JP2003142378A - System and method of controlling aligner for semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control aligners for semiconductor so as to automatically perform optimum exposure according to the distortion generated, depending on various the conditions of each of the aligner for semiconductor, and to efficiently reduce matching errors to the utmost due to distortion factors without increasing process steps. SOLUTION: This controls system, which contains a plurality of aligners for semiconductor 101 and which controls a variety of exposures in manufacturing semiconductor devices, is constituted, such that in performing a plurality of exposures, an optimum exposure condition for each exposure is selected for practice, based on the distortion generated in each aligner for semiconductor 101.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor exposure apparatus management system for printing a circuit pattern on a wafer, and an apparatus operation for reducing a product alignment error caused by exposure apparatus distortion. It is a thing.

[0002]

2. Description of the Related Art Conventionally, regarding the lens distortion of a semiconductor exposure apparatus, an engineer of a semiconductor manufacturing line manages the measurement result of the lens distortion of each apparatus,
We have selected equipment with a similar distortion tendency and limited the number of machines for each product or process to reduce the alignment error caused by distortion.

[0003]

When the above-described apparatus operation is performed, the operation is often inefficient, such as the concentration of processing lots in a specific semiconductor exposure apparatus. Further, when considering the matching of distortions including the difference in distortion for each exposure illumination mode and the change over time of distortion, there is a problem that the number of man-hours for management by the manufacturing line engineer increases.

Therefore, the present invention has been made in view of the above problems, and a semiconductor exposure apparatus is provided so that optimum exposure is automatically performed according to each distortion that occurs depending on various conditions of the semiconductor exposure apparatus. (EN) Provided are a management system and a management method for a semiconductor exposure apparatus, which can manage and efficiently reduce the alignment error of distortion factors as much as possible without increasing the number of steps and perform highly reliable exposure. With the goal.

[0005]

A semiconductor exposure apparatus management system according to the present invention is a management system that comprises a plurality of semiconductor exposure apparatuses and controls various exposures when manufacturing a semiconductor device. The first means having a function of managing the distortion generated in each of the devices, the illumination conditions, and the measurement timings, and the lot processing data of the semiconductor exposure device, the product name, the process name, and the lot ID. The second means having a function of managing as key information, and the process name of the matching reference process for baking which is the next process are acquired from the product name and the next process name,
Of the alignment reference process based on the lot processing data by the means, third means having the function of acquiring the processing illumination mode, the processing illumination mode, and the processing date and time; and the alignment reference step acquired by the third means. A fourth means having a function of acquiring the distortion data closest to the distortion data managed by the first means from the processing device, the processing exposure illumination mode, and the processing date and time, and the processing exposure illumination mode of the next step. Fifth means having the function of acquiring from the product name and the next process name, the distortion data of the latest processing exposure illumination mode in the exposure apparatus group to be searched for each semiconductor exposure apparatus, and the fourth means. The distortion data obtained by the above and the distortion data obtained by the fifth means are respectively compared and calculated, A sixth means having a function for determining the alignment error of Isutoshon factors, characterized in that a seventh means having a function of displaying the alignment error of the distortion factors obtained by the sixth means.

According to one aspect of the semiconductor exposure apparatus management system of the present invention, when the distortion generated in the semiconductor exposure apparatus is measured using the measurement function of the semiconductor exposure apparatus, it is automatically performed via a network or online. To get the data.

According to one aspect of the semiconductor exposure apparatus management system of the present invention, when the distortion occurring in the semiconductor exposure apparatus is measured by a semiconductor wafer inspection apparatus, data is automatically acquired via a network or online.

In one aspect of the semiconductor exposure apparatus management system of the present invention, the lot processing data by the second means is automatically acquired via a network or online.

According to one aspect of the semiconductor exposure apparatus management system of the present invention, in calculating the alignment error of the distortion factor by the sixth means, the eighth component has a function of calculating a linear component included in the alignment error. Means for displaying the linear component by the display function of the seventh means.

In one aspect of the semiconductor exposure apparatus management system of the present invention, the seventh means displays a shot image when displaying the alignment error of distortion factors, and displays each distortion measurement coordinate position on it. However, it has a function of displaying the alignment error of the distortion factor at the distortion measurement coordinates in a vector form.

In one aspect of the semiconductor exposure apparatus management system of the present invention, the first means uses two numerical values X and Y indicating the amount of deviation from the ideal projection position for each measurement point as the distortion data.

In one aspect of the semiconductor exposure apparatus management system of the present invention, the third means obtains the processing apparatus, the processing illumination mode, and the processing date and time of the alignment reference step, each step for each product. Use the information of the alignment reference process for.

In one aspect of the semiconductor exposure apparatus management system of the present invention, the first means has a function of managing the name of a reticle used for distortion printing when managing distortion and each reticle used for distortion measurement. The fifth means has a function of managing an error that an individual has, and the fifth means has a function of correcting an error component due to the distortion measurement reticle when calculating a distortion factor matching error.

A semiconductor exposure apparatus management system according to the present invention is a management system that includes a plurality of semiconductor exposure apparatuses and controls various types of exposure when manufacturing a semiconductor device. It is characterized in that the semiconductor exposure apparatus in the optimum exposure state is selected for each exposure based on the distortion that occurs in step 1 and the exposure is sequentially performed.

In one aspect of the semiconductor exposure apparatus management system of the present invention, the distortion is managed for each semiconductor exposure apparatus, for each illumination condition, and for each measurement timing, and optimal for each exposure based on these differences. The semiconductor exposure apparatus in the exposed state is selected and executed.

A semiconductor exposure apparatus management method of the present invention is a management method for controlling various exposures when a semiconductor device is manufactured, comprising a plurality of semiconductor exposure apparatuses, wherein distortion generated in the semiconductor exposure apparatus is A first step of managing each apparatus, each lighting condition, and each measurement timing, and a second step of managing lot processing data of the semiconductor exposure apparatus with a product name, a step name, and a lot ID as key information. And the process name of the matching reference process for printing is obtained from the product name and the next process name, and the processing device, the processing illumination mode, and the processing date and time of the matching reference process are obtained based on the lot processing data by the second means. From the third step to be acquired, the processing apparatus, the processing exposure illumination mode, and the processing date and time of the alignment reference step acquired in the third step, the first process is performed. The fourth process that obtains the closest distortion data from the distortion data managed by, and the process exposure illumination mode that is acquired from the product name and the next process name, and the latest process exposure illumination mode in the exposure device group to be searched. Distortion data of the fifth step of acquiring for each of the semiconductor exposure apparatus, the distortion data acquired in the fourth step, and the distortion data acquired in the fifth step are respectively compared and calculated, It is characterized by comprising a sixth step of obtaining a distortion factor alignment error and a seventh step of displaying the distortion factor alignment error obtained in the sixth step.

According to one aspect of the semiconductor exposure apparatus management method of the present invention, when the distortion generated in the semiconductor exposure apparatus is measured using the measurement function of the semiconductor exposure apparatus, it is automatically performed via a network or online. To acquire data.

According to one aspect of the semiconductor exposure apparatus management method of the present invention, when the distortion generated in the semiconductor exposure apparatus is measured by a semiconductor wafer inspection apparatus,
Data is automatically acquired via the network or online.

In one aspect of the semiconductor exposure apparatus management method of the present invention, the lot processing data in the second step is automatically acquired via a network or online.

In one aspect of the method for controlling a semiconductor exposure apparatus of the present invention, when the alignment error of the distortion factor is calculated in the sixth step, a linear component included in the alignment error is calculated, and the seventh step is performed. The linear function is displayed by the display function in.

In one aspect of the method for controlling a semiconductor exposure apparatus of the present invention, in the seventh step, a shot image is displayed when the alignment error of the distortion factor is displayed,
Each distortion measurement coordinate position is displayed on it, and the alignment error of the distortion factor at the distortion measurement coordinate is illustrated in vector form.

In one aspect of the method for controlling a semiconductor exposure apparatus of the present invention, in the first step, two numerical values, X and Y, indicating the amount of deviation from the ideal projection position for each measurement point are used as the distortion data.

In one aspect of the semiconductor exposure apparatus management method of the present invention, when the processing apparatus, the processing illumination mode, and the processing date and time in the alignment reference step are acquired in the third step, each processing is performed for each product. Use the information of the alignment reference process for the process.

In one aspect of the semiconductor exposure apparatus management method of the present invention, in managing the distortion in the first step, management of names of reticles used for distortion printing and individual reticles used for distortion measurement are performed. Error management is performed, and in the fifth step, when calculating the alignment error of the distortion factor, the error component due to the distortion measurement reticle is corrected.

The storage medium of the present invention is a computer-readable medium that stores a program for executing the steps of the semiconductor exposure apparatus management method.

In the present invention, since the difference in distortion between semiconductor exposure apparatuses is compared, the semiconductor exposure apparatus and the online function or a semiconductor exposure apparatus management system connected to the online function by a network independent of each other is used. Data management for a plurality of exposure apparatuses and calculation between data across a plurality of exposure apparatuses are performed. As the data to be managed, distortion data for managing the lens distortion of the exposure apparatus, lot processing data for managing the wafer processing, and product information data for managing the product alignment tree are managed. As the processing apparatus, an apparatus having a lens distortion that is well matched to the lens distortion of the alignment target layer that has already been printed on the wafer is selected.

Although the system is described as existing outside the semiconductor exposure apparatus here, a computer in the semiconductor exposure apparatus may be network-connected and a distributed system may be provided in an environment in which those computers are network-connected. .

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments to which the present invention is applied will be described in detail with reference to the drawings. FIG. 1 is an overall view showing a management system of a semiconductor exposure apparatus of this embodiment. In the figure, 101 is a semiconductor exposure apparatus, 102 is a computer called a normal console in the semiconductor exposure apparatus, 103 is a control computer called a main sequence, and 104 is a server computer of a semiconductor exposure apparatus management system. Some of the 104
There is a database management system 105, and the data managed by the database management system includes a distortion management database 106, a lot processing management database 107, and a product information database 108. In this embodiment, the database management system is used to manage such information, but the information management may be performed by a normal file system without necessarily using the database management system.

Reference numeral 109 is a client computer of the semiconductor exposure apparatus management system. At 109, two systems, a user interface unit denoted by 110 and a data processing unit denoted by 111, are operating.

Reference numeral 112 denotes a network in the semiconductor factory, to which 101, 104 and 109 are respectively connected to perform data communication.

Here, the distortion measurement pattern managed in the present embodiment is a 3 × 3 nine-point pattern as shown in FIG. 2, and the measurement coordinates are also as shown in the table included in FIG. The outer frame indicated by 201 indicates the exposure area of the exposure apparatus, and the plots indicated by 202 to 210 indicate the respective measurement points.

The measurement point coordinates corresponding to each point are shown in the table 220. In this table, 221 is the ID of the measurement point that uniquely identifies the measurement point, 222 is the X coordinate of the measurement point corresponding to that ID, and 223 is the Y coordinate. The correspondence between each ID and each measurement point is as follows: 202 is ID-1, 203 is ID-2, 204 is ID-3, 205 is ID-4, 20
6 is ID-5, 207 is 1D-6, 208 is ID-7,
209 is ID-8 and 210 is 1D-10.
In the present embodiment, the displacement components of X and Y at each of the nine points are used as distortion.

An example of construction of the distortion management database is shown in FIG. The distortion management database is roughly divided into three. Reference numeral 301 denotes distortion measurement reticle error information, which is a table showing a reticle drawing error of a reticle used for distortion measurement, 30
2 is a reticle identification 1D, 30 that uniquely identifies the reticle
Reference numeral 3 denotes a measurement coordinate ID, which indicates the same coordinate as the ID shown in FIG. 304 is a reticle drawing error in the X direction corresponding to the reticle identification ID and the measurement coordinate ID.
5 is the reticle drawing error in the Y direction. In this example, for one reticle, there is information corresponding to nine measurement points, that is, information indicated by 306. In 301,
Although the information for two reticles is shown, in reality,
There is data for the number of reticles used for distortion measurement.

Reference numeral 311 is a distortion measurement coordinate table, which is a table for connecting the distortion measurement coordinates and the measurement point ID, and is similar to the table in FIG. Reference numeral 312 indicates the measurement coordinate D. 313 is an X coordinate corresponding to the measurement coordinate ID, and 314 is a Y coordinate.

Reference numeral 321 is a distortion measurement data table in which measurement values corresponding to each measurement point ID are stored. 322 is an apparatus ID for uniquely identifying the exposure apparatus
Is shown. Reference numeral 323 indicates the measurement date and time when the distortion was measured, and reference numeral 324 indicates the reticle identification ID of the reticle used for the measurement.

Reference numerals 325 and 326 represent the measured distortion illumination modes, and 325 represents NA.
6 indicates Sigma. Reference numeral 327 is a measurement coordinate D corresponding to each measurement coordinate. 328 and 329 are
The distortion measurement values correspond to the respective measurement points, and 328 indicates X and 329 indicates Y measurement values, respectively. Here, one set of measurement data specified by the device measurement timing illumination mode is the data indicated by 330. In this embodiment, there are 9 points of data.

An example of construction of the lot processing management database is shown in FIG. 401 is lot processing management information, and 402
Is a lot ID that uniquely identifies a lot, 403 is a product ID that identifies a product corresponding to lot processing, 404 is a process ID that identifies a lot processing step, and 405 is an apparatus ID that identifies an exposure apparatus that has performed processing. is there. Reference numeral 406 denotes a processing start time that specifies the date and time when the processing is performed.

An example of construction of the product information database is shown in FIG. 501 is product information, which describes an alignment tree and an exposure illumination mode for each product. A product 1D 502 uniquely identifies the product. Here, only the product information of one product is shown.
A step 1D 503 uniquely identifies the step. 504
Is a process sequence number that indicates the order of the exposure processes that form the product. Has become. Reference numeral 505 denotes an alignment target layer indicating which process the corresponding process performs alignment. The aligner is required to properly align and expose the alignment target layer 505. Reference numerals 506 and 507 indicate illumination modes used for exposure. Reference numeral 506 indicates NA, and 507 indicates Sigma.

A method of collecting distortion data will be described. First, an example of measuring distortion data with a semiconductor exposure apparatus will be described. Usually, when performing distortion measurement with a semiconductor exposure apparatus, after the distortion pattern is printed, the developed wafer is measured again using the alignment measurement system of the semiconductor exposure apparatus.

As the distortion baking method,
As shown in FIG. 6, first, a blanket overall baking is performed. On the reticle used at that time, marks such as 621 are arranged at the coordinates corresponding to the measurement points 602 to 610. Here, since an example using a positive resist is shown, the hatched portion 621 indicates a light-shielding portion made of chrome. In this batch baking, the 621 mark is projected onto the position displaced by the distortion of the lens and is exposed on the wafer. This whole surface is baked, and the stage is used as a reference, as shown in 701 to 709 of FIG.
When the mark 721 is exposed so as to be overlapped with 2 to 610 respectively, this mark is also an example of using positive resist like 621, and therefore the hatched portion indicates a light shielding portion by chrome.

The same mark on the reticle is used as the mark 721 used when exposing each shot of 701 to 709. The image of the layout printed in this way is shown in FIG. The image after development of the measurement points 802 to 810 is 821. In 821, the hatched portion is the portion where the resist remains. actually,
8 if lens distortion is present
The mark image in which the resist in 21 is missing is biased to either side in the surrounding mark where the resist remains.

At the time of distortion measurement, distortion can be measured at each point by measuring this deviation.

At the time of actual measurement, it can be obtained by calculation by measuring each dimension shown in FIG.
As a calculation formula, when the distortions of X and Y are Xdis and Ydis respectively, Xdis = (XR-XL) / 2 Ydis = (YU-YD) / 2.

This measurement may be carried out by using the measuring function of the exposure apparatus or by using the measuring function of an external measuring device.

Of the above, on the premise that the measurement is performed by the exposure apparatus, the distortion data at each point is measured by the control computer 103 in FIG. 1 and transmitted to the console computer 102. 102 console computers pass through 112 networks, and 104
106 in the management system supercomputer indicated by
To the distortion database of 105 via the database management system. However, it is necessary to transmit all the items of the distortion measurement data shown in 321 of FIG. 3 to the data transmitted here.

By transmitting in this manner, the history is managed in the form of giving a date for each device and each exposure illumination mode. The above is the method for acquiring distortion data.

A method of acquiring lot processing data will be described. When performing lot processing with the semiconductor exposure apparatus, the console computer shown at 102 in FIG. 1 transmits the lot ID, the apparatus ID, the product ID, the process ID, and the processing start date and time to the management system server computer at 104. To do. Similar to the distortion data transmission, it is managed by the lot processing database shown by 107 via the database management system 105. Since the management here is performed in the form shown in FIG. 4, the history of all lot process execution data in each semiconductor exposure apparatus is managed.

The method of setting the product information is input by the user. This input screen is shown in FIG. When a product ID is entered in the cell of which the input operation is 1002 and 1003 is pressed, a list of product information of the product ID currently set is displayed. In that state, one row in the frame 1004 is selected, and addition 1012 or insertion 1013 is pressed. When 1012 is pressed, a new line is added to the line next to the selected line, and items 1006 to 1011 can be input.

When 1013 is pressed, a new line is inserted before the selected line, and items 1006 to 101 can be similarly input. If 1014 is pressed after selecting a row, the selected row is deleted. During these operations, the process sequence No. of 1008 is automatically performed. Shall be reset. The end button 1015 is the end button on the screen of FIG. 10, and at the same time, the setting contents are reflected in the product information database.

The above description is for the part that stores data. From here, the actual flow of processing will be described.
Normally, a lot ID of a lot to be exposed is input from a client computer of the exposure apparatus management system. The input screen is shown in FIG. In FIG. 11, 110
Reference numeral 1 denotes an input screen, and 1102 denotes a text input field for inputting a lot ID. Here, although the input using the keyboard is imagined, the input using a barcode reader, a magnetic field or the like may be used. After inputting the lot ID in 1102, the processing is started by pressing 1103. If you press 1104,
The screen of 1101 is deleted.

The flow of processing after 1103 is pressed will be described with reference to the flowchart of FIG. The number of the flow shown in FIG. 12 is described in parentheses and each process will be described.

(1202) Lot I entered in 1102
D is used to search the lot processing control database of FIG. At this time, a row matching the lot ID of 402 is searched. The latest processing lot is obtained by referring to the processing date and time data 406 of the matching lines. The processing lot obtained here is the exposure step immediately before the step of performing the processing next to the relevant lot. Here, the product ID (403) and the process ID (404) of the immediately preceding exposure processing are acquired.

(1203) Product ID obtained in 1202,
The product information data of FIG. 5 is searched by the process ID, and the process sequence number. (504) is acquired. This process sequence No. Is the process number of the exposure process immediately before the lot ID.

(1204) Step sequence No. obtained in 1203. The number of the next exposure step is obtained by adding 1 to. This process sequence No. The product information data of FIG. 5 is searched for the process ID of the next exposure process using (504), and the alignment target layer (505) and the processing illumination conditions (506) and (507) are obtained. The alignment target layer obtained here indicates the process for which the next exposure process of the lot is the target of alignment.

(1205) With the alignment target layer obtained in 1204 and the product ID obtained in 1202, FIG.
The product information data is searched for to obtain the illumination NA Sigma of the process to be aligned. This illumination condition is an illumination condition in which the process of alignment target of the lot is printed.

(1206) The lot processing data of FIG.
The lot ID (401) specified in 201 and the alignment target layer (404) acquired in 1204 are searched, and the processing device ID (405) and the processing start time (40)
6) is acquired.

(1207) The device ID and (1205) obtained in 1206 for (321) of the distortion data in FIG.
The processed illumination NA Sigma (325), (32
6), and the distortion data (32) closest to the processing start time obtained in 1206 (323).
7), (328), and (329) are acquired. At the same time, the reticle identification ID (324) used for measurement is acquired.
Here, when acquiring the distortion data that is closest in time, you may simply select the one that is close to the measurement time and the processing start time, or you may select the newest one measured before the processing start time. You may use the measurement data which has a measurement date and time.

(1208) The reticle identification ID (302) obtained in 1207 is searched for 301 in FIG. 3, and error components (303), (304) of the reticle factor at each point are searched.
(305) is acquired.

(1209) Based on the error of the reticle factor at each point obtained at 1207 and the error of the reticle factor at each point obtained at 1208, the error component corresponding to the reticle factor is removed from the distortion measured value to obtain a pure distortion component. Extract.

This extraction method is a simple vector subtraction as shown in FIG. Reference numeral 1301 is a measurement point, 1302 is a distortion measurement value obtained in 1207, 1303 is a reticle error component obtained in 1208, and 1304 is a distortion component in which the reticle error is corrected. It is a vector obtained by simply subtracting 1303 from 1302. The correction can be performed by repeating this calculation for each point.

(1210) The distortion data (321) of FIG. 3 is converted into (322), (1204) for each device.
Illumination obtained in step NA Sigma (325), (326)
To obtain the latest distortion data (327), (328), (328), (329) of each device. Reticle identification ID used for each measurement at the same time
(324) is acquired.

(1211) Reticle identification ID (30 corresponding to the latest distortion of each device obtained in 1210)
By (2), (301) in FIG. 3 is searched. The reticle factor errors (303), (304), (305) at each point are acquired. Repeat for the number of devices.

By the same calculation as (1212) 1209, the latest distortion of each pure device after reticle factor error correction is obtained for each device. In this case also, the process is repeated for the number of devices.

(1213) Distortion data of the processing illumination mode, which is close to the processing date and time, and the latest distortion data of the illumination mode of the next exposure step of each apparatus obtained in 1212 are processed by the apparatus in which the alignment target layer is printed by 1209. By comparing, the alignment error at each point of the distortion factor is calculated. This calculation method is a simple vector subtraction as shown in FIG. 1401 is the measurement point,
1402 is a distortion measurement value of the alignment target layer obtained in 1209, 1403 is a distortion measurement value of the latest exposure process of one apparatus obtained in 1212, and 1304 is an alignment error of distortion factors when the respective distortions are combined. . It is a vector obtained by simply subtracting 1403 from 1402. By repeating this calculation for each point and further for each device, the alignment error of the distortion factor of each device can be obtained.

(1214) A linear component of the alignment error is calculated based on the alignment error at each measurement point of the distortion factor obtained in 1213. The method of determining the rotation correction value, the chip magnification correction value, and the shift correction value will be described below.

The measurement coordinates XY corresponding to the measurement coordinates D-1 are PosXi and PosYi, and the corresponding measurement values are DataXi and DataYi (that is, i = ID-
1). The number of measurement coordinate points is n. By the formula shown below,
It is possible to calculate the linear component of the alignment error.
As a premise, the rotation component targeted by the stepper is sufficiently small, and sin θ ≈ tan θ
Is considered.

[0067]

[Equation 1]

[0068]

[Equation 2]

The linear components to be obtained are (Equation 31) to (Equation 3)
6) MagX, MagY, RotX, RotY, Sh
iftX and ShiftY represent the chip magnification X, the chip magnification Y, the chip rotation X, the chip rotation Y, the shift X, and the shift Y, respectively. When a normal step-and-repeat type stepper or the like is used, it is meaningless to divide the chip magnification and the chip rotation into X and Y, and therefore the average value of X and Y may be used.

The alignment error due to the distortion factor at each measurement point is corrected by each linear component obtained here. The correction method can be calculated by the following equation, but (Equation 31)
Since the one calculated by (Equation 36) is a linear component of the alignment error, it is necessary to make all the opposite signs and input them to the following equation. The respective correction values are Mx,
It becomes My, Rx, Ry, Sx, Sy.

[0071]

[Equation 3]

Here, assuming that the corrected error of the distortion factor after correction is DataXi ', DataYi', it can be obtained by the following equation.

[0073]

[Equation 4]

(1215) A list of the respective units is displayed due to the alignment error of the distortion factor after the linear correction or without the correction, which is obtained in 1213 or 1214.

FIG. 15 shows a display example of the list. Each item in FIG. 15 will be described. 1502 displays the lot ID designated in 1201. 1503 displays the product ID retrieved in 1202. 1504 is 1516 to 1527
It is used to switch the judgment order when displaying the processing number list in the cell. Display switching is 151
A mode of an average error value determined by using the larger one of X and Y of the average error values shown in 8 and 1519;
It is possible to select two modes, that is, the maximum error value mode determined by using the larger one of the maximum error value X and Y shown in 0, 1521. It is assumed that the determination order displayed in 1516 to 1527 is recalculated and redisplayed at the timing of changing 1504. 1506-150
The information indicated by 9 is the information of the next exposure process. 15
10 to 1515 are information of the alignment target layer. In 1516 to 1527, the list of determination ranks is displayed as described above.

This display will be described. 1516 is 1
This is the order of determination of 1517 devices in the sort mode selected in 504. Reference numerals 1518 and 1519 denote average error values of X and Y of alignment errors corresponding to the device of 1517. Similarly, 1520 and 1521 are the maximum error values of X and Y, respectively. The larger value of either X or Y is used as the value for determining the judgment order. Reference numerals 1522 to 1527 are linear error components included in the alignment error with the device indicated by 1517. Also, if the setting with linear correction is selected in 1505, 1
The respective error values of 518 to 1521 display the corrected value obtained in 1214. When there is no linear correction, the value obtained in 1213 is displayed. 1529 is a button for ending the screen of FIG.

Further, if one line is selected from the fields 1516 to 1527 and the button 1528 is pressed,
Map display of alignment error with the device of the selected row FIG. 16 showing the snow surface is displayed. 1602 displays the lot ID set in 1201. 1603 is 120
The product ID acquired in 2 is displayed. 1605-16
Reference numeral 09 indicates the information of the next exposure process and the processing apparatus ID of the target displayed on the map 1616. 1610-16
Reference numeral 15 indicates information on the alignment target layer as in FIG. In 1616, the amount of deviation at each measurement coordinate caused by the distortion factor is displayed as a vector map.

Reference numeral 1617 displays the numerical data of the data shown in 1616 in a cell. Reference numeral 1618 indicates the value of the linear component of the alignment error due to the distortion factor. 1616 and 1617 are displayed as 16
The correction of the linear component shown in 1618 by setting 04 is shown in FIG.
The same procedure as 5 is performed. The button indicated by 1619 is a button for ending the screen of FIG.

As described above, according to this embodiment, the semiconductor exposure apparatus is managed so that optimum exposure is automatically performed according to each distortion that occurs depending on various conditions of the semiconductor exposure apparatus, It is possible to provide a management system and a management method for a semiconductor exposure apparatus that can perform exposure with high reliability by efficiently reducing the alignment error of distortion factors without increasing the number of steps.

Here, in order to operate the various devices so as to realize the functions of the above-described embodiments, the functions of the embodiments are realized for a computer in an apparatus or system connected to the various devices. The program code of the software is supplied and the various devices are operated according to the program stored in the computer (CPU or MPU) of the system or apparatus, which is also included in the scope of the present invention.

Further, in this case, the program code itself of the software realizes the function of the above-mentioned embodiment, and the program code itself and a means for supplying the program code to the computer,
For example, a storage medium storing such program code constitutes the present invention. As a storage medium for storing the program code, for example, a flexible disk, a hard disk, an optical disk, a magneto-optical disk, a CD-RO.
M, a magnetic tape, a non-volatile memory card, a ROM, or the like can be used.

Further, not only the functions of the above-described embodiments are realized by executing the supplied program code by the computer, but also the OS (operating system) or other OS in which the program code is operating in the computer. Needless to say, the program code is also included in the embodiments of the present invention when the functions of the above-described embodiments are implemented jointly by application software and the like.

Further, after the supplied program code is stored in the memory provided in the function expansion board of the computer or the function expansion unit connected to the computer, it is stored in the function expansion board or the function expansion unit based on the instruction of the program. The present invention also includes the case where the CPU or the like provided therein performs a part or all of the actual processing and the functions of the above-described embodiments are realized by the processing.

[0084]

According to the present invention, the semiconductor exposure apparatus is managed so that the optimum exposure is automatically performed according to each distortion that occurs depending on various conditions of the semiconductor exposure apparatus, and the number of steps is increased. It is possible to provide a management system and a management method for a semiconductor exposure apparatus that can perform highly reliable exposure by efficiently reducing the alignment error of distortion factors as much as possible.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an overall configuration of a management system for a semiconductor exposure apparatus according to the present embodiment.

FIG. 2 is a schematic diagram showing measurement coordinates of distortion.

FIG. 3 is a schematic diagram showing a method of managing distortion data.

FIG. 4 is a schematic diagram showing a method of managing lot processing data.

FIG. 5 is a schematic diagram showing a method of managing product information data.

[Fig. 6] Baking of distortion (all-in-one baking)
It is a schematic diagram which shows.

FIG. 7 is a schematic diagram showing distortion baking (stage lattice baking).

FIG. 8: Baking of distortion (after stacking)
It is a schematic diagram which shows.

FIG. 9 is a schematic view showing a distortion measuring method.

FIG. 10 is a schematic diagram showing an input screen for product information.

FIG. 11 is a schematic diagram showing a lot ID input screen.

FIG. 12 is a flowchart showing processing by a management system of a semiconductor exposure apparatus.

FIG. 13 is a schematic diagram for explaining correction of a reticle error.

FIG. 14 is a schematic diagram for explaining calculation of a distortion factor alignment error.

FIG. 15 is a schematic diagram showing a list display screen of a processing machine.

FIG. 16 is a schematic diagram showing a distortion map screen of alignment error.

[Explanation of symbols]

101 semiconductor exposure apparatus 102 computer (console) 103 Control computer (main sequence) 104 server computer 105 database management system 106 distortion management database 107 Lot Processing Management Database 108 Product Information Database 109 client computer 110 user interface 111 system 112 network

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shigeyuki Uzawa             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation (72) Inventor Yasushi Hoshi             5-20-18-706 Kitasuna, Koto-ku, Tokyo (72) Inventor Yumi Yamada             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation F term (reference) 5F046 AA25 AA28 BA03 CB17 DA13                       DD01 DD06 EC05

Claims (21)

[Claims] 1. A management system, comprising a plurality of semiconductor exposure apparatuses, for controlling various exposures when manufacturing a semiconductor device, wherein distortion generated in the semiconductor exposure apparatus is controlled for each apparatus, each illumination condition, and A first means having a function of managing for each measurement timing; a second means having a function of managing the lot processing data of the semiconductor exposure apparatus as a product name, a process name, and a lot ID as key information; The process name of the alignment reference process for baking, which is the process, is acquired from the product name and the next process name, and the processing device, the processing illumination mode, and the processing date and time of the alignment reference process are acquired based on the lot processing data by the second means. Third means having a function of acquiring, a processing apparatus, a processing exposure illumination mode, and a processing of the alignment reference step acquired by the third means. From time to time, a fourth means having a function of acquiring the closest distortion data from the distortion data managed by the first means, and the processing exposure illumination mode of the next step are acquired from the product name and the next step name, Fifth means having a function of acquiring the latest distortion data of the processing exposure illumination mode of the exposure apparatus group to be searched for each semiconductor exposure apparatus; the distortion data acquired by the fourth means; A sixth means having a function of comparing and calculating distortion data acquired by the means to obtain a distortion factor alignment error, and a function of displaying the distortion factor alignment error obtained by the sixth means. 7. A semiconductor exposure apparatus management system comprising the means 7). 2. When the distortion generated in the semiconductor exposure apparatus is measured using the measurement function of the semiconductor exposure apparatus, data is automatically acquired via a network or online. The semiconductor exposure apparatus management system described in 1. 3. The semiconductor exposure apparatus according to claim 1, wherein when a semiconductor wafer inspection apparatus measures distortion generated in the semiconductor exposure apparatus, data is automatically acquired via a network or online. Management system. 4. The semiconductor exposure apparatus according to claim 1, wherein the lot processing data obtained by the second means is automatically acquired via a network or online. Management system. 5. The display means of the seventh means, further comprising: eighth means having a function of calculating a linear component included in the alignment error when the alignment error of the distortion factor is calculated by the sixth means. 5. The semiconductor exposure apparatus management system according to claim 1, wherein the linear component is displayed by. 6. The seventh means displays a shot image when displaying an alignment error of distortion factors, displays each distortion measurement coordinate position on the shot image, and adjusts the distortion factors at the distortion measurement coordinates. The management system for a semiconductor exposure apparatus according to any one of claims 1 to 5, wherein the management system has a function of displaying an error in a vector form. 7. The first means uses, as the distortion data, two numerical values, X and Y, which indicate a deviation amount from an ideal projection position for each measurement point, according to any one of claims 1 to 6. Item 7. A semiconductor exposure apparatus management system according to item. 8. The third means utilizes the information of the alignment reference process for each process for each product when acquiring the processing device, the processing illumination mode, and the processing date and time of the alignment reference process. The semiconductor exposure apparatus management system according to any one of claims 1 to 7. 9. The first means has a function of managing the name of the reticle used for distortion printing when managing distortion, and a function of managing the error of each reticle used for distortion measurement. The semiconductor exposure according to any one of claims 1 to 8, wherein the fifth means has a function of correcting an error component due to a distortion measurement reticle when calculating a distortion factor alignment error. Equipment management system. 10. A management system comprising a plurality of semiconductor exposure apparatuses, for controlling various exposures when manufacturing a semiconductor device, wherein each exposure is performed a plurality of times based on the distortion generated in the semiconductor exposure apparatus. A management system for a semiconductor exposure apparatus, wherein the semiconductor exposure apparatus in an optimum exposure state is selected for each exposure and exposure is performed sequentially. 11. Each semiconductor exposure apparatus, each illumination condition,
11. The semiconductor exposure apparatus according to claim 10, wherein the distortion is managed for each measurement timing, and the semiconductor exposure apparatus in an exposure state optimal for each exposure is selected and executed based on the difference. Management system. 12. A semiconductor exposure apparatus management method comprising a plurality of semiconductor exposure apparatuses and controlling various types of exposure when manufacturing a semiconductor device, wherein a distortion generated in the semiconductor exposure apparatus is illuminated for each apparatus. A first step of managing for each condition and each measurement timing, a second step of managing the lot processing data of the semiconductor exposure apparatus as a product name, a process name, and a lot ID as key information, and a combination for printing. A third step of acquiring the process name of the reference process from the product name and the next process name, and acquiring the processing device, the processing illumination mode, and the processing date and time of the matching reference process based on the lot processing data by the second means. From the process, the processing apparatus, the process exposure illumination mode, and the process date and time of the alignment reference process acquired in the third process, the process is managed in the first process. A fourth step of obtaining the closest distortion data from the distortion data, the processing exposure illumination mode obtained from the product name and the next process name that,
A fifth step of acquiring the distortion data of the latest processing exposure illumination mode in the exposure apparatus group to be searched for each semiconductor exposure apparatus, the distortion data acquired in the fourth step, and the fifth step. And a seventh step of displaying the distortion factor matching error obtained in the sixth step by comparing and calculating the distortion data obtained in A method for managing a semiconductor exposure apparatus, which is characterized by the above. 13. The data is automatically acquired via a network or online when the distortion generated in the semiconductor exposure apparatus is measured by using the measurement function of the semiconductor exposure apparatus. 13. The method for managing a semiconductor exposure apparatus according to item 12. 14. The semiconductor exposure apparatus according to claim 12, wherein when the distortion generated in the semiconductor exposure apparatus is measured by a semiconductor wafer inspection apparatus, data is automatically acquired via a network or online. Management method. 15. The semiconductor exposure apparatus according to claim 12, wherein the lot processing data in the second step is automatically acquired via a network or online. Management method. 16. When calculating the alignment error of the distortion factor in the sixth step, a linear component included in the alignment error is calculated, and the linear component is displayed by the display function in the seventh step. The method of managing a semiconductor exposure apparatus according to claim 12, wherein the method is a semiconductor exposure apparatus management method. 17. In the seventh step, a shot image is displayed when the alignment error of the distortion factor is displayed, each distortion measurement coordinate position is displayed on the shot image, and the distortion factor of the distortion measurement coordinate is displayed. 17. The method for managing a semiconductor exposure apparatus according to claim 12, wherein the alignment error is shown in a vector form. 18. The method according to claim 12, wherein in the first step, two numerical values X and Y indicating a deviation amount from an ideal projection position for each measurement point are used as the distortion data. 2. The method for managing a semiconductor exposure apparatus according to item 1. 19. In the third step, when the processing device, the processing illumination mode, and the processing date and time of the alignment reference step are acquired, the information of the alignment reference step for each product is used. The method for managing a semiconductor exposure apparatus according to claim 12, wherein the method is a semiconductor exposure apparatus management method. 20. In managing the distortion in the first step, management of a name of a reticle used for distortion printing and management of an error of each reticle used for distortion measurement are executed, 13. The error component due to the distortion measurement reticle is corrected when the distortion factor matching error calculation is performed in the step 5).
20. A method of managing a semiconductor exposure apparatus according to any one of items 1 to 19. 21. A computer-readable recording medium storing a program for executing each of the steps of the method for managing a semiconductor exposure apparatus according to claim 12.