JP2003099747A - Method of manufacturing memory card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a memory card capable of easily reducing the thickness of a thin-walled part to less than 0.3 mm, largely assuring a volume occupied by electronic components and substrates in the memory card having standardized outside dimensions, and eliminating a conventional process for sticking a formed product for memory card. SOLUTION: This method of manufacturing the memory card A incorporates a substrate 3 having the electronic components 1 mounted thereon and a projected part 2 formed thereon. The substrate 3 is fitted to the formed product 5 for memory card by inserting the projected part 2 of the substrate 3 into the recessed part 4 of the formed product 5 for memory card having the recessed part 4 formed thereon so as to match the projected part 2 on one side of the substrate 3. The formed product is set in the first cavity 10 of the first split mold 7 of a metal mold 9 formed of the first split mold 7 and a second split mold 8. Next, after clamping the metal mold 9, molten resin 13 is filled into a space 12 formed between the inner surface of the second cavity 11 of the second split mold 8 and the other side of the substrate 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a memory card equipped with an IC memory such as a flash memory.

[0002]

2. Description of the Related Art A conventional memory card A has a structure in which a substrate 3 on which an electronic component 1 such as an IC memory is mounted is sandwiched between two memory card molded products 28 and 29. Specifically, for example, in the structure shown in FIG. 5, the electronic component 1 is mounted on both sides of the substrate 3, and the convex portions 2 are formed on both sides of the substrate 3 by the electronic component 1.
Recesses 30 and 31 for accommodating the protrusions 2 of the substrate 3 are provided in the memory card molded products 28 and 29, respectively.

Then, the convex portions 2 formed on both sides of the substrate 3
Are inserted into the recesses 30 and 31 provided in the two memory card molded products 28 and 29, the substrate 3 is sandwiched between the two memory card molded products 28 and 29, and then these memory card molded products are molded. The memory card A is manufactured by attaching the products 28 and 29 by ultrasonic welding or an adhesive agent.

[0004]

By the way, in the memory card A manufactured as described above, since the external dimensions such as size and thickness are standardized, a large storage capacity is obtained. In order to embed the board 3 on which the electronic component 1 having high-speed processing capability is mounted, the external dimensions of the memory card A cannot be arbitrarily increased.
Recesses 30 provided in the memory card molded products 28, 29,
The thickness of the bottom portions 32 and 33 of 31 is reduced so that the bottom portion 3
By forming the thin portions 34 and 35 for the thin portions 2 and 33,
It was necessary to secure a large volume of 0,31. In addition,
The area of the bottom of the recesses 30 and 31 is usually 0.25 to 30.
The range is cm ² .

However, in general, the two memory card molded products 28 and 29 are separately molded by injection molding or transfer molding using molding dies 36 and 37 as shown in FIGS. 6 (a) and 6 (b). The molding dies 36 and 37 and the molding method have problems such as the fluidity of the resin 13 and the shapes of the memory card molded products 28 and 29. Item 28, 29
Regarding the above, the thickness of the thin portions 34 and 35 is 0.3 mm.
However, in reality, it was very difficult to reduce the thickness. Even if the thin portions 34 and 35 can be formed to be thinner than 0.3 mm, warpage, sink marks, burrs, welds, etc. occur, which makes the manufacture of the memory card A difficult. That is, the thicknesses of the thin portions 34 and 35 of the two memory card molded products 28 and 29 used for manufacturing the memory card A are both limited to 0.3 mm. It was impossible to secure a large volume of the concave portions 30 and 31 by making the thickness of the thin portions 34 and 35 smaller than 0.3 mm.

As described above, in the manufacture of the memory card A, the substrate 3 is sandwiched between the two memory card molded products 28 and 29, and then the memory card molded products 28 and 29 are manufactured. There is also a problem in that it has to be attached and the number of steps is large.

In addition, in the conventional memory card A, the recesses 30 and 3 provided in the molded products 28 and 29 for the memory card.
Although the convex portion 2 of the electronic component 1 mounted on the substrate 3 is fitted in the substrate 1, a minute gap may be formed between the inner surfaces of the concave portions 30 and 31 and the surface of the convex portion 2. There is a possibility that this gap may cause the memory card A to be damaged. Therefore, in order to prevent the damage of the memory card A, a filler such as an epoxy resin is also injected into the gap between the molded product for memory card 28, 29 and the electronic component 1 and the substrate 3. However, if such a process is added, the number of steps is further increased, and the manufacturing efficiency of the memory card A is deteriorated.

The present invention has been made in view of the above points, and it is easy to reduce the thickness of the thin portion to less than 0.3 mm, and the electronic parts are provided inside the memory card whose outer dimensions are standardized. It is an object of the present invention to provide a method of manufacturing a memory card, which can secure a large volume occupied by a substrate and a substrate and can omit the conventional step of attaching a molded article for a memory card and the step of injecting a filler as in the prior art. It is what

[0009]

A method of manufacturing a memory card according to claim 1 of the present invention is directed to a memory card A including a substrate 3 on which an electronic component 1 is mounted and a convex portion 2 is formed.
In manufacturing the substrate, the convex portion 2 of the substrate 3 is inserted into the concave portion 4 of the memory card molded product 5 in which the concave portion 4 is formed so as to match the convex portion 2 on one side of the substrate 3. 3 is fitted into the molded product 5 for the memory card, and the molded mold 9 is composed of the first split mold 7 and the second split mold 8.
Is set between the inner surface of the second cavity 11 of the second split mold 8 and the other side of the substrate 3 after the mold is set in the first cavity 10 of the first split mold 7 of FIG. The resin 12 in a molten state is injected and filled in the voids 12.

The invention of claim 2 is characterized in that, in claim 1, the gap 13 is filled with the resin 13 while the substrate 3 is pressed against the memory card molded product 5 by the injection pressure of the resin 13. is there.

In the method of manufacturing a memory card according to a third aspect of the present invention, in manufacturing the memory card A containing the substrate 3 on which the electronic component 1 is mounted and the convex portion 2 is formed, the first cavities 14 and 15 are It is composed of two first split dies 16 arranged in parallel, and a second split mold 19 in which a core portion 17 and a second cavity 18 are juxtaposed so as to face each of the two first cavities 14 and 15. Along with the first
A molding die 20 in which at least one of the split mold 16 and the second split mold 19 is rotatably formed in a plane perpendicular to the mold clamping / mold opening direction is used.
By inserting the convex portion 2 of the substrate 3 into the concave portion 4 of the memory card molded product 5 molded in one of the first cavities 14 in the step, the substrate 3 is fitted into the memory card molded product 5, and the second step is performed. , The molding die 2 so that the first cavity 14 on which the memory card molded product 5 is molded and the second cavity 18 of the second split mold 19 face each other.
0 is clamped, and in the third step, the resin 13 in a molten state is injected and filled into the void 21 formed by the first cavity 14 and the second cavity 18 to mold the memory card A, and the first cavity 15 and The resin 13 in a molten state is injected and filled into the voids 22 formed by the core portion 17 to mold the memory card molded product 5 in which the recesses 4 are formed by the core portion 17, and the molding die 20 is used as the fourth step. The mold is opened and the memory card A molded in the first cavity 14 and the second cavity 18 is demolded. As a fifth step, the memory card molded product 5 molded in the first cavity 15 and the core portion 17 is At least one of the first split mold 16 and the second split mold 19 is rotated in a state of being held in the one cavity 15 to mold the memory card molded product 5 into the first cavity. The I 15 is opposed to the second cavity 18 of the second mold part 19, repeat the first step of the to the fifth step, characterized in that to produce a memory card A continuously.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below by dividing them into a first embodiment and a second embodiment.

(Embodiment 1) FIG. 1 and FIG.
2 shows an example of a process of manufacturing a memory card A according to the invention of FIG. The memory card A has electronic parts 1
The substrate 3 on which the convex portions 2 are formed is mounted, but the substrate 3 is not particularly limited, and it is used when the conventional memory card A is manufactured. Similar ones can be used. That is, an electronic component 1 such as an IC memory (for example, a flash memory) is mounted on a circuit formed on both sides or one side of the substrate 3, and a terminal portion 38 connected to this circuit is provided at an end portion of the substrate 3, The circuit of the substrate 3 can be energized from an external electrode (not shown) of another electronic device through the terminal portion 38.

As shown in FIG. 2, the molding die 23 used for molding the memory card molded product 5 is a male split mold 2.
4 and a female split mold 25. The split molds 24 and 25 are arranged so that their parting surfaces (divided surfaces) face each other so that they can be clamped and opened. Here, a core portion 26 is provided in a protruding manner on the parting surface of the male mold 24, and the core portion 26 has substantially the same shape and shape as the protrusion 2 formed on one side of the substrate 3 described above. It is formed with a size. When there are a plurality of electronic components 1 mounted on one side of the board 3, that is, when there are a plurality of convex portions 2, the same number of core portions 26 are provided on the split mold 24 so that the positional relationships are also equal. ing. On the other hand, a cavity 27 is recessed in the parting surface of the female split mold 25. Then, the molding die 23 is manufactured such that the entire space portion formed when the split molds 24 and 25 are clamped is the outer dimension of the memory card molded product 5 which is a part of the memory card A. Has been done.

The molding die 9 used for manufacturing the memory card A is composed of a first split mold 7 and a second split mold 8 as shown in FIG. 7,
8 is each parting surface (divided surface) for mold clamping and mold opening
Are opposed to each other. Here, the parting surface of the first split mold 7 is provided with a first cavity 10 having the same shape and size as the cavity 27 recessed in the split mold 25 described above. On the other hand, the second split type 8
The second cavity 11 is recessed on the parting surface. The entire space formed when the split molds 7 and 8 are clamped is a standardized memory card A.
The molding die 9 is manufactured so as to have the outer dimensions of.

When the memory card A is manufactured, the memory card molded product 5 is required, which can be molded through the following steps. That is, FIG.
As shown in FIG. 2A, the male split mold 24 and the female split mold 25, which are separated from each other, are brought close to each other to perform mold clamping.
The resin 13 in a molten state is injected and filled in the cavity 27 as shown in FIG. After that, by cooling and hardening it, the molded product for memory card 5 as shown in FIG. 2 (c) can be molded. The molded product for memory card 5 thus obtained Is formed with a concave portion 4 matching the convex portion 2 on one side of the substrate 3. The resin 13 is not particularly limited, but examples of the thermoplastic molding material include polyethylene, polypropylene, polycarbonate, polyimide, polyamide, polyacetal, polyester, ABS, polyetherimide, and polyether sulfone. Engineering plastics such as polyphenylene sulfide and liquid crystal polymer can be used, and the same materials can be used in the following.

When the memory card A is manufactured using the memory card molded product 5 molded as described above, the following steps can be performed. That is, the substrate 3 is fitted into the memory card molded product 5 by inserting the above-described convex portion 2 of the substrate 3 into the recessed portion 4 of the memory card molded product 5. Then, the molding die 9 is opened as shown in FIG. 1 (a), and the memory card molded product 5 in which the substrate 3 is fitted as described above is set in the first cavity 10 of the first split mold 7. .

Next, the first split mold 7 and the second split mold 8 are brought close to each other to form a molding die 9 as shown in FIG. 1 (b).
The mold is clamped. After that, as shown in FIG. 1C, it is formed between the inner surface of the second cavity 11 of the second split mold 8 and the other side of the substrate 3 (the side not facing the memory card molded product 5). The resin 12 in a molten state is injected and filled in the voids 12. Here, even if the electronic component 1 having a large storage capacity and high-speed processing capability is mounted on the other side of the substrate 3, the electronic component 1 is separated from the inner surface of the second cavity 11 by at least 0.1. If the space 12 of about 0.3 mm is formed, it is easy to accommodate the substrate 3 and the electronic component 1 in the memory card A whose outer dimensions are standardized. That is, since the memory card molded product 5 having a thin portion with a thickness of 0.3 mm or less is fragile, it is difficult to mold it alone and handle it independently. In addition, it is easy to make the thickness of the void 12 0.3 mm or less, and therefore, it becomes possible to mount the electronic component 1 having a large-capacity storage capacity, etc. on the substrate. 12
The thin portion formed by filling the resin 13 with the resin 13 is
Since it is integrated with the substrate 3 and the electronic component 1 simultaneously with the curing of
Not only the pasting process of the molded products for memory cards 28 and 29 and the injection process of the filler as in the past are not required, but also a process in which a fragile thin portion having a thickness of 0.3 mm or less exists alone This eliminates the difficulty in manufacturing the memory card A.

When the molten resin 13 is injected, although not shown, for example, an injection port (gate) for the resin 13 is provided at a position facing the substrate 3 on the inner surface of the second cavity 11, and from this point By discharging the resin 13, the substrate 3 is pressed against the memory card molded product 5 by the injection pressure of the resin 13, and
It is preferable to fill the resin 13 with the resin. In this way, the first split mold 7 exists on the back surface of the substrate 3 via the memory card molded product 5, and the first split mold 7 supports the substrate 3 and the memory card molded product 5. Therefore, even if the substrate 3 and the molded product for a memory card 5 are thinly formed in order to mount the electronic component 1 having a large storage capacity and a high-speed processing capability, they may be deformed or damaged. There is nothing to do. Furthermore, when a minute gap is formed between the concave portion 4 of the molded product 5 for a memory card and the convex portion 2 of the substrate 3 inserted in the concave portion 4, the injection pressure of the resin 13 is appropriately adjusted. For example, the resin 13 can be made to wrap around to one side of the substrate 3 (the side facing the memory card molded product 5) to allow the resin 13 to penetrate into the above-mentioned gap. It is also possible to omit such a filling material injection step.

After filling the molten resin 13 as shown in FIG. 1C, the resin 13 is cooled and hardened, and then the first split mold 7 and the second split mold 8 are separated from each other. Manufacture is completed by opening the mold and demolding, and a molded product as shown in FIG.
Is what you can get.

By the above method, for games, music,
It is possible to manufacture a memory card A that can be used for various purposes such as for moving images and still images. It is not necessary to inject a filler for reinforcement into the gap inside the memory card A generated after attachment. That is, according to the present invention, the steps corresponding to these can be performed at one time, and the standardized memory card A can be efficiently manufactured. Moreover, the first of the molding dies 9 used in the present invention
The combination of the cavity 10 and the second cavity 11 is manufactured so as to have the standardized external dimensions of the memory card A. Within this range, a large volume of the electronic component 1 and the substrate 3 should be secured. Is something that can be done.

(Embodiment 2) FIG. 4 shows an example of steps for manufacturing a memory card A according to the invention of claim 3. The memory card A has a built-in substrate 3 on which the electronic component 1 is mounted and the convex portion 2 is formed. As such a substrate 3, the same one as in the first embodiment should be used. You can

The molding die 20 used for manufacturing the memory card A in the present invention is composed of a first split mold 16 and a second split mold 19 as shown in FIG. The molds 16 and 19 are arranged such that their parting surfaces (divided surfaces) face each other so that they can be clamped and opened.

Here, on the parting surface of the first split mold 16, two first cavities 14 and 15 are arranged in parallel.
These two first cavities 14 and 15 are the same as those in the first embodiment.
The same shape and size as the first cavity 10 of the first split mold 7 and the cavity 27 of the female split mold 25 in FIG. That is, as the first split mold 16 in the second embodiment, the one in which the first split mold 7 and the female split mold 25 in the first embodiment are formed adjacent to each other while their parting surfaces are flush with each other can be used. .

On the other hand, on the parting surface of the second split mold 19, the core portion 17 and the second cavity 18 are provided with the above-mentioned first portion.
The split mold 16 is arranged in parallel so as to face each of the two first cavities 14 and 15. The core portion 17 is formed similarly to the core portion 26 of the male mold 24 in the first embodiment, and the second cavity 18 is formed in the first embodiment.
It is formed similarly to the second cavity 11 of the second split mold 8 in FIG. That is, as the second split mold 19 in the second embodiment, it is possible to use the second split mold 8 and the split mold 24 in the first embodiment that are formed adjacent to each other with their parting surfaces flush with each other.

Further, in the molding die 20 of the second embodiment, at least one of the first split mold 16 and the second split mold 19 described above is rotatable in a plane perpendicular to the mold clamping / mold opening direction. The first split mold 16 and the second split mold 19 are rotated, or one or both of them are rotated, so that the core portion 17 of the second split mold 19 and the second cavity 1 are formed.
8 is the two first cavities 14, 1 of the first split mold 16.
It is arranged so that it can face any of the above items. In the following description, only the first split mold 16 is rotated, but the second split mold 19 may be rotated.

The manufacturing of the memory card A using the first split mold 16 and the second split mold 19 can be performed through the following first to fifth steps.

In the first step, one of the first cavities 14 is
(15) By inserting the convex portion 2 of the substrate 3 into the concave portion 4 of the memory card molded product 5 molded in (15), the substrate 3
To the memory card molded product 5. Therefore, it is necessary to mold the memory card molded product 5 in any of the first cavities 14 (15) of the first split mold 16 in advance. This should be molded in the same manner as in the first embodiment. You can That is, the first split mold 16 and the second split mold 19 which are separated as shown in FIG. 4A are brought close to each other to perform mold clamping, and then, as shown in FIG. 4B, the molten resin 13 is melted. Is injected and filled in one of the first cavities 14.
Then, the molded product for memory card 5 can be molded by cooling and hardening it. The molded product for memory card 5 thus obtained
Is formed with a concave portion 4 matching the convex portion 2 on one side of the substrate 3.

After opening the molding die 20,
By inserting the above-described convex portion 2 of the substrate 3 into the concave portion 4 of the memory card molded product 5 molded in one of the first cavities 14, the substrate 3 is molded into the memory card molded product 5.
Fit in.

In the second step, by rotating the first split mold 16 in the direction of the arrow in FIG. 4 (c), the first cavity 14 in which the memory card molded product 5 is molded is moved to the second split mold. After facing the second cavity 18 of 19, the first split mold 16 and the second split mold 19 are brought close to each other, so that the molding die 20 is clamped as shown in FIG. 4D.

In the third step, the following two operations are performed at the same time. That is, the first work is to fill the resin 21 in the molten state as shown in FIG. 4 (e) into the void 21 formed by the first cavity 14 and the second cavity 18 on which the memory card molded product 5 is molded. Memory card A
Is molded. That is, this operation can be performed in the same manner as in the case of manufacturing the memory card A by using the memory card molded product 5 in the first embodiment.
Therefore, it is easy to reduce the thickness of the thin portion to less than 0.3 mm, and the external dimensions of the memory card A are standardized.
It is possible to secure a large volume occupied by the electronic component 1 having a large storage capacity and the substrate 3 inside. Further, when injecting the molten resin 13, it is preferable to fill the resin 13 into the voids 21 while pressing the substrate 3 against the memory card molded product 5 by the injection pressure of the resin 13. Is similar to the case of the first embodiment. On the other hand, in the second work, the resin 13 in a molten state as shown in FIG. 4E is filled in the void 22 formed by the first cavity 15 and the core portion 17 on which nothing is molded.
Is injected and filled, and the molded product 5 for a memory card in which the concave portion 4 is formed by the core portion 17 is molded.
That is, this operation can be performed in the same manner as in the case of molding the memory card molded product 5 in the first embodiment.

In the fourth step, after the resin 13 is cooled and hardened, the molding die 20 is opened to remove the memory card A molded in the first cavity 14 and the second cavity 18. . At this time, the memory card A as shown in FIG. 3 can be obtained. The molded product 5 for the memory card molded by the first cavity 15 and the core portion 17 is kept in the first cavity 15.

In the fifth step, the molded product for memory card 5 is held in the first cavity 15 as shown in FIG.
By rotating the first split mold 16 in the direction of the arrow (f), the first cavity 15 in which the memory card molded product 5 is molded is made to face the second cavity 18 of the second split mold 19. In this way, by rotating the first split mold 16, the two first cavities 14, 15 are rotated.
In order to move the memory card molded product 5 molded in one of the first cavities 14 (15) to another first cavity 15 (14), both of them can face the second cavity 18. Therefore, it is possible to reliably prevent the deformation or damage of the memory card molded product 5 because the mold releasing work is unnecessary.

Then, the above-mentioned molded product for memory card 5
That is, the same operation as in the first step can be performed by fitting the new substrate 3 into the molded product 5 for the memory card molded in the one first cavity 15 in the third step. In the invention of item 3, in FIG.
The memory card A is continuously manufactured by repeating the above-mentioned first to fifth steps shown in (c) to (f).

By the method of manufacturing a memory card according to the third aspect of the present invention, it is possible to omit the conventional steps of attaching the molded products for a memory card 28, 29 and the step of injecting the filler. It is clear from the work from the first process to the fifth process. Moreover, in the third step,
By molding the memory card molded product 5 at the same time as molding the memory card A, the number of steps can be reduced and the manufacturing efficiency of the memory card A can be further improved.

[0036]

As described above, in the method of manufacturing a memory card according to claim 1 of the present invention, when manufacturing a memory card incorporating a substrate on which electronic parts are mounted and convex portions are formed, one of the substrates is Is inserted into the concave part of the molded product for memory card in which the concave part is formed so as to match the convex part on the side of And the second split mold is set in the first cavity of the first split mold, and after the mold is clamped, the inner surface of the second cavity of the second split mold and the other side of the substrate are separated. Since the molten resin is injected and filled into the space formed between them, it is easy to make the thin portion of the memory card thinner than 0.3 mm, and the external dimensions are standardized. Inside It is possible to secure a large electronic components and the substrate occupied volume, in which the implantation process as in the prior art memory card moldings of attaching step and the filler can be omitted.

According to the second aspect of the present invention, since the resin is filled in the voids while the substrate is pressed against the memory card molded product by the resin injection pressure, even if the substrate and the memory card molded product are thinly formed. These are supported by the first split mold, and can be prevented from being deformed or damaged.

In the method of manufacturing a memory card according to a third aspect of the present invention, in manufacturing a memory card having a substrate on which electronic parts are mounted and convex portions are formed, two first cavities are arranged in parallel. It is composed of a split mold and a second split mold in which a core portion and a second cavity are arranged in parallel so as to face each of the two first cavities, and
Clamping at least one of the first split mold and the second split mold
Using a molding die formed so as to be rotatable in a plane perpendicular to the mold opening direction, as a first step, a concave portion of a molded article for a memory card molded in one of the first cavities in a third step described later. The substrate is fitted into the molded product for memory card by inserting the convex portion of the substrate into the molded product for the memory card, and in the second step, the first cavity in which the molded product for the memory card is molded and the second cavity of the second split mold And the mold are clamped so that they face each other, and in the third step, a resin in a molten state is injected and filled into the void formed by the first cavity and the second cavity to mold the memory card. Molten resin is injected and filled into the cavity formed by 1 cavity and the core part to mold a molded product for a memory card in which the concave part is formed by the core part, and as the fourth step, the mold is opened. The memory card is molded in one cavity and the second cavity demolding, as a fifth step,
The memory card molded product is molded by rotating at least one of the first split mold and the second split mold in a state where the memory card molded product molded by the first cavity and the core is held in the first cavity. Since the first cavity of the other side is opposed to the second cavity of the second split mold and the above first to fifth steps are repeated to continuously manufacture the memory card, the thickness of the thin portion of the memory card can be reduced. It is easy to make it thinner than 0.3 mm, and it is possible to secure a large volume occupied by electronic parts and substrates inside the memory card whose outer dimensions are standardized.
It is possible to omit the conventional sticking process of the molded article for the memory card and the filling process of the filler. Moreover, in the third step, by molding the memory card molded product at the same time as molding the memory card, the number of steps can be reduced and the memory card manufacturing efficiency can be further improved.

[Brief description of drawings]

FIG. 1 shows an example of an embodiment of a method for manufacturing a memory card according to claim 1 of the present invention, in which (a) to (c) are cross-sectional views of respective steps.

FIG. 2 shows an example of a method for molding a molded product for a memory card used in the present invention, in which (a) to (c) are cross-sectional views of respective steps.

3A and 3B show a memory card manufactured according to the present invention, where FIG. 3A is a sectional view and FIG. 3B is a perspective view.

FIG. 4 shows an example of an embodiment of a method for manufacturing a memory card according to claim 3 of the present invention, in which (a) to (f) are cross-sectional views of respective steps.

FIG. 5 is an explanatory diagram showing a conventional method of manufacturing a memory card.

FIG. 6 is a view showing a molding die for molding a conventionally used molded product for a memory card, (a)
(B) is a sectional view.

[Explanation of symbols]

A memory card 1 electronic components 2 convex 3 substrates 4 recess 5 Molded products for memory cards 7 First split type 8 second split type 9 Mold 10 First cavity 11 Second cavity 12 voids 13 resin 14 First cavity 15 First cavity 16 First split type 17 core 18 second cavity 19 Second split type 20 Mold 21 void 22 void

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kouichi Shiraishi             2856 Shiratsuka-cho, Tsu-shi, Mie Asahi Electric Industrial Co., Ltd.             Inside the company (72) Inventor Masao Furukawa             2856 Shiratsuka-cho, Tsu-shi, Mie Asahi Electric Industrial Co., Ltd.             Inside the company (72) Inventor Masaaki Minamimura             2110 Nanjo, Nanjo, Sakagi-cho, Hanashina-gun, Nagano             Within Seisei Kogyo Co., Ltd. (72) Inventor Kunio Yubara             2110 Nanjo, Nanjo, Sakagi-cho, Hanashina-gun, Nagano             Within Seisei Kogyo Co., Ltd. (72) Inventor Fumiwa Nagaya             2110 Nanjo, Nanjo, Sakagi-cho, Hanashina-gun, Nagano             Within Seisei Kogyo Co., Ltd. (72) Inventor Takefumi Mizushima             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works             Within the corporation (72) Inventor Kazuo Hattori             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works             Within the corporation (72) Inventor Takahide Suzuki             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works             Within the corporation F-term (reference) 4F206 AH37 JA07 JB17 JQ81                 5B035 BA03 BB09 CA01

Claims (3)

[Claims] 1. When manufacturing a memory card having a built-in substrate on which electronic parts are mounted and convex portions are formed,
By inserting the convex portion of the substrate into the concave portion of the molded product for memory card in which the concave portion is formed so as to match the convex portion on one side of the substrate, the substrate is fitted into the molded product for memory card, and this is After the mold is set in the first cavity of the first mold of the mold composed of the one mold and the second mold and then the mold is clamped, the inner surface of the second cavity of the second mold and the other of the substrate are A method for manufacturing a memory card, characterized in that a resin in a molten state is injected and filled into a gap formed between the side and the side. 2. The method for manufacturing a memory card according to claim 1, wherein the void is filled with the resin while the substrate is pressed against the molded article for the memory card by the injection pressure of the resin. 3. In manufacturing a memory card having a built-in substrate on which electronic parts are mounted and convex portions are formed,
A first split mold in which two first cavities are arranged side by side, and a core part and a second split mold that face each of the two first cavities.
And a second split mold in which cavities are arranged side by side, and at least one of the first split mold and the second split mold is rotatably formed in a plane perpendicular to the mold clamping and mold opening direction. Using the molding die described above, as a first step, the substrate is molded for the memory card by inserting the convex portion of the substrate into the concave portion of the molded article for the memory card molded in one of the first cavities in the third step described later. Then, as a second step, the molding die is clamped so that the first cavity in which the molded product for the memory card is molded and the second cavity of the second split mold face each other, and the third step is performed. In the process, a resin in a molten state is injected and filled into the void formed by the first cavity and the second cavity to form a memory card, and a resin in a molten state is injected into the void formed by the first cavity and the core. A memory card molded product in which a recess is formed by the core portion is filled, and in a fourth step, the molding die is opened to release the memory card molded in the first cavity and the second cavity. As a fifth step, at least one of the first split mold and the second split mold is rotated in a state where the molded product for the memory card molded in the first cavity and the core part is held in the first cavity, and the memory card The first cavity on which the molded product for molding is formed faces the second cavity of the second split mold, and the above first to fifth steps are repeated to continuously manufacture a memory card. Memory card manufacturing method.