JP2003147453A - Low temperature flow-down refining to tin, lead and solder and recycle system for these metal - Google Patents

Low temperature flow-down refining to tin, lead and solder and recycle system for these metal

Info

Publication number
JP2003147453A
JP2003147453A JP2001383769A JP2001383769A JP2003147453A JP 2003147453 A JP2003147453 A JP 2003147453A JP 2001383769 A JP2001383769 A JP 2001383769A JP 2001383769 A JP2001383769 A JP 2001383769A JP 2003147453 A JP2003147453 A JP 2003147453A
Authority
JP
Japan
Prior art keywords
tin
lead
solder
low
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001383769A
Other languages
Japanese (ja)
Inventor
Yoshito Ijichi
祥人 伊地知
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIROGANE KK
Original Assignee
SHIROGANE KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHIROGANE KK filed Critical SHIROGANE KK
Priority to JP2001383769A priority Critical patent/JP2003147453A/en
Publication of JP2003147453A publication Critical patent/JP2003147453A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Manufacture And Refinement Of Metals (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a new recycle smelting method with a crucible with high efficiency, in recycling tin, lead and a solder as an alloy thereof in the diversified components. SOLUTION: Tin, lead and the solder alloy containing impurities such as a copper, are charged into a low temperature flow-down furnace and heated to a temperature at not higher than the melting point of the impurities of copper, iron, or nickel, and tin and lead are melted and flown down to remove the impurities in a solid state. Further, many unnecessary added materials and impurities are filtered off by forming copper granular layer in the low temperature flow-down furnace and filtering the copper granular layer because the fluidity of the copper grain is low at the low temperature.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は主に錫、鉛、その合
金である半田のリサイクル精錬等における不純物および
不必要な添加物の除去を目的とした精錬です。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a refining mainly for removing impurities and unnecessary additives in the recycling refining of tin, lead, and alloys of solder.

【0002】[0002]

【従来の技術】従来の技術では錫、鉛、半田のるつぼ精
錬において排気煙道上に、銅を含む精錬物を置いて、低
温流下させ銅分を減少していた。
2. Description of the Related Art In the prior art, when refining tin, lead and solder in a crucible, a refined material containing copper was placed on an exhaust flue and allowed to flow at a low temperature to reduce the copper content.

【0003】[0003]

【発明が解決しようとする課題】従来のるつぼ精錬の余
熱を利用した低温流下による銅除去は、るつぼ精錬の精
錬温度に煙道温度が比例して上がるので温度管理が困難
であり、銅分があまり除去出来ないばかりか、銅以外の
不純物が除去出来る事も知られていませんでした。現在
半田溶接は半導体の普及により、リサイクル半田材料に
従来含まれる事の少なかった鉄、また含まれる事の無か
ったニッケル、シリコンが含まれるばかりでなく、環境
問題でなまりの毒性が問題と成り、従来の鉛、錫ベース
の半田から錫ベースの鉛フリー半田使用に移行しており
ますが、鉛フリー半田にはニッケル、ゲルマニウム等の
添加があり、これらを除去する必要があります。鉛リサ
イクルに当たっては、現在カルシウムが含まれる事も多
くなるなど錫、鉛、半田に関する使用技術の高度化に伴
ういろいろな成分変化がおきております。なお半田溶接
技術の進歩により、今まで問題と成らないで居た錫、鉛
等の金属酸化物の介在までもが問題と成ってきました。
In the conventional copper removal by low temperature flow utilizing the residual heat of the crucible refining, the temperature control is difficult because the flue temperature rises in proportion to the refining temperature of the crucible refining. It was not known that impurities could be removed in addition to copper, not just that they could be removed very much. With the widespread use of semiconductors, solder welding now contains not only iron, which was rarely included in recycled solder materials, but also nickel and silicon, which were never included in recycled solder materials. Conventional lead and tin-based solders have been replaced by tin-based lead-free solders, but lead-free solders contain nickel, germanium, etc., and these must be removed. In lead recycling, various components change due to the sophistication of usage technology for tin, lead, and solder, including the fact that calcium is often contained. With the progress of solder welding technology, even the interposition of metal oxides such as tin and lead, which have not been a problem until now, became a problem.

【0004】[0004]

【課題を解決するための手段】上記の問題を解決する為
に、添加物、不純物除去用の専用低温流下炉(基本構造
は反射炉に同じ)を製作し、錫、鉛、半田を融点に近い
温度で低温流下させる事により、不純物、添加物、それ
に金属酸化物を除去するばかりで無く、リサイクル材の
内、銅分の無い、または少ないリサイクル材の精錬に適
量の銅分を溶融添加する事により、錫、鉛、半田中の銅
分子をフィルターとして、上記添加物不純物を完全に除
去することが出来ます。
[Means for Solving the Problems] In order to solve the above problems, a dedicated low-temperature downflow furnace (basic structure is the same as that of a reflection furnace) for removing additives and impurities is manufactured, and tin, lead, and solder are used as melting points. Impurities, additives, and metal oxides are not only removed by low-temperature flow at a similar temperature, but also an appropriate amount of copper is melted and added to the refining of recycled materials with or without a small copper content in the recycled materials. As a result, tin, lead, and copper molecules in solder can be used as a filter to completely remove the above-mentioned additive impurities.

【0005】[0005]

【発明の実施の形態】本発明は温度管理の徹底を図る為
に、錫、鉛、半田の専用低温流下炉を作製した。
BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a dedicated low-temperature downflow furnace for tin, lead, and solder was produced in order to thoroughly control temperature.

【0006】錫、鉛、半田のリサイクル材料が適量以上
の銅分を含有し、それに鉄ニッケル、シリコン、ゲルマ
ニウム、カルシウム、金属酸化物等を含む場合はそのま
ま、銅分が適量に達しない場合は適量の銅を溶融添加す
る。
When the recycled material of tin, lead, and solder contains an appropriate amount of copper and iron iron, nickel, silicon, germanium, calcium, metal oxide, etc., and when the amount of copper does not reach the appropriate amount. Melt and add an appropriate amount of copper.

【0007】金属吐出口前に耐火煉瓦等、流下金属の抵
抗物を設置する。
In front of the metal discharge port, a resistance material such as refractory brick is installed for the falling metal.

【0008】素地金にしたリサイクル材を低温流下炉に
入れ、低温流下させる。投入素地金が錫、鉛合金(半
田)の場合、最初に融点の低い錫分が多く流下するの
で、始め流下してくる流下半田中の錫分は投入素地金よ
り多い。
[0008] The recycled material made into a base metal is put into a low temperature down-flow furnace and is made to flow down at low temperature. When the input base metal is tin or a lead alloy (solder), a large amount of tin having a low melting point flows down first, so the amount of tin in the flow-down solder that flows down first is higher than that of the input base metal.

【0009】低温流下炉の金属流下が少なくなったら、
温度を徐々に上げる。この際流下金属は温度を上げるに
従って、融点の低い錫分は減少して行き、融点が錫より
高い鉛分が増加してくる。
When the amount of metal flowing in the low-temperature flow furnace decreases,
Gradually raise the temperature. At this time, as the temperature of the flowing metal increases, the tin content having a lower melting point decreases and the lead content having a higher melting point than tin increases.

【0010】銅分が流下を始めたら流下精錬を中止し、
残存の含銅金属を取り出す。
When the copper content starts to flow down, the downflow refining is stopped,
The remaining copper-containing metal is taken out.

【0011】必要除去成分の除去が十分で無かったら、
低温流下精錬を繰り返す。
If the necessary removal components are not sufficiently removed,
Repeated low temperature smelting.

【実施例】実施は回収リサイクル材料である錫、鉛、半
田の素地金、それらの溶剤入り金属粕、異物入り金属等
を次の手順により循環リサイクルする。
[Examples] The practice is to circulate and recycle recovered recycling materials such as tin, lead, solder base metal, their solvent-containing metal lees, and metal containing foreign substances according to the following procedure.

【0012】焼却釜によるリサイクル材の溶剤焼却。
焼却により(A)一次素地金が製造される他副産物が出
来る。製造物−(A)一次素地金 副産発生物−(B)
酸化金属灰(C)金属異物
Solvent incineration of recycled materials in an incinerator.
By incineration, (A) primary base metal is produced and other by-products are produced. Product- (A) Primary base metal By-product- (B)
Metal oxide ash (C) Metal foreign material

【0013】低温流下炉で(A)一次素地金を低温流
下し、除去可能成分を除去する。製造物−(D)二次素
地金 副産発生物−(E)含銅合金
In the low temperature down-flow furnace, the (A) primary base metal is flown down at low temperature to remove the removable components. Product- (D) Secondary base metal By-product- (E) Copper-containing alloy

【0014】還元炉で(B)酸化金属灰を高温還元し
(A)一次素地金を製造する。製造物−(A)一次素地
金 副産発生物−(F)金属ノロ
(B) Metal oxide ash is reduced at a high temperature in a reducing furnace to produce (A) primary base metal. Product- (A) Primary base metal By-product- (F) Metalloro

【0015】上記還元炉で製造の(A)一次素地金は
低温流下炉で再処理(D)二次素地金に。
The (A) primary base metal produced in the above reduction furnace is reprocessed in the low temperature flow furnace (D) into the secondary base metal.

【0016】成分調整炉で(D)二次素地金を硫黄と
の化学反応により残存銅分を取り除く。製造物−(G)
再生地金 副産発生物−(H)脱銅粕
The residual copper component is removed from the secondary base metal (D) by a chemical reaction with sulfur in a component adjusting furnace. Product- (G)
Recycled metal byproduct- (H) decopper residue

【0017】上記(H)脱銅粕は還元炉で再処理
(A)一次素地金に。
The above (H) decoppered residue is reprocessed in a reducing furnace (A) into a primary base metal.

【0018】上記(A)一次素地金は低温流下炉で再
処理(D)二次素地金に。
The above (A) primary base metal is re-processed in a low temperature downflow furnace (D) into a secondary base metal.

【0019】上記(D)二次素地金は成分調整炉
(G)再生地金に。
The above (D) secondary base metal is used as a component adjusting furnace (G) recycled base metal.

【0020】焼却釜還元炉において集塵装置の集塵
灰が発生する。(工場内清掃灰も集塵灰に含む)
Dust collecting ash of the dust collector is generated in the incinerator reduction furnace. (In-plant cleaning ash is also included in dust collection ash)

【0021】[0021]

【発明の効果】本発明は上記の形態をもって実施され、
低温流下炉が錫、鉛、半田の循環リサイクルシステムの
一部として利用される事により以下に記載されるような
効果を奏する。
The present invention is carried out in the above-mentioned modes,
By utilizing the low temperature down-flow furnace as a part of the circulation recycling system for tin, lead and solder, the following effects can be obtained.

【0022】低温流下炉により上記除去必要添加物、不
純物の多くを日本工業規格に定められた錫、鉛、半田の
不純物の許容限度以下に押さえられる。また日本工業規
格に表記の無い成分の不純物においても、その多くを
0,01%以下に除去出来る事により、再生地金の利用
価値が高まり、その使用範囲も拡大する。
By the low-temperature down-flow furnace, most of the above-mentioned additives and impurities required for removal can be kept below the allowable limit of tin, lead and solder impurities specified in Japanese Industrial Standards. Moreover, even if impurities of components not listed in Japanese Industrial Standards can be removed to less than 0.01%, the utility value of recycled metal is increased and the range of its use is expanded.

【0023】上記循環型リサイクルシステムに低温流下
炉を組み込む事により、産業廃棄物を出さない循環型リ
サイクルシステムが完成した。
By incorporating a low temperature down-flow furnace into the above circulation type recycling system, a circulation type recycling system which does not generate industrial waste was completed.

【0024】上記製造物、副産発生物より(A)一次素
地金(B)酸化金属灰(D)二次素地金(H)脱銅粕は
工場内において循環精錬される。
From the above products and by-products, (A) primary base metal (B) metal oxide ash (D) secondary base metal (H) decopper residue is circulated and refined in the factory.

【0025】上記製造物、副産発生物より売却され再利
用される物は(C)金属異物(E)含銅合金(F)金属
ノロ(G)再生地金(I)集塵灰
The products sold and reused from the above-mentioned products and by-products are (C) foreign metal (E) copper-containing alloy (F) metal noro (G) recycled metal (I) dust ash

【0026】上記(A)から(I)まで、その全てが再
処理か売却され利用される事により循環されて行く。
From (A) to (I), all of them are recycled by being reprocessed or sold and used.

【符号の説明】[Explanation of symbols]

1 (1)から(7)低温流下炉による除去可能物質。 2 から循環型、リサイクル材料処理設備。 3 (A)から(I)社内循環再処理される物、および
他へ売却される材料。
1 (1) to (7) Materials that can be removed by a low temperature down-flow furnace. 2 to recycling type, recycling material processing equipment. 3 (A) to (I) Materials that are reprocessed in-house, and materials that are sold to others.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C22B 25/02 C22B 25/02 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C22B 25/02 C22B 25/02

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】低温流下炉による錫、鉛、それらの合金で
ある半田の低温による流下精錬。
1. A low-temperature down-flow smelting process of tin, lead and solder, which is an alloy thereof, in a low-temperature down-flow furnace.
【請求項2】低温流下炉による錫、鉛、それらの合金で
ある半田の低温流下精錬における除去可能物質の特定
(1)銅(2)鉄(3)ニッケル(4)ゲルマニウム
(5)シリコン(6)カルシウム(7)錫、鉛等金属酸
化物
2. Identification of a removable substance in low-temperature smelting of solder, which is an alloy of tin, lead and their alloys, in a low-temperature down-flow furnace (1) copper (2) iron (3) nickel (4) germanium (5) silicon ( 6) Calcium (7) Metal oxides such as tin and lead
【請求項3】低温流下精錬素材に銅の溶融添加を行う事
で、精錬金属中の除去物質に関わる、銅粒子によるフィ
ルター効果。
3. A filter effect by copper particles, which is related to a substance to be removed in refining metal, by melting and adding copper to a low-temperature flowing-down refining material.
【請求項4】低温流下炉の炉内金属吐出口前に耐火煉瓦
等で、流下に抵抗を与え、流動性の悪い銅粒子等を溜
め、厚い銅粒子金属層を形成させる事による銅粒子フィ
ルターのフィルター効果の増大。
4. A copper particle filter which is provided with a refractory brick or the like in front of a metal discharge port of a low-temperature down-flow furnace, which gives resistance to the downflow and collects copper particles having poor fluidity to form a thick copper particle metal layer. The filter effect of.
【請求項5】錫、鉛、半田のリサイクル精錬において、
低温流下炉をリサイクルシステムに組み込む事による、
産業廃棄物を出さない循環型リサイクルシステムの完
成。
5. In the recycling and refining of tin, lead and solder,
By incorporating the low temperature down-flow furnace into the recycling system,
Completion of a recycling system that does not generate industrial waste.
【請求項6】錫、鉛、半田の低温流下炉での反復流下精
錬による、不要添加物、不純物の除去増大。
6. Increased removal of unnecessary additives and impurities by repeated downflow refining of tin, lead and solder in a low temperature downflow furnace.
【請求項7】半田の低温流下精錬における融点を利用し
た、錫−鉛半田の錫分濃縮。
7. Concentration of tin in tin-lead solder by utilizing the melting point in low-temperature smelting of solder.
【請求項8】半田の低温流下精錬における融点を利用し
た、錫−鉛半田の鉛分濃縮。
8. A lead content concentration of tin-lead solder, which utilizes a melting point in low-temperature smelting of solder.
JP2001383769A 2001-11-13 2001-11-13 Low temperature flow-down refining to tin, lead and solder and recycle system for these metal Pending JP2003147453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001383769A JP2003147453A (en) 2001-11-13 2001-11-13 Low temperature flow-down refining to tin, lead and solder and recycle system for these metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001383769A JP2003147453A (en) 2001-11-13 2001-11-13 Low temperature flow-down refining to tin, lead and solder and recycle system for these metal

Publications (1)

Publication Number Publication Date
JP2003147453A true JP2003147453A (en) 2003-05-21

Family

ID=19187633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001383769A Pending JP2003147453A (en) 2001-11-13 2001-11-13 Low temperature flow-down refining to tin, lead and solder and recycle system for these metal

Country Status (1)

Country Link
JP (1) JP2003147453A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1908853A1 (en) * 2005-07-26 2008-04-09 Nihon Superior Sha Co., Ltd METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN
CN106834744A (en) * 2017-01-04 2017-06-13 长沙汇聚环境技术有限公司 A kind of method of Separation of Tin and copper from tin plating waste cupron
CN110453072A (en) * 2019-08-05 2019-11-15 湖北金洋冶金股份有限公司 A method of extracting metallic tin from lead-acid accumulator
CN116904793A (en) * 2023-09-13 2023-10-20 广州先艺电子科技有限公司 Purifying remelting method for gold-tin alloy return material

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1908853A1 (en) * 2005-07-26 2008-04-09 Nihon Superior Sha Co., Ltd METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN
EP1908853A4 (en) * 2005-07-26 2010-03-17 Nihon Superior Sha Co Ltd METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN
EP2377956A1 (en) * 2005-07-26 2011-10-19 Nihon Superior Sha Co., Ltd Device for copper precipitation in lead-free solder, granulation and separation of (cux) 6sn5 compounds and recovery of tin
CN106834744A (en) * 2017-01-04 2017-06-13 长沙汇聚环境技术有限公司 A kind of method of Separation of Tin and copper from tin plating waste cupron
CN110453072A (en) * 2019-08-05 2019-11-15 湖北金洋冶金股份有限公司 A method of extracting metallic tin from lead-acid accumulator
CN116904793A (en) * 2023-09-13 2023-10-20 广州先艺电子科技有限公司 Purifying remelting method for gold-tin alloy return material
CN116904793B (en) * 2023-09-13 2023-12-19 广州先艺电子科技有限公司 Purifying remelting method for gold-tin alloy return material

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