JP2003121982A - Mask, method for exposure, aligner, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To discriminate between masks which have the same pattern and to precisely perform exposure processing. SOLUTION: On a mask M, an identification code 13 is formed which includes a 1st unique code 15 corresponding to a pattern 11 and a 2nd code 16 for discriminating a plurality of masks M where the same pattern 11 is formed is formed. Recipes including specific processing conditions are prepared individually by identification codes 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a device such as a semiconductor device, a liquid crystal display device, an image pickup device (CCD, etc.), a thin film magnetic head, etc. It relates to a manufacturing method.

[0002]

2. Description of the Related Art In the process of manufacturing a device such as a liquid crystal display element or a semiconductor element, when a circuit pattern is formed, a pattern as an original image formed on a photomask or a reticle is exposed to a glass plate using an exposure device such as a stepper. And transfer onto a substrate (photosensitive substrate) to be exposed such as a wafer or a wafer.

A recipe for determining processing conditions is prepared for an exposure apparatus used for pattern transfer, and the exposure apparatus transfers a mask pattern onto a photosensitive substrate based on this recipe.
The recipe is associated with a mask for each pattern, and the mask has an identification code (bar code or the like) for matching the matching between the recipe and the pattern.

[0004]

By the way, since there are individual differences in the physical characteristics of the mask (dimensional tolerance, deflection amount due to its own weight when the exposure stage is installed, drawing error, etc.), the recipe is different for each mask. In many cases, individual processing conditions defined according to the above are included.

However, in the conventional exposure apparatus, all the masks having the same pattern are identified as the same mask.
Even if the masks have the same pattern, if different masks are used, the processing conditions included in the recipe do not match the masks used, and cause defects such as poor alignment and poor transfer accuracy. There is a fear.

Specifically, in the case of a semiconductor manufacturing factory in which a plurality of masks having the same pattern are prepared and a plurality of exposure apparatuses which are larger in number than the masks having the same pattern are installed, the mask having the same pattern is set together with the recipe setting. One of them is set in a certain exposure apparatus for exposure, and the mask is also used in another exposure apparatus for exposure. In such a case, the same mask is not always used for exposure in the exposure apparatus. For example, if a different mask is set with the same pattern as the previously exposed mask, the processing conditions included in the recipe may not match the mask used, and problems such as poor alignment and poor transfer accuracy may occur. There is.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a mask which enables discrimination between masks having the same pattern and which is suitable for performing an exposure process with high accuracy. Another object of the present invention is to provide an exposure method, an exposure apparatus, and a device manufacturing method capable of identifying masks having the same pattern and performing exposure processing with high accuracy.

[0008]

To solve the above problems, the present invention provides a pattern (1) which is an original image of a circuit pattern.
1) and an identification code (13) for identifying the pattern (11), wherein the identification code (13) is a unique first pattern corresponding to the pattern (11). The code (15) and the same pattern (1
1) includes a second code (16) for identifying the formed plurality of masks (M). The mask of the present invention has a unique first code corresponding to a pattern,
Since the second code for identifying a plurality of masks on which the same pattern is formed is included, even masks having the same pattern can be identified. Therefore, by using this mask, it is possible to reflect the individual difference of the mask in the exposure processing and perform the exposure processing with high accuracy.

In this case, the plurality of masks (M) include the pattern (11) and the first code (1).
3) and a pattern drawn by synthesizing the second code (16). for that reason,
Since the pattern and the first code are drawn in a relation related to each other between a plurality of masks and the second code is also combined and drawn, the drawing error of the pattern does not change between the plurality of masks. The unique second code for each is also drawn at the same time.

Further, the present invention is an exposure method for transferring the pattern (11) formed on the mask (M) onto the photosensitive substrate (P), wherein the pattern (11) is formed on the mask (M). An identification code (13) including a unique first code (15) corresponding to and a second code (16) for identifying a plurality of masks (M) on which the same pattern (11) is formed. Formed, said identification code (13)
It is characterized in that a recipe including a predetermined processing condition is individually prepared for each. In this exposure method, since the identification code including the unique first code corresponding to the pattern and the second code for identifying the plurality of masks having the same pattern is formed on the mask, Even masks having the same pattern can be identified.
Therefore, by individually preparing a recipe including a predetermined processing condition for each identification code, it is possible to reflect the individual difference of the mask in the exposure processing and perform the exposure processing with high accuracy.

In this case, when creating the recipe corresponding to the identification code (13) of the mask (M), any one of the first code (15) included in the identification code (13) is created. A recipe that matches the mask (M) may be created using the recipe.

Further, the recipes have the same pattern (1
1) may include common processing conditions among the masks (M) on which the mask (M) is formed, and individual processing conditions determined according to individual differences of the masks (M). In this case, in addition to the common processing conditions, the recipe includes individual processing conditions determined according to the individual differences of the mask, so that the individual differences of the mask can be reflected in the exposure processing.

Further, according to the present invention, the first mark (12) formed on the mask (M) and the second mark (18) formed on the photosensitive substrate (P) are imaged under predetermined conditions, An exposure method for transferring a pattern (11) formed on the mask (M) onto the photosensitive substrate (P) positioned relative to the mask (M) based on an image pickup result, comprising: It is characterized in that the conformity between the mask (M) and the predetermined condition is judged based on the contrast value of the image of the first mark (12). In this exposure method, the conformity between the predetermined condition for capturing the mark and the mask is determined based on the contrast value of the image obtained by capturing the first mark. Therefore, the conformity between the predetermined condition and the mask is not sufficient. It is possible to prevent an image pickup defect of the mark due to, and perform the exposure processing by accurately aligning the mask.

In this case, the predetermined condition may include a parameter for adjusting the focus position of the observation system (33) for imaging the first mark (12). As a result, it is possible to prevent the defocus of the observation system with respect to the first mark due to the mixing and equalization of the masks having the same pattern, and to accurately image the mark.

Information concerning the correlation between the contrast value and the predetermined condition is stored in advance, and when the predetermined condition and the mask (M) are not sufficiently matched, the measurement result of the contrast value and the information are obtained. Based on the above, the predetermined condition may be changed. As a result, even if the predetermined condition for capturing the image of the mark and the mask are not sufficiently matched, the predetermined condition can be matched with the mask based on the measurement result of the contrast value and the stored information. It can be changed easily.

The present invention is also a device manufacturing method, which includes the step of transferring the device pattern formed on the mask (M) onto the photosensitive substrate (P) using the exposure method described above. It is characterized by In this device manufacturing method, the accuracy of the formed pattern can be improved by improving the exposure accuracy.

The present invention is also an exposure apparatus (20) for transferring a pattern (11) formed on a mask (M) onto a photosensitive substrate (P) based on a recipe, wherein the mask (M). Includes a first code (15) common to the masks (M) having the same pattern (11) and a first code (M) for identifying the plurality of masks (M) having the same pattern (11). An identification code (13) including two codes (16) is formed, and an identification code reading means (25) for reading the identification code (13) formed on the mask (M), and each identification code (13). And a recipe supply means (27) for separately preparing a recipe including a predetermined processing condition. In this exposure apparatus, since the exposure method described above can be carried out, it is possible to reflect the individual difference of the mask in the exposure processing and perform the exposure processing with high accuracy.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing an example of an embodiment of a mask of the present invention. A mask M has a pattern 11 which is an original image of a circuit pattern, a mark (mask mark) 12 used for alignment, and a pattern. And an identification code 13 for doing so. In addition,
In order to prevent foreign matters from adhering to the area where the pattern 11 is formed, it is preferable to provide a protective device that covers the pattern area and that includes a transparent thin film containing an organic substance such as nitrocellulose as a main component.

In this example, the identification code 13 is a bar code and is provided on a part of the peripheral edge outside the area where the pattern 11 is formed. The identification code 13 is formed by depositing a metal such as chrome on the mask surface or etching a metal surface formed on the mask surface, and in addition to the identification information, information for detection such as a start bit is provided. Including.

FIG. 1B is a diagram showing an example of the identification information included in the identification code 13. In this example, the identification code 13 is a unique first code (mask name) 15 corresponding to the pattern 11 and a second code (mask ID) for identifying a plurality of masks M on which the same pattern 11 is formed.
16 and 16. That is, the first code 15 is a code common to a plurality of masks M on which the same pattern 11 is formed, and the second code 16 is the same pattern 11.
The plurality of masks M formed with the individual codes are different from each other. FIG. 1B shows a plurality (three) of masks M on which the same pattern 11 is formed, and the identification codes 13 of the plurality of masks M are a common first code “AA”. , And the second codes 16 different from each other are “01”, “02”, and “0”.
3 ”is included. Thus, the mask M of this example
In addition to the unique first code 15 corresponding to the pattern 11, since the second code 16 for identifying a plurality of masks M on which the same pattern 11 is formed is included, masks having the same pattern are Even, they can be identified. A plurality of masks on which the same pattern is formed can be easily and surely manufactured by duplicating the mask pattern and the first code based on the drawing data of one mask. Alternatively, the pattern of the master mask may be transferred to another mask to produce a copy mask, and only the second code 16 may be transferred separately. Further, the masks may not have the same thickness among the plurality of masks.

Next, an embodiment of an exposure apparatus in which the above-described mask M of the present invention is preferably used will be described. FIG. 2 is a diagram schematically showing the overall configuration of the exposure apparatus of this example. The exposure apparatus 20 includes a mask library 22 that stores a plurality of masks M, a mask transport unit 23, a foreign substance detection unit 24 that detects foreign substances (microscopic dust, etc.) on the mask M, and an identification code (bar code) formed on the mask M. ), An identification code reading unit 25, an exposure apparatus main body 26, and a control device 27 that controls these in a centralized manner.

The mask library 22 includes a plurality of masks M.
Is a storage device for loading and storing, for example, in a vertical direction in multiple stages. The mask library 22 stores masks M having various patterns according to the specifications of the manufacturing lot and the processing steps. The mask carrying section 23 carries the mask M taken out from the mask library 22 to the exposure apparatus main body 26 based on an instruction from the control apparatus 27. The foreign matter detection unit 24 has an irradiation unit (not shown) that irradiates the mask M with predetermined light and a light receiving unit (not shown) that receives light from the mask M, and based on the light reflected by the mask M. Foreign matter on the mask M is detected.
The identification code reading section 25 has an irradiation section 28 for irradiating the identification code on the mask M with a predetermined light and a light receiving section 29 for receiving the light from the mask M, and receives the light reflected by the mask M. The identification code of the mask M is detected photoelectrically.

The exposure apparatus main body 26 includes an illumination system 30 for illuminating the mask M, and a mask stage 3 on which the mask M is mounted.
1, a projection optical system PL, a substrate stage 32 on which a photosensitive substrate P coated with a photosensitive material is mounted, an alignment microscope 3
3 and an autofocus mechanism 34 are typically provided. The exposure apparatus main body 26 images the mark on the mask M (mask mark 12) and the mark on the photosensitive substrate P (substrate mark 18) with the alignment microscope 33, and based on the image pickup result, the mask M and the photosensitive substrate P are separated. Align. Further, the photosensitive substrate P is positioned (focused) within the depth of focus of the projection optical system PL by the autofocus mechanism 34. Then, the pattern on the mask M is exposed and transferred onto the aligned and focused photosensitive substrate P.

In the exposure apparatus 20, the control device 2
The processing condition is determined based on the recipe stored in the storage unit in 7. The recipe includes information such as an operation specification of the apparatus and individual processing conditions determined according to individual differences of the mask. Therefore, in this example, the recipe is individually prepared for each identification code of the mask M.

FIG. 3 is a diagram showing an example of the relationship between the mask identification code and the recipe. In FIG. 3, the same pattern is formed on each of the plurality of masks M. Then, the recipe “AA01” is associated with the mask with the identification code “AA-01”, and similarly, the recipe “AA0” is associated with the mask with the identification code “AA-02”.
2 ”is associated with the recipe“ AA03 ”for the mask with the identification code“ AA-03 ”. “AA” in each identification code and recipe name is the first code (mask name) corresponding to the pattern on the mask, and “01”, “02”, and “03” have the same pattern. It is a second code (mask ID) for identifying the formed plurality of masks.

In this example, the recipes are grouped according to the pattern of the corresponding mask, and the recipe No. common to each group. Have. In the case of the example in FIG. 3, a group including recipes “AA01”, “AA02”, and “AA03” is formed, and the recipe is the common recipe N.
O. "123" is shared.

Further, the recipe includes common processing conditions among the masks on which the same pattern is formed and individual processing conditions determined according to individual differences of the masks. The common processing conditions include, for example, a parameter that determines a procedure for transferring a mask or a photosensitive substrate, a parameter that determines an exposure time (exposure) to the photosensitive substrate, and the like. Further, the individual processing conditions are set for each mask for the exposure apparatus. For example, a parameter for adjusting the focus position of the alignment microscope 33 shown in FIG. 2 may be included. In the case of this parameter, the focus position may be measured and input for each mask when the mask is first set in the exposure apparatus. As long as it is input once, in the case of a recipe using the same mask, it is possible to perform optimum alignment by calling and setting parameters for the adjustment.

The alignment microscope 33 shown in FIG. 2 picks up an image of the mask mark or the substrate mark through the mask. Therefore, when the physical characteristics of the mask, especially the mask thickness, changes in the focal position with respect to the mark. Alignment microscope 3 during alignment
If the defocus of 3 occurs, the alignment accuracy may decrease. Therefore, in the exposure apparatus 20 of this example, the focus position of the alignment microscope 33 is adjusted during alignment. This adjustment is performed by the alignment microscope 3 measured in advance.
3 focus positions are used. That is, the exposure device 2
0, the alignment microscope 33 is used before the exposure processing.
The focus position is measured in advance (focus measurement), and the result is stored as a parameter. In the focus measurement, while changing the focal position of the alignment microscope 33 at a constant interval, the mask mark is moved to the alignment microscope 33.
The image is picked up in (1) and the focus position (optimum focus value) that maximizes the contrast value of the picked-up image is obtained. Then, the obtained optimum focus value is recorded in the recipe as a parameter determined according to the individual difference of the mask. When a plurality of mask marks are formed on the mask, it is preferable to obtain the focus position (optimum focus value) of the alignment microscope 33 for each mask mark.

Next, an example of the exposure method of the present invention performed using the above-described exposure apparatus 20 will be described with reference to the flowchart of FIG. First, the control device 27 uses the predetermined recipe No. When the instruction to process is received, the specified N
o. Develop a recipe having (step 100). At this time, the designated No. When there are a plurality of recipes each having "," the control device 27 arbitrarily selects one of them.
Develop that recipe. For example, in FIG. 3 above,
Recipe No. “123”. When receiving the designation of, the control device 27 arbitrarily selects one (for example, “AA01”) from the recipes “AA01”, “AA02”, and “AA03”, and expands the recipe.

Next, the controller 27 takes out the mask M from the mask library 22 (step 101), and outputs the identification code 13 of the mask M to the identification code reading section 25.
Read with. At this time, the control device 27 controls the first code (mask name) 15 and the second code of the identification code 13 of the mask M.
Each of the codes (mask ID) 16 is checked for compatibility with the recipe (steps 102 and 103). Only if the first code 15 and the second code 16 are both matched by the above collation, the next foreign matter inspection (step 10
Proceeding to 4), if the first code 15 does not match, the mask is replaced with another mask at that time. Furthermore, the first
When the code 15 matches but the second code 16 does not match, the control device 27 exchanges the recipe for a recipe that matches the mask M (step 105). In this case, the recipe is replaced by the same recipe N as the current recipe.
o. This is done by searching for a recipe having the same second code (mask ID) 16 as the mask M from the group having. For example, when the recipe name is “AA01” and the identification code 13 of the matched mask M is “AA-02”, the first code 15 matches “AA” but the second code 16 does not match. Therefore, the control device 27 uses the same recipe No. as the current recipe “AA01”. Group with "123"("AA01","AA02","AA0"
3)), the recipe “AA02” having the second code 16 of “02” is searched and selected, and the recipe “AA0” is selected.
2 ”is expanded and the process proceeds.

Next, the controller 27 carries out a foreign matter inspection by the foreign matter detecting section 24 (step 104). If the result of the foreign matter inspection is unsuccessful, a mask having the same pattern is set in another slot of the mask library 22, and the mask is replaced with a rejected mask to perform predetermined processing again. Or wash it. Further, the above-mentioned steps are performed in the exposure apparatus main body 26 during the exposure processing of the front slot. Therefore, even if the mask or recipe is exchanged as described above, the throughput of the exposure apparatus 20 is hardly affected.

Next, when the exposure processing of the previous lot is completed in the exposure apparatus main body 26, the control apparatus 27 conveys the mask that has passed the foreign matter inspection to the exposure apparatus main body 26 and mounts it on the mask stage 31. Then, a process of exposing and transferring the pattern on the mask M onto the photosensitive substrate P is performed (step 106). At this time, since the processing conditions in the exposure processing include individual processing conditions determined according to individual differences of the mask and reflect the characteristics of the mask M in use, the exposure processing is performed accurately. .

As described above, in this example, the identification code including the unique first code corresponding to the pattern and the second code for identifying the plurality of masks on which the same pattern is formed is provided on the mask. Since they are formed, even masks having the same pattern can be identified. For this reason, when setting up each mask, it is possible to set conditions suitable for each mask, and it is possible to shorten the setup time. In addition, since the recipe is individually prepared for each identification code, it is possible to reflect the individual difference of the mask in the exposure processing and perform the exposure processing with high accuracy.

Moreover, instead of simply providing individual identification codes for the masks, a common code (first code) is provided for masks of the same pattern, and a plurality of masks having the common first code are provided. Since the code (second code) for identifying the mask is separately provided, the identification codes can be grouped and the identification codes can be easily managed.

Further, in this example, since the management of the second code of the identification codes is mainly necessary only in the exposure apparatus that handles the mask, the information regarding the second code is managed by the upper level of the exposure apparatus. It is not necessary to notify the system. Therefore, in this example, although the identification code has the second code, which is not available in the past, it is possible to suppress an increase in the load on the upper management system. Further, the present invention can be applied to a system that does not have means for notifying the upper management system of information from the exposure apparatus.

Further, in this example, as a result of matching the recipe and the mask, the identification codes do not match, and the breakdown is that the first code matches, but the second code does not match, the recipe Whether the replacement is automatically performed or determined by the operator may be set in advance for the exposure process. If the program of the exposure system is set in advance to automatically exchange the desired recipe, the recipe is automatically exchanged for the mask and the processing of the photosensitive substrate is automatically continued. The processing can proceed smoothly as compared with the case where the recipe information is input again. On the other hand, similarly, when the second code does not match, if the optimum recipe or the related recipe for the mask can be selected based on the information of the first code, the replacement of the above recipe is currently performed. Recipe No. Since it is possible to search for a recipe related to a group having, for example, a first code which is pattern information of a mask, the search time is shorter than when searching for a desired recipe from all recipes. Short,
Even when setting as a result, the wrong recipe is not set at all. In this case, it is also possible to bring a mask suitable for the recipe to the exposure apparatus and set it so that the mask is replaced.

In this example, the information on the result of matching the matching between the recipe and the mask is stored, and the processing will be performed next time with reference to the information. That is, the correspondence between the recipe and the mask that have been collated once is stored, and the current position of the mask is always grasped. As a result, the previously specified recipe number.
Is designated, the recipe number. You can quickly select the mask and recipe corresponding to.
In this case, it is possible to omit at least a part of the processing relating to the matching between the mask and the recipe, such as the reading of the identification code for the mask that has been read once can be omitted.

Further, in this example, when the recipe corresponding to the mask identification code is not found at the time of exchanging the recipe, a new recipe is created and the subsequent processing is performed using the recipe. When creating the recipe corresponding to the mask identification code, one of the recipes corresponding to the first code included in the collated mask identification code is used,
Create a recipe that matches the mask. In this case, as described above, the recipe includes the common processing conditions between the masks on which the same pattern is formed and the individual processing conditions determined according to the individual difference of the masks. The recipe corresponding to the current mask can be reliably created in a short time by changing only the individual processing conditions while maintaining the above.

FIG. 5 is a flow chart showing another example of the exposure method of the present invention performed by using the exposure apparatus 20 shown in FIG. In the above-described example, whether the processing conditions included in the recipe are compatible with the mask in use was determined using the second code of the identification code. However, in the exposure method of this example, the mask is formed on the mask. The above determination is performed based on the contrast value of the image of the captured mask mark. Therefore, the mask identification code may be a unique code (first code) corresponding to the pattern. Further, as a preparatory operation, the control device 27 shown in FIG. 2 previously performs the above-described focus measurement, that is, the focus position of the alignment microscope 33 with respect to the mask mark, prior to the exposure processing, and together with the optimum focus value, The contrast value of the image at that time is stored.
The exposure method of this example will be described below with reference to the flowcharts of FIGS. 2 and 5.

First, the control device 27 uses the predetermined recipe N.
o. When receiving the instruction of the processing of No. The recipe is developed (step 200). In this example, the recipe is associated with the mask for each pattern, and the designated No. One recipe is selected for.

Next, the controller 27 takes out a desired mask M from a predetermined slot of the mask library 22 (step 201) and reads the identification code 13 of the mask M. Then, the control device 27 collates the identification code 13 of the mask M with the recipe (step 203). If the identification code does not match as a result of the above-mentioned collation, the foreign substance inspection is then carried out to see if there is foreign matter on the mask (step 203). If the identification code does not match, the current mask is obtained at that time. In the case, give an instruction to take out another mask, and collate the identification code.

Next, the control device 27 takes an image of the mask mark formed on the mask M with the alignment microscope 33,
The contrast value of the image at that time is measured. In this example, the measurement of the contrast value is performed as part of the alignment operation for aligning the mask and the photosensitive substrate described above. That is, when the mask mark is imaged by the alignment microscope 33 during the alignment operation, the contrast value of the imaged image is measured. The control device 27 compares the current contrast value with the previously stored contrast value. When the contrast value at the present time exceeds the predetermined range (allowable range) as compared with the stored contrast value, the optimum focus value of the alignment microscope 33, which is one of the processing conditions included in the recipe, is used. It is determined that the mask does not match the inner mask, and the focus measurement is performed again (step 205). On the other hand, if the current contrast value is within the allowable range, the control device 27
Judges that the stored processing conditions match the mask in use, and executes the exposure processing as it is (step 206).

Here, when the mask for which focus measurement is performed in the preparatory operation and the mask at the present time are the same pattern but different masks, due to the difference in mask thickness and the like, during the alignment operation, the alignment microscope for the mask mark is used. There is a possibility that the focal position of the may shift.
In this example, as described above, by comparing the stored contrast value and the current contrast value,
The matching between the optimum focus value of the alignment microscope and the current mask is judged, and if the matching is not sufficient, the focus value is measured again. Therefore, defocus of the alignment microscope due to mixing and equalization of masks having the same pattern is prevented. Therefore, in this example, the exposure process can be performed accurately by reflecting the individual difference of the mask in the exposure process. In this example, the mask identification code only needs to correspond to the pattern, and it is not necessary to provide a code unique to the mask as in the above-described example. Therefore, management of the identification code is relatively easy.

The remeasurement of the focus value is performed in the same procedure as in the preparatory operation, that is, the mask mark is imaged by the alignment microscope while changing the focus position of the alignment microscope at a constant interval, and the contrast value of the image is changed. This can be done by finding the maximum focus position (optimum focus value). Alternatively, information about the correlation between the contrast value and the optimum focus value may be stored in advance and the optimum focus value for the current mask may be obtained based on the information. In this case, for example, from the results of focus measurement performed on multiple masks,
It is preferable to create and store the information on the above-mentioned correlation, select the contrast value closest to the contrast value of the current mask from the stored information, and obtain the focus value corresponding to the contrast value. Thereby, the optimum focus value can be easily obtained in a short time.

Although the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these embodiments. If you are a person skilled in the art,
It is clear that various changes or modifications can be conceived within the scope of the technical idea described in the claims, and it is understood that they naturally belong to the technical scope of the present invention. It

The exposure apparatus of the present invention may be, for example, a scanning exposure system (for example, step-and-scan system) in which the mask and the photosensitive substrate are moved relative to the exposure illumination light, a mask and a substrate. It can be applied to a static exposure method (for example, a step-and-repeat method) in which a mask pattern is transferred onto a substrate in a state where and are almost stationary. Furthermore, the present invention can be applied to a step-and-stitch type exposure apparatus that transfers a pattern to each of a plurality of shot areas whose peripheral portions overlap on the photosensitive substrate. Further, the projection optical system PL may be any of a reduction system, a unity magnification system, and a magnification system.
Either a catadioptric system or a catoptric system may be used. Furthermore, the present invention can be applied to, for example, a proximity type exposure apparatus that does not use a projection optical system.

In the exposure apparatus to which the present invention is applied, g-line, i-line, KrF excimer laser light, ArF excimer laser light, F2 laser light, and A are used as exposure illumination light.
Ultraviolet light such as r2 laser light can be used. Further, for example, EUV light, X-ray, or charged particle beam such as electron beam or ion beam may be used. Moreover, the light source for exposure is not limited to the mercury lamp and the excimer laser,
Harmonic generator such as AG laser or semiconductor laser, S
An OR, a laser plasma light source, an electron gun or the like may be used.

The exposure apparatus to which the present invention is applied is a semiconductor device, a liquid crystal display device, a display device, a thin film magnetic head, an image pickup device (CCD or the like), a micromachine, or a microdevice (electronic device) such as a DNA chip. Can be used for manufacturing a photomask or reticle used in an exposure apparatus.

When a linear motor is used for the substrate stage or mask stage described above, either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used. Further, the stage may be of a type that moves along a guide, or may be a guideless type that does not have a guide. Further, when a flat motor is used as a drive device for the stage, one of the magnet unit (permanent magnet) and the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is connected to the moving surface side of the stage ( Base).

The reaction force generated by the movement of the substrate stage may be mechanically released to the floor (ground) by using a frame member, as described in JP-A-8-166475. The present invention can also be applied to an exposure apparatus having such a structure.

The reaction force generated by the movement of the mask stage is mechanically fixed to the floor (ground) by using a frame member, as described in JP-A-8-330224.
You may let me escape. The present invention can also be applied to an exposure apparatus having such a structure.

In the exposure apparatus to which the present invention is applied, various subsystems including the constituent elements recited in the claims of the present application are provided so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by assembling. Before and after this assembly, adjustments to achieve optical precision for various optical systems, adjustments to achieve mechanical precision for various mechanical systems, and various electrical systems to ensure these various types of precision are made. Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from the various subsystems includes mechanical connection, electrical circuit wiring connection, air pressure circuit pipe connection, and the like between the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies of the exposure apparatus as a whole. It is desirable that the exposure apparatus be manufactured in a clean room where the temperature and cleanliness are controlled.

For devices such as semiconductor devices and liquid crystal devices, the process of designing the function / performance of the device, the process of producing a mask (reticle) based on this design step, the process of producing a substrate to be a photosensitive substrate, It is manufactured through the substrate processing step of exposing the mask pattern onto the photosensitive substrate by the above-described exposure apparatus, the device assembly step (including the dicing step, the bonding step, the packaging step, etc.), the inspection step and the like.

[0054]

As described above, according to the mask of the present invention, masks having the same pattern can be discriminated from each other. Therefore, it is suitable for accurately performing the exposure process. Further, according to the exposure method, the exposure apparatus, and the device manufacturing method of the present invention, masks having the same pattern can be identified, and mask setup can be shortened and exposure processing can be performed accurately.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an embodiment of a mask of the present invention.

FIG. 2 is a diagram schematically showing an overall configuration of an example of an embodiment of an exposure apparatus of the present invention.

FIG. 3 is a diagram showing an example of a relationship between a mask identification code and a recipe.

FIG. 4 is a flowchart showing an example of the exposure method of the present invention.

FIG. 5 is a flowchart showing another example of the exposure method of the present invention.

[Explanation of symbols]

M mask P photosensitive substrate (substrate) 11 patterns 12 Mask mark 13 identification code 15 First Code 16 second code 20 Exposure equipment 25 Identification Code Reading Section (Identification Code Reading Means) 26 Exposure system body 27 Control device (recipe supply means) 33 Alignment microscope (observation system)

Claims (10)

[Claims] 1. A pattern serving as an original image of a circuit pattern,
A mask formed with an identification code for identifying the pattern, wherein the identification code is a first unique peculiar to the pattern.
A mask comprising: a code; and a second code for identifying a plurality of masks having the same pattern. 2. The mask according to claim 1, wherein the plurality of masks are patterns drawn by combining the pattern and the first code with the second code. 3. An exposure method for transferring a pattern formed on a mask onto a photosensitive substrate, wherein a plurality of unique first codes corresponding to the pattern and the same pattern are formed on the mask. And an identification code including a second code for identifying the mask, and a recipe including a predetermined processing condition is individually prepared for each identification code. 4. When creating a recipe corresponding to the identification code of the mask, any recipe corresponding to the first code included in the identification code is used to create a recipe that matches the mask. The exposure method according to claim 3, wherein: 5. The method according to claim 3, wherein the recipe includes processing conditions common to masks on which the same pattern is formed and individual processing conditions determined according to individual differences of the masks. The exposure method according to claim 4. 6. The first mark formed on the mask and the second mark formed on the photosensitive substrate are imaged under predetermined conditions,
An exposure method for transferring a pattern formed on the mask onto the photosensitive substrate positioned relative to the mask based on the result of the imaging, wherein the contrast value of the image of the first mark is An exposure method, characterized in that the matching between the mask and the predetermined condition is determined based on the above. 7. The exposure method according to claim 6, wherein the predetermined condition includes a parameter for adjusting a focus position of an observation system (33) for imaging the first mark. 8. Information on the correlation between the contrast value and the predetermined condition is stored in advance, and when the predetermined condition and the mask are not sufficiently matched, based on the measurement result of the contrast value and the information. The exposure method according to claim 6, wherein the predetermined condition is changed. 9. Any one of claims 3 to 8
A method of manufacturing a device, comprising the step of transferring the device pattern formed on the mask onto the photosensitive substrate by using the exposure method described in the item 1. 10. An exposure apparatus for transferring a pattern formed on a mask onto a photosensitive substrate based on a recipe, wherein the mask has a first code common to the masks on which the same pattern is formed, An identification code including a second code for identifying a plurality of masks on which the same pattern is formed, identification code reading means for reading the identification code formed on the mask, and for each identification code, An exposure apparatus comprising: a recipe supply unit that individually prepares a recipe including a predetermined processing condition.