JP2003159447A - Ball plate device of game machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To resolve the problem of a poor workability due to difficult wiring because a lead line is wired within a ball plate unit to pull out the lead line to the other side of the ball plate device by selecting a place that has no metallic substrate when the electrical part is integrally incorporated with the ball plate unit to the ball plate device wherein installed the ball plate unit is installed on the front side of a resin substrate made of a synthetic resin and a metallic substrate is superposed on the rear side of the resin substrate. <P>SOLUTION: In the ball plate device 5A of a game machine having a resin substrate 6 and provided with a ball plate unit 7 and an electrical member 8 such as a light emitting diode on the front face, a metallic substrate 9 is superposed on the resin substrate 6, and through holes 6w and 9w for wiring for the electrical member 8 are made in the same positions of the resin substrate 6 and the metallic substrate 9. The through hole 9w of the metallic substrate 9 for wiring is made to be larger than the through hole 6w of the resin substrate 6 for wiring. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball tray device installed on the front of a game machine such as a pachinko machine. 2. Description of the Related Art Conventionally, there is a ball tray unit in which a ball tray unit is installed on the front side of a resin substrate made of synthetic resin, and a metal substrate is superposed and arranged on the back side of the resin substrate (for example, Japanese Unexamined Patent Publication No. 9-117553, FIG. 9). On the other hand, for example, in a gaming machine compatible with a prepaid card, a ball tray device in which an electric component such as a 7-segment LED is incorporated in the ball tray unit and a lead wire for wiring is drawn out to the back side of a resin substrate is employed. . [0003] Conventionally, when an electric component is integrated with a ball tray unit in a ball tray device in which a metal substrate is superposed and arranged on the back side of a resin substrate, lead wires of the electric component are wired in the ball tray unit. Then, a place where there is no metal substrate is selected, and the lead wire is drawn out to the back side of the ball tray device. [0004] If the lead wire is wired in the ball tray unit and pulled out to the back side of the ball tray device as described above, there is a problem that the wiring is troublesome and the workability is poor. Was. On the other hand, if the metal substrate is provided with a through hole for wiring so that the lead wire passes through the lead wire, the sharp edge of the through hole may damage the lead wire. There is a problem that there is a risk of cutting. SUMMARY OF THE INVENTION The present invention has been made in view of the above, and has a game machine including a resin substrate made of synthetic resin and having a ball plate unit and electric components such as light emitting diodes installed on the front surface thereof. In the ball dish apparatus of the machine, a metal substrate is superposed on the resin substrate and wiring holes for the electric parts are respectively opened at the same positions of the resin substrate and the metal substrate. Is set to be larger than a wiring hole of a resin substrate. In the ball dish apparatus of the present invention, since the wiring hole of the metal substrate is set larger than the wiring hole of the resin substrate, the wiring hole of the metal substrate is formed outside the periphery of the wiring hole of the resin substrate. Edge retreats. Therefore, there is no danger of the lead wire or the operator's finger being rubbed against the edge of the metal substrate. Therefore, it is possible to form a through hole for wiring in the metal substrate and draw out the lead wire directly therefrom to the back side of the ball dish apparatus. Become. An embodiment of the present invention will be described below with reference to a pachinko machine which is one of gaming machines. In addition,
FIG. 1 is a perspective view of a ball dish apparatus, FIG. 2 is a partial cross-sectional view of a pachinko machine showing a main part of the ball dish apparatus, FIG.
FIG. 4 is an exploded perspective view of the ball plate unit. As shown in FIG. 3, the pachinko machine P has a rectangular frame-shaped outer frame 1, a front frame 2 attached to the front of the outer frame 1, a window hole 3 opened in the front frame 2. It has a glass door frame 4 for closing the upper half of the window hole 3 and a ball tray device 5A for closing the lower half of the window hole 3. The ball tray device 5A comprises a resin substrate 6 made of synthetic resin and a ball plate unit 7 provided on the front surface of the resin substrate 6.
And an electric component 8 provided inside the ball plate unit 7;
A metal substrate 9 arranged on the back side of the resin substrate 6. The resin substrate 6 serves as a supporting base of the ball plate unit 7, and is mounted on the window hole 3 of the front frame 2 so as to be openable and closable about the left end in FIG. The resin substrate 6 has a speaker opening 10a and pachinko ball openings 10b and 10c.
a, 10b, and 10c so as to surround the guide walls 11a, 11c.
b, 11c are projected from the back side. The pachinko ball opening 10b shown in FIG. 1 constitutes a part of a ball removal route 12 (see FIG. 3) connecting the ball tray unit 7 and the lower ball tray device 5B. Another pachinko ball opening 10c constitutes a part of a prize ball discharge route 14 connecting the mechanism plate 13 (see FIG. 2) and the ball plate unit 7. The ball plate unit 7 is attached to the front of the resin substrate 6 by means of attachment (not shown) such as screws or elastic hook pieces. As shown in FIG. And a cover member 16 for decorating the dish member 15. The plate member 15 is composed of a mounting plate 15a to be attached to the resin substrate 6 and a plate portion 15b for storing pachinko balls, and further integrally has a mounting base portion 15c for the electric component 8, which will be described later. On the other hand, the cover member 16 has a shell shape that completely covers the periphery other than the upper surface of the dish member 15, and as shown in FIG. 2, an upper cover 16a, a bottom cover 16b, and a decorative member interposed therebetween. 16c are integrally joined. The decorative member 16c is made of a transparent (or translucent) synthetic resin, and has a concave-convex surface for light diffusion formed on the entire back surface as a blinding means that does not allow the inside to pass through. Is transparent, and the inside of the cover member 16 is covered by the light diffusing action of the uneven surface. In the decorative member 16c, a window 16d is formed in a part of the blinding means so as to make the inside see-through possible by eliminating the unevenness of the blinding means and making it flat. The electric component 8 is, for example, a display device for displaying the balance of the prepaid card, and includes three 7-segment LEDs 8 on the front of the wiring board 8a as shown in FIG.
The wiring board 8a is mounted on the mounting base 15c of the plate member 15 with screws. In this mounted state, the 7-segment LED 8b of the electric component 8 faces the window 16d of the decorative member 16c. As described above, since the decorative member 16c is made of a transparent or translucent synthetic resin, the 7-segment LED 8b can be seen through the window 16d. In addition, even when the decorative member 16c is translucent and has low visibility, the display can be recognized if the 7-segment LED 8b emits light.
The wiring board 8a is provided with switch means 8d on both sides for inputting a pachinko ball purchase command or the like to the ball rental device 22 described later.
A through hole 16e is formed in the decorative member 16c so that the decorative member 16c faces the outside. The metal substrate 9 is superposed and arranged on the back side of the resin substrate 6 and has a size that almost covers the entire back side of the resin substrate 6. At the upper end of the metal substrate 9, a folded piece 9a that engages with the lower end of the glass door frame 4 to prevent insertion of foreign matter is integrally provided. A notch 9b is provided in the metal substrate 9, and the guide walls 11a, 11b, 11c of the resin substrate 6 enter into the notch 9b. In the resin substrate 6 and the metal substrate 9, wiring holes 6w and 9w for electric components 8 are formed at the same positions. The wiring through holes 6w and 9w are formed by connecting the wiring through hole 9w of the metal substrate 9 to the wiring through hole 6w of the resin substrate 6.
The wiring through hole 6w of the resin substrate 6 is set to be larger.
The edge of the wiring hole 9w of the metal substrate 9 is recessed outside the peripheral edge. A tongue piece 9c is formed by punching a downward U-shaped cut line on the metal substrate 9 with a press, and the tongue piece 9c is bent into a hook shape to lock the lead wire 17a. In the embodiment, the mounting base 15c provided on the plate member 15 is formed in a step shape so that the wiring board 8
a, and a wiring board 8c for a connector is installed on the low place L side, and both wiring boards 8a and 8c are connected to a short lead wire 1.
7b. Further, the wiring board 8c on the low place L side corresponds to the wiring through hole 6w of the resin substrate 6 through the space S for connector, and the wiring through hole 6w has a connector 18a integrated with the wiring board 8c. Faces. The electrical component 8 can be connected to a circuit on the mechanism plate 13 side by connecting a connector 18b that is a pair to the connector 18a from the outside. As described above, a space S for a connector is formed on the back side of the wiring through hole 6w, and a connector 18a is disposed at the back of the space S. If the parts 8 and the circuit on the mechanical plate 13 side are electrically connected, the connector 18 can be used to attach and detach the ball tray device 5A from the pachinko machine P.
b only needs to be inserted and removed, and since there is the space S behind the wiring through hole 6w, there is no problem that the connector 18b from the outside protrudes to the back side of the ball tray device 5A. In addition, reference numeral 20 in FIG. 1 denotes a known automatic ball feeder fixed to the metal substrate 9;
Numeral denotes claw pieces projecting from the resin substrate 6 for locking lead wires.
Reference numeral 22 in FIG. 3 denotes a ball rental device for a prepaid card provided beside the pachinko machine P. Next, the electric component 8 of the ball dish apparatus 5A of the present invention.
Is connected to the circuit on the mechanism plate 13 side. First, the ball tray device 5A is pivotally attached to the lower side of the glass door frame 4 using a known hinge means 19 so as to be openable and closable. Next, the ball tray device 5A is opened, and the lead wire 17a connected to the circuit on the mechanism plate 13 side is engaged with the tongue piece 9c of the metal substrate 9 as shown in FIG. Next, the connector 18b at the end of the lead wire 17a is inserted into the space S from the wiring holes 6w and 9w, and fitted into the connector 18a at the back. In this case, since the edge of the wiring hole 9w of the metal substrate 9 is located at a position retreated outside the periphery of the wiring hole 6w of the resin substrate 6, there is no danger of cutting a finger. In addition, the ball dish device 5
To remove A from the pachinko machine P, the above procedure may be performed in reverse. Although the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment. For example, in the embodiment, the connectors 18a and 18b are passed through the wiring through holes 6w and 9w.
As shown in FIG. 6, the lead wire 17a extends from the wiring through holes 6w and 9w.
May be drawn directly. In FIGS. 5 and 6, parts denoted by the same reference numerals as those in FIGS. 1 and 2 are parts having the same or the same functions as those of the above-described embodiment. The wiring through holes 9w of the metal substrate 9 are shown in FIG.
The shape may be continuous with the notch 9b corresponding to the guide wall 11b (11a, 11c). Further, the electric component 8 is not limited to the 7-segment LED 8b as in the embodiment, but includes all electric-actuated components such as decorative lamps and speakers. In the embodiment, the metal substrate 9 has a single-piece structure. However, the metal substrate 9 may be divided into an appropriate number, such as two or three. In addition, the present invention can be applied to the lower bowl apparatus 5B. According to the ball dish apparatus of the present invention, the wiring holes of the metal substrate are set larger than the wiring holes of the resin substrate.
The edge of the wiring hole of the metal substrate recedes outside the periphery of the wiring hole of the resin substrate. Therefore, there is no danger of the lead wire or the finger of the worker being rubbed against the edge of the metal substrate, so that it is possible to form a through hole for wiring in the metal substrate and draw out the lead wire directly therefrom to the back side of the ball dish apparatus. Thus, the workability of the wiring work of the electric component can be remarkably improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a ball dish device. FIG. 2 is a partial cross-sectional view of a pachinko machine showing a main part of a ball dish device. FIG. 3 is a front view of the pachinko machine. FIG. 4 is an exploded perspective view of a ball tray unit. FIG. 5 is a perspective view of a ball dish device. FIG. 6 is a partial cross-sectional view of a pachinko machine showing a main part of a ball dish device. [Description of Signs] P: Pachinko machine (game machine) 5A: Upper ball tray device 5B: Lower ball tray device 6: Resin board 6w ... Wiring through hole 7: Ball tray unit 8 ... Electrical component 9: Metal substrate 9w ... wiring through hole

Claims (1)

Claims 1. A ball dish device for a game machine including a resin substrate made of a synthetic resin and having a ball tray unit and an electric component such as a light emitting diode installed on a front surface thereof. The boards are superposed and arranged, and the wiring holes for the electric components are respectively opened at the same positions of the resin substrate and the metal substrate, and the wiring holes of the metal substrate are set to be larger than the wiring holes of the resin substrate. A ball tray device for a gaming machine, comprising: