JP2003142830A5 - - Google Patents
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- Publication number
- JP2003142830A5 JP2003142830A5 JP2001333281A JP2001333281A JP2003142830A5 JP 2003142830 A5 JP2003142830 A5 JP 2003142830A5 JP 2001333281 A JP2001333281 A JP 2001333281A JP 2001333281 A JP2001333281 A JP 2001333281A JP 2003142830 A5 JP2003142830 A5 JP 2003142830A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001333281A JP4051194B2 (en) | 2001-10-30 | 2001-10-30 | Multi-layer wiring board with built-in capacitor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001333281A JP4051194B2 (en) | 2001-10-30 | 2001-10-30 | Multi-layer wiring board with built-in capacitor element |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006076657A Division JP4429282B2 (en) | 2006-03-20 | 2006-03-20 | Manufacturing method of wiring board with built-in capacitor element |
| JP2006076656A Division JP4936756B2 (en) | 2006-03-20 | 2006-03-20 | Manufacturing method of ceramic capacitor element for built-in multilayer wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003142830A JP2003142830A (en) | 2003-05-16 |
| JP2003142830A5 true JP2003142830A5 (en) | 2006-05-18 |
| JP4051194B2 JP4051194B2 (en) | 2008-02-20 |
Family
ID=19148575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001333281A Expired - Fee Related JP4051194B2 (en) | 2001-10-30 | 2001-10-30 | Multi-layer wiring board with built-in capacitor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4051194B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4544909B2 (en) * | 2003-05-28 | 2010-09-15 | 京セラ株式会社 | Manufacturing method of multilayer ceramic electronic component |
| JP4457779B2 (en) * | 2004-06-30 | 2010-04-28 | Ｔｄｋ株式会社 | Semiconductor IC built-in substrate |
| KR100674842B1 (en) | 2005-03-07 | 2007-01-26 | 삼성전기주식회사 | Print Circuit Board Having the Embedded Multilayer Chip Capacitor |
| JP4807410B2 (en) * | 2006-11-22 | 2011-11-02 | 株式会社村田製作所 | Multilayer electronic component and manufacturing method thereof |
| KR101452130B1 (en) | 2013-08-30 | 2014-10-16 | 삼성전기주식회사 | Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part |
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2001
- 2001-10-30 JP JP2001333281A patent/JP4051194B2/en not_active Expired - Fee Related