JP2003145303A - Chamfering method and chamfering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chamfering method and a chamfering device capable of conducting chamfering while minimizing abrasion of a chamfering part such as a cutter and effects of deflection of an origin position of a chamfering means. SOLUTION: Images of a part M to be chamfered are taken to make circumferential position relation in chamfering clear, and chamfering quantity L is determined based on the images. A processing position of the chamfering means is corrected based on the chamfering quantity L.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering method and a chamfering device. More specifically, it relates to a chamfering method and a chamfering apparatus with improved chamfering accuracy.

[0002]

2. Description of the Related Art Conventionally, round rods and the like have been chamfered at their edges and shipped to users. In this chamfering process, it is important to keep the variation in chamfering amount within a predetermined range. This is because if the chamfering amount is too small, the user may damage the cutting device when cutting with a cutting device such as a pipe cutter, while if the chamfering amount is too large, the yield will be reduced.

Therefore, in order to realize highly accurate chamfering, for example, in Japanese Patent Laid-Open No. 2001-38514, FIG.
An automatic chamfering device as shown in 0 has been proposed.

This automatic chamfering device S'is provided with a workpiece W '.
And a chamfering mechanism 102 for chamfering the workpiece W ′ held by the holding mechanism 101.
With.

The chamfering mechanism 102 is capable of advancing and retracting and facing the end surface of the workpiece W'and is vertically movable.
03, a cutter body 104 that is rotatably provided on the front surface of the spindle head 103, and a positioning rod 105 that is provided so as to be capable of advancing and retreating on the axis of the cutter body 104, and is incorporated in the front portion of the cutter body 104. Required number of cutting chips 104a
The chamfering process is performed by cutting the edge portion of the workpiece W'by (see FIG. 11).

Next, with reference to FIG. 11, chamfering of the workpiece W'by the automatic chamfering device S'having such a configuration will be described.

(1) The spindle head 103 is moved up and down based on the outer diameter value information of the workpiece W ', and the axis of the cutter body 104 and the workpiece W'are aligned.

(2) After the cutter body 104 is advanced from the standby position I ₀ to the positioning position I ₁ (see FIG. 11 (a)), the positioning rod 105 is advanced by a predetermined amount to move the end surface of the workpiece W '. Positioning at the reference position CR (Fig. 11
(See (b)).

(3) After the positioning rod 105 is retracted to its original position, the cutter body 104 is rotationally driven and the cutter body 104 is advanced to the machining position I ₂ to move the workpiece W ′ end edge portion. It is cut and chamfered (see FIG. 11C).

That is, this automatic chamfering device S'cuts by performing the cutting in a state where the cutter body 104 and the workpiece W'are aligned with each other and the workpiece W'end surface is positioned at the reference position CR. It is intended to realize highly accurate chamfering.

However, in this automatic chamfering apparatus S ', when the cutting tip 104a wears, the cutting amount becomes too small, while when the tip of the positioning rod 105 wears, the end surface of the workpiece W'bevels more than the reference position CR. There is a problem in that the machining amount is positioned on the side of the processing unit 102, which results in an excessive amount of cutting.

Further, if the origin position (standby position) I ₀ of the cutter body 104 deviates for some reason, the positioning position I ₁ and the machining position I ₂ also deviate, and desired chamfering cannot be achieved. There are also problems.

Further, when there is a deviation in the vertical origin position of the spindle head 103 or when there is a large error between the outer diameter value information of the workpiece W'and the actual outer diameter, the cutter body 104.
There is also a problem that the axial center of the workpiece W ′ and the axial center of the workpiece W ′ are misaligned to cause uneven cutting, and the chamfering amount varies in the circumferential direction.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and minimizes the effects of abrasion of chamfered parts such as cutters and deviation of the origin position of the chamfering means. An object of the present invention is to provide a chamfering method and a chamfering device that can perform chamfering while suppressing the chamfering.

[0015]

The chamfering method of the present invention comprises:
The chamfered portion is imaged so that the positional relationship in the circumferential direction during chamfering can be understood, and the chamfered amount is calculated from the captured image,
The machining position of the chamfering means is corrected based on the chamfering amount.

In the chamfering method of the present invention, it is preferable to correct the amount of advance of the chamfering means based on the deviation of the average chamfering amount from the target chamfering amount.

Further, in the chamfering method of the present invention, it is preferable to correct the height of the chamfering means based on the amount of uneven chamfering.

Further, in the chamfering method of the present invention,
Imaging is preferably done while illuminating the chamfer without illuminating the end face on which it is formed.

Further, in the chamfering method of the present invention,
Imaging is preferably performed while rotating the material to be processed.

On the other hand, the chamfering device of the present invention takes an image of the chamfered portion so that the positional relationship in the circumferential direction at the time of chamfering can be understood, calculates the chamfering amount from the captured image, and based on the chamfered amount, the chamfering processing means Is configured to correct the machining position of.

Specifically, the chamfering device of the present invention includes a chamfering portion, a chamfering amount measuring portion for measuring the chamfering amount by the chamfering portion, and a chamfering portion for the workpiece to be chamfered. And a transfer means for transferring the chamfering portion, the chamfering portion has a chamfering means whose advancing amount and height are adjustable, and the chamfering amount measuring portion is a light source for illuminating the chamfering portion, Based on the chamfering amount calculated by the image processing unit that calculates the chamfering amount based on the image captured by the image capturing unit And a machining position correcting section for correcting the machining position of the chamfering means.

In the chamfering device of the present invention, it is preferable that the amount of advance of the chamfering means is corrected based on the deviation of the target chamfering amount of the average chamfering amount.

Further, the chamfering device of the present invention is preferably constructed so as to correct the height of the chamfering processing means based on the amount of uneven chamfering.

Further, in the chamfering device of the present invention,
It is preferable that the imaging is performed while illuminating the chamfer without illuminating the end face on which it is formed.

Further, in the chamfering device of the present invention,
It is preferable that the imaging is performed while rotating the workpiece.

Further, in the chamfering device of the present invention,
It is preferable that an image pickup means for picking up an image of the chamfered portion is provided adjacent to the chamfering processing means.

Further, in the chamfering device of the present invention,
It is preferable that the transfer means is configured to transfer from the chamfering portion to the chamfering amount measuring portion without substantially changing the circumferential positional relationship of the end surface of the workpiece.

[0028]

Since the present invention is constructed as described above, while minimizing the effects of wear of parts of the chamfering means such as a cutter and deviation of the origin position of the chamfering means,
Can be chamfered.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described based on the embodiments with reference to the accompanying drawings, but the present invention is not limited to such embodiments.

FIG. 1 shows a block diagram of a chamfering apparatus to which a chamfering method according to an embodiment of the present invention is applied, and FIG. 2 is a schematic perspective view of a main part.

The chamfering device S includes a chamfering portion 10 for chamfering an edge portion of the workpiece W, and a chamfering portion 10.
Chamfering amount measuring unit 50 for measuring the chamfering amount, a transfer mechanism 60 for transferring the workpiece W from the chamfering processing unit 10 to the chamfering amount measuring unit 50, the chamfering processing unit 10, the chamfering amount measuring unit 50 and the transfer mechanism. Control device 70 for controlling mounting mechanism 60
And become the main components.

As shown in FIGS. 2 and 3, the chamfering section 10 has a support mechanism 2 for supporting the workpiece W so that it can be moved back and forth.
0 and a holding mechanism 30 for holding the workpiece W at the reference position
And a chamfering mechanism (chamfering means) 40 for chamfering the workpiece W held by the holding mechanism 30.

The support mechanism 20 includes roller bases 21, 21 installed on the support base B ₁ so as to be separated from each other in the longitudinal direction of the workpiece W.
And a support roller 22 rotatably arranged on the roller base 21. The support roller 22 is, for example, a claw type roller.

The holding mechanism 30 is disposed in front of the support mechanism 20 and has a lower holding member 31 on which the vicinity of the chamfered end portion of the workpiece W is placed, and is arranged above the lower holding member 31 to be movable up and down. And the upper holding member 32, and the workpiece W is held at the reference position by sandwiching the workpiece W by the lower holding member 31 and the upper holding member 32.

The lower holding member 31 is composed of a pair of front and rear V blocks 31b and 31b arranged on the machine frame 31a. The upper holding member 32 is, for example, a flat plate, and is attached to the tip of a piston rod 32c of a holding cylinder 32b arranged upside down on a machine frame 32a so as to be movable up and down.

The chamfering mechanism 40 is capable of advancing and retreating in opposition to the end surface of the workpiece W and is capable of moving up and down.
And a surface of the spindle head 41 facing the workpiece W end surface (hereinafter,
Cutter body 42 rotatably arranged on the front side)
And a drive motor 43 that rotationally drives the cutter body 42,
A forward / backward drive mechanism 44 for moving the spindle head 41 back and forth, and a spindle head 4
It comprises an elevating mechanism 45 for elevating and lowering 1 and a positioning mechanism 46 for positioning the end surface of the workpiece W at the reference position.

The spindle head 41 is slidably disposed on a pair of guide rails 48, 48 (only one of which is shown) disposed parallel to the end surface of the workpiece W on the horizontal upper surface of the bed 47. There is. This allows the spindle head 41 to move forward and backward so as to face the end surface of the workpiece W. Further, a spindle 41 a is arranged inside the spindle head 41 in parallel with the guide rail 48 and rotatably.

Specifically, the main shaft 41a is arranged such that one end (front end) of the main shaft 41a projects from the front surface of the main spindle head 41, and the cutter main body 42 aligns its axial center with the projecting end. It is attached and rotatable integrally.
Although not clearly shown on the main shaft 41a,
A positioning rod insertion hole, through which a positioning rod 46a, which will be described later, of the positioning mechanism 46 is inserted, has its axis centered on the main shaft 41.
The through hole is formed so as to match the axis of a.

The cutter body 42 has a plurality of cutting tips 42a built in its front portion, and the positioning rod insertion hole 4 communicating with the positioning rod insertion hole 4 of the main shaft 41a.
2b is formed so that its axis coincides with the axis of the cutter body 42 (see FIG. 8). This cutter body 42
The configuration is the same as that of the cutter main body described in Japanese Patent Laid-Open No. 2001-38514, and thus detailed description thereof will be omitted.

The drive motor 43 is disposed above the rear surface of the spindle head 41, and its drive shaft is connected to the spindle 41a via a gear transmission system (not clearly shown) to rotate the spindle 41a. By making the cutter body 4
2 is driven to rotate.

The advancing / retreating drive mechanism 44 is, for example, a feed screw mechanism. The feed screw 44a is arranged in parallel between the guide rails 48, and the feed screw 44a is arranged at the rear end of the bed 47 to rotate the feed screw 44a. A servo motor 44b for driving is provided, and a nut body (not shown) provided on the bottom surface of the spindle head 41 is screwed onto the feed screw 44a.

Here, the feed screw 44a is the cutter body 4
2 has a length that allows it to be moved back and forth between the standby position I ₀ and the processing position I ₂ (see FIG. 8). In the present embodiment, one end (tip) of the feed screw 44a is the front end of the bed 47. Part is rotatably supported, while the other end (base end) is connected to the servo motor 4 via a means such as a coupling.
It is connected to the drive shaft 4b. Also, the servo motor 4
4b is provided with a rotation angle detecting means 44c, for example, an encoder, and a control unit 71, which will be described later, can monitor the moving position of the spindle head 41 and position the spindle head 41 at a desired position.

The elevating mechanism 45 is arranged below the bed 47 to elevate the bed 47 and thereby elevate the spindle head 41. For example, the elevating mechanism 45 is provided with a guide member around a ball screw. It

The positioning mechanism 46 includes a positioning rod 46a which is inserted into the positioning rod insertion holes of the main shaft 41a and the cutter body 42 so as to be able to move forward and backward, and a positioning rod which is arranged on the rear surface of the main spindle head 41 and drives the positioning rod 46a forward and backward. And a cylinder 46b.

As shown in FIG. 8, the positioning rod 46a moves back and forth between a retracted position housed in the positioning rod insertion hole 42b and an operating position protruding from the front end face of the cutter body 42. The positioning rod 46a is
Specifically, when the cutter body 42 moves to the positioning position I ₁ , the cutter body 42 projects to the operating position and pushes the end surface of the workpiece W back to the reference position CR for positioning. Therefore, the amount of protrusion of the positioning rod 46a in the operating position from the front end surface of the cutter body 42 is determined by the positioning position I ₁
Is equal to the distance between the front end face of the cutter body 42 and the reference position CR. Also, the positioning rod 46a
Since the workpiece W is pushed back and positioned by the above, the reference position CR is set to the support mechanism 20 and the holding mechanism 30.
It is set closer to the holding mechanism 30 than the position of the end surface of the workpiece W in the initial state when it is carried in and placed on.

As shown in FIGS. 1, 2 and 4, the chamfering amount measuring unit 50 detects a rotation angle of the workpiece W and a supporting / rotating mechanism 51 that supports and rotates the workpiece W. A rotation angle detection means 52, a light source 53 for illuminating the chamfered portion M of the workpiece W supported by the support rotation mechanism 51,
An image capturing unit 54 that captures the chamfered portion M illuminated by the light source 53, and an image that calculates the chamfered amount L by performing predetermined image processing and arithmetic processing on the image data of the chamfered portion M captured by the image capturing unit 54. A processing position correction unit 56 that corrects the position of the spindle head 41 during chamfering based on the calculation results of the processing calculation unit 55 and the image processing calculation unit 55, more specifically, the deviation of the chamfering amount L from the specified amount. With.

Here, the image processing calculation unit 55 and the processing position correction unit 56 are specifically configured by the control device 70. Further, the chamfering amount L is calculated by measuring
It is defined as the width of the projection plane M ′ when viewed from a direction parallel to the central axis P of.

The supporting / rotating mechanism 51 includes a driving portion having a pair of left and right driving rollers 51a and 51b formed in a V shape, and a driven portion having a pair of left and right driven rollers (not shown) formed in a V shape. And are arranged at a predetermined interval. Then, with the workpiece W placed on the drive roller 51,
The workpiece W is rotated by rotationally driving a and 51b. The support rotation mechanism is not limited to the above, and various known support rotation mechanisms can be used.

The rotation angle detecting means 52 is a driving roller 51a.
Is a rotary encoder, for example, a rotary encoder.

In the light source 53, the optical axis 53a forms a predetermined angle θ ₅₃ with the end face so that the chamfered portion M is illuminated and the end face is not illuminated.
It is arranged so that

The image pickup means 54 includes an optical lens 54a and a CC.
The D line sensor 54b and the chamfered portion M illuminated by the light source 53 can be imaged on an optical axis substantially parallel to the central axis P of the workpiece W, and at a position where reflected light from the side surface is not received. Will be placed.

The optical lens 54a forms an image of the chamfered portion M illuminated by the light source 53 on the CCD line sensor 54b.

The CCD line sensor 54b converts the image of the chamfered portion M formed by the optical lens 54a into image data and outputs it. That is, the CCD line sensor 54
Reference numeral b denotes a sensor in which light receiving elements (not shown) are linearly arranged in a one-dimensional manner, and charges corresponding to the amount of light received are accumulated in each light receiving element. The accumulated charges are simultaneously transferred from each light receiving element to a CCD register (not shown) at a predetermined cycle (for example, 100 MHz), sequentially transferred in the CCD register, and output to the outside.

The image processing calculation section 55 includes the rotation angle detecting means 5
Based on the detected value of 2 and each image data (output signal) output from the CCD line sensor 54b in a predetermined cycle,
The chamfering amount L at each position on the circumference of the chamfered portion M is calculated over the entire circumference. Specifically, the image processing calculation unit 55 calculates the chamfering amount L by performing binarization and threshold processing on each image data. The principle of calculating the chamfering amount will be described with reference to FIG.

As shown in FIG. 5, by binarizing, the output signal waveform of the CCD line sensor 54b shows a high brightness portion M ₁ which is an area corresponding to the chamfered portion M and a portion outside the workpiece W. First low-intensity part M that is a region corresponding to the region
₂ and a second low-intensity portion M ₃ that is a region corresponding to the end surface of the workpiece W are formed. Therefore, the threshold value V _r is set in order to extract the high-intensity part M ₁ from the output signal of the CCD line sensor 54b, and then the output signal value V of the CCD line sensor 54b corresponds to the area exceeding the threshold value V _r. By calculating the number of light receiving elements, it becomes possible to calculate the length of the high-luminance portion M ₁ , that is, the dimension L ′ of the image of the chamfered portion M by the optical lens 54a. Then, the chamfering amount L can be calculated by converting the dimension L ′ into an actual dimension using the magnification of the optical lens 54a.

FIG. 6 shows an example of a calculation result obtained by calculating the chamfering amount L over the entire circumference of the chamfered portion M by the image processing calculation unit 55.

The machining position correcting section 56 includes a front and rear position correcting means 56a for correcting the front and rear direction position of the spindle head 41 when chamfering the workpiece W, and a vertical position, that is, a vertical position for correcting the height. The position correction means 56b (FIG. 1).
reference).

As shown in FIGS. 6 and 7, the front-rear position correcting means 56a obtains the average chamfering amount L _A based on the calculation result of the image processing calculation section 55, and then the front-rear correction amount is calculated by the equation (1). Calculate X. Here, in the formula (1), L
_T represents the target chamfering amount, and θ represents an acute angle (hereinafter referred to as a chamfering angle) among the angles formed by the chamfered portion M and the end face.
The correction amount X is positive in the direction toward the chamfering mechanism 40.

X = (L _A −L _T ) tan θ (1)

The vertical position correction means 56b finds the decentering amount H, that is, the difference between the maximum chamfering amount Lmax and the minimum chamfering amount Lmin, based on the calculation result of the image processing calculating section 55, and from this decentering amount H (2 ) to calculate the vertical correction amount Y by expression, to determine a correction direction based on the chamfering amount L ₁₈₀ of chamfering amount L ₀ and 180 ° positions in the circumferential direction 0 ° position.

[0061]     Y = H / 2 = (Lmax-Lmin) / 2 (2)

The vertical position correcting means 56b is, specifically,
If L ₀ <L ₁₈₀ , the correction direction is determined to be downward, and L ₀ >
If it is L ₁₈₀ , the correction direction is determined to be the upward direction. Here, the reason for determining the correction direction in this way is as follows.

That is, whether the axial center of the cutter main body 42 is vertically displaced from the axial center of the workpiece W is chamfered at the end face upper end position and the end face lower end position in the state of being held by the holding mechanism 30. It can be known from the quantity.
Specifically, if the chamfering amount at the upper end position is larger than the chamfering amount at the lower end position, it is shifted downward, and if the chamfering amount at the upper end position is smaller than the chamfering amount at the lower end position, it is shifted upward. It will be.

In this embodiment, the workpiece W is transferred from the chamfering processing section 10 to the chamfering amount measuring section 50 without substantially changing the circumferential positional relationship of the end faces by the transfer mechanism 60. For example, since the image is moved in parallel and the position of the upper end of the end face is imaged, the 0 ° position and the 180 ° position in the circumferential direction correspond to the upper end position of the end face and the lower end position of the end face, respectively.

Therefore, if L ₀ <L ₁₈₀ , the downward correction is made, and if L ₀ > L ₁₈₀ , the upward correction is made to eliminate the misalignment between the cutter body 42 and the workpiece W. It is a thing.

The transfer mechanism (transfer means) 60 is, for example, a walking beam, and as described above, it does not substantially change the circumferential positional relationship of the end surface of the workpiece W, and the support roller 22 and the lower support. The workpiece W on the member 31 is transferred to the support rotation mechanism 51. The transfer mechanism 60 is not limited to the walking beam, and various transfer mechanisms can be used, for example, an articulated robot.

The control device 70 controls the chamfering section 10, the chamfering amount measuring section 50 and the transfer mechanism 60.
1 and the image processing calculation unit 55 and the processing position correction unit 56.

The control section 71 includes a holding cylinder 32b, a drive motor 43, a servo motor 44b, a lifting mechanism 45, a positioning cylinder 46b, drive rollers 51a and 51b,
The light source 53 and the image pickup means 54 are instructed to perform various operations described below.

The control device 70 having such a function is, for example, a computer, and a program corresponding to the functions of the respective units 56a and 56b of the control unit 71, the image processing calculation unit 55 and the processing position correction unit 56, that is, a control program,
It is realized by storing an image processing calculation program, a front-back position correction program, and a vertical position correction program.

Next, with reference to FIG. 8, chamfering processing of the workpiece W by the chamfering device S having such a configuration will be described.

(1) Support roller 22 and lower holding member 3
A work piece W is placed on 1.

(2) The elevating mechanism 45 is driven to elevate and lower the spindle head 41 so that the axial center of the cutter body 42 and the axial center of the workpiece W coincide with each other. Here, the ascending / descending amount of the spindle head 41 is preset based on the outer diameter value information of the workpiece W.

(3) The servo motor 44b is driven to advance the cutter body 42 from the standby position I ₀ to the positioning position I ₁ (see FIG. 8A).

(4) The positioning cylinder 46b is driven forward, the positioning rod 46a is advanced from the retracted position to the operating position, and the end surface of the workpiece W is positioned at the reference position CR (see FIG. 8B).

(5) The holding cylinder 32b is driven forward to lower the upper holding member 32 so that the workpiece W is moved to the reference position C.
Hold at R. Further, the positioning cylinder 46b is driven backward to move the positioning rod 46a backward to the retracted position.

(6) The drive motor 43 is driven to rotate the cutter body 42, and the servomotor 44b is driven to advance the spindle head 41 to the machining position I ₂ (FIG. 8).
(See (c)). As a result, the edge W of the workpiece W is cut by the cutting tip 42a and chamfering is performed.

(7) The servomotor 44b is driven to retract the spindle head 41 to the positioning position I ₁ , and the drive motor 43 is stopped. Further, the holding cylinder 32b is driven backward to raise the upper holding member 32 to the original position.

(8) The transfer mechanism 60 transfers the workpiece W from the support roller 22 and the lower holding member 31 onto the support rotation mechanism 51.

(9) Drive roller 51 of support rotation mechanism 51
The workpiece W is rotated by rotationally driving a and 51b, the chamfered portion M is illuminated by the light source 53, and the illuminated portion is imaged by the imaging unit 54.

(10) Based on the output signals of the rotation angle detection means 52 and the image pickup means 54, the image processing calculation section 55
The chamfering amount L is calculated over the entire circumference of the chamfered portion M.

(11) The front-rear position correction means 56a calculates the correction amount X in the front-rear direction based on the calculation result of the image processing calculation section 55. Further, the vertical position correction means 56b calculates the vertical correction amount Y and determines the correction direction.

(12) After stopping the drive rollers 51a and 51b, the workpiece W is unloaded from the support / rotation mechanism 51.

(13) The next workpiece W is supported by the supporting roller 22.
While being placed on the lower holding member 31, the elevating mechanism 45 is driven to correct the vertical position of the spindle head 41 in the determined correction direction by the correction amount Y.

(14) Perform the operations (4) and (5).

(15) The drive motor 43 is driven to rotate the cutter body 42, and the servo motor 44b is driven to advance the cutter body 42 to the correction machining position for chamfering. Here, the corrected machining position is the machining position I.
_It means a position deviated from ₂ by the correction amount X.

(16) The operations (7) to (12) are performed.

(17) Thereafter, the operations (13) to (16) are repeated until chamfering of all the workpieces W is completed. Here, in (15), if the machining position has already been corrected, the immediately preceding corrected machining position is used instead of the machining position I ₂ . That is, the cutter main body 42 is moved from the position immediately before the correction processing position to the position displaced by the correction amount X.
To advance and chamfer.

As described above, according to this embodiment, the chamfering amount of the chamfered workpiece W is measured, and the cutter for chamfering the next workpiece W based on the measured value. Since the position of the main body 42 is corrected, even if the cutting tip 42a or the positioning rod 46a is worn or the origin position of the spindle head 41 is deviated, the influence is eliminated and high accuracy is achieved. Can be chamfered.

[0089]

EXAMPLES Hereinafter, the present invention will be described more specifically based on more specific examples.

Example FIG. 9 shows the measurement results obtained by chamfering two round bars (workpieces) by the chamfering apparatus S of the embodiment and measuring the chamfering amount. Here, FIG. 9 (a)
Shows the measurement result of the first work material, and FIG. 9 (b) shows 1
The measurement result of the second work material subjected to chamfering by correcting the position of the cutter body based on the measurement result of the first work is shown. The target chamfering amount is 3.0 mm, and the chamfering angle θ is 45 °.

Specifically, as shown in FIG. 9A, 1
Since the average chamfering amount L _{A of the} material to be machined was 3.5 mm, the correction amount X in the front-rear direction is calculated to be +0.5 mm. Since the decentering amount H was 0.6 mm and L ₀ <L ₁₈₀ , the vertical correction amount Y was calculated to be 0.3 mm and the correction direction was determined to be downward.

From FIG. 9 (b), the average chamfering amount is 2.9 in the second work material in which the position of the spindle head is corrected.
It is understood that the error between the target chamfering amount of 5 mm and the target chamfering amount is reduced to only 0.05 mm, and the deviation chamfering amount is also reduced to 0.2 mm.

Therefore, according to the chamfering device S, even if the chamfering amount deviates from the target chamfering amount for some reason, or the chamfering amount varies in the circumferential direction,
It is understood that the deviations and variations can be immediately corrected, thereby minimizing the influences thereof and performing highly accurate chamfering.

Although the present invention has been described based on the embodiments and examples, the present invention is not limited to the embodiments and examples, and various modifications can be made. For example, in the embodiment, the spindle head position is corrected each time the chamfering amount is measured, but the present invention is not limited to this, and the calculated correction amount exceeds the set value. The position may be corrected only in this case. Further, in the embodiment, the transfer mechanism transfers the end face from the processing portion to the chamfering amount measurement portion without substantially changing the circumferential positional relationship, but the processing start position is automatically marked on the workpiece. Alternatively, the mark position may be used as a reference position during image capturing.
Further, depending on the size of the material to be processed, the light source and the imaging means may be integrally rotated instead of rotating the material to be processed.

[0095]

As described in detail above, according to the present invention,
The chamfering amount by the chamfering means is fed back for each chamfering, and the excellent effect that high precision chamfering can be achieved by minimizing the effects of abrasion of chamfering parts such as cutters and deviation of the origin position of the chamfering means. can get.

[Brief description of drawings]

FIG. 1 is a block diagram of a chamfering device according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of the same main part.

FIG. 3 is a side view of a chamfering portion of the apparatus.

FIG. 4 is a schematic diagram showing a main configuration of a chamfering amount measuring unit of the apparatus.

FIG. 5 is a schematic diagram showing an example of an output waveform of a CCD line sensor of the measuring section.

FIG. 6 is a graph showing an example of a chamfering amount calculation result by the image processing calculation unit of the measurement unit.

FIG. 7 is a diagram for explaining a principle of calculating a correction amount by a front-back direction position correction unit of the measurement unit.

FIG. 8 is an operation explanatory view of the same chamfering device, and FIG.
Shows the state where the cutter body is advanced to the positioning position, (b) shows the state where the workpiece is positioned at the reference position by the positioning mechanism, and (c) shows the cutting of the edge of the workpiece. Indicates the started state.

9A and 9B are graphs showing the chamfering amount measurement results of the work material of the example, where FIG. 9A shows the measurement result of the first work material, and FIG. 9B shows the second work material. The measurement results of the material are shown.

FIG. 10 is a side view of a conventional automatic chamfering device.

FIG. 11 is an operation explanatory view of the same automatic chamfering device.

[Explanation of symbols]

10 Chamfering section 20 Support mechanism 30 holding mechanism 40 Chamfering mechanism (Chamfering processing means) 41 spindle head 42 cutter body 44 Forward / backward mechanism 45 Lifting mechanism 46 Positioning mechanism 50 Chamfer amount measuring unit 51 Support rotation mechanism 52 Rotation angle detection means 53 light source 54 Imaging means 55 Image processing unit 56 Machining position correction unit 60 Transfer mechanism (transfer means) 70 Control device S chamfering device W Workpiece material M chamfer

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takuya Tomatsu             39 Motomoto-cho, Tokai City, Aichi Prefecture Daido Steel Co., Ltd.             Ceremony Company Chita Factory F term (reference) 3C001 KA01 KB01 TA02 TB03 TD01                 3C022 DD07 DD19                 3C029 AA01 AA40                 3C045 CA07 DA04 DA09

Claims (13)

[Claims] 1. A chamfering part is imaged so that the positional relationship in the circumferential direction at the time of chamfering can be understood, a chamfering amount is calculated from the picked-up image, and the machining position of the chamfering means is corrected based on the chamfering amount. The characteristic chamfering method. 2. The chamfering method according to claim 1, wherein the amount of advance of the chamfering means is corrected based on the deviation of the average chamfering amount from the target chamfering amount. 3. The chamfering method according to claim 1, wherein the height of the chamfering means is corrected based on the amount of uneven chamfering. 4. The chamfering method according to claim 1, wherein the imaging is performed while illuminating the chamfered portion so as not to illuminate the end face on which the chamfered portion is formed. 5. The chamfering method according to claim 1, wherein the imaging is performed while rotating the workpiece. 6. The chamfered portion is imaged so that the positional relationship in the circumferential direction during chamfering can be understood, the chamfering amount is calculated from the captured image, and the machining position of the chamfering means is corrected based on the chamfered amount. A chamfering device characterized by being configured. 7. A chamfering portion, a chamfering amount measuring portion for measuring a chamfering amount by the chamfering portion, and a transfer means for transferring a workpiece from the chamfering portion to the chamfering amount measuring portion. The chamfering unit has a chamfering unit whose advancing amount and height are adjustable, and the chamfering amount measuring unit captures an image of the light source that illuminates the chamfering unit and the chamfering unit irradiated by the light source. Image processing means for calculating the chamfering amount based on the image captured by the image capturing means, and the processing position of the chamfering processing means based on the chamfering amount calculated by the image processing calculation portion. A chamfering device comprising a processing position correction unit for correction. 8. The chamfering device according to claim 6, wherein the chamfering device is configured to correct the amount of advance of the chamfering means based on the deviation of the target chamfering amount from the average chamfering amount. 9. The chamfering device according to claim 6 or 7, wherein the chamfering means is configured to correct the height of the chamfering means based on the deviation amount. 10. The chamfering device according to claim 6, wherein the chamfering portion is configured to be imaged while illuminating the chamfered portion so as not to illuminate the end face on which the chamfered portion is formed. 11. The chamfering device according to claim 6, wherein imaging is performed while rotating the workpiece. 12. The chamfering device according to claim 6, wherein an image pickup means for picking up an image of the chamfered portion is arranged adjacent to the chamfering processing means. 13. The transfer means is configured to transfer from the chamfering portion to the chamfering amount measuring portion without substantially changing the circumferential positional relationship of the end surface of the workpiece. The chamfering device according to claim 7.