case, in order to maintain a good ohmic contact and obtain a highly reliable resistor having a stable resistance value, only the second upper surface electrode layer 15 of the upper surface electrode 12 has the resistor 13
It is preferable to be configured to be electrically connected to.

Next, in order to correct the resistance value to the desired resistance value, the first surface made of glass or the like is formed on the upper surface of the resistance element 13.
The protective layer 17 is provided, and the trimming groove 18 is provided on the first protective layer 17 and the resistor 13 by a laser or the like to correct the resistance value. After that, a resin is formed so as to cover at least the resistor 13, preferably the resistor 13 that straddles the second upper surface electrode layers 15 of the pair of upper surface electrodes 12 so as to overlap, the first protective layer 17, and the trimming groove 18. Alternatively, the second protective layer 19 made of glass or the like is provided.

At the edge of the substrate 11, a pair of side-surface electrodes 20 are provided so as to be electrically connected to the upper surface electrode 12 and surround in a substantially U shape. The side surface electrode 20 includes a first thin film 21 and a second thin film 2 which are sequentially formed from the edge side of the substrate 11.
2 and a first plating film 23 and a second plating film 24. The first thin film 21 is the substrate 1
From the back surface to the side surface of 1, a Cr, Cr-based alloy thin film, Ti, Ti-based alloy thin film, or NiCr alloy thin film having good adhesion to the substrate 11 is sputtered, vacuum-deposited, ion-plated, It is formed by a thin film technique such as P-CVD. The second thin film 22 is formed in a substantially L-shape from the back surface to the side surface of the substrate 11 and is a Cu-based alloy thin film that is sputtered, vacuum-deposited so as to be electrically connected so as to overlap with the first thin film 21. Ion plating, P-CVD
It is formed by a thin film technique such as.

The first plating film 23 is formed of a Ni plating film having excellent heat resistance and solder diffusion prevention so as to cover the exposed upper surface electrode 12 and the second thin film 22.
Further, the second plating film 24 is formed of a Pb-Sn plating film or Sn plating film having good solder adhesion so as to cover the first plating film 23.

The manufacturing method of the resistor according to the embodiment of the present invention having the above-described structure will be described with reference to the drawings.

FIG. 3 is a top view showing a state in which an unnecessary region is formed at the edge of the entire circumference of a sheet-like substrate used when manufacturing a resistor according to an embodiment of the present invention, and FIG.
(A) (b), FIG.6 (a) (b), FIG.8 (a) (b),
10 (a) (b), FIG. 12 (a) (b), FIG. 14, FIG. 16 (a) (b) and FIG. 18 (a) (b) show a resistor according to an embodiment of the present invention. Cross-sectional view showing the manufacturing process,
5 (a) (b), FIG. 7 (a) (b), FIG. 9 (a)
(B), FIG. 11 (a) (b), FIG. 13 (a) (b), FIG. 15, FIG. 17 (a) (b) and FIG. 19 (a) (b) are one embodiment of the present invention. 4 is a top view showing the manufacturing process of the resistor in FIG.

First, as shown in FIGS. 3, 4 (a) and 5 (a), a 0.2 mm-thick insulating sheet-like substrate 31 made of calcined 96% pure alumina is prepared. To do. In this case, as shown in FIG. 3, the sheet-shaped substrate 31 has an unnecessary region portion 31a which does not become a product in the end at the entire peripheral edge portion. The unnecessary area portion 31a is formed in a substantially square shape.

Next, as shown in FIGS. 3, 4 (b) and 5 (b), a plurality of pairs of first conductive pastes of Au series are formed on the upper surface of the sheet-like substrate 31 by the screen printing method. The upper surface electrode layer 32 was formed and baked with a baking profile having a peak temperature of 850 ° C., thereby forming the first upper surface electrode layer 32 as a stable film.

Next, as shown in FIGS. 3, 6 (a) and 7 (a), the upper surface of the sheet-like substrate 31 is overlapped with at least a part of the first upper surface electrode layer 32. A plurality of pairs of second upper surface electrode layers 33 containing silver as a main component were formed by a screen printing method, and the second upper surface electrode layers 33 were formed into a stable film by baking with a baking profile having a peak temperature of 850 ° C. .

Next, as shown in FIGS. 3, 6B, and 7B, a plurality of ruthenium oxide-based ruthenium oxide-based materials are formed by a screen printing method so as to straddle a plurality of pairs of second upper surface electrode layers 33. The resistor 34 was formed and fired with a firing profile having a peak temperature of 850 ° C., thereby forming the resistor 34 as a stable film.

Next, as shown in FIGS. 8A and 9A, a plurality of first protective layers 35 containing glass as a main component are formed by screen printing so as to cover the plurality of resistors 34.
Was formed and baked in a baking profile having a peak temperature of 600 ° C., whereby the first protective layer 35 containing glass as a main component was formed into a stable film.

Next, as shown in FIGS. 8B and 9B, in order to correct the resistance value of the resistor 34 between the plurality of pairs of second upper surface electrode layers 33 to a constant value, Trimming is performed by the laser trimming method, and a plurality of trimming grooves 36 are formed.
Was formed.

Next, as shown in FIGS. 10A and 11A, so as to overlap a part of the plurality of pairs of the first upper surface electrode layers 32 and a part of the second upper surface electrode layers 33. A plurality of pairs of adhesive layers 37 made of a silver-based conductive resin were formed by the screen printing method, and the adhesive layers 37 were cured with a curing profile having a peak temperature of 200 ° C. to form a stable film.

Next, as shown in FIGS. 10 (b) and 11 (b), while covering the plurality of first protective layers 35 mainly composed of glass arranged in the vertical direction in the drawing, the resistor 34 is also provided. Part of the second upper surface electrode layer 33 and a part of the second upper surface electrode layer 33 are screen-printed to form a plurality of second resin-based components.
The protective layer 38 of No. 2 was formed, and the second protective layer 38 was formed into a stable film by curing with a curing profile having a peak temperature of 200 ° C.

Next, FIG. 3, FIG. 12 (a) and FIG. 13 (a)
As shown in FIG. 5, the unnecessary region portion 31a formed at the end portion of the entire circumference of the sheet-like substrate 31 on which the second protective layer 38 is formed.
Except for the above, a plurality of pairs of first upper surface electrode layers 32 and adhesion layers 37 are separated to form a plurality of slit-shaped first dividing portions 39 for dividing the plurality of strip-shaped substrates 31b by a dicing method. In this case, the plurality of slit-shaped first divided portions 39 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 39 is 120 μm. The plurality of slit-shaped first dividing portions 39 are formed by through holes that vertically penetrate the sheet-shaped substrate 31. Further, since the sheet-shaped substrate 31 is formed with the plurality of slit-shaped first divided portions 39 by the dicing method except the unnecessary region portion 31a, the slit-shaped first divided portions 39 are formed. Since the plurality of strip-shaped substrates 31b are still connected to the unnecessary area 31a after that, they are in a sheet state.

Next, as shown in FIGS. 12B and 13B, a mask (not shown) is used to perform a sputtering method from the back surface side of the sheet-shaped substrate 31 to the back surface of the substrate 31. The substrate 31 forming a part of the side surface electrode 40 on the end surface of the substrate 31 on the inner surface of the part and the plurality of slit-shaped first divided portions 39, the end surface of the first upper electrode layer 32, and the end surface of the adhesion layer 37. A plurality of pairs of first thin films 41 made of a Cr thin film having good adhesion to are formed in a substantially L shape.

Next, as shown in FIGS. 14 and 15, by a sputtering method using a mask (not shown), the plurality of pairs of first thin films 41 are overlapped from the back surface side of the sheet-shaped substrate 31. And Cu-Ni forming a part of the side surface electrode 40.
A plurality of pairs of second thin films 42 made of an alloy thin film are formed in a substantially L shape.

Next, FIG. 3, FIG. 16 (a) (b), and FIG.
As shown in (a) and (b), a plurality of strip-shaped substrates 31b in the sheet-shaped substrate 31 are provided with a plurality of strip-shaped substrates 31b except for the unnecessary region portions 31a formed at the ends of the entire periphery of the sheet-shaped substrate 31. A plurality of second divided portions 43 is formed in a direction orthogonal to the slit-shaped first divided portion 39 so that the resistor 34 is individually separated and divided into the individual substrate 31c. In this case, since the plurality of second divided portions 43 are formed with a pitch of 400 μm, the width of the second divided portions 43 is 100 μm. The plurality of second divided portions 43 are formed by laser scribing.
(A), as shown in FIG. 17 (a), a dividing groove is formed by a laser, and then, as shown in FIGS. 16 (b) and 17 (b), the dividing groove portion is divided by general dividing equipment. Then, the individual substrate 31c is divided. That is, this dividing method has an effect that it is not divided into pieces each time the second dividing portion 43 is formed, but is divided into two pieces. Further, since the plurality of second divided portions 43 are formed by laser scribing on the plurality of strip-shaped substrates 31b except the unnecessary area portion 31a, each of the plurality of second divided portions 43 is formed. Is divided into individual pieces of substrate 31c, and this individual piece of substrate 31c is separated from the unnecessary area portion 31a.

Next, as shown in FIGS. 18 (a) and 19 (a), the second thin film 42 forming a part of the side surface electrode 40 is covered and exposed by an electroplating method. A first plating film 44 made of nickel plating having a thickness of about 2 to 6 μm and excellent in solder diffusion prevention and heat resistance is formed so as to cover the end surface of the adhesion layer 37 and the upper surface of the second upper surface electrode layer 33. Form.

Finally, as shown in FIGS. 18 (b) and 19 (b), an electroplating method is used to cover the first plating film 44 made of nickel plating with a thickness of about 3 to
A second plating film 45 having a thickness of 8 μm and made of tin plating having good solder adhesion is formed.

The resistor according to the embodiment of the present invention is manufactured by the above manufacturing steps.

In the above manufacturing process, the second plating film 45 is made of tin plating, but the present invention is not limited to this. It is also possible to use a tin alloy material such as solder plating. Often, when these materials are used, stable soldering can be performed during reflow soldering.

In the above manufacturing process, the resistor 34
And the like, a first protective layer 35 containing glass as a main component for covering the resistor 34, and a second protective layer 35 as a main component for covering the first protective layer 35 and the trimming groove 36. Since the protective layer 38 is composed of two layers, the first protective layer 35 can prevent the occurrence of cracks during laser trimming to reduce the current noise, and the second protective layer containing the resin as a main component. Since the entire resistor 34 is covered with the layer 38, it is possible to secure resistance characteristics having excellent moisture resistance.

Further, in the resistor manufactured by the above manufacturing process, the interval between the slit-shaped first divided portion 39 formed by the dicing method and the second divided portion 43 formed by laser scribing is accurate (± 0. .005m
m)) and the first side electrode 40
Since the thicknesses of the thin film 41 and the second thin film 42 and the thicknesses of the first plated film 44 and the second plated film 45 are accurate,
The total length and width of the product resistor is exactly 0.
6 mm × width 0.3 mm. Further, the pattern accuracy of the first upper surface electrode layer 32 and the resistor 34 does not need to be classified into the dimensional rank of the individual substrates, and it is not necessary to consider the dimensional variation within the dimensional rank of the same individual substrate. The effective area of the resistor 34 can be made larger than that of the conventional product. That is, the resistor in the conventional product had a length of about 0.20 mm and a width of 0.19 mm, whereas the resistor 34 of the resistor in the embodiment of the present invention had a length of about 0.25 mm and a width of 0. The area becomes 0.24 mm, which is about 1.6 times or more in area.

Further, in the above manufacturing process, the plurality of slit-shaped first divided portions 39 are formed by using the dicing method, and the sheet-shaped substrate 31 which does not require the dimensional classification of individual substrates is used. Therefore, it is not necessary to perform dimensional classification of the individual substrate as in the conventional case, thereby making it possible to eliminate the complexity of the process, and the dicing can be easily performed using general dicing equipment such as semiconductors. It is a thing.

Further, in the above manufacturing process, the sheet-like substrate 31 has unnecessary regions 31a which will not be the final products at the end portions of the entire periphery thereof, and has a plurality of slit-like first dividing portions 39. Is formed on the sheet-shaped substrate 31 so that the plurality of strip-shaped substrates 31b are connected to the unnecessary region portion 31a, and therefore a plurality of slit-shaped first divided portions 39 are formed even after the plurality of strip-shaped substrates 31b are formed. Strip-shaped substrate 31b
Is connected to the unnecessary area portion 31a, so that the sheet-shaped substrate 31 is not finely separated into the plurality of strip-shaped substrates 31b. Therefore, the plurality of slit-shaped first divided portions 39 are formed. After that, the unnecessary area portion 31
Since the post-process can be performed in the state of the sheet-shaped substrate 31 having a, the method design can be simplified.

In the above manufacturing process, the side electrode 4
The first thin film 41 and the second thin film 42 forming 0 are formed by a sputtering method using a mask (not shown), but the present invention is not limited to this, and the mask (not shown) is used. Without using, the thin film is also formed on the entire back surface of the sheet-like substrate by the sputtering method, and thereafter, unnecessary portions of the thin film formed on the entire back surface, that is, the substantially central portion of the back surface is peeled off by laser irradiation to remove the side surface. The back surface portion of the electrode 40 may be formed.

Next, the side surface electrode 40 in the above manufacturing process
The second thin film 42 forming a part of the above will be described in detail.

Of the Cu-based alloy thin films, the material of the second thin film 42 is preferably a Cu-Ni alloy thin film.

In the Cu-Ni alloy thin film, the additive material Ni is C with respect to Cu which is the main element of the alloy thin film and the first thin film 41.
This constitutes a “total solid solution” in which Ni is uniformly dissolved in the entire composition ratio (range) of u. Therefore, Cu-N
Ni diffuses into the interface between the second thin film 42 made of an i alloy thin film and the first thin film 41 to form a strong adhesion layer, which improves the adhesion. Further, Ni existing on the outermost surface of the second thin film 42 is
Since the plating bath for forming the nickel plating used for the first plating film 44 has the effect of enhancing the anticorrosion property on the surface of the second thin film 42, the first plating film 44 and the second thin film 42 are formed. The adhesiveness at the interface of can be improved.

Here, the “total rate solid solution” in one embodiment of the present invention is as shown in the equilibrium state diagram of the Cu—Ni alloy thin film forming the second thin film shown in FIG. Figure 2
In FIG. 0, when the addition amount of Ni metal is plotted on the horizontal axis and the temperature is plotted on the vertical axis, it is in a liquid phase state at a temperature higher than the liquidus line shown by the solid line and in a solid state at a temperature lower than the solidus line shown by the dotted line. The region surrounded by these solid lines and dotted lines is a state in which the solid phase and the liquid phase are mixed, that is, "total solid solution". That is, Cu-N in the embodiment of the present invention
The second thin film 42 made of an i alloy thin film is a face-centered cubic structure in which Ni metal atoms having a crystal structure of the same face-centered cubic lattice are dissolved in Cu metal of a face-centered cubic lattice, which is a base metal, to form one phase. The substitutional solid solution having a lattice structure is formed over the entire tissue range.

FIG. 21 shows the results of composition analysis by SIMS of the first thin film 41 made of a Cr thin film and the second thin film 42 made of a Cu—Ni alloy thin film. At this time, the amount of Ni added to the second thin film 42 is 6.2 wt%. In FIG. 21, the horizontal axis represents the film thickness from the surface of the Cu—Ni alloy thin film by the sputtering time, and the vertical axis represents the C in each layer.
It shows the number of atoms of u, Ni, Cr and the like. As is clear from FIG. 21, the Cu—Ni alloy thin film layer and the Cr
Although there is a diffusion layer containing Cu, Ni and Cr respectively at the interface with the thin film layer, Ni metal is contained in the Cu metal between the surface of the Cu-Ni alloy thin film layer and the interface with the Cr thin film layer. It exists uniformly. this is,
It shows that the second thin film 42 made of a Cu-Ni alloy thin film is a "total solid solution" in which Ni metal is completely melted in Cu metal to form one phase. Further, in FIG. 21, the amount of Ni added is set to 6.2 wt%,
The added amount of Ni is the same as that shown in FIG. 21 in the entire composition range.

Next, in the resistor according to the embodiment of the present invention configured as described above, the characteristics of using the Cu—Ni alloy thin film as the second thin film 42 will be described.

As a test method for explaining the characteristics, the test is performed by the method defined in "Plating adhesion test method / JIS H8504C", and the test tape is shown in FIG.
As shown in (b), "Cellophane adhesive tape / JIS
Adhesive tape 4 with a width of 18 mm specified in "Z 1522"
6 was used. At this time, the peeling direction of the adhesive tape 46 is as shown in “JIS H 8504” shown in FIG.
As shown in (b), it was set in a direction perpendicular to or inclined with respect to the alumina substrate 47.

That is, in this test method, an alumina substrate 47 is used as a test piece, a Cr thin film is formed as a first thin film 41 on the side surface of the alumina substrate 47 by a sputtering method, and then the first thin film is formed. Second thin film 4 on 41
The Cu-Ni alloy thin film as 2 is similar to the first thin film 41.
The sputtering method is used. Then, a pattern having a pattern width of 0.3 mm is formed using a laser.

After that, an acceleration test is performed under the conditions of a temperature of 65 ° C. and a humidity of 95%, and then an adhesive tape 46 is brought into close contact with the surface of the second thin film 42. Then, the adhesive tape 46 is peeled off at once and the whole is removed. Second thin film 4 with respect to the number of patterns
The ratio of the number of patterns in which No. 2 was peeled off was determined and the adhesion was evaluated.

Further, the first plating film 44 and the second thin film 42
Regarding the test piece for evaluating the adhesiveness of the interface of No. 1, after forming the second thin film 42, nickel plating was formed as the first plating film 44, and solder plating was further formed as the second plating film 45 by electrolytic plating. I used one.

The evaluation was carried out when the amount of Ni added in the Cu—Ni alloy thin film was “1.6 wt%”, “6.2 wt%”, and “12.6 wt%”.
% ”And the amount of Ni added was“ 0 wt% ”.

Table 1 shows the second test after 500 hours from the acceleration test.
3 shows the evaluation results of the peeling rate at the interface between the thin film 42 and the first thin film 41.

[0072]

[Table 1]

As is clear from (Table 1), by adding Ni to the Cu thin film, the adhesiveness at the interface between the second thin film 42 and the first thin film 41 is significantly improved.

Table 2 shows the first test after 500 hours from the acceleration test.
3 shows the evaluation results of the peeling rate at the interface between the plated film 44 and the second thin film 42.

[0075]

[Table 2]

As is clear from Table 2, by adding Ni to the Cu thin film, the first plated film 44 and the second plated film 44
The adhesiveness at the interface of the thin film 42 is significantly improved.

In the embodiment of the present invention described above, the first thin film 41 and the second thin film 42 are formed by using the sputtering method. However, the present invention is not limited to this sputtering method. Alternatively, even when the first thin film 41 and the second thin film 42 are formed by a thin film technique such as a vacuum deposition method, an ion plating method, or P-CVD, which is another construction method, The same effect can be obtained.

Further, in the above-mentioned one embodiment of the present invention, the first thin film 41 is formed of the Cr thin film, but the present invention is not limited to this Cr thin film.
Other Cr-Si alloy thin films with good adhesion to the substrate, N
Even when the first thin film 41 is formed of a material such as an i-Cr alloy thin film, a Ti thin film, or a Ti-based alloy thin film, the same effect as that of the embodiment of the present invention can be obtained.

Further, in the above-described embodiment of the present invention, the unnecessary area portion 31a which does not become a final product is formed in the end portion of the entire periphery of the sheet-shaped substrate 31 to have a substantially square shape. I explained the thing, but this unnecessary area part 3
1a does not necessarily have to be formed on the edge of the entire periphery of the sheet-shaped substrate 31, and for example, when the unnecessary region portion 31d is formed on one end of the sheet-shaped substrate 31 as shown in FIG. Even when the unnecessary area portions 31e are formed at both ends of the sheet-shaped substrate 31 as shown in FIG. 25, even when the unnecessary area portions 31f are formed at three ends of the sheet-shaped substrate 31 as shown in FIG. The same effect as that of the embodiment of the present invention can be obtained.

Furthermore, in the above-described one embodiment of the present invention, the case where the plurality of second divided portions 43 are formed by laser scribing has been described, but the second divided portions 43 are formed in the slit-shaped first portion. Similar to the dividing portion 39, it may be formed by using a dicing method. In this case, dicing can be easily performed using general dicing equipment for semiconductors and the like.

Furthermore, in the manufacturing process of the resistor according to the embodiment of the present invention, the plurality of pairs of the first upper electrode layer 32 and the second upper electrode layer 33 are made of a conductive resin so as to overlap with each other. The step of providing a pair of adhesion layers 37, the step of providing a plurality of first protective layers 35 containing glass as a main component so as to cover the plurality of resistors 34, and the plurality of pairs of second resistors in the plurality of resistors 34. This is performed after performing the step of trimming in order to correct the resistance value between the upper surface electrode layers 33, but the order is changed and glass is used as a main component so as to cover the plurality of resistors 34. The step of providing a plurality of first protective layers 35, and a step of trimming in order to correct the resistance value between the plurality of pairs of second upper surface electrode layers 33 in the plurality of resistors 34, and at least the glass. Main component And the step of providing the second protective layer 38 made of a resin layer so as to cover the plurality of first protective layers 35, and then the plurality of pairs of the first upper surface electrode layer 32 and the second upper surface electrode layer 33. The step of providing a plurality of pairs of adhesion layers 37 made of a conductive resin so as to overlap with each other may be carried out, and this manufacturing method also has the same effect as that of the embodiment of the present invention. It is a thing.

That is, in the manufacturing method shown in the embodiment of the present invention, the adhesion layer 37 made of a conductive resin, in which the formation temperature of the first protective layer 35 containing glass as a main component is 600 ° C. or higher, and which is made of a conductive resin. Since the formation temperature of is around 200 ℃,
The resistance value does not change after trimming to correct the resistance value. On the other hand, even when the order is changed, the formation temperature of the first protective layer 35 containing glass as a main component is 600 ° C. or higher, and the second protective layer 38 made of a resin layer and the adhesion layer made of a conductive resin. Since the formation temperature of 37 is about 200 ° C., the resistance value does not change after trimming and resistance value correction.

As described above, in the embodiment of the present invention, as shown in FIG. 1, one main surface (upper surface) of the substrate 11 is used.
The pair of upper surface electrodes 12 formed on the first upper electrode layer 1
4, a second upper surface electrode layer 15 provided so as to at least partially overlap the first upper surface electrode layer 14, and an adhesion that overlaps the first upper surface electrode layer 14 and the second upper surface electrode layer 15. Since the layer 16 has a multi-layered structure, it is possible to measure the resistance value at the time of trimming to correct the resistance value between the pair of upper surface electrodes 12 when manufacturing a resistor with a multi-sheet sheet substrate. With the presence of the first upper surface electrode layer 14, the meter can be brought into contact with the second upper surface electrode layer 15 of the adjacent resistor in addition to the second upper surface electrode layer 15 in question. This is advantageous in manufacturing a resistor.
When the side surface electrode 20 is formed on the edge of the substrate 11, when the side surface electrode 20 is formed by the thin film technique, the adhesion layer 16 overlapping the first upper surface electrode layer 14 and the second upper surface electrode layer 15 is formed. Due to the presence, the connection area between the side surface electrode 20 and the top surface electrode 12 can be increased, and thus, the electrical connection reliability between the top surface electrode 12 and the side surface electrode 20 can be improved. .

The second upper electrode layer 15 is formed on the substrate 11
Since it is provided on the inner side of the edge of the upper surface of, the second upper surface electrode layer 15 does not exist in the dividing portion when dividing a multi-sheet sheet substrate into individual pieces or strips, As a result, the second upper surface electrode layer 15 has a function of preventing peeling, burr, or the like.

Further, since the first upper surface electrode layer 14 and the adhesion layer 16 forming the upper surface electrode 12 are formed so as to be flush with the edge of the substrate 11, the side surface electrode is formed on the edge of the substrate 11. When the thin film 20 is formed by the thin film technique, the side surface electrode 20 made of a thin film can be continuously formed in a stable state on the edge of the substrate 11 and the substrate edge side of the first upper surface electrode layer 14 and the adhesion layer 16. It has the action.

Further, of the first upper surface electrode layer 14, the second upper surface electrode layer 15 and the adhesion layer 16 forming the upper surface electrode 12, only the second upper surface electrode layer 15 is electrically connected to the resistor 13. Therefore, the resistance value does not change even when the adhesion layer 16 is formed. As a result, the ohmic contact can be favorably maintained, so that the resistance value does not change after the resistance value is corrected. It has an effect of obtaining a high resistor.

Furthermore, the first upper surface electrode layer 14, the second upper surface electrode layer 15 and the adhesion layer 1 which form the upper surface electrode 12
6, the maximum height of the adhesion layer 16 in the thickness direction is higher than the maximum height of the first upper surface electrode layer 14 in the thickness direction. When 20 is formed by thin film technology, the adhesion layer 16
Due to the presence of the
The contact area of 0 can be increased, which has the effect of improving the electrical connection reliability of the upper surface electrode 12 and the side surface electrode 20.

Further, since the first upper surface electrode layer 14 constituting the upper surface electrode 12 is composed of the conductive paste, when dividing a multi-piece sheet-like substrate into pieces or strips, This makes it easier to divide the first upper surface electrode layer 14 into pieces, which makes it less likely that peeling, burr, or the like of the first upper surface electrode layer 14 will occur.

Since the substrate 11 is provided with a pair of substantially U-shaped side surface electrodes 20 electrically connected to at least the first upper surface electrode layer 14 and the adhesion layer 16 on the edge of the substrate 11, the upper surface electrode is formed. The 12 and the side electrode 20 are electrically connected in a stable state, which has the effect of providing a highly reliable resistor.

Further, since the second thin film 22 electrically connected to the first thin film 21 is made of a Cu-based alloy thin film, the additive metal and the first thin film 21 which form the Cu-based alloy thin film are formed. The constituent metal forms a solid solution at the interface between the first thin film 21 and the second thin film 22, thereby improving the adhesion between the first thin film 21 and the second thin film 22. It has the action.

Furthermore, since the second thin film 22 constituting the side surface electrode 20 is made of a Cu-Ni alloy thin film containing Cu in an amount of 1.6 wt% or more, the Ni of the Cu-Ni alloy thin film is formed. The components and the constituent metals of the first thin film 21 form a solid solution at all rates, which has the effect of improving the adhesion between the first thin film 21 and the second thin film 22.

The first thin film 2 which constitutes the side electrode 20
Since the first and second thin films 22 are formed in a substantially L-shape from the back surface to the side surface of the substrate 11, when the first thin film 21 and the second thin film 22 are formed by the thin film technique, the substrate 1
It can be easily formed from only the rear surface side of the substrate 1 toward the upper surface side of the substrate 11, which has the effect of improving the productivity.

[0093]

As described above, according to the resistor of the present invention, the pair of upper surface electrodes formed on the one main surface of the substrate is provided with at least a part of the first upper surface electrode layer and the first upper surface electrode layer. Since it has a multi-layer structure of a second upper surface electrode layer provided so as to overlap with each other and an adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer, a multi-sheet sheet shape When manufacturing a resistor with the substrate of, in the resistance value measurement at the time of trimming to correct the resistance value between the pair of upper surface electrodes,
Due to the presence of the first upper electrode layer, the meter can be brought into contact with the second upper electrode layer of the adjacent resistor in addition to the second upper electrode layer in question, and a particularly small resistor is manufactured. It will be advantageous in above. Further, when the side surface electrode is formed on the edge of the substrate, when the side surface electrode is formed by the thin film technique, the side surface electrode and the side surface electrode are formed due to the presence of the adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer. The connection area with the upper surface electrode can be increased, which has the effect of improving the electrical connection reliability between the upper surface electrode and the side surface electrode.

[Brief description of drawings]

FIG. 1 is a sectional view of a resistor according to an embodiment of the present invention.

FIG. 2 is a top view of the same resistor without side electrodes.

FIG. 3 is a top view showing a state in which an unnecessary region portion is formed at an end portion of the entire circumference of a sheet-shaped substrate used for manufacturing the same resistor.

4A and 4B are cross-sectional views showing a manufacturing process of the same resistor.

5A and 5B are plan views showing a manufacturing process of the same resistor.

6A and 6B are cross-sectional views showing a manufacturing process of the same resistor.

7A and 7B are plan views showing a manufacturing process of the same resistor.

8A and 8B are cross-sectional views showing a manufacturing process of the same resistor.

9A and 9B are plan views showing a manufacturing process of the same resistor.

10A and 10B are cross-sectional views showing a manufacturing process of the same resistor.

11A and 11B are plan views showing manufacturing steps of the same resistor.

12A and 12B are cross-sectional views showing a manufacturing process of the same resistor.

13A and 13B are plan views showing a manufacturing process of the same resistor.

FIG. 14 is a sectional view showing a manufacturing process of the same resistor.

FIG. 15 is a plan view showing a manufacturing process of the same resistor.

16 (a) and 16 (b) are sectional views showing a manufacturing process of the same resistor.

17A and 17B are plan views showing a manufacturing process of the same resistor.

18 (a) and 18 (b) are sectional views showing a manufacturing process of the same resistor.

19 (a) and 19 (b) are plan views showing a manufacturing process of the same resistor.

FIG. 20: Cu-Ni forming the second thin film of the same resistor
Equilibrium diagram of alloy thin film

FIG. 21 is a SIM of the first thin film and the second thin film of the same resistor.
Explanatory drawing of composition analysis result by S

FIG. 22 is a diagram showing a test method for explaining characteristics (a) and (b).

FIG. 23 is a top view showing a state in which an unnecessary region portion is formed at one end portion of a sheet-shaped substrate used for manufacturing the same resistor.

FIG. 24 is a top view showing a state where unnecessary regions are formed at both ends of a sheet-shaped substrate used for manufacturing the same resistor.

FIG. 25 is a top view showing a state in which unnecessary area portions are formed at three end portions of a sheet-shaped substrate used for manufacturing the same resistor.

FIG. 26 is a sectional view of a conventional resistor.

[Explanation of symbols]

11 board 12 Top electrode 13 resistor 14 First upper electrode layer 15 Second upper electrode layer 16 Adhesion layer 17 First protective layer 18 Trimming groove 19 Second protective layer 20 Side electrode 21 First thin film 22 Second thin film 23 First plating film 24 Second plating film 31 sheet-like substrate 31a, 31d to 31f unnecessary area portion 31b Strip substrate 31c piece-shaped substrate 32 First Top Electrode Layer 33 Second upper electrode layer 34 resistor 35 First Protective Layer 36 Trimming groove 37 Adhesion layer 38 Second protective layer 39 First division 40 side electrode 41 First thin film 42 Second thin film 43 Second division 44 First plating film 45 Second plating film

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masato Hashimoto             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hiroyuki Saikawa             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Tsutomu Nakanishi             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5E032 BA03 BB01 CA01 CB01 CC03                       TA13 TB02                 5E033 AA02 BA01 BB02 BC01 BD01                       BE01 BE04 BH01

Claims (21)

[Claims] 1. A substrate, a pair of upper surface electrodes formed on one main surface of the substrate, a resistor provided so as to be electrically connected to the pair of upper surface electrodes, and at least covering the resistor. A pair of upper surface electrodes, a first upper surface electrode layer, and a second upper surface electrode layer provided so as to at least partially overlap with the first upper surface electrode layer. A resistor having a multi-layer structure of an adhesion layer overlapping the first upper surface electrode layer and the second upper surface electrode layer. 2. The resistor according to claim 1, wherein the second upper surface electrode layer is provided inside an edge of the upper surface of the substrate. 3. The resistor according to claim 1, wherein the first upper surface electrode layer and the adhesion layer forming the upper surface electrode are flush with each other at the edge of the substrate. 4. A first upper surface electrode layer constituting an upper surface electrode,
The resistor according to claim 1, wherein only the second upper surface electrode layer of the second upper surface electrode layer and the adhesion layer is electrically connected to the resistor. 5. A first upper surface electrode layer forming an upper surface electrode,
The resistance according to claim 1, wherein the maximum height of the second upper surface electrode layer and the adhesion layer in the thickness direction of the adhesion layer is higher than the maximum height of the first upper surface electrode layer in the thickness direction. vessel. 6. The resistor according to claim 1, further comprising a pair of substantially U-shaped side electrodes electrically connected to at least the first upper surface electrode layer and the adhesion layer on the edge of the substrate. 7. A first thin film, wherein the side electrode is located on the edge side of the substrate and is made of any one of a Cr thin film, a Ti thin film, a Cr-based alloy thin film, and a Ti-based alloy thin film, which has good adhesion to the substrate. A second thin film made of a Cu-based alloy thin film electrically connected to the first thin film, a first plating film made of nickel plating covering at least the second thin film, and at least the first thin film. 7. The resistor according to claim 6, which has a multi-layer structure of a second plating film which covers the plating film. 8. The second thin film forming the side surface electrode is made of Cu.
The resistor according to claim 7, which is composed of a Cu-Ni alloy thin film containing Ni in an amount of 1.6% by weight or more. 9. The resistor according to claim 7, wherein the first thin film and the second thin film forming the side surface electrode are formed in a substantially L shape from the back surface to the side surface of the substrate. 10. A plurality of pairs of first members are formed on the upper surface of a sheet-shaped substrate.
Providing a plurality of pairs of second top surface electrode layers, a plurality of pairs of second top surface electrode layers electrically connected to the plurality of pairs of first top surface electrode layers, and the plurality of pairs of second top surface electrode layers. A plurality of resistors electrically connected to the plurality of resistors, a plurality of protective layers covering at least the plurality of resistors, and a plurality of pairs of the second upper surface electrodes of the plurality of resistors. Trimming to correct the resistance value between the layers; providing a plurality of pairs of adhesion layers so as to overlap the plurality of pairs of the first upper surface electrode layer and the second upper surface electrode layer; A first slit-shaped substrate for separating the plurality of pairs of the first upper surface electrode layers, the second upper surface electrode layers, and the plurality of pairs of adhesion layers into a plurality of strip-shaped substrates on the substrate.
And a plurality of strip-shaped substrates in the sheet-shaped substrate, the first slit-shaped substrate is formed so that the resistors are individually separated and divided into individual substrates. And a step of forming a plurality of second divided parts in a direction orthogonal to the divided parts. 11. The method of manufacturing a resistor according to claim 10, wherein the plurality of slit-shaped first divided portions are formed by dicing. 12. The method of manufacturing a resistor according to claim 10, wherein the plurality of second divided portions are formed by dicing. 13. The method of manufacturing a resistor according to claim 10, wherein a plurality of second divided portions are formed by a laser and then the second divided portions are divided into individual substrates. . 14. A sheet-shaped substrate is formed with an unnecessary area portion at an end portion thereof, and a plurality of slit-shaped first divided portions are configured such that a plurality of strip-shaped substrates are connected to the unnecessary area portion. The method for manufacturing a resistor according to claim 10, wherein the resistor is formed on a sheet-shaped substrate. 15. A plurality of pairs of first members are formed on the upper surface of a sheet-like substrate.
Providing a plurality of pairs of second top surface electrode layers, a plurality of pairs of second top surface electrode layers electrically connected to the plurality of pairs of first top surface electrode layers, and the plurality of pairs of second top surface electrode layers. A step of providing a plurality of resistors electrically connected to the plurality of resistors, and a plurality of first glass-based main components so as to cover the plurality of resistors.
A protective layer, a trimming process for correcting the resistance value between the plurality of pairs of second upper surface electrode layers in the plurality of resistors, a plurality of pairs of the first upper surface electrode layers and the plurality of pairs of first upper surface electrode layers. The step of providing a plurality of pairs of adhesion layers so as to overlap the second upper surface electrode layer, and a plurality of second protective layers made of a resin layer so as to cover at least the plurality of first protective layers containing glass as a main component. The step of providing and slit-shaped first for separating the plurality of pairs of the first upper surface electrode layer, the second upper surface electrode layer and the adhesion layer into a plurality of strip-shaped substrates on the sheet-shaped substrate Forming a plurality of divided parts of
A plurality of strip-shaped substrates in the sheet-shaped substrate are divided into a plurality of strip-shaped substrates in a direction orthogonal to the slit-shaped first dividing portion so that the resistors are individually separated and divided into individual substrates. And a step of forming a second divided portion. 16. A plurality of pairs of first upper surface electrode layers and second pairs.
A step of providing a plurality of pairs of adhesion layers made of a conductive resin so as to overlap the upper surface electrode layer, a step of providing a plurality of first protective layers containing glass as a main component so as to cover a plurality of resistors, 16. The method of manufacturing a resistor according to claim 15, wherein the trimming is performed to correct the resistance value between the plurality of pairs of second upper surface electrode layers in the plurality of resistors, and the trimming step is performed. 17. A plurality of pairs of first upper surface electrode layers and second pairs.
A step of providing a plurality of pairs of adhesion layers made of a conductive resin so as to overlap the upper surface electrode layer, a step of providing a plurality of first protective layers containing glass as a main component so as to cover a plurality of resistors, A step of trimming in order to correct the resistance value between a plurality of pairs of second upper surface electrode layers in a plurality of resistors, and a resin layer so as to cover at least the plurality of first protective layers containing glass as a main component. 16. The method of manufacturing a resistor according to claim 15, wherein the method is performed after performing the step of providing a plurality of second protective layers. 18. The method of manufacturing a resistor according to claim 15, wherein the plurality of slit-shaped first divided portions are formed by dicing. 19. The method of manufacturing a resistor according to claim 15, wherein the plurality of second divided portions are formed by dicing. 20. The method of manufacturing a resistor according to claim 15, wherein a plurality of second divided portions are formed by a laser, and thereafter, the second divided portions are divided into individual substrates. 21. An unnecessary area portion is formed at an end portion of a sheet-shaped substrate, and a plurality of slit-shaped first divided portions are arranged so that a plurality of strip-shaped substrates are connected to the unnecessary area portion. The method of manufacturing a resistor according to claim 15, wherein the resistor is formed on a sheet-shaped substrate.