JP2003149512A - O/e conversion connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an O/E (optical and electric signals) conversion connector which can radiate heat with high efficiency, protects a surface of contact between a light receiving and transmitting element and an optical transmission medium, and neither deforms nor breaks by an applied unreasonable force resulting from its fitting tolerance or error. SOLUTION: The O/E conversion connector is connected to the optical transmission medium 10 with an optical diffusing function through the light receiving and emitting element 2 and it is characterized in that an FPC 23 with the light receiving and emitting element 2 mounted thereon is incorporated in contact with the internal wall surface of a connector case 20 made of a material with high-heat-conductivity; and the light receiving and emitting element 2 is brought into tight contact with the optical transmission medium 10 across a sealing member 22 formed surrounding the circumference of the element 2 and a PCB 50 incorporated in the connector case 20 is fitted to the connector case 20 slightly movably.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an O / E conversion connector for mutually converting an electric signal and an optical signal, and more specifically, it reflects / diffuses light incident from an entrance / exit portion provided on an end face. On the other hand, the electric signal and the optical signal, which are connected via the light emitting / receiving element, are connected to the optical transmission medium having the light diffusion function that uniformly transmits to the almost entire end surface of the other input / output section located on the opposite side. The present invention relates to an O / E conversion connector for converting to.

[0002]

2. Description of the Related Art With the rapid spread of the Internet and multimedia, the amount of information to be processed by various processing devices has increased remarkably today. In various processing devices as network terminals, in order to improve information processing capability, speeding up and multi-processoring of processors and increasing capacity of internal memory of the system have been attempted. However, since the connection between the high-performance devices that make up such a processing device has been conventionally performed by electrical wiring made of metal, problems such as signal delay and power consumption due to wiring capacitance and resistance occur and bottleneck of data processing capability. It becomes a bottleneck and the processing speed is limited. Further, in the electric wiring, there are problems that the driving frequency and fan-out are restricted by the wiring length, and the wiring area and power consumption increase.

As a technique for solving these problems, an optical interconnection technique for transmitting signals at an extremely high speed using an optical sheet bus, which is a sheet-like optical transmission medium different from the conventional optical fiber transmission, is drawing attention. . Here, the principle of the optical sheet bath will be briefly described. FIG. 1 is a schematic explanatory view showing the principle of the optical sheet bath. As best shown in FIG. 1, a light sheet bus 10 has a light transmitted therethrough to form a light guide path.
A flat plate-shaped core layer 100 made of a material such as MA (Polymethylmethacrylate), and a clad layer 1 which is a fluororesin coating applied so as to cover the upper and lower surfaces of the core layer 100.
It is composed of 01. The opposite end surfaces 100a and 100b of the core layer 100 through which the optical signal is input and output are provided.
A diffusion film (not shown) for optimally diffusing and distributing the optical signal is adhered to, and a plurality of input / output units for inputting / outputting the optical signal are arranged at predetermined intervals.

The optical signal L1 converted from the electric signal E1 by O / E conversion is converted into the end surface 10 of the optical sheet bus 10 described above.
When entering from the entrance / exit section A of 0a (only one place is shown for explanation), the optical signal is opposed to the end surface 100b by the diffusion film.
In addition to being diffusely transmitted to the core layer 100, the total reflection on the upper and lower surfaces of the core layer 100 is repeated to reach the entire surface of the end surface 100b facing the optical signal directly reaching the surface almost evenly. The reached optical signal L2 can be taken out from any part of the end face 100b to be an electric signal E2. Therefore, by providing a plurality of input / output units on both end surfaces 100a and 100b of the optical sheet bus 10, M: N multicast transmission is possible, unlike optical fibers based on 1: 1 one-way communication. Become. In addition, both end surfaces 100a, 100
By providing a plurality of entrance / exit portions in each of b, bidirectional transmission for transmitting / receiving an optical signal from any end surface side is also possible. Further, as shown in FIG. 2, by stacking the optical sheet buses 10 with the black PMMA 11 sandwiched therebetween, it is possible to increase the number of bits of the optical signal transmission path. It should be noted that it is possible to realize the transmission of signals at a speed higher than that of the electric signals performed by the electric wiring. In addition, 13 shows a diffusion film. Here, Fig. 1 and Fig. 2 are excerpted from "Outline of optical sheet bus technology" shown as related material in the introduction page of optical sheet bus technology provided by Fuji Xerox Co., Ltd. on the Internet. Is.

[0005]

When a plurality of light emitting and receiving elements are mounted on the O / E conversion connector closely connected to the optical sheet bus as described above, the light receiving and emitting elements and other electronic parts to be mounted are mounted. Fever becomes a problem. In particular, when the light emitting / receiving element and other electronic components are densely mounted in the connector case, the amount of heat generated per unit volume also increases, so it is necessary to take effective heat dissipation measures.

If a PCB (Printed Circuit Board) having a predetermined electric circuit connected to the light emitting / receiving element is fixed to a connector case containing the light receiving / emitting element by means of screwing or the like, the PCB can be freely attached. When the connector is fitted into the housing that holds the optical transmission medium, the mounting tolerance and error of the connector and the housing apply unreasonable force to the PCB, which may deform or destroy the connector, the housing, and the PCB. There is a risk that

Therefore, the present invention provides an O / E conversion connector capable of efficiently radiating heat even when the light emitting / receiving element and other electronic components are mounted in a connector case with high density. With the goal. In addition, when the connector and the housing are coupled, an unreasonable force is applied to the PCB due to the mounting tolerance and error, and an O / E conversion connector that does not deform or destroy the connector and the housing, and further the PCB is provided. With the goal.

[0008]

In order to solve the above-mentioned problems, the present invention as set forth in claim 1 is arranged on the opposite side to the light incident from the entrance / exit portion provided on the end face while reflecting / diffusing the light. O / which mutually connects an electric signal and an optical signal which are connected to an optical transmission medium having a light diffusing function for transmitting evenly over substantially the entire end face of the other input / output unit through the light emitting / receiving element.
An EPC connector, which is an FPC in which a light emitting / receiving element is mounted
Is closely attached to the inner wall surface of a connector case made of a highly heat-conductive material to be incorporated therein, so that heat generated from components mounted on the FPC is radiated through the connector case. An O / E conversion connector is provided.

In order to solve the above problems, the present invention according to claim 2 provides the O / E conversion connector according to claim 1, wherein the connector case is further provided with a heat radiating plate for increasing heat radiating efficiency. It is characterized by being

In order to solve the above problems, the present invention according to claim 3 is directed to another incident / emission portion located on the opposite side from the incident / emission portion provided on the end face while reflecting / diffusing the light incident thereon. Is an O / E conversion connector for mutually converting an electrical signal and an optical signal, which is connected to an optical transmission medium having a light diffusing function for uniformly transmitting the light on substantially the entire end surface of the device, through an optical receiving element. An FPC on which the light emitting element is mounted and a PCB including a predetermined electric circuit coupled via an FPC connector attached to the FPC are internally provided in the connector case, and P
The CB provides an O / E conversion connector characterized by being attached so as to be slightly movable with respect to the connector case.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an O / E conversion connector according to the present invention will be described in detail below with reference to the drawings. 3 is a perspective view of an embodiment of the O / E conversion connector according to the present invention, FIG. 4 is a plan view of the housing of the O / E conversion connector shown in FIG. 3, FIG. 5 is its front view, and FIG. A side view thereof and FIG. 8 are plan sectional views of the O / E conversion connector shown in FIG.

First, O in the embodiment shown in FIG.
The / E conversion connector 1 is generally formed by arranging a plurality of (four in the figure) packages 21 and 21 provided with a plurality of light receiving and emitting elements 2 and 2 in a connector case 20, and at both ends of the connector case 20. Optical sheet bus 1 to be described later
It is configured by including lock screws 27, 27 for making close contact with a screw hole (not shown) provided in the housing 40 holding 0.

The connector case 20 is made of, for example, a metal material made of a highly heat-conductive material such as aluminum or a copper alloy.
It is formed to have a substantially rectangular parallelepiped shape having a space portion capable of accommodating various electronic members inside, and a heat dissipation portion 30 formed to extend rearward is provided on the upper surface thereof. On the front side of the connector case 20, as shown in FIGS. 3 and 5, four packages 21, 21 on which the light emitting and receiving elements 2, 2 are mounted are arranged side by side in a line. The light emitting / receiving elements 2 and 2 convert an electric signal into an optical signal and an optical signal into an electric signal.

Lock screws 27, 27 are provided in the vicinity of both ends of the front surface of the connector case 20 for tightly contacting screw holes (not shown) provided in the housing 40 holding the optical sheet bus 10 shown in FIG. The guide pins 41, 41 provided are inserted to form guide holes 29, 29 for positioning them. Lock screw 2
7 has a knob portion 27a at the rear portion thereof.
Turn a and screw into a screw hole provided in the housing 40. As a result, the O / E conversion connector 1 and the housing 4
The light emitting and receiving elements 2 and 2 are firmly connected to each other so that 0 does not separate, and the light emitting and receiving elements 2 and 2 are provided in the optical sheet bus 10.
Position and guide it so that it is exactly in contact with. still,
The number of the light emitting / receiving elements 2 and 2 and the number of the packages 21 and 21 arranged in the connector case 20 are not limited to those of the present embodiment.

A package 2 including the light emitting / receiving elements 2 and 2.
As shown in FIG. 10, 1 and 21 are FPC (flexible print) in which electric wiring is laid on a flexible film.
ing circuit) 23, 23, and the bent portion 2
It can be bent at 3a. Then, the light emitting / receiving elements 2 and 2 are housed in the connector case 20 such that they are located on the front side of the connector case 20. In addition, FPC2
An amplifier 9 for amplifying an electric signal converted from an optical signal is arranged near the bent portion 23a of No. 3. FPC23,
As shown in FIG. 9, 23 is arranged so that the surface on the side opposite to the side on which each electronic component is arranged is in close contact with the upper inner wall surface of the connector case 20. As a result, heat generated from electronic components such as the light emitting / receiving elements 2 and 2 and the amplifier 9 is radiated by radiating the heat through the connector case 20 made of a high thermal conductive material. In this case, it is also preferable that heat dissipation grease is applied to the inner wall surface of the connector case 20 and the FPCs 23, 23 are brought into close contact therewith. Further, since the connector case 20 is provided with the heat radiating portion 30, it is possible to radiate heat more efficiently.

The heat dissipating section 30 is not limited to a simple plate-like body as shown in FIG. 3, but may be a multi-stage bent shape as shown in FIG. By forming in this way, the surface area of the heat dissipation plate 30 can be increased and the heat dissipation effect is improved. Further, other than that, for example, fins may be formed on the heat dissipation portion 30 to increase the surface area, and thus the effect can be increased. Further, it is also effective to apply heat-dissipating grease to the electronic components that generate heat.

The FPCs 23, 23 have FPCs at the rear ends thereof.
The connectors 23a, 23a are provided, and this FPC
A PCB (Printed Circuit Board) 50 having a predetermined electric circuit is connected via the connectors 23a and 23a. The PCB 50 is attached to the connector case 20 by an attaching means having a floating mechanism. That is, as shown in FIGS. 8 and 11, mounting holes 51, 51 are formed at predetermined locations on the PCB 50. Then, the PCB 50 has an insertion portion having a diameter smaller than the diameter of the mounting holes 51, 51, and a stopper 51 having a head portion 51a having a diameter larger than the diameter of the mounting holes 51, 51 is loosely inserted into the projection hole 20a. Connector case 2 by fixing
It is attached to 0. The stopper 51 has mounting holes 51, 51.
PCB with a head 51a larger than the diameter of
Since 50 does not come off and has a slight play, it can be slightly moved in the vertical and horizontal directions with respect to the connector case 20. On the other hand, since the PCB 50 is coupled to the FPC connectors 23a and 23a provided on the flexible FPCs 23 and 23, the PCB 50 can move due to the mounting tolerance and error when the connector case 20 and the housing 40 are fixed. Can be absorbed by PCB50 and FPC connector 23a, 23a
No unreasonable force is applied to the joint between the connector case 20 and the housing 40. This can prevent the connector case 20, the housing 40, and the PCB 50 from being deformed or damaged.

A sealing member 22 is provided on the front surface of the connector case 20 so as to surround the light emitting / receiving elements 2 and 2.
Is provided to protect the connection surface between the light emitting / receiving elements 2 and 2 and the optical sheet bus 10 from dirt such as dust and moisture. The sealing member 22 can be arranged not only on the surface of the connector case 20 but also on the surface of the housing 40 that is in close contact with the connector case 20. In the embodiment shown in FIG. 9, the sealing member 22 is also arranged on the surface of the housing 40. With this configuration, the connection surface between the light emitting / receiving elements 2 and 2 and the optical sheet bus 10 is dusted.
It is possible to protect the connection surface from dirt such as moisture.
As the sealing member 22, a material having high elasticity such as synthetic resin or natural rubber is used, which is formed in a sheet shape and arranged at the illustrated position. Although the sealing member 22 is provided on the surface of the connector case 20 and the surface of the housing 40 in the illustrated embodiment, the sealing member 22 is provided only on at least one side of the surface of the connector case 20 and the surface of the housing 40. It may be arranged at.

Next, a method of using the O / E conversion connector 1 will be described. First, the surface of the connector case 20 on the side where the light emitting / receiving elements 2 and 2 to be connected are arranged and the surface of the housing 40 on which the entrance / exit surface of the optical sheet bus 10 is located are cleaned to remove dirt. Then, the guide pins 41, 41 provided in the housing 40 are inserted into the guide holes 29, 29 formed in the connector case 20 to bring the O / E conversion connector 1 and the housing 40 into close contact with each other while positioning. Next, turn the knob 27a to turn the lock screw 27
Is fixed by screwing into a screw hole provided in the housing 40. At this time, since the PCB 50 is attached so as to be slightly movable with respect to the connector case 20, the mounting tolerance or error between the O / E conversion connector 1 and the housing 40 may be reduced by the PC.
It is absorbed by the movement of B50. Further, since the sealing member 22 is disposed on the surface of the connector case 20 and the surface of the housing 40, the two are closely adhered to each other without a gap, and the connecting surfaces of the light emitting / receiving elements 2 and 2 and the optical sheet bus 10 are dusty or damp. Protected from dirt.

When the operation of the O / E conversion connector 1 is started in this state, heat is generated from the electronic components such as the light emitting / receiving elements 2 and 2, the amplifier 9, and the temperature inside the connector case 20 rises. At this time, the FPCs 23, 23 are connected to the connector case 20.
The heat generated from each electronic component is radiated through the connector case 20 because it is in close contact with the inner wall surface of the connector. Further, since the connector case 20 is provided with the heat radiating portion 30, the heat radiating portion 30 also radiates heat efficiently, the temperature rise of the O / E conversion connector 1 is suppressed, and the performance of each electronic component is ensured. The life will be extended.

【The invention's effect】

As described above, the O / E according to the present invention
According to the conversion connector, the heat generated from the components mounted on the FPC is transmitted through the connector case by closely incorporating the FPC having the light emitting / receiving element mounted therein to the inner wall surface of the connector case formed of the high thermal conductive material. Therefore, even if the light emitting / receiving element and other electronic components are densely mounted in the connector case, there is an effect that the heat can be efficiently radiated.

Further, according to the O / E conversion connector of the present invention, a PCB including an FPC on which the light emitting / receiving element is mounted and a predetermined electric circuit coupled via the FPC connector attached to the FPC is provided. Is installed inside the connector case, and P
Since the CB is attached so as to be slightly movable with respect to the connector case, when the O / E conversion connector and the housing are coupled, an unreasonable force is applied to the PCB due to the mounting tolerance or error, There is an effect that the E conversion connector, the housing, and the PCB are not deformed or destroyed.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view showing the principle of an optical sheet bath.

FIG. 2 is a schematic explanatory view showing a transmission line in which an optical sheet bus is arranged.

FIG. 3 is a perspective view of an embodiment of an O / E conversion connector according to the present invention.

4 is a plan view of a housing of the O / E conversion connector shown in FIG.

5 is a front view of the O / E conversion connector shown in FIG.

6 is a side view of the O / E conversion connector shown in FIG.

FIG. 7 is a perspective view showing a multi-stage heat dissipation plate.

FIG. 8 is a plan sectional view of the O / E conversion connector shown in FIG.

9 is a cross-sectional view of the O / E conversion connector shown in FIG.

FIG. 10 is a side view of the package.

FIG. 11 is a cross-sectional plan view illustrating attachment of the PCB to the connector case.

[Explanation of symbols]

1 O / E conversion connector 2 Light emitting / receiving element 9 amp 10 light sheet bath 10a entrance / exit section 21 packages 22 Sealing material 23 FPC 23a FPC connector 27 Lock screw 27a knob part 29 Guide hole 30 Heat sink 40 housing 41 guide pin 50 PCB 51 mounting holes

Claims (3)

[Claims] 1. A light diffusing function for reflecting and diffusing light incident from an entrance / exit portion provided on an end face, and uniformly transmitting the light to almost the entire end face of another entrance / exit portion located on the opposite side. An O / E conversion connector for mutually converting an electric signal and an optical signal, which is connected to an optical transmission medium via a light emitting / receiving element, wherein the FPC having the light emitting / receiving element mounted thereon is formed of a high thermal conductive material. An O / E conversion connector characterized in that the heat generated from the components mounted on the FPC is radiated through the connector case by being closely attached to the inner wall surface of the connector case and incorporated therein. . 2. The O / E conversion connector according to claim 1, wherein the connector case is further provided with a heat dissipation plate for increasing heat dissipation efficiency. 3. A light diffusing function of reflecting and diffusing light incident from an entrance / exit portion provided on an end face, and uniformly transmitting the light to substantially the entire end face of another entrance / exit portion located on the opposite side. An O / E conversion connector for mutually converting an electrical signal and an optical signal, which is connected to an optical transmission medium via a light emitting / receiving element, the FPC having the light emitting / receiving element mounted, and being attached to the FPC. A PCB provided with a predetermined electric circuit coupled through the FPC connector is provided inside the connector case, and the PCB is attached so as to be slightly movable with respect to the connector case. And O / E conversion connector.