JP2003100982A - Mounting structure of semiconductor chip and liquid crystal display unit using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain low wiring resistance even when wiring for driving or controlling semiconductor chips is formed on a glass board and obtain a liquid crystal display unit with a narrow casing which is excellent in display quality. SOLUTION: Part 6b of wiring 6 for driving or controlling semiconductor chips is formed on a glass board 2 as common wiring 6b used for a plurality of the semiconductor chips, so that the part of the wiring passes under a plurality of the semiconductor chips mounted in juxtaposition. The semiconductor chips mounted on the common wiring 6b are provided with connecting terminals 11B, so that the chips are connected at a plurality of points on a common- wiring-by-common-wiring 6b basis. Further, in-chip wiring 10 for parallel connection with the common wiring 6b is formed in the casing of the semiconductor chips.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC chip and an LS.
The present invention relates to a mounting structure of a semiconductor element such as an I-chip and a liquid crystal display device using the structure.

[0002]

2. Description of the Related Art In recent years, semiconductor chips have been mounted with TAs in accordance with the progress of higher density, higher quality and thinner thickness.
The B method (Tape Automated Bonding method) is shifting to the flip chip method (Flip Chip Bonding method).
In particular, since liquid crystal display devices are required to be thin and lightweight, a flip chip method (Flip Chi
p Bonding method) is adopted. The flip-chip method is one of face-down methods, and is a method of directly connecting a connection terminal of a semiconductor chip to a wiring electrode of a substrate or a package. In the COG method, an anisotropic conductive film (ACF) or the like is used. The protruding electrodes (bumps) are connected to the glass substrate using an electrically conductive adhesive. COG
The (ChipOn Glass) method is advantageous in that the semiconductor chip for driving a liquid crystal is directly mounted on a glass substrate, which is compact and improves the vibration resistance, and further improves the portability which is a feature of the liquid crystal display device. Yes, this implementation method is becoming mainstream.

On the other hand, in the liquid crystal display device, there is a tendency that the demand for a larger glass substrate and a higher definition of the display becomes more severe, and the number of semiconductor chips used per one liquid crystal display device tends to increase. is there. 4 and 5
[FIG. 3] is a plan view of a conventional liquid crystal display device using the COG method. In FIG. 4, a thin film transistor (TF
A glass substrate (also called an active matrix substrate or a TFT array substrate) 2 on which T) is arranged, and an upper substrate (also called a color filter substrate when the liquid crystal display device is color) 1 smaller than the glass substrate 2 A gate side liquid crystal driving semiconductor chip (gate driving semiconductor chip) 3 for driving a TFT and six data side liquid crystal driving semiconductor chips ( A data driven semiconductor chip) 4 is mounted by the COG method. Electrical signals output from the gate driving semiconductor chip 3 and the data driving semiconductor chip 4 are transmitted by the gate wiring 7 connected to the gate of the TFT and the data wiring 8 connected to the source of the TFT to drive the liquid crystal. .

Wirings 5 and 6 for driving the gate driving semiconductor chip 3 and the data driving semiconductor chip 4 are formed on the glass substrate 2 by film formation. Flexible wiring board 9
Is a semiconductor substrate (not shown) for driving mounted on a substrate formed of a resin film such as polyimide, and is provided with a predetermined wiring configuration, and a connection terminal is provided to provide a glass substrate 2 and a circuit board (printed circuit board wiring). It is connected to a PC. Signal processing and control of the liquid crystal display panel are transmitted from the circuit board PC to the gate drive semiconductor chip 3 and the data drive semiconductor chip 4 of the glass substrate 2 via the flexible wiring board 9. An anisotropic conductive film (ACF) 12 in which conductive particles are dispersed in a thermosetting resin film is used to connect the substrates, and the substrates are often bonded by thermocompression bonding. The wirings 5 and 6, and the gate wiring 7 and the data wiring 8 are wirings that are formed at the same time in the process of forming the TFT thin film formed on the glass substrate 2.

[0005]

However, when the area required for mounting the data driving semiconductor chips 4 becomes wider as the number of the data driving semiconductor chips 4 increases, it is necessary to drive the data side liquid crystal because of the narrow frame design. The area where the wiring 6 for driving the semiconductor chip 4 can be formed by film formation is inevitably narrow. Further, since the wiring 6 is formed by film formation on the glass substrate 2, the flexible wiring substrate 9 made of a resin film is formed.
The wiring resistance is higher than that of the wiring.
When the wiring resistance of the wiring is high, variations in operation occur even among semiconductor chips on the same substrate, which leads to deterioration in display quality of the liquid crystal display device. The wiring 5 of the gate drive semiconductor chip 3 has the same problem.

As shown in FIG. 4, when a small flexible wiring board 9 is used, it is necessary to lengthen the wirings 5 and 6 for drawing from the glass substrate 2 to the flexible wiring board 9, resulting in high wiring resistance. . Also, the wiring 5,
A large area for forming 6 on the glass substrate 2 is required,
It was against the narrow frame. Therefore, as shown in FIG. 5, when the wirings 5 and 6 for drawing out from the glass substrate 2 to the flexible wiring board 9 are shortened, the flexible wiring board 9 becomes large, and the flexible wiring board 9 requires a complicated wiring pattern. Therefore, it is disadvantageous in terms of cost due to the yield of the flexible wiring board 9.

Therefore, it is an object of the present invention to reduce the wiring resistance to a low level even when a semiconductor chip is mounted on a glass substrate and wiring for driving or controlling the semiconductor chip is formed. It is an object of the present invention to provide a semiconductor chip mounting structure which is small and has a simple wiring, and a liquid crystal display device using the structure.

[0008]

In order to solve the above-mentioned problems, a semiconductor chip mounting structure according to claim 1 of the present invention has a plurality of semiconductor chips mounted on a glass substrate and drives or controls the semiconductor chips. In a mounting structure of a semiconductor chip on which wiring for forming is formed, a wiring for driving or controlling the semiconductor chip mounted on the glass substrate is provided as an in-chip wiring in the housing of the semiconductor chip, and It is characterized in that it is connected in parallel with the wiring formed on the glass substrate.

For example, in the operation of a semiconductor chip, when it is necessary to connect the wiring to a connection terminal having a different name in the semiconductor chip such as connecting a signal wiring and a ground, according to the present invention, the semiconductor chip is Wiring for driving or controlling is also provided in the housing of the semiconductor chip as in-chip wiring and is connected in parallel with the wiring formed on the glass substrate, so that it is formed on the glass substrate. The wiring resistance of the wiring can be suppressed low.

In a semiconductor chip mounting structure according to a second aspect of the present invention, a plurality of semiconductor chips having connection terminals are mounted side by side on a glass substrate, and wiring for driving or controlling the semiconductor chips is formed. In the mounting structure of the semiconductor chip, a part of the wiring is formed as a common wiring used for a plurality of semiconductor chips on a glass substrate so as to pass under a plurality of semiconductor chips mounted side by side. The semiconductor chip mounted on the common wiring is provided with connection terminals so as to be connected at a plurality of points for each common wiring, while the in-chip wiring connected in parallel with the common wiring is provided in the semiconductor chip housing. It is characterized by being.

According to the present invention, since the in-chip wiring connected in parallel with the wiring for driving or controlling the semiconductor chip is provided in the housing of the semiconductor chip, the wiring is formed on the glass substrate. Even if it is done, the wiring resistance can be kept low. Further, a part of the wiring is formed as a common wiring used for a plurality of semiconductor chips on a glass substrate so as to pass under a plurality of semiconductor chips mounted side by side, and is mounted on the common wiring. Since the semiconductor chip is provided with connection terminals so as to be connected at a plurality of points for each common wiring, even if the number of semiconductor chips increases, it is necessary to increase the wiring area in the glass substrate for the above wiring. Will be suppressed.

A semiconductor chip mounting structure according to claim 3 of the present invention is based on the invention of claim 1 or 2,
The commonly used wiring is for power supply or ground supply.

It is important that the power supply and the ground commonly used by a plurality of semiconductor chips are stably supplied with the same potential to each semiconductor chip in order to operate the semiconductor chips accurately. According to the present invention, wiring is provided between the connection terminals on the inner surface of the housing of the semiconductor chip so as to be in parallel with the power supply or ground supply wiring. Therefore, the wiring resistance of the power supply and ground wiring can be reduced, and a plurality of semiconductor chips can be provided. It is possible to stably supply power or ground to.

In a liquid crystal display device using a semiconductor chip mounting structure according to a fourth aspect of the present invention, the glass substrate is one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates. The semiconductor chip is a liquid crystal driving semiconductor chip for driving a liquid crystal display panel, and is characterized in that a flexible wiring substrate is connected to the outer periphery of the glass substrate.

In mounting a COG type semiconductor chip in a conventional liquid crystal display device, the area of the wiring formed on the glass substrate cannot be made large, so that
There was a tendency to rely on the flexible wiring board for its wiring area. However, according to the present invention, the wiring resistance of the wiring formed on the glass substrate can be suppressed to be low, and the wiring area does not become wide. Therefore, the area of the wiring depending on the flexible wiring board can be narrowed. The wiring pattern can be simple, and as a result, the flexible wiring board can be downsized.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings.

As shown in FIG. 1, this embodiment is a liquid crystal display device using a thin film transistor (TFT) which is a typical active element currently used. Figure 1
FIG. 4 is a plan view of a liquid crystal display device in which a liquid crystal driving semiconductor chip is mounted by a COG method. FIG. 2 is a sectional view taken along the broken line indicated by a in FIG. This liquid crystal display device
A liquid crystal layer is sandwiched between a pair of upper and lower substrates, and a glass substrate (also referred to as an active matrix substrate or a TFT array substrate) 2 below the pair of substrates has a TFT as an active element and a gate line and a source line. Address wirings are arranged in a matrix, and color filters are arranged on the other upper substrate (also called a color filter substrate) 1.

In the portion which is projected to the side of the glass substrate 2,
The gate side liquid crystal driving semiconductor chip (gate driving semiconductor chip) 3 and the data side liquid crystal driving semiconductor chip (data driving semiconductor chip) 4 for driving the TFT are CO
It is implemented by the G method. In FIG. 1, one gate-driving semiconductor chip 3 and six data-driving ICs 4 are mounted side by side, but the number is arbitrary as required. TF
Electrical signals output from the gate driving semiconductor chip 3 and the data driving semiconductor chip 4 are transmitted by the gate wiring 7 connected to the gate of T and the data wiring 8 connected to the source of the TFT, and the liquid crystal is driven. Wirings 5 and 6 for driving the gate driving semiconductor chip 3 and the data driving semiconductor chip 4 are formed on the glass substrate 2.

A small-sized (small area) flexible wiring board 9 is connected to approximately the center of one side of the glass substrate 2. The flexible wiring board 9 is further connected to a circuit board (printed wiring board) PC. Signal processing and control of the liquid crystal display panel are transmitted from the circuit board to the gate drive semiconductor chip 3 and the data drive semiconductor chip 4 of the glass substrate 2 via the flexible wiring board 9. The flexible wiring board 9 is formed by mounting a driving semiconductor element (not shown) on a board formed of a resin film such as polyimide, performing a predetermined wiring configuration, providing connection terminals, and providing a glass substrate 2 and a circuit board PC. Connected with. For connection, an anisotropic conductive film (ACF) 12 in which conductive particles are dispersed in a thermosetting resin film is used and bonded by thermocompression bonding. The flexible wiring board 9 is often used by being bent on the back surface side of the liquid crystal display panel in order to narrow the frame.

The wiring 5 for driving or controlling the gate driving semiconductor chip 3 is formed as a film-forming wiring on the outer peripheral side of the glass substrate 2 and is connected to the flexible wiring substrate 9. Wiring 6 for driving or controlling the data driving semiconductor chip 4
a and 6b, a part 6a of which is formed and formed on the outer peripheral side of the glass substrate 2, and the other part 6b of the data driving semiconductor chips 4 mounted side by side in the lateral direction (longitudinal direction of the glass substrate 2). It is provided as a common wiring for connection.

That is, as shown in FIGS. 2 and 3, the power supply, the ground and the signal line commonly used by each data driving semiconductor chip 4 pass under the data driving semiconductor chip 4 and the adjacent data driving semiconductor chip 4. The film formation wiring is connected so as to be connected to the chip 4, and the wiring 6b is shared. Then, for each type of common wiring 6b (signal line Sg, power supply Va, etc.)
The connection terminals (also called bumps, electrode terminals, and connection electrodes) 11B are formed so as to be aligned on a straight line. In the data driving semiconductor chip 4, the input / output connection terminals 11A and the left and right connection terminals 11B arranged in the longitudinal direction are formed of a conductive material, and the common wiring 6b and the ACF 12 which are the film formation wirings are provided. Are connected using (Fig. 3). On the other hand, inside the data driving semiconductor chip 4, the connection terminal 11B is arranged in parallel with the common wiring 6b.
In-chip wiring 10 is provided between them (FIG. 2). As a result, when the data driving semiconductor chip 4 is mounted, the common wiring 6b is connected in parallel with the in-chip wiring 10, so that the wiring resistance is reduced as compared with the case where the common wiring 6b is used alone. . Note that not only the wirings 5 and 6, but the gate wiring 7 and the data wiring 8 are film-forming wirings that are simultaneously formed in the process of forming and processing the TFT thin film formed on the glass substrate 2.

As described above, in this embodiment, among the wirings 6a and 6b used for each data driving semiconductor chip 4 formed on the glass substrate 2, a part of the wiring 6b is used for each data driving semiconductor chip 4. A connection terminal 11B is provided under the same so as to be shared. As a result, the wirings 6a, 6
The wiring area of the whole b can be minimized and the frame can be narrowed. Further, by providing the in-chip wiring 10, the wiring resistance of the wiring 6b is reduced. In addition, the common wiring 6b simplifies the interface even when the small flexible wiring board 9 is used.
Thereby, the wiring of the flexible wiring board 9 can be simplified. Further, it is possible to stably supply signals and power to a plurality of semiconductor chips without making the wiring formed on the glass substrate unnecessarily thick, thereby preventing the display quality from deteriorating.

Here, the electric signals used in the data driving semiconductor chip 4 are roughly classified into a power source (analog power source, logic power source), a ground, and a signal line (analog signal, logic signal). It is effective to apply the present invention only to a power supply and a ground that consume a large amount of current. This is because the current value of the signal line is at a minimum level compared to the power supply. If there is a margin in the design margin, such a configuration may facilitate the frame narrowing design.

Although the wirings 6a and 6b of the data driving semiconductor chip 4 have been mainly described in this embodiment,
The wiring 5 of the gate drive semiconductor chip 3 can be wired in the same manner as the wirings 6a and 6b.
Further, in the present embodiment, the power supply, the ground, and the signal line are each made into a common wiring, but the present invention is not limited to this, and the signal wiring and the ground are connected in the operation of the semiconductor chip.
This is also effective when the above wiring needs to be connected to connection terminals having different names in the semiconductor chip.

[0025]

According to the semiconductor chip mounting structure of the present invention, since the in-chip wiring connected in parallel with the wiring for driving or controlling the semiconductor chip is provided in the housing of the semiconductor chip, the glass substrate The wiring resistance can be suppressed to be lower than that of the wiring just formed on the substrate, and signals and power can be stably supplied to the semiconductor chip.

Further, according to the liquid crystal display device using the semiconductor chip mounting structure of the present invention, it is possible to suppress the wiring resistance of the wiring formed on the glass substrate to be low, and it is not necessary to widen the wiring area. . As a result, the wiring pattern of the flexible wiring board can be simplified, the flexible wiring board can be made smaller, and the frame of the liquid crystal display panel of the liquid crystal display device can be narrowed and the semiconductor chip can be formed. It can supply signals and power stably. As a result, the display quality is not deteriorated, and further, the cost can be comprehensively reduced together with the simplification of the design of the glass substrate and the flexible wiring substrate.

[0027]

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a liquid crystal display device according to an embodiment of the liquid crystal display device of the present invention.

FIG. 2 is a sectional view showing a semiconductor chip configuration of the liquid crystal display device according to the one embodiment.

FIG. 3 is a plan view showing an example of mounting a liquid crystal driving semiconductor chip by a COG method.

FIG. 4 is a plan view showing an example of a liquid crystal display device mounted with a conventional liquid crystal driving semiconductor chip.

FIG. 5 is a plan view showing another example of a liquid crystal display device on which a conventional semiconductor chip for driving a liquid crystal is mounted.

[Explanation of symbols]

1 color filter substrate (upper substrate) 2 glass substrate (lower substrate) 3 gate side liquid crystal driving semiconductor chip 4 data side liquid crystal driving semiconductor chip 5 gate side liquid crystal driving semiconductor chip wiring 6 data side liquid crystal driving semiconductor Chip wiring 6a Part of wiring of data side liquid crystal driving semiconductor chip 6b Common wiring (part of wiring of data side liquid crystal driving semiconductor chip) 7 Gate wiring 8 Data wiring 9 Flexible wiring board 10 Data side liquid crystal driving semiconductor Wiring inside the chip (wiring inside the chip) 11A, 11B Connection terminals (bumps) 12 Anisotropic conductive film (ACF)

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/30 330 G09F 9/35 9/35 H01L 21/60 311R H01L 21/60 311 25/04 Z 25 / 18 F term (reference) 2H092 GA50 GA60 JA24 NA27 NA28 NA29 5C094 AA15 AA43 AA44 AA53 BA03 BA43 DB01 EA04 EA05 EA07 EB02 5F044 KK06 KK09 QQ00 5G435 AA17 AA18 BB12 CC09 EE37 EE40 KK05EE42KK

Claims (4)

[Claims] 1. A semiconductor chip mounting structure in which a plurality of semiconductor chips are mounted on a glass substrate and a wiring for driving or controlling the semiconductor chips is formed in the semiconductor chip mounting structure. A semiconductor chip mounting structure, wherein wiring for driving or controlling is provided as in-chip wiring in a housing of the semiconductor chip and is connected in parallel with the wiring formed on the glass substrate. 2. A mounting structure of a semiconductor chip, wherein a plurality of semiconductor chips having connection terminals are mounted side by side on a glass substrate and wiring for driving or controlling the semiconductor chips is formed. The portion is formed as a common wiring used for a plurality of semiconductor chips on a glass substrate so as to pass under a plurality of semiconductor chips mounted side by side. The mounting structure of the semiconductor chip is characterized in that the connection terminals are provided so as to be connected at a plurality of points for each common wiring, and the in-chip wiring connected in parallel with the common wiring is provided in the housing of the semiconductor chip. . 3. The semiconductor chip mounting structure according to claim 1, wherein the common wiring and the in-chip wiring are wirings for supplying power or ground. 4. The glass substrate is one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates, and the semiconductor chip is a liquid crystal driving semiconductor chip for driving or controlling the liquid crystal display panel, 4. A liquid crystal display device using a semiconductor chip mounting structure according to claim 1, wherein a flexible wiring substrate is connected to the outer periphery of the glass substrate.