JP2003105107A - Polyamide film - Google Patents
Polyamide filmInfo
- Publication number
- JP2003105107A JP2003105107A JP2001302204A JP2001302204A JP2003105107A JP 2003105107 A JP2003105107 A JP 2003105107A JP 2001302204 A JP2001302204 A JP 2001302204A JP 2001302204 A JP2001302204 A JP 2001302204A JP 2003105107 A JP2003105107 A JP 2003105107A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide film
- film
- polyamide
- weight
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Wrappers (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、耐熱水性の優れたポリ
アミドフィルムに関する。更に詳しくは、高温レトルト
処理を受けても機械的強度が低下しないポリアミドフィ
ルムに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide film having excellent hot water resistance. More specifically, the present invention relates to a polyamide film whose mechanical strength does not decrease even when subjected to a high temperature retort treatment.
【0002】[0002]
【従来の技術】ポリアミドフィルムは、食品等の包装に
用いられる他のフィルム、例えばポリプロピレンフィル
ムやポリエチレンテレフタレートフィルム等に比べて、
a)引張り強度が強く、かつ柔軟性に富む、b)突刺し
ピンホール強度が強い、c)屈曲疲労耐性に優れる、
d)耐摩耗特性に優れる、e)低温から高温まで使用可
能な温度範囲が広い等々、多くの優れた特徴を有する。
これらの特徴を生かして、ポリアミドフィルムは、食品
包装の分野を中心に広く利用されてきた。特に、機械的
強度に優れる点および耐熱性に優れる点はレトルト食品
の包装用途に適し、透明レトルトパウチ等の素材として
欠かせない存在である。2. Description of the Related Art Polyamide film is superior to other films used for packaging foods, such as polypropylene film and polyethylene terephthalate film.
a) High tensile strength and high flexibility, b) Strong pinhole strength, c) Excellent flex fatigue resistance,
d) It has excellent wear resistance properties, e) It has many excellent features such as a wide temperature range that can be used from low temperatures to high temperatures.
Utilizing these characteristics, the polyamide film has been widely used mainly in the field of food packaging. In particular, its excellent mechanical strength and excellent heat resistance are suitable for packaging retort pouch foods and are indispensable as materials for transparent retort pouches and the like.
【0003】しかしながら、その耐熱水性にも限界があ
り、従来のフィルムにおいては約135℃の熱水もしくは
水蒸気に晒されると、引張り強度等の機械的強度が低下
したり、白化したりするというフィルム劣化の問題があ
った。従って、このような条件下で使用される場合のポ
リアミドフィルムの耐熱限界は現在上市されている耐熱
水性フィルムでも精々130℃程度であり、135℃を越える
高温度条件では使用できないという問題があった。この
ため、従来は、表面層となっているポリアミドフィルム
にポリエチレンテレフタレートよりなる保護層を設け、
例えばポリエチレンテレフタレート層/ポリアミド層/
ポリプロピレン層とした層構成の積層フィルムが提案さ
れている。かかるフィルムの使用は、保護層の効果によ
って耐熱水性を幾分かは改善できるものの本質的な解決
とはならず、また他方では製造コストが大幅に嵩んでし
まうという問題が新たに発生する。このような背景か
ら、高温でのレトルト処理に耐えることのできる食品包
装用のポリアミドフィルムの開発が強く望まれていた。However, its hot water resistance is also limited, and when exposed to hot water or steam of about 135 ° C. in the conventional film, the mechanical strength such as tensile strength is lowered or the film is whitened. There was a problem of deterioration. Therefore, the heat resistance limit of the polyamide film when used under such conditions is at most about 130 ° C. even with the heat resistant water film currently on the market, and there is a problem that it cannot be used under high temperature conditions exceeding 135 ° C. . For this reason, conventionally, a protective layer made of polyethylene terephthalate is provided on a polyamide film which is a surface layer,
For example polyethylene terephthalate layer / polyamide layer /
A laminated film having a layer structure of a polypropylene layer has been proposed. Although the use of such a film can improve the hot water resistance to some extent by the effect of the protective layer, it is not an essential solution, and on the other hand, a new problem arises that the manufacturing cost is significantly increased. From such a background, development of a polyamide film for food packaging that can withstand retort treatment at high temperature has been strongly desired.
【0004】[0004]
【発明が解決しようとする課題】本発明は、上記の問題
点を解決した、135℃を越える条件でレトルト処理を受
けても強度が低下することなく、レトルト食品の包装に
適するポリアミドフィルムの提供を目的とする。DISCLOSURE OF THE INVENTION The present invention solves the above problems and provides a polyamide film suitable for packaging of retort foods, which does not decrease in strength even when subjected to retort treatment at a temperature exceeding 135 ° C. With the goal.
【0005】[0005]
【課題を解決するための手段】しかして本発明の要旨と
するところは、分子鎖の繰り返し最小単位あたりのメチ
レン鎖数6個以上且つ融点160℃以上のポリアミド系
樹脂を主成分とし、140℃の熱水処理で破断強度保持
率が70%以上であることを特徴とするポリアミドフィ
ルムに存する。The gist of the present invention is, however, that the main component is a polyamide resin having 6 or more methylene chains per repeating minimum unit of molecular chains and a melting point of 160 ° C. or more, and 140 ° C. The polyamide film has a breaking strength retention rate of 70% or more in the hot water treatment.
【0006】以下、本発明を詳細に説明する。本発明に
おいて分子鎖の繰り返し最小単位あたりのメチレン鎖数
6個以上且つ融点160℃以上のポリアミド系樹脂と
は、たとえば、NY66、NY11,NY12、NY6
10,NY612、等のポリアミド系樹脂をいう。また
は、ポリアミド樹脂と共重合可能な他の化合物との共重
合体であって分子鎖の繰り返し最小単位あたりのメチレ
ン鎖数が加重平均で6個以上且つ融点160℃以上のポ
リアミド系樹脂をいう。The present invention will be described in detail below. In the present invention, the polyamide resin having 6 or more methylene chains per repeating minimum unit of molecular chain and having a melting point of 160 ° C. or higher means, for example, NY66, NY11, NY12, NY6.
A polyamide resin such as 10, NY612. Alternatively, it refers to a polyamide resin that is a copolymer of a polyamide resin and another compound that is copolymerizable and has a weighted average of 6 or more methylene chains per repeating minimum unit of molecular chain and a melting point of 160 ° C. or higher.
【0007】共重合可能な他の化合物とは、脂肪族系ポ
リアミド、芳香族系ポリアミド、テレフタル酸を共重合
したポリアミド、等を含むが、これに限るものではな
い。ポリアミドとしては、ポリヘキサメチレンアジパミ
ドや脂肪族または芳香族とジアミン類と、脂肪族または
芳香族のジカルボン酸とよりなるナイロン塩があげられ
る。上記ジアミン類の代表例としては、エチレンジアミ
ン、テトラメチレンジアミン、ペンタメチレンジアミ
ン、ヘキサメチレンジアミン、オクタメレンジアミン、
ノナンジアミン、デカメチレンジアミン、メタキシリレ
ンジアミン、パラキシリレンジアミン等があげられ、ま
た上記ジカルボン酸の代表例としては、アジピン酸、セ
バシン酸、コルク酸、グルタール酸、アゼライン酸、β
−メチルアジピン酸、テレフタル酸、イソフタル酸、デ
カメチレンカルボン酸、ドデカメチレンカルボン酸、ピ
メリン酸等があげられる。共重合体は分子鎖の繰り返し
最小単位あたりのメチレン鎖数が加重平均で6個以上且
つ融点が160℃以上であれば、2元共重合体でも3元
共重合体でもそれ以上でも良い。Other copolymerizable compounds include, but are not limited to, aliphatic polyamides, aromatic polyamides, and polyamides obtained by copolymerizing terephthalic acid. Examples of polyamides include polyhexamethylene adipamide, nylon salts composed of aliphatic or aromatic diamines, and aliphatic or aromatic dicarboxylic acids. Representative examples of the diamines include ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, octamerenediamine,
Nonanediamine, decamethylenediamine, meta-xylylenediamine, para-xylylenediamine and the like, and typical examples of the dicarboxylic acid include adipic acid, sebacic acid, corkic acid, glutaric acid, azelaic acid, β
-Methyl adipic acid, terephthalic acid, isophthalic acid, decamethylenecarboxylic acid, dodecamethylenecarboxylic acid, pimelic acid and the like can be mentioned. The copolymer may be a binary copolymer, a ternary copolymer or more as long as the weighted average number of methylene chains per repeating unit of the molecular chain is 6 or more and the melting point is 160 ° C. or more.
【0008】分子鎖の繰り返し最小単位あたりのメチレ
ン鎖数6個以上且つ融点160℃以上のポリアミド系樹
脂はこれを主成分とすれば、相溶性のある重合体と混合
することができる。主成分とは分子鎖の繰り返し最小単
位あたりのメチレン鎖数6個以上且つ融点160℃以上
のポリアミド樹脂がフィルム中の50重量部以上含有し
ていることが好ましい。相溶性があり、混合し得る重合
体としては、脂肪族ポリアミド、芳香族ポリアミド、非
結晶ポリアミド、上記共重合ポリアミド等をあげること
ができる。A polyamide resin having 6 or more methylene chains per repeating minimum unit of molecular chain and a melting point of 160 ° C. or more can be mixed with a compatible polymer by using this as a main component. The main component preferably contains a polyamide resin having 6 or more methylene chains per repeating minimum unit of molecular chain and a melting point of 160 ° C. or more in an amount of 50 parts by weight or more in the film. Examples of compatible and miscible polymers include aliphatic polyamides, aromatic polyamides, amorphous polyamides, and the above-mentioned copolymerized polyamides.
【0009】これらのポリアミド系樹脂には、改質のた
め、得られるフィルムの性質を損なわない範囲内で、前
記の化合物郡とは別に、滑剤、帯電防止剤、耐ピンホー
ル改良剤、ブロッキング防止剤、染料、顔料、無機微粒
子等の各種添加剤が配合されていてもよい。Due to the modification, these polyamide resins are, apart from the above-mentioned compound groups, a lubricant, an antistatic agent, a pinhole resistance improving agent, and an antiblocking agent as long as they do not impair the properties of the obtained film. Various additives such as agents, dyes, pigments and inorganic fine particles may be blended.
【0010】本発明に係るポリアミドフィルムは140
℃の熱水処理で破断強度保持率が70%以上であること
を特徴とするが、好ましくは80%以上、さらに好まし
くは90%以上である。70%以下では、シーラントフ
ィルム等との層間剥離(デラミ)の発生、破袋が発生し
やすく使用上問題が起きやすい。The polyamide film according to the present invention is 140
The breaking strength retention rate by hot water treatment at 70 ° C. is 70% or more, preferably 80% or more, more preferably 90% or more. If it is 70% or less, delamination from the sealant film or the like and bag breakage are likely to occur and problems in use tend to occur.
【0011】本発明に係るポリアミドフィルムは、特定
の酸化防止剤を添加する事が望ましく、ヒンダードフェ
ノール系、リン系(ホスフォナイト系)、ラクトン系、
ベンゾトリアゾール系等が上げられる。好ましくはヒン
ダードフェノール系酸化防止剤を含有するのが良い。ヒ
ンダードフェノール系酸化防止剤は通常公知のポリアミ
ド樹脂に好適に使用できるものである。具体的にはN,N'
−ヘキサメチレンビス(3,5−ジ−t−ブチル−4−ヒ
ドロキシーヒドロシンナマミド)、3,5−ジ−t−ブチ
ル−4−ヒドロキシーベンジルフォスフォネート−ジエ
チルエステル、1,3,5−トリメチル−2,4,6−トリス(3,
5−ジ−t−ブチル−4−ヒドロキシベンジル)ベンゼ
ン、テトラキス(2,4―ジーt―ブチルフェニル)
4,4‘―ビフェニリレンージーフォスフォナイト、お
よびトリエチレングリコールービスー3―(3―t―ブ
チルー4―ヒドロキシー5―メチルーフェニル)プロピ
オネート等が挙げられる。特に食品包装用途に使用する
場合には、N,N'−ヘキサメチレンビス(3,5−ジ−t−
ブチル−4−ヒドロキシーヒドロシンナマミド)、3,5
−ジ−t−ブチル−4−ヒドロキシーベンジルフォスフ
ォネート−ジエチルエステル、1,3,5−トリメチル−2,
4,6−トリス(3,5−ジ−t−ブチル−4−ヒドロキシベ
ンジル)ベンゼンからなる群より選ばれる少なくとも1
種の化合物が好ましい。It is desirable to add a specific antioxidant to the polyamide film according to the present invention, such as hindered phenol type, phosphorus type (phosphonite type), lactone type,
Examples include benzotriazole type. It is preferable to contain a hindered phenolic antioxidant. The hindered phenol-based antioxidant can be suitably used for generally known polyamide resins. Specifically, N, N '
-Hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), 3,5-di-t-butyl-4-hydroxy-benzylphosphonate-diethyl ester, 1,3 , 5-Trimethyl-2,4,6-tris (3,
5-di-t-butyl-4-hydroxybenzyl) benzene, tetrakis (2,4-di-t-butylphenyl)
4,4'-biphenylylene diphosphonate, triethylene glycol bis-3- (3-t-butyl-4-hydroxy-5-methyl-phenyl) propionate and the like can be mentioned. Especially when used for food packaging, N, N'-hexamethylenebis (3,5-di-t-
Butyl-4-hydroxy-hydrocinnamamide), 3,5
-Di-t-butyl-4-hydroxy-benzylphosphonate-diethyl ester, 1,3,5-trimethyl-2,
At least one selected from the group consisting of 4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene
Certain compounds are preferred.
【0012】ヒンダードフェノール系酸化防止剤の含有
量はポリアミド系樹脂100重量部に対して0.01重
量部以上であることが好ましく、さらに好ましくは0.
03重量部以上である。又、ヒンダードフェノール系酸
化防止剤の含有量は0.8重量部以下である事が好まし
く、さらに好ましくは0.5重量部以下である。The content of the hindered phenolic antioxidant is preferably 0.01 part by weight or more, more preferably 0.1 part by weight or more, based on 100 parts by weight of the polyamide resin.
It is at least 03 parts by weight. The content of the hindered phenolic antioxidant is preferably 0.8 part by weight or less, more preferably 0.5 part by weight or less.
【0013】ポリアミド系樹脂に含有せしめる酸化防止
剤は、単独であっても、複数を組み合わせたものであっ
てもよく、ポリアミド系樹脂に対する割合が上記の範囲
内であれば、特に制限はない。ポリアミド系樹脂100重
量部に対する酸化防止剤の割合が、0.01重量部より少
ないとレトルト処理後の引張り破断強度等のフィルム強
度が低下して、目的とする延伸フィルムとはならない。
また、0.5重量部より多いとフィルムの表面に酸化防
止剤がブリードアウトし易く、この面の印刷適性や接着
性が損なわれる恐れがあり、0.8重量部より多いとこ
の傾向が一層顕著になり実用的なものとはならない。特
に接着性が損なわれると、ポリアミドフィルムとこれに
積層されるシーラントフィルム(例えば、ポリプロピレ
ンフィルム)との接着面での層間剥離(デラミともい
う)が発生するので、レトルト食品の包装用途には致命
的となる。The antioxidant contained in the polyamide resin may be a single antioxidant or a combination of plural antioxidants, and there is no particular limitation as long as the ratio to the polyamide resin is within the above range. If the ratio of the antioxidant to 100 parts by weight of the polyamide-based resin is less than 0.01 parts by weight, the film strength such as tensile rupture strength after retort treatment will decrease, and the intended stretched film will not be obtained.
Further, if it is more than 0.5 parts by weight, the antioxidant is likely to bleed out on the surface of the film, which may impair the printability and adhesiveness of this surface, and if it is more than 0.8 parts by weight, this tendency becomes more prominent. It becomes noticeable and not practical. In particular, if the adhesiveness is impaired, delamination (also known as delamination) occurs at the adhesive surface between the polyamide film and the sealant film (for example, polypropylene film) laminated on it, which is fatal for packaging of retort foods. To be the target.
【0014】本発明に係るポリアミド系フィルムは、上
記の酸化防止剤を含有するポリアミド系樹脂組成物をフ
ィルム原料として用い、従来公知の各種の方法によって
製造することができる。例えば、逐次二軸延伸法による
場合には、上記フィルム原料を押出機で加熱溶融し、T
−ダイからフィルム状の押出し、これを静電ピニング等
の公知のキャスティング法を用いてキャスティングロー
ルの表面にて急冷して、実質的に無定形で無配向のポリ
アミドフィルムが得られる。また、この未延伸フィル
ム、更にロール式縦延伸機により2〜4倍延伸したフィ
ルム、次いでテンター式横延伸機により3〜5倍延伸
し、所望により熱処理した後、このフィルムを徐冷しつ
つ、連続的に巻き取ることによって2軸延伸ポリアミド
フィルムを製造することができる。The polyamide film according to the present invention can be produced by various conventionally known methods using the polyamide resin composition containing the above-mentioned antioxidant as a film raw material. For example, in the case of the sequential biaxial stretching method, the film raw material is heated and melted by an extruder,
-Extrusion in the form of a film from a die and quenching on the surface of a casting roll using a known casting method such as electrostatic pinning to obtain a substantially amorphous and non-oriented polyamide film. Further, this unstretched film, a film further stretched 2 to 4 times by a roll type longitudinal stretching machine, then stretched 3 to 5 times by a tenter type transverse stretching machine, and after heat treatment as desired, while slowly cooling this film, A biaxially stretched polyamide film can be produced by continuously winding.
【0015】なお、上記の酸化防止剤を含有するポリア
ミド系樹脂組成物(フィルム原料)の調製は、任意の方
法によって行うことができ、例えば、ポリアミド系樹脂
の製造系(重合系)に酸化防止剤を添加して一挙に酸化
防止剤を含有するポリアミド系樹脂を製造する方法、酸
化防止剤を含有しないポリアミド系樹脂に酸化防止剤を
添加して、ヘンシェルミキサーやタンブラー等の粉体混
合機で均一組成物とする方法等を採用することができ
る。The polyamide resin composition (film raw material) containing the above-mentioned antioxidant can be prepared by any method. For example, in the polyamide resin production system (polymerization system) A method of producing a polyamide-based resin containing an antioxidant by adding an agent, adding an antioxidant to a polyamide-based resin that does not contain an antioxidant, and using a powder mixer such as a Henschel mixer or a tumbler. A method of providing a uniform composition can be adopted.
【0016】本発明に係るポリアミド系フィルムは、上
記例示のテンター式逐次二軸延伸法によるほか、テンタ
ー式同時二軸延伸法、チューブラー法等の他の方法でも
製造できる。このようにして製造したポリアミドフィル
ムには、印刷インクの乗りや他のフィルム(例えば、シ
ーラントフィルム)との接着性を向上させるため、コロ
ナ処理等の表面処理を施すこともできる。The polyamide film according to the present invention can be produced not only by the tenter type sequential biaxial stretching method exemplified above, but also by other methods such as a tenter type simultaneous biaxial stretching method and a tubular method. The polyamide film produced in this manner may be subjected to a surface treatment such as corona treatment in order to improve printing ink coverage and adhesion to other films (for example, sealant film).
【0017】本発明に係るポリアミドフィルムは高温暴
露または高温保管用途としてレトルト食品包装用途、例
えば味噌、漬け物、惣菜、ベビーフード、佃煮、こんに
ゃく、ちくわ、蒲鉾、水産加工品、ミートボール、ハン
バーグ、ジンギスカン、ハム、ソーセージ、その他の畜
産加工品、練り歯磨き、ペットフード、農薬、肥料、輸
液パックさらには半導体包装、精密材料包装など医療、
電子、化学、機械などの産業材料包装用途使用すること
ができる。その形態は、袋、フタ材、カップ、チュー
ブ、スタンディングパックなど様々である。The polyamide film according to the present invention is used for retort food packaging for high temperature exposure or high temperature storage, such as miso, pickles, prepared foods, baby foods, tsukudani, konjac, chikuwa, kamaboko, seafood products, meatballs, hamburg, genghis khan. , Ham, sausage, other livestock products, toothpaste, pet food, pesticides, fertilizers, infusion packs, as well as semiconductor packaging, precision material packaging, medical treatment, etc.
It can be used for packaging industrial materials such as electronic, chemical and mechanical. There are various forms such as a bag, a lid material, a cup, a tube, and a standing pack.
【0018】[0018]
【発明の効果】本発明は、次のように特別に顕著な効果
を奏し、その産業上の利用価値は極めて大である。
(1)本発明のポリアミドフィルムは、耐熱水性が極め
て優れているので、高温のレトルト処理を受けても強度
が低下せずレトルト食品包装用途に極めて好適である。
(2)本発明のポリアミドフィルムは、表面特性が優れ
ているので、シーラントフィルム等の接着性が良好で高
温のレトルト処理を受けてもデラミ(層間剥離)現象を
惹起することがない。
(3)本発明に係るポリアミドフィルムは、特別の保護
フィルムを積層したり、保護層を塗布して設けたりする
必要がないので、製法が簡単で安価に製造できる。INDUSTRIAL APPLICABILITY The present invention has particularly remarkable effects as follows, and its industrial utility value is extremely large. (1) Since the polyamide film of the present invention is extremely excellent in hot water resistance, it does not decrease in strength even when subjected to a high temperature retort treatment, and is very suitable for retort food packaging applications. (2) Since the polyamide film of the present invention has excellent surface characteristics, it has good adhesiveness to a sealant film or the like and does not cause delamination (delamination) even when subjected to high temperature retort treatment. (3) Since the polyamide film according to the present invention does not need to be laminated with a special protective film or coated with a protective layer, the polyamide film can be produced easily and at low cost.
【0019】[0019]
【実施例】以下、本発明を実施例および比較例により更
に詳しく説明するが、これらの例に限定されないのは勿
論である。なお、以下の例において、破断強度保持率、
レトルト処理後のデラミの有無は、それぞれ次の方法に
よって実施し、測定したが、使用する装置はこれらと同
等なものであればこの限りではない。レトルト処理の方
法ポリアミドフィルムより、一辺の長さ200mmの正方形
状の試料用フィルムを切り出し、この試料用フィルムの
全周を、一辺の長さ100mmの正方形状の開口部を有し全
周にシリコンゴム製のパッキン材を備えた型枠で固定し
た。この型枠で固定された試料用フィルムを、次の条件
でレトルト処理を行う。
1)処理装置 レトルト釜(日阪製作所製)
2)釜内の温度および圧力
130℃の場合:
全 圧 2.7kg/cm2(ゲージ圧)
空気分圧 1.0kg/cm2
135℃の場合:
全 圧 3.2kg/cm2(ゲージ圧)
空気分圧 1.0kg/cm2
140℃の場合:
全 圧 3.7kg/cm2(ゲージ圧)
空気分圧 1.0kg/cm2
145℃の場合:
全 圧 4.2kg/cm2(ゲージ圧)
空気分圧 1.0kg/cm2
3)処理時間 上記いずれかの条件下で、30分間
4)試料フィルムの数 5個/釜EXAMPLES The present invention will be described in more detail below with reference to examples and comparative examples, but it goes without saying that the present invention is not limited to these examples. In the following examples, the breaking strength retention rate,
The presence or absence of delamination after the retort treatment was carried out and measured by the following methods, respectively, but it is not limited to this as long as the apparatus used is equivalent to these. Retort processing method From a polyamide film, a square sample film with a side length of 200 mm is cut out, and the entire circumference of this sample film has a square-shaped opening with a side length of 100 mm and silicon It was fixed with a mold provided with rubber packing material. The sample film fixed by this mold is subjected to retort treatment under the following conditions. 1) Processing equipment Retort kettle (manufactured by HISAKA) 2) Temperature and pressure inside the kettle: 130 ° C: Total pressure 2.7kg / cm2 (gauge pressure) Air partial pressure 1.0kg / cm2: 135 ° C: Total pressure 3.2 kg / cm2 (gauge pressure) Air partial pressure 1.0kg / cm2 140 ℃: Total pressure 3.7kg / cm2 (gauge pressure) Air partial pressure 1.0kg / cm2 145 ℃: Total pressure 4.2kg / cm2 (gauge pressure) ) Air partial pressure 1.0kg / cm2 3) Processing time Under any of the above conditions, 30 minutes 4) Number of sample films 5 pieces / pot
【0020】フィルム破断強度の測定方法
ポリアミドフィルム(レトルト処理前)、若しくは上記
の条件で処理したポリアミドフィルム(レトルト処理
後)について、23℃、相対湿度50%の条件下で2日間の
コンディショニングを行った後、これらのフィルムよ
り、10mm幅×50mm長さの長方形の測定用サンプルを切り
取り、このサンプルについて、上記の温度・湿度条件下
で、(株)島津製作所製のオートグラフDS−100型を用
い、50mm/minの速度で横延伸方向への引張り試験を行
い、フィルムが破断した時点での引張り強度を、そのフ
ィルムの破断強度(kg)とした。なお、この測定は、そ
れぞれ一つの例当たり5サンプル(5測定)について行
い、これらの平均値で評価する。また、同一条件で製造
したポリアミドフィルムに関する破断強度において、レ
トルト処理後の破断強度は、次の式で定義する「破断強
度保持率」で評価する。
破断強度保持率=(Ft/Fto)×100(%)
但し、Ftoは、レトルト処理前の破断強度(kg)
Ftはレトルト処理後の破断強度(kg)を、それぞれ意味
する。Method for measuring film breaking strength A polyamide film (before retort treatment) or a polyamide film treated under the above conditions (after retort treatment) was conditioned for 2 days at 23 ° C. and 50% relative humidity. After that, a rectangular measurement sample with a width of 10 mm and a length of 50 mm is cut out from these films, and this sample is subjected to the above temperature and humidity conditions using Autograph DS-100 manufactured by Shimadzu Corporation. A tensile test in the transverse stretching direction was performed at a speed of 50 mm / min, and the tensile strength at the time when the film broke was defined as the breaking strength (kg) of the film. In addition, this measurement is performed for 5 samples (5 measurements) for each example, and the average value of these is evaluated. In the breaking strength of the polyamide film manufactured under the same conditions, the breaking strength after retort treatment is evaluated by "breaking strength retention rate" defined by the following formula. Breaking strength retention rate = (Ft / Fto) × 100 (%) where Fto means breaking strength before retort treatment (kg) Ft means breaking strength after retort treatment (kg), respectively.
【0021】レトルト処理後のデラミ
下記の各例に記載の方法によって得られたフィルムに、
ウレタン系二液型接着剤(東洋モートン(株)製、AD90
0/RT5)を用いて、無延伸ポリプロピレンフィルム(東
レ合成(株)製、ZK−93,厚み70μm)をドライラミネ
ートして、積層フィルムを調製した。次に、この積層フ
ィルムを、40℃×3日間のエージングの後、上記の「レ
トルト処理の方法」に従ってレトルト処理を行い、レト
ルト処理後のデラミの有無を目視観察によって判定し
た。Delamination after retort treatment The film obtained by the method described in each of the following examples
Two-component urethane adhesive (AD90, manufactured by Toyo Morton Co., Ltd.)
0 / RT5) was used to dry laminate an unstretched polypropylene film (ZK-93, Toray Gosei Co., Ltd., thickness 70 μm) to prepare a laminated film. Next, this laminated film was subjected to aging at 40 ° C. for 3 days, then subjected to retort treatment according to the above-mentioned “method of retort treatment”, and the presence or absence of delamination after the retort treatment was visually determined.
【0022】実施例1
ポリヘキサメチレンアジパミド(旭化成工業(株)製)
100重量部に、酸化防止剤として、N,N'−ヘキサメチレ
ンビス(3,5−ジ−t−ブチル−4−ヒドロキシ−ヒド
ロシンナマミド)(チバガイギー社製、イルガノックス
1098)を0.02重量部添加しタンブラーでブレンドした混
合組成物を、65mmφの押出機にて260℃の条件で加熱溶
融し、T−ダイより連続的にシート状に押出し、表面温
度が25℃の冷却回転ドラムの表面に静電ピニング法にて
密着急冷し、厚み140μmの実質的無定形で無配向のシ
ートを得た。このシートをロール式縦延伸機にて、縦方
向に3倍延伸し、この縦延伸フィルムを直ちにテンター
式横延伸機に導き、横方向に3倍延伸し、これに続き熱
固定処理を施して、厚み15μmの二軸延伸ポリアミドフ
ィルムを得た。得られた二軸延伸フィルムについて、レ
トルト処理前およびレトルト処理後のそれぞれの破断強
度を前記方法によって測定した。また、得られた二軸延
伸フィルムより調製した積層フィルムについて、前記方
法に従ってレトルト処理後のデラミの有無を調べた。そ
の結果を、ポリヘキサメチレンアジパミドに含有せしめ
た酸化防止剤の名称、量とともに、第1表に示す。Example 1 Polyhexamethylene adipamide (manufactured by Asahi Kasei Co., Ltd.)
100 parts by weight of N, N'-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamamide) as an antioxidant (Irganox manufactured by Ciba-Geigy)
1098) was added to 0.02 parts by weight and blended by a tumbler, and the mixture composition was heated and melted at a temperature of 260 ° C. with a 65 mmφ extruder, and continuously extruded into a sheet form from a T-die. The surface of the cooling rotary drum was closely cooled by electrostatic pinning to obtain a substantially amorphous and non-oriented sheet having a thickness of 140 μm. This sheet was stretched 3 times in the longitudinal direction by a roll type longitudinal stretching machine, and this longitudinally stretched film was immediately introduced into a tenter type transverse stretching machine and stretched 3 times in the transverse direction, followed by heat setting treatment. A biaxially stretched polyamide film having a thickness of 15 μm was obtained. The breaking strength of each of the obtained biaxially stretched films was measured by the above method before and after the retort treatment. Further, the laminated film prepared from the obtained biaxially stretched film was examined for the presence of delamination after retort treatment according to the method described above. The results are shown in Table 1 together with the names and amounts of the antioxidants contained in polyhexamethylene adipamide.
【0023】実施例2〜4
実施例1に記載の例において、ポリヘキサメチレンアジ
パミド 100重量部当たりに添加した酸化防止剤とそ
の量とを、第1表に記載の通りに変更したほかは同例に
おけると同様にして厚み15μmの二軸延伸ポリアミドフ
ィルムを得、得られた二軸延伸フィルムについて、同例
におけると同様にして破断強度を測定し、デラミの有無
を調べた。Examples 2 to 4 In the example described in Example 1, the antioxidant and the amount thereof added per 100 parts by weight of polyhexamethylene adipamide were changed as shown in Table 1. A biaxially stretched polyamide film having a thickness of 15 μm was obtained in the same manner as in the same example, and the breaking strength of the obtained biaxially stretched film was measured in the same manner as in the same example, and the presence or absence of delamination was examined.
【0024】実施例5,6
実施例1に記載の例において、ポリヘキサメチレンアジ
パミド 100重量部をポリヘキサメチレンアジパミド
51〜80重量部と三菱エンシ゛ニアリンク゛フ゜ラスチック(株)製ノハ゛
ミット゛1020(NY6) 20〜49重量部に、及び添
加した酸化防止剤とその量とを、第1表に記載の通りに
変更したほかは同例におけると同様にして厚み15μmの
二軸延伸ポリアミドフィルムを得、得られた二軸延伸フ
ィルムについて、同例におけると同様にして破断強度を
測定し、デラミの有無を調べた。Examples 5 and 6 In the example described in Example 1, 100 parts by weight of polyhexamethylene adipamide was added to polyhexamethylene adipamide.
51 to 80 parts by weight and 20 to 49 parts by weight of NOMIMIT 1020 (NY6) manufactured by Mitsubishi Engineering Plastics Co., Ltd., and the same except that the added antioxidant and its amount were changed as shown in Table 1. A biaxially stretched polyamide film having a thickness of 15 μm was obtained in the same manner as in the example, and the breaking strength of the obtained biaxially stretched film was measured in the same manner as in the example, and the presence or absence of delamination was examined.
【0025】実施例7
実施例1に記載の例において、ポリヘキサメチレンアジ
パミド 100重量部を三菱エンシ゛ニアリンク゛フ゜ラスチック(株)製ノハ
゛ミット゛2420(NY66/NY6共重合体)80重量
部と三菱エンシ゛ニアリンク゛フ゜ラスチック(株)製ノハ゛ミット゛1020
(NY6) 20重量部に、及び添加した酸化防止剤と
その量とを、第1表に記載の通りに変更したほかは同例
におけると同様にして厚み15μmの二軸延伸ポリアミド
フィルムを得、得られた二軸延伸フィルムについて、同
例におけると同様にして破断強度を測定し、デラミの有
無を調べた。Example 7 In the example described in Example 1, 100 parts by weight of polyhexamethylene adipamide was added to 80 parts by weight of Mitsubishi Engineering Link Plastics Co., Ltd. NOVAMIT 2420 (NY66 / NY6 copolymer) and Mitsubishi Engineering Plastics ( Novamid 1020 manufactured by
(NY6) A biaxially stretched polyamide film having a thickness of 15 μm was obtained in the same manner as in the same example except that 20 parts by weight and the added antioxidant and the amount thereof were changed as described in Table 1. With respect to the obtained biaxially stretched film, the breaking strength was measured in the same manner as in the example, and the presence or absence of delamination was examined.
【0026】実施例8
実施例1に記載の例において、ポリヘキサメチレンアジ
パミド 100重量部を昭和電工エムス製グリロンC(N
Y6/NY12共重合体) 80重量部と三菱エンシ゛ニアリン
ク゛フ゜ラスチック(株)製ノハ゛ミット゛1020(NY6) 20重
量部に、及び添加した酸化防止剤とその量とを、第1表
に記載の通りに変更したほかは同例におけると同様にし
て厚み15μmの二軸延伸ポリアミドフィルムを得、得ら
れた二軸延伸フィルムについて、同例におけると同様に
して破断強度を測定し、デラミの有無を調べた。Example 8 In the example described in Example 1, 100 parts by weight of polyhexamethylene adipamide was added to Showa Denko MGS Grilon C (N).
80 parts by weight of Y6 / NY12 copolymer) and 20 parts by weight of NOMIMIT 1020 (NY6) manufactured by Mitsubishi Engineering Plastics Co., Ltd., and the added antioxidant and its amount were changed as shown in Table 1. Otherwise in the same manner as in the example, a biaxially stretched polyamide film having a thickness of 15 μm was obtained, and the breaking strength of the obtained biaxially stretched film was measured in the same manner as in the example, and the presence or absence of delamination was examined.
【0027】比較例1−2
実施例1に記載の例において、三菱エンシ゛ニアリンク゛フ゜ラスチック
(株)製ノハ゛ミット゛1020(NY6) 100重量部当
たりに添加した酸化防止剤とその量とを、第1表に記載
の通りに変更したほかは同例におけると同様にして厚み
15μmの二軸延伸ポリアミドフィルムを得、得られた二
軸延伸フィルムについて、同例におけると同様にして破
断強度を測定し、デラミの有無を調べた。Comparative Example 1-2 In the example described in Example 1, the antioxidant and the amount thereof added per 100 parts by weight of Novamid 1020 (NY6) manufactured by Mitsubishi Engineering Plastic Co., Ltd. are shown in Table 1. Same as in the same example except that
A 15 μm biaxially stretched polyamide film was obtained, and the breaking strength of the obtained biaxially stretched film was measured in the same manner as in the same example, and the presence or absence of delamination was examined.
【0028】上記実施例、比較例の結果を、同じく第1
表に示す。なお、実施例および比較例の結果を示す第1
表において、添加した化合物の略号、A〜Cの意味はそ
れぞれ次の通りである。
A:N,N'−ヘキサメチレンビス(3,5−ジ−t−ブチル−
4−ヒドロキシ−ヒドロシンナマミド)(チバガイギー
社製、イルガノックス1098)
B:3,5−ジ−t−ブチル−4−ヒドロキシ−ベンジルフ
ォスフォネート−ジエチルエステル(チバガイギー社
製、イルガノックス1222)
C:1,3,5−トイリチル−2,4,6−トリス(3,5−ジ−t−
ブチル−4−ヒドロキシベンジル)ベンゼン(チバガイ
ギー社製、イルガノックス1330)The results of the above Examples and Comparative Examples are the same as the first example.
Shown in the table. In addition, the first showing the results of Examples and Comparative Examples
In the table, the abbreviations of the added compounds and the meanings of A to C are as follows. A: N, N'-hexamethylenebis (3,5-di-t-butyl-
4-hydroxy-hydrocinnamamide) (manufactured by Ciba-Geigy, Irganox 1098) B: 3,5-di-t-butyl-4-hydroxy-benzylphosphonate-diethyl ester (manufactured by Ciba-Geigy, Irganox 1222) C: 1,3,5-toytyl-2,4,6-tris (3,5-di-t-
Butyl-4-hydroxybenzyl) benzene (Ciba-Geigy Co., Irganox 1330)
【0029】[0029]
【表1】 [Table 1]
フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08K 5/5333 C08K 5/5333 C08L 77/00 C08L 77/00 // B29K 77:00 B29K 77:00 B29L 7:00 B29L 7:00 Fターム(参考) 3E086 AA01 AB01 AC07 AC22 AD01 AD30 BA02 BA15 BA33 BB41 BB71 CA03 DA08 4F071 AA54 AA55 AA84 AC11 AC12 AC15 AE05 AF13 AH04 BB08 BC01 4F210 AA29 AB06 AB19 AG01 AH54 QC05 QC06 4J002 CL001 CL031 EJ046 EP026 EW126 FD076 GG02 Front page continuation (51) Int.Cl. 7 Identification code FI theme code (reference) C08K 5/5333 C08K 5/5333 C08L 77/00 C08L 77/00 // B29K 77:00 B29K 77:00 B29L 7:00 B29L 7:00 F term (reference) 3E086 AA01 AB01 AC07 AC22 AD01 AD30 BA02 BA15 BA33 BB41 BB71 CA03 DA08 4F071 AA54 AA55 AA84 AC11 AC12 AC15 AE05 AF13 AH04 BB08 BC01 4F210 CL0 406026 001 HO06 QC06 A4 GG02
Claims (8)
ン鎖数6個以上且つ融点160℃以上のポリアミド系樹
脂を主成分とし、140℃の熱水処理で破断強度保持率
が70%以上であることを特徴とするポリアミドフィル
ム1. A polyamide resin having 6 or more methylene chains per repeating minimum unit of a molecular chain and a melting point of 160 ° C. or more as a main component and having a breaking strength retention of 70% or more by hot water treatment at 140 ° C. Polyamide film characterized by
する請求項1のポリアミドフィルム2. A polyamide film according to claim 1, which contains a hindered phenolic antioxidant.
ポリアミド系樹脂100重量部に対して0.01重量部
以上含有する請求項1又は2のポリアミドフィルム3. The polyamide film according to claim 1, which contains 0.01 part by weight or more of a hindered phenolic antioxidant with respect to 100 parts by weight of the polyamide resin.
ポリアミド系樹脂100重量部に対して0.8重量部以
下含有する請求項1又は2のポリアミドフィルム4. The polyamide film according to claim 1, which contains 0.8 parts by weight or less of a hindered phenolic antioxidant with respect to 100 parts by weight of the polyamide resin.
ン鎖数6個以上のポリアミド系樹脂ががナイロン66で
ある請求項1ないし4いずれかののポリアミドフィルム5. The polyamide film according to claim 1, wherein the polyamide resin having 6 or more methylene chains per repeating minimum unit of molecular chain is nylon 66.
N'−ヘキサメチレンビス(3,5−ジ−t−ブチル−4−
ヒドロキシーヒドロシンナマミド)、3,5−ジ−t−ブ
チル−4−ヒドロキシーベンジルフォスフォネート−ジ
エチルエステル、および1,3,5−トリメチル−2,4,6−ト
リス(3,5−ジ−t−ブチル−4−ヒドロキシベンジ
ル)ベンゼンからなる群より選ばれる少なくとも1種の
化合物である請求項2ないし5いずれかのポリアミドフ
ィルム6. The hindered phenolic antioxidant is N,
N'-hexamethylenebis (3,5-di-t-butyl-4-
Hydroxy-hydrocinnamamide), 3,5-di-t-butyl-4-hydroxy-benzylphosphonate-diethyl ester, and 1,3,5-trimethyl-2,4,6-tris (3,5 The polyamide film according to any one of claims 2 to 5, which is at least one compound selected from the group consisting of -di-t-butyl-4-hydroxybenzyl) benzene.
アミドフィルム7. The biaxially stretched polyamide film according to claim 1.
ずれかのポリアミドフィルム8. A polyamide film for packaging retort foods according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001302204A JP3946478B2 (en) | 2001-09-28 | 2001-09-28 | Polyamide film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001302204A JP3946478B2 (en) | 2001-09-28 | 2001-09-28 | Polyamide film |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003105107A true JP2003105107A (en) | 2003-04-09 |
JP3946478B2 JP3946478B2 (en) | 2007-07-18 |
Family
ID=19122491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001302204A Expired - Lifetime JP3946478B2 (en) | 2001-09-28 | 2001-09-28 | Polyamide film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3946478B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011225872A (en) * | 2010-04-02 | 2011-11-10 | Ube Industries Ltd | Polyamide resin composition for film |
WO2012067172A1 (en) * | 2010-11-17 | 2012-05-24 | ユニチカ株式会社 | Semi-aromatic polyamide film, and process for production thereof |
CN114713051A (en) * | 2022-03-28 | 2022-07-08 | 金发科技股份有限公司 | Polyamide membrane, preparation method and application of photo-repairing polyamide membrane |
-
2001
- 2001-09-28 JP JP2001302204A patent/JP3946478B2/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011225872A (en) * | 2010-04-02 | 2011-11-10 | Ube Industries Ltd | Polyamide resin composition for film |
WO2012067172A1 (en) * | 2010-11-17 | 2012-05-24 | ユニチカ株式会社 | Semi-aromatic polyamide film, and process for production thereof |
KR20130139967A (en) * | 2010-11-17 | 2013-12-23 | 유니띠까 가부시키가이샤 | Semi-aromatic polyamide film, and process for production thereof |
TWI506063B (en) * | 2010-11-17 | 2015-11-01 | Unitika Ltd | Semiaromatic polyamide and the manufacturing method thereof |
JP5881614B2 (en) * | 2010-11-17 | 2016-03-09 | ユニチカ株式会社 | Semi-aromatic polyamide film and method for producing the same |
KR101893840B1 (en) * | 2010-11-17 | 2018-08-31 | 유니띠까 가부시키가이샤 | Semi-aromatic polyamide film, and process for production thereof |
CN114713051A (en) * | 2022-03-28 | 2022-07-08 | 金发科技股份有限公司 | Polyamide membrane, preparation method and application of photo-repairing polyamide membrane |
Also Published As
Publication number | Publication date |
---|---|
JP3946478B2 (en) | 2007-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU649710B2 (en) | Polyamide resin composition and film therefrom | |
EP0358038B1 (en) | Amorphous nylon copolymer and copolyamide films and blends | |
KR100818881B1 (en) | Laminated biaxially-oriented polyamide film and process for producing the same | |
JP4961632B2 (en) | Polyamide stretched film | |
JP2022161902A (en) | Laminated film | |
TW294689B (en) | ||
JPS6024814B2 (en) | resin composition | |
JP2004358721A (en) | Lactic acid-based polymer multilayered film | |
CN113573905B (en) | Laminated stretched polyamide film | |
JP2003105107A (en) | Polyamide film | |
JPH07276591A (en) | Polyamide type laminated biaxially stretched film | |
JP2001164109A (en) | Polyamide resin composition | |
JP7322458B2 (en) | Easy adhesion polyamide film | |
HUT73071A (en) | Copolyamides, use thereof, package material, closing sheet | |
WO2024010008A1 (en) | Polyamide resin composition, film and film laminate comprising same, and pellet mixture | |
JPH07268209A (en) | Polyamide resin composition for forming film and biaxially oriented polyamide film made therefrom | |
JP2917401B2 (en) | Biaxially stretched polyamide film with excellent hot water resistance | |
JP2003011307A (en) | Laminated biaxially oriented polyamide film | |
JPH07117198A (en) | Polyamide laminated biaxial oriented film | |
JPH08156205A (en) | Polyamide laminated biaxially stretched film excellent in hot water resistance | |
JPH05193081A (en) | Polyamide base laminated biaxially stretched film | |
JP4000002B2 (en) | Hot water-resistant polyamide film | |
JPH04120168A (en) | Polyamide resin composition and polyamide film | |
JPS62127346A (en) | Polyamide composition | |
JP2009154294A (en) | Biaxially oriented laminated polyamide film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041012 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20041012 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20041012 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060726 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060801 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060928 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061219 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070213 |
|
A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070320 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070410 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070411 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 3946478 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110420 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120420 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120420 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130420 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130420 Year of fee payment: 6 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |