JP2003133390A - Wafer-conveying apparatus - Google Patents
Wafer-conveying apparatusInfo
- Publication number
- JP2003133390A JP2003133390A JP2001330382A JP2001330382A JP2003133390A JP 2003133390 A JP2003133390 A JP 2003133390A JP 2001330382 A JP2001330382 A JP 2001330382A JP 2001330382 A JP2001330382 A JP 2001330382A JP 2003133390 A JP2003133390 A JP 2003133390A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- suction
- transfer device
- plate
- wafer transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 235000012489 doughnuts Nutrition 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 104
- 238000004140 cleaning Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 101500000959 Bacillus anthracis Protective antigen PA-20 Proteins 0.000 description 1
- 101000722833 Geobacillus stearothermophilus 30S ribosomal protein S16 Proteins 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ウエーハ搬送装
置、さらに詳しくは、極薄状のウエーハを収納カセット
などの収容部に搬送するのに好適なウエーハ搬送装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer device, and more particularly to a wafer transfer device suitable for transferring an ultrathin wafer to a storage portion such as a storage cassette.
【０００２】[0002]
【従来の技術】表面にＩＣ、ＬＳＩなどの回路が複数形
成された円板状の半導体ウエーハは、研削装置により裏
面が研削され所定の厚さに形成される。研削装置におい
て半導体ウエーハは、研削が終了した後、スピンナー洗
浄部に搬送され、洗浄されたウエーハはＵ字状の搬送ハ
ンドの上に吸着保持され、収容部である収容カセット内
に一枚ずつ順次に搬送される。典型的な直方体状を成す
収容カセットは、開口した縦面の左右側壁各々の内面
に、上下方向に所定の間隔で複数のウエーハ収容溝を所
定の溝幅で棚状に備え、ウエーハの外縁部が左右一対の
収容溝内に収容され支持される。2. Description of the Related Art A disk-shaped semiconductor wafer having a plurality of circuits such as IC and LSI formed on the front surface is ground to a predetermined thickness by a grinding machine. In the grinding device, the semiconductor wafer is transferred to the spinner cleaning section after the grinding is completed, and the cleaned wafer is adsorbed and held on the U-shaped transfer hand, and is sequentially transferred one by one in the storage cassette which is the storage section. Be transported to. A typical rectangular parallelepiped accommodating cassette is provided with a plurality of wafer accommodating grooves at predetermined intervals in the vertical direction on the inner surface of each of the left and right side walls of the open vertical surface in a shelf shape with a predetermined groove width, and an outer edge portion of the wafer. Are housed and supported in the pair of left and right housing grooves.
【０００３】[0003]
【発明が解決しようとする課題】上述したとおりの形態
の従来の半導体ウエーハの搬送には、次のとおりの解決
すべき問題がある。There are the following problems to be solved in the transportation of the conventional semiconductor wafer having the above-mentioned configuration.
【０００４】（１）収容時のウエーハの破損：半導体ウ
エーハの厚さは、携帯電話、ノートパソコン、スマート
カードなどの小型化、軽量化などに伴い、１００μｍ〜
５０μｍの極薄に加工される傾向にある。したがって、
ウエーハは薄くなるほどその剛性が低下し、搬送時にＵ
字状の搬送ハンドの上で撓みにより反り、外縁が垂れ下
がり、ウエーハを収容溝に収容する際にウエーハが収容
溝と干渉し、ウエーハを破損させやすい問題がある。(1) Wafer damage during storage: The semiconductor wafer has a thickness of 100 μm or less as the size and weight of mobile phones, notebook computers, smart cards, etc. are reduced.
It tends to be processed to a very thin thickness of 50 μm. Therefore,
The thinner the wafer, the lower its rigidity.
There is a problem in that the wafer warps due to bending on the letter-shaped transport hand, the outer edge hangs down, and when the wafer is accommodated in the accommodation groove, the wafer interferes with the accommodation groove and the wafer is easily damaged.
【０００５】（２）受け取り時のウエーハ破損：また、
ウエーハをスピンナー洗浄部の載置されたテーブルから
搬送ハンドで受け取る際、極薄のウエーハはＵ字状の搬
送ハンドの上にその一部分のみが載置され保持されるの
で、破損しやすい問題がある。(2) Wafer damage during receipt:
When a wafer is received from the table on which the spinner cleaning section is placed by the transport hand, only a part of the ultra-thin wafer is placed and held on the U-shaped transport hand, so that the wafer is easily damaged. .
【０００６】本発明は上記事実に鑑みてなされたもの
で、その技術的課題は、円板状のウエーハを平坦な状態
で確実に保持し搬送できるようにし、またウエーハの収
容溝に円滑に搬入できるようにし、搬送におけるウエー
ハの破損を防止できるようにした、ウエーハ搬送装置を
提供することである。The present invention has been made in view of the above facts, and its technical problem is to make it possible to reliably hold and convey a disk-shaped wafer in a flat state, and to smoothly carry it into the accommodation groove of the wafer. (EN) Provided is a wafer transfer device capable of preventing damage to a wafer during transfer.
【０００７】[0007]
【課題を解決するための手段】本発明においては、上記
技術的課題を解決するために、可動アームに取付けられ
た吸着板により円板状のウエーハを吸着し搬送するウエ
ーハ搬送装置であって、該吸着板は、ウエーハの外径と
略同一の外径を有する円板部と、円板部の吸着面の外周
に形成された吸引領域とを備えている、ことを特徴とす
るウエーハ搬送装置が提供される。In order to solve the above-mentioned technical problems, the present invention provides a wafer transfer device for adsorbing and transferring a disk-shaped wafer by an adsorption plate attached to a movable arm, The wafer transfer device, wherein the suction plate includes a disc portion having an outer diameter substantially the same as the outer diameter of the wafer, and a suction region formed on the outer periphery of the suction surface of the disc portion. Will be provided.
【０００８】そして、吸着板をウエーハと略同径の円板
で形成し、ウエーハを全面で平坦に、また外周部を吸引
保持し、ウエーハを撓ませ変形させることなく確実に保
持し、さらに吸着板からはみ出さないようにし、搬送し
てウエーハ収容溝への搬入を円滑にできるようにして、
ウエーハの破損を防止する。Then, the suction plate is formed of a disk having substantially the same diameter as the wafer, the wafer is flat over the entire surface, and the outer peripheral portion is suction-held to securely hold the wafer without bending and deforming it. Do not let it stick out of the plate, and transport it so that it can be smoothly loaded into the wafer storage groove.
Prevent wafer damage.
【０００９】好適実施形態においては、該吸着板は、該
ウエーハが挿入収容される収容溝に、ウエーハを吸着し
た状態で出し入れ可能に形成されている。該吸着板の厚
さは、１ｍｍ〜２ｍｍである。また、該吸引領域は、周
方向に複数の多孔状の吸引部を備え、該吸引部の各々を
吸引源に連通する吸引路が該吸着板の内部に形成されて
いる。該吸着板は、該吸引領域を残してドーナッツ状に
形成してもよい。また、該吸引領域の形成された面は、
フッ素樹脂によりコーティングされている。In a preferred embodiment, the suction plate is formed so as to be able to be taken in and out in a holding groove into which the wafer is inserted and held while the wafer is sucked. The thickness of the suction plate is 1 mm to 2 mm. In addition, the suction area includes a plurality of porous suction portions in the circumferential direction, and a suction path that connects each of the suction portions to a suction source is formed inside the suction plate. The suction plate may be formed in a donut shape, leaving the suction area. The surface on which the suction area is formed is
It is coated with fluororesin.
【００１０】[0010]
【発明の実施の形態】以下、本発明に従って構成された
ウエーハ搬送装置について、好適実施形態を図示してい
る添付図面を参照して、さらに詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a wafer transfer apparatus constructed according to the present invention will be described in more detail with reference to the accompanying drawings illustrating preferred embodiments.
【００１１】図１を参照して、先ず本発明に係るウエー
ハ搬送装置２２が装備された半導体ウエーハ（以下単に
ウエーハと呼ぶことがある）の研削装置２を研削加工の
流れとともに概要について説明する。カセット４２内に
収容されたウエーハは、後述するウエーハ搬送装置２２
によって搬出され、借り受けテーブル１０に搬送され
る。借り受けテーブル１０に搬送されたウエーハは、セ
ンター合わせされた後、搬入手段１２によってターンテ
ーブル６上のチャックテーブル８に搬入され吸着保持さ
れる。ウエーハが吸着されたチャックテーブル８は、タ
ーンテーブル６が矢印で示す反時計方向に間欠的に回転
されると、荒研削ユニット１４による荒研削加工域、仕
上研削ユニット１６による仕上研削加工域を移動して、
加工液が供給されながら研削加工される。Referring to FIG. 1, first, an outline of a grinding device 2 for a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) equipped with a wafer transfer device 22 according to the present invention will be described together with a flow of grinding. The wafer accommodated in the cassette 42 is the wafer transfer device 22 described later.
Is carried out and is carried to the borrowing table 10. The wafer carried to the borrowing table 10 is centered, and then carried into the chuck table 8 on the turntable 6 by the carrying-in means 12 and held by suction. When the turntable 6 is intermittently rotated counterclockwise as indicated by an arrow, the chuck table 8 to which the wafer is adsorbed moves in the rough grinding processing area by the rough grinding unit 14 and the finish grinding processing area by the finish grinding unit 16. do it,
Grinding is performed while the processing liquid is supplied.
【００１２】研削加工されたウエーハは、搬出域におい
て搬出手段１８の吸着パッド１８ａにより吸着されチャ
ックテーブル８から取り外され、次工程のスピンナー洗
浄装置２０のテーブル２０ａ上に搬出され載置される。
スピンナー洗浄装置２０は、ウエーハを高速回転させな
がら洗浄液を噴射し洗浄し、洗浄が終わったウエーハを
乾燥させる。スピンナー洗浄装置２０で処理されたウエ
ーハは、ウエーハ搬送装置２２により収容カセット２４
に搬送される。なお図１においてウエーハは、図面が煩
雑になるのを避けて、収容カセット２４に収容された状
態のみがウエーハＷとして示されている。The ground wafer is sucked by the suction pad 18a of the carry-out means 18 in the carry-out area, removed from the chuck table 8, and carried out and placed on the table 20a of the spinner cleaning device 20 in the next step.
The spinner cleaning device 20 jets a cleaning liquid while rotating the wafer at a high speed for cleaning, and dries the cleaned wafer. The wafer processed by the spinner cleaning device 20 is transferred to the storage cassette 24 by the wafer transfer device 22.
Be transported to. Note that, in FIG. 1, the wafer is shown as a wafer W only in a state of being accommodated in the accommodation cassette 24 in order to avoid making the drawing complicated.
【００１３】ウエーハ搬送装置２２について図１ととも
に図２を参照して説明する。ウエーハ搬送装置２２は、
装置ハウジング４に備えられた可動アーム２６と、可動
アーム２６の先端に水平に取付けられた吸着板２８が吸
着面Ｆを下に向けて備えている。そしてウエーハを、着
板２８によって吸着し可動アーム２６を動かして搬送す
る。The wafer transfer device 22 will be described with reference to FIG. 2 together with FIG. The wafer transfer device 22
A movable arm 26 provided in the device housing 4 and a suction plate 28 horizontally attached to the tip of the movable arm 26 are provided with the suction surface F facing downward. Then, the wafer is adsorbed by the attachment plate 28 and the movable arm 26 is moved to be conveyed.
【００１４】可動アーム２６は、それ自体は当業者に周
知のものでよく、したがってその詳細な説明は省略する
が、装置ハウジング４に取付けられた上下動手段２６ａ
と、上下動手段２６ａに立設された旋回手段２６ｂと、
旋回手段２６ｂの上端に上下に延びる軸線Ｘ１を中心に
水平方向に旋回自在に取付けられた第一のアーム２６ｃ
と、第一のアーム２６ｃの先端部に上下に延びる軸線Ｘ
２を中心に水平方向に旋回自在に取付けられた第二のア
ーム２６ｄとを備えており、第二のアーム２６ｄの先端
部に上下に延びる軸線Ｘ３を中心に吸着板２８が旋回自
在に取付けられている。The movable arm 26 may be one that is known to those skilled in the art per se, and a detailed description thereof will be omitted, but the vertical movement means 26a attached to the apparatus housing 4 is omitted.
And a turning means 26b erected on the vertical movement means 26a,
A first arm 26c attached to the upper end of the turning means 26b so as to be horizontally turnable about an axis X1 extending vertically.
And an axis line X extending vertically at the tip of the first arm 26c.
2 and a second arm 26d which is attached so as to be rotatable in the horizontal direction, and the suction plate 28 is attached to the tip of the second arm 26d so as to be rotatable about an axis X3 extending vertically. ing.
【００１５】吸着板２８について図２とともに図３〜図
６を参照して説明する。図３に示すごとく吸着板２８
は、円板状のウエーハの外径と略同一の外径Ｄを有する
円板部２８ａを備え、円板部２８ａのウエーハを吸着す
る吸着面Ｆの外周に、吸引領域Ｓが形成されている。円
板部２８ａには、可動アーム２６の第２のアーム２６ｄ
の先端部に取付けられる矩形状の基部２８ｂが一体的に
形成されている。The suction plate 28 will be described with reference to FIG. 2 and FIGS. As shown in FIG. 3, the suction plate 28
Includes a disk portion 28a having an outer diameter D that is substantially the same as the outer diameter of a disk-shaped wafer, and a suction area S is formed on the outer periphery of a suction surface F that attracts the wafer of the disk portion 28a. . The disk portion 28a includes a second arm 26d of the movable arm 26.
A rectangular base portion 28b attached to the tip portion of the is integrally formed.
【００１６】図３のＢ−Ｂ断面を表した図４に基づいて
説明すると、吸着板２８は、吸着面Ｆを有し厚さ１ｍｍ
のステンレス板あるいはアルミ板で形成された本体３０
と、本体３０の吸着面Ｆの裏面側に堀り込まれ形成され
た吸引部３２及び吸引路３４（これらについては後に詳
述する）を覆い塞ぐ本体３０と同一の輪郭で厚さ０．５
ｍｍのアルミ板で形成され本体３０に接着された蓋３６
とを備えている。したがって、吸着板２８の厚さＴは
１．５ｍｍに形成されている。Explaining with reference to FIG. 4 showing a section taken along the line BB of FIG. 3, the suction plate 28 has a suction surface F and has a thickness of 1 mm.
Body 30 made of stainless steel plate or aluminum plate
With the same contour as the main body 30 that covers and closes the suction portion 32 and the suction passage 34 (these will be described in detail later) formed by being dug into the back surface side of the suction surface F of the main body 30, the thickness is 0.5.
A lid 36 formed of a 30 mm aluminum plate and adhered to the body 30
It has and. Therefore, the thickness T of the suction plate 28 is formed to be 1.5 mm.
【００１７】蓋３６を外した状態を示す図５に基づいて
説明すると、吸引部３２は吸引領域Ｓに円周方向に等間
隔で複数個（実施の形態においては５個）備えられてい
る。吸引部３２の各々は、本体３０に矩形の凹部３２ａ
が深さ０．５ｍｍで堀り込まれ、その底に吸着面Ｆに貫
通する複数の吸着穴３２ｂが形成されている。吸引路３
４は、隣接した吸引部３２の凹部３２ａ同士を結び、基
部２８ｂ側の２個の吸引部３２を基部２８ｂに形成され
た連結穴３８に連通させている。この吸引路３４は幅３
ｍｍ深さ０．５ｍｍで形成されている。連結穴３８は、
可動アーム２６を介して研削装置２の真空ポンプなどか
らなる吸引源（図示していない）に連結されている。ま
た、吸引領域Ｓの形成された吸着面Ｆは、フッ素樹脂に
よりコーティングされている。基部２８ｂには可動アー
ム２６に取付けるための取付穴４０が形成されている
（５個）。Explaining with reference to FIG. 5 showing the state in which the lid 36 is removed, a plurality of suction portions 32 (five in the embodiment) are provided in the suction area S at equal intervals in the circumferential direction. Each of the suction portions 32 has a rectangular recess 32a in the main body 30.
Has a depth of 0.5 mm, and a plurality of suction holes 32b penetrating the suction surface F are formed at the bottom thereof. Suction path 3
Reference numeral 4 connects the concave portions 32a of the adjacent suction portions 32 to each other, and connects the two suction portions 32 on the base portion 28b side to the connection hole 38 formed in the base portion 28b. This suction path 34 has a width of 3
The depth is 0.5 mm. The connecting hole 38 is
It is connected via a movable arm 26 to a suction source (not shown) such as a vacuum pump of the grinding device 2. Further, the suction surface F on which the suction area S is formed is coated with a fluororesin. Mounting holes 40 for mounting to the movable arm 26 are formed in the base portion 28b (five).
【００１８】図１に示すウエーハが収容される収容カセ
ット２４は、当業者には周知のものである。矢印Ｅ−Ｅ
で示す方向から見た状態を図６に表して説明すると、開
口部の左右側壁２４ａ、２４ｂ各々の内面には、上下方
向に所定の間隔で複数の収容溝２５が溝幅Ｇ、典型例と
して５ｍｍで棚状に備えられている。The storage cassette 24 for storing the wafer shown in FIG. 1 is well known to those skilled in the art. Arrow E-E
6 is described with reference to FIG. 6, a plurality of housing grooves 25 are formed at predetermined intervals in the vertical direction on the inner surface of each of the left and right side walls 24a and 24b of the opening. It has a shelf shape of 5 mm.
【００１９】上述のように構成されたウエーハ搬送装置
２２によるウエーハの搬送について説明する。主として
図１を参照して、スピンナー洗浄装置２０により処理さ
れたウエーハを、可動アーム２６を操作し、吸着板２８
の吸着面Ｆを上からウエーハの上面に位置付けて吸着
し、可動アーム２６を操作して収容カセット２４に搬送
する。そして、主として図６を参照して、吸着板２８の
下面の吸着面Ｆにより上面が吸着されたウエーハＷを、
収容溝２５に吸着板２８とともに挿入し、その後吸着板
２８の吸着力を吸着源との連結を断って分離させ、ウエ
ーハＷの外縁部を左右一対の収容溝２５、２５内に載置
する。かくして、ウエーハＷは、スピンナー洗浄装置２
０からウエーハ搬送装置２２により収容カセット２４に
搬送されその収容溝２５に収容される。収容カセット２
４は、所定数のウエーハＷが収納されると、空の収容カ
セット２４に交換される。The wafer transfer by the wafer transfer device 22 configured as described above will be described. Mainly referring to FIG. 1, the wafer processed by the spinner cleaning device 20 is operated by operating the movable arm 26 to remove the suction plate 28.
The suction surface F is positioned on the upper surface of the wafer from above to suck the wafer, and the movable arm 26 is operated to convey it to the storage cassette 24. Then, referring mainly to FIG. 6, the wafer W whose upper surface is sucked by the suction surface F on the lower surface of the suction plate 28 is
The wafer W is inserted into the housing groove 25 together with the suction plate 28, and then the suction force of the suction plate 28 is separated by disconnecting the suction source from the suction source, and the outer edge portion of the wafer W is placed in the pair of left and right housing grooves 25, 25. Thus, the wafer W is the spinner cleaning device 2
The wafer is transferred from 0 to the storage cassette 24 by the wafer transfer device 22 and stored in the storage groove 25. Storage cassette 2
When a predetermined number of wafers W are stored, the number 4 is replaced with an empty storage cassette 24.
【００２０】したがって、ウエーハ搬送装置２２の吸着
板２８の厚さＴは、ウエーハＷを吸着した状態で収容溝
Ｇに出し入れ可能な厚さ、１ｍｍ〜２ｍｍに形成するの
が好ましい。Therefore, the thickness T of the suction plate 28 of the wafer transfer device 22 is preferably formed to a thickness of 1 mm to 2 mm that allows the wafer W to be taken in and out of the storage groove G while being sucked.
【００２１】上述したとおりの形態のウエーハ搬送装置
２２の作用について説明する。The operation of the wafer transfer device 22 having the above-described configuration will be described.
【００２２】（１）搬送、収容時のウエーハの破損防
止：ウエーハＷを保持する吸着板２８を、ウエーハと略
同一径Ｄの円板状に形成し、ウエーハの外周を吸引保持
するようにし、ウエーハの全面を確実に保持するように
したので、極薄のウエーハを撓ませ反りを生じさせるこ
となく、また破損させることなく、確実に搬送して収容
カセット内に搬入することができる。(1) Prevention of wafer damage during transportation and storage: A suction plate 28 for holding the wafer W is formed into a disk shape having a diameter D substantially the same as that of the wafer so that the outer circumference of the wafer is suction-held. Since the entire surface of the wafer is securely held, it is possible to reliably carry and carry the ultrathin wafer into the accommodation cassette without warping and damaging the ultrathin wafer without damaging it.
【００２３】（２）ウエーハ収容溝へのウエーハの出し
入れが容易：ウエーハＷを保持する吸着板２８を薄く、
またウエーハと略同じ大きさの「うちわ状」に形成した
ので、ウエーハをウエーハ収容溝２５に容易に出し入れ
することができる。(2) Easy loading / unloading of the wafer into / from the wafer receiving groove: The suction plate 28 for holding the wafer W is thin,
Further, since the wafer is formed in a "fan shape" having substantially the same size as the wafer, the wafer can be easily taken in and out of the wafer accommodation groove 25.
【００２４】（３）コンパクトな吸着板：吸着板２８の
吸引部３２及びそれを吸引源に結ぶ吸引路３４を、吸着
板２８の内部に形成したので、吸着板の外部に配管など
がなく、コンパクトな搬送装置が提供される。(3) Compact suction plate: Since the suction portion 32 of the suction plate 28 and the suction passage 34 connecting it to the suction source are formed inside the suction plate 28, there is no pipe or the like outside the suction plate. A compact transport device is provided.
【００２５】（４）吸着面のコーティングによる搬送の
容易化：ウエーハＷを吸着する吸着面Ｆにフッ素樹脂に
よるコーティングを施したので、その低摩擦性、低粘着
性により、吸着したウエーハは吸着面の吸引力を除き分
離する際に吸着面に張り付きにくくなり、容易に離され
る。したがって、収容カセット２４の収容溝２５などに
ウエーハを容易に搬送収容することができる。(4) Easier transportation by coating the adsorption surface: Since the adsorption surface F for adsorbing the wafer W is coated with a fluororesin, the adsorbed wafer is adhered to the adsorption surface due to its low friction and low tackiness. It becomes difficult to stick to the suction surface when separating it by removing the suction force of, and is easily separated. Therefore, the wafer can be easily conveyed and accommodated in the accommodation groove 25 of the accommodation cassette 24 or the like.
【００２６】（５）未研削ウエーハの搬送にも適用でき
る：ウエーハ搬送装置２２は、それが適用された図１の
研削装置において、未研削ウエーハを、その収容カセッ
ト４２から借り受けテーブル１０に搬出するのにも適用
することができる。(5) It is also applicable to transfer of unground wafers: the wafer transfer device 22 carries out the unground wafers from the storage cassette 42 to the borrow table 10 in the grinding device of FIG. 1 to which the wafer transfer device 22 is applied. It can also be applied to
【００２７】以上、本発明を実施の形態に基づいて詳細
に説明したが、本発明は上記の実施の形態に限定される
ものではなく、本発明の範囲内においてさまざまな変形
あるいは修正ができるものである。例えば、図７に示す
吸着板２９のように、本実施の形態における吸着板２８
の外周の吸引領域を残し中心部を空け中空部２９ａを設
けたドーナッツ状にしてもよい。The present invention has been described in detail above based on the embodiments. However, the present invention is not limited to the above embodiments, and various changes or modifications can be made within the scope of the present invention. Is. For example, like the suction plate 29 shown in FIG. 7, the suction plate 28 according to the present embodiment.
It is also possible to leave the suction area on the outer periphery of the above and leave it in the central portion and provide a hollow portion 29a to form a donut shape.
【００２８】[0028]
【発明の効果】本発明に従って構成されたウエーハ搬送
装置によれば、円板状のウエーハを平坦な状態で確実に
保持し搬送できるようにし、またウエーハの収容溝に円
滑に搬入できるようにし、搬送におけるウエーハの破損
を防止できるようにした、ウエーハ搬送装置が提供され
る。According to the wafer transfer apparatus constructed in accordance with the present invention, a disk-shaped wafer can be reliably held and transferred in a flat state, and can be smoothly loaded into the wafer receiving groove. Provided is a wafer transfer device capable of preventing damage to a wafer during transfer.
【図１】本発明に従って構成されたウエーハ搬送装置を
備えた研削装置の斜視図。FIG. 1 is a perspective view of a grinding apparatus including a wafer transfer device configured according to the present invention.
【図２】図１に示すウエーハ搬送装置を、可動アームを
動かして示した拡大斜視図。FIG. 2 is an enlarged perspective view showing the wafer transfer device shown in FIG. 1 by moving a movable arm.
【図３】図２の矢印Ａ方向に吸着板下面の吸着面Ｆを見
て示した吸着板の拡大平面図。FIG. 3 is an enlarged plan view of the suction plate showing a suction surface F on the lower surface of the suction plate in the direction of arrow A in FIG.
【図４】図３のＢ−Ｂ矢印方向に見て示した吸着板の拡
大断面図。FIG. 4 is an enlarged cross-sectional view of the suction plate shown in the direction of arrow BB in FIG.
【図５】図４のＣ−Ｃ矢印方向に見て示した吸着板本体
の縮小平面図。FIG. 5 is a reduced plan view of the suction plate body shown in the direction of arrows CC in FIG.
【図６】図１のＥ−Ｅ矢印方向に見て示したウエーハ収
容カセットのウエーハ収容溝部の詳細説明図。6 is a detailed explanatory view of a wafer accommodation groove portion of the wafer accommodation cassette shown in the direction of arrow E-E in FIG. 1. FIG.
【図７】吸着板の他の実施形態を示す斜視図。FIG. 7 is a perspective view showing another embodiment of the suction plate.
２：研削装置 ２２：ウエーハ搬送装置 ２５：収容溝 ２６：可動アーム ２８：吸着板 ２８ａ：円板部 ３２：吸引部 ３４：吸引路 Ｆ：吸着面 Ｓ：吸引領域 Ｗ：半導体ウエーハ（ウエーハ） 2: Grinding device 22: Wafer transfer device 25: Storage groove 26: Movable arm 28: Adsorption plate 28a: Disc part 32: suction unit 34: suction path F: Adsorption surface S: suction area W: Semiconductor wafer (wafer)
フロントページの続き Ｆターム(参考） 3C007 AS24 BS15 DS01 ES17 FS01 FU00 NS13 5F031 CA02 FA01 FA07 FA11 FA15 FA17 GA08 GA24 GA26 GA32 GA33 GA43 GA49 MA22 MA23 PA20 Continued front page F-term (reference) 3C007 AS24 BS15 DS01 ES17 FS01 FU00 NS13 5F031 CA02 FA01 FA07 FA11 FA15 FA17 GA08 GA24 GA26 GA32 GA33 GA43 GA49 MA22 MA23 PA20
Claims (6)
円板状のウエーハを吸着し搬送するウエーハ搬送装置で
あって、 該吸着板は、ウエーハの外径と略同一の外径を有する円
板部と、円板部の吸着面の外周に形成された吸引領域と
を備えている、ことを特徴とするウエーハ搬送装置。1. A wafer transfer device for adsorbing and transferring a disk-shaped wafer by an adsorption plate attached to a movable arm, the adsorption plate having an outer diameter substantially the same as the outer diameter of the wafer. And a suction area formed on the outer periphery of the suction surface of the disk portion.
る収容溝に、ウエーハを吸着した状態で出し入れ可能に
形成されている、請求項１記載のウエーハ搬送装置。2. The wafer transfer device according to claim 1, wherein the suction plate is formed so as to be able to be taken in and out in a storage groove into which the wafer is inserted and stored while the wafer is suctioned.
る、請求項１又は２記載のウエーハ搬送装置。3. The wafer transfer device according to claim 1, wherein the suction plate has a thickness of 1 mm to 2 mm.
吸引部を備え、該吸引部の各々を吸引源に連通する吸引
路が該吸着板の内部に形成されている、請求項１から３
までのいずれかに記載のウエーハ搬送装置。4. The suction area is provided with a plurality of porous suction portions in the circumferential direction, and a suction passage that connects each of the suction portions to a suction source is formed inside the suction plate. 1 to 3
The wafer transfer device described in any of the above.
ッツ状に形成されている、請求項１から４までのいずれ
かに記載のウエーハ搬送装置。5. The wafer transfer device according to claim 1, wherein the suction plate is formed in a donut shape, leaving the suction region.
脂によりコーティングされている、請求項１から５まで
のいずれかに記載のウエーハ搬送装置。6. The wafer transfer device according to claim 1, wherein the surface on which the suction area is formed is coated with a fluororesin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001330382A JP4279487B2 (en) | 2001-10-29 | 2001-10-29 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001330382A JP4279487B2 (en) | 2001-10-29 | 2001-10-29 | Wafer transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003133390A true JP2003133390A (en) | 2003-05-09 |
| JP4279487B2 JP4279487B2 (en) | 2009-06-17 |
Family
ID=19146107
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001330382A Expired - Lifetime JP4279487B2 (en) | 2001-10-29 | 2001-10-29 | Wafer transfer device |
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| Country | Link |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006026856A (en) * | 2004-07-20 | 2006-02-02 | Nakamura Tome Precision Ind Co Ltd | Disk perimeter grinding device |
| JP2010287783A (en) * | 2009-06-12 | 2010-12-24 | Lintec Corp | Transfer apparatus |
| WO2012001913A1 (en) * | 2010-06-30 | 2012-01-05 | コニカミノルタオプト株式会社 | Method of manufacturing glass substrate for information recording medium, and suction implement |
| JP2014204089A (en) * | 2013-04-09 | 2014-10-27 | 株式会社ディスコ | Wafer transfer mechanism and wafer processing method |
| CN113477599A (en) * | 2021-07-28 | 2021-10-08 | 上海申和热磁电子有限公司 | Automatic wafer cleaning device |
-
2001
- 2001-10-29 JP JP2001330382A patent/JP4279487B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006026856A (en) * | 2004-07-20 | 2006-02-02 | Nakamura Tome Precision Ind Co Ltd | Disk perimeter grinding device |
| JP2010287783A (en) * | 2009-06-12 | 2010-12-24 | Lintec Corp | Transfer apparatus |
| WO2012001913A1 (en) * | 2010-06-30 | 2012-01-05 | コニカミノルタオプト株式会社 | Method of manufacturing glass substrate for information recording medium, and suction implement |
| JP4982818B2 (en) * | 2010-06-30 | 2012-07-25 | コニカミノルタアドバンストレイヤー株式会社 | Manufacturing method of glass substrate for information recording medium and suction tool |
| JP2014204089A (en) * | 2013-04-09 | 2014-10-27 | 株式会社ディスコ | Wafer transfer mechanism and wafer processing method |
| CN113477599A (en) * | 2021-07-28 | 2021-10-08 | 上海申和热磁电子有限公司 | Automatic wafer cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4279487B2 (en) | 2009-06-17 |
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