JP2003128910A - Polishing pad - Google Patents
Polishing padInfo
- Publication number
- JP2003128910A JP2003128910A JP2001319788A JP2001319788A JP2003128910A JP 2003128910 A JP2003128910 A JP 2003128910A JP 2001319788 A JP2001319788 A JP 2001319788A JP 2001319788 A JP2001319788 A JP 2001319788A JP 2003128910 A JP2003128910 A JP 2003128910A
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- polishing
- slurry
- oxide monomer
- diol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体、電子部品
等の被研磨部材の研磨加工において使用される研磨パッ
ドに関し、特にＳｉ基板、ＧａＡｓ基板、ガラス、ハー
ドデイスク、ＬＣＤ基板等の薄型基板用の研磨パッドに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad used in polishing a member to be polished such as semiconductors and electronic parts, and particularly for thin substrates such as Si substrate, GaAs substrate, glass, hard disk, LCD substrate and the like. Regarding polishing pad.
【０００２】[0002]
【従来の技術】水系媒体中にシリカ粒子を分散させた研
磨用スラリーを用いた化学機械研磨（以下、ＣＭＰ研磨
ともいう)方法を、以下に説明する。2. Description of the Related Art A chemical mechanical polishing (hereinafter also referred to as CMP polishing) method using a polishing slurry in which silica particles are dispersed in an aqueous medium will be described below.
【０００３】ＣＭＰ研磨は、研磨機の下定盤に研磨パッ
ドを貼付けたものと、上定盤の下面にウエハを取り付け
たものを対向させ、研磨する前に、下定盤上に配置した
パッド表面をコンディショニングし、その後上定盤を下
定盤に一定加重で押し付け、研磨パッド上に研磨用スラ
リーを供給しつつ上下定盤を回転させることで、上定盤
の下面に保持したウエハ表面を研磨している。In CMP polishing, one in which a polishing pad is attached to the lower surface plate of a polishing machine and one in which a wafer is attached to the lower surface of the upper surface plate are opposed to each other, and the surface of the pad placed on the lower surface plate is polished before polishing. After conditioning, the upper surface plate is pressed against the lower surface plate with a constant load, and the upper and lower surface plates are rotated while supplying the polishing slurry onto the polishing pad, thereby polishing the wafer surface held on the lower surface of the upper surface plate. There is.
【０００４】上記ＣＭＰ研磨方法に用いられる研磨パッ
ドは、その素材が主としてポリウレタンから構成されて
いる。このポリウレタンは疎水性であるため、この研磨
パッドを用いてウエハ表面を研磨する場合、スラリーが
研磨パッドになじまないという問題がある。すなわち、
研磨パッドがスラリーをはじいてスラリーの供給量が不
均一となる。また、スラリーが研磨パッド上に滞留しな
いため、スラリーがムダに消費される。その結果、研磨
効率が悪く研磨レートが低下するという欠点がある。The material of the polishing pad used in the above CMP polishing method is mainly composed of polyurethane. Since this polyurethane is hydrophobic, there is a problem that when the wafer surface is polished using this polishing pad, the slurry does not fit into the polishing pad. That is,
The polishing pad repels the slurry and the amount of the slurry supplied becomes uneven. Moreover, since the slurry does not stay on the polishing pad, the slurry is wasted. As a result, there is a drawback that the polishing efficiency is poor and the polishing rate is lowered.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上記の実状に
着目してなされたものであって、その目的とするところ
は、研磨パッドにスラリーをなじみやすくすることによ
り、研磨レートの増加を図ることができる研磨パッドを
提供することにある。SUMMARY OF THE INVENTION The present invention has been made by paying attention to the above situation, and an object of the present invention is to increase the polishing rate by making the slurry easy to adapt to the polishing pad. It is to provide a polishing pad that can be used.
【０００６】[0006]
【課題を解決するための手段】本発明の研磨パッドは、
親水性基を有する化合物が共重合されたウレタン樹脂を
含有し、かつ親水剤を含有するポリウレタン組成物より
なり、そのことにより上記目的が達成される。The polishing pad of the present invention comprises:
A polyurethane composition containing a urethane resin copolymerized with a compound having a hydrophilic group and containing a hydrophilic agent, thereby achieving the above object.
【０００７】一つの実施態様では、前記親水剤が、２，
４，７，９−テトラメチル−５−デシン−４，７−ジオ
ール−ジポリオキシエチレンエーテル、２，４，７、９
−テトラメチル−５−デシン−４，７−ジオール、およ
びポリメチルアルキルシロキサンからなる群から選択さ
れる少なくとも一種でり、前記親水性基を有する化合物
が、エチレンオキサイドモノマー、プロピレンオキサイ
ドモノマー、およびエチレンプロピレンオキサイドモノ
マーからなる群から選択される少なくとも一種である。[0007] In one embodiment, the hydrophilic agent is 2,
4,7,9-Tetramethyl-5-decyne-4,7-diol-dipolyoxyethylene ether, 2,4,7,9
-Tetramethyl-5-decyne-4,7-diol, and at least one selected from the group consisting of polymethylalkylsiloxanes, wherein the compound having a hydrophilic group is an ethylene oxide monomer, a propylene oxide monomer, or ethylene. It is at least one selected from the group consisting of propylene oxide monomers.
【０００８】[0008]
【発明の実施の形態】以下本発明を詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
【０００９】本発明の研磨パッドはポリウレタン組成物
から形成され、いわゆるプレポリマー法やワンショット
法で製造することができる。The polishing pad of the present invention is formed of a polyurethane composition and can be manufactured by a so-called prepolymer method or a one-shot method.
【００１０】プレポリマー法とは、ポリオール成分とイ
ソシアネート成分との反応物であるウレタンプレポリマ
ーを用い、ジアミン類又はジオール類、発泡剤、触媒等
を添加混合して得られるポリウレタン組成物を硬化させ
る方法である。ワンショット法とは、ポリオール成分、
イソシアネート成分、ジアミン類又はジオール類、そし
て発泡剤、触媒等を混合して得られるポリウレタン組成
物を硬化させる方法である。In the prepolymer method, a urethane prepolymer which is a reaction product of a polyol component and an isocyanate component is used, and a polyurethane composition obtained by adding and mixing diamines or diols, a foaming agent, a catalyst and the like is cured. Is the way. The one-shot method is a polyol component,
It is a method of curing a polyurethane composition obtained by mixing an isocyanate component, diamines or diols, a foaming agent, a catalyst and the like.
【００１１】上記ウレタンプレポリマーとしては、ポリ
エーテル系ウレタンプレポリマー、ポリエステル系ウレ
タンプレポリマー、ポリエステルエーテル系ウレタンプ
レポリマーのいずれも使用することができる。As the urethane prepolymer, any of a polyether type urethane prepolymer, a polyester type urethane prepolymer and a polyester ether type urethane prepolymer can be used.
【００１２】ウレタンプレポリマー法において各ウレタ
ンプレポリマーの製造に使用されるポリオール成分とし
て、またワンショット法において使用されるポリオール
成分として、本発明では、親水性基を有する化合物を共
重合させた共重合体を使用する。In the present invention, a copolymer obtained by copolymerizing a compound having a hydrophilic group is used as a polyol component used in the production of each urethane prepolymer in the urethane prepolymer method and as a polyol component used in the one-shot method. Use a polymer.
【００１３】そのような共重合させるモノマーとして
は、エチレンオキサイドモノマー、プロピレンオキサイ
ドモノマー、またはエチレンプロピレンオキサイドモノ
マーがあげられる。Examples of the monomer to be copolymerized include ethylene oxide monomer, propylene oxide monomer, and ethylene propylene oxide monomer.
【００１４】従って、好ましいポリオール成分として
は、以下のポリオールと上記親水性基を有する化合物と
の共重合体があげられる。Therefore, preferred polyol components include copolymers of the following polyols and the above-mentioned compounds having a hydrophilic group.
【００１５】ポリテトラメチレングリコール、ポリプロ
ピレングリコール、ポリエチレングリコール、ポリエチ
レンアジペート、ポリテトラメチレンアジペート、ポリ
ヘキサメチレンアジペート。Polytetramethylene glycol, polypropylene glycol, polyethylene glycol, polyethylene adipate, polytetramethylene adipate, polyhexamethylene adipate.
【００１６】上記イソシアネート成分としては、例え
ば、４、４'−ジフェニルメタンジイソシアネート、
２，４−トリレンジイソシアネート、２，６−トリレン
ジイソシアネート等が挙げられる。The above-mentioned isocyanate component is, for example, 4,4'-diphenylmethane diisocyanate,
2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate and the like can be mentioned.
【００１７】上記ジアミン類としては、４，４’−メチ
レン−ビス（２−クロロアニリン）等があり、ジオール
類としてはエチレングリコール、１、４−ブタンジオー
ル、プロピレングリコール等があげられる。また、硬化
剤として、トリメチロールプロパン等のトリオール類お
よびこれらの混合物を用いてもよい。The diamines include 4,4'-methylene-bis (2-chloroaniline) and the like, and the diols include ethylene glycol, 1,4-butanediol and propylene glycol. Also, triols such as trimethylolpropane and mixtures thereof may be used as the curing agent.
【００１８】上記発泡剤、触媒は従来より公知のものが
使用され、例えば、発泡剤として水またはアゾビスイソ
ブチロニトリルなどの有機発泡剤があり、触媒としてト
リメチレンジアミン等がある。また、シリコーン整泡剤
や充填材が任意に配合される。充填剤としては、たとえ
ばシリカ（疎水性を含む）、カーボン粉末、含水ケイ酸
カルシウム、含水ケイ酸アルミニウム、ケイ酸マグネシ
ウム、炭酸カルシウム、酸化セリウム、炭酸マグネシウ
ムなどの一種以上を挙げることができる。As the above-mentioned foaming agent and catalyst, conventionally known ones are used. For example, as the foaming agent, there are organic foaming agents such as water or azobisisobutyronitrile, and as the catalyst there are trimethylenediamine and the like. Further, a silicone foam stabilizer and a filler are optionally mixed. Examples of the filler include one or more of silica (including hydrophobicity), carbon powder, hydrous calcium silicate, hydrous aluminum silicate, magnesium silicate, calcium carbonate, cerium oxide, magnesium carbonate and the like.
【００１９】研磨パッドの親水性を向上させるために、
ポリウレタン組成物は、さらに、以下の親水剤を含有す
る。In order to improve the hydrophilicity of the polishing pad,
The polyurethane composition further contains the following hydrophilic agent.
【００２０】２，４，７，９−テトラメチル−５−デシ
ン−４，７−ジオール−ジポリオキシエチレンエーテル
（エチレンオキサイド付加量 １５〜９０重量％）、
２，４，７、９−テトラメチル−５−デシン−４，７−
ジオール、ポリメチルアルキルシロキサン。2,4,7,9-tetramethyl-5-decyne-4,7-diol-dipolyoxyethylene ether (ethylene oxide addition amount 15 to 90% by weight),
2,4,7,9-Tetramethyl-5-decyne-4,7-
Diol, polymethylalkyl siloxane.
【００２１】これらの親水剤は、ポリウレタン組成物に
対して０．５〜１０重量％配合することができ、好まし
くは１〜５重量％である。配合量が０．５重量％未満の
ときは研磨パッドの親水度を上げる効果が小さく、１０
重量％を超えるとポリウレタンの膨潤による軟質化等の
欠点がある。These hydrophilic agents can be added in an amount of 0.5 to 10% by weight, preferably 1 to 5% by weight, based on the polyurethane composition. If the blending amount is less than 0.5% by weight, the effect of increasing the hydrophilicity of the polishing pad is small.
If it exceeds 5% by weight, there are drawbacks such as softening due to swelling of polyurethane.
【００２２】上記各成分を混合してポリウレタン組成物
が得られ、このポリウレタン組成物を硬化発泡させて本
発明の研磨パッドが得られる。A polyurethane composition is obtained by mixing the above components, and the polyurethane composition is cured and foamed to obtain the polishing pad of the present invention.
【００２３】得られた研磨パッドの硬度は、ＪＩＳ Ａ
硬度において７０〜１００が好ましく、圧縮率は１．５
〜５．０％が好ましく、また密度は０．３０〜０．８０
ｇ／ｃｍ3が好ましい。さらに好ましい研磨パッドの硬
度は、８０〜９０、圧縮率は２．５〜３．５％、密度は
０．５０〜０．６０ｇ／ｃｍ3であるなお、研磨パッド
の発泡性（孔の径や発泡倍率等）は上記発泡剤、シリコ
ーン系整泡剤等の配合量を変えることにより、調整する
ことができる。The hardness of the obtained polishing pad is JIS A
The hardness is preferably 70 to 100 and the compressibility is 1.5.
~ 5.0% is preferable, and the density is 0.30 to 0.80
g / cm 3 is preferred. Further preferred hardness of the polishing pad is 80-90, the compression ratio 2.5 to 3.5% density is still a 0.50~0.60g / cm 3, Ya diameter effervescent (hole in the polishing pad The foaming ratio and the like) can be adjusted by changing the blending amount of the above-mentioned foaming agent, silicone-based foam stabilizer and the like.
【００２４】このようにして得られた研磨パッドに対す
る研磨パッドのなじみ性は、図１に示すように、研磨パ
ッド１上にスラリーの液滴２をのせたときに（図１
ａ）、図１（ｂ）に示すように、直ぐに研磨パッド１表
面に沿ってスラリーが濡れるという減少で判断すること
ができる。また、この研磨パッドの親水度の程度は、研
磨パッドの表面とスラリーの液滴との接触角によっても
測定することができ、接触角は３０°以下が好ましく、
１０°以下がさらに好ましい。The conformability of the polishing pad thus obtained to the polishing pad is as shown in FIG. 1, when the droplet 2 of the slurry is placed on the polishing pad 1 (see FIG. 1).
As shown in a) and FIG. 1B, it can be judged by the reduction that the slurry gets wet along the surface of the polishing pad 1 immediately. The degree of hydrophilicity of the polishing pad can also be measured by the contact angle between the surface of the polishing pad and the droplet of the slurry, and the contact angle is preferably 30 ° or less.
It is more preferably 10 ° or less.
【００２５】[0025]
【実施例】以下、本発明を実施例により詳細に説明す
る。
（実施例１）
ウレタンプレポリマーＰＴＭＧ−ＴＤＩ系（これはエチ
レンオキサイドをＰＴＭＧに共重合させたジオールを用
いたものである）…１００重量部
イハラケミカル工業（株）製 キャアミンＭＴ（３，
３’ジクロロ−４，４’−ジアミノフェニルメタン）…
２０重量部
東ソー（株）製 ＴＥＤＡ３３Ｌ（トリエチレンジアミ
ン、触媒）…０．１重量部
水（発泡剤）…０．１３重量部
エアープロラクツジャパン（株）のサーフィノール４２
０（４，７，９−テトラメチル−５−デシン−４，７−
ジオール−ジポリオキシエチレンエーテル、親水剤）…
１重量部
上記各成分を混合して得られるポリウレタン組成物を発
泡硬化させて、シート状の研磨パッドを得た。EXAMPLES The present invention will be described in detail below with reference to examples. (Example 1) Urethane prepolymer PTMG-TDI system (this uses a diol obtained by copolymerizing ethylene oxide with PTMG) ... 100 parts by weight Caiamine MT (3, manufactured by Ihara Chemical Industry Co., Ltd.)
3'dichloro-4,4'-diaminophenylmethane) ...
20 parts by weight Tosoh Corp. TEDA33L (triethylenediamine, catalyst) ... 0.1 parts by weight water (foaming agent) ... 0.13 parts by weight Surfactol 42 from Air Prolacts Japan Co., Ltd.
0 (4,7,9-tetramethyl-5-decyne-4,7-
(Diol-dipolyoxyethylene ether, hydrophilic agent) ...
1 part by weight A polyurethane composition obtained by mixing the above components was foamed and cured to obtain a sheet-like polishing pad.
【００２６】得られた研磨パッドのＪＩＳ Ａ硬度を測
定したところ８６であった。厚みは１．０１ｍｍ、圧縮
率は２．８％、密度は０．５１ｇ／ｃｍ3であった。The polishing pad thus obtained had a JIS A hardness of 86. The thickness was 1.01 mm, the compressibility was 2.8%, and the density was 0.51 g / cm 3 .
【００２７】次に、研磨パッドの親水度を以下の方法で
測定した。Next, the hydrophilicity of the polishing pad was measured by the following method.
【００２８】以下の研磨条件にて研磨を行い、これを１
バッチとし、研磨パッド表面に完全にスラリーがなじむ
時間を確認した。
（研磨条件）
圧力：３１０ｇ
定盤回転数：４０ｒｐｍ
スラリー流量：４リットル／ｍｉｎ
研磨時間：３０分
研磨温度：２５℃
被加工物：８インチのシリコンウエハ
その結果、５バッチの後（上記研磨を５回繰り返した
後）にスラリーが研磨パッドになじむことを目視にて確
認した。Polishing was carried out under the following polishing conditions,
A batch was prepared, and the time for the slurry to fully fit on the surface of the polishing pad was confirmed. (Polishing conditions) Pressure: 310 g Surface plate rotation speed: 40 rpm Slurry flow rate: 4 liters / min Polishing time: 30 minutes Polishing temperature: 25 ° C. Workpiece: 8 inch silicon wafer As a result, after 5 batches (after polishing above) After repeating 5 times), it was visually confirmed that the slurry was adapted to the polishing pad.
【００２９】また、得られた研磨パッドの研磨レートを
以下の方法によって測定したところ、０．６２μm／分
であった。
（研磨レートの測定方法）測定方法は以下の通りとし
た。
静電容量計： 岩通テクノシステム製 ＳＴ−３５２５
ＴＨＩＣＫＮＥＳＳＭＥＴＥＲを用いた。静電容量計
による５点測定平均で行った。
（実施例２）親水剤（サーフィノール４２０）の配合量
を５重量部としたこと以外は、実施例１と同様にして研
磨パッドを得た。The polishing rate of the obtained polishing pad was measured by the following method and was found to be 0.62 μm / min. (Measuring method of polishing rate) The measuring method was as follows. Capacitance meter: ST-3525 made by Iwatsu Techno System
A THICKNESSMETER was used. The measurement was performed by averaging five points measured by a capacitance meter. (Example 2) A polishing pad was obtained in the same manner as in Example 1 except that the blending amount of the hydrophilic agent (Surfynol 420) was 5 parts by weight.
【００３０】得られた研磨パッドについて、実施例１と
同様にして、スラリーが研磨パッドになじむまでの時間
を観察し、また研磨レートを測定した。それらの結果を
表２に示す。
（比較例１）ウレタンプレポリマーとして、三井武田ケ
ミカル（株）製ハイプレンＬ−２１３（ウレタンプレポ
リマーＰＴＭＧ−ＴＤＩ系）を用い、かつ親水剤（サー
フィノール４２０）を配合しないこと以外は、実施例１
と同様にして研磨パッドを得た。With respect to the obtained polishing pad, the time until the slurry became compatible with the polishing pad was observed and the polishing rate was measured in the same manner as in Example 1. The results are shown in Table 2. (Comparative Example 1) Example except that Hyprene L-213 (urethane prepolymer PTMG-TDI system) manufactured by Mitsui Takeda Chemical Co., Ltd. was used as the urethane prepolymer and no hydrophilic agent (Surfynol 420) was blended. 1
A polishing pad was obtained in the same manner as in.
【００３１】得られた研磨パッドについて、実施例１と
同様にして、スラリーが研磨パッドになじむまでの時間
を観察し、また研磨レートを測定した。それらの結果を
表２に示す。
（比較例２）親水剤（サーフィノール４２０）を配合し
ないこと以外は、実施例１と同様にして研磨パッドを得
た。With respect to the obtained polishing pad, the time until the slurry became compatible with the polishing pad was observed and the polishing rate was measured in the same manner as in Example 1. The results are shown in Table 2. (Comparative Example 2) A polishing pad was obtained in the same manner as in Example 1 except that the hydrophilic agent (Surfynol 420) was not added.
【００３２】得られた研磨パッドについて、実施例１と
同様にして、スラリーが研磨パッドになじむまでの時間
を観察し、また研磨レートを測定した。それらの結果を
表２に示す。With respect to the obtained polishing pad, the time until the slurry became compatible with the polishing pad was observed and the polishing rate was measured in the same manner as in Example 1. The results are shown in Table 2.
【００３３】[0033]
【表１】 [Table 1]
【００３４】[0034]
【表２】
これらの結果から、本実施例においては、従来品よりス
ラリーがなじみやすくなり、研磨レートの向上が確認さ
れた。また、親水剤の添加量が多いほど、研磨パッドの
親水度が向上し、研磨レートも増加することも確認され
た。[Table 2] From these results, in this example, it was confirmed that the slurry became easier to fit in than the conventional product and the polishing rate was improved. It was also confirmed that the larger the amount of the hydrophilic agent added, the higher the hydrophilicity of the polishing pad and the higher the polishing rate.
【００３５】[0035]
【発明の効果】本発明によれば、親水性基を有する化合
物を共重合させたウレタンプレポリマーを用い、かつ親
水剤を含有したポリウレタン組成物を用いて研磨パッド
を作成したので、両者の相乗作用により、研磨用スラリ
ーの研磨パッドに対するなじみが良好になり、研磨用ス
ラリーが少量で効率のよい研磨が行え、また研磨レート
の高い研磨が行える。According to the present invention, a polishing pad is prepared by using a urethane prepolymer obtained by copolymerizing a compound having a hydrophilic group and a polyurethane composition containing a hydrophilic agent. By the action, the familiarity of the polishing slurry with the polishing pad is improved, efficient polishing can be performed with a small amount of the polishing slurry, and polishing with a high polishing rate can be performed.
【図１】研磨パッド上での研磨用スラリーのなじみを説
明した図である。FIG. 1 is a diagram illustrating familiarization of a polishing slurry on a polishing pad.
１ 研磨パッド ２ スラリーの液滴 1 polishing pad 2 Slurry droplets
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｌ 83/04 Ｃ０８Ｌ 83/04 Ｈ０１Ｌ 21/304 ６２２ Ｈ０１Ｌ 21/304 ６２２Ｆ Ｆターム(参考） 3C058 AA07 AA09 CB03 DA12 DA17 4F071 AA51 AA53 AA67 AC05 AE22 AF04 AF28 DA19 4J002 CH022 CK031 CK041 CP032 EC046 FD202 FD206 GM00Front page continuation (51) Int.Cl. 7 Identification code FI theme code (reference) C08L 83/04 C08L 83/04 H01L 21/304 622 H01L 21/304 622F F term (reference) 3C058 AA07 AA09 CB03 DA12 DA17 4F071 AA51 AA53 AA67 AC05 AE22 AF04 AF28 DA19 4J002 CH022 CK031 CK041 CP032 EC046 FD202 FD206 GM00
Claims (2)
ウレタン樹脂を含有し、かつ親水剤を含有するポリウレ
タン組成物よりなる研磨パッド。1. A polishing pad comprising a polyurethane composition containing a urethane resin copolymerized with a compound having a hydrophilic group and containing a hydrophilic agent.
メチル−５−デシン−４，７−ジオール−ジポリオキシ
エチレンエーテル、２，４，７、９−テトラメチル−５
−デシン−４，７−ジオール、およびポリメチルアルキ
ルシロキサンからなる群から選択された少なくとも一種
であり、前記親水性基を有する化合物が、エチレンオキ
サイドモノマー、プロピレンオキサイドモノマー、およ
びエチレンプロピレンオキサイドモノマーからなる群か
ら選択された少なくとも一種である請求項１に記載の研
磨パッド。2. The hydrophilic agent is 2,4,7,9-tetramethyl-5-decyne-4,7-diol-dipolyoxyethylene ether, 2,4,7,9-tetramethyl-5.
-Decyne-4,7-diol, and at least one selected from the group consisting of polymethylalkylsiloxanes, wherein the compound having a hydrophilic group comprises an ethylene oxide monomer, a propylene oxide monomer, and an ethylene propylene oxide monomer. The polishing pad according to claim 1, which is at least one selected from the group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001319788A JP3851135B2 (en) | 2001-10-17 | 2001-10-17 | Polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001319788A JP3851135B2 (en) | 2001-10-17 | 2001-10-17 | Polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003128910A true JP2003128910A (en) | 2003-05-08 |
| JP3851135B2 JP3851135B2 (en) | 2006-11-29 |
Family
ID=19137292
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001319788A Expired - Lifetime JP3851135B2 (en) | 2001-10-17 | 2001-10-17 | Polishing pad |
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| Country | Link |
|---|---|
| JP (1) | JP3851135B2 (en) |
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