JP2003174139A - Semiconductor module - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To eliminate the need to create a dedicated support jig for each product of a semiconductor module including a memory module, and to eliminate the need to attach the dedicated support jig, thereby realizing a cost reduction of the product. A semiconductor module is provided. Kind Code: A1 A memory module equipped with a TCP, comprising: a plurality of semiconductor packages;
, A module substrate 3, a protective case 4, and supporting electronic components 5, and the supporting electronic components 5 are mounted on the module substrate 3 in the same manner as the semiconductor package 1 and the regular electronic components 2. In order to protect the semiconductor package 1 and the legitimate electronic component 2 due to the deformation of the protective case 4, the electronic component supports the protective case 4, and includes a power supply and a power supply on the module substrate 3 forming a predetermined circuit of the memory module. A chip capacitor, a chip resistor, a small IC, and the like that are not electrically connected to the regular wiring and are the same as the regular electronic component 2 are used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor module, and more particularly to a TCP (Tape Carrier Pac).
Kage), CSP (Chip Size Packa)
ge) is applied to a memory module having a memory package mounted on a module substrate.

[0002]

2. Description of the Related Art As a technique studied by the present inventor, the following technique can be considered for a memory module.

For example, using TCP stack technology, D
There is a method in which a memory such as a RAM has a laminated structure and is mounted on a module substrate to realize double the memory mounting density in the same occupied area. In this method, the memory chip mounted on the polyimide tape is exposed, so protect the memory chip on the memory module with a metal protective case that utilizes the elastic force of the metal. There is.

As a technique relating to such a memory module, for example, "Electronics Packaging Encyclopedia" P545-P5, published by Industrial Research Institute Co., Ltd., July 28, 2000, edited by Japan Institute of Electronics Packaging.
47 and the like.

[0005]

By the way, as a result of the present inventor's examination of the memory module as described above, the following has been clarified.

For example, in the memory module as described above, since the protective case for protecting the memory chip is thin, the protective case is supported so that the memory chip does not bend even if force is applied to the case. You need to use a jig. For example, as shown in FIG. 8, the support jig 31 is made of plastic or the like, and is arranged on the module substrate 3 together with the semiconductor package 1 and the regular electronic component 2.

In such a memory module, a plastic support jig is formed for each memory module product in order to support the protective case, resulting in an increase in cost. That is, it is necessary to create a dedicated support jig for each product in accordance with the arrangement of the memory and electronic components mounted on the module substrate. Further, in the manufacturing process of the memory module, the work of attaching the supporting jig occurs, which leads to an increase in the work time.

Therefore, the inventor of the present invention contemplates diverting the chip parts mounted on the memory module in order to give versatility to the supporting jig that is specially prepared for each memory module product. It was That is, the specific chip component does not have a circuit-like function but merely functions as a supporting jig.

Therefore, an object of the present invention is to reduce the cost of the product by eliminating the need to create a dedicated supporting jig for each product of the semiconductor module including the memory module and the installation of the dedicated supporting jig. It is intended to provide a semiconductor module capable of realizing the above.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

In order to achieve the above object, the present invention realizes a supporting jig for a protective case by using electronic parts (chip capacitor, chip resistor, etc.). In other words, the module board is provided with pads for mounting electronic components that are not connected to the power supply and regular wiring, and when mounting a semiconductor package or regular electronic components there, the electronic components for supporting the protective case are also mounted. Then, it is possible to solder-connect and support the protective case with the electronic parts.

That is, a semiconductor module according to the present invention includes a plurality of semiconductor packages, a module board on which the semiconductor packages are mounted, a protective case for protecting the plurality of semiconductor packages mounted on the module board, The module is mounted on the module substrate in the same manner as the semiconductor package and has a supporting electronic component for supporting the protective case.

Further, in the above semiconductor module,
The supporting electronic component is the same component as a regular electronic component mounted on the module substrate. The supporting electronic component is a chip component and is electrically disconnected from the power source and regular wiring on the module substrate.

Further, in the semiconductor module, the semiconductor package is applied to a memory package.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In all the drawings for explaining the embodiments, members having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

(First Embodiment) FIG. 1 is a plan view showing a semiconductor module according to a first embodiment of the present invention, and FIG. 2 is a plan view showing a state in which a protective case is removed in the semiconductor module according to the present embodiment, FIG. 3 is a sectional view showing a main part of a semiconductor module, FIG. 4 is a sectional view showing a semiconductor package,
FIG. 5 is a flowchart showing a method for manufacturing a semiconductor module and a semiconductor package mounted on the semiconductor module.

First, an example of the configuration of the semiconductor module according to the first embodiment of the present invention will be described with reference to FIGS.

The semiconductor module of this embodiment is, for example, a memory module equipped with TCP, and is a module for mounting a plurality of semiconductor packages 1, regular electronic components 2, semiconductor package 1, regular electronic components 2, and the like. The board 3, the protective case 4 for protecting the semiconductor package 1 and the legitimate electronic component 2 mounted on the module board 3, and the semiconductor package 1 and the legitimate electronic component 2 on the module board 3 are the same. Is mounted on the module board 3 and is connected to the outside through the external terminals 6 on the module substrate 3.

The semiconductor package 1 is composed of a TCP of a memory such as a DRAM, and a plurality of semiconductor packages 1 are mounted on the front surface and the back surface of the module substrate 3. Here, four semiconductor packages 1 are provided on each of the front surface and the back surface of the module substrate 3.
An example of implementing is shown.

This semiconductor package 1 is shown in FIG.
As an example, the chip 12 on which a predetermined circuit is formed and the bumps 11 are arranged on the surface, and the chip 12
A plurality of inner leads 13 connected to the bumps 11 of
And a tape-shaped substrate 15 including a plurality of outer leads 14 connected to the inner leads 13 and serving as external terminals,
Surface of chip 12 and bumps 11 of this chip 12
And a resin encapsulant 16 for encapsulating a connecting portion of the tape-shaped substrate 15 with the inner leads 13 and the like. Here, an example in which the chip 12 having the center pad structure is mounted as a face-down type is shown, but the chip having a peripheral pad structure, a face-up type mounting, and the like are also applicable.

The regular electronic component 2 is the semiconductor package 1
Together with electronic components that form a predetermined circuit of the memory module, such as chip capacitors, chip resistors,
Includes small ICs. Here, as the legitimate electronic component 2, one is attached to the external terminal side of the central portion of the module substrate 3.
An example in which individual chip capacitors are mounted is shown.

The module substrate 3 has a substantially rectangular planar shape, and a plurality of semiconductor packages 1 are arranged on the front surface and the back surface side by side in the long side direction, and a plurality of semiconductor packages 1 are arranged on the front surface and the back surface of one of the long sides. The external terminal 6 is arranged.
This module substrate 3 is, for example, a multilayer wiring layer substrate, the insulating base material is formed of an epoxy resin, the wiring layer is formed of a metal thin film such as a copper foil, and the front and back wiring layers are formed of a polyimide resin or the like for protection. Insulation coating material is applied.

The protective case 4 has a substantially U-shaped cross section, is mounted from the side of the module substrate 3 opposite to the side on which the external terminals 6 are arranged, and is mounted on the module substrate 3. 1. The structure is such that the legitimate electronic component 2 and the like are covered. The protective case 4 is made of, for example, metal such as steel utilizing the elastic force of metal.

The supporting electronic component 5 is an electronic component that supports the protective case 4 in order to protect the semiconductor package 1, the legitimate electronic component 2 and the like due to the deformation of the protective case 4, and a predetermined circuit of the memory module. It is not electrically connected to the power supply and the regular wiring on the module substrate 3 to be formed, and is made of the same electronic component as the regular electronic component 2, and for example, a chip capacitor, a chip resistor, a small IC, etc. are used. Here, as the supporting electronic component 5, an example is shown in which five chip capacitors are mounted between the semiconductor packages 1 except for the external terminal side of the central portion of the module substrate 3.

In the memory module configured as described above, the electronic component 5 similar to the regular electronic component 2 is used as a support jig for the protective case 4, and therefore, the electronic components not connected to the power source and the regular wiring are used. A pad for mounting a component is provided on the module substrate 3, and the semiconductor package 1 is placed there.
By mounting the supporting electronic component 5 and soldering together when the regular electronic component 2 is mounted, the electronic component 5
It is possible to support the protective case 4 with.

Next, an example of a method of manufacturing the semiconductor module of this embodiment and the semiconductor package mounted on this semiconductor module will be described with reference to FIG.

(1) Preparation Step (Step S1) In this step, the semiconductor package 1, the legitimate electronic component 2, the module substrate 3, the protective case 4, the supporting electronic component 5 and the like are prepared. The TCP used as the semiconductor package 1 includes, for example, chip bumping (step S101) and inner lead bonding (step S101).
102), sealing material application (step S103), tape cutting (step S104), burn-in (step S10).
5), electrical characteristic test (step S106), outer shape cutting (step S107), visual inspection (step S10)
8), etc. that have been completed through the respective steps are used for mounting on the memory module.

(2) Solder application (back surface) process (step S
2) In this step, solder paste is applied to the pads on the back surface of the module substrate 3 with a printing machine.

(3) Component Mounting Step (Step S3) In this step, the supporting electronic component 5 is mounted together with the semiconductor package 1 and the regular electronic component 2 on the back surface of the module substrate 3.

(4) Soldering Step (Step S4) In this step, the pads of the module substrate 3 are connected to the mounted semiconductor package 1, the legitimate electronic component 2, and the terminals of the supporting electronic component 5. In this step, when the terminals have a tape structure like TCP of the semiconductor package 1, the solder paste is melted and bonded by pressure bonding,
In the case of a lead structure, a method of heating by reflow to melt the solder paste and soldering is used.

(5) Solder application (front surface) process (step S
5), component mounting step (step S6), soldering step (step S7) In these steps, the solder is applied to the front surface in the same manner as the solder application to the back surface of the module substrate 3, the component mounting, and the soldering. Apply, mount components, and solder.

(6) Appearance inspection step (step S8) In this step, the mounting state of the components on the back and front surfaces of the module substrate 3 and the connection state between the pads on the module substrate 3 after the soldering step and the terminals of the mounted components are checked. Inspect,
Check if there is a bad connection. Here, the products which are confirmed to be non-defective products proceed to the subsequent steps, and those which are not non-defective products are removed as defective products.

(7) Electrical characteristic test process (step S
9) In this process, a DC test such as an open / short test between external terminals, a leak current test, and a power supply current (during operation and standby) measurement is performed on a product that is confirmed to be non-defective by a visual inspection. A function test such as a write / read operation for a memory circuit is performed using a predetermined test pattern, and a function test such as measurement of a timing margin is performed. Here, the products which are confirmed to be non-defective products proceed to the subsequent steps, and those which are not non-defective products are removed as defective products.

(8) Case mounting step (step S10) In this step, the semiconductor package 1 mounted on the module substrate 3, the legitimate electronic component 2 and The electronic case 5 for support is covered, and the protective case 4 is attached so that the external terminals 6 are exposed.

(9) Product Display Step (Step S11) In this step, the product name, lot number, etc. of this memory module are printed on the memory module in which the protective case 4 is mounted.

(10) Shipment Inspection Step (Step S12) In this step, final inspection is performed before shipping the memory module whose product display is completed. As a result, the memory module confirmed to be non-defective can be shipped as a product.

Therefore, according to the memory module of the present embodiment, by using the supporting electronic component 5 for supporting the protective case 4, the supporting electronic component 5 supports the protective case 4. , Even if the protective case 4 is bent, the semiconductor package 1 and the legitimate electronic component 2
You can prevent it from damaging. Also,
Since the supporting electronic component 5 is not electrically connected to the power source and the regular wiring on the module substrate 3, even if the protective case 4 hits between the terminals of the supporting electronic component 5, a short circuit occurs. Absent.

As a result, it is not necessary to create a dedicated support jig for each memory module product, and it is not necessary to attach this dedicated support jig, so that the manufacturing cost can be reduced. That is, the TCP stack technology is the largest high-density mounting technology at the present time,
The protective case 4 and this supporting jig are required, and the cost increase of the member is the biggest demerit, but by reducing the supporting jig as in the present embodiment,
Product cost reduction can be realized and competitiveness is further improved.

(Second Embodiment) FIG. 6 is a sectional view showing a main part of a semiconductor module according to a second embodiment of the present invention, and FIG. 7 is a sectional view showing a semiconductor package.

The semiconductor module of this embodiment is, for example, a memory module having a CSP mounted thereon, and the difference from the first embodiment is that the semiconductor package mounted on the module substrate is changed from TCP to CSP. Is.

That is, the semiconductor module of the present embodiment has a plurality of semiconductor packages 1a, regular electronic components 2, and semiconductor package 1 as shown in FIG.
a and a legitimate electronic component 2 and the like, a module board 3, a protective case 4 for protecting the semiconductor package 1a and the legitimate electronic component 2 and the like mounted on the module substrate 3, and a module substrate 3 A supporting electronic component 5 mounted in the same manner as the semiconductor package 1a and the regular electronic component 2 for supporting the protective case 4.
Etc.

The semiconductor packages 1a are composed of CSPs for memories such as DRAMs, and a plurality of them are mounted on the front and back surfaces of the module substrate 3. This semiconductor package 1a has a chip 2 on which a predetermined circuit is formed and a pad 21 is arranged on the surface, as shown in an example in FIG.
2, a plurality of leads 23 connected to the pads 21 of the chip 22, and a tape-shaped substrate 25 including a plurality of solder balls 24 connected to the leads 23 and serving as external terminals,
Surface of chip 22 and pad 21 of this chip 22
And a resin encapsulant 26 for encapsulating a connection portion between the tape-shaped substrate 25 and the lead 23, and an elastomer 27 for absorbing displacement.
Etc. Here, an example of arranging the external terminals in a Fan-in type is shown by taking the chip 22 having a center pad structure as an example, but a chip having a peripheral pad structure, a Fan-out type, a Fan-in / out type arrangement, etc. Is also applicable.

Since the legitimate electronic component 2, the protective case 4, the supporting electronic component 5 and the like are the same as those in the first embodiment, detailed description thereof will be omitted here. Further, regarding the module substrate 3, although wiring routing and the like are slightly different because the semiconductor package 1a is replaced with a CSP,
The structure and the like are the same as those in the first embodiment.

Therefore, according to the memory module of the present embodiment, even when the semiconductor package is changed from TCP to CSP, by using the supporting electronic component 5 for supporting the protective case 4, the above-mentioned embodiment is realized. As in the first embodiment, it is not necessary to create a dedicated support jig for each memory module product, and it is not necessary to attach this dedicated support jig, so the manufacturing cost can be reduced. As a result, the cost of the product can be reduced and the competitiveness is further improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, in the above embodiment, T
Although the case where the present invention is applied to the memory module having the CP and CSP is described, the present invention can be applied to the logic, the processor, etc., and is particularly applicable to a wide range of semiconductor modules with a protective case.

As the supporting electronic parts for supporting the protective case, in addition to chip parts such as a chip capacitor and a chip resistor, a small I package such as a plastic package is used.
It is also possible to use other components such as C that can be mounted on the semiconductor module.

Further, it is preferable that the supporting electronic component is not electrically connected to the power source and the regular wiring. For example, if the electronic component itself is a non-conductive component, the power source and the regular wiring. It may be connected to the wiring.

Further, it is possible to use not only a regular electronic component as a component for forming a predetermined circuit of the memory module but also a support for supporting the protective case. In this case, the number of components mounted on the module board can be reduced.

[0051]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1) By using the same electronic component as the regular electronic component mounted on the module substrate as a supporting electronic component for supporting the protective case, a dedicated supporting jig is provided for each semiconductor module product. Since it is not necessary to create the device, it is possible to reduce the manufacturing cost.

(2) According to the above (1), it is not necessary to attach a dedicated supporting jig, so that it is possible to further reduce the manufacturing cost.

(3) Due to the above (1) and (2), it is possible to realize cost reduction of a semiconductor module including a memory module and the like.

[Brief description of drawings]

FIG. 1 is a plan view showing a semiconductor module according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the semiconductor module according to the first embodiment of the present invention with a protective case removed.

FIG. 3 is a sectional view showing a main part of the semiconductor module according to the first embodiment of the present invention.

FIG. 4 is a sectional view showing a semiconductor package in the semiconductor module of the first embodiment of the present invention.

FIG. 5 is a flowchart showing a method of manufacturing a semiconductor module and a semiconductor package mounted on the semiconductor module according to the first embodiment of the present invention.

FIG. 6 is a sectional view showing a main part of a semiconductor module according to a second embodiment of the present invention.

FIG. 7 is a sectional view showing a semiconductor package in a semiconductor module according to a second embodiment of the present invention.

FIG. 8 is a plan view showing a state in which a protective case is removed in the semiconductor module which is the premise of the present invention.

[Explanation of symbols]

1,1a Semiconductor package 2 Regular electronic components 3 module board 4 protective case 5 Electronic components for support 6 external terminals 11 bumps 12 chips 13 Inner lead 14 Outer leads 15 Tape substrate 16 Resin sealing material 21 pads 22 chips 23 Lead 24 solder balls 25 tape substrate 26 Resin encapsulant 27 Elastomer 31 Support jig

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Jun Nakamura             1 Hitachi-1 Yokote-cho, Takasaki-shi, Gunma East Hitachi             Within Semiconductor Corporation (72) Inventor Asahiko Sato             1 Hitachi-1 Yokote-cho, Takasaki-shi, Gunma East Hitachi             Within Semiconductor Corporation (72) Inventor Toshio Miyazawa             1 Hitachi-1 Yokote-cho, Takasaki-shi, Gunma East Hitachi             Within Semiconductor Corporation

Claims (5)

[Claims] 1. A plurality of semiconductor packages, a module board on which the plurality of semiconductor packages are mounted, a protective case for protecting the plurality of semiconductor packages mounted on the module board, and a module case on the module board. A semiconductor module, which is mounted in the same manner as the plurality of semiconductor packages, and has a supporting electronic component for supporting the protective case. 2. The semiconductor module according to claim 1, wherein the supporting electronic component is the same component as a regular electronic component mounted on the module substrate. 3. The semiconductor module according to claim 2, wherein the supporting electronic component is a chip component. 4. The semiconductor module according to claim 2, wherein the supporting electronic component is not electrically connected to a power source and regular wiring on the module substrate. 5. The semiconductor module according to claim 1, wherein the semiconductor package is a memory package.