JP2003115471A - Backside grounding method and system for semiconductor chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To grind the backside of a semiconductor chip in the same handling manner as a wafer. SOLUTION: A plurality of semiconductor chips 2 are arranged with their surfaces upward on a tape mounting tray 4 in conformity with the shape of a wafer. A protective adhesive tape 1 having the same shape as the wafer is pasted to the chips 2 to form a dummy wafer 3 having a wafer shape with the chips' backsides exposed and hence the dummy wafer 3 is set in an existing wafer back grounder to grind the backside of the chip 2. After grinding the backside of the chips 2, the wafer 3 is mounted on a frame 14 with a dicing tape 16, the protective adhesive tape 1 is peeled off and the individual semiconductor chips 2 are picked from the dicing tape 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backside grinding method and a backside grinding system for a semiconductor chip for reducing the thickness of a semiconductor chip obtained by dicing a wafer. More specifically, a plurality of semiconductor chips are attached to a tape-shaped member having the same shape as a wafer so that the back surface of the semiconductor chip can be ground in the same manner as a wafer.

[0002]

2. Description of the Related Art Since a wafer on which various elements are formed has a problem that the resistance is large with the thickness as it is, as a process before dicing the wafer into semiconductor chips,
There is a process called back-grinding process in which the back surface of the wafer is ground to bring the thickness of the wafer to a required value.

10 to 12 are explanatory views showing an example of a wafer backside grinding process. First, the example shown in FIG. 10 is a method mainly used when the wafer thickness is 150 μm or more. That is, first, as shown in FIG. 10A, a protective adhesive tape 32 is attached to the front surface of the wafer 30 by a pressing roller 31, etc., and then the back surface of the wafer 30 is padded as shown in FIG. 10B. Grind at 33.

The wafer 30 that has undergone the backside grinding process is
After the protective adhesive tape 32 is peeled off by the peeling tape 34 as shown in FIG. 10C, the ring-shaped frame 3 is pressed by the pressing roller 35 as shown in FIG. 10D.
6 is mounted by the dicing tape 37, as shown in FIG.
As shown in 0 (e), the wafer 30 is diced by a blade 38 into semiconductor chips.

The example shown in FIGS. 11 and 12 is a method used when the wafer thickness is 150 μm or less. First, in the example shown in FIG. 11, the wafer 30 is half-cut by the blade 38 as shown in FIG. The half-cutting is a dicing method in which the wafer 30 is cut into semiconductor chips in the thickness direction of the wafer 30 from the surface to the middle.

Next, as shown in FIG. 11B, a protective adhesive tape 32 is attached to the surface of the half-cut wafer 30 by a pressing roller 31 or the like, and then, as shown in FIG.
As shown in FIG. 1 (c), the back surface of the wafer 30 is pad 3
Grind at 3. Since the wafer 30 is half-cut from the front surface side, it is cut into semiconductor chips in this back surface grinding step.

Then, as shown in FIG. 11 (d), the wafer 30 after the back surface grinding step is pressed against the pressing roller 3
After being mounted on the ring-shaped frame 36 by the dicing tape 37 by 5 or the like, the protective adhesive tape 32 is peeled off by the peeling tape 34 as shown in FIG.

In the example shown in FIG. 12, first, as shown in FIG. 12A, a pressing roller 31 is pressed against the surface of the wafer 30.
After attaching the protective adhesive tape 32 by using the
As shown in (b), the back surface of the wafer 30 is attached to the pad 33.
Grind with.

Then, the wafer 30 which has undergone the back surface grinding step is pressed against the pressing roller 3 as shown in FIG. 12 (c).
After being mounted on the ring-shaped frame 36 by the dicing tape 37 by 5 or the like, the protective adhesive tape 32 is peeled off by the peeling tape 34 as shown in FIG. 12 (d), and as shown in FIG. The wafer 30 is diced by a blade 38 into semiconductor chips.

With respect to such a wafer-based back grinding process, in recent years, it has become necessary to carry out back grinding on a semiconductor chip unit after dicing. That is, in the case of purchasing a semiconductor chip and manufacturing a semiconductor device, the thickness of the semiconductor chip that can be purchased is often thicker than a desired thickness in order to prevent cracking during transportation of the semiconductor chip. Therefore, it is necessary to grind the back surface of the purchased semiconductor chip. FIG. 13 is an explanatory view showing a conventional backside grinding method for semiconductor chips.

Conventionally, as shown in FIG. 13A, a dummy wafer 41 for adjusting a grinding height is mounted on a ring-shaped chip grinding frame 39 with an adhesive tape 40, and then an operator manually holds the semiconductor chip 42. The semiconductor chips 42 were attached one by one, and the back surface of each semiconductor chip 42 was ground by the pads 43 as shown in FIG. 13B.

[0012]

Conventionally, the back surface grinding process for each wafer has been automated, but as described above, the back surface grinding for each semiconductor chip requires a manual process, which is troublesome. There was a problem that it took time.

The present invention has been made to solve the above problems, and provides a backside grinding method and a backside grinding system for a semiconductor chip, which enables the backside grinding of a semiconductor chip in the same manner as a wafer. The purpose is to

[0014]

In order to solve the above-mentioned problems, a method for grinding a back surface of a semiconductor chip according to the present invention is a state in which a plurality of semiconductor chips are exposed on a tape-shaped member having a wafer shape. Is attached to form a pseudo wafer, and the back surface of each semiconductor chip arranged on the pseudo wafer is ground.

In the above-described method for grinding a back surface of a semiconductor chip according to the present invention, a plurality of semiconductor chips can be handled as an integrated body by attaching the plurality of semiconductor chips to the tape-shaped member. And since the shape of the tape-shaped member matches the shape of the wafer, the back surface of each semiconductor chip can be ground in the same way as a wafer, and existing devices that handle wafers can be used. Using this, the backside grinding of semiconductor chips can be performed automatically.

A back surface grinding system for semiconductor chips according to the present invention is a pseudo wafer forming apparatus for forming a pseudo wafer by adhering a plurality of semiconductor chips to a tape-shaped member having a wafer shape with its back surface exposed. And a grinding device that grinds the back surface of each semiconductor chip on the pseudo wafer created by this pseudo wafer creation device.

In the above-described semiconductor chip backside grinding system according to the present invention, a plurality of semiconductor chips are attached to a tape-shaped member having a wafer shape so that the backside thereof is exposed to create a pseudo wafer. The wafer is sent to a grinding machine and the back surface of each semiconductor chip is ground.

Since the pseudo wafer has the same shape as the wafer, an existing grinding device for grinding the back surface of the wafer can be used for grinding the back surface of the semiconductor chip.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a backside grinding method for a semiconductor chip and a backside grinding system for a semiconductor chip according to the present invention will be described below with reference to the drawings. That is, FIG. 1 is a flow chart showing the method for grinding the back surface of the semiconductor chip of the present embodiment, and FIG. 2 is an explanatory diagram showing the processing in each step performed in the back surface grinding system for the semiconductor chip of the present embodiment.

In the method for grinding the back surface of a semiconductor chip according to this embodiment, a plurality of semiconductor chips 2 are attached to a protective adhesive tape 1 as a tape-shaped member having a wafer shape to create a pseudo wafer 3 (step 1) In the existing apparatus for processing a wafer, the rear surface of the semiconductor chip 2 is ground and the pseudo wafer 3 is returned to the semiconductor chip 2 (steps 2 to 5).

Further, in the semiconductor chip backside grinding system of this embodiment, a plurality of semiconductor chips 2 are attached to the protective adhesive tape 1 as a tape-shaped member having a wafer shape with the backside thereof exposed and simulated. The semiconductor wafer backside grinding method of the present embodiment described above is implemented by including at least a pseudo wafer forming apparatus for forming the wafer 3 and a grinding apparatus for grinding the backside of the semiconductor chip 2.

The details of each step of the flowchart shown in FIG. 1 will be described below. First, the process of forming the pseudo wafer 3 shown in step 1 in FIG. 1 will be described. The process of creating the pseudo wafer 3 includes a process of arranging a plurality of semiconductor chips 2 according to the shape of the wafer and a process of attaching the protective adhesive tape 1 to the plurality of semiconductor chips 2 arranged in this way.

Then, in the process of producing the pseudo wafer 3, a pseudo wafer producing device which constitutes a backside grinding system is used. This pseudo wafer making device is, for example,
A tape mounting tray 4, a reversing arm 6 and a transfer arm 7 used in a step of arranging a plurality of semiconductor chips 2 according to the shape of a wafer, and a step of attaching a protective adhesive tape 1 to the plurality of semiconductor chips 2. The tape mounter device (not shown) used in.

First, FIG. 2A shows a chip in which the semiconductor chips 2 are arranged according to the shape of the wafer in the semiconductor chip back grinding method of the present embodiment carried out by the semiconductor chip back grinding system of the present embodiment. The transfer process of is shown. The tape mounting tray 4 has a shape that matches a wafer having a predetermined diameter, and has a plurality of semiconductor chips 2 mounted thereon. The tape mounting tray 4 may include a vacuum suction device (not shown) so that the semiconductor chip 2 can be held.

The semiconductor chip 2 is mounted on the chip tray 5 and supplied. On the chip tray 5, the semiconductor chips 2 are arranged with the surface thereof facing downward. The transfer of the semiconductor chips 2 from the chip tray 5 to the tape mounting tray 4 is performed by a robot hand.

FIG. 3 is an explanatory view showing the outline of the mechanism for transferring the semiconductor chips to the tape mounting tray 4. The reversing arm 6 is provided with a suction collet 6a at one end thereof, and has a shaft 6b provided on the other end side as a fulcrum.
It has a configuration of rotating 80 degrees. And the reversing arm 6
3A, the semiconductor chip 2 placed on the chip tray 5 is sucked by the suction collet 6a as shown in FIG.
As shown in (b), the semiconductor chip 2 held by the suction collet 6a is turned 180 degrees about the shaft 6b as a fulcrum so that the back surface of the semiconductor chip 2 faces downward.

The transfer head 7 transfers the semiconductor chip 2 held by the reversing arm 6 to the tape mounting tray 4. This transfer head 7 is provided with a suction collet 7a on the tip side, and by a mechanism not shown,
Move up and down and horizontally. And the reversing arm 6
The semiconductor chip 2 whose back surface is held upward is held by the suction collet 7a of the transfer head 7, and the holding of the reversing arm 6 by the suction collet 6a is released to move the transfer head 7 to a desired position. Then, the semiconductor chip 2 held by the suction collet 7a is placed on the tape mounting tray 4. As a result, the semiconductor chips 2 are arranged on the tape mounting tray 4 with their surfaces facing upward.

Since the tape mounting tray 4 has a shape matching the shape of the wafer, if the semiconductor chips 2 are lined up on the tape mounting tray 4 by the transfer head 7, the semiconductor chips 2 can be mounted on the wafer. It will be lined up according to the shape.

The semiconductor chip 2 is placed on the chip tray 5.
When the rear surface of the semiconductor chip 2 is arranged downward, the semiconductor chips 2 are directly transferred onto the tape mounting tray 4 by simply transferring the semiconductor chips 2 from the chip tray 5 to the tape mounting tray 4 by the transfer head 7. The reversing arm 6 is not necessary because the surfaces are lined up.

If a plurality of chip trays 5 accommodating semiconductor chips 2 of different sizes are prepared and the semiconductor chips 2 can be picked up from each of the chip trays 5 by the reversing arms 6, the size of the semiconductor chips 2 can be increased. Different semiconductor chips 2 can be arranged on the tape mounting tray 4.

FIG. 2B shows a step of attaching the protective adhesive tape 1 to the semiconductor chip 2 in the method of grinding the back surface of the semiconductor chip of the present embodiment which is carried out by the back surface grinding system of the semiconductor chip of the present embodiment. Shows. After arranging the semiconductor chips 2 on the tape mounting tray 4, the tape mounting tray 4 is sent to a tape mounter device (not shown) constituting the pseudo wafer forming apparatus, and the protective adhesive tape 1 is attached to the semiconductor chip 2.

The protective adhesive tape 1 is made of a hard material such as PET (polyethylene terephthalate) material and has a wafer shape. FIG. 4 is a perspective view showing a supply state of the protective adhesive tape 1, and the protective adhesive tape 1 is supplied in a state in which a long tape is wound in a roll shape. And by cutting according to the shape of the wafer in advance,
A protective adhesive tape 1 having a wafer shape is constructed.

In the back surface grinding process of the wafer, a protective adhesive tape may be attached for the purpose of protecting the front surface of the wafer, and the protective adhesive tape for the wafer may be used. Further, as the tape mounter device described above, a device for attaching a protective adhesive tape to a wafer may be diverted.

An adhesive layer (not shown) is provided on one surface of the protective adhesive tape 1. Then, as shown in FIG. 2 (b), the protective adhesive tape 1 is supplied onto the tape mounting tray 4 with the pressure-sensitive adhesive layer facing downward, and is pressed onto the tape mounting tray 4 by the pressing roller 8 or the like. It is pressed. As a result, the plurality of semiconductor chips 2 arranged on the tape mounting tray 4 are collectively attached to the protective adhesive tape 1. Then, by handling the protective adhesive tape 1 having the plurality of semiconductor chips 2 attached thereto from the tape mounting tray 4, the plurality of semiconductor chips 2 are integrated with the protective adhesive tape 1 having the shape of a wafer. The wafer 3 is formed.

Now, on the tape mounting tray 4,
Since the semiconductor chips 2 are arranged with their front surfaces facing upward, the back surface of the semiconductor chips 2 is exposed by attaching the protective adhesive tape 1.

Here, by using a hard material such as PET material as the protective adhesive tape 1, when handling this pseudo wafer 3 with a robot hand (not shown) or the like, the pseudo wafer 3 does not bend significantly and is treated like a wafer. It becomes possible.

Further, since the protective pressure-sensitive adhesive tape 1 is cut beforehand according to the shape of the wafer, a device for cutting the protective pressure-sensitive adhesive tape 1 when the protective pressure-sensitive adhesive tape 1 is attached is not necessary.

Next, the back surface grinding process of the semiconductor chip 2 shown in step 2 of FIG. 1 will be described. That is, FIG.
(C) shows a step of performing back surface grinding of the semiconductor chip 2 in the back surface grinding method for a semiconductor chip according to the present embodiment, which is carried out in the back surface grinding system for a semiconductor chip according to the present embodiment. A pseudo wafer 3 in which a plurality of semiconductor chips 2 are integrally formed with a protective adhesive tape 1 having a wafer shape is an existing back grinder device that performs back surface grinding of a wafer, which is an example of a grinding device that constitutes a back surface grinding system. And the back surface of each semiconductor chip 2 is ground.

FIG. 5 is a perspective view showing a schematic structure of an existing back grinder device. The back grinder device includes a loader unloader 10 for supplying the wafer 9 before the back surface grinding and storing the wafer 9 after the back surface grinding, a pad 11 for grinding the back surface of the wafer 9, and this pad 11.
The back grinding unit 12 includes a motor 11a for rotating the wafer, a table 11b for mounting the wafer 9, and the like, and a robot hand 13 for transferring the wafer 9 between the loader unloader 10 and the back grinding unit 12.

The pseudo wafer 3 has the same shape as the wafer 9 whose back surface is ground by such an existing back grinder device, and can be carried by the robot hand 13. Further, in the pseudo wafer 3, the back surface of the semiconductor chip 2 is exposed.

Therefore, the pseudo wafer 3 is stored in the loader / unloader 10 instead of the wafer 9, and the pseudo wafer 3 is conveyed by the robot hand 13 and set on the table 11b of the back surface grinding unit 12. Then, by horizontally moving the table 11b and rotating the pad 11, as shown in FIG. 2 (c), the protective adhesive tape 1
The back surface of each of the plurality of semiconductor chips 2 that are integrated with each other can be ground with the pad 11.

Further, the pseudo wafer 3 on which the back surface grinding of each semiconductor chip 2 is completed is transferred from the back surface grinding section 12 by the robot hand 13 shown in FIG. 5 and stored in the loader / unloader 10.

As described above, in order to return the pseudo wafer 3 whose back surface has been ground to the semiconductor chip 2 to the semiconductor chip 2 by using the existing apparatus, steps 3 to 5 in FIG. 1 are required. .

First, the mounting process on the dicing tape shown in step 3 of FIG. 1 will be described. That is,
FIG. 2D shows a step of mounting the pseudo wafer 3 on the dicing tape in the method of grinding the back surface of the semiconductor chip of the present embodiment which is carried out by the back surface grinding system of the semiconductor chip of the present embodiment. The pseudo wafer 3 after the back surface grinding of each semiconductor chip 2 is sent to an existing tape mounter device that attaches a dicing tape to a wafer, which is an example of a tape mounter device that constitutes a back surface grinding system, and is then framed by the dicing tape. Mounted.

FIG. 6 is a perspective view showing a schematic structure of an existing tape mounter device. The tape mounter device includes a loader unloader 15 that supplies the wafer 9 before mounting to the ring-shaped frame 14 and stores the wafer 9 after mounting, a pressing roller 17 and a pseudo wafer 3.
Wafer mount unit 17 having a mechanism for supplying and attaching dicing tape 16, such as a mechanism for moving table 17a on which a load is placed, and a loader unloader 15
The robot hand 18 for transporting the wafer 9 and the mechanism for supplying the frame 14 and the like.

As described above, since the pseudo wafer 3 can be handled in the same manner as the wafer 9, the pseudo wafer 3 is stored in the loader / unloader 15 instead of the wafer 9, and the pseudo wafer 3 is transferred by the robot hand 18. Then, the frame 14 is set on the table 17a of the wafer mount unit 17, and the frame 14 is mounted on the wafer mount unit 1.
7 table 17a. Then, the table 17a is moved in the direction of the arrow in synchronism with the feeding of the dicing tape 16, so that the dummy wafer 3 is mounted on the frame 14 by the dicing tape 16 by the pushing roller 17a as shown in FIG. 2 (d). can do.

That is, the pseudo wafer 3 is placed at the center of the ring-shaped frame 14 placed on the table 17a shown in FIG.
Is placed with the side to which the semiconductor chip 2 is attached facing upward. Then, the dicing tape 16 cut into a size larger than the inner diameter of the frame 14 and smaller than the outer shape of the frame 14 is attached to the surface of the pseudo wafer 3 on which the semiconductor chip 2 is attached and the frame 14 to obtain the pseudo wafer. 3 is mounted on the frame 14. In this state, the semiconductor chip 2 is sandwiched between the protective adhesive tape 1 and the dicing tape 16.

The pseudo wafer 3 mounted on the frame 14 is transferred from the wafer mounting section 17 by the robot hand 18 shown in FIG.
Stored in 5.

Next, the protective tape peeling process shown in step 4 of FIG. 1 will be described. That is, FIG. 2E shows a step of peeling the protective pressure-sensitive adhesive tape 1 in the method of grinding the back surface of the semiconductor chip of the present embodiment carried out by the back surface grinding system of the semiconductor chip of the present embodiment. The pseudo wafer 3 mounted on the frame 14 by the dicing tape 16 is sent to an existing protective tape peeling device that peels the protective adhesive tape from the wafer, which is an example of a peeling device that constitutes the backside grinding system, and the protective adhesive tape 1 Is peeled off.

FIG. 7 is a perspective view showing a schematic structure of an existing protective tape peeling device. The protective tape peeling device includes a loader unloader 19 for supplying the wafer 9 before peeling the protective adhesive tape 1 and storing the wafer 9 after peeling the protective adhesive tape 1, and a peeling tape for peeling the protective adhesive tape 1. 20 and a protective adhesive tape peeling unit 21 including a table 21a for mounting the wafer 9 mounted on the frame 14, a robot hand 22 for transferring the wafer 9 between the loader unloader 19 and the protective adhesive tape peeling unit 21, and the like. Composed of.

By mounting the pseudo wafer 3 on the frame 14 as described above, the wafer 9 after dicing is mounted.
Can be treated like. Therefore, the pseudo wafer 3 is stored in the loader / unloader 19 in place of the wafer 9, and the pseudo wafer 3 is transported by the robot hand 22 so that the surface to which the protective adhesive tape 1 is attached faces upward. Table 21a of peeling section 21
Set to. Then, the table 21a is moved in the arrow direction in synchronism with the feeding of the peeling tape 20, whereby the protective adhesive tape 1 and the peeling tape 2 are moved as shown in FIG.
0 is attached, and the protective adhesive tape 1 can be peeled from the semiconductor chip 2 by the peeling tape 20. When the protective adhesive tape 1 is peeled from the pseudo wafer 3, the semiconductor chip 2 is attached to the dicing tape 16 with its surface exposed, so that the wafer after dicing in a general wafer dicing process It becomes the same state as.

The protective adhesive tape 1 is peeled off and the semiconductor chip 2 mounted on the frame 14 by the dicing tape 16 is conveyed from the protective adhesive tape peeling section 21 by the robot hand 22 shown in FIG. 19 are stored.

Next, the step of picking up the semiconductor chip 2 shown in step 5 of FIG. 1 will be described. That is,
FIG. 2F shows a semiconductor chip back surface grinding method of the present embodiment implemented by the semiconductor chip back surface grinding system of the present embodiment, in which the semiconductor chip 2 whose back surface grinding has been completed is transferred to the chip tray 5. The replacement process is shown.

In the step of picking up the semiconductor chip 2, a pickup device which constitutes a backside grinding system is used. This pickup device is composed of, for example, a table (not shown) on which the frame 14 is set, a reversing arm 6 and a transfer head 7.

The semiconductor chip 2 from which the protective pressure-sensitive adhesive tape 1 has been peeled off after the back surface grinding is completed is attached to the dicing tape 16 and mounted on the frame 14. The frame 14 on which the semiconductor chip 2 is mounted is set on a table (not shown) for picking up the semiconductor chip 2. This table shows the semiconductor chips 2
A needle elevating mechanism (not shown) for pushing up is provided. This needle lifting mechanism pushes up the semiconductor chip 2 attached to the front surface side of the dicing tape 16 by causing a needle (not shown) to project from the back surface side of the dicing tape 16 and separates the semiconductor chip 2 from the dicing tape 16. .

The adhesive layer (not shown) of the dicing tape 16 is often made of an ultraviolet curable adhesive. This UV-curable adhesive has the property of being cured and weakening its adhesive force when it is irradiated with UV rays. Therefore, by irradiating the dicing tape 16 with UV rays before picking up the semiconductor chip 2, The adhesive force is weakened and the peeling of the semiconductor chip 2 from the dicing tape 16 is promoted.

The transfer of the semiconductor chips 2 to the chip tray 5 is performed by a robot hand. FIG. 8 is an explanatory view showing the outline of the mechanism for transferring the semiconductor chips to the chip tray 5.

The transfer head 7 is provided with a suction collet 7a on the tip side and moves vertically and horizontally by a mechanism (not shown). And the transfer head 7
8 sucks the semiconductor chip 2 pushed up from the dicing tape 16 by the needle (not shown) by the suction collet 7a and raises it by the mechanism (not shown).
As shown in (a), the semiconductor chip 2 is picked up from the dicing tape 16.

The semiconductor chips 2 are arranged on the chip tray 5 with the surface thereof facing downward. On the contrary,
The semiconductor chip 2 attached to the dicing tape 16 is in a state in which the surface thereof faces upward. Therefore, when the semiconductor chip 2 picked up by the transfer head 7 is placed on the chip tray 5 as it is, the surface thereof faces upward. Therefore, the reversing arm 6 is used to reverse the front and back of the semiconductor chip 2.

The reversing arm 6 has a suction collet 6a at one end, and is rotated by 180 degrees about a shaft 6b provided at the other end as a fulcrum. The semiconductor chip 2 held by the transfer head 7 is held by the suction collet 6a of the reversing arm 6, and
The holding of the transfer head 7 by the suction collet 7a is released, and the reversing arm 6 is rotated 180 degrees about the shaft 6b as a fulcrum, so that the semiconductor chip held by the suction collet 6a as shown in FIG. 8B. 2 are arranged on the chip tray 5 with the back surface thereof facing downward. When the semiconductor chips 2 are arranged on the chip tray 5 with the back surface thereof facing downward, the reversing arm 6 is unnecessary.

When semiconductor chips 2 having different sizes are mixed when the pseudo wafer 3 is created, a plurality of chip trays 5 are prepared and the storage destination chip trays 5 are switched according to the type of the semiconductor chips 2. .

As described above, the back surface of the semiconductor chip 2 stored in the chip tray 5 is ground, and the chip tray 5 is removed.
A series of operations until returning to can be performed using the existing device. Here, for example, when the pseudo wafer 3 is transferred from the back grinder device shown in FIG. 5 to the tape mounter device shown in FIG. 6, a carrier that can store a plurality of pseudo wafers 3 is used. Then, in consideration of the warpage of the pseudo wafer 3, the following storage carrier is used. That is, FIG. 9 is a perspective view of a pseudo wafer storage carrier used in the semiconductor chip back surface grinding method of the present embodiment.

The accommodating carrier 24 accommodates a plurality of pseudo wafers 3 in a stacked state with a space provided therebetween. The storage carrier 24 has wall surfaces 25 that cover the three side surfaces of the pseudo wafers 3 to be stacked and one side surface is open. And serves as a loading / unloading port 26 for the pseudo wafer 3.

The wall surface 25 is provided with a groove portion 25a for supporting a plurality of pseudo wafers 3 with a space therebetween, whereby the pseudo wafers 3 are supported around the periphery thereof. The assist plate 27 is provided to hold the vicinity of the center of the bottom surface of the pseudo wafer 3, and prevents the pseudo wafer 3 supported around the periphery from warping. By using such a storage carrier 24, it becomes possible to transfer the pseudo wafer 3 between the devices, and the back surface grinding of the semiconductor chip can be automatically performed using the existing device.

[0065]

As described above, according to the present invention, a plurality of semiconductor chips are attached to a tape-shaped member having a wafer shape with its back surface exposed to form a pseudo wafer. The back surface of each of the semiconductor chips arranged in line is ground.

According to this, since a plurality of semiconductor chips can be handled as an integrated body equivalent to a wafer, the back surface of each semiconductor chip can be ground in the same manner as a wafer, and it is premised that the wafer is handled. Backside grinding of semiconductor chips can be performed automatically using existing equipment. Therefore, the back surface of the semiconductor chip can be ground in a short time without increasing the labor of the operator.

[Brief description of drawings]

FIG. 1 is a flowchart showing a method of grinding a back surface of a semiconductor chip according to the present embodiment.

FIG. 2 is an explanatory diagram showing a process in each step performed in the back surface grinding system for a semiconductor chip according to the present embodiment.

FIG. 3 is an explanatory diagram showing an outline of a mechanism for transferring a semiconductor chip to a tape mounting tray.

FIG. 4 is a perspective view showing a supply state of a protective adhesive tape.

FIG. 5 is a perspective view showing a schematic configuration of an existing back grinder device.

FIG. 6 is a perspective view showing a schematic configuration of an existing tape mounter device.

FIG. 7 is a perspective view showing a schematic configuration of an existing protective tape peeling device.

FIG. 8 is an explanatory diagram showing an outline of a mechanism for transferring a semiconductor chip to a chip tray.

FIG. 9 is a perspective view of a pseudo wafer storage carrier used in the semiconductor chip back surface grinding method of the present embodiment.

FIG. 10 is an explanatory view showing an example of a wafer backside grinding step.

FIG. 11 is an explanatory diagram showing an example of a wafer backside grinding step.

FIG. 12 is an explanatory view showing an example of a wafer backside grinding step.

FIG. 13 is an explanatory diagram showing a conventional backside grinding method for a semiconductor chip.

[Explanation of symbols]

1 ... Protective adhesive tape, 2 ... Semiconductor chip, 3 ...
..Pseudo wafers, 4 ... Tape mounting trays,
5 ... Chip tray, 6 ... Inverting arm, 7 ...
Transfer head, 8 ... pressing roller, 10 ...
Loader unloader, 11 ... Pad, 12 ...
Back grinding section, 13 ... Robot hand, 14 ... Frame, 15 ... Loader / unloader, 16 ...
Dicing tape, 17 ... Wafer mount part, 1
8 ... Robot hand, 19 ... Loader unloader, 20 ... Peeling tape, 21 ... Protective adhesive tape peeling section, 22 ... Robot hand, 24 ... Storage carrier, 25 ... Wall, 26 ... entrance / exit,
27 ... Assist plate

Claims (6)

[Claims] 1. A pseudo wafer is prepared by sticking a plurality of semiconductor chips to a tape-shaped member having a wafer shape with the back surface thereof exposed, and grinding the back surface of each of the semiconductor chips arranged on the pseudo wafer. A method for grinding a back surface of a semiconductor chip, comprising: 2. The pseudo wafer on which backside grinding of each semiconductor chip has been completed is attached to a ring-shaped frame by a dicing tape, and the tape-shaped member is peeled from the pseudo wafer supported by the dicing tape on the frame. After that, the individual semiconductor chips are picked up from the dicing tape, and the back surface grinding method of the semiconductor chip according to claim 1. 3. The method of grinding a back surface of a semiconductor chip according to claim 1, wherein the tape-shaped member is a protective adhesive tape which is attached to a front surface of the wafer when the back surface of the wafer is ground. 4. A pseudo wafer forming device for forming a pseudo wafer by attaching a plurality of semiconductor chips to a tape-shaped member having a wafer shape with the back surface thereof exposed, and a pseudo wafer forming device. And a grinding device for grinding the back surface of each of the semiconductor chips on the pseudo wafer. 5. A tape mounter device for attaching a dicing tape to the surface of the pseudo wafer on which the semiconductor chip is attached and attaching the pseudo wafer to a ring-shaped frame; and the tape mounter attached to the semiconductor chip. The back surface grinding system for a semiconductor chip according to claim 4, further comprising: a peeling device for peeling the tape-shaped member, and a pickup device for picking up the semiconductor chip from the dicing tape. 6. The back surface grinding system for a semiconductor chip according to claim 4, wherein the grinding apparatus is an apparatus for grinding a back surface of a wafer.