JP2003101872A - Image pickup device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an image pickup device capable of obtaining appropriate data for photometry even in the case that defective pixels are present in an image pickup element, and the image pickup device. SOLUTION: In a pixel group setting process of setting a pixel 50a of a first group used for converting an object to image data and a pixel 50b of a second group used for performing the photometry, in the case that the defective pixel is present, the defective pixel is not set to the pixel 50b of the second group. Thus, the data for the photometry obtained from the pixel of the second group obtained at the time of photographing become highly reliable data and thus appropriate exposure is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an image pickup apparatus having a solid-state image pickup device including a pixel group for image data acquisition and a pixel group for photometry and an image pickup apparatus.

[0002]

2. Description of the Related Art A solid-state image pickup device provided in an image pickup device such as an electronic camera uses a large number of two-dimensionally arranged pixels to convert an optical image of an object formed on each pixel into a charge amount (electrical signal). It has the function of converting and outputting. by the way,
It is possible that some of these pixels cannot output a normal signal because they have defects (pixel defects) due to dust adhesion, crystal defects, and the like. For such a pixel defect, a signal obtained by adding an extra signal component to an output signal that should be output corresponding to the brightness of the subject is output, and a white defect that makes the image whitish and There is a black defect in which a signal obtained by subtracting a certain signal component from the output signal that should be output corresponding to the luminance is output, which makes the image dark.

If many pixel defects occur, the image quality may be significantly deteriorated when the image picked up by such a solid-state image pickup device is reproduced. On the other hand, since the solid-state image sensor that has been used in recent years has at least several hundreds of thousands of pixels, it can be said that it is actually difficult to manufacture a solid-state image sensor having no pixel defect. Therefore, it is required to use the solid-state image pickup device on the assumption that there are always some pixel defects.

Based on such a premise, an electronic camera having a correction circuit for correcting an electric signal output from a pixel having a pixel defect by post-processing to improve the image quality has already been developed. According to such an electronic camera, a pixel having a pixel defect (defective pixel) of the solid-state image sensor is detected by using the pixel defect inspection device in the production process of the electronic camera, and the position thereof is mounted on, for example, the electronic camera. RO
By storing the information in M as information, a method of appropriately correcting the output signal from the defective pixel at the time of actual imaging is adopted.

[0005]

By the way, an electronic camera has been developed which acquires image data by using a partial pixel group in a single image sensor and acquires photometric data by using the remaining pixel group. There is. According to such an electronic camera,
There is an advantage that it is not necessary to separately provide a photometric element.

In such an electronic camera, when the above-described white flaw or black flaw occurs in a pixel for image data acquisition, the position of the defective pixel is stored as described above, so that the image data Correction is possible. However, the number of pixels for obtaining photometric data may be relatively small, and if a defect occurs in the pixels, the photometric data may become inadequate and proper exposure may not be obtained during shooting.

The present invention has been made in view of the above problems of the prior art, and a method of manufacturing an image pickup apparatus and an image pickup method capable of obtaining proper photometric data even when there is a defective pixel in the image pickup element. The purpose is to provide a device.

[0008]

According to a first aspect of the present invention, there is provided an image pickup apparatus manufacturing method, which comprises an image pickup device in which a plurality of pixels are two-dimensionally arranged, and the image pickup device converts a subject into image data. A method of manufacturing an image pickup apparatus, comprising: a first group of pixels used for the purpose of measurement; and a second group of pixels used for performing photometry, wherein a defective pixel is included in the plurality of pixels. If there is a defective pixel, the process of storing information about the position of the defective pixel, the first group of pixels used for converting the subject into image data, and the pixel used for performing photometry A pixel group setting step for setting the second group of pixels, and if there is a defective pixel in the pixel group setting step, the defective pixel is not set as the pixel of the second group. From the pixels of the second group obtained at the time Photometric data to be, the reliability high can be maintained, thereby to obtain a proper exposure.

According to a second aspect of the present invention, there is provided a method of manufacturing an image pickup device, which comprises an image pickup device in which a plurality of pixels are two-dimensionally arranged, and the image pickup device is used for converting a subject into image data. A group of pixels and a second used to perform photometry
A method of manufacturing an image pickup device comprising a group of pixels, comprising the step of determining whether or not the second group of pixels includes a defective pixel; Since a step of writing information for performing photometric control without using it into a storage element is provided, for example, in the manufacturing stage, defective pixels are not distinguished from pixels of the first group and pixels of the second group. By writing the information on the position of the defective pixel obtained as a result to the storage element, it is possible to prevent the defective pixel from being used as a pixel for photometry and not for photometry at the time of photographing. Therefore, the proper exposure can be obtained.

Further, it is preferable that the information is information on the position of the defective pixel.

Further, it is preferable that the information is information on a position of a defective pixel and information on a position of a pixel used in place of the defective pixel (for example, a pixel adjacent to the defective pixel).

According to a third aspect of the present invention, there is provided an image pickup device for photographing a subject, wherein the image pickup device has a plurality of pixels arranged two-dimensionally. The image pickup device converts the subject into image data. A first group of pixels used to
It is configured by a second group of pixels used for performing photometry, and has a control means for performing photometry control without using defective pixels of the second group of pixels. The photometric data obtained from the pixels of the second group, which is obtained at the time of photographing, is set so that the defective pixels are not set to the pixels of the second group based on the information on the defective pixels stored at the time of manufacture. The reliability can be kept high, and proper exposure can be obtained.

Further, it is preferable that the control means can obtain highly reliable photometric data unless the information fetching operation from the defective pixel is performed based on the information on the position of the defective pixel stored in the storage means.

Further, the control means is used instead of the defective pixel stored in the storage means without performing the information fetching operation from the defective pixel based on the information on the position of the defective pixel stored in the storage means. It is preferable to perform the information reading operation from the pixel used instead of the information based on the information regarding the position of the pixel because highly reliable photometric data can be obtained.

A photographing device according to a fourth aspect of the present invention has an image pickup device in which a plurality of pixels are two-dimensionally arranged, and in the image pickup device for photographing a subject, the image pickup device converts the subject into image data. A first group of pixels used to
And a second group of pixels used for performing photometry, and when a pixel of the second group has a defective pixel, information for performing photometric control without using the defective pixel is provided. Since the written storage means is provided, the defective pixel is not set as the pixel of the second group based on the information stored in the storage means at the time of manufacturing or the like, and thus the defective pixel is obtained at the time of photographing. The reliability of the photometric data obtained from the pixels of the second group can be kept high, and thus proper exposure can be obtained.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the present embodiment with reference to the drawings, an outline of a CMOS type image pickup device will be described below. FIG. 1 is an equivalent circuit diagram of a CMOS image sensor. Although only a single pixel 50 is shown in FIG. 1, the pixel 50 is arranged two-dimensionally. The timing generator 5 is provided outside the pixel 50.
1, vertical shift register 52, horizontal shift register 5
3, circuits such as the output amplifier 54 are configured. The vertical shift register 52 is a register for selecting a scanning line, and the horizontal shift register 53 is a register for pixels 5 in the same scanning line.
This is a register for selecting 0. The timing generator 51 controls the entire sensor including these. In addition to the above configuration, it is possible to incorporate a CDS circuit, an AD converter, a signal processing circuit, and the like.

The internal settings of the timing generator 51 can be made externally by serial communication. In FIG. 1, only command input is viewed from the arrow, but 2-wire or 3-wire serial communication is assumed. By this serial communication, it is possible to set and change the registers inside the timing generator 51. As an exposure control signal, a dedicated terminal (T
Since RG1 and TRG2) are provided, they are transmitted via this terminal.

There are several conceivable methods for controlling the image pickup device, but in this embodiment, the trigger signal T
The exposure is started at the rising edge of the pulse of RG1 and is ended at the falling edge of the pulse. And
When the trigger signal TRG2 rises after the pulse of the trigger signal TRG1 rises and before the pulse falls and the pulse amount of the trigger signal TRG1 rises, the exposure is finished at that point.

More specifically, the operation of each part will be described. In FIG. 1, the light-receiving operation for the sweeping operation in the pixel 50 is performed by the power source Vrst1 via the MOS transistor Q2.
Is performed by the photosensor section (that is, the photodiode) D1 connected to the. When sweeping out the charges of the photodiode D1, the output signal RG1 of the timing generator 51 is controlled to turn on the transistor Q2 so that the charges are swept out to the power supply Vrst1. By turning on the MOS transistors Q2 of all pixels, the charges of all the photodiodes are swept out, and the transistors Q2
Exposure is started from the point when is turned off. This part corresponds to the charge discharging part.

A photodiode D is further provided for charge transfer.
1 is a capacitor C1 via a MOS transistor Q1
It is connected to the. This part corresponds to the charge storage part.
The output signal SG of the timing generator 51 is controlled,
By turning on the MOS transistors Q1 of all pixels, the charges of the photodiode D1 are transferred to the capacitor C1. Further, the exposure is completed by turning off the transistor Q1.

Next, the reading of charges will be described.
The electric charge accumulated in the capacitor C1 of each pixel is turned on by turning on the MOS transistor Q5.
Is read out one pixel (or one line) to the outside via the. Pixels are selected by the vertical shift register 52 and the horizontal shift register 53 (transistor Q6 is turned on here).
By specifying the address. That is,
The charge can be read out only from the addressed pixel. At this time, it is possible to read out the electric charges as they are, but since they are easily affected by noise, in the present embodiment, they are once converted into a voltage and output.

After that, the charge storage section is reset. More specifically, by turning on the MOS transistor Q3 at the same time after the reading is completed and before the next photographing is started, the charge of the capacitor C1 is swept out to the power source Vrst2 (cleared, that is, the power source Vr).
reset to st2). At this time, it is desirable to perform all pixels at the same time because the dark current noise amount between the pixels can be equalized. However, if the noise amount is sufficiently small, it may be performed pixel by pixel after reading. This charge is current-amplified and output by the amplifier 55 of the output section.

The reset function of the photodiode D1 can be omitted. In that case, the transistor Q2 is omitted. In this case, by transferring the charge to the capacitor C1, the photodiode D1 can be cleared and the exposure can be started from there. The charges transferred to the capacitor C1 are read out and discarded during the exposure period.

Further, as a modification, a case where a non-volatile memory (charge storage section) is provided will be described. In an image pickup device including a non-volatile charge storage unit and a non-volatile charge storage unit, first, charges are transferred from the photosensor unit to the non-volatile charge storage unit at the same time for all pixels, and then one pixel at a time. It is preferable to transfer the charges to the charge storage section. This is because a flash memory or the like generally has a low writing speed and takes a long time to write, so that the writing timing is adjusted.

FIG. 2 is a schematic block diagram of an image sensor circuit 20 including the image sensor of FIG. Each pixel 50 (FIG. 1) of the imaging unit 54 in which the pixels 50 shown in FIG. 1 are two-dimensionally arranged.
As described above, the vertical shift register 52 and the horizontal shift register 53 controlled by the image sensor control circuit 23 (including the timing generator) receiving the control signal from the MPU 27 are controlled and operate. There is.

In the present embodiment, some of the pixels 50 are pixels (pixels of the second group) for performing photometry for detecting light from the subject for exposure control, and the remaining pixels (the pixels of the second group). One group of pixels) has a function of converting a subject image into image data. Therefore, the output signal from the pixel of the first group is amplified by the output amplifier 55 via the output terminal 55a and is output to the outside of the image sensor circuit 20, and the output signal from the pixel of the second group is output terminal. The signal is amplified by the output amplifier 56 via 56a, compared with a predetermined photometric level (threshold value) by the comparator 7, and the result is output to the image sensor control circuit 23. As shown in FIG. 2, the image pickup unit 54, the vertical shift register 52, the horizontal shift register 53, the image pickup element control circuit 23, the output amplifier 5
5, 56 and the comparator 7 are integrated into one chip. Although not shown, the one-chip circuit also has a built-in register for setting the photometric level and a DA converter, and a communication function for rewriting this register from the outside to change the photometric level. I also have.

FIG. 3 is a schematic configuration diagram showing an array of pixels in the image pickup section 54. Pixels 50b of the second group (shown by hatching) are arranged at predetermined intervals in the pixels 50a of the first group which are two-dimensionally arranged. In the present embodiment, in a general-purpose CMOS image sensor, a part of pixels for obtaining image data is used as pixels for exposure control, so that a low cost structure can be obtained. According to this configuration, a part of the image data is used as the exposure control data, so that a state equivalent to a pixel defect (so-called black defect) occurs at the position of the pixel of the second group. However, it is considered that such a pixel defect does not cause a big problem because it can be corrected from the image data of the surrounding pixels, like a black defect that may occur normally. Further, the number of the pixels 50b of the second group is preferably about 30 to 100 when the pixels 50a of the first group are 1M pixels. The pixel 50b of the second group is specified by the address,
It is good that it is always outputting. In such a case, the outputs of a plurality of pixels can be combined to form one output. The second group of pixels 50b may be arranged only in the center, or may be arranged at a predetermined interval over the entire imaging unit 50.

FIG. 4 is a wiring diagram for signal extraction when the image pickup section of FIG. 3 is used. As shown in FIG. 4, the first group of pixels 50a and the second group of pixels 50b are
Output amplifiers 55,
56 is connected.

FIG. 5 is a schematic configuration diagram showing an array of pixels in the image pickup section 54 according to the modification of the present embodiment.
The pixels 50b of the second group (shown by hatching) are arranged between the pixels 50a of the first group which are two-dimensionally arranged. In the present embodiment, although it is necessary to manufacture the CMOS type image pickup device exclusively (including the wiring dedicated to the pixel 50b of the second group), unlike the configuration of FIG. Can be kept high.

FIG. 6 is a wiring diagram for signal extraction when the image pickup section of FIG. 5 is used. As shown in FIG. 6, the first group of pixels 50a and the second group of pixels 50b are
Output amplifiers 55,
56 is connected.

There are the following methods for reading out signals from the second group of pixels. 1) A method of simultaneously accessing all the light receiving elements, reading signals at the same time, adding them, and taking them out. In this case, the signals are read by designating the XY addresses so that the output transistors of all the light receiving elements are turned on. 2) A method of reading at high speed by switching pixel by pixel. In this case, it is necessary to consider the case of using a strobe and read out the signal at a time interval sufficiently short with respect to the emission time of the strobe light. The signals read out pixel by pixel are added externally. 3) A method combining the above. This is a method in which the light receiving elements are divided into several groups and read out for each group.

In the method 1), since signals are added and detected at one time, photometry with a fast response speed can be performed, and photometry can be performed without using a complicated circuit or a complicated photometry algorithm. . The method 2) depends on the number of light receiving elements because the flash light emission time is about several hundred μs, but if the number of pixels of the second group is about 100, then
An access speed of 0 ns or less, preferably about 10 ns or less is required, but fine metering control as described later can be performed. The method of 3) is in the middle,
It has both advantages and disadvantages. For example, the signal of the light receiving element for one column is read out simultaneously, and the signal is sequentially read over all the columns and read out.

When reading out individually, signals can be used adaptively. In the case of the CMOS type image pickup device, since the signal can be read out for each pixel, for example, during stroboscopic photography, the signal can be used by paying attention to the pixel that has a large change after strobe light emission. Initially, signals are read from all the pixels of the second group, but if there is a pixel having a large change after stroboscopic light emission, some or all of them are selected and only the signal from that pixel is read. That is, for example, when a person is photographed, the portion where the amount of reflected light such as the face or body is desired to be measured is focused and the light is measured. Further, in this case, the number of pixels of the second group to be used is reduced, so that the read cycle becomes shorter, the resolution in the time axis direction becomes higher, and more accurate photometry becomes possible. Also, a dedicated second
When the pixels of the group are provided, the readout circuit can also be provided exclusively. The output circuit can also be provided exclusively,
It can be shared with the output of the image signal.

FIG. 7 is a view showing the schematic arrangement of an electronic still camera which is an example of the image pickup apparatus according to this embodiment. In FIG. 7, 27 is an MPU that determines the aperture and shutter speed, and outputs control signals to various circuits.
24 is a release switch which is a signal output means,
25 is turned on, the battery BT to M
This is a power switch that supplies power to the PU 27 and the like and shuts off the power by turning it off. Further, 21 is a photographing lens that collects the reflected light from the subject 3,
Reference numeral 2 denotes the CMOS image sensor shown in FIG. An image sensor control circuit 23 controls the exposure amount of the image sensor 22 in response to a stop signal from the comparator 7 which is a determination unit.

Next, detection of a white defect as a defective pixel will be described. In addition, the detection of the white flaw is performed in the manufacturing process of the electronic still camera, and the obtained detection result is EEP.
The detection result is stored in the ROM 28 and is used for white defect correction during actual image pickup. However, in order to deal with white scratches that increase over time, the detection result is executed every time the power is turned on, or if the electronic still camera is recyclable, when it is collected for recycling. It may be updated.

A mode of white defect detection in the manufacturing process of the electronic still camera will be described. First, when the power switch 25 is turned on in the check mode state, the switch signal is input to the MPU 27 and the aperture 2
6 is driven fully closed, and in this state, the CMOS image sensor 2
By 2, the image pickup for one screen is performed while limiting the incident light.
The output from the CMOS type image pickup device 22 by such image pickup is accumulated in an image memory (not shown), and is output to the MPU 27.
Compares the threshold value (reference data) for white defect determination stored in the EEPROM 28 in advance with the image data of each pixel, that is, the output signal. The reference data can be obtained by averaging the peripheral data of the detected pixel using imaged image data.

The defect level detected at this time may be detected not by setting the same range for all the image data but by dividing a certain area and by different reference for each area. For example, divide into the central part of the screen and the peripheral part,
5% or less in the central part and 10% or less in the peripheral part,
The conditions for flaw detection can be changed. The percentage at this time is the ratio of the scratch level to the data average value of the 24 pixels around the target pixel.

In this way, the reference data, that is, the threshold value is obtained. According to the above-mentioned image pickup, the CMOS type image pickup device 2
Since the incident light does not reach the pixel No. 2, the output signal from the pixel should be less than the threshold value as long as the pixel is normal. Therefore, when the output signal is equal to or higher than the threshold value, it is determined that there is a defect corresponding to a white defect. By this comparison, white scratches will be detected.
When the white defect is detected, the position information (two-dimensional coordinate) of the defective pixel corresponding to the white defect is stored in the EEPROM 28.

Defects corresponding to black scratches can be obtained by the same detection method as for the white scratches described above by shooting an object with a constant brightness on the shooting screen. The position information (two-dimensional coordinates) of the defective pixel corresponding to it is EEPRO
It is stored in M28.

Next, the photographing operation of the embodiment according to the present invention will be described with reference to the drawings. 8 and 9 are flowcharts showing the operation of the electronic still camera according to the present embodiment. As a premise, in the manufacturing process, the above-mentioned defective pixel is checked, and EEPRO which is a storage unit is used.
In M28, information regarding the position of the defective pixel and information instructing to perform photometric control without using the defective pixel (information regarding the position of a normal pixel used in place of the defective pixel, if necessary) Is stored.

When the power switch 25 is turned on in step S100 of FIG. 8, step S101 is performed.
At, the electric power is supplied from the battery BT to the MPU 27 and the like. In the following step S102, the determination routine for the pixels of the second group is started. More specifically, in step S102a in FIG. 9, the MPU 27, which is the control unit, sets the EE
Data regarding the position of the defective pixel is read from the PROM 28. Based on such data, step S102b
Then, the MPU 27 determines whether or not the pixel 50b of the second group at the position (for example, 50b in FIGS. 3 to 6) that is designed by design corresponds to the defective pixel.

When it is judged that the pixel corresponds to the defective pixel, MP
In step S102c, the U27 determines the pixel 50b of the second group.
Is changed to, for example, a pixel next to the defective pixel (however, it is desirable that the color of the filter is the same), and the pixel 50b of the second group after the setting is changed to the defective pixel again in step S102b. It is judged whether or not it corresponds. If it is determined that the pixel does not correspond to the defective pixel, the setting routine is left and the decision routine is exited to wait for the release. EE
If the PROM 28 contains information about the position of a normal pixel used instead of the defective pixel, the second group of pixels 50b may be immediately determined based on this information.

In step S103, the release switch 2
4 is turned on, in step S104, MPU2
7 starts photoelectric conversion of the pixels 50a of the first group and the determined pixels 50b of the second group. In such a case, since the defective pixel is not included in the second group of pixels 50b, it is possible to prevent inappropriate data from being read from the defective pixel.

Here, the MPU 27 includes the second group of pixels 50.
By outputting a control signal to the image sensor control circuit 23 so that the pixels accumulated in b are periodically taken out in a short cycle, and comparing the total with the threshold value of the photometric level with the comparator 7, the specified light amount is obtained. It is determined whether or not (step S105). If the specified light amount has not been reached, the MPU 27 determines in step S106 whether or not a predetermined time has elapsed from the release. When the comparator 7 determines that the prescribed light amount has been reached before the predetermined time has elapsed from the release, the MPU 27 ends the photoelectric conversion of the pixels 50a of the first group in step S110, and the accumulated charge is removed in step S111. The image data is read out and subjected to A / D conversion and other processing to obtain image data, which is stored in a memory (not shown) in step S112. After that, the power is automatically turned off in step S113 (the process may return to step S103 to continue shooting).

On the other hand, if it is determined that the predetermined time has elapsed from the release before the specified light amount is reached, step S107.
Then, the MPU 27 forcibly ends the photoelectric conversion of the pixels 50a of the first group, and in step S108, "The exposure is insufficient.
A message such as "The shooting was stopped" is displayed on the LCD panel (not shown) to warn. The warning may be a buzzer or a voice. Then, in step S109,
The MPU 27 erases the charges of the pixels 50a and 50b, and turns off the power in step S113.

According to the present embodiment, the first group of pixels 50
Since the photoelectric conversion of the pixel 50b of the second group is started at the same time when the photoelectric conversion of a is started, the field brightness during photographing can be accurately measured, and an appropriate exposure can be obtained. If it is determined that a predetermined time has elapsed from the release before the specified light amount is reached, a message such as "underexposure" is not shown without forcibly ending the photoelectric conversion of the pixels 50a of the first group. You may display it on a liquid crystal panel and give only a warning. This is because the photographer may perform long-time exposure with the intention of photographing a night scene.

Further, even if it is determined that a predetermined time has elapsed from the release before the specified light amount is reached, if the release switch 24 is kept pressed as a predetermined operation, the MPU 27 gives no warning. No, first
It is also conceivable to continue the photoelectric conversion of the pixels 50a of the group. This is because it is clear that the photographer intends a long exposure when the release switch 24 is still pressed.

In the present embodiment described above, the first group of pixels 50a for image data acquisition and the second group of pixels 50b for exposure control data acquisition are independent. However, if the second group of pixels 50b is a so-called non-destructive read-out pixel, the amount of the accumulated charges can be confirmed without being taken out, so that the charges accumulated in the second group of pixels 50b are imaged. It can be used as a part of the data, which can improve the image quality. or,
The integration may be started after the charge of the pixels 50b of the second group is completely discharged and then the charge of the pixels 50a of the first group can be output.

As described above, since the charge of any pixel can be read out by using the CMOS type image pickup device, as in the present embodiment, a part of the pixels of the image pickup device 22 is used for acquiring exposure control data. Therefore, the light receiving element for measuring the field brightness, which is provided in the prior art, becomes unnecessary, and the cost can be reduced and the degree of freedom in appearance design can be increased.

In addition, even if there is a defect in the pixel of the image pickup device 22, as described above, the second photometric data is acquired.
The reliability of the photometric data can be improved by not setting the pixels of the group as defective pixels.

In the above embodiment, EEPRO
Although the position of the pixel 50b of the second group is determined based on the position information of the defective pixel stored in M28, this does not have to be performed each time photographing is performed, and the data of the defective pixel is updated. You may go once. Furthermore, the second group of pixels 50b may be composed of, for example, a plurality of pixels in the center of the shooting screen. In this case, if a defective pixel exists in the defective pixel, the output data from the defective pixel may be ignored and the photometric data may be obtained from the average value of the remaining pixels. Further, when there is a defect in the second group of pixels in the periphery, it is possible to switch to center-weighted photometry or change the photometric determination standard.

FIG. 10 is a flow chart showing a manufacturing process of an electronic still camera according to another embodiment.
In step S201, the second
Without determining the position of the pixel 50b of the group, the defective pixel is checked and the information regarding the position is stored. Further, in step S202, in the pixel group setting step of classifying the pixels 50a of the first group and the pixels 50b of the second group, the pixels 50b of the second group are set so as to avoid defective pixels. Finally, in step S203, the set second group of pixels 50
The position of b is stored in the EEPROM 28, for example. This makes it possible to obtain highly reliable data for photometry from the second group of pixels 50b during shooting.

FIG. 11 is a flow chart showing a manufacturing process of an electronic still camera according to still another embodiment. In such an electronic still camera, at the manufacturing stage,
One of the pixels 50b of the second group is determined.

As shown in step S301 of FIG.
In the manufacturing process, it is checked whether or not there is a defective pixel in the image 50b of the second group, and if there is, the location is stored in the storage means. When the second group of pixels 50b is provided with a filter, the color of the filter is also stored. In this case, if there is a bias in the filter colors of the defective pixels, pixels that are not defective pixels are also stored as defective pixels so that the pixels used for photometry are not biased in the filter colors. In this way, the bias of the filter color of the pixels used for photometry is prevented and an accurate photometry signal can be obtained.

In step S302, step S301
The photometric level is set according to the number of defective pixels detected in. That is, the photometric level (comparable to the signal value) is set according to the number of pixels used for photometry.

Although the present invention has been described above with reference to the embodiments, the present invention should not be construed as being limited to the above embodiments, and it goes without saying that appropriate modifications and improvements are possible. is there. For example, when the pixel 50b of the second group corresponds to a defective pixel, an LUT indicating the position of the defective pixel is used, and an output wire extending from the pixel is used to prevent data from being fetched from the pixel. A method such as cutting may be considered. The image pickup element is not limited to CMOS, but CCD can be used.

[0057]

According to the image processing system of the present invention, it is possible to provide a method of manufacturing a photographing apparatus and a photographing apparatus capable of obtaining proper data for photometry even when there is a defective pixel in the image sensor. .

[Brief description of drawings]

FIG. 1 is an equivalent circuit diagram of a CMOS image sensor according to the present embodiment.

FIG. 2 is a schematic configuration diagram of an image sensor circuit 20 including the image sensor of FIG.

FIG. 3 is a schematic configuration diagram showing an array of pixels in an imaging unit 54.

FIG. 4 is a wiring diagram for extracting a signal when the image pickup unit of FIG. 3 is used.

FIG. 5 is a schematic configuration diagram showing an array of pixels in an imaging unit 54 according to a modified example of the present embodiment.

FIG. 6 is a wiring diagram for signal extraction when the image pickup unit of FIG. 5 is used.

FIG. 7 is a diagram showing a schematic configuration of an electronic still camera which is an example of an image capturing apparatus according to the present embodiment.

FIG. 8 is a flowchart showing the operation of the electronic still camera according to the present embodiment.

FIG. 9 is a flowchart showing the operation of the electronic still camera according to the present embodiment.

FIG. 10 is a flowchart showing a manufacturing process of an electronic still camera according to another embodiment.

FIG. 11 is a flowchart showing a manufacturing process of an electronic still camera according to still another embodiment.

[Explanation of symbols]

7 comparator 22 CMOS image sensor 23 Image sensor control circuit 24 Release switch 25 power switch 27 MPU 28 EEPROM 50 Imaging unit 50a First group of pixels 50b Second group of pixels 51 Timing generator 52 Vertical shift register 53 Horizontal shift register

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Keita Miyata             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company (72) Inventor Takao Hosaka             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company (72) Inventor Jun Takayama             2970 Ishikawa-cho, Hachioji-shi, Tokyo Konica stock             Inside the company (72) Inventor Koichi Sato             2970 Ishikawa-cho, Hachioji-shi, Tokyo Konica stock             Inside the company (72) Inventor Satoru Kitada             2970 Ishikawa-cho, Hachioji-shi, Tokyo Konica stock             Inside the company F-term (reference) 4M118 AA07 AB01 BA14 CA02 DD09                       FA06                 5C022 AA13 AB06 AC42 AC69                 5C024 BX01 CX23 CX24 CY47 EX11                       GX21 GY31 GZ42

Claims (8)

[Claims] 1. An image sensor having a plurality of pixels arranged two-dimensionally, the image sensor comprising a first group of pixels used for converting an object into image data, and a pixel used for photometry. A method of manufacturing an image pickup apparatus configured by a second group of pixels, comprising: determining whether a defective pixel is included in the plurality of pixels; And a pixel group setting step of setting a first group of pixels used for converting a subject into image data and a second group of pixels used for performing photometry. In the pixel group setting step, if there is a defective pixel, the defective pixel is not set as the pixel of the second group, and the manufacturing method of the imaging device. 2. An image pickup device having a plurality of pixels arranged two-dimensionally, the image pickup device being used for performing photometry and a first group of pixels used for converting a subject into image data. A method of manufacturing an image pickup apparatus configured by a second group of pixels, wherein a step of determining whether the second group of pixels does not include a defective pixel; And a step of writing information for performing photometric control without using a defective pixel in a storage element. 3. The method according to claim 2, wherein the information is information regarding a position of a defective pixel. 4. The method according to claim 2, wherein the information is information about a position of a defective pixel and information about a position of a pixel used in place of the defective pixel. 5. An imaging device for imaging a subject, comprising an imaging device having a plurality of pixels arranged two-dimensionally, wherein the imaging device is a first group used for converting the subject into image data. And a second group of pixels used for performing photometry, and a control means for performing photometry control without using defective pixels of the second group of pixels. Shooting device. 6. The control means does not perform an information fetching operation from the defective pixel based on the information regarding the position of the defective pixel stored in the storage means.
The imaging device described. 7. The control means is used instead of the defective pixel stored in the storage means without performing the operation of taking information from the defective pixel based on the information on the position of the defective pixel stored in the storage means. 6. The image pickup apparatus according to claim 5, wherein the information reading operation is performed from the pixel used instead of the information based on the pixel position information. 8. An imaging device for imaging a subject, comprising an imaging device having a plurality of pixels arranged two-dimensionally, wherein the imaging device is a first group used for converting the subject into image data. And a second group of pixels used for performing photometry, and when a pixel of the second group has a defective pixel, photometric control is performed without using the defective pixel. An image pickup apparatus comprising a storage unit in which information for writing is stored.