JP2003131515A - Heating device and image forming apparatus - Google Patents

Heating device and image forming apparatus

Info

Publication number
JP2003131515A
JP2003131515A JP2001324882A JP2001324882A JP2003131515A JP 2003131515 A JP2003131515 A JP 2003131515A JP 2001324882 A JP2001324882 A JP 2001324882A JP 2001324882 A JP2001324882 A JP 2001324882A JP 2003131515 A JP2003131515 A JP 2003131515A
Authority
JP
Japan
Prior art keywords
heating
temperature
heating body
heated
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001324882A
Other languages
Japanese (ja)
Inventor
Satoru Taniguchi
悟 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2001324882A priority Critical patent/JP2003131515A/en
Publication of JP2003131515A publication Critical patent/JP2003131515A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a heating device which can ensure high reliability by preventing the deterioration and breakage of a heater, a stay, a film, a pressure roller, etc. SOLUTION: The heating device is provided with: a heating body; the support of this heating body; a heat-resistant fixing film which is in contact with the heating body and slides over the heating body; a pressing member which drives the fixing film and brings a material to be heated in contact with the heating body through the fixing film; a first thermometer which detects the temperature of the heating body; a means to control the current to the heating body on the basis of the temperature detected with the first thermometer; a second thermometer provided in a position different from the position of the first thermometer in the longitudinal direction of the heating body and being in contact with the sliding surface of an unfixed film of the heating body; and a support of the second thermometer. The material to be heated is heated by allowing the fixing film and the material to be heated to pass together through the nip part formed by the heating body and the pressing member. The space between the support of the second thermometer and the support of the heating body at the outside of the longitudinal direction is disposed more outwardly in the longitudinal direction of the heat generating area of the heating body.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、加熱装置とこれを
備える複写機、レーザービームプリンタ等の画像形成装
置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating device and an image forming apparatus such as a copying machine and a laser beam printer having the heating device.

【0002】[0002]

【従来の技術】従来、例えば画像の加熱定着等のための
記録材の加熱装置には、所定の温度に維持された加熱ロ
ーラと、弾性体層を介して前記加熱ローラに圧接される
加圧ローラとによって被加熱体としての記録材を挟持搬
送しつつ加熱する熱ローラ方式が多用されている。又、
この他にもフラッシュ加熱方式、オープン加熱方式、熱
板加熱方式等、種々の方式と構成のものが知られてお
り、実用されている。
2. Description of the Related Art Conventionally, for example, in a heating device for a recording material for fixing an image by heating, a heating roller maintained at a predetermined temperature and a pressure applied to the heating roller via an elastic layer. A heat roller system is widely used in which a recording material as a heated object is nipped and conveyed by a roller and heated. or,
Other than this, various methods and configurations such as a flash heating method, an open heating method, and a hot plate heating method are known and put into practical use.

【0003】ところで、最近では、上記方式に代わっ
て、図7に示すように固定支持された加熱体(ヒータ)
3と、該加熱体3に対向圧接しつつ搬送される耐熱性フ
ィルム(定着フィルム)2と、該フィルム2を介して被
加熱体としての記録材Pを加熱体3に密着させる加圧体
(加圧ローラ)4を有し、加熱体3の熱をフィルム2を
介して記録材Pへ付与することによって記録材面に形成
担持されている未定着画像を記録材P面に加熱定着させ
るフィルム加熱方式の加熱装置が考案されている。
By the way, recently, in place of the above-mentioned method, a heating body (heater) fixedly supported as shown in FIG.
3, a heat-resistant film (fixing film) 2 that is conveyed while being pressed against the heating body 3, and a pressurizing body that adheres a recording material P as a heated body to the heating body 3 through the film 2 ( A film having a pressure roller 4 and heating and fixing the unfixed image formed and carried on the surface of the recording material by applying the heat of the heating body 3 to the recording material P via the film 2. Heating type heating devices have been devised.

【0004】このようなフィルム加熱方式の加熱装置に
おいては、加熱体として低熱容量加熱体を用いることが
できため、従来の接触加熱方式である熱ローラ方式やベ
ルト加熱方式等の装置に比べて省電力及びウェイトタイ
ムの短縮化(クイックスタート)が可能になる。
In such a film heating type heating apparatus, since a low heat capacity heating element can be used as a heating element, it is possible to reduce the number of heating elements as compared with a conventional contact heating method such as a heat roller method or a belt heating method. Power and wait time can be shortened (quick start).

【0005】[0005]

【発明が解決しようとする課題】ところで、斯かるフィ
ルム加熱方式の加熱装置においては、通紙可能な最大サ
イズよりも小さな幅の記録材(以下、小サイズ紙と称す
る)を通紙すると、非通紙部では記録材に熱が奪われな
いために通紙部に比べて高温になる(非通紙部昇温)。
特に、最大サイズよりも小さな幅で厚い厚紙、封筒等の
記録材(以下、小サイズ厚紙と称する)が重送して通紙
された場合、通紙部では記録材に多量の熱を奪われ、し
かも温度制御は通紙部に設けられた検温素子の出力に基
づいて行われるため、ヒータに多量の電力が供給され
る。
By the way, in such a film heating type heating device, when a recording material having a width smaller than the maximum size which can be passed (hereinafter referred to as small size paper) is passed, Since heat is not taken by the recording material in the paper passing portion, the temperature becomes higher than that in the paper passing portion (temperature rise in non-paper passing portion).
In particular, when a recording material such as thick paper or envelope with a width smaller than the maximum size (hereinafter referred to as small size thick paper) is fed by double feeding, a large amount of heat is taken by the recording material in the paper passing portion. Moreover, since the temperature control is performed based on the output of the temperature detecting element provided in the paper passing portion, a large amount of electric power is supplied to the heater.

【0006】一方、非通紙部では記録材に熱を奪われな
いために非常に高温になり、ヒータ、ヒータステー、定
着フィルム、加圧ローラ等が破損に至る可能性がある。
On the other hand, in the non-sheet passing portion, heat is not taken by the recording material, so that the temperature becomes extremely high, and the heater, the heater stay, the fixing film, the pressure roller and the like may be damaged.

【0007】上記非通紙部昇温を防止するために、温度
制御用の検温素子とは別に非通紙部昇温検知用の検温素
子を非通紙部に設け、この検温素子の出力に応じて非通
紙部昇温を緩和するような制御を行う方法が考えられ
る。従来のフィルム加熱方式の加熱装置においては、温
度制御用の検温素子としてチップサーミスタを使用し、
ヒータ基板の非フィルム摺動面側にチップサーミスタを
接着し且つサーミスタ用の導電パターンも形成する構成
が多用されている。
In order to prevent the temperature rise of the non-sheet-passing portion, a temperature-sensing element for detecting the temperature rise of the non-sheet-passing portion is provided in the non-sheet-passing portion in addition to the temperature-sensing element for temperature control. Accordingly, a method of controlling so as to reduce the temperature rise of the non-sheet passing portion can be considered. In a conventional film heating type heating device, a chip thermistor is used as a temperature detecting element for temperature control,
A structure in which a chip thermistor is bonded to the non-film sliding surface side of the heater substrate and a conductive pattern for the thermistor is also formed is often used.

【0008】しかし、非通紙部は高温になるため、非通
紙部昇温検知用の検温素子として同様の構成を採用する
ことは接着剤の耐熱性の観点から困難である。このた
め、非通紙部昇温検知用の検温素子構成として、サーミ
スタを支持する部材を設け、サーミスタと支持部材を所
定の圧力でヒータ基板の非フィルム摺動面側に当接させ
る方法が考えられる(以下、外部当接型サーミスタと称
する)。この構成の場合、 サーミスタをヒータ基板に接
着する必要がないため、接着剤の耐熱性の問題はクリア
できる。
However, since the non-sheet passing portion becomes high in temperature, it is difficult to adopt the same structure as the temperature detecting element for detecting the temperature rise of the non-sheet passing portion from the viewpoint of heat resistance of the adhesive. Therefore, as a temperature detecting element configuration for detecting the temperature rise of the non-sheet passing portion, a method of providing a member for supporting the thermistor and bringing the thermistor and the supporting member into contact with the non-film sliding surface side of the heater substrate with a predetermined pressure is considered. (Hereinafter referred to as an external contact type thermistor). With this configuration, it is not necessary to bond the thermistor to the heater substrate, so the problem of heat resistance of the adhesive can be solved.

【0009】ところが、外部当接型サーミスタを用いる
場合、ヒータを支持するステーに外部当接型サーミスタ
の支持部材を配置するための穴が必要となる。このと
き、加熱体の長手方向においてステーと外部当接型サー
ミスタの支持部材との間に空隙が生じると、空隙部はヒ
ータ基板からステー或は外部当接型サーミスタの支持部
材への熱の逃げがないため、局所的に高温になる。特
に、非通紙部昇温が大きい場合、この局所的な高温が著
しくなり、熱応力によるヒータ基板の破損(ヒータ割
れ)、フィルム・加圧ローラ等の劣化・破損を招く可能
性がある。この空隙は設計上小さくすることはできる
が、寸法公差を考慮すると完全に無くすことは不可能で
ある。
However, when the external contact type thermistor is used, a hole for disposing the supporting member of the external contact type thermistor is required in the stay supporting the heater. At this time, if a gap is formed between the stay and the supporting member of the external contact type thermistor in the longitudinal direction of the heating element, the void portion allows heat to escape from the heater substrate to the stay or the supporting member of the external contact type thermistor. There is no heat, so the temperature rises locally. In particular, when the temperature rise in the non-sheet passing portion is large, this local high temperature becomes remarkable, which may cause damage to the heater substrate (heater cracking) due to thermal stress and deterioration / damage of the film / pressure roller. Although this void can be made small in design, it cannot be completely eliminated in consideration of dimensional tolerance.

【0010】本発明は上記問題に鑑みてなされたもの
で、その目的とする処は、ヒータ・ステー・フィルム・
加圧ローラ等の劣化・破損を防止して高い信頼性を確保
することができる加熱装置及び画像形成装置を提供する
ことにある。
The present invention has been made in view of the above problems, and its object is to provide a heater stay film
An object of the present invention is to provide a heating device and an image forming apparatus capable of preventing deterioration and damage of a pressure roller and ensuring high reliability.

【0011】[0011]

【課題を解決するための手段】上記目的を達成するた
め、本発明は、加熱体と、該加熱体の支持体と、前記加
熱体に接触摺動する耐熱性の定着フィルムと、該定着フ
ィルムを駆動し且つ定着フィルムを介して被加熱材を前
記加熱体に密着させる加圧部材と、前記加熱体の温度を
検知する第1の検温素子と、該第1の検温素子の検知温
度に基づいて加熱体への通電制御する通電制御手段と、
加熱体の長手方向で第1の検温素子とは異なる位置に設
けられた加熱体の非定着フィルム摺動面に接触している
第2の検温素子及び該第2の検温素子の支持体とを有
し、前記加熱体と前記加圧部材により形成されるニップ
部を前記定着フィルムと前記被加熱材が一緒に挟持搬送
されることにより被加熱材を加熱する加熱装置におい
て、前記第2の検温素子の支持体と加熱体の支持体との
間の長手方向外側の空隙を加熱体の発熱領域よりも長手
方向において外側に配置したことを特徴とする。
To achieve the above object, the present invention provides a heating body, a support for the heating body, a heat-resistant fixing film that slides in contact with the heating body, and the fixing film. And a first temperature detecting element for detecting the temperature of the heating body, based on a temperature detected by the first temperature detecting element. And an energization control means for controlling energization to the heating element,
A second temperature measuring element in contact with the sliding surface of the non-fixing film of the heating element, which is provided at a position different from the first temperature measuring element in the longitudinal direction of the heating element, and a support for the second temperature measuring element. In the heating device, which has the fixing film and the material to be heated sandwiched and conveyed in a nip portion formed by the heating body and the pressure member, the second material is heated. It is characterized in that a gap on the outer side in the longitudinal direction between the support of the element and the support of the heating element is arranged outside the heat generating region of the heating element in the longitudinal direction.

【0012】又、本発明は、記録材上に画像を形成する
像形成手段と、記録材上の画像を加熱する像加熱手段を
有する画像形成装置において、前記像加熱手段を前記加
熱装置で構成したことを特徴とする。
Further, according to the present invention, in an image forming apparatus having an image forming means for forming an image on a recording material and an image heating means for heating an image on the recording material, the image heating means comprises the heating device. It is characterized by having done.

【0013】[0013]

【発明の実施の形態】以下に本発明の実施の形態を添付
図面に基づいて説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings.

【0014】<実施の形態1>図5は本発明に係る画像
形成装置としてのレーザービームプリンタの断面図であ
り、同図において、101は像担持体として有機感光ド
ラム、102は帯電部材としての帯電ローラ、103は
レーザー露光装置、104は現像スリーブ、現像ブレー
ド、1成分磁性トナー等から成る現像装置、105はク
リーニングブレード、106は転写ローラ、107は定
着装置である。
<First Embodiment> FIG. 5 is a sectional view of a laser beam printer as an image forming apparatus according to the present invention. In FIG. 5, 101 is an organic photosensitive drum as an image carrier, and 102 is a charging member. A charging roller, 103 is a laser exposure device, 104 is a developing sleeve, a developing blade, a developing device including one-component magnetic toner, 105 is a cleaning blade, 106 is a transfer roller, and 107 is a fixing device.

【0015】有機感光ドラム101は、帯電ローラ10
2によって一様に負の電荷に帯電し、レーザー露光装置
103からのレーザービームによって有機感光ドラム1
01に静電潜像が形成される。次に、現像装置104の
中で帯電したトナーが有機感光ドラム101上の静電潜
像に付着して可視像となり、転写ローラ106上で紙に
転写され、定着装置107で定着される。尚、クリーニ
ングブレード105は、有機感光ドラム101上に残っ
たトナーを除去する。
The organic photosensitive drum 101 comprises a charging roller 10
2 is uniformly charged to a negative charge, and the organic photosensitive drum 1 is irradiated with a laser beam from the laser exposure device 103.
An electrostatic latent image is formed at 01. Next, the charged toner in the developing device 104 adheres to the electrostatic latent image on the organic photosensitive drum 101 to form a visible image, which is transferred onto paper on the transfer roller 106 and fixed by the fixing device 107. The cleaning blade 105 removes the toner remaining on the organic photosensitive drum 101.

【0016】以上の各ユニットの働きにより画像が形成
される。
An image is formed by the action of each unit described above.

【0017】図3は本発明に係る画像加熱定着装置の概
略構成図である。この装置は特開平4−44075号〜
44083号公報、同4−204980〜204984
号公報等に開示の所謂テンションレスタイプの装置であ
る。このテンションレスタイプの装置は、耐熱性フィル
ムとしてエンドレスベルト状又は円筒状のものを用い、
該フィルムの周長の少なくとも一部は常にテンションフ
リー(テンションが加わらない状態)とし、フィルムは
加圧部材の回転駆動力で回転駆動するようにした装置で
ある。
FIG. 3 is a schematic configuration diagram of an image heating and fixing device according to the present invention. This device is disclosed in JP-A-4-44075.
No. 44083, 4-204980 to 204984.
This is a so-called tensionless type device disclosed in Japanese Patent Publication No. This tensionless type device uses an endless belt-shaped or cylindrical heat-resistant film,
At least part of the circumference of the film is always tension-free (a state in which no tension is applied), and the film is rotationally driven by the rotational driving force of the pressure member.

【0018】2はエンドレスの耐熱性フィルムであり、
このフィルム2は加熱体(ヒータ)3を含む耐熱性フィ
ルムガイド部材であるステー1に外嵌されている。この
エンドレスの耐熱性フィルム2の内周長と加熱体3を含
むステー1の外周長はフィルム2の方を例えば3mm程
度大きくしてあり、従って、フィルム2は周長に余裕を
持って外嵌されている。
2 is an endless heat-resistant film,
The film 2 is fitted onto a stay 1 which is a heat resistant film guide member including a heating body (heater) 3. The inner peripheral length of the endless heat-resistant film 2 and the outer peripheral length of the stay 1 including the heating element 3 are larger than those of the film 2 by, for example, about 3 mm. Has been done.

【0019】ステー1はポリイミド、ポリアミドイミ
ド、PEEK、PPS、液晶ポリマー等の高耐熱性樹脂
や、これらの樹脂とセラミックス、金属、ガラス等との
複合材料等で構成されている。本実施の形態では液晶ポ
リマーを用いた。
The stay 1 is made of a highly heat resistant resin such as polyimide, polyamideimide, PEEK, PPS, liquid crystal polymer, or a composite material of these resins and ceramics, metal, glass or the like. In this embodiment mode, a liquid crystal polymer is used.

【0020】耐熱性フィルム2は熱容量を小さくしてク
イックスタート性を向上させるために、膜厚は100μ
m以下、好ましくは50μm以下20μm以上の耐熱性
の高いPTFE、PFA、FEP等の単層フィルム或い
ポリイミド、ポリアミドイミド、PEEK、PES、P
PS等のフィルムの外周表面にPTFE、PFA、FE
P等をコーティングした複合層フィルムが使用される。
本実施の形態では、耐熱性フィルム2として、膜厚約4
0μmのポリイミドフィルムの外周表面にPTFEをコ
ーティングしたものを用いた。
The heat resistant film 2 has a thickness of 100 μm in order to reduce the heat capacity and improve the quick start property.
m or less, preferably 50 μm or less and 20 μm or more having high heat resistance, single layer film such as PTFE, PFA, FEP or polyimide, polyamide imide, PEEK, PES, P
PTFE, PFA, FE on the outer surface of the film such as PS
A composite layer film coated with P or the like is used.
In this embodiment, the heat-resistant film 2 has a film thickness of about 4
A 0 μm polyimide film coated with PTFE on the outer peripheral surface was used.

【0021】図2は加熱体3の正面図と通電制御を行う
回路を示す図である。
FIG. 2 is a front view of the heating element 3 and a diagram showing a circuit for controlling energization.

【0022】加熱体3は、耐熱性フィルム2若しくは被
加熱体としての記録材Pの搬送方向aに対して直角方向
を長手とする細長の耐熱性・絶縁性・良熱伝導性の基板
31、該基板31の表面側の短手方向中央部に基板長手
に沿って形成具備された抵抗発熱体32、この抵抗発熱
体32を形成した加熱体表面を保護する耐熱性オーバー
コート層34、抵抗発熱体32の長手両端部の給電用電
極21,22等から成る全体に低熱容量の加熱体であ
る。この加熱体3を抵抗発熱体32を形成具備させた表
面(フィルム摺動面)側を下向きに露呈させてステー1
の下面側に保持させて固定配設している。
The heating element 3 is an elongated heat-resistant / insulating / heat-conductive substrate 31 having a longitudinal direction perpendicular to the conveying direction a of the heat-resistant film 2 or the recording material P as a heated object. A resistance heating element 32 formed along the longitudinal direction of the substrate at the center of the substrate 31 in the lateral direction, a heat resistant overcoat layer 34 for protecting the surface of the heating element on which the resistance heating element 32 is formed, and resistance heating. It is a heating body having a low heat capacity as a whole, which is composed of the power supply electrodes 21 and 22 at both longitudinal ends of the body 32. The stay 1 is formed by exposing the surface (film sliding surface) of the heating element 3 on which the resistance heating element 32 is formed to face downward.
It is held and fixed on the lower surface side of.

【0023】加熱体基板31には、例えばアルミナや窒
化アルミニウム等の材料が用いられ、本実施の形態では
厚さ1mm・幅7mm・長さ270mmのアルミナ基板
を使用している。抵抗発熱体32は、例えばAg/Pd
(銀パラジウム)、RuO2、Ta2 N等の電気抵抗材
料をスクリーン印刷等により線状若しくは線帯状に塗工
して形成したもので、本実施の形態では、Ag/Pdを
スクリーン印刷により厚さ約10μm、幅1mmに塗工
して形成した。給電用電極21,22はAg/Pdのス
クリーン印刷パターン層を用いた。オーバーコート層3
4は約50μm厚の耐熱性ガラス層を用いた。
A material such as alumina or aluminum nitride is used for the heating body substrate 31, and in the present embodiment, an alumina substrate having a thickness of 1 mm, a width of 7 mm and a length of 270 mm is used. The resistance heating element 32 is, for example, Ag / Pd.
It is formed by coating an electric resistance material such as (silver palladium), RuO 2 , Ta 2 N or the like in a linear or linear shape by screen printing or the like. In the present embodiment, Ag / Pd is thickened by screen printing. It was formed by coating with a thickness of about 10 μm and a width of 1 mm. The power supply electrodes 21 and 22 used Ag / Pd screen-printed pattern layers. Overcoat layer 3
No. 4 used a heat resistant glass layer having a thickness of about 50 μm.

【0024】図2中にはステー1のヒータ3の接触面も
示している。本実施の形態においては、第1の検温素子
5としてチップサーミスタを用い、ヒータ基板31の非
フィルム摺動面に実装した。このため、第1の検温素子
5用の導電パターンもヒータ基板31の非フィルム摺動
面側に形成しているが、図2では省略している。そし
て、第2の検温素子6及び第2の検温素子6の支持部材
7を長手方向端部に設けている。第2の検温素子6とし
ては、チップサーミスタ、ビーズサーミスタ等が使用で
き、本実施の形態では第1の検温素子5と同仕様のチッ
プサーミスタを使用した。図2中のA、Eはステー1と
第2の検温素子6の支持部材7との間の空隙を示してお
り、以下、Aを外側の空隙、Eを内側の空隙と記述す
る。第1の検温素子5及び第2の検温素子6はCPU2
4に通じている。
FIG. 2 also shows the contact surface of the heater 3 of the stay 1. In the present embodiment, a chip thermistor is used as the first temperature measuring element 5 and is mounted on the non-film sliding surface of the heater substrate 31. Therefore, the conductive pattern for the first temperature measuring element 5 is also formed on the non-film sliding surface side of the heater substrate 31, but it is omitted in FIG. Then, the second temperature measuring element 6 and the support member 7 of the second temperature measuring element 6 are provided at the end portion in the longitudinal direction. A chip thermistor, a bead thermistor, or the like can be used as the second temperature measuring element 6, and in the present embodiment, a chip thermistor having the same specifications as the first temperature measuring element 5 is used. A and E in FIG. 2 indicate a space between the stay 1 and the support member 7 of the second temperature measuring element 6, and hereinafter, A is described as an outer space and E is described as an inner space. The first temperature measuring element 5 and the second temperature measuring element 6 are the CPU 2
It leads to 4.

【0025】尚、図3においては、第2の検温素子6及
びその支持部材7のみ示し、第1の検温素子5は省略し
ている。
In FIG. 3, only the second temperature measuring element 6 and its supporting member 7 are shown, and the first temperature measuring element 5 is omitted.

【0026】図4は第2の検温素子6及び第2の検温素
子6の支持部材7の拡大図である。
FIG. 4 is an enlarged view of the second temperature measuring element 6 and the supporting member 7 of the second temperature measuring element 6.

【0027】支持部材7は耐熱性樹脂層7aと断熱層7
bとで構成されており、断熱層7bの下部に第2の検温
素子6としてチップサーミスタを設けている。又、第2
の検温素子6及び断熱層7bを覆う絶縁層8を設けてい
る。本実施の形態では、耐熱性樹脂層7aとして液晶ポ
リマーを、断熱層7bとしてセラミックペーパーを積層
したものを、絶縁層8としてポリイミドフィルムをそれ
ぞれ使用した。
The supporting member 7 includes a heat resistant resin layer 7a and a heat insulating layer 7.
b, and a chip thermistor is provided as the second temperature measuring element 6 below the heat insulating layer 7b. Also, the second
An insulating layer 8 is provided to cover the temperature measuring element 6 and the heat insulating layer 7b. In this embodiment, a liquid crystal polymer is used as the heat resistant resin layer 7a, a ceramic paper is laminated as the heat insulating layer 7b, and a polyimide film is used as the insulating layer 8.

【0028】断熱層7bは、熱がヒータ3からステー1
内部へ逃げ、第2の検温素子6付近の温度が低下するの
を防止するのが目的である。又、絶縁層8はCPU2
4、第1の検温素子5等の故障によりヒータ3への通電
制御が不能になり、ヒータ3が破損した場合、抵抗発熱
体32(AC)と第2の検温素子6の電極(DC)との
絶縁を確保するのが目的である。
In the heat insulation layer 7b, heat is applied from the heater 3 to the stay 1.
The purpose is to prevent the temperature in the vicinity of the second temperature detecting element 6 from escaping to the inside and lowering. The insulating layer 8 is the CPU 2
4. When the heater 3 is damaged due to failure of the heater 3 due to a failure of the first temperature detecting element 5 or the like, the resistance heating element 32 (AC) and the electrode (DC) of the second temperature detecting element 6 are connected to each other. The purpose is to ensure insulation.

【0029】以上の構成の第2の検温素子6の支持部材
7が不図示の手段により所定の圧力でヒータ基板31の
非フィルム摺動面に当接されている。本実施の形態で
は、第1の検温素子5は本実施の形態に係る定着器に供
給して使用可能な最小幅の記録材が通過する領域(以
下、最小通紙域と称する)内に設け、第2の検温素子6
は本実施の形態に係る定着器に供給して使用可能な最大
幅の記録材が通過する領域(以下、最大通紙域と称す
る)内で且つ最小通紙域外に設けている。よって、小サ
イズ紙を通紙した場合、第2の検温素子6が設置されて
いる位置は非通紙部になる。
The supporting member 7 of the second temperature measuring element 6 having the above structure is brought into contact with the non-film sliding surface of the heater substrate 31 with a predetermined pressure by means (not shown). In the present embodiment, the first temperature detecting element 5 is provided in an area (hereinafter referred to as the minimum paper passing area) through which the recording material having the minimum width that can be supplied to and used by the fixing device according to the present embodiment passes. , The second temperature measuring element 6
Is provided within an area (hereinafter referred to as the maximum paper passing area) through which the recording material having the maximum width which can be supplied to and used by the fixing device according to the present embodiment passes, and outside the minimum paper passing area. Therefore, when a small size sheet is passed, the position where the second temperature detecting element 6 is installed becomes the non-sheet passing portion.

【0030】4は加熱体3との間にフィルム2を挟んで
圧接ニップ部(定着ニップ部)Nを形成し、且つ、フィ
ルム2を回転駆動させるフィルム外面接触駆動手段とし
ての加圧ローラである。このフィルム駆動ローラ兼加圧
ローラ4は、芯金4aと弾性体層4bと最外層の離形層
4cから成り、不図示の軸受手段・付勢手段により所定
の押圧力をもってフィルム2を挟ませて加熱体3の表面
に圧接させて配設してある。この加圧ローラ4の回転駆
動による該ローラ4とフィルム2外面との摩擦力でフィ
ルム2に回転力が作用する。本実施の形態では、芯金4
aとしてアルミニウムを、弾性体層4bとしてシリコー
ンゴムを、離形層4cとしてPFAをそれぞれ用いた。
Reference numeral 4 denotes a pressure roller as a film outer surface contact drive means for forming a pressure contact nip portion (fixing nip portion) N by sandwiching the film 2 with the heating body 3 and driving the film 2 to rotate. . The film driving roller / pressure roller 4 comprises a cored bar 4a, an elastic layer 4b, and an outermost release layer 4c. The film 2 is sandwiched with a predetermined pressing force by bearing means / urging means (not shown). Are arranged in pressure contact with the surface of the heating element 3. The rotational force acts on the film 2 due to the frictional force between the roller 4 and the outer surface of the film 2 due to the rotational driving of the pressure roller 4. In the present embodiment, the core metal 4
Aluminum was used as a, silicone rubber was used as the elastic layer 4b, and PFA was used as the release layer 4c.

【0031】加熱体3は、抵抗発熱体32の長手両端部
の給電用電極21,22に対する給電により該抵抗発熱
体32が長手全長に亘って発熱することによって昇温す
る。その昇温が第1の検温素子5で検知され、第1の検
温素子5の出力をA/D変換してCPU24に取り込
み、その情報に基づいてトライアック25により抵抗発
熱体32に通電する電力を位相、波数制御等により制御
して加熱体3の温度制御がなされる。即ち、第1の検温
素子5の検知温度が所定の設定温度より低いと加熱体3
が昇温するように、設定温度より高いと降温するように
通電を制御することによって、加熱体3は定着時一定温
度に保たれる。本実施の形態では、第2の検温素子6は
加熱体3を一定温度に保つための制御には使用しない。
The heating element 3 is heated by the resistance heating element 32 generating heat over the entire length of the resistance heating element 32 by feeding power to the power supply electrodes 21 and 22 at both ends of the resistance heating element 32. The temperature rise is detected by the first temperature detecting element 5, the output of the first temperature detecting element 5 is A / D converted and taken into the CPU 24, and based on this information, the electric power supplied to the resistance heating element 32 by the triac 25 is supplied. The temperature of the heating element 3 is controlled by controlling the phase and the wave number. That is, when the detected temperature of the first temperature detecting element 5 is lower than the predetermined set temperature, the heating element 3
The heating element 3 is kept at a constant temperature during fixing by controlling the energization so that the temperature rises when the temperature is higher than the set temperature. In the present embodiment, the second temperature detecting element 6 is not used for the control for keeping the heating element 3 at a constant temperature.

【0032】而して、加熱体3の温度が所定に立ち上が
り、且つ、加圧ローラ4の回転によるフィルム2の回転
周速度が定常化した状態において、フィルム2を挟んで
加熱体3と加圧ローラ4とで形成される圧接ニップ部N
のフィルム2と加圧ローラ4との間に被加熱体としての
画像定着すべき記録材Pが画像形成部(転写部)より導
入されてフィルム2と一緒に圧接ニップ部Nを挟持搬送
されることにより加熱体3の熱がフィルム2を介して記
録材Pに付与され、該記録材P上の未定着顕画像(トナ
ー画像)Tが記録材P面に加熱定着される。そして、圧
接ニップ部Nを通った記録材Pは、フィルム2の面から
分離されて搬送される。
Then, in the state where the temperature of the heating element 3 rises to a predetermined level and the rotational peripheral speed of the film 2 by the rotation of the pressure roller 4 is stabilized, the film 2 is sandwiched and the heating element 3 is pressed. Pressure contact nip portion N formed with the roller 4
The recording material P as an object to be image-fixed, which is an object to be heated, is introduced between the film 2 and the pressure roller 4 from the image forming portion (transfer portion), and is nipped and conveyed together with the film 2 in the pressure contact nip portion N. As a result, the heat of the heating element 3 is applied to the recording material P via the film 2, and the unfixed visible image (toner image) T on the recording material P is heated and fixed on the surface of the recording material P. Then, the recording material P passing through the pressure nip portion N is separated from the surface of the film 2 and conveyed.

【0033】本実施の形態では、非通紙部に設けられた
第2の検温素子6の出力により非通紙部昇温を監視し、
昇温を緩和する制御を行う。非通紙部昇温を緩和する制
御としては、或る閾値以上の温度を第2の検温素子6が
検知した場合、スループットを下げる(紙間時間を長く
する)、定着温度を下げる、加熱体3への通電を止めて
一時画像形成を中断する等の制御が考えられる。本実施
の形態では、第2の検温素子6が所定温度以上の温度を
検知した場合、紙間時間を通常よりも長くしてスループ
ットを下げる制御を行っている。又、閾値温度を2つ以
上設け、それらの閾値温度別に異なる非通紙部昇温を緩
和する制御を行うことも可能である。更に、非通紙部温
度を監視するのではなく、非通紙部の温度上昇速度を監
視し、或る閾値を超えると非通紙部昇温を緩和する制御
を実行することも可能である。
In the present embodiment, the temperature rise of the non-sheet passing portion is monitored by the output of the second temperature measuring element 6 provided in the non-sheet passing portion,
Control is performed to mitigate the temperature rise. As a control for reducing the temperature rise in the non-sheet passing portion, when the second temperature detecting element 6 detects a temperature equal to or higher than a certain threshold value, the throughput is lowered (the paper interval time is lengthened), the fixing temperature is lowered, and the heating member is heated. Control such as stopping the energization of 3 to temporarily suspend the image formation is conceivable. In the present embodiment, when the second temperature detecting element 6 detects a temperature equal to or higher than a predetermined temperature, the paper interval time is set longer than usual to control the throughput. Further, it is also possible to provide two or more threshold temperatures and perform control so as to mitigate the temperature rise in the non-sheet passing portion that differs depending on the threshold temperatures. Furthermore, instead of monitoring the temperature of the non-sheet passing portion, it is also possible to monitor the temperature rising speed of the non-sheet passing portion and execute control to reduce the temperature rise of the non-sheet passing portion when a certain threshold is exceeded. .

【0034】前述したステー1と第2の検温素子6の支
持部材7との空隙A、Eが抵抗発熱体32が存在する領
域にあると、空隙部ではヒータ基板31の非フィルム摺
動面からのステー1或は第2の検温素子6の支持部材7
への熱の伝達がないため、局所的に高温になる。特に小
サイズ厚紙が重送して通紙されて非通紙部昇温が大きい
場合には、局所的に著しく高温になり、熱応力によるヒ
ータ基板31の破損(ヒータ割れ)、ステー1・フィル
ム2・加圧ローラ4・第2の検温素子6の支持部材7等
の劣化・破損を招く可能性がある。前述したように、こ
の空隙は小さくすることはできるが、寸法公差上完全に
無くすことは不可能である。
When the gaps A and E between the stay 1 and the support member 7 of the second temperature measuring element 6 are in the region where the resistance heating element 32 exists, the gap from the non-film sliding surface of the heater substrate 31 is increased. Support member 7 for stay 1 or second temperature measuring element 6
There is no transfer of heat to, resulting in high temperatures locally. In particular, when small size thick paper is fed by double feeding and the temperature rise in the non-paper feeding portion is large, the temperature becomes extremely high locally, and the heater substrate 31 is damaged (heater cracks) due to thermal stress. 2. The pressure roller 4, the supporting member 7 of the second temperature measuring element 6, and the like may be deteriorated or damaged. As described above, this void can be made small, but it is impossible to completely eliminate it due to dimensional tolerance.

【0035】内側の空隙Eに関しては、 第2の検温素子
6により非通紙部昇温を緩和する制御が可能であるた
め、上記劣化・破損の可能性は小さい。
With respect to the inner space E, it is possible to control the temperature rise of the non-sheet passing portion by the second temperature detecting element 6, so that the possibility of deterioration and damage is small.

【0036】一方、外側の空隙Aに関しては、第2の検
温素子6が通紙部となり、外側の空隙Aが非通紙部にな
るような非定型サイズの小サイズ厚紙が通紙された場合
は、第2の検温素子6では非通紙部昇温が検知不能であ
り、前記劣化・破損の危険性が生じる。
On the other hand, with respect to the outer space A, when the second temperature measuring element 6 serves as a paper passing portion and the outer space A serves as a non-paper passing portion, a small-sized cardboard of a non-standard size is passed. The second temperature measuring element 6 cannot detect the temperature rise in the non-sheet passing portion, and the risk of deterioration and damage arises.

【0037】そこで、本実施の形態では、外側の空隙A
を抵抗発熱体32の長手方向外側に配置する。図1に第
2の検温素子6及び第2の検温素子6の支持部材7付近
の拡大図を示す。
Therefore, in this embodiment, the outer space A is formed.
Are arranged outside the resistance heating element 32 in the longitudinal direction. FIG. 1 shows an enlarged view of the second temperature measuring element 6 and the vicinity of the support member 7 of the second temperature measuring element 6.

【0038】図1に示すように、本実施の形態では、長
手方向外側から外側の空隙A、抵抗発熱体32端B、最
大通紙域端C、第2の検温素子6Dの順に配置されてい
る。
As shown in FIG. 1, in the present embodiment, the air gap A from the outer side in the longitudinal direction to the outer side, the resistance heating element 32 end B, the maximum sheet passing area end C, and the second temperature measuring element 6D are arranged in this order. There is.

【0039】先ず、外側の空隙Aは抵抗発熱体32端B
の外側にあるため、前述した不定型サイズの小サイズ厚
紙が通紙された場合でも外側の空隙A部の局所的な昇温
はなく、前記劣化・破損を防止することができる。次
に、抵抗発熱体32端Bが最大通紙域端Cより外側にあ
るのは、記録材P端部の定着性を確保するためである。
そして、第2の検温素子6Dが最大通紙域端Cより内側
にあるのは、第2の検温素子6で最大サイズ紙の非通紙
部昇温を検知しないためである。本実施の形態において
は、第2の検温素子6の検知温度が或る閾値を超えると
スループットを下げる制御を行っているため、第2の検
温素子6Dが最大通紙域端Cより外側にあると最大サイ
ズ紙でスループットが下がる可能性がある。又、小サイ
ズ紙の中でも幅の狭い記録材の非通紙部昇温を精度良く
検知するという観点においても、第2の検温素子6は中
央に近い位置に配置することが望ましい。
First, the outer space A is the end B of the resistance heating element 32.
Since it is on the outer side of the above, even when the small size thick paper of the irregular size described above is passed through, there is no local temperature rise in the outer space A portion, and the deterioration / damage can be prevented. Next, the reason that the end B of the resistance heating element 32 is outside the end C of the maximum paper passing area is to secure the fixing property of the end portion of the recording material P.
The reason why the second temperature measuring element 6D is inside the maximum sheet passing area edge C is that the second temperature measuring element 6 does not detect the temperature rise in the non-sheet passing portion of the maximum size sheet. In the present embodiment, when the detected temperature of the second temperature detecting element 6 exceeds a certain threshold value, the throughput is controlled to be reduced, so that the second temperature detecting element 6D is outside the maximum sheet passing area edge C. And the maximum size paper may reduce the throughput. Further, from the viewpoint of accurately detecting the temperature rise in the non-sheet passing portion of the recording material having a narrow width even in small size paper, it is desirable to dispose the second temperature detecting element 6 near the center.

【0040】又、本実施の形態においては、加圧ローラ
4のゴム部の端が長手方向において外側の空隙Aよりも
外側になるようにした。局所的に温度が高くなる所がゴ
ム部端の外側にあると加圧ローラ4ヘ熱が伝達されない
ため、より高温になり、ヒータ3破損の危険性が高ま
る。本実施の形態では、外側の空隙Aは抵抗発熱体32
の存在する領域外に配置されているため、その部分の温
度上昇は十分小さいが、ゴム部端の内側に配置していた
方がヒータ3等の破損防止にはより効果的である。
Further, in the present embodiment, the end of the rubber portion of the pressure roller 4 is located outside the outer space A in the longitudinal direction. If the location where the temperature locally rises is outside the end of the rubber portion, heat is not transmitted to the pressure roller 4, so the temperature becomes higher and the risk of damage to the heater 3 increases. In this embodiment, the outer space A is the resistance heating element 32.
Since it is arranged outside the region where the temperature is present, the temperature rise in that part is sufficiently small, but it is more effective to prevent damage to the heater 3 etc. if it is arranged inside the end of the rubber part.

【0041】従来の加熱装置と本実施の形態に係る加熱
装置との比較を以下に示す。
A comparison between the conventional heating device and the heating device according to the present embodiment is shown below.

【0042】図8は従来の加熱装置の一例における第2
の検温素子付近の拡大図である。この従来例において
は、 第2の検温素子として本実施の形態と同様の外部当
接型サーミスタを使用している。本実施の形態と異なる
のは、外側の空隙A’が抵抗発熱体32端B及び最大通
紙域端Cよりも長手方向において内側にあることであ
り、それ以外は本実施の形態と全く同じ構成・位置関係
となっている。
FIG. 8 shows a second example of the conventional heating device.
FIG. 3 is an enlarged view of the temperature measuring element and its vicinity. In this conventional example, an external contact type thermistor similar to that of the present embodiment is used as the second temperature measuring element. The difference from the present embodiment is that the outer space A ′ is inside the resistance heating element 32 end B and the maximum paper passing area end C in the longitudinal direction, and other than that is exactly the same as the present embodiment. It has a configuration / positional relationship.

【0043】両者の加熱装置を用いてヒータ割れの試験
を行った。試験は、温度5℃の環境において、図8中の
Hの位置が紙端になるような不定型サイズの小サイズ厚
紙(216g/m2 )を通紙し、その後、加熱装置が常
温に戻るまでファンで冷却して再び通紙する、というサ
イクルを繰り返すことで行った。ヒータ3が冷えた状態
から一気に温度を上昇させまた冷却するというサイクル
を繰り返すことにより、ヒータ基板31に断続的に熱応
力が発生し、ヒータ3は破損し易くなる。本試験で用い
たサイズの記録材を通紙する場合、本実施の形態、従来
例共に第2の検温素子6Dの位置は通紙部となるため、
非通紙部昇温の検知は不能であり、且つ、外側の空隙
A、A’は非通紙部となる。ここで、外側の空隙A、
A’の長手方向における長さは約1mmとした。これは
寸法公差上最も空隙が広くなる場合の値であり、最もヒ
ータ割れに対して厳しい条件である。尚、試験はそれぞ
れ2回ずつ別の加熱装置を用い行った。ヒータ割れ試験
の結果を表1に示す。
A heater cracking test was conducted using both heating devices. In the test, in an environment of a temperature of 5 ° C., small size thick paper (216 g / m 2 ) of an indeterminate size is passed so that the position of H in FIG. 8 is the edge of the paper, and then the heating device returns to room temperature. It was done by repeating the cycle of cooling with a fan and passing the paper again. By repeating a cycle in which the temperature of the heater 3 is raised and cooled at once, the thermal stress is intermittently generated in the heater substrate 31, and the heater 3 is easily damaged. When the recording material of the size used in this test is passed, the position of the second temperature measuring element 6D is the sheet passing portion in both the present embodiment and the conventional example.
It is impossible to detect the temperature rise in the non-sheet passing portion, and the outer voids A and A'become the non-sheet passing portion. Here, the outer void A,
The length of A'in the longitudinal direction was about 1 mm. This is the value when the void is the widest due to dimensional tolerance, and is the most severe condition for heater cracking. The test was conducted twice using different heating devices. Table 1 shows the results of the heater cracking test.

【0044】 表1に示す通り、従来例の加熱装置においては1回目、
2回目共に外側の空隙A’部でヒータ割れが発生した
が、本実施の形態に係る加熱装置においてはヒータ割れ
は発生せず、ステー1・フィルム2・加圧ローラ4等の
劣化・破損もなかった。従来例の加熱装置では、外側の
空隙A’は抵抗発熱体32の存在する領域にあるため、
局所的な温度上昇が著しく、ヒータ基板31に発生する
熱応力がヒータ基板31の破断応力を超えてヒータ割れ
に至ったと考えられる。本実施の形態に係る加熱装置に
おいても、外側の空隙A部はその周辺に比べてて若干温
度は高いが、抵抗発熱体32の存在する領域ではないた
め、温度上昇は十分低くてヒータ割れに至るような熱応
力は発生しない。
[0044] As shown in Table 1, in the heating device of the conventional example,
Although the heater cracked in the outer space A'in both the second time, the heater cracked did not occur in the heating device according to the present embodiment, and the stay 1, the film 2, the pressure roller 4 and the like were not deteriorated or damaged. There wasn't. In the heating device of the conventional example, since the outer space A ′ is in the region where the resistance heating element 32 exists,
It is considered that the local temperature rise was remarkable and the thermal stress generated in the heater substrate 31 exceeded the breaking stress of the heater substrate 31 and led to the heater cracking. Also in the heating device according to the present embodiment, the temperature of the outside void A is slightly higher than that of its surroundings, but since it is not in the region where the resistance heating element 32 exists, the temperature rise is sufficiently low that heater cracking occurs. No thermal stress is generated.

【0045】以上説明したように、本実施の形態に係る
加熱装置及び画像形成装置を用いることによって、第2
の検温素子として外部当接型サーミスタを用いた場合に
生じる可能性のあるステーと第2の検温素子の支持部材
との空隙に起因するヒータ・ステー・フィルム・加圧ロ
ーラ等の劣化・破損を防止することができる。
As described above, by using the heating device and the image forming apparatus according to the present embodiment, the second
Deterioration or damage of the heater, stay, film, pressure roller, etc. due to the gap between the stay and the support member of the second temperature detecting element that may occur when an external contact type thermistor is used as the temperature measuring element of Can be prevented.

【0046】尚、本実施の形態は記録材を中央基準で通
紙する場合の加熱装置であるが、記録材を端部基準で通
紙する加熱装置にも本発明は適用可能である。又、本実
施の形態では非通紙部昇温を検知するための検温素子を
1つ設けたが、この検温素子を加熱体の長手方向に対し
て異なる位置に複数個設けても良い。
Although the present embodiment is a heating device for passing the recording material on the basis of the center, the present invention is also applicable to a heating device for passing the recording material on the basis of the end portion. Further, although one temperature detecting element for detecting the temperature rise in the non-sheet passing portion is provided in the present embodiment, a plurality of temperature detecting elements may be provided at different positions in the longitudinal direction of the heating body.

【0047】<実施の形態2>次に、本発明の実施の形
態2について説明する。
<Second Embodiment> Next, a second embodiment of the present invention will be described.

【0048】本実施の形態では、 第1の検温素子も外部
当接型サーミスタとする。その他の加熱装置及び画像形
成装置の構成は実施例の形態1と同様である。
In this embodiment, the first temperature detecting element is also an external contact type thermistor. Other configurations of the heating device and the image forming apparatus are similar to those of the first embodiment.

【0049】図6は本実施の形態に係る加熱体3の正面
図及び通電制御を行う回路を表す図である。図6中には
ステー1のヒータ3の接触面も示している。
FIG. 6 is a front view of the heating element 3 according to the present embodiment and a diagram showing a circuit for controlling energization. FIG. 6 also shows the contact surface of the heater 3 of the stay 1.

【0050】本実施の形態では、第1の検温素子9とし
て実施の形態1の第2の検温素子6と同じチップサーミ
スタを使用しており、第1の検温素子9の支持部材10
も実施の形態1の支持部材7と同構成になっている。従
って、第1の検温素子9及びその支持部材10の拡大図
は実施の形態1で説明した図4と同様である。本実施の
形態では、第1の検温素子9及びその支持部材10は最
小通紙域内に配置している。
In the present embodiment, the same chip thermistor as the second temperature measuring element 6 of the first embodiment is used as the first temperature measuring element 9, and the supporting member 10 for the first temperature measuring element 9 is used.
Also has the same configuration as the support member 7 of the first embodiment. Therefore, an enlarged view of the first temperature measuring element 9 and its supporting member 10 is the same as FIG. 4 described in the first embodiment. In the present embodiment, the first temperature measuring element 9 and its supporting member 10 are arranged within the minimum sheet passing area.

【0051】第1の検温素子9を外部当接型にすると、
実施の形態1で述べた実装型のチップサーミスタ用の導
電パターンをヒータ基板31上に形成する必要がなくな
るため、導電パターンを形成する場合に比べてヒータ基
板幅を狭くすることが可能になる。ヒータ基板幅を狭く
すると、ヒータ幅方向においてヒータ基板31端から抵
抗発熱体32までの距離を小さくすることが可能である
ため、ヒータ幅方向の温度分布が均一に近づく。熱応力
はヒータ幅方向の温度分布が均一に近づく程小さくなる
ため、本実施の形態の構成は、実施の形態1の構成に対
して更にヒータ割れ防止に効果がある。勿論、ヒータ基
板幅を狭くするとコストダウン・低熱容量化によるウェ
イトタイムの短縮等の効果もある。
When the first temperature measuring element 9 is of the external contact type,
Since it is not necessary to form the conductive pattern for the mounting type chip thermistor described in the first embodiment on the heater substrate 31, it is possible to reduce the width of the heater substrate as compared with the case where the conductive pattern is formed. When the width of the heater substrate is narrowed, the distance from the end of the heater substrate 31 to the resistance heating element 32 can be reduced in the heater width direction, and therefore the temperature distribution in the heater width direction becomes closer to uniform. Since the thermal stress decreases as the temperature distribution in the heater width direction becomes closer to uniform, the configuration of the present embodiment is more effective in preventing heater cracking than the configuration of the first embodiment. Of course, if the width of the heater substrate is narrowed, the cost can be reduced and the wait time can be shortened by lowering the heat capacity.

【0052】又、本実施の形態の場合、CPU24、第
1の検温素子9等の故障によりヒータ3への通電制御が
不能になり、ヒータ3が破損した場合、抵抗発熱体32
(AC)と第1の検温素子9(DC)との絶縁が確実に
確保できる。よって、サーミスタをヒータ基板裏面に実
装する実施の形態1に比べて加熱装置及び画像形成装置
故障時の安全性は向上する。
Further, in the case of the present embodiment, when the heater 3 is damaged due to the failure of the CPU 24, the first temperature detecting element 9, etc., the energization control to the heater 3 becomes impossible, the resistance heating element 32 is used.
Insulation between (AC) and the first temperature detecting element 9 (DC) can be reliably ensured. Therefore, as compared with the first embodiment in which the thermistor is mounted on the back surface of the heater substrate, the safety at the time of failure of the heating device and the image forming apparatus is improved.

【0053】但し、本実施の形態の構成においては、第
1の検温素子9とヒータ基板31との間には絶縁層(ポ
リイミドフィルム)が存在するため、実施の形態1に比
べて応答性が若干悪化する。
However, in the structure of the present embodiment, since the insulating layer (polyimide film) is present between the first temperature detecting element 9 and the heater substrate 31, the responsiveness is higher than that of the first embodiment. It gets a little worse.

【0054】ステー1と第1の検温素子9の支持部材1
0との空隙(図6中のF、G)に関しては、空隙A、E
と同じく局所的に温度は高くなるが、何れも最小通紙域
内にあり、非通紙部昇温の影響は受けないため、それら
に起因するヒータ等の劣化・破損は生じない。
Support member 1 for stay 1 and first temperature measuring element 9
Regarding the voids with 0 (F, G in FIG. 6), the voids A, E
Although the temperature rises locally like the above, since they are both within the minimum sheet passing area and are not affected by the temperature rise in the non-sheet passing portion, the deterioration or damage of the heater or the like due to them does not occur.

【0055】上記構成から成る加熱装置及び画像形成装
置を用いることによって、実施の形態1と同じく、第2
の検温素子として外部当接型サーミスタを用いた場合生
じる可能性のあるステーと第2の検温素子の支持部材と
の空隙に起因するヒータ・ステー・フィルム・加圧ロー
ラ等の劣化・破損を防止することができる。又、CP
U、第1の検温素子等の故障時における安全性も向上す
る。
By using the heating device and the image forming apparatus having the above structure, the second device can be used as in the first embodiment.
Prevents deterioration and damage of heaters, stays, films, pressure rollers, etc. due to the gap between the stay and the support member of the second temperature sensing element that may occur when an external contact type thermistor is used as the temperature sensing element can do. Also, CP
The safety at the time of failure of U, the first temperature detecting element, etc. is also improved.

【0056】尚、本実施の形態は記録材を中央基準で通
紙する場合の加熱装置であるが、記録材を端部基準で通
紙する加熱装置にも本発明は適用可能である。又、本実
施の形態では非通紙部昇温を検知するための検温素子を
1つ設けたが、この検温素子を加熱体の長手方向に対し
て異なる位置に複数個設けても良い。
Although the present embodiment is a heating device for passing the recording material on the basis of the center, the present invention is also applicable to a heating device for passing the recording material on the basis of the end portion. Further, although one temperature detecting element for detecting the temperature rise in the non-sheet passing portion is provided in the present embodiment, a plurality of temperature detecting elements may be provided at different positions in the longitudinal direction of the heating body.

【0057】[0057]

【発明の効果】以上の説明で明らかなように、本発明に
よれば、第2の検温素子として外部当接型サーミスタを
用いた場合に生じる可能性のあるステーと第2の検温素
子の支持部材との空隙に起因するヒータ・ステー・フィ
ルム・加圧ローラ等の劣化・破損を防止することがで
き、加熱装置及び画像形成装置の信頼性向上を図ること
ができるという効果が得られる。
As is apparent from the above description, according to the present invention, there is a possibility that the stay and the second temperature sensing element may be supported when an external contact type thermistor is used as the second temperature sensing element. It is possible to prevent deterioration and damage of the heater, stay, film, pressure roller, etc. due to the gap between the members, and it is possible to improve the reliability of the heating device and the image forming apparatus.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態1に係る加熱装置の第2の
検温素子及びその支持部材付近の拡大図である。
FIG. 1 is an enlarged view of a vicinity of a second temperature measuring element and its supporting member of a heating device according to a first embodiment of the present invention.

【図2】本発明の実施の形態1に係る加熱装置の加熱体
の正面図及び通電制御を行う回路を示す図である。
FIG. 2 is a front view of a heating body of the heating device according to the first embodiment of the present invention and a diagram showing a circuit for controlling energization.

【図3】本発明の実施の形態1に係る加熱装置(フィル
ム加熱方式の画像加熱定着装置)の概略構成図である。
FIG. 3 is a schematic configuration diagram of a heating device (film heating type image heating and fixing device) according to the first embodiment of the present invention.

【図4】本発明の実施の形態1に係る加熱装置の第2の
検温素子及びその支持部材を示す図である。
FIG. 4 is a diagram showing a second temperature measuring element and its supporting member of the heating device according to the first embodiment of the present invention.

【図5】本発明に係る画像形成装置(レーザービームプ
リンタ)の概略断面図である。
FIG. 5 is a schematic sectional view of an image forming apparatus (laser beam printer) according to the present invention.

【図6】本発明の実施の形態2に係る加熱装置の加熱体
の正面図及び通電制御を行う回路を示す図である。
FIG. 6 is a front view of a heating body of a heating device according to a second embodiment of the present invention and a diagram showing a circuit for controlling energization.

【図7】従来の加熱装置(フィルム加熱方式の画像加熱
定着装置)の概略構成図である。
FIG. 7 is a schematic configuration diagram of a conventional heating device (film heating type image heating and fixing device).

【図8】従来の加熱装置の一例における第2の検温素子
及びその支持部材付近の拡大図である。
FIG. 8 is an enlarged view of the vicinity of a second temperature measuring element and its supporting member in an example of a conventional heating device.

【符号の説明】[Explanation of symbols]

1 ステー 2 定着フィルム 3 ヒータ(加熱体) 4 加圧ローラ(加圧体) 4a 芯金 4b 弾性体層 4c 離型層 5 第1の検温素子 6 第2の検温素子 7 第2の検温素子の支持部材 7a 耐熱性樹脂層 7b 断熱層 8 絶縁層 9 第1の検温素子 10 第1の検温素子の支持部材 24 CPU 25 トライアック 26 AC電源 31 基板 32 抵抗発熱体 34 オーバーコート層 N ニップ部 P 記録材 T トナー 1 stay 2 fixing film 3 heater (heating body) 4 Pressure roller (Pressure body) 4a core metal 4b elastic layer 4c Release layer 5 First temperature measuring element 6 Second temperature measuring element 7 Second temperature measuring element support member 7a Heat resistant resin layer 7b heat insulation layer 8 insulating layers 9 First temperature measuring element 10 First temperature measuring element support member 24 CPU 25 triacs 26 AC power supply 31 substrate 32 resistance heating element 34 Overcoat layer N Nip part P recording material T toner

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 加熱体と、該加熱体の支持体と、前記加
熱体に接触摺動する耐熱性の定着フィルムと、該定着フ
ィルムを駆動し且つ定着フィルムを介して被加熱材を前
記加熱体に密着させる加圧部材と、前記加熱体の温度を
検知する第1の検温素子と、該第1の検温素子の検知温
度に基づいて加熱体への通電制御する通電制御手段と、
加熱体の長手方向で第1の検温素子とは異なる位置に設
けられた加熱体の非定着フィルム摺動面に接触している
第2の検温素子及び該第2の検温素子の支持体とを有
し、前記加熱体と前記加圧部材により形成されるニップ
部を前記定着フィルムと前記被加熱材が一緒に挟持搬送
されることにより被加熱材を加熱する加熱装置におい
て、 前記第2の検温素子の支持体と加熱体の支持体との間の
長手方向外側の空隙を加熱体の発熱領域よりも長手方向
において外側に配置したことを特徴とする加熱装置。
1. A heating body, a support for the heating body, a heat-resistant fixing film that comes into contact with and slides on the heating body, and a heating material that drives the fixing film and heats a material to be heated through the fixing film. A pressurizing member brought into close contact with the body, a first temperature detecting element for detecting the temperature of the heating body, and an energization control means for controlling energization of the heating body based on the temperature detected by the first temperature detecting element,
A second temperature measuring element in contact with the sliding surface of the non-fixing film of the heating element, which is provided at a position different from the first temperature measuring element in the longitudinal direction of the heating element, and a support for the second temperature measuring element. A heating device that heats a material to be heated by sandwiching and transporting the fixing film and the material to be heated together with a nip portion formed by the heating body and the pressing member, wherein the second temperature measurement A heating device, characterized in that a gap on the outer side in the longitudinal direction between the support of the element and the support of the heating element is arranged outside the heat generating region of the heating element in the longitudinal direction.
【請求項2】 使用可能な最大幅の被加熱材が通過する
領域は加熱体の発熱領域よりも長手方向において内側に
位置することを特徴とする請求項1記載の加熱装置。
2. The heating device according to claim 1, wherein the region through which the material to be heated having the maximum usable width passes is located inside the heating region of the heating body in the longitudinal direction.
【請求項3】 前記第1の検温素子を使用可能な最小幅
の被加熱材が通過する領域内に設け、前記第2の検温素
子を使用可能な最小幅の被加熱材が通過する領域外且つ
使用可能な最大幅の被加熱材が通過する領域内に設けた
ことを特徴とする請求項1又は2記載の加熱装置。
3. The first temperature measuring element is provided in a region through which a usable minimum-width heated material passes, and the second temperature measuring element is provided outside a minimum-width-enabled heated material pass region. The heating device according to claim 1 or 2, wherein the heating device is provided in a region through which a material to be heated having a maximum usable width passes.
【請求項4】 前記第2の検温素子及びその支持体は、
加熱体の非定着フィルム摺動面から絶縁層・検温素子・
断熱層・耐熱性樹脂層の順に形成されていることを特徴
とする請求項1〜3の何れかに記載の加熱装置。
4. The second temperature measuring element and its support are
From the non-fixing film sliding surface of the heating element to the insulation layer, temperature sensor,
The heating device according to claim 1, wherein a heat insulating layer and a heat resistant resin layer are formed in this order.
【請求項5】 前記第2の検温素子の検知温度に応じて
制御を変更することを特徴とする請求項1〜4の何れか
に記載の加熱装置。
5. The heating apparatus according to claim 1, wherein the control is changed according to the temperature detected by the second temperature detecting element.
【請求項6】 記録材上に画像を形成する像形成手段
と、記録材上の画像を加熱する像加熱手段を有する画像
形成装置において、 前記像加熱手段を請求項1〜5の何れかに記載の加熱装
置で構成したことを特徴とする画像形成装置。
6. An image forming apparatus having an image forming means for forming an image on a recording material and an image heating means for heating an image on the recording material, wherein the image heating means is any one of claims 1 to 5. An image forming apparatus comprising the above described heating device.
JP2001324882A 2001-10-23 2001-10-23 Heating device and image forming apparatus Pending JP2003131515A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001324882A JP2003131515A (en) 2001-10-23 2001-10-23 Heating device and image forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001324882A JP2003131515A (en) 2001-10-23 2001-10-23 Heating device and image forming apparatus

Publications (1)

Publication Number Publication Date
JP2003131515A true JP2003131515A (en) 2003-05-09

Family

ID=19141539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001324882A Pending JP2003131515A (en) 2001-10-23 2001-10-23 Heating device and image forming apparatus

Country Status (1)

Country Link
JP (1) JP2003131515A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071894A (en) * 2004-09-01 2006-03-16 Canon Inc Fixing device
JP2006259718A (en) * 2005-03-16 2006-09-28 Toshiba Corp Fixing device of image forming apparatus
JP2013134423A (en) * 2011-12-27 2013-07-08 Canon Inc Image heating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071894A (en) * 2004-09-01 2006-03-16 Canon Inc Fixing device
JP4579626B2 (en) * 2004-09-01 2010-11-10 キヤノン株式会社 Fixing device
JP2006259718A (en) * 2005-03-16 2006-09-28 Toshiba Corp Fixing device of image forming apparatus
JP2013134423A (en) * 2011-12-27 2013-07-08 Canon Inc Image heating device

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