JP2003124292A - Position correcting device and guide device of planer member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the allowable proportion of a deviation amount greater than a conventional case by correcting the position of a substrate and guiding it to the prescribed position of a mounting part even if the substrate is delivered to a mounting part side in the state that the substrate is deviated a little, when the substrate is mounted on the prescribed position of the mounting part which receives the substrate from above. SOLUTION: The mounting part 12 is arranged on the upper surface of a plate 11. The mounting part 12 is formed in a square whose area is almost the same as that of the substrate 13 and constituted so as to receive the substrate 13 from above. At the periphery of the mounting part 12, two guide devices 14 are arranged so as to correspond to each side of the mounting part 12. The guide device 14 is provided with a columnar pivoting member 16 which is pivotably retained to a retaining part 15 and pivotably retained to the retaining part 15 in the state that a shaft line of the guide device 14 is stretched in parallel to the corresponding side of the mounting part 12. The pivoting member 16 is arranged in the state that a part of a curved surface is protruded outward from the end surface of a side facing the mounting part 12 of the retaining part 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate member position correcting device and a guide device, and more particularly to a liquid crystal panel,
The present invention relates to a plate-shaped member position correction device and a guide device suitable for guiding a plate-shaped member such as a printed circuit board or an iron plate to a predetermined position of a mounting portion for temporarily mounting it in a horizontal state.

[0002]

2. Description of the Related Art Conventionally, in a liquid crystal panel manufacturing process,
After the photoresist film is applied to the substrate, there is a step of adjusting the temperature of the substrate to a predetermined temperature. When the temperature of the substrate is adjusted, the processing is performed while the substrate is in close contact with or close to a plate having a predetermined temperature. As a device for arranging the substrate at a predetermined position on the plate, conventionally, there is a device shown in FIGS. 5 (a) and 5 (b). In this device, a quadrangular pyramid-shaped guide member 5 is provided around a quadrangular plate 51 arranged at a predetermined position.
Two pieces 2 are arranged around the plate 51 on each side. A hole is formed in the plate 51, and the support pin 53 is provided so as to be retractable from the hole.

When the substrate 54 is placed on the plate 51, as shown by a chain line in FIG. 5 (a), the support pin 53 is arranged at the projecting position by suction by a suction means (not shown). The substrate 54, which has been conveyed from the previous process in this state, is placed on the tip of the support pin 53. The substrate 54 is placed on the plate 51 by descending from that state until the support pin 53 is retracted into the hole. At this time, when the suction action of the suction means is released and the position of the substrate placed on the support pin 53 is slightly displaced from the position of the plate 51, the substrate 54 is lowered when the support pin 53 descends. The peripheral edge of the guide member 52 is guided by the inclined surface of the guide member 52, the position thereof is adjusted, and the plate 51 is placed at a predetermined position.

[0004]

However, in the conventional apparatus, as shown in FIG. 5B, when the lower surface of the substrate 54 is displaced to the position where it abuts against the upper surface of the guide member 52, the substrate is The end of 54 remains on the upper surface of the guide member 52. In this state, the suction means carries out the substrate 54, and when it descends to a predetermined position, the substrate 5
4 is broken and the device is stopped, and film quality such as film peeling occurs. In the conventional device, the allowable range of the deviation is 1 mm
And the allowable range was small for the substrate 54 having a length of several tens of cm.

The present invention has been made in view of the above problems, and a first object thereof is that when the plate-shaped member is mounted at a predetermined position of a mounting portion for receiving the plate-shaped member from above, the plate-shaped member is slightly moved. Even if it is delivered to the mounting portion side in a displaced state, it is possible to correct the position of the plate member and guide it to a predetermined position of the mounting portion,
It is an object of the present invention to provide a position correcting device for a plate-shaped member, which allows the allowable ratio of the amount of deviation to be larger than in the past. A second object is to provide a guide device suitable for the position correction device.

[0006]

In order to achieve the first object, the invention according to claim 1 is such that a peripheral edge of the plate-shaped member is provided around a mounting portion capable of receiving the plate-shaped member from above. A guide having a guide portion that is capable of making point contact with the portion and is inclined downward toward the placing portion is provided.

Therefore, according to the present invention, when the plate-shaped member is delivered to the mounting portion, the plate-shaped member is delivered while being displaced from a predetermined position of the mounting portion, and the lower surface of the plate-shaped member is the upper surface of the guide. The plate-shaped member is in point contact with the guide even when it is in a state of riding on. Therefore, the friction between the plate-shaped member and the guide becomes small, and the plate-shaped member moves toward the predetermined position side of the mounting portion and also moves along the downwardly inclined guide portion to move to the predetermined position of the mounting portion. Placed on top. Then, the allowable ratio of deviation becomes larger than that of the conventional device, and the occurrence rate of quality defects decreases.

According to the second aspect of the present invention, a guide is provided around the mounting portion which can receive the plate-shaped member from above, and whose upper side is rotatable in the mounting portion direction. In this invention,
The guide rotates even if the plate-shaped member is delivered to the mounting part in a state shifted from the predetermined position of the mounting part and the lower surface of the plate-shaped member rides on the upper surface of the guide. As a result, the plate-like member moves toward the predetermined position of the mounting portion. Since it is placed on the predetermined position of the placing portion, the allowable ratio of deviation becomes larger than that of the conventional device, and the occurrence rate of quality defects decreases.

According to a third aspect of the present invention, in the first or second aspect of the invention, the mounting portion is formed in a shape corresponding to a polygonal plate member, and the guide is formed. At least one polygonal mounting portion is provided so as to correspond to each side. Therefore, according to the present invention, when the plate-shaped member is transferred to the mounting portion, even if the plate-shaped member is displaced in any direction, if the displacement is within the allowable range, it is reliably guided to the mounting portion.

According to a fourth aspect of the present invention, there is provided a supporting portion and a rotating member which is composed of a rotating body having a convex curved surface on the outside and which is rotatably supported with respect to the supporting portion. The moving member is arranged such that a part of the curved surface projects outward from the end surface of the support portion. Therefore, when the invention according to claim 2 is carried out, the guide device of the invention is used, and the support part is arranged such that the side where a part of the curved surface of the rotating member projects is the mounting part side. By doing so, it can be easily implemented.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which the present invention is applied to a mounting portion provided in a liquid crystal panel manufacturing process will be described below with reference to FIGS. FIG. 1A is a schematic plan view of a plate portion for heat-treating a substrate, and FIG. 1B is a schematic side view thereof.

As shown in FIG. 1A, a mounting portion 12 is provided on the upper surface of the metal plate 11. The mounting portion 12 is formed in a square shape having substantially the same size as the substrate 13 as a plate-shaped member, and is configured to receive the substrate 13 to be mounted from above. Around the mounting portion 12, a guide device 14 is arranged so as to correspond to at least one (two in this embodiment) each side of the rectangular mounting portion 12. Each guide device 14 is arranged near the end of each side of the mounting portion 12.

The guide device 14 includes a support portion 15 and a rotating member 16 rotatably supported by the support portion 15. When the substrate 13 received by the mounting portion 12 is displaced from the mounting portion 12, the rotating member 16 contacts the peripheral portion of the substrate 13 and plays a role of a rotatable guide. The rotating member 16 is composed of a rotating body (a cylinder in this embodiment) having a convex curved surface on the outside, and is rotated with respect to the support portion 15 in a state where its axis extends parallel to the corresponding side of the mounting portion 12. It is movably supported. The rotating member 16 is arranged such that a part of the curved surface projects outward from the end surface of the supporting portion 15 that faces the mounting portion 12. Rotating member 16
Has a diameter of, for example, about 10 mm. In this embodiment, the position correction device 17 is composed of eight guide devices 14.

A hole 18 is formed in the plate 11 in the area of the mounting portion 12, and a support pin 19 can be retracted from the hole 18. The support pin 19 is configured to be able to project from the hole 18 to a position where the upper end of the support pin 19 is higher than the top of the rotating member 16 by a driving unit (not shown) (for example, an air cylinder).

Next, the operation of the position correcting device 17 constructed as described above will be described. When mounting the substrate 13 on the mounting portion 12 of the plate 11, the support pin 1 is used as in the conventional device.
In a state in which 9 is projected (illustrated by a chain line in FIG. 2A), the substrate 13 transferred by the transfer unit including the suction unit 20 is placed on the support pin 19.

Next, after the suction action of the suction means 20 is released, the support pin 19 is retracted. When the substrate 13 is placed on the support pin 19 in a state corresponding to the placing portion 12, the substrate 13 is placed in a predetermined position on the placing portion 12 in a horizontal state as the supporting pin 19 descends. To be done.

On the other hand, when the substrate 13 is placed on the support pin 19 in a state of being displaced from the predetermined position of the placing portion 12, for example, when it is displaced to the right side in FIG.
Is lowered, as shown by the solid line in FIG.
The right end side of 3 is mounted on the rotating member 16 of the guide device 14. In the prior art, in such a case, the substrate 1
3 is maintained as it is, but in the apparatus of this embodiment, the rotating member 16 is rotated counterclockwise in FIG. 2A by the action of the pressing force due to the weight of the substrate 13. A part of the curved surface of the rotating member 16 is the mounting portion 1 of the support portion 15.
Since it projects from the end surface on the second side, as shown in FIG. 2B, the substrate 13 is moved by the rotation of the rotation member 16.
Moved to side 2. Then, finally, as shown in FIG. 2C, the substrate 13 is placed on a predetermined position of the placing section 12. In this embodiment, the rotating member 16 has a diameter of 10 mm.
Due to the degree, the maximum amount of displacement of the substrate 13 is about 5 mm.

This embodiment has the following effects. (1) When the substrate 13 to be placed on the placing unit 12 is displaced from the placing unit 12 around the placing unit 12 that receives the substrate 13 from above, the substrate 13 is in contact with the peripheral portion and is rotatable. A plurality of guides (rotating members 16) are provided. As a result, even when the lower surface of the substrate 13 comes into contact with the rotating member 16, that is, even when the end portion of the substrate 13 rides on the substrate 16, the substrate 13 stays at the predetermined position of the mounting portion 12 unlike the conventional device. Placed. The allowable amount of deviation was about 1 mm in the past, but it was significantly improved to about 5 mm.
Further, the apparatus trouble and the quality defect due to the board 13 riding on the guide became zero.

(2) Since the rotating member 16 is formed in a cylindrical shape, it is rotatably attached to the supporting portion 15 as compared with the case where a spherical member or another member having the shape of a rotating body is used. Will be easier.

(3) At least one guide device 14 (two in this embodiment) is provided at a position corresponding to each side of the rectangular mounting portion 12. Therefore, the substrate 13
When the substrate 13 is transferred to the mounting portion 12, even if the substrate 13 is displaced in any direction, if the displacement is within an allowable range, the mounting portion 12 is surely transferred.
Can be guided to.

(4) Since the two guide devices 14 provided on the respective sides of the mounting portion 12 are arranged near the ends of the respective sides, the substrate 13 can be more reliably transferred to the mounting portion 12. I can guide you.

The embodiment is not limited to the above, but may be embodied as follows, for example. The shape of the rotating member 16 as a rotatable guide is not limited to a cylindrical shape or a cylindrical shape, and may be a spherical shape as shown in FIGS. 3 (a) and 3 (b), for example. The rotating member 16 is arranged such that a part of the rotating member 16 projects from the end surface of the support portion 15 that faces the mounting portion 12. Also in this case, when the board 13 rides on the turning member 16, the turning member 16 is turned by the pressing force of the own weight of the board 13 and guides the board 13 to the mounting portion 12.

As an alternative to the configuration in which the guide device 14 is arranged around the mounting portion 12, a truncated cone-shaped guide 21 may be arranged around the mounting portion 12 as shown in FIG. . Since the guide 21 has a truncated cone shape, the substrate 13 is transferred in a state of being displaced from the predetermined position of the mounting portion 12, and even if the end portion of the substrate 13 rides on the upper surface of the guide 21, the substrate 13 is still It comes into point contact with the guide 21. In addition, point contact is also made when contacting the slope of the guide 21. Therefore, the friction between the substrate 13 and the guide 21 is reduced, and the substrate 13 moves toward the predetermined position side of the mounting portion 12 and also moves along the guide surface 21a as a guide portion that descends and inclines. It is placed on a predetermined position of the section 12. Therefore, the allowable ratio of deviation becomes larger than that of the conventional apparatus, and the occurrence rate of quality defects due to the board 13 riding on the guide 21 decreases. In the case of the truncated cone-shaped guide, the arrangement position thereof can be adjusted more easily than the polygonal truncated pyramid-shaped guide described below.

The fixed guide is not limited to the truncated cone shape,
Any shape may be used as long as the substrate 13 to be placed on the placing section 12 is in a state of being displaced from the placing section 12 and has a guide portion that can be in point contact with the peripheral edge thereof and is inclined downward toward the placing section 12. For example, a quadrangular truncated pyramid-shaped guide is arranged such that one side of the bottom surface is not parallel to the side of the mounting portion 12 and one ridge that descends and slopes faces the side of the mounting portion 12, or a triangular shape. One ridge that descends and inclines a frustum-shaped guide is the mounting portion 1.
You may arrange | position in the state which opposes the two sides. In this case, the ridge constitutes a guide portion which is capable of making point contact with the peripheral portion of the substrate 13 and is inclined downward toward the mounting portion 12.

A guide having a conical shape or a polygonal pyramid shape may be used instead of the truncated cone shape or the polygonal pyramid shape guide as in the above-described embodiment. The invention is not limited to the position correction of the substrate 13 used for manufacturing the liquid crystal panel, but may be applied to a position correction device in a mounting portion for mounting a plate member such as a printed circuit board or a metal plate to be pressed.

The shape of the plate member is not limited to a quadrangle, and may be a polygon, a shape in which a part of the quadrangle is cut out, or a circle or an ellipse. 〇 The number of guide devices 14 or guides 21
The number is not limited to two, and one may be provided at a position corresponding to each side of the mounting portion 12, or three or more may be provided.

The sizes of the rotating member 16 and the guide 21 of the guide device 14 may be appropriately changed and set according to the size of the plate-shaped member to be position-corrected, required accuracy, and the like.

The technical idea understood from the above embodiment will be described below. (1) In the invention according to claim 2, the guide is formed in a cylindrical shape or a cylindrical shape.

(2) In the invention described in claim 1,
The guide is formed in a truncated cone shape. (3) In the invention according to any one of claims 1 to 3, the plate member is a substrate used in a liquid crystal panel manufacturing process.

[0030]

As described above in detail, according to the first to third aspects of the present invention, even if the plate-shaped member is delivered to the mounting portion side in a slightly displaced state, It is possible to correct the position of the member and guide it to a predetermined position of the mounting portion, and it is possible to increase the allowable ratio of the amount of deviation at the time of delivery as compared with the conventional case. Claim 4
According to the invention described in (1), it can be suitably used for the position correction device of the invention described in (2) or (3).

[Brief description of drawings]

FIG. 1A is a schematic plan view of one embodiment, and FIG.
Is a schematic side view, and (c) is a schematic side view of the guide device.

FIG. 2 is a schematic side view illustrating the operation.

FIG. 3A is a schematic plan view of a guide device according to another embodiment, and FIG. 3B is a schematic side view.

FIG. 4 is a schematic perspective view of a guide according to another embodiment.

5A and 5B are schematic side views illustrating a conventional technique.

[Explanation of symbols]

12 ... Placement part, 13 ... Board as plate-like member, 14 ... Guide device, 15 ... Support part, 16 ... Rotating member as guide, 21 ... Guide, guide surface as guide part.

Claims (4)

[Claims] 1. A guide is provided around a mounting portion that can receive a plate-shaped member from above, and a guide having a guide portion that can be in point contact with the peripheral portion of the plate-shaped member and that is inclined downward toward the mounting portion. Position correction device for plate-shaped members. 2. A position correcting device for a plate-shaped member, wherein a guide is provided around the mounting part that can receive the plate-shaped member from above, and the upper side thereof is rotatable in the direction of the mounting part. 3. The mounting portion is formed in a shape corresponding to a plate-shaped member formed in a polygonal shape, and the guide is arranged so that at least one guide corresponds to each side of the polygonal mounting portion. The position correction device for a plate-shaped member according to claim 1 or 2, which is provided. 4. A supporting part and a rotating member which is composed of a rotating body having a convex curved surface on the outside and is rotatably supported with respect to the supporting part, wherein the rotating member is a part of the curved surface. The guide device is arranged so as to project outward from the end surface of the support portion.