JP2003126955A - Molding method and molding die for semisolid metal goods - Google Patents

Molding method and molding die for semisolid metal goods

Info

Publication number
JP2003126955A
JP2003126955A JP2001325588A JP2001325588A JP2003126955A JP 2003126955 A JP2003126955 A JP 2003126955A JP 2001325588 A JP2001325588 A JP 2001325588A JP 2001325588 A JP2001325588 A JP 2001325588A JP 2003126955 A JP2003126955 A JP 2003126955A
Authority
JP
Japan
Prior art keywords
semi
die
mold
lower mold
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001325588A
Other languages
Japanese (ja)
Inventor
Mitsuru Adachi
充 安達
Satoshi Sato
智 佐藤
Takuma Maeda
琢磨 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Machinery Corp Ltd
Original Assignee
Ube Machinery Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Machinery Corp Ltd filed Critical Ube Machinery Corp Ltd
Priority to JP2001325588A priority Critical patent/JP2003126955A/en
Publication of JP2003126955A publication Critical patent/JP2003126955A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method of molding semisolid metal by pressurization without taking complicated steps and provide a die used in the method. SOLUTION: A die to be used is provided with a lower die having a concave part which is large enough to accommodate semisolid metal and a upper die, and semisolid metal is filled in a space formed by them and moreover, if necessary, by a slide core and a casting product is molded. Semisolid metal having minute spherical crystal with a solid phase rate ranging from 30% to 99.9% is accommodated in the concave part of the lower type die and is filled in a space for a product formed by the transfer of the upper die, the lower die and, if necessary, the slide core.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、半凝固金属の成形
方法に係わり、特に金型に半凝固金属を載置して、直接
上型や加圧ピンにより加圧することで高品質成形品を成
形する半凝固金属の成形方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming semi-solidified metal, and in particular, placing the semi-solidified metal on a mold and directly applying a pressure by an upper mold or a pressure pin to produce a high-quality molded product. The present invention relates to a method for forming a semi-solid metal to be formed.

【0002】[0002]

【従来の技術】半凝固成形においては、一般的には成形
する金型に液体から温度を低下させて製造した半凝固金
属あるいは固体状態の材料を加熱して製造した半凝固金
属を一旦スリーブに移し、しかる後スリーブ内のチップ
を移動させて成形する。
2. Description of the Related Art In semi-solidifying molding, generally, a semi-solidifying metal produced by heating a semi-solidifying metal or a solid material by lowering the temperature from a liquid into a mold is temporarily put into a sleeve. Then, the tip in the sleeve is moved and then molded.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上述し
た方法ではいくつかの課題がある。第1にスリーブに挿
入した段階で固液共存状態の金属はスリーブに接触して
急速に熱を奪われるために凝固層が生成しやすい。この
ために、チップの動きに合わせて凝固層が混入しやすく
金型内にメタルを挿入して成形する場合に機械的性質の
ばらつきの原因になりやすい。第2にスリーブ内に残さ
れたビスケット部分と製品までのランナーを加えた製品
以外の部分の全鋳込み重量に対する割合が高い。特に小
型製品の場合にはその割合が高くなる。その結果、製品
価格が高くなる。
However, the above method has some problems. First, when the metal in the solid-liquid coexistence state comes into contact with the sleeve at the stage of being inserted into the sleeve to rapidly remove heat, a solidified layer is likely to be formed. For this reason, the solidified layer easily mixes with the movement of the chip, and when the metal is inserted into the mold for molding, variations in mechanical properties are likely to occur. Second, the ratio of the biscuit portion left in the sleeve and the portion other than the product including the runner up to the product to the total cast weight is high. Especially in the case of small products, the ratio becomes high. As a result, the product price increases.

【0004】このために、直接金型の中に半凝固金属を
入れて成形することが知られている。しかし、下型に接
触する半凝固金属は同様に凝固層を形成しやすくまた、
特に容器を反転してその中に保持されていた半凝固金属
を下型内に載置して成形する場合、その底部には酸化物
が混入している。
For this reason, it is known to directly insert a semi-solidified metal into a mold for molding. However, the semi-solid metal that contacts the lower mold is likely to form a solidified layer as well.
In particular, when the container is turned over and the semi-solidified metal held therein is placed in the lower mold for molding, an oxide is mixed in the bottom.

【0005】また、多くの製品によっては、鋳造メタル
が入ってこない鋳抜き部、窓部があるが、型の閉じるに
応じて完全に半凝固金属を該鋳抜き、該窓部に入らない
ようにすることはすでに下型にメタルが載置されている
段階では困難である。
Also, many products have a cast-out portion and a window portion into which the cast metal does not enter, but as the mold is closed, the semi-solid metal is completely removed from the cast-out portion and the window portion. It is difficult to do so when the metal is already placed on the lower mold.

【0006】本発明は、前述した問題点に着目し、煩雑
な方法をとることなく、半凝固金属を加圧成形する方法
と同方法に使用される金型を提供することを目的とする
ものである。
The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a metal mold used in the same method as the method of pressure-forming a semi-solid metal without taking a complicated method. Is.

【0007】[0007]

【課題を解決するための手段】このような課題を解決す
るために、本発明においては、第1の発明では固相率が
30%〜99.9%の微細球状結晶を有する半凝固金属
を下型の凹部内に載置し、上型と下型および必要に応じ
てスライドコアの移動により形成される製品空間部に該
半凝固金属を充填することとした。
In order to solve such problems, in the present invention, in the first invention, a semi-solid metal having fine spherical crystals with a solid fraction of 30% to 99.9% is used. The semi-solid metal was placed in the recess of the lower mold, and the product space formed by moving the upper mold, the lower mold and, if necessary, the slide core was filled with the semi-solid metal.

【0008】また、第1の発明を主体とする第2の発明
では、上型の下型への接近に伴って該半凝固金属を圧縮
させて型内に半凝固金属を充填するに際し、該上型に設
けられた空洞部を形成する部位を有する上型凸部と該下
型との間隔を0.5mm〜10mmとし、鋳造後に該空
洞部に相当する部位を切断、切削加工により貫通させる
こととした。
In the second invention, which is mainly based on the first invention, the semi-solid metal is compressed as the upper die approaches the lower die, and the semi-solid metal is filled in the die. The interval between the upper die convex portion having a cavity forming portion provided in the upper die and the lower die is set to 0.5 mm to 10 mm, and the portion corresponding to the cavity is cut and penetrated by cutting after casting. I decided.

【0009】第1の発明を主体とする第3の発明では、
上下の金型を閉じた後型内に充填した該半凝固金属を加
圧ピンにより圧縮するに際し、該上型に設けられた空洞
部を形成する部位を有する上型凸部と該下型との間隔を
0.5mm〜10mmとし、鋳造後に該空洞部に相当す
る部位を切断、切削加工により貫通させることとした。
In the third invention, which is mainly based on the first invention,
When closing the upper and lower molds and then compressing the semi-solidified metal filled in the mold with a pressure pin, the upper mold convex portion having a cavity forming portion provided in the upper mold and the lower mold The interval was set to 0.5 mm to 10 mm, and after casting, the portion corresponding to the cavity was cut and cut to penetrate.

【0010】第1または第2の発明を主体とする第4の
発明では、上下型により形成される製品空間部に充填さ
れた半凝固金属の下型凹部の部位を加圧ピンにより局部
加圧し、必要に応じて部位を製品から分離除去するこ
ととした。
According to a fourth aspect of the invention, which is mainly based on the first or second aspect of the invention, the lower mold cavity portion of the semi-solidified metal filled in the product space formed by the upper and lower dies is locally pressurized by a pressure pin. , it was decided to separate and remove the parts from the product as necessary.

【0011】第1、第2または第4の発明を主体とする
第5の発明では、上下型により形成される製品空間部に
充填された半凝固金属の下型凹部の下型接触部位を切削
加工して除去することとした。
According to a fifth aspect of the invention, which is mainly based on the first, second or fourth aspect, the lower die contact portion of the lower die recess of the semi-solid metal filled in the product space formed by the upper and lower dies is cut. It was decided to process and remove it.

【0012】第6の発明では半凝固金属を載置できる大
きさの凹部を有する下型と上型を設けるとともに、必要
に応じてさらにスライドコアにより形成される空間部に
該半凝固金属を充填して鋳物製品を成形する金型であっ
て、空洞部を有する鋳物を製造する場合においては上型
は該鋳物製品の該空洞部に相当する部位の上下型間に
0.5mm〜10mmの空隙を形成するように上型凸部
を有し、しかも、下型凹部に載置した該半凝固金属を型
内充填時、あるいは型内充填後プレス成形が可能な半凝
固金属製品の成形金型構造とする。
According to the sixth aspect of the invention, a lower mold and an upper mold having a recess having a size capable of mounting the semi-solid metal are provided, and the space formed by the slide core is filled with the semi-solid metal as necessary. A die for molding a casting product by molding, and in the case of manufacturing a casting having a hollow portion, the upper die is a void of 0.5 mm to 10 mm between the upper and lower dies of the portion corresponding to the hollow portion of the casting product. A mold for a semi-solid metal product which has an upper mold convex portion for forming a mold and can be press-molded during or after filling the semi-solid metal placed in the lower mold concave portion into the mold. The structure.

【0013】[0013]

【発明の実施の形態】以下に本発明に係わる半凝固金属
の成形方法の具体的実施の形態を図面を参照して詳細に
説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Specific embodiments of the method for forming a semi-solid metal according to the present invention will be described in detail below with reference to the drawings.

【0014】図1は上下の金型を閉じた後下型凹部内に
載置された半凝固金属を加圧ピンにより圧縮して成形す
ることを示す説明図、図2はあらかじめ型が閉じた状態
で下型凹部に半凝固金属を載置した後該金属を加圧ピン
により圧縮して成形することを示す説明図、図3は下型
凹部の半凝固金属を大きい凸部の無い上型が下降して圧
縮して成形することを示す説明図、図4は下型凹部の半
凝固金属を凸部を有する上型が下降して圧縮して成形す
ることを示す説明図、図5は下型とスライドコアにより
構成される金型において下型凹部の半凝固金属を上型が
下降して圧縮して成形することを示す説明図、図6は下
型とスライドコアにより構成される金型において下型凹
部の半凝固金属を上型が下降して圧縮して、その後下型
凹部の部位を局部加圧して同部位を製品から分離除去す
ることを示す説明図、図7は溶湯から半凝固金属を製造
するまでのプロセスの説明図である。
FIG. 1 is an explanatory view showing that the upper and lower molds are closed and then the semi-solidified metal placed in the recess of the lower mold is compressed by a pressure pin to be molded, and FIG. 2 is the mold is closed in advance. FIG. 3 is an explanatory view showing that the semi-solidified metal is placed in the lower mold recess in this state and then the metal is compressed by a pressure pin to be molded, and FIG. FIG. 4 is an explanatory view showing that the lower die is compressed and molded, FIG. 4 is an explanatory view showing that the upper die having a convex portion descends and compresses and molds the semi-solidified metal of the lower die concave portion, and FIG. FIG. 6 is an explanatory view showing that the upper die descends and compresses and molds semi-solidified metal in the recess of the lower die in a die constituted by the lower die and the slide core. In the mold, the upper mold descends and compresses the semi-solid metal in the lower mold recess, and then the lower mold recess is locally localized. Pressure and explanatory view showing that separation and removal of the same site from the product, 7 is an explanatory view of a process until the production of semi-solid metal from the melt.

【0015】まず、図1の(1)と(2)を用いて、上
下の金型を閉じた後下型凹部内に載置された半凝固金属
を加圧ピンにより圧縮して成形時の概要を示す。1は上
型、2は下型、3は下型凹部、4は半凝固金属、5は加
圧ピン、6は製品、7はランナー、8はビスケット部、
9はメタルの流入溝、10は上型凸部である。図1
(1)に示すように、両金型1、2が開いた状態(図1
(1))で下型凹部3の中に固相率が30%〜99.9
%の微細球状結晶を有する半凝固金属4を挿入し直ちに
上型1が下降して両金型1、2を閉じる(図1
(2))。
First, referring to (1) and (2) in FIG. 1, the upper and lower molds are closed, and then the semi-solidified metal placed in the lower mold recess is compressed by a pressure pin to be used for molding. Show an overview. 1 is an upper mold, 2 is a lower mold, 3 is a lower mold recess, 4 is a semi-solid metal, 5 is a pressure pin, 6 is a product, 7 is a runner, 8 is a biscuit part,
Reference numeral 9 is a metal inflow groove, and 10 is an upper die convex portion. Figure 1
As shown in (1), the molds 1 and 2 are open (see FIG. 1).
In (1)), the solid phase ratio in the lower mold recess 3 is 30% to 99.9.
%, The semi-solid metal 4 having fine spherical crystals is inserted and immediately the upper mold 1 descends to close both molds 1 and 2 (FIG. 1).
(2)).

【0016】型閉後、直ちに、加圧ピン5が下降して半
凝固金属4を圧縮する。これにより、下型凹部3の一部
に開けられた流入溝9、ランナー部7を通って半凝固金
属4が型内に充填する。半凝固金属4は、型の内部に充
填されるに当たり、上型凸部10と下型2間の間隙Sを
通過して成形品が成形される。
Immediately after the mold is closed, the pressing pin 5 descends to compress the semi-solidified metal 4. As a result, the semi-solidified metal 4 is filled in the mold through the inflow groove 9 and the runner portion 7 opened in a part of the lower mold recess 3. When the semi-solid metal 4 is filled in the mold, the semi-solid metal 4 passes through a gap S between the upper mold convex portion 10 and the lower mold 2 to mold a molded product.

【0017】図2の(1)と(2)を用いてあらかじめ
両金型が閉じた状態で下型凹部10に固相率が30%〜
99.9%の微細球状結晶を有する半凝固金属4を載置
した後、該金属4を加圧ピン5により圧縮して成形する
時の概要を示す。
Using (1) and (2) of FIG. 2, the solid fraction of the lower mold recess 10 is 30% to 30% when both molds are closed in advance.
An outline of when the semi-solidified metal 4 having 99.9% fine spherical crystals is placed and then the metal 4 is compressed by the pressure pin 5 to be molded will be described.

【0018】1は上型、2は下型、3は下型凹部、4は
半凝固金属、5は加圧ピン、6は製品、7はランナー
部、8はビスケット部、9はメタルの流入溝、10は上
型凸部である。両金型1、2が閉じた状態(図2
(1))で下型凹部3の中に半凝固金属4を挿入し、直
ちに加圧ピン5が下降して半凝固金属4を圧縮する。
1 is an upper mold, 2 is a lower mold, 3 is a lower mold recess, 4 is a semi-solid metal, 5 is a pressure pin, 6 is a product, 7 is a runner part, 8 is a biscuit part, and 9 is a metal inflow. The groove 10 is an upper convex portion. Both molds 1 and 2 are closed (Fig. 2
In (1), the semi-solidified metal 4 is inserted into the lower mold recess 3, and the pressure pin 5 immediately descends to compress the semi-solidified metal 4.

【0019】これにより、下型凹部3の一部に開けられ
た流入溝9、ランナー部7を通って半凝固金属4が型内
に充填する(図2(2))。半凝固金属4は、型の内部
に充填されるに当たり、上型凸部10と下型2間の間隙
Sを通過して成形品が成形される。
As a result, the semi-solidified metal 4 is filled in the mold through the inflow groove 9 and the runner portion 7 formed in a part of the lower mold recess 3 (FIG. 2 (2)). When the semi-solid metal 4 is filled in the mold, the semi-solid metal 4 passes through a gap S between the upper mold convex portion 10 and the lower mold 2 to mold a molded product.

【0020】図3を用いて大きい凸部の無い上型が下降
して下型凹部の半凝固金属を大きい圧縮して成形するこ
とを示す。1は上型、2は下型、3は下型凹部、4は半
凝固金属、6は製品である。上型1と下型2が型開した
状態(図3(1))で、下型凹部3の中に固相率が30
%〜99.9%の微細球状結晶を有する半凝固金属4を
載置して、直ちに上型1が下降して半凝固金属4を圧縮
(図3(2))して成形品が成形される。この後、下型
凹部3の下型接触部位を切削加工して除去し、製品6と
なる。
FIG. 3 shows that the upper mold having no large convex portion descends and the semi-solid metal in the concave portion of the lower mold is largely compressed and molded. 1 is an upper mold, 2 is a lower mold, 3 is a lower mold recess, 4 is a semi-solid metal, and 6 is a product. In the state where the upper mold 1 and the lower mold 2 are opened (FIG. 3 (1)), the solid fraction is 30 in the lower mold recess 3.
% To 99.9% of semi-solid metal 4 having fine spherical crystals is placed, and immediately the upper mold 1 descends to compress the semi-solid metal 4 (FIG. 3 (2)) to form a molded product. It After that, the lower mold contact portion of the lower mold recess 3 is cut and removed to obtain a product 6.

【0021】図4を用いて下型凹部の半凝固金属を上型
が下降して圧縮成形する例を示す。1は上型、2は下
型、3は下型凹部、4は半凝固金属、6は製品、10は
上型凸部である。上型1と下型2が型開した状態(図4
(1))で、下型凹部3の中に固相率が30%〜99.
9%の微細球状結晶を有する半凝固金属4を載置して、
直ちに上型1が下降して半凝固金属4を圧縮(図4
(2))して成形品が成形される。この後、下型凹部3
の下型接触部位を切削加工して除去し、製品6となる。
An example of compression-molding the semi-solidified metal in the recess of the lower mold by lowering the upper mold will be described with reference to FIG. Reference numeral 1 is an upper die, 2 is a lower die, 3 is a lower die concave portion, 4 is a semi-solid metal, 6 is a product, and 10 is an upper die convex portion. The state where the upper mold 1 and the lower mold 2 are opened (Fig. 4
In (1)), the solid fraction in the lower mold recess 3 is 30% to 99.
Placing a semi-solid metal 4 having 9% fine spherical crystals,
Immediately, the upper mold 1 descends and compresses the semi-solid metal 4 (see FIG.
(2)) and the molded product is molded. After this, the lower mold recess 3
The lower die contact portion is cut and removed to obtain the product 6.

【0022】図5の(1)、(2)を用いて下型凹部の
半凝固金属を上型が下降して圧縮成形する例を示す。1
は上型、2は下型、3は下型凹部、4は半凝固金属、5
は加圧ピン、6は製品、10は上型凸部、11はスライ
ドコアである。下型2の上面部に放射状に配設された4
片の金型から構成されるスライドコア11を前進させた
状態で、下型2の中心部に位置する下型凹部3の中に固
相率が30%〜99.9%の微細球状結晶を有する半凝
固金属4を載置(図5(1))して、直ちに上型1が下
降して半凝固金属4を圧縮(図5(2))し、必要に応
じて加圧ピン5により下型凹部3の半溶融金属4を圧縮
する。また、上型凸部10と下型の間隙Sを通過して成
形品が成形される。この後、下型凹部3の下型接触部位
を切削加工して除去し、製品6となる。
An example in which the semi-solidified metal in the recess of the lower mold is compression-molded by lowering the upper mold will be described with reference to (1) and (2) of FIG. 1
Is an upper mold, 2 is a lower mold, 3 is a lower mold recess, 4 is a semi-solid metal, 5
Is a pressure pin, 6 is a product, 10 is an upper die convex portion, and 11 is a slide core. 4 arranged radially on the upper surface of the lower mold 2.
In a state where the slide core 11 composed of one piece of mold is advanced, fine spherical crystals having a solid fraction of 30% to 99.9% are placed in the lower mold recess 3 located at the center of the lower mold 2. The semi-solidified metal 4 is placed (FIG. 5 (1)), the upper mold 1 immediately descends to compress the semi-solidified metal 4 (FIG. 5 (2)), and the pressing pin 5 is used as necessary. The semi-molten metal 4 in the lower mold recess 3 is compressed. Further, the molded product is molded by passing through the gap S between the upper mold convex portion 10 and the lower mold. After that, the lower mold contact portion of the lower mold recess 3 is cut and removed to obtain a product 6.

【0023】図6を用いて下型凹部の半凝固金属を上型
が下降して圧縮して、その後下型凹部の部位を局部加圧
して同部位を製品から分離除去する例を示す。1は上
型、2は下型、3は下型凹部、4は半凝固金属、5は加
圧ピン、6は製品、11はスライドコア、12は下型押
えブロックである。
An example in which the semi-solid metal in the recess of the lower mold is lowered and compressed by the upper mold and then the region of the recess of the lower mold is locally pressed to separate and remove the same from the product will be described with reference to FIG. 1 is an upper mold, 2 is a lower mold, 3 is a lower mold recess, 4 is a semi-solid metal, 5 is a pressure pin, 6 is a product, 11 is a slide core, and 12 is a lower mold holding block.

【0024】下型2の上面部に放射状に配設された4片
の金型から構成されるスライドコア11を前進させた状
態(図6(1))で、下型凹部3の中に固相率が30%
〜99.9%の微細球状結晶を有する半凝固金属4を載
置して、直ちに上型1が下降して半凝固金属4を圧縮
(図6(2))し、必要に応じて加圧ピン5により下型
凹部3の半凝固金属4を局部圧縮(図6(3))し、下
型押えブロック12が下降して同部位を製品6から分離
除去する。また、上型凸部10と下型2の間隙Sを通過
して成形品が成形される。この後、下型凹部3の下型接
触部位を切削加工して除去し、製品6となる。
In a state where the slide core 11 composed of four pieces of dies radially arranged on the upper surface of the lower mold 2 is advanced (FIG. 6 (1)), it is fixed in the lower mold recess 3. Phase ratio is 30%
Place the semi-solidified metal 4 having -99.9% fine spherical crystals, immediately lower the upper mold 1 to compress the semi-solidified metal 4 (Fig. 6 (2)), and pressurize as necessary. The pin 5 locally compresses the semi-solidified metal 4 in the lower mold recess 3 (FIG. 6C), and the lower mold holding block 12 descends to separate and remove the same part from the product 6. Further, the molded product is molded by passing through the gap S between the upper mold convex portion 10 and the lower mold 2. After that, the lower mold contact portion of the lower mold recess 3 is cut and removed to obtain a product 6.

【0025】(実施例)以下図面に基づいて、本発明の
実施例の詳細について説明する。
(Embodiment) The embodiment of the present invention will be described in detail below with reference to the drawings.

【0026】下型2に載置した半凝固金属4を加圧した
場合、下型2に接触して温度が低下して発生した凝固層
が製品6の内部に混在するとともに、容器内で生成され
半凝固金属4の酸化物を固定できないために、製品6の
内部に混在し品質上問題である。また、下型2に載置し
た半凝固金属4を加圧した場合、鋳造製品6の空洞部
(ここでいう空洞部とは、製品の表側から裏側に通じる
貫通孔をいう)の部位の下型2と上型1の初期の間隙に
加圧中に半凝固金属4が入り込み固化するためにプレス
成形してもプレスできないために希望する厚みの寸法の
製品6が得られないことが発生する。
When the semi-solidified metal 4 placed on the lower mold 2 is pressurized, a solidified layer generated by contacting the lower mold 2 and lowering the temperature is mixed inside the product 6 and produced in the container. Since the oxide of the semi-solidified metal 4 cannot be fixed, it is mixed in the product 6 and is a quality problem. Further, when the semi-solid metal 4 placed on the lower mold 2 is pressurized, it is below the portion of the hollow portion of the cast product 6 (the hollow portion here refers to a through hole communicating from the front side to the back side of the product). Since the semi-solidified metal 4 enters into the initial gap between the mold 2 and the upper mold 1 during pressurization and solidifies, the product 6 having a desired thickness cannot be obtained because it cannot be pressed even by press molding. .

【0026】次に、表1に成形条件と成形体の品質につ
いて示す。
Next, Table 1 shows the molding conditions and the quality of the molded product.

【0027】[0027]

【表1】 [Table 1]

【0028】用いた合金はAC4CH合金である。合金
組成はAl−7%、Si−0.35%、Mg−0.15
Tiである。半凝固金属4は、実施例1〜4は液相線温
度に対して過熱度を30℃に保持された約1.5kgの
合金を冷却治具を使用することなく直接ステンレスステ
ィールの保持容器14に注湯し、所定の液相率を示す成
形温度まで冷却しつつ、たとえば50%固相率を示す温
度まで約3分間保持することにより得た。
The alloy used is an AC4CH alloy. The alloy composition is Al-7%, Si-0.35%, Mg-0.15.
Ti. The semi-solid metal 4 of Examples 1 to 4 is a stainless steel holding container 14 directly made of about 1.5 kg of an alloy whose superheat is maintained at 30 ° C. against the liquidus temperature without using a cooling jig. It was obtained by pouring the molten metal into, and cooling it to a molding temperature showing a predetermined liquid phase ratio, and maintaining it at a temperature showing a 50% solid phase ratio for about 3 minutes, for example.

【0029】容器上部、下部にぱ断熱性を有するのセラ
ミックを配置して、容器露出部をエアー16で冷却して
均一な温度の半凝固金属4を得た。実施例5〜10、比
較例1〜5は保持容器の注湯は約7kgである。保持時
間は50%固相率を示す温度まで約5分間保持した。試
験に用いた金型は200℃であり、黒鉛系の水溶性離型
剤を使用した。1.5kgの製品においては、型締め力
350tのマシンを使用し、7kgの製品においては、
型締め力800tのマシンを使用した。
Ceramics having a heat insulating property were arranged on the upper and lower parts of the container, and the exposed part of the container was cooled by air 16 to obtain a semi-solid metal 4 having a uniform temperature. In Examples 5 to 10 and Comparative Examples 1 to 5, the molten metal poured into the holding container was about 7 kg. The holding time was about 5 minutes until the temperature at which the solid fraction was 50%. The mold used for the test was 200 ° C., and a graphite-based water-soluble mold release agent was used. For the 1.5 kg product, a machine with a mold clamping force of 350 t is used, and for the 7 kg product,
A machine having a mold clamping force of 800 t was used.

【0030】なお、半凝固金属4について、その製造方
法は限定されるものではなく種々の方法が適用できる。
実施例に用いた方法は、治具を使用せずに直接得る方法
であって、液相線温度に対して過熱度を50℃未満に保
持された結晶微細化剤を含むアルミニウム合金溶湯、ま
たはマグネシウム合金溶湯を冷却治具を使用することな
くラドル13を介して直接保持容器(金属容器14)に
注湯し、溶湯19内に結晶核を発生させ、該結晶核を成
長させて所定の液相率を示す成形温度まで冷却しつつ3
0秒〜30分間保持することにより球状結晶を有する半
凝固金属4を得ることを特徴とし、該半凝固金属20を
容器14より反転して排出することで、型内に載置す
る。
The method of manufacturing the semi-solid metal 4 is not limited, and various methods can be applied.
The method used in the examples is a method of obtaining directly without using a jig, and is an aluminum alloy molten metal containing a crystal refining agent having a superheat degree of less than 50 ° C. with respect to a liquidus temperature, or The magnesium alloy melt is poured directly into the holding container (metal container 14) via the ladle 13 without using a cooling jig, crystal nuclei are generated in the melt 19, and the crystal nuclei are grown to give a predetermined liquid. 3 while cooling to the molding temperature showing the phase ratio
The semi-solidified metal 4 having spherical crystals is obtained by holding the semi-solidified metal 4 for 0 second to 30 minutes, and the semi-solidified metal 20 is inverted from the container 14 and discharged to be placed in a mold.

【0031】また、冷却板に溶湯19を接触させて、あ
るいは冷却振動棒を注湯する溶湯19あるいは注湯後も
継続して溶湯19中に浸漬して上記方法と同様に保持容
器内で冷却保持する方法も適用できる。
Further, the molten metal 19 is brought into contact with a cooling plate, or the molten metal 19 for pouring a cooling vibrating rod is continuously immersed in the molten metal 19 after pouring and cooled in a holding container in the same manner as the above method. A holding method can also be applied.

【0032】また、一旦固化したビレットを加熱した半
溶融金属20も本発明に適用できる。比較例1では、下
型2に凹部がないため、半凝固金属4を載置して加圧し
た場合、下型2に接触して温度が低下して発生した凝固
層が製品6の内部に混在するとともに、容器内で生成さ
れ半凝固金属4の酸化物を固定できないために、同様に
製品6の内部に混在するために品質上問題となった。
The semi-molten metal 20 obtained by heating the billet once solidified is also applicable to the present invention. In Comparative Example 1, since the lower mold 2 has no recess, when the semi-solidified metal 4 is placed and pressed, the solidified layer generated by contacting the lower mold 2 and lowering the temperature is inside the product 6. In addition to being mixed, since the oxide of the semi-solidified metal 4 generated in the container cannot be fixed, it is mixed in the product 6 as well, which is a quality problem.

【0033】比較例2では、鋳造製品の空洞部(ここで
いう空洞部とは、製品の表側から裏側に通じる貫通孔を
いう)の部位の下型2と上型1の初期の間隙Sが狭いた
めに半凝固金属4が加圧された場合、初期間隙まで圧縮
できずに初期間隙よりも製品6の厚みが厚いために下型
2と上型1の間に隙間Sが発生してバリが吹くことにな
り、目標とする寸法の製品が得られなかった。
In Comparative Example 2, the initial gap S between the lower mold 2 and the upper mold 1 at the portion of the cavity of the cast product (the cavity here is the through hole communicating from the front side to the back side of the product). When the semi-solid metal 4 is pressed due to its narrowness, the initial gap cannot be compressed and the product 6 is thicker than the initial gap, so that a gap S is generated between the lower mold 2 and the upper mold 1 to cause burrs. However, the product of the target size could not be obtained.

【0034】比較例3では製品6の厚みが厚いために、
成形後切削加工する量が多く歩留まりが悪い。比較例4
では固相率が低いために、下型凹部3に半凝固金属4を
載置しても下型凹部3以外のところに半凝固金属4が流
れるために凝固層が生成されやすく、また容器内で生成
され半凝固金属4の酸化物を下型凹部3に固定できない
ために品質上問題であった。
In Comparative Example 3, since the product 6 is thick,
The amount of cutting after forming is large and the yield is poor. Comparative Example 4
Since the solid phase ratio is low, even if the semi-solid metal 4 is placed in the lower mold recess 3, the semi-solid metal 4 flows to a place other than the lower mold recess 3 so that a solidified layer is likely to be formed, Since the oxide of the semi-solidified metal 4 generated in 1 cannot be fixed to the lower mold recess 3, there is a problem in quality.

【0035】比較例5では完全に固体であり、しかも温
度が低いために成形が容易でない。一方、実施例1〜1
0では凝固層、酸化物層を一部に集め、必要に応じて切
削加工し、また鋳造製品に空洞部がある製品の成形も可
能であるために、高い品質の製品を得ることができた。
In Comparative Example 5, since it is completely solid and the temperature is low, molding is not easy. On the other hand, Examples 1 to 1
In 0, a solidified layer and an oxide layer were collected in a part, cut as required, and a product having a cavity in a cast product could be formed, so that a high quality product could be obtained. .

【0036】[0036]

【発明の効果】以上説明したことから明らかなように、
本発明に関わる半凝固金属製品の成形方法では、(1)
下型の凹部に半凝固金属を載置して上型と下型および必
要に応じてスライドコアの移動により形成される製品空
間部に該半凝固金属を充填し、該凹部の半凝固金属が製
品品質に影響する場合は切削加工して下型凹部に接触す
る部位を除去することおよび、(2)空洞部を有する製
品を成形する場合においては、該上型に設けられた空洞
部を形成する部位を有する上型凸部と該下型との間隔を
0.5mm〜10mmとし、鋳造後に該空洞部に相当す
る部位を切断、切削加工により貫通させることにより、
製品内部に凝固層、酸化物層の混入ない高品質の成形体
が得られる。
As is apparent from the above description,
In the method for forming a semi-solid metal product according to the present invention, (1)
The semi-solid metal is placed in the recess of the lower mold, and the product space formed by moving the upper mold and the lower mold and, if necessary, the slide core is filled with the semi-solid metal. When the product quality is affected, the part that comes into contact with the lower mold recess is removed by cutting, and (2) when molding a product having a cavity, the cavity provided in the upper mold is formed. By setting the interval between the upper die convex portion having a portion to be formed and the lower die to be 0.5 mm to 10 mm, and cutting the portion corresponding to the hollow portion after casting, and penetrating by cutting.
It is possible to obtain a high-quality molded product in which the solidified layer and the oxide layer are not mixed in the product.

【図面の簡単な説明】[Brief description of drawings]

【図1】上下の金型を閉じた後下型凹部内に載置された
半凝固金属を加圧ピンにより圧縮して成形することを示
す説明図である。
FIG. 1 is an explanatory view showing that a semi-solidified metal placed in a lower mold recess is compressed by a pressure pin and then molded after closing upper and lower molds.

【図2】あらかじめ型が閉じた状態で下型凹部に半凝固
金属を載置した後該金属を加圧ピンにより圧縮して成形
することを示す説明図である。
FIG. 2 is an explanatory view showing that a semi-solidified metal is placed in the lower mold recess in a state where the mold is closed in advance, and then the metal is compressed by a pressure pin to be molded.

【図3】下型凹部の半凝固金属を大きい凸部の無い上型
が下降して圧縮して成形することを示す説明図である。
FIG. 3 is an explanatory view showing that the semi-solidified metal of the concave portion of the lower die is molded by descending and compressing the upper die having no large convex portion.

【図4】下型凹部の半凝固金属を上型が下降して圧縮し
て成形することを示す説明図である。
FIG. 4 is an explanatory diagram showing that the semi-solidified metal in the recess of the lower mold is lowered and compressed by the upper mold to be molded.

【図5】下型とスライドコアにより構成される金型にお
いて下型凹部の半凝固金属を上型が下降して圧縮して成
形することを示す説明図である。
FIG. 5 is an explanatory view showing that a semi-solid metal in a recess of a lower mold is compressed by an upper mold to be compressed and molded in a mold constituted by a lower mold and a slide core.

【図6】下型とスライドコアにより構成される金型にお
いて下型凹部の半凝固金属を上型が下降して圧縮して、
その後下型凹部の部位を局部加圧して同部位を製品から
分離除去することを示す説明図である。
FIG. 6 is a mold configured by a lower mold and a slide core, in which the upper mold descends and compresses the semi-solid metal in the lower mold recess,
It is explanatory drawing which shows that the site | part of a lower mold recessed part is locally pressed after that, and the same site is separated and removed from a product.

【図7】溶湯から半凝固金属を製造するまでのプロセス
の説明図である。
FIG. 7 is an explanatory diagram of a process for producing a semi-solid metal from a molten metal.

【符号の説明】[Explanation of symbols]

1 上型 2 下型 3 下型凹部 4 半凝固金属 5 加圧ピン 6 製品 7 ランナー部 8 ビスケット 9 メタル流入溝 10 上型凸部 11 スライドコア 12 下型押えブロック 13 ラドル 14 金属容器 15 断熱材 16 エアー 17 高周波加熱コイル 18 射出スリーブ 19 溶湯 20 半凝固金属 1 Upper mold 2 Lower mold 3 Lower mold recess 4 Semi-solid metal 5 Pressure pin 6 products 7 Runner section 8 biscuits 9 Metal inflow groove 10 Upper mold protrusion 11 slide core 12 Lower presser block 13 ladles 14 metal containers 15 Insulation 16 air 17 High frequency heating coil 18 injection sleeve 19 molten metal 20 semi-solid metal

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B22D 27/09 B22D 27/09 A 27/11 27/11 27/20 27/20 Z 29/00 29/00 G 31/00 31/00 A (72)発明者 前田 琢磨 山口県宇部市大字小串沖の山1980番地 宇 部興産機械株式会社宇部機械製作所内 Fターム(参考) 4E093 NA01 NB01 NB10 Front page continuation (51) Int.Cl. 7 Identification code FI theme code (reference) B22D 27/09 B22D 27/09 A 27/11 27/11 27/20 27/20 Z 29/00 29/00 G 31 / 00 31/00 A (72) Takuma Maeda Tayama Maeda, Ube City, Yamaguchi Prefecture 1980, Ogishi-oki, Ogishi Oyama, Ube Machinery Co., Ltd. F-term (reference) 4E093 NA01 NB01 NB10

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 固相率が30%〜99.9%の微細球状
結晶を有する半凝固金属を下型の凹部内に載置し、上型
と下型および必要に応じてスライドコアの移動により形
成される製品空間部に該半凝固金属を充填することを特
徴とする半凝固金属製品の成形方法。
1. A semi-solidified metal having fine spherical crystals with a solid fraction of 30% to 99.9% is placed in the recess of the lower mold, and the upper mold and the lower mold and, if necessary, the movement of the slide core. A method for molding a semi-solid metal product, comprising filling the semi-solid metal in a product space formed by the method.
【請求項2】 上型の下型への接近に伴って該半凝固金
属を圧縮させて型内に半凝固金属を充填するに際し、該
上型に設けられた空洞部を形成する部位を有する上型凸
部と該下型との間隔を0.5mm〜10mmとし、鋳造
後に該空洞部に相当する部位を切断、切削加工により貫
通させることを特徴とする請求項1記載の成形方法。
2. When the upper mold is filled with the semi-solidified metal by compressing the semi-solidified metal as it approaches the lower mold, the upper mold has a portion for forming a cavity. The molding method according to claim 1, wherein the interval between the upper die convex portion and the lower die is set to 0.5 mm to 10 mm, and a portion corresponding to the hollow portion is cut and cut through after casting.
【請求項3】 上下の金型を閉じた後型内に充填した該
半凝固金属を加圧ピンにより圧縮するに際し、該上型に
設けられた空洞部を形成する部位を有する上型凸部と該
下型との間隔を0.5mm〜10mmとし、鋳造後に該
空洞部に相当する部位を切断、切削加工により貫通させ
ることを特徴とする請求項1記載の成形方法。
3. An upper die convex portion having a portion forming a cavity portion provided in the upper die when the semi-solid metal filled in the die after closing the upper and lower die is compressed by a pressure pin. The molding method according to claim 1, wherein a distance between the lower mold and the lower mold is set to 0.5 mm to 10 mm, and a portion corresponding to the hollow portion is cut and cut to penetrate after casting.
【請求項4】 上下型により形成される製品空間部に充
填された半凝固金属の下型凹部の部位を加圧ピンにより
局部加圧し、必要に応じて部位を製品から分離除去す
ることを特徴とする請求項1または請求項2記載の成形
方法。
4. A local pressurizing by site pressurizing pin of the lower die recess of semi-solidified metal filled into the product space formed by the upper and lower molds, to separate and remove the site from the product if necessary The molding method according to claim 1 or 2, which is characterized in that.
【請求項5】 上下型により形成される製品空間部に充
填された半凝固金属の下型凹部の下型接触部位を切削加
工して除去することを特徴とする請求項1、請求項2ま
たは請求項4記載の成形方法。
5. The method according to claim 1, wherein the lower mold contact portion of the lower mold recess of the semi-solidified metal filled in the product space formed by the upper and lower molds is cut and removed. The molding method according to claim 4.
【請求項6】 半凝固金属を載置できる大きさの凹部を
有する下型と上型を設けるとともに、必要に応じてさら
にスライドコアにより形成される空間部に該半凝固金属
を充填して鋳物製品を成形する金型であって、空洞部を
有する鋳物を製造する場合においては上型は該鋳物製品
の該空洞部に相当する部位の上下型間に0.5mm〜1
0mmの空隙を形成するように上型凸部を有し、しか
も、下型凹部に載置した該半凝固金属を型内充填時、あ
るいは型内充填後プレス成形が可能な半凝固金属製品の
成形金型。
6. A casting comprising a lower mold and an upper mold having recesses each having a size capable of mounting the semi-solid metal, and further filling the space formed by the slide core with the semi-solid metal, if necessary. A die for molding a product, and in the case of manufacturing a casting having a hollow portion, the upper die is 0.5 mm to 1 between the upper and lower dies of a portion corresponding to the hollow portion of the casting product.
A semi-solid metal product having an upper die convex portion so as to form a void of 0 mm and capable of press-forming when the semi-solid metal placed in the lower die concave portion is filled in the die or after the die is filled. Molding die.
JP2001325588A 2001-10-23 2001-10-23 Molding method and molding die for semisolid metal goods Pending JP2003126955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001325588A JP2003126955A (en) 2001-10-23 2001-10-23 Molding method and molding die for semisolid metal goods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001325588A JP2003126955A (en) 2001-10-23 2001-10-23 Molding method and molding die for semisolid metal goods

Publications (1)

Publication Number Publication Date
JP2003126955A true JP2003126955A (en) 2003-05-08

Family

ID=19142124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001325588A Pending JP2003126955A (en) 2001-10-23 2001-10-23 Molding method and molding die for semisolid metal goods

Country Status (1)

Country Link
JP (1) JP2003126955A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010194549A (en) * 2009-02-23 2010-09-09 Moriyama Giken:Kk Apparatus for molding semi-solidified metal
CN107405682A (en) * 2014-08-20 2017-11-28 新加坡科技研究局 Metal forms equipment and the method for forming metal
CN107737912A (en) * 2017-10-12 2018-02-27 东风精密铸造安徽有限公司 One kind casting dead head shear

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010194549A (en) * 2009-02-23 2010-09-09 Moriyama Giken:Kk Apparatus for molding semi-solidified metal
CN107405682A (en) * 2014-08-20 2017-11-28 新加坡科技研究局 Metal forms equipment and the method for forming metal
CN107737912A (en) * 2017-10-12 2018-02-27 东风精密铸造安徽有限公司 One kind casting dead head shear

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