JP2003133774A - Cooling device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool a CPU and its peripheral devices. SOLUTION: A support member 32 is so formed that the path of outside air supplied by a large-diameter fan 31 gradually becomes narrower as the outside air advances, so that the peripheral section of the outside air supplied by the fan 31 is guided to the central section, efficiently hitting a heatsink 33. A tab 81 which is bent inward by a prescribed angle through a bending part 81A is formed on a surface 73-1 of the support member 32, and a part of the outside air supplied by the fan 31 is discharged (flow S) into the gap between an optical disc drive 22 and a hard disc drive 23. A discharge opening 82 is formed on a surface 73-2 of the support member 32. A part of the outside air supplied by the fan 31 is guided along a curved surface of a heat radiation fin 92-1 of the heatsink 33 and discharged (flow T) to the end surface opposed to a mother board 21 of the optical disc drive 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device and electronic equipment, and more particularly to a cooling device and electronic equipment capable of efficiently cooling a CPU and its peripheral devices, for example.

[0002]

2. Description of the Related Art Recently, personal computers have been miniaturized as the integration rate of built-in electronic circuits has been improved, and the processing speed of a CPU mounted therein has been improved.

By the way, in general, when the processing speed of the CPU is improved (that is, the operating clock frequency is increased),
Along with that, power consumption increases and the amount of heat generated increases. Then, if the CPU is overheated to a temperature above a predetermined level, so-called thermal runaway will occur. Therefore,
Usually, a cooling device is installed near the CPU.

The cooling device is composed of, for example, a fan and a heat sink. The heat sink that absorbs the heat of the electronic element is cooled by the air flowing out from the fan, and the cooling air discharged from the heat sink is the CPU.
Have been sent to. As a result, overheating of the CPU is suppressed.

[0005]

However, in a personal computer equipped with a CPU whose heat generation amount is increasing, cooling air having a temperature higher than the outside air is exhausted from the heat sink, so that the devices around the CPU are sufficiently cooled. I couldn't.

Therefore, it is possible to increase the size of the heat sink in order to increase the cooling efficiency, but it has been difficult to install a large heat sink because of space saving.

The present invention has been made in view of the above circumstances, and it is possible to improve the CPU without increasing the size of the heat sink.
And its peripheral devices can be cooled efficiently.

[0008]

The cooling device of the present invention comprises a fan for taking in outside air, a heat sink for absorbing heat generated by electronic elements inside the housing, and a supporting member for supporting the fan and the heat sink. The member is formed such that the flow path of the outside air discharged from the fan is gradually narrowed in the direction in which the outside air flows, and the guide surface that guides the outside air in the direction in which the heat sink is arranged is substantially opposed to the adjacent device. The position is provided with an opening formed in a part of the guide surface.

The support member may be further provided with a discharge port formed in a direction in which the outside air is guided along the curved surface of the fin constituting the heat sink.

The opening can discharge a part of outside air discharged from the fan into a gap between two adjacent devices.

The curved surface of the fin can guide a part of the outside air discharged from the fan to the discharge port and discharge it to a predetermined position of the device.

In the cooling device of the present invention, the heat sink is arranged such that the support member for supporting the fan and the heat sink is such that the flow path of the outside air flowing out from the fan is gradually narrowed in the direction in which the outside air flows. A guide surface for guiding in the direction is formed, and an opening is formed in a part of the guide surface at a position substantially facing the adjacent device.

The electronic device of the present invention has a fan for taking in outside air, a heat sink for absorbing heat generated by electronic elements inside the electronic device, and a cooling device comprising a supporting member for supporting the fan and the heat sink. Is a position where the flow path of the outside air flowing out from the fan is formed so as to become gradually narrower in the direction in which the outside air flows, and the guide surface for guiding the outside air in the direction in which the heat sink is arranged and the position that is almost opposite to the adjacent device. And an opening formed in a part of the guide surface, and the opening discharges a part of the outside air discharged from the fan into a gap between two adjacent devices.

The electronic device of the present invention has a fan that takes in outside air, a heat sink that absorbs heat generated by electronic elements inside the electronic device, and a cooling device that includes a support member that supports the fan and the heat sink. The member forms a guide surface that guides in the direction in which the heat sink is arranged by gradually narrowing the flow path of the outside air discharged from the fan in the direction in which the outside air flows, and substantially faces the adjacent device. An opening is formed in a part of the guide surface at the position where the opening is formed, and a part of the outside air discharged from the fan is discharged into the gap between the two adjacent devices by the opening.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are diagrams showing a configuration example of a personal computer according to the present invention. FIG. 1 shows a configuration example of the entire personal computer, and FIG. 2 shows an enlarged view of a computer main body 2. As shown in the figure, the computer main body 2 of the personal computer 1 is a so-called vertical type that is vertically long when viewed from the front.

The personal computer 1 is composed of a computer main body 2, a keyboard 3, a display 4, and a stand 5 for supporting the display 4.

Inside the computer main body 2, a CPU (Cen
A processing unit such as a tral processing unit) is provided, and various types of processing are executed based on a signal input by operating the operation keys 6 of the keyboard 3. A keyboard cover 7 for shielding the operation keys 6 is supported on the keyboard 3.

The display 4 has a display panel 8
A display screen 9 is provided on the front surface of the computer, and is connected to the computer main body 2 via a connection line 10.

The housing 11 of the computer main body 2 is composed of half covers 12 and 13 joined together through a joint member 14, and is formed in a box-like shape with an open rear surface. An exhaust hole (not shown) for exhausting the air inside the computer main body 2 is provided on the back surface thereof.

An air intake hole 15 is provided on the side surface of the half cover 12 for sucking outside air into the computer main body 2.
Is provided.

On the inner surface of the half cover 13 of the housing 11,
As shown in FIG. 3, a motherboard 21 on which various chip parts are arranged, a CD-ROM (Compact Disc Read-Only)
Memory) or DVD (Digital Versatile Disc), etc. mounted optical disk drive 22, hard disk drive 23, power supply unit 24, riser support 2
5, the chip set 26, and the cooling device 27 are attached to a chassis (neither is shown) via a dedicated holder.

In addition, although not shown, various required parts are mounted. Further, the optical disk drive 22 and the hard disk drive 23 are attached with a predetermined gap, and the cooling device 27 includes the half cover 1
It is attached at a position facing the intake hole 15 provided on the side surface of the second side.

Next, an example of the structure of the cooling device 27 will be described with reference to FIGS.

FIG. 4 shows an external perspective view of the cooling device 27, and FIGS. 5 to 8 show the cooling device 27 of FIG.
The external side view seen from each direction or arrow D direction is shown. 9 shows an external top view of the cooling device 27 of FIG. 4, and FIG. 10 shows an external bottom view of the cooling device 27 of FIG.

The cooling device 27 is located at a position facing the intake hole 15 provided on the side surface of the half cover 12, and
The discharge port 82 of the support member 32 forming the cooling device 27 is
Optical disk drive 22 and hard disk drive 23
Are provided at the positions opposite to each other (FIG. 3), and as will be described later, the outside air sucked from the intake holes 15 is used to cool the optical disk drive 22 and the hard disk drive 23 as heat source devices. The cooling device 27 includes a fan 31, a heat sink 33, and a support member 32 for supporting the fan 31 and the heat sink 33.

First, a configuration example of the fan 31 will be described with reference to FIGS. 11 and 12. FIG. 11 shows FIG.
A sectional view of the fan 31 taken along the line AA shown in FIG. 8 or FIG. 9 (a side sectional view of the fan 31 seen from the arrow A direction in FIG. 4).
FIG. 12 is a top view of the fan 31.

The fan 31 is composed of, for example, a main body 40 made of a material such as synthetic resin and having a large diameter of 80 mm long × 80 mm wide, and can secure a sufficient air flow rate. The half cover 1 is provided in one opening of the fan 31.
A suction port 41 for sucking the outside air (fresh air) sucked in by the intake hole 15 provided in the No. 2 is formed, and an outlet port 42 for discharging the sucked outside air is formed at the other opening. Has been formed.

The main body 40 has a bottom surface (outlet 42 side)
A base 43 for fixing the motor 44 is integrally formed therewith. The terminal 46 at one end of the connection line 45 is connected to the power supply unit 24, and the other end is guided along the base 43 and connected to the motor 44. As a result, the motor 44 is driven by the electric power supplied from the power supply unit 24.

The motor 44 fixed to the base 43 is
It has a rotor 47 that is rotationally driven in a predetermined direction, and rotatably supports the rotor 47. The rotor 47 is provided with a blade body 50 for generating an air flow. The blade body 50 is composed of a plurality of blades 49, and these blades 49 are provided at predetermined intervals in the circumferential direction of the peripheral wall portion 48 of the rotor 47.

Therefore, by driving the motor 44, the rotor 47 is rotated in a predetermined direction, and the blade body 50 generates an air flow (wind) from the outside air (fresh air) sucked in by the suction port 41, and the flow is generated. It flows out from the outlet 42.

Mounting holes 51-1 to 51-4 are formed at the four corners of the upper surface (on the suction port 41 side) of the main body 40.
As will be described later with reference to FIG. 19, mounting screws 111-1,
111-2 is the mounting holes 85-1, 85- of the support member 32.
2 (FIG. 16) through the mounting holes 51-2 and 51-4, respectively, and the fan 31 and the support member 32 are fastened and fixed (FIGS. 5, 7, and 10).

Next, with reference to FIGS. 13 to 16, an example of the structure of the support member 32 will be described. 13 is a side view of the support member 32 seen from the direction of arrow A in FIG.
4 is a cross-sectional view of the support member 32 taken along line BB shown in FIG. 13 (a side cross-sectional view of the support member 32 seen from the arrow B direction in FIG. 4), and FIG. 15 shows the support member 32 in FIG. FIG. 16 is a side view seen from the direction of arrow C, and FIG. 16 is a top view of the support member 32.

The supporting member 32 is made of a material such as aluminum, and has a length of 80 mm, a width of 85.74 mm, and a height of 43 m.
A main body 70 of m, which supports and fixes a heat sink 33, which will be described later, and a fan 31 larger than the heat sink 33. The outside air (fresh air) flowing out from the fan 31 can be efficiently directed in a predetermined direction. It is shaped to guide you to.

The main body 70 has a surface 71 arranged at a position facing the fan 31, a bent portion 72-1A from the surface 71,
A surface 73-1 and a surface 73-1 formed by being bent inward at a predetermined angle via 72-1B to be continuously formed, and a bent portion 74.
Vertical surface 7 in FIG. 14 formed continuously through
3-2, a surface 75 and a surface 7 that are continuously formed by bending the surface 71 inward at a predetermined angle via the bent portion 72-2.
14 is a surface 76-1 that is continuously bent by a predetermined angle from the position 1 through the bent portion 72-3, and is continuously formed through the surface 76-1 and the bent portion 77. Face 76-2, Bent from face 71 72-4
It is composed of a surface 78 that is continuously formed by being bent inward at a predetermined angle via. Further, an opening 83 is formed in the surface 71, so that the outside air (fresh air) flowing out from the fan 31 can be taken in.

That is, the surface 73-1 and the surface 7 of the main body 70
5, the surface 76-1 and the surface 78 are formed such that the flow path of the outside air taken out from the fan 31 that is taken in from the opening 83 is gradually narrowed in the direction in which the outside air flows (FIGS. 5 to 5). (Figure 8). As a result, the large-diameter fan 3
It is possible to guide the outer circle portion of the outside air flowing out of 1 to the center, and to efficiently apply it to the heat sink 33.

The optical disk drive 22 is provided on the surface 73-1.
The horizontal tongue portion 81 in FIG. 14 is formed by being bent inward at a predetermined angle through the bent portion 81A so as to be positioned substantially horizontally in the gap between the hard disk drive 23 and the hard disk drive 23. A discharge port 82 for directly discharging the outside air discharged from the fan 31 is formed at 73-2 (FIGS. 4 and 5).

Mounting holes 85-1 and 85-2 are formed at two opposing corners of the four corners of the surface 71, as shown in FIG.
As will be described later with reference to No. 9, mounting screws 111-1, 11
1-2 is attached to the fan 3 via the mounting holes 85-1 and 85-2.
1 is inserted into the mounting holes 51-2 and 51-4 (FIG. 12), and the fan 31 and the support member 32 are fastened and fixed (FIGS. 5, 7, and 10).

A cutout portion 75A is formed on the surface 75 so as not to interfere with the mounting of the mounting screw 111-1 (FIG. 6), and a surface 78 interferes with the mounting of the mounting screw 111-2. The cutout portion 78A is formed so as not to become (FIG. 8).

When the fan 31 is supported and fixed to the support member 32, a tongue portion 81 bent inward at a predetermined angle via the bent portion 81A is formed on the surface 73-1 to open the opening. Outlet 83 continuous from the portion 83
A is formed.

With these shapes, the outside air (fresh air) discharged from the fan 31 is not only collected in the center and efficiently applied (without waste) to the heat sink 33, but also
A part of the outside air discharged from the fan 31 is guided to the discharge port 83A by the tongue portion 81 without being applied to the heat sink 33, directly applied to the gap between the optical disk drive 22 and the hard disk drive 23, and guided to the discharge port 82. It can be directly applied to the end surface of the optical disk drive 22 facing the motherboard 21 (the details will be described later).

That is, the support member 32 not only supports and fixes the fan 31 and the heat sink 33, but also can function as a duct for guiding the outside air (fresh air) in a predetermined direction.

Below the surface 73-2, the mounting holes 84-1,
84-2 is formed, and mounting holes 84-3 and 84-4 are formed below the surface 76-2, and as described later with reference to FIG. 112-4 is mounted on the heat sink 33 through the mounting holes 84-1 to 84-4 (see FIG. 1).
7), and the support member 32 and the heat sink 33 are fastened and fixed (FIGS. 4 to 8 and 10).

Next, with reference to FIGS. 17 and 18, an example of the structure of the heat sink 33 will be described. Figure 17
FIG. 18 is a side view of the heat sink 33 seen from the direction of arrow A in FIG. 4, and FIG. 18 is a side view of the heat sink 33 seen from the direction of arrow B of FIG.

The heat sink 33 is a body 90 made of a material such as aluminum or aluminum alloy having good thermal conductivity.
For example, a skive heat sink having a fin height of 31 mm, a base height of 6.35 mm, and a fin count of 24 is used.

On the heat dissipating board 91 of the main body 90, the heat dissipating fins 92 having a substantially square shape are arranged in the left-right direction when viewed from the front of FIG.
-1A to 92-1D are formed in four rows, and a large number of heat radiation fins 92-1 to 9-9 are arranged in the front-rear direction.
2-24 are provided at predetermined intervals.

The radiating fins 92 are curved downward, and by this shape, the outside air (fresh air) discharged from the fan 31 can be guided directly to the end surface of the optical disk drive 22 facing the motherboard 21. Yes (the details will be described later).

Ventilation paths 93-1 to 93-23 are formed between the radiation fins 92-1 to 92-24.
Therefore, by driving the fan 31, the fan 3
The outside air that has flowed out of 1 flows into the heat sink 33, passes through the ventilation passages 93, and is discharged to the side. At this time, while the outside air passes through the ventilation passage 93 and escapes to the side, heat is exchanged with each radiating fin 92, and the heat sink 33 is cooled.

Further, the radiation fins 92-1 of the radiation substrate 91
On both sides of the lower part where A and 92-1D are provided, recesses 94-1 and 94-2 are provided over the entire length of the main body 90, respectively, and are provided on the mother board 21 and are not shown. The heat generated in the chipset 26 and the like is engaged with the heat dissipating fins 92.

The main body 90 has mounting holes 95-1 to 95-.
4 (mounting holes 95-3 and 95-4 are not shown) are formed, and as described later with reference to FIG.
2-1 to 112-4 are mounting holes 84- of the support member 32.
1 to 84-4 (FIGS. 13 and 15) to be inserted into the mounting holes 95-1 to 95-4, respectively, and the support member 3
2 and the heat sink 33 are clamped and fixed (see FIGS. 4 to 8 and 10).

Next, attachment of the fan 31, the support member 32, and the heat sink 33 will be described with reference to the exploded perspective view of the cooling device 27 of FIG.

The mounting screws 111-1, 111-2 are attached to the fan 3 via the mounting holes 85-1, 85-2 of the support member 32.
No. 1 mounting holes 51-2 and 51-4 are inserted respectively. As a result, the fan 31 and the support member 32 are clamped and fixed.

Further, the mounting screws 112-1 to 112-4
Are inserted into the mounting holes 95-1 to 95-4 of the heat sink 33 via the mounting holes 84-1 to 84-4 of the support member 32, respectively. As a result, the support member 32 and the heat sink 33 are clamped and fixed.

As described above, in the heat sink 33, the curved surface of the radiation fin 92-1 has the discharge port 8 of the support member 32.
It is arranged so as to face 2 and is supported and fixed. Therefore, as will be described later, the outside air (fresh air) discharged from the fan 31 is guided along the curved surface of the heat radiation fin 92-1 of the heat sink 33, and the support member 32.
Is discharged from the discharge port 82.

Next, the flow of outside air for cooling the optical disk drive 22 and the hard disk drive 23 of the computer main body 2 by the cooling device 27 will be described with reference to FIGS. 20 and 21. FIG. 20 shows FIG.
21 is a partially enlarged view of the vicinity of the cooling device 27, and FIG. 21 is a side sectional view of the cooling device 27 of FIG.

The motor 44 of the fan 31 is the power supply unit 2
When driven by the electric power supplied from the rotor 4,
7 is rotated in a predetermined direction, and the outside air (fresh air) sucked through the intake holes 15 provided on the side surface of the half cover 12 is sucked into the suction port 41 of the fan 31 (flow P).

The outside air sucked through the suction port 41 of the fan 31 becomes an air flow by the blade body 50 composed of a plurality of blades 49, and the support member 3 is discharged from the outlet 42.
Spilled to 2.

The surface 73-1, the surface 75, the surface 76-1, and the surface 78 of the main body 70 of the support member 32 are such that the flow path of the outside air discharged from the fan 31 becomes gradually narrow in the direction in which the outside air flows. Because it is formed into a large diameter fan 3
The outer circle portion of the outside air flowing out of 1 is guided to the center. Thereby, the taken-in external air can be efficiently applied to the heat sink 33, and the cooling effect can be enhanced. The outside air guided to the inside of the heat sink 33 passes between the ventilation passages 93 and exchanges heat with the radiating fins 92, and then is discharged sideways (flow Q and flow R).
As a result, the heat sink 33 that has absorbed the heat generated by the chipset 26 is cooled.

As described above, the surface 73-1, the surface 75, the surface 76-1, and the surface 78 of the main body 70 of the support member 32 are such that the flow path of the outside air discharged from the fan 31 is in the direction in which the outside air flows. Since it is formed so as to be gradually narrowed, it is possible to guide the outside air flowing out from the large-diameter fan 31 to the heat sink 33 without waste.

By applying a sufficient amount of air to the heat sink 33 using the large-diameter fan 31, the cooling effect can be enhanced without increasing the size of the heat sink 33, and the rotation speed of the fan 31 can be suppressed. Can be silenced.

Further, as shown in FIG. 21, on the surface 73-1 of the main body 70 of the support member 32, a tongue portion 81 bent inward at a predetermined angle via a bent portion 81A is formed. Therefore, a part of the outside air flowing out from the fan 31 is guided to the discharge port 83A and is discharged into the gap between the optical disk drive 22 and the hard disk drive 23 (flow S).

The outside air (flow S) discharged from the discharge port 83A is the outside air (flow Q) discharged from the heat sink 33.
And the flow R) and the outside air (flow T) discharged from the discharge port 82, which will be described later, have lower temperatures. This is because the outside air exhausted from the exhaust port 83A is exhausted without being applied to the heat sink 33 (that is, without heat exchange), and thus the suction port 41 of the fan 31 is used.
The temperature becomes almost the same as that of the outside air (flow P) sucked in.
Therefore, in order to cool the two heat source devices (in this case, the optical disk drive 22 and the hard disk drive 23), the outside air (fresh air) flowing out from the fan 31 is directly discharged to further enhance the cooling effect. it can.

Furthermore, a discharge port 82 is formed on the surface 73-2 of the main body 70 of the support member 32, and
The heat sink 33 is provided at a position facing the discharge port 82.
Since the curved surface of the heat radiation fin 92-1 is disposed, a part of the outside air flowing out from the fan 31 is guided to the discharge port 82 along the curved surface of the heat radiation fin 92-1 and the optical disk drive. It is discharged to the end face of 22 which faces the mother board 21 (flow T).

Outside air (flow T) discharged from the discharge port 82
Has a lower temperature than the outside air (flow Q and flow R) discharged through heat exchange between the heat radiation fins 92 and the ventilation passages 93 inside the heat sink 33. This is because the outside air guided along the curved surface of the heat radiating fin 92-1 is hardly affected by the heat exchange between the heat radiating fin 92-1 and the outside air. Therefore, in order to cool a predetermined device (in this case, the optical disk drive 22), the heat sink 33 is used along the curved surface of the heat radiation fin 92-1 rather than using the outside air discharged after heat exchange. The cooling effect can be enhanced by using the outside air (flow T) that is guided and discharged from the discharge port 82.

As described above, not only is the outside air discharged from the large-diameter fan 31 guided to the center so that it is efficiently applied to the heat sink 33, but a part of the outside air discharged from the fan 31 is discharged to the exhaust port 83A and the exhaust port 83A. It can be guided to the outlet 82 and directly applied to the gap between the optical disk drive 22 and the hard disk drive 23 and the end surface of the optical disk drive 22 facing the motherboard 21.

In the above, the tongue portion 81 is provided on the surface 73-1.
To form a part of the outside air discharged from the fan 31,
Optical disk drive 22 and hard disk drive 23
I tried to induce in the gap (that is, in one direction)
Not limited to this, it is of course possible to guide in four directions.

In this case, for example, as shown in FIG. 22, the surface 75, the surface 76-1, the surface 75 of the main body 70 of the supporting member 32,
Also on the surface 78, the tongue portion 81 formed on the surface 73-1.
Tongue portions 121 to 123 similar to the above are formed respectively. As a result, a part of the outside air discharged from the fan 31 is guided in the direction in which the tongue portion 81 and the tongue portions 121 to 123 are formed.

As described above, the heat source device adjacent to the cooling device 27 can be cooled regardless of its mounting position.

In the above description, the tongue portion 81 formed on the surface 73-1 is formed at a position substantially horizontal in the gap between the optical disk drive 22 and the hard disk drive 23. The angle of the tongue portion 81 can be changed according to

For example, as shown in FIG. 23, by changing the tongue portion 81 to a predetermined angle via the bent portion 81A, the outside air can be guided to a device having an arbitrary height. That is, the optical disk drive 22 and the hard disk drive 2 having the height shown in FIG. 23A.
When the outside air is guided to the space of No. 3, the tongue portion 81 is formed so as to face the upper right in the figure. Also, FIG.
When the optical disk drive 22 and the hard disk drive 23 are reversely attached as shown in FIG. 11, the tongue portion 81 is formed on the lower right side in the drawing.

As described above, the outside air can be guided in a desired direction by arbitrarily changing the angle of the tongue portion 81.

Furthermore, in the above, a fan 31 having a larger diameter than that described above may be used. For example, as shown in FIG. 24A, by installing a fan 31 having a larger diameter, the air volume can be increased and the rotation speed of the fan 31 can be suppressed. In this case, since the housing difference between the fan 31 and the heat sink 33 is large, as shown in FIG. 24B, the surface 73-1, the surface 75, the surface 76-1, and the surface 78 of the support member 32 are provided.
By increasing the angle of, the outer circle portion of the outside air discharged from the large-diameter fan 31 can be guided to the center and can be efficiently applied to the heat sink 33.

[0073]

According to the cooling device of the present invention, the heat sink is arranged such that the support member for supporting the fan and the heat sink makes the flow path of the outside air flowing out from the fan narrower in the direction in which the outside air flows. In addition to forming a guide surface that guides in the direction in which the heat sink is located, an opening is formed in a part of the guide surface at a position almost facing the adjacent device, so that the CPU does not need to be large in size and
And the peripheral device can be cooled efficiently.

Further, according to the electronic apparatus of the present invention, it has a fan for taking in outside air, a heat sink for absorbing heat generated by electronic elements inside the electronic apparatus, and a cooling device including a supporting member for supporting the fan and the heat sink. The support member forms a guide surface for guiding the flow path of the outside air flowing out of the fan in the direction in which the heat sink is arranged by gradually narrowing the flow path of the outside air in the direction in which the outside air flows.
Since an opening is formed in a part of the guide surface at a position substantially facing the adjacent device, the opening allows a part of the outside air discharged from the fan to be discharged into the gap between the two adjacent devices. , It is possible to efficiently cool the CPU and its peripheral devices without increasing the size of the heat sink.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration example of a personal computer according to the present invention.

FIG. 2 is an enlarged view of the computer main body of FIG.

3 is a diagram showing an example of the internal configuration of the computer main body of FIG.

FIG. 4 is an external perspective view of a cooling device.

5 is an external side view of the cooling device of FIG. 4 as seen from the direction of arrow A. FIG.

6 is an external side view of the cooling device of FIG. 4 as seen from the direction of arrow B. FIG.

7 is an external side view of the cooling device of FIG. 4 as seen from the direction of arrow C. FIG.

8 is an external side view of the cooling device of FIG. 4 as seen from the direction of arrow D. FIG.

9 is an external top view of the cooling device of FIG.

FIG. 10 is an external bottom view of the cooling device of FIG.

11 is a side sectional view of the fan taken along the line AA shown in FIG.

FIG. 12 is a top view of the fan of FIG.

13 is a side view of the support member of FIG. 4 viewed from the direction of arrow A. FIG.

14 is a side sectional view of the support member taken along the line BB shown in FIG.

15 is a side view of the support member of FIG. 4 viewed from the direction of arrow C. FIG.

16 is a top view of the support member of FIG.

17 is a side view of the heat sink as seen from the direction of arrow A in FIG.

18 is a side view of the heat sink as seen from the direction of arrow B in FIG.

19 is an exploded perspective view of the cooling device of FIG. 4. FIG.

FIG. 20 is a diagram illustrating the flow of outside air.

21 is a cross-sectional view taken along the line CC of FIG.

FIG. 22 is a diagram showing a configuration example of a support member of a cooling device of another example.

FIG. 23 is a diagram illustrating a tongue portion of a support member of a cooling device of another example.

FIG. 24 is a diagram showing a configuration example of a cooling device of another example.

[Explanation of symbols]

1 personal computer, 2 computer main body, 11 housing, 12 half cover, 15 air intake hole, 21 motherboard, 22 optical disk drive, 23 hard disk drive, 24 power supply unit, 25 riser support, 26 chip set, 27 cooling device, 31 fan, 32 support member, 33 heat sink, 40 body, 41
Suction port, 42 outlet, 43 base, 44 motor, 45 connecting wire, 46 terminal, 47 rotor,
48 peripheral wall parts, 49 blades, 50 blade bodies, 5
1-1 to 51-4 mounting holes, 70 main body, 71,
73-1, 73-2, 75-76-1, 76-2, 78
Surface 81 tongue part, 82 discharge port, 83 opening part, 83A discharge port, 84-1 to 84-4, 85
-1,85-2 mounting hole, 90 main body, 91 heat dissipation board, 92-1 to 92-24 heat dissipation fin, 93
-1 to 93-23 Ventilation path, 95-1, 95-2
Mounting holes, 111-1, 111-2 mounting screws, 11
2-1 to 112-4 Mounting screw

Continued front page    (72) Inventor Shinji Yamamura             6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Soni             -In EMCS Co., Ltd. (72) Inventor Kenji Tayoshi             6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Soni             -In EMCS Co., Ltd. F-term (reference) 5E322 AA01 AA11 BA05                 5F036 AA01 BA04 BA24 BB05 BB35                       BB37

Claims (5)

[Claims] 1. A cooling device comprising a fan for taking in outside air, a heat sink for absorbing heat generated by an electronic element inside a housing, and a cooling member for supporting the fan and the heat sink, wherein the supporting member is the fan. The flow path of the outside air that flows out from is formed so as to become gradually narrower in the direction in which the outside air flows, and the guide surface that guides the outside air in the direction in which the heat sink is arranged is substantially opposed to the adjacent device. A cooling device, comprising: an opening formed in a part of the guide surface at a position. 2. The cooling device according to claim 2, wherein the support member further includes a discharge port formed in a direction in which the outside air is guided along a curved surface of a fin that constitutes the heat sink. 3. The cooling device according to claim 1, wherein the opening discharges a part of the outside air discharged from the fan into a gap between two adjacent devices. 4. The curved surface of the fin guides a part of the outside air discharged from the fan to the outlet and discharges the outside air to a predetermined position of the device. The cooling device described. 5. In an electronic device having a cooling device, the cooling device includes a fan that takes in outside air, a heat sink that absorbs heat generated by an electronic element inside the electronic device, and a support that supports the fan and the heat sink. The support member is formed such that the flow path of the outside air discharged from the fan is gradually narrowed in a direction in which the outside air flows, and guides the outside air in a direction in which the heat sink is arranged. A guide surface and an opening formed in a part of the guide surface at a position substantially opposite to an adjacent device are provided, and the opening adjoins a part of the outside air discharged from the fan. Electronic equipment characterized by discharging into the gap between two devices.