JP2003152310A - Method, mechanism, and device for parting printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield of a circuit board parted from a circuit board of multiple allocation by reducing stress applied to electronic parts mounted on a printed board having lug sections near a parted position of the printed board. SOLUTION: After parting grooves 3 are formed at the printed board 2 by using a pre-parting machine (pre-parting section) 20 and a parting and removing section 30, lug sections 2b at both end sections of the printed board 2 are removed by parting. The pre-parting machine 20 has a pair of left and right disk cutters 23 positioned at the parted positions of the printed board 2 and a pre-parting stage 21 which supports the board 2 at the inside of the board 2 more inner than the parted positions and forms the parting grooves 3 at the parted positions of the board 2. The parting and removing section 30 is provided with a parting machine 35 having a press-cutter 124 which removes the lug sections 2b of the board 2 by parting at the parted positions of the board 2 and a stage 33 which supports the board 2 at the inside of the board 2 more inner than the parted positions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a printed circuit board, a mechanism for cutting the printed circuit board, and a device for cutting the printed circuit board. Specifically, the present invention relates to a cutting method suitable for cutting and removing so-called ears located at both ends of a printed circuit board, a cutting mechanism and a cutting device for the cutting method.

[0002]

2. Description of the Related Art A circuit board on which electronic components 2b such as transistors, resistors and capacitors are mounted is often manufactured by dividing one printed board (mother board) 2 into a plurality of pieces. FIG. 6 is a plan view showing an example of the printed circuit board 2, and the printed circuit board 2 includes three circuit board regions 2a. The printed circuit board 2 is made of an epoxy resin such as an epoxy substrate or a glass epoxy substrate, and its left and right ends (in the illustrated example,
A so-called ear portion 2b is provided in the long axis direction of the substrate 2.
The ear portion 2b is provided on the substrate 2 when the electronic component 2b is mounted, for example.
Is used for holding, and in the final step, it is divided and removed at the broken line position a in FIG.

An automatic cutting device 100 as shown in FIG. 7, for example, is used for this cutting. The automatic cutting device 10
Reference numeral 0 designates a charging palletizer 110 accommodating a plurality of printed circuit boards 2, a separation / removal section 120 for cutting off the ears 2b of the printed circuit board 2 to divide the circuit boards into two, and a board extraction section 130 for taking out the separated circuit boards. , Input palletizer 110
The take-out robot 140 that conveys the printed circuit board 2 from the separation removal unit 120 and the board removal unit 1 from the separation removal unit 120
And a substrate transfer robot 150 for transferring to 30.

The severing / removing section 120 comprises a substrate reversing machine 121 for rotating the conveyed printed circuit board 2 by 90 degrees, and a severing machine 122 for severing and cutting the ears 2b of the printed circuit board 2 and dividing the circuit board into circuit boards. . The cutting machine 122 is, as shown in FIG. 8, a cutting stage 1 for setting the printed circuit board 2.
23, a cylinder 125 that moves up and down by a drive device (not shown), a pair of left and right press cutters 124 that moves up and down in conjunction with the cylinder 125, and a press cutter (not shown) that divides each circuit board. That is, the separation removing unit 120 is the ear 2 of the printed circuit board 2.
It has both a dividing / removing portion for removing b and a dividing portion for separating each circuit board region 2a and dividing it into circuit boards, and can remove the ears 2b and divide into circuit boards at the same time with one press cut. . The dividing stage 123 reciprocates between the substrate reversing machine 121 and the dividing machine 122 along the guide 126. The dividing stage 123 supports the ears (both ends) 2b of the printed circuit board 2, and the ears 2b of the printed circuit board 2 have a substantially concave shape protruding to the left and right sides of the dividing stage 123. In addition, three circuit board supporting portions 127 are provided in the major axis direction to hold each of the divided circuit boards.

When the input palletizer 110 is set at a predetermined position, the take-out robot 140 takes out the printed circuit board 2 from the input palletizer 110 and conveys it to the substrate reversing machine 121. In the input palletizer 110, the printed circuit board 2 is stored with its major axis direction being the vertical direction.
It is conveyed to the substrate reversing machine 121 in that posture. The substrate reversing machine 121 rotates the substrate 22 by 90 degrees so that the conveyed substrate 2 becomes horizontal. Then, the take-out robot 140 again.
Transports the horizontal printed circuit board 2 and transfers it to the dividing stage 123 on the substrate reversing machine 121 side. Then, the cutting stage 123 moves to the cutting machine 122 side. When the cutting machine 122 detects that the cutting stage 123 is set, the driving device drives the cylinder 125 to lower the press cutter 124, presses the printed circuit board 2, and cuts off the ears 2b. At the same time, the printed circuit board 2 on the dividing stage 123 is divided into circuit board regions 2a and divided into three circuit boards. After that, the dividing stage 123 returns to the original position (the substrate reversing machine 121
Returning to (side), the board transfer robot 150 transfers the divided circuit boards one by one to the transfer conveyor 160. The transferred circuit board is carried to the board take-out section 130 by the carrying conveyor 160. An inspection device 170 is arranged on the way to the board take-out section 130, and after a predetermined inspection,
Defective products are discharged by the discharge conveyor 180, and only good products are conveyed to the next process.

[0006]

However, in the case of the cutting machine 122 as described above, a large stress may be applied to the electronic component 2b in the vicinity of the cutting position, and the electronic component 2b may be destroyed. Therefore, it has been a cause of a decrease in yield of the obtained circuit board. Particularly, the printed circuit board 2 is made of an epoxy resin such as an epoxy substrate or a glass epoxy substrate.
Since both end portions of are cut by the press cutter 124 at once, a large stress is likely to be generated in the printed board 2. Therefore, there is a great deal of fear that a very large stress is applied to the electronic component 2b.

The present invention has been made in view of the above-mentioned problems of the prior art, and aims to reduce the stress applied to the electronic components near the dividing position and to improve the yield of a large number of circuit boards. .

[0008]

According to a first method for cutting a printed circuit board of the present invention, a cutting groove is provided in advance at a predetermined position on the printed circuit board by a disk cutter, and then the printed circuit board is cut by a press cutter. The feature is that both ends are cut and removed at once.

A second method of cutting a printed circuit board according to the present invention is such that a cutting groove is provided in advance at a predetermined position of the printed circuit board by a disk cutter, and then both end portions of the printed circuit board are simultaneously cut by the disk cutter. It is characterized by dividing and removing.

In these dividing methods, it is desirable to provide the dividing groove while preventing the printed circuit board from being lifted up inside the substrate from the dividing position.

Further, a first printed circuit board cutting mechanism according to the present invention comprises a pair of left and right disc cutters positioned at a cutting position of the printed circuit board and a stage for supporting the printed circuit board inside the cutting position from the cutting position. A pre-cutting portion having a cutting groove at the cutting position, a press cutter for cutting off both ends of the printed circuit board at the cutting position, and a stage for supporting the printed circuit board inside the cutting position from the cutting position. The present invention is characterized in that it has a fragmentation removal section.

Further, a second printed circuit board cutting mechanism according to the present invention comprises a pair of left and right disk cutters positioned at a cutting position of the printed circuit board and a stage for supporting the printed circuit board inside the cutting position from the cutting position. A pre-cutting portion having a cutting groove at the cutting position, a disk cutter for cutting off both ends of the printed circuit board at the cutting position, and a stage for supporting the printed circuit board inside the cutting position from the cutting position. The present invention is characterized in that it has a fragmentation removal section.

In the cutting mechanism for the second printed circuit board, the precutting portion may also serve as the division removing portion.

Further, in these dividing mechanisms, it is desirable that the pre-cutting portion is provided with a holding jig that prevents the printed circuit board from being lifted up inside the circuit board from the cutting position of the printed circuit board.

A printed circuit board cutting device according to the present invention comprises a loading palletizer in which a plurality of printed circuit boards are housed.
A dividing mechanism that divides and removes both ends of the printed circuit board, a dividing unit that divides the divided printed circuit board into a circuit board, a board take-out section that takes out the circuit board, and a printed circuit board of the input palletizer as a cutting section. In a device for cutting a printed circuit board, which comprises a take-out robot for carrying and a board carrying robot for carrying a divided circuit board to a board taking-out section, the cutting mechanism is the cutting mechanism according to the present invention. .

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram showing a cutting device 1 for a printed circuit board which is an embodiment of the present invention. The cutting device 1 includes an input palletizer 10 in which a plurality of printed circuit boards 2 are housed, a pre-cutting machine (pre-cutting section) 20 in which a cutting groove 3 is provided at a cutting position of the printed circuit board 2, and an ear 2 b of the printed circuit board 2. A cutting removal unit 30 that cuts the substrate into individual circuit boards and a board extraction unit 4 that takes out the divided circuit boards.
0, the take-out robot 50 that conveys the printed circuit board 2 from the input palletizer 10 to the fragmentation removal unit 30, and the fragmentation removal unit 3
A substrate transfer robot 60 that transfers from 0 to the substrate extraction unit 40
With. The cutting / removing unit 30 includes a board reversing machine 31 that rotates the conveyed printed circuit board 2 by 90 degrees, and a cutting machine 32 that cuts and cuts the ears 2b of the printed circuit board 2 and divides the circuit boards into circuit boards. That is, the division removal unit 30 has the same configuration as the conventional division removal unit 120, and includes a division removal unit that removes the ear 2b of the printed circuit board 2 and a division unit that separates each circuit board region 2a into circuit boards. A slicing machine 32 having both is used. Therefore, it can be said that the cutting device 1 has the same configuration as the conventional cutting device 1 except that the cutting device (precutting portion) 20 is provided.

The pre-cutting machine 20 is provided separately from the cutting machine 32, and the printed circuit board 2 is conveyed from the substrate reversing machine 31 to the pre-cutting machine 20 by the take-out robot 50, and the cutting groove 3 is provided.
After that, the sheet is conveyed to the cutting machine 32. Disruptor 3
2 uses the same device as the conventional cutting machine 122, and includes a support stage 33 that moves on a guide 34. In addition, the support stage 33 includes a board supporting portion 35 that supports the circuit board obtained by the division.

As shown in FIG. 2, the pre-cutting machine 20 previously forms the cutting groove 3 for cutting and cutting at the cutting position of the ear 2b of the printed circuit board 2. The pre-cutting machine 20 includes a pre-cutting stage 21 for setting the printed circuit board 2 as shown in FIG. 3, a cylinder 22 that moves up and down by a driving device (not shown), and a pair of left and right disc cutters 23 that move up and down in conjunction with the cylinder 22. Is equipped with. The disc cutter 23 and the cylinder 22 are attached to a slide portion 24 that is held slidably on a support stage 25.
With the horizontal movement of 4, the printed circuit board 2 is freely moved horizontally in the long axis direction. The pre-cutting stage 21 is formed in a substantially concave shape that supports the vicinity of both ends of the printed circuit board 2. As a result, the printed circuit board 2 is supported with the ears 2b of the printed circuit board 2 protruding to the left and right sides of the precut stage 21. That is, the disc cutter 23 lowered by the cylinder 22 horizontally moves to form the dividing groove 3. By forming the dividing groove 3, the cutting force required for dividing the ear portion 2b can be reduced, and the stress caused by the dividing by the dividing machine 32 in the next step can be reduced. The depth of the dividing groove 3 is appropriately adjusted depending on the thickness of the printed board 2 and the material thereof, and is set so that the cutting can be performed with a cutting force that does not apply an excessive stress to the printed board 2. Specifically, it is about 1/10 to 1/2 that of the printed circuit board 2. The sectional shape of the dividing groove 3 is generally V-shaped as shown in FIG. This cross-sectional shape is the used disc cutter 2
It follows the tip shape of the blade No. 3 and does not necessarily have to be substantially V-shaped, but it is desirable to have substantially V-shaped considering the press cut which is the next step.

Further, the pre-cutting machine 20 is provided with a holding jig for preventing the printed circuit board 2 from rising. This jig is
The stage 2 supporting the printed circuit board 2 inside the dividing position
It suffices if it can be pressed against the disc 5, and in the pre-cutting machine 20 shown in FIG. 3, a disc-shaped pressing plate 26 provided inside the disc cutter 23 is used. This holding plate 26
Is designed to be slightly smaller than that of the disc cutter 23. This difference is such that the printed circuit board 2 can be prevented from being lifted up, and it is preferable to set the difference to be slightly the same as the depth of the dividing groove 3 or slightly small. The holding plate 26 moves up and down together with the disc cutter 23,
The disk cutter 23 moves horizontally along with the horizontal movement.
Further, as the disc cutter 23 rotates, the holding plate 26
Also moves horizontally while rotating, but at this time the presser plate 26
Need not rotate in synchronism with the rotation of the disk cutter 23, but it is sufficient if it rotates to such an extent that horizontal movement is not hindered. When the holding plate 26 does not rotate, the printed circuit board 2
This is not preferable because the friction between the two becomes large and unreasonable force is generated. By using this holding jig (holding plate 26), the dividing groove 3 can be formed without the printed circuit board 2 rising from the precut stage 21.

Further, as the holding jig, a holding rod 27 arranged in the major axis direction of the printed board 2 as shown in FIG. 4 can be used. The presser bar 27 is moved up and down by a drive bar 28 that is interlocked with the cylinder 22 and the like. The drive rod 28 is arranged on the inner side of the substrate with respect to the dividing position, and keeps the printed circuit board 2 pressed while the disk cutter 23 is being driven.

When the loading palletizer 10 is set at a predetermined position in the cutting device 1, the unloading robot 50 takes out the printed circuit board 2 from the loading palletizer 10 and conveys it to the substrate reversing machine 31. The substrate reversing machine 31 rotates the substrate 2 by 90 degrees so that the conveyed substrate 2 becomes horizontal. Then, the take-out robot 50 again conveys the horizontal printed circuit board 2 to the pre-cutting machine 20 and transfers it to the pre-cutting stage 21. Next, the disk cutter 23 is lowered by driving the cylinder 22, and the dividing groove 3 is formed at a predetermined depth while moving horizontally. The holding plate 26 holds the printer substrate 2 against the precut stage 21, and prevents the substrate 2 from rising. When the dividing groove 3 is formed in this manner, the take-out robot 5
0 conveys the printed circuit board 2 to the cutting machine 32. Disruptor 3
In No. 2, as in the case of the conventional cutting device 100, the ear portion 2b is cut and removed by the press cutter 122, and the circuit board is cut. After that, the circuit board transfer robot 60 transfers the divided circuit board to the transfer conveyor 70, and a predetermined inspection is performed by the inspection device 80. Then, the defective product is discharged by the discharge conveyor 90, and only the good product is transported to the transport and take-out section 40.

Thus, the pre-cutting machine 20 (disk cutter 2
By 3), the dividing groove 3 is formed in the printed board 2,
It is possible to significantly reduce the stress generated when the ear 2b is divided. As a result, the stress applied to the electronic component 2b mounted on the printed board 2 is reduced, the damage of the electronic component 2b is reduced, and the yield of the obtained circuit board is improved.

Next, the cutting device 1 according to the second invention of the present application will be described. FIG. 5 shows the cutting device 1 including a loading palletizer 10 in which a plurality of printed circuit boards 2 are housed, a separation removing unit 30 for separating and removing the ears 2b of the printed circuit board 2, and a printed circuit board 2 from which the ears 2b are removed. Divider 36 that divides each circuit board, board take-out section 40 that takes out the cut circuit board, take-out robot 50 that conveys printed circuit board 2 from input palletizer 10 to cut-and-remove section 30, and board-removal section 40 from cut-and-remove section 30. Substrate transfer robot 6 to transfer to
However, unlike the cutting device 1 shown in FIG. 1, the cutting and removing unit 30 divides the printed circuit board 2 with the ears 2b cut and cut into circuit boards (divider 3).
6) is separated, and is composed of a pre-cutting machine 20 having the functions of both a pre-cutting portion that forms the dividing groove 3 and a cut-and-cut portion that completely removes the ear 2b. That is, the ear portion 2b of the printed circuit board 2 is completely removed by the pre-cutting machine 20 which also has the division removing portion 30. This cutting device 1
Then, by first moving the disc cutter 23 of the pre-cutting machine 20 to form the dividing groove 3 once,
Next, the descending amount of the disc cutter 23 is increased to further horizontally move on the dividing groove 3 to completely remove the ear portion 2b. That is, the descending amount of the disk cutter 23 is first set to about 1/2 to 1/10 of the thickness of the printed circuit board 2, and then the descending amount is made larger than the thickness of the printed circuit board 2 to divide it.
According to this method, as a result of the ear 2b being removed by the disc cutter 23, the stress applied to the electronic components 2b mounted near both ends of the printed circuit board 2 can be eliminated as much as possible. In addition, although not shown in the drawing, since it is not necessary to remove the ears 2b from the printed circuit board 2 in this dividing machine 36, the cutting machine 122 shown in FIG. 8 without the press cutter for removing the ears 2b is used. To be

When the ear portion 2b is removed by the disc cutter 23, it is necessary to include the formation of the dividing groove 3
The ear portion 2b may be cut and removed in a plurality of times at least once, and the number of movements of the disk cutter 23 may be appropriately set according to the thickness of the printed board 2 and the like.

In this case, it is convenient to use, as the pressing jig, a pressing rod 27 arranged inside the substrate rather than the cutting position. Regardless of the descending amount of the disc cutter 23, the printed circuit board 2 can be prevented from being lifted up by a single pressing operation, and the positional displacement of the printed circuit board 2 can be prevented.
Further, when the pressing plate 26 is provided inside the disc cutter 23, the structure of the pre-cutting machine 20 becomes complicated, such as changing the descending amount of the pressing plate 26 according to the descending amount of the disc cutter 23, which is not preferable.

Further, in the cutting device 1 shown in FIG. 5, the pre-cutting machine 20 is configured to have both the functions of the pre-cutting portion and the split excision portion. However, the functions of the pre-cutting portion and the split excision portion should be further divided. You can also That is, it is possible to provide a cutting and cutting machine including the disc cutter 23 separately from the precutting machine 20. As this cutting and cutting machine, one having the same structure as the precutting machine 20 is used.

In any case, if the ears 2b located at both ends of the printed circuit board 2 are removed by using the disk cutter 23, the generation of stress is further reduced as compared with the removal of the ears 2b by the press cutter 124. . Therefore, almost no stress is applied to the electronic component 2b located in the vicinity thereof, which can greatly contribute to the improvement of the yield.

As described above, according to the present invention, by previously using the disc cutter 23 to provide the dividing groove 3 at the dividing / removing position, it is possible to reduce the stress applied to the electronic component 2b mounted in the vicinity of the dividing / removing position. It can greatly contribute to the improvement of the yield of the circuit board.

[0029]

According to the first method of cutting a printed circuit board of the present invention, after a cutting groove is provided in advance at a predetermined position of the printed circuit board by a disk cutter, both end portions of the printed circuit board are pressed by a press cutter. Since the cutting and removal are performed at once, the stress generated during the cutting by the press cutter can be reduced.

In the second method for cutting a printed circuit board according to the present invention, a cutting groove is provided in advance at a predetermined position on the printed circuit board by a disk cutter, and then both end portions of the printed circuit board are further cut by the disk cutter. Therefore, the so-called ears located at both ends of the printed circuit board can be removed with almost no stress on the printed circuit board.

As described above, according to these cutting methods, the stress is small or scarcely generated, the damage of the electronic parts due to the cutting is reduced, and the yield of the circuit board is improved.

For example, the first cutting method has a pair of left and right disc cutters located at the cutting position of the printed circuit board and a stage for supporting the printed circuit board inside the cutting position and at the cutting position of the printed circuit board. The present invention includes a pre-cutting unit that provides a cutting groove, a press cutter that cuts and removes both ends of a printed circuit board at the cutting position, and a cutting and removal unit that has a stage that supports the printed circuit board inside the cutting position from the cutting position. This is realized by the first printed circuit board cutting mechanism according to the invention.

The second cutting method has a pair of left and right disc cutters positioned at the cutting position of the printed circuit board and a stage for supporting the printed circuit board inside the cutting position and the cutting position of the printed circuit board. A pre-cutting portion provided with a groove for cutting, a disc cutter for cutting and removing both ends of the printed circuit board at the cutting position, and a cutting and removing section having a stage for supporting the printed circuit board inside the cutting position from the cutting position. This is realized by the second printed circuit board cutting mechanism according to the present invention.

Further, in these cutting mechanisms, the pre-cutting portion is provided with a holding jig which prevents the printed circuit board from being lifted up inside the cutting position of the printed circuit board, so that the cutting groove can be reliably formed. .

Thus, according to the cutting apparatus of the present invention, since the cutting mechanism of the present invention is provided, it is possible to manufacture a circuit board from a large number of printed boards with a good yield.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a cutting device according to an embodiment of the present invention.

2A and 2B are diagrams showing a printed circuit board obtained by the above cutting machine, in which FIG. 2A is a plan view thereof and FIG. 2B is a front view thereof.

FIG. 3 is a view showing a pre-cutting machine in the above cutting device, (a) is a front view thereof, and (b) is a side view thereof.

FIG. 4 is a front view in which a part of another pre-cutting device in the above cutting device is cut away.

FIG. 5 is a schematic configuration diagram of a cutting device according to another embodiment of the present invention.

FIG. 6 is a plan view showing a printed circuit board for multi-cavity production.

FIG. 7 is a schematic configuration diagram of a conventional cutting device.

FIG. 8 is a front view showing a cutting machine in the above cutting apparatus.

[Explanation of symbols]

2 printed circuit boards 2b ear 3 dividing grooves 10 Input palletizer 20 Pre-cutting machine (pre-cutting section) 21 Pre-stage 23 Disc cutter 26 Presser plate (presser jig) 27 Presser bar (presser jig) 30 cutting and removing section 32 cutting machine 33 Support stage 36 division machine

Claims (8)

[Claims] 1. A method of cutting a printed circuit board, which comprises previously forming a cutting groove at a predetermined position of the printed circuit board with a disc cutter, and then cutting and removing both ends of the printed circuit board at once with a press cutter. . 2. A cutting of a printed circuit board, characterized in that after a cutting groove is provided at a predetermined position of the printed circuit board by a disk cutter, both ends of the printed circuit board are cut and removed at once by the disk cutter. Method. 3. The method of cutting a printed circuit board according to claim 1, wherein a groove for cutting is provided while preventing the printed circuit board from being lifted up inside the substrate from the cutting position. 4. A pre-cutting unit having a pair of left and right disc cutters positioned at a cutting position of the printed circuit board, a stage for supporting the printed circuit board inside the cutting position, and providing a cutting groove at the cutting position. A printed board including a press cutter that cuts and removes both ends of the printed board at the cutting position, and a stage that supports the printed board inside the cutting position from the cutting position. Cutting mechanism. 5. A precutting unit having a pair of left and right disc cutters positioned at a cutting position of the printed circuit board and a stage for supporting the printed circuit board inside the cutting position from the cutting position, and providing a cutting groove at the cutting position. And a discreet removal unit having a disc cutter for detaching and removing both ends of the printed circuit board at the segmenting position, and a stage for supporting the printed circuit board inside the substrate from the segmenting position. Cutting mechanism. 6. The cutting mechanism for a printed circuit board according to claim 5, wherein the precutting portion also serves as the division removing portion. 7. The pre-cutting unit comprises a holding jig for preventing the printed circuit board from being lifted up inside the printed circuit board from a cutting position of the printed circuit board. The printed circuit board cutting mechanism described. 8. A throw-in palletizer in which a plurality of printed circuit boards are accommodated, a dividing mechanism for separating and removing both ends of the printed circuit board, a dividing section for dividing the divided printed circuit boards into circuit boards, and the circuit. In a device for cutting a printed circuit board, a circuit board take-out unit for taking out a circuit board, a take-out robot for carrying a printed circuit board of the input palletizer to a cutting unit, and a board carrying robot for carrying a divided circuit board to a board taking-out unit, wherein: A cutting device for a printed circuit board, wherein the cutting mechanism is the cutting mechanism according to any one of claims 4, 5, 6 and 7.