JP2003117666A - Ultrasonic compressive-joining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic compressive-joining device which can selectively, efficiently and continuously perform the ultrasonic joining and the compressive joining at the same position by one device. SOLUTION: An ultrasonic joining device 1 and a compressive joining device 2 are provided continuous to each other so that works are joined with each other on a common anvil 3, and a tool 4 having an ultrasonic wave application tip 40 and a compression die 41 is provided above the anvil 3 so that the pressure of the ultrasonic vibration when applying the ultrasonic wave and the pressure during the compression to the works 50 and 51 are selectively applied to the anvil 3. When a part of a plurality of tools 4 includes the ultrasonic wave application tip 40 or the ultrasonic wave application tip 40 together with the compression die 41, and the remaining tools are the compression die 41, the movement of either tool is controlled by a drive device so as to selectively face a part above the anvil 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to ultrasonic bonding (ultrasonic pressure welding) and compression bonding (cold pressure welding) at the same position of a composite device with respect to members to be bonded. The present invention relates to an ultrasonic / compression bonding apparatus that can be selectively performed. More specifically, the present invention relates to an ultrasonic / compression joining device that can be suitably used for joining an electric wire and a terminal.

[0002]

2. Description of the Related Art An ultrasonic / compression bonding apparatus capable of selectively performing ultrasonic bonding and compression bonding at the same position with one apparatus has not been proposed. For example, the electric wire and the terminal are joined together by wrapping the electric wire, which is a bundle of many wires, with a terminal member. Conventionally, when the electric wire and the terminal are made of aluminum or an aluminum alloy, or copper or a copper alloy, the joining of the both is usually performed by compression joining, but in particular, the cross-sectional area (the cross-sectional area in the state where the wires are bundled) In some cases, the electric wire and the terminal having a small value are joined by ultrasonic joining.

[0003]

However, in the case of connecting an electric wire and a terminal which are composed of a large number of thin wires which have a relatively large cross-sectional area and are required to have flexibility or flexibility (flexibility), It was difficult to destroy the surface oxide film of the wire and the terminal by compression connection, and there was a problem in the electrical connection characteristics after joining. Especially in the case of aluminum or aluminum alloy wire, the tendency was strong because the oxide film on the surface was strong.

In order to solve the above-mentioned problems, it is conceivable to use ultrasonic bonding as in the case of bonding an electric wire having a small cross-sectional area to a terminal. That is, when the electric wire and the terminal are ultrasonically bonded as described above, the contact surface is rubbed by the vibration of the wire due to the ultrasonic waves, impurities and surface oxide films adhering to the portion are removed, and the wire and This is because good electrical connection characteristics can be obtained because the terminals are connected in the activated state. However, in ultrasonic bonding, it is difficult to obtain sufficient wire gripping force by the terminal because the pressure is weak.
Also, if the ultrasonic wave application time is lengthened to increase the wire gripping force of the terminal by ultrasonic bonding, or if the horn pressing load at the time of application is increased, the strands that compose the wire are fatigued due to the vibration at the vibration application part, There is a problem that it is easily worn and broken. Therefore, for joining an electric wire composed of a large number of thin wires having a relatively large cross-sectional area and flexibility and a terminal, a joining method in which ultrasonic joining and compression joining are appropriately combined is suitable. You can say that.

However, when the ultrasonic bonding and the compression bonding are combined using a single-function machine like the conventional ultrasonic bonding device and the compression bonding device, it is sufficient to make the characteristics after bonding constant. In addition to the need for strict quality control, it is necessary to move the members to be joined from one device to the other device, which results in a large number of steps and is troublesome. In addition, depending on the structure and shape of the members to be joined, for example, when ultrasonic waves are applied from above the terminals after the terminals are compressed and joined to the wires, the ultrasonic vibrations are not sufficiently transmitted to the wires, and the wires between There is a problem that ultrasonic bonding between terminals tends to be insufficient.

The present invention is proposed in order to solve the above-mentioned problems, and an object of the present invention is to make ultrasonic bonding and compression bonding at the same position (moving a connected member by one device). An object of the present invention is to provide an ultrasonic / compression bonding apparatus that can be continuously performed selectively and efficiently (without performing the above).

[0007]

The ultrasonic / compression bonding apparatus according to the present invention is configured as follows in order to solve the above-mentioned problems. That is, according to the ultrasonic / compression bonding apparatus of claim 1, the ultrasonic bonding apparatus and the compression bonding apparatus are provided side by side so that the members to be bonded are bonded to each other on the common anvil, and the upper part of the anvil is provided. Is equipped with a processing tool that also serves as an ultrasonic wave application tip and a compression die, and ultrasonic vibration and applied pressure when ultrasonic waves are applied to the members to be joined and pressing force are selected on the anvil through the processing tool. It is characterized in that it is configured to act in a positive manner.

An ultrasonic / compression bonding apparatus according to a second aspect is the bonding apparatus according to the first aspect, wherein the ultrasonic bonding apparatus includes a transducer unit having an ultrasonic horn in a horizontal direction and the ultrasonic horn. And a horn pressure applying device for applying a pressing force to a node part (non-vibration part) via a load applying part, wherein the compression joining device applies a pressing force to the processing tool via the load applying part. And the processing tool is provided at the tip of the ultrasonic horn.

In the ultrasonic / compression bonding apparatus according to the third aspect, the ultrasonic bonding apparatus and the compression bonding apparatus are provided side by side so that the members to be bonded are bonded to each other on a common anvil.
A plurality of processing tools installed in a state that can be selectively arranged above the anvil, ultrasonic vibration and ultrasonic pressure at the time of ultrasonic imprinting on the members to be joined and pressing force at the time of compression are above the anvil. It is configured to selectively act on the anvil through a positioned processing tool, and the plurality of processing tools both serve as an ultrasonic wave application tip and a compression die, or a part of them is an ultrasonic wave application tip. The present invention is characterized in that some of them are used as the ultrasonic wave application tip and the compression die, and the other part thereof is a compression die.

An ultrasonic / compression bonding apparatus according to a fourth aspect is the bonding apparatus according to the third aspect, wherein the ultrasonic bonding apparatus includes a transducer unit having an ultrasonic horn in a horizontal direction and the ultrasonic horn. and a horn push adding device for applying a pressure via the load application part section part (vibration-free portion), the pressure to the work tool said compression bonding device positioned in the anvil upwards through the load application part The processing tool is provided with a load generating section to apply, each processing tool is provided at a predetermined angular interval along the circumferential direction at the tip of the ultrasonic horn, and the vibrator unit including the ultrasonic horn is operated by the pressing force. It is characterized in that it is movable along a predetermined stroke by a predetermined stroke, and is controlled so that one of the processing tools is selected by a rotary driving device so as to be positioned above the anvil.

An ultrasonic / compression bonding apparatus according to a fifth aspect is the bonding apparatus according to the third aspect, wherein the ultrasonic bonding apparatus includes a transducer unit having an ultrasonic horn in a horizontal direction and the ultrasonic horn. and a horn push adding device for applying a pressure via the load application part section part (vibration-free portion), pressure to the work tool said compression bonding device to be located towards the said anvil through the load application part A load generating unit for applying a force, each of the processing tools is provided at a predetermined interval along the horizontal direction to the tip of the ultrasonic horn, and the vibrator unit including the ultrasonic horn is operated by the pressing force. It is characterized in that it can be moved by a predetermined stroke along a direction and is controlled so that one of the tools is selected by a horizontal driving device so as to be positioned above the anvil.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of an ultrasonic / compression bonding apparatus according to the present invention will be described below with reference to the drawings. 1 is a schematic side view showing an embodiment of an ultrasonic / compression bonding apparatus according to the present invention, FIG. 2 is a schematic front view of the bonding apparatus shown in FIG. 1, and FIGS. 3, 4 and 5 show the bonding apparatus shown in FIG. Enlarged front views showing different forms of the installed processing tools, and FIGS. 6 (a) and 6 (b) are views showing members to be joined (electric wires and wires) when the processing tool of FIG. 3 is installed in the joining device of FIG. Electrodes. The same applies hereinafter.) An enlarged end view exemplifying a mutual joint form, FIG. 7C.
(D) Each drawing is an enlarged end view exemplifying the form of a joint between the members to be joined when the processing tool of FIG. 4 is installed in the joining device of FIG. 1, and each of (e), (f), and (g) of FIG. FIG. 3 is an enlarged end view showing an example of the form of a joint between members to be joined when the processing tool of FIG. 5 is installed in the joining device of FIG.

First Embodiment In the ultrasonic / compression bonding apparatus of the first embodiment, a common anvil 3 is installed directly below the bonding position between the members 50 (electric wires) and 51 (terminals) to be bonded, The ultrasonic joining device 1 and the compression joining device 2 are provided side by side so that the members are joined to each other on the common anvil 3.

The ultrasonic joining device 1 includes a vibrator unit 10 for converting electric energy received from an oscillating device (not shown) into mechanical vibration energy, and a horn pressing device 1.
1 and. The vibrator unit 10 integrally includes an ultrasonic horn 12 in the horizontal direction, and an ultrasonic wave applying tip is provided at a tip end portion 14 of the ultrasonic horn 12 which has a divergent shape in a vertical direction (a direction in which a pressure is applied). 40 and compression die 4
A processing tool 4 that doubles as 1 (enlarged in FIG. 3) is installed with the processing portion at the lower end facing above the anvil 3. The horn pressing device 11 includes an ultrasonic horn 12
It is installed so that the pressing force is applied to the node portion (vibration-free portion) 13 of the shaft 16 via the shaft 16 and the load applying portion 15 at the tip thereof. The compression bonding apparatus 2 includes a shaft 22 and a load applying section 2
A load generating unit 20 for applying a pressing force to the processing tool 4 via 1 is provided. The load generator 20 includes a pneumatic mechanism,
A load is generated by a hydraulic mechanism or a mechanical mechanism.

The ultrasonic / compression bonding apparatus of this embodiment is
The ultrasonic bonding device 1 and the compression bonding device 2 are configured to be selectively operated by the control of a control device (not shown). During operation of the ultrasonic bonding apparatus 1, the mechanical vibration energy converted by the vibrator unit 10 is bonded to the members 50, 51 to be bonded via the ultrasonic horn 12 and the processing tool 4.
Is transmitted to the members 50 and 51 to be joined on the anvil 3 via the ultrasonic horn 12 and the processing tool 4. On the other hand, while the compression welding device 2 is operating, the pressure applied by the load generating unit 20 is not applied to the load applying unit 2.
It acts on the members to be joined 50, 51 via the tool 1 and the processing tool 4.

The ultrasonic / compression bonding apparatus of this embodiment is
The target members to be joined 50 and 51 are electric wires and terminals made of aluminum or aluminum alloy, copper or copper alloy, and are suitable for joining electric wires and terminals having a relatively small cross-sectional area. First, in the state of FIG. 1, as shown in FIG. 3, another member 50 to be joined is set on the member 51 to be joined on the anvil 3, and the load applying section 21 of the compression joining apparatus 2 is lowered, and the load is applied. A predetermined pressing force is applied to the materials to be welded 50 and 51 via the processing tool 4 by the generator 20, and the two are compression-bonded in the state as shown in FIG. Next, after the load applying unit 21 is raised to release the members 50 and 51 to be joined from the pressure applied by the load generating unit 20, the ultrasonic horn 12 and the processing tool 4 are operated as they are to operate the ultrasonic joining apparatus 1. . That is, a predetermined pressing force is applied from the horn pressure applying device 11 to the ultrasonic horn 12 via the load applying section 15, and the pressing force is applied via the processing tool 4 to the members 50, 5 to be joined.
1 and actuating the oscillator unit 10 to apply the vibration to the members to be joined 50, 51, these are ultrasonically joined in the state as shown in FIG. 6B.

With the above construction, the compression bonding and the ultrasonic bonding can be efficiently and continuously performed on the members to be bonded at the same position of one device. At the joint between the electric wire and the terminal joined as described above, the electric wire gripping force by the terminal is sufficient and the electrical connection characteristic is improved.

Second Embodiment An ultrasonic / compression bonding apparatus according to the second embodiment of the present invention is
Since most parts of the structure of the joining device of the first embodiment are the same as those of the bonding device of the first embodiment, only the different parts from the device of the first embodiment will be described with reference to FIGS. 1, 2 and 4.
In the apparatus of this embodiment, a plurality of processing tools 4, 4 having a configuration as shown in FIG. 4 are installed so that any one of them can be selectively moved and arranged above the anvil 3.
As shown in an enlarged scale in FIG. 1, one processing tool 4 is an ultrasonic wave application tip 40 and the other processing tool 4 is a compression die 41.

In this embodiment, a plurality of processing tools 4,
The specific configuration for installing 4 so that it can be selectively moved and arranged above the anvil 3 is as follows. The processing tools 4 and 4 are provided at a predetermined angular interval along the circumferential direction at the tip of the ultrasonic horn 12. Further, the transducer unit 10 including the ultrasonic horn 12 is movable by a predetermined stroke along the acting direction (vertical direction) of the pressing force of the horn pressure applying device 11, and each is driven by the rotary drive device 17. It is controlled so that one of the tools 4 is selected to face the anvil 3. In this embodiment, as shown in FIG. 4, the processing tool 4 including the ultrasonic wave applying tip 40 is formed at one end of the vertical main body, and the processing tool 4 including the compression die 41 is formed at the other end of the main body. . Therefore, the angular interval in the circumferential direction between the processing tools 4 and 4 is 18
It is 0 degrees. Transducer unit 1 including ultrasonic horn 12
0 means that when the welding device of this embodiment shifts from the ultrasonic welding operation to the compression welding operation, or vice versa, that is, when the operation mode is changed, one of the processing tools 4 is driven by a drive device (not shown). It rises until it separates from the members to be joined 50, 51, and is controlled by the rotation driving device 17 to rotate 180 degrees so that one desired processing tool 4 is exposed above the anvil 3. The change of the operation mode and the control of each drive device are performed by a control device (not shown).

The ultrasonic / compression bonding apparatus of this embodiment is
The members to be joined 50, 51 are electric wires and terminals made of the above-mentioned materials, and are suitable for joining when the cross-sectional size of the electric wires and terminals is relatively large. In order to join such an electric wire and a terminal, in a state where the ultrasonic wave application tip 40 faces the upper side of the anvil 3, the members 50 and 51 to be joined which are stacked as described above are set on the anvil 3, Both are ultrasonically bonded to each other by the ultrasonic bonding device 1 in the state shown in FIG. Next, the load application unit 15 is raised to release the ultrasonic horn 12 from the pressure applied by the horn pressing device 11, the transducer unit 10 is slightly raised, and then the transducer unit 10 is rotated 180 degrees. Compression die 41
Is exposed above the anvil 3, and the members 50 and 51 to be joined are compression-joined by the compression joining device 2 in the state shown in FIG.

The ultrasonic / compression bonding apparatus of the second embodiment is
As described above, when the operation mode is changed, the desired processing tool 4 is selected and moved so as to face the anvil 3, so that ultrasonic welding is performed at the same position with respect to the members to be welded by one device. The compression bonding can be efficiently and continuously performed. Further, when the members to be joined are electric wires and terminals having a relatively large cross-sectional area, if the processing shapes of the respective processing tools 4, 4 are set in advance, ultrasonic vibration will destroy the impurities and oxide film on the surface of the electric wires. Therefore, it is possible to perform the joining with good electrical connection characteristics, and the subsequent compression joining enables the joining with a large electric wire gripping force by the terminal.

Third Embodiment The ultrasonic / compression bonding apparatus of the third embodiment is a plurality of processing tools as shown in FIG. 5 in which the plurality of processing tools 4, 4 in the bonding apparatus of the second embodiment are enlarged. 4 and 4 are substituted. That is, the processing tool 4 that also serves as the ultrasonic wave application tip 40 and the compression die 41 is formed at one end of the vertical main body,
A processing tool 4 including a compression die 41 is formed on the other end of the main body.

The ultrasonic horn 1 is provided with such processing tools 4 and 4.
2 is provided vertically to the tip end portion of the ultrasonic wave applying tip 40, for example.
The operation is started in a state in which the processing tool 4 that also serves as the compression die 41 faces the upper side of the anvil 3. First, the members to be connected 50 and 51 consisting of electric wires and terminals are set on the anvil 3, and they are compression bonded to each other in the state shown in FIG. Next, with the ultrasonic horn 12 and the processing tool 4 as they are,
After releasing 0 and 51 from the compressive load, both are ultrasonically bonded in the state of FIG. Further, the load applying section 15 is raised to release the ultrasonic horn 12 from the pressure applied by the horn pressing device 11, the transducer unit 10 is slightly raised, and then the transducer unit 10 is rotated 180 degrees. Face the compression die 41 above the anvil 3,
The members 50 and 51 to be joined are compression-joined by the compression-joining device 2 to the state shown in FIG. Other configurations and operational effects of the third embodiment are similar to those of the second embodiment, and therefore their description is omitted.

Fourth Embodiment FIG. 9 is a schematic side view of an ultrasonic / compression bonding apparatus according to a fourth embodiment of the present invention, and FIG. 10 is a partial enlarged view partially showing the form of each processing tool in the apparatus of FIG. It is a figure. The configurations of the ultrasonic bonding apparatus 1 and the compression bonding apparatus 2 and the positional relationship between them and the anvil 3 are the same as those of the bonding apparatus of the first embodiment. At the tip of the ultrasonic horn 12, a plurality of processing tools 4, 4 are provided at predetermined intervals along the axial direction (length direction) and the horizontal direction, with the processing parts facing down. There is. As shown in FIG. 10, one processing tool 4 is an ultrasonic wave application tip 40, and the other processing tool 4 is a compression die 41.

Transducer unit 1 including ultrasonic horn 12
0 is movable by a predetermined stroke along the acting direction of the pressing force of the horn pressing device 11, and the horizontal driving device 18 selects one of the processing tools 4 to move the anvil 3. It is configured to be controlled so as to face upward. The transducer unit 10 including the ultrasonic horn 12 is not shown when the welding apparatus of this embodiment shifts from the ultrasonic welding operation to the compression welding operation, or vice versa, that is, when the operation mode is changed. The driving device raises one of the processing tools 4 until it is separated from the members to be joined 50, 51, and the horizontal driving device 18 advances and retracts in the axial direction so that one desired processing tool 4 faces the anvil 3. Controlled by. The change of the operation mode and the control of each drive device are performed by a control device (not shown).

The ultrasonic / compression bonding apparatus of this embodiment is
Similar to the joining device of the second embodiment, the members to be joined 50, 5
Reference numeral 1 denotes an electric wire and a terminal, which are suitable for joining when the cross-sectional size of the electric wire and the terminal is relatively large. In order to join such an electric wire and a terminal, in a state where the ultrasonic wave application tip 40, which is one of the processing tools 4, faces the upper side of the anvil 3, the members 50, 51 to be joined which are stacked as described above.
Is set on the anvil 3 and the two are ultrasonically bonded by the ultrasonic bonding device 1 to the state shown in FIG. 7 (c). Then
After the load applying section 15 is raised to release the ultrasonic horn 12 from the pressure applied by the horn pressing device 11, the transducer unit 10 is slightly raised, and then the transducer unit 10 is processed by the horizontal drive device 18. 7, the compression die 41 is made to face above the anvil 3, and the members 50 and 51 to be joined are compressed by the compression joining device 2 as shown in FIG.
(D) in the state shown in FIG. Since the operation and effect of the joining device of this embodiment are similar to those of the second embodiment, their description will be omitted.

Other Embodiments In the ultrasonic / compression bonding apparatus according to the present invention, the processing tools 4, 4 are used.
9 instead of providing the ultrasonic horn 12 at the tip end portion of the ultrasonic horn 12 at a predetermined interval along the length direction and the horizontal direction as in the fourth embodiment (FIG. 9). The ultrasonic horn 12 can be provided at a predetermined interval along the horizontal direction (for example, the left-right direction in FIG. 2) orthogonal to the lengthwise direction of the ultrasonic horn 12. In such an embodiment,
Instead of the horizontal drive device 18 of FIG. 9, another horizontal drive device that moves the transducer unit 10 including the ultrasonic horn 12 in the horizontal direction by the distance between the processing tools 4 and 4 is installed. In the fourth embodiment and the other embodiments described above, as shown in FIG. 5, one of the processing tools 4 may be a structure that serves as an ultrasonic chip and a compression die, and the other processing tool 4 may be a compression die. . In the processing tools 4 and 4 shown in FIG. 5, both processing tools 4 and 4 are both ultrasonic wave applying tips 40.
It can be implemented even if it doubles as the compression die 41.

[0028]

According to the ultrasonic / compression bonding apparatus of the first and second aspects of the invention, the ultrasonic bonding apparatus and the compression bonding apparatus are combined so that the members to be bonded are bonded to each other on a common anvil. Along with it, a processing tool that doubles as an ultrasonic wave application tip and a compression die is provided above the anvil. Since it is configured so as to selectively act on the anvil, the compression bonding and the ultrasonic bonding can be efficiently and efficiently performed at the same position of one device with respect to the members to be bonded without moving the processing tool. It can be performed continuously. Further, when the members to be joined are an electric wire and a terminal made of aluminum or an alloy thereof or copper or an alloy thereof, the electric wire gripping force by the terminal is sufficient and the electrical connection characteristic is improved at the joint portion.

According to the ultrasonic / compression bonding apparatus of the present invention, the ultrasonic bonding apparatus and the compression bonding apparatus are combined so that the members to be bonded are bonded to each other on the common anvil. , A processing tool that is provided with a plurality of processing tools in a state where it can be selectively disposed above the anvil, and ultrasonic vibration and ultrasonic pressure at the time of ultrasonic imprinting on a member to be joined and pressing force are positioned above the anvil. Is configured to act selectively on the anvil through the plurality of processing tools, and the plurality of processing tools both serve as an ultrasonic wave application tip and a compression die, or some of them are ultrasonic wave application tips or ultrasonic waves. Since the application tip and the compression die are combined and the other part of them is the compression die, by selectively arranging the processing tool, the compression bonding and the ultrasonic bonding can be performed on the members to be bonded at the same position of one device. And efficiently It can be carried out continuously. Also,
Even if the members to be joined are electric wires and terminals made of aluminum or its alloy or copper or its alloy and the cross-sectional size of the electric wires and terminals is relatively large, the electric wire gripping force by the terminals is sufficient at those joints. And the electrical connection characteristics are improved.

[Brief description of drawings]

FIG. 1 is a schematic side view for explaining first to third embodiments of an ultrasonic wave / compression bonding apparatus according to the present invention.

FIG. 2 is a schematic front view of the joining apparatus of FIG.

FIG. 3 is an enlarged front view of a processing tool used in the joining device according to the first embodiment.

FIG. 4 is an enlarged front view of a processing tool used in the joining device according to the second embodiment.

FIG. 5 is an enlarged front view of a processing tool used in the joining device according to the third embodiment.

6A and 6B are views showing an example of a joining portion form of members to be joined joined by the joining apparatus according to the first embodiment. FIG. 6A is an enlarged end view of the joining portion after compression joining, and FIG. FIG. 6 is an enlarged end view of a joint portion in which the members to be joined are further ultrasonically joined from the state shown in the figure.

7A and 7B exemplify a joining portion form of joined members joined by the joining apparatus according to the second embodiment. FIG. 7C is an enlarged end view of the joining portion after ultrasonic joining, and FIG. FIG. 3C is an enlarged end view of the joint where the members to be joined are further compression joined from the state shown in FIG.

8A and 8B exemplify a joining portion form of members to be joined joined by the joining apparatus according to the third embodiment. FIG. 8E is an enlarged end view of the joining portion after compression joining, and FIG. ) An enlarged end view of the joint where the members to be joined are ultrasonically joined from the state shown in the figure,
FIG. 6G is an enlarged end view of the joint portion in which the members to be joined are further compression joined from the state of FIG.

FIG. 9 is a schematic side view of an ultrasonic wave / compression bonding apparatus according to a fourth embodiment of the present invention.

10 is a partially enlarged view partially showing the form of each processing tool in the joining device of FIG. 9. FIG.

[Explanation of symbols]

1 Ultrasonic bonding device 10 transducer unit 11 Horn pressing device 12 ultrasonic horn 13 nodes (vibration free part) 14 Tip 15 Load application part 16 axes 17 Rotary drive 18 Horizontal drive 2 compression bonding equipment 20 Load generation part 21 Load application part 22 axes 3 anvil 4 processing tools 40 Ultrasonic wave application chip 41 compression die 50,51 Members to be joined

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takashi Miyoshi             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. (72) Inventor Tatsuzo Koyama             1-6 Kashiwacho, Tachikawa, Tokyo 1 Ultrasonic wave             Industry Co., Ltd. (72) Inventor Hidemichi Fujiwara             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. F-term (reference) 4E067 AA05 AA07 BB01 BF00 BF04                       CA02 EA04 EC13                 5D107 AA14 BB01 FF03 FF06 FF07

Claims (5)

[Claims] 1. An ultrasonic bonding apparatus and a compression bonding apparatus are provided side by side so that the members to be bonded can be bonded to each other on a common anvil, and an ultrasonic wave application chip and a compression die are provided above the anvil. A tool is provided, and it is configured such that ultrasonic vibration and ultrasonic pressure at the time of applying ultrasonic waves to the members to be joined and pressing force at the time of compression act selectively on the anvil via the processing tool. An ultrasonic / compression bonding device. 2. The ultrasonic bonding apparatus comprises a vibrator unit having an ultrasonic horn in a horizontal direction, and a horn for applying a pressing force to a node portion (non-vibration portion) of the ultrasonic horn via a load applying portion. A pressure applying device, the compression joining device includes a load generating section that applies a pressing force to the processing tool via a load applying section, and the processing tool is provided at the tip of the ultrasonic horn. The ultrasonic / compression bonding apparatus according to claim 1, wherein 3. A plurality of ultrasonic welding devices and a compression welding device are provided side by side so that the members to be welded can be welded to each other on a common anvil, and the ultrasonic welding device and the compression welding device can be selectively placed above the anvil. the processing tool wherein the to act selectively on the anvil through the machining tool ultrasonic vibration and pressure and pressure applied during compression of the time under the ultrasonic mark is positioned at the anvil upwards against the workpieces The plurality of processing tools are both ultrasonic wave application chips and compression dies, or some of them are ultrasonic wave application chips or ultrasonic wave application chips and compression dies. Ultrasonic wave, characterized in that part is a compression die
Compression bonding equipment. 4. The ultrasonic bonding apparatus includes a vibrator unit having an ultrasonic horn in a horizontal direction, and a horn for applying a pressure force to a node portion (non-vibration portion) of the ultrasonic horn via a load applying portion. A pressure applying device, the compression joining device includes a load generating unit that applies a pressing force to a processing tool located above the anvil via a load applying section, and each processing tool has a tip portion of the ultrasonic horn. At a predetermined angular interval along the circumferential direction, the vibrator unit including the ultrasonic horn is movable in a predetermined stroke along the acting direction of the pressing force, and is rotated by a rotation driving device among the processing tools. The ultrasonic / compression bonding apparatus according to claim 3, wherein any one of the above is controlled so as to be exposed above the anvil. 5. The ultrasonic bonding apparatus includes a vibrator unit having an ultrasonic horn in a horizontal direction, and a horn for applying a pressure force to a node portion (non-vibration portion) of the ultrasonic horn via a load applying portion. A pressure applying device, the compression joining device includes a load generating unit that applies a pressing force to a processing tool located above the anvil via a load applying section, and each processing tool has a tip portion of the ultrasonic horn. The vibrator unit including the ultrasonic horns, which is provided along the horizontal direction at a predetermined interval, is movable in a predetermined stroke along the acting direction of the pressing force, and any one of the tools by a horizontal drive device. The ultrasonic-compression bonding apparatus according to claim 3, wherein the ultrasonic-compression-bonding apparatus is controlled so that it is selected and exposed above the anvil.