JP2003152158A5 - - Google Patents

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Publication number
JP2003152158A5
JP2003152158A5 JP2001344147A JP2001344147A JP2003152158A5 JP 2003152158 A5 JP2003152158 A5 JP 2003152158A5 JP 2001344147 A JP2001344147 A JP 2001344147A JP 2001344147 A JP2001344147 A JP 2001344147A JP 2003152158 A5 JP2003152158 A5 JP 2003152158A5
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JP
Japan
Prior art keywords
semiconductor element
circuit surface
electrode
electronic component
projecting electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001344147A
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Japanese (ja)
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JP2003152158A (en
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Publication date
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Priority to JP2001344147A priority Critical patent/JP2003152158A/en
Priority claimed from JP2001344147A external-priority patent/JP2003152158A/en
Publication of JP2003152158A publication Critical patent/JP2003152158A/en
Publication of JP2003152158A5 publication Critical patent/JP2003152158A5/ja
Withdrawn legal-status Critical Current

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Description

【０００８】
【課題を解決するための手段】
上記の目的を達成するために本発明は、回路面に突起電極を有する第１の半導体素子と、前記第１の半導体素子の回路面に実装される第２の半導体素子とを構成することにより、小型、高容量の半導体素子を実装した電子部品とを有する。さらに、第３の半導体素子を、第２の半導体素子と併設して、第１の半導体素子の突起電極間に配置する電子部品を用いてもよい。 0008
[Means for solving problems]
In order to achieve the above object, the present invention comprises a first semiconductor element having a protruding electrode on the circuit surface and a second semiconductor element mounted on the circuit surface of the first semiconductor element. It has an electronic component on which a small, high-capacity semiconductor element is mounted. Further, an electronic component may be used in which the third semiconductor element is arranged side by side with the second semiconductor element and arranged between the protruding electrodes of the first semiconductor element.

Claims (6)

回路面に突起電極を有する第１の半導体素子と、前記第１の半導体素子の回路面に実装される第２の半導体素子と、前記第１の半導体素子の突起電極を実装する実装基板とを有する電子部品。  A first semiconductor element having a protruding electrode on a circuit surface; a second semiconductor element mounted on the circuit surface of the first semiconductor element; and a mounting substrate for mounting the protruding electrode of the first semiconductor element. Electronic component having. 回路面に突起電極を有する第１の半導体素子と、回路面に突起電極を有する第２の半導体素子とを有し、前記第１の半導体素子の突起電極を有する回路面と対向して前記第２の半導体素子の突起電極を配置し、前記第１の半導体素子の回路面に前記第２の半導体素子の突起電極を実装し、前記第１の半導体素子の突起電極を実装する回路面を有する実装基板からなる電子部品。  A first semiconductor element having a projecting electrode on the circuit surface; and a second semiconductor element having a projecting electrode on the circuit surface; and facing the circuit surface having the projecting electrode of the first semiconductor element. A projecting electrode of the second semiconductor element is mounted on the circuit surface of the first semiconductor element, and the projecting electrode of the first semiconductor element is mounted. An electronic component consisting of a mounting board. 第２の半導体素子は第１の半導体素子の突起電極間に配置されている請求項１又は２記載の電子部品。  The electronic component according to claim 1, wherein the second semiconductor element is disposed between the protruding electrodes of the first semiconductor element. 第３の半導体素子を、第２の半導体素子と併設して、第１の半導体素子の突起電極間に配置されている請求項３記載の電子部品。The electronic component according to claim 3, wherein the third semiconductor element is disposed side by side with the second semiconductor element and between the protruding electrodes of the first semiconductor element. 回路面に突起電極を有する第１の半導体素子と、回路面に突起電極を有する第２の半導体素子とを有し、前記第１の半導体素子の突起電極を有する回路面と対向して前記第２の半導体素子の突起電極を配置し、前記第１の半導体素子の回路面に前記第２の半導体素子の突起電極を実装し、前記第１の半導体素子の突起電極を実装基板の回路面に実装する電子部品の組立方法。  A first semiconductor element having a projecting electrode on the circuit surface; and a second semiconductor element having a projecting electrode on the circuit surface; and facing the circuit surface having the projecting electrode of the first semiconductor element. A protruding electrode of the second semiconductor element is mounted on the circuit surface of the first semiconductor element, and the protruding electrode of the first semiconductor element is mounted on the circuit surface of the mounting substrate. Assembly method for electronic components to be mounted. 第２の半導体素子の突起電極の大きさが５０μｍ以下である請求項１〜３のいずれか１項に記載の電子部品。  The electronic component according to claim 1, wherein the size of the protruding electrode of the second semiconductor element is 50 μm or less.
JP2001344147A 2001-11-09 2001-11-09 Electronic part, with semiconductor element mounted thereon, and manufacturing method thereof Withdrawn JP2003152158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001344147A JP2003152158A (en) 2001-11-09 2001-11-09 Electronic part, with semiconductor element mounted thereon, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001344147A JP2003152158A (en) 2001-11-09 2001-11-09 Electronic part, with semiconductor element mounted thereon, and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2003152158A JP2003152158A (en) 2003-05-23
JP2003152158A5 true JP2003152158A5 (en) 2005-07-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001344147A Withdrawn JP2003152158A (en) 2001-11-09 2001-11-09 Electronic part, with semiconductor element mounted thereon, and manufacturing method thereof

Country Status (1)

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JP (1) JP2003152158A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6371122B2 (en) * 2014-06-05 2018-08-08 株式会社日立製作所 Power semiconductor device and resin-sealed motor

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