JP2003096416A - Oversheet for card and card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oversheet for a card having sufficient adhesive force to ink for offset printing and ink for silk screen printing, capable of corresponding to the variety of card designs, producible with a simplified process and free from a tack trouble, and provide a card laminated with the oversheet for the card. SOLUTION: The oversheet for card has a heat-sensitive adhesive layer on one surface of a substrate. The substrate is a rigid polyvinyl chloride sheet or a sheet made of a polymer composed mainly of a polymer selected from a polyester resin, a polycarbonate and a polymer alloy of a polyester resin and a polycarbonate. The adhesive constituting the heat-sensitive adhesive layer is an adhesive resin composition composed mainly of a polyamide resin produced by the condensation polymerization of a dimer acid and a diamine.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a magnetic card and an IC.
Regarding oversheets for cards such as cards and cards,
In particular, the present invention relates to an oversheet for a card that has good adhesion to a printing ink and a card in which this oversheet is laminated.

[0002]

2. Description of the Related Art A magnetic card or an IC card is manufactured by printing a white resin sheet generally called a core sheet, laminating a transparent oversheet to protect the printed surface, and thermocompression bonding. The printing on the core sheet is
Offset printing, silk screen printing, etc. The ink used for silk screen printing is vinyl chloride-
It has a vinyl acetate copolymer as a main component and is excellent in thermocompression bonding property with an oversheet made of a material such as vinyl chloride. On the other hand, offset printing is quick-drying and excellent in reproducibility of fine patterns, lines, characters, gradations, etc., and can be used for diversifying card designs. However, the ink used for offset printing is an ultraviolet curable ink containing epoxy acrylate, polyester acrylate, polyurethane acrylate, etc. as its main components, and is inferior in thermocompression bonding property with an oversheet made of a material such as vinyl chloride. Therefore, when using a vinyl chloride oversheet and offset printing on the core sheet to create a card, do halftone printing, silkscreen printing the edges of the card, or do not print. It was required to be kept innocent, and there were some restrictions on the design, which hindered the freedom to think of card designs. Further, it is also performed to improve the adhesiveness with the oversheet by applying a polyurethane-based adhesive to the printed surface, but a coating step for applying the adhesive, a drying step, an aging step, etc. are required, There is a problem that the manufacturing process becomes complicated and the productivity is lowered. Oversheets provided with an adhesive layer have also been developed, but not only the adhesiveness to offset printing ink is insufficient, but also the adhesiveness to silk screen printing ink decreases,
There was a problem such as a tack between sheets.

[0003]

The present invention has been made to solve the above problems, and an object of the present invention is to cope with diversification of card designs and to simplify the manufacturing process. Provided are a card oversheet having an adhesive layer which can be applied to the ink for offset printing and ink for silkscreen printing and does not cause tack, and a card in which the card oversheet is laminated. Especially.

[0004]

The card oversheet of the present invention is a card oversheet having a heat-sensitive adhesive layer on one surface of a substrate, wherein the substrate is a hard polyvinyl chloride sheet, or , A polyester resin, a polycarbonate, and a sheet having as a main component one selected from the group consisting of polymer alloys of a polyester resin and a polycarbonate, wherein the adhesive constituting the heat-sensitive adhesive layer is composed of dimer acid and diamine. It is characterized by comprising an adhesive resin composition containing a polyamide resin obtained by condensation polymerization as a main component. Here, the heat-sensitive adhesive resin composition may further contain an inorganic filler having an average particle size of 0.2 to 6 μm. The adhesive resin composition has an average particle size of 0.2 to 6 μm with respect to 100 parts by mass of the polyamide resin.
1 to 20% by mass of the inorganic filler can be contained.
Further, the adhesive resin composition may have a storage elastic modulus at a temperature of 40 ° C. and 10 Hz of 2 × 10 ⁷ Pa or more and 5 × 10 ⁹ Pa or less. The card of the present invention is characterized in that at least one surface of the core sheet is printed, and at least one of the above-mentioned card oversheets is laminated on the printed surface.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The oversheet for a card of the present invention has a heat-sensitive adhesive layer on one surface of a base material. The base material is a hard vinyl chloride sheet or polyester resin,
1 selected from the group consisting of polycarbonate and polymer alloys of polyester resin and polycarbonate
Is a sheet whose main component is, if necessary, stabilizers, lubricants, impact modifiers, colorants, antioxidants, fillers,
An ultraviolet absorber, an antiblocking agent, an antistatic agent, a processing aid and the like can be added within a range that does not impair the effects of the present invention. The thickness of the base material is preferably in the range of 0.03 to 0.25 mm, and more preferably 0.05 to 0.1.
It is preferably 2 mm. A hard polyvinyl chloride sheet or a sheet containing a polyester resin, a polycarbonate or a polymer alloy of a polyester resin and a polycarbonate as a main component is formed by calendering, extrusion molding or the like. In the present invention, it is preferable that the sheets constituting these base materials are transparent. This is because if the oversheet is transparent, the pattern, line, character, gradation, etc. on the printed surface of the core sheet can be recognized through the oversheet when a card is created by superimposing it on the printed surface of the core sheet. In the present invention, “transparent” means that the sheet having a thickness of 0.1 mm has a total light transmittance of 80% or more. JIS total light transmittance
It is measured based on K-7105.

Here, the polyester resin means a dehydration condensation product of an aromatic dicarboxylic acid component and a diol component,
Among them, those having low crystallinity, which do not cause white turbidity or defective fusion due to crystallization even when subjected to practically performed heat processing such as press fusion.

Typical examples of the dicarboxylic acid component preferably used in the present invention include terephthalic acid, isophthalic acid, adipic acid, naphthalenedicarboxylic acid, etc., but some of terephthalic acid is replaced with another dicarboxylic acid. May be. Other dicarboxylic acid components include oxalic acid,
Malonic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, neopentylic acid, isophthalic acid, naphthalenedicarboxylic acid, diphenyl ether dicarboxylic acid, p-oxybenzoic acid and the like can be mentioned. The other dicarboxylic acid component used may be one kind or a mixture of two or more kinds, and the amount of the other dicarboxylic acid to be substituted can be appropriately selected.

Typical examples of the diol component preferably used in the present invention include ethylene glycol, diethylene glycol, triethylene glycol, cyclohexanedimethanol and the like. However, a part of ethylene glycol is replaced with another diol component. Good. Other diol components include propylene glycol, trimethylene glycol, tetramethylene glycol, hexamethylene glycol, diethylene glycol, neopentyl glycol, polyalkylene glycol, 1,4-cyclohexanedimethanol, glycerin, pentaerythritol, trimethylol, methoxypolyethylene. Examples thereof include alkylene glycol. The other diol components used may be one kind or a mixture of two or more kinds,
Also, the amount of other diol to be substituted can be appropriately selected.

As the polyester resin used in the present invention, specifically, polyethylene terephthalate obtained by condensation polymerization of terephthalic acid and ethylene glycol is preferable from the viewpoint of cost, but dicarboxylic acid components other than terephthalic acid and Copolyesters containing diol components other than ethylene glycol and / or ethylene glycol can be used.

As the copolyester, 60 mol% or more of the dicarboxylic acid component is terephthalic acid, and 60 mol% or more of the diol component and the dicarboxylic acid component in which the remaining dicarboxylic acid component is replaced with another dicarboxylic acid component. A copolymerized polyester obtained by condensation-polymerizing ethylene glycol and a diol component in which the remaining diol component is substituted with another diol component is used. The polyester resin in the present invention may be a mixture of polyethylene terephthalate and the above copolymerized polyester. However, when a copolyester is used, caution is required because the glass transition temperature and the tensile elastic modulus of the sheet change greatly depending on the selection and content of the co-polymerization component.

As the copolyester which can be particularly preferably used, a substantially amorphous aromatic polyester resin obtained by substituting about 30 mol% of ethylene glycol in polyethylene terephthalate with 1,4-cyclohexanedimethanol is preferable, For example, the product name "PET-G" manufactured by Eastman Chemical Company can be obtained commercially.

The polycarbonate used as the material of the sheet base material of the present invention means a resin composition whose main component is polycarbonate. As the resin that can be mixed with the polycarbonate, for example, "PET-G"
Etc.

The polymer alloy of polyester resin and polycarbonate used as the material of the sheet base material is, for example, PET-based resin such as PET-
G or polybutylene terephthalate (hereinafter referred to as "PBT") is used, and a polymer alloy of this and polycarbonate is preferable. PBT is a dehydration condensation product of terephthalic acid and 1,4-butanediol, and may be a homopolymer or a copolymer. The composition ratio of the polyester-based resin and the polycarbonate of the polymer alloy can be appropriately set according to the purpose and the like, and it is desirable to design in consideration of the type and thickness of the card used.

The heat-sensitive adhesive layer constituting the card oversheet of the present invention is formed of an adhesive resin composition containing a polyamide resin as a main component. The polyamide resin is a polyamide resin produced by condensation polymerization of dimer acid and diamine, and has an amine value of 6 to 11,
It is a polyamide resin having an acid value of 2 or less and a softening point by the ring and ball method of 130 ° C. or more. As such a polyamide resin,
For example, a reaction product of a dimer acid, which is a dimer such as oleic acid or linolenic acid, and a diamine may be mentioned. Specifically, the product name "Versamide 973" manufactured by Cognis Japan Co., Ltd. and the product name "DX" manufactured by Nogawa Chemical Co., Ltd.
"607D" and the like can be obtained commercially. In addition,
Since an aliphatic diamine has poor adhesiveness, an aromatic diamine is preferable from the viewpoint of adhesiveness.

In the present invention, the heat-sensitive adhesive layer preferably further contains an inorganic filler having an average particle diameter of 0.2 to 6 μm, and particularly preferably an inorganic filler having an average particle diameter of 1 to 4 μm. preferable. If the average particle size is less than 0.2 μm, it is difficult to uniformly disperse it in the adhesive layer coating liquid, and if the average particle size is greater than 6 μm, it causes coloring of the heat-sensitive adhesive layer, and is produced. Cracks may occur when cards are embossed. The addition of the inorganic filler can increase the bonding strength and hardness of the adhesive, and can increase the peel strength between layers of the card formed by heat fusion. Further, when the rolled card oversheet is rewound or stacked in a sheet-like manner, it is possible to prevent the occurrence of tack between the sheets. The content of the inorganic filler is polyamide resin 10
It is preferably in the range of 1 to 20 parts by mass, and more preferably in the range of 5 to 15 parts by mass with respect to 0 parts by mass. If the content of the inorganic filler is less than 1 part by mass, the above effects may not be sufficiently exhibited. If the content of the inorganic filler is 20 parts by mass or less,
Adhesiveness and mechanical strength are not reduced, and the oversheet is not colored. Examples of the inorganic filler used in the present invention include silica, calcium carbonate, barium sulfate, talc, clay and the like. Among these, silica, calcium carbonate and talc are preferably used.

The heat-sensitive adhesive layer is prepared by dissolving the adhesive resin composition in a solvent and stirring it to obtain a uniform coating liquid, and coating one surface of the substrate with various coaters such as a roll coater, a blade coater and a gravure coater. It is formed by applying and drying. In the present invention, it is preferable to use a gravure coater because a uniform thin film heat-sensitive adhesive layer can be formed. The solvent used is not particularly limited, but for example, it is preferable to use a mixture of toluene, ethyl acetate, methyl ethyl ketone (MEK), isopropyl alcohol, ethanol, water and the like. The coating liquid has a solid content of 10% such as an adhesive resin composition.
It is preferably -40 mass% and a viscosity of 100-1000 cps, and a uniform thin film heat-sensitive adhesive layer can be formed by using the coating liquid thus adjusted. In the present invention, the thickness of the heat-sensitive adhesive layer is not particularly limited, but it is preferably 2 μm or more in consideration of adhesiveness, and 5 μm or less in consideration of printing distortion due to thermocompression bonding. Is preferred. In the present invention, the adhesive resin composition preferably has a storage elastic modulus at 40 ° C. and 10 Hz of 2 × 10 ⁷ Pa or more. If the storage elastic modulus is less than 2 × 10 ⁷ Pa, tack may be generated in the produced card oversheet, unwinding of the sheet wound in a roll shape, handling of sheets stacked in a sheet shape, etc. Becomes difficult. The storage elastic modulus of polyamide resin is usually 5 × 10 5.
^{It is 9} Pa or less. In the present invention, the storage elastic modulus of the film-shaped one is 0 at a vibration frequency of 10 Hz.
It is a value obtained by measuring the dynamic viscoelasticity in the range of 200 ° C. and obtaining the storage elastic modulus (unit Pa) at a temperature of 40 ° C. from the obtained data.

In the present invention, a card can be produced using the above card oversheet. For example, an image or the like is printed on at least one surface of a white core sheet by silk screen printing and / or offset printing, and the card oversheet of the present invention is laid on the printed surface so that the heat-sensitive adhesive layer is in contact therewith. Temporarily paste,
After that, the card can be formed by sandwiching it in a decorative plate and thermocompression bonding. The card of the present invention may have a structure in which a printing layer for images or the like is provided on one surface of the core sheet, and the above-mentioned card oversheet is laminated thereon, and the card overcoat is also provided on the other surface which is not printed. A structure in which sheets are laminated may be used. Further, the core sheet may have printing layers such as images on both sides, and both sides of the printing layers may be covered with the above card oversheet. It is also possible to form a magnetic stripe tape or the like on the above-mentioned card oversheet and then to bond it to the core sheet to produce a card. Generally, a card is formed by thermocompression bonding an oversheet for a card and a core sheet and then punching it into a card shape using a punching machine.

An embodiment of the card of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the configuration of the card of the present invention. An image or the like is printed on both surfaces of the core sheet 1 by silk screen printing and / or offset printing to form a printing layer 2. On the surface of the print layer 2, the card oversheet 3 of the present invention is thermocompression bonded. The card oversheet 3 is composed of an adhesive layer 4 and a base material 5.

[0019]

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. (Example 1) Polyamide resin A (manufactured by Cognis Japan Ltd., trade name "Versamide 973") was used, with an average particle size of 2
A solvent (toluene and isopropyl alcohol in a weight ratio of 50: 50) in which μm silica (trade name “Sylysia 350” manufactured by Fuji Silysia Chemical Ltd.) is previously dispersed.
50) to prepare a coating liquid for the adhesive layer. However, the solid content (polyamide resin A and silica) of the adhesive resin composition or the like is 25% by mass,
5 parts by mass of silica was added to 100 parts by mass of polyamide resin A. This coating solution was applied to a hard vinyl chloride sheet having a thickness of 0.1 mm using a gravure coater so that the dry film thickness was 4 μm, and dried to obtain a transparent card oversheet. The obtained oversheet for cards was evaluated for tackiness as shown below. Next, a printing layer was formed on one surface of the core sheet by offset printing, and a printing layer was formed on the other surface by silk screen printing. The obtained card oversheet was superposed on the surface of this printed layer so that the adhesive layer was on the inside, and sandwiched in a heat press machine at a temperature of 120 ° C. and 10 kgf / cm ²
After thermocompression bonding for 5 minutes at the pressure of
A card sheet having a structure of substrate / adhesive layer / silk screen printing layer / core sheet / offset printing layer / adhesive layer / substrate was prepared. Further, in order to obtain the peel strength from the core sheet, a core sheet without printing and a card oversheet were thermocompression bonded to produce a test sheet. The following evaluations were performed on the produced card sheet and test sheet.

Evaluation method: 1. Peel strength The peel strength test piece (peeling width 25 mm) for the offset ink and the printing layer by offset printing are separated by about 6 mm in advance,
The card oversheet and the core sheet are attached to the grips of the tester, and a 180-degree peel test is performed based on JIS-X6305. The peel strength (unit: N / 10 m)
m) was calculated. Peel strength against silk screen ink A peeling test strip (peeling width 25 mm) between the adhesive layer and the printed layer by silk screen printing is peeled in advance by about 6 mm, and the card oversheet and core sheet are held by the gripping part of the testing machine. And a 180 degree peel test based on JIS-X6305, and peel strength (unit: N / 1
0 mm) was calculated. Peel strength for core sheet Test piece (peel width: 25 mm) is preliminarily peeled by about 6 mm between the adhesive layer and the core sheet, and the card oversheet and the core sheet are attached to the grips of the tester respectively, and the JIS A 180-degree peel test was performed based on -X6305, and the peel strength (unit: N / 10 mm) was determined. 2. Evaluation of tackiness An oversheet for a card wound in a roll is placed at 40 ° C.
Was left in the gear oven for 24 hours and then the card oversheet was rewound, and it was observed whether a tack sound was generated or whether the adhesive was transferred to the sheet. If there is no noticeable tack sound and there is no adhesive transfer, the symbol "○" indicates that even if the tack sound occurs, a practical level "△" indicates whether a noticeable tack sound occurs. When the transfer of the adhesive was observed, it was indicated by "x". 3. Measurement of dynamic storage elastic modulus Dynamic viscoelasticity measuring device "Viscoelasticity Analyzer RSA-I"
I "(manufactured by Rheometrics Scientific FEE Co., Ltd.), a film-shaped product was measured at a vibration frequency of 10 Hz from 0 to 200 ° C, and the obtained data was stored at a temperature of 40 ° C. The elastic modulus (unit Pa) was determined.

Example 2 A transparent card oversheet was prepared in the same manner as in Example 1 except that the amount of silica added was changed to 10 parts by mass. The obtained oversheet for card was evaluated for tackiness in the same manner as in Example 1. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed on these. The results obtained are shown in Table 1.

(Example 3) An oversheet for a card was prepared in the same manner as in Example 1 except that the amount of silica added was changed to 18 parts by mass. The obtained oversheet for card was evaluated for tackiness in the same manner as in Example 1. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1.
The same evaluation as was done. The results obtained are shown in Table 1.

(Example 4) An oversheet for a card was prepared in the same manner as in Example 1 except that the amount of silica added was changed to 25 parts by mass. The obtained oversheet for card was evaluated for tackiness in the same manner as in Example 1. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1.
The same evaluation as was done. The results obtained are shown in Table 1.

Example 5 A transparent card oversheet was prepared in the same manner as in Example 1 except that silica was not added. The obtained oversheet for card was evaluated for tackiness in the same manner as in Example 1. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed on these. The results obtained are shown in Table 1.

(Example 6) An oversheet for a card was prepared in the same manner as in Example 1 except that the particle diameter of silica to be added was changed to 8 µm. The obtained oversheet for card was evaluated for tackiness in the same manner as in Example 1. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed on these. The results obtained are shown in Table 1.

(Comparative Example 1) An oversheet for a card was prepared in the same manner as in Example 1 except that the type of the polyamide resin was changed to the comparative polyamide resin B (aminocarboxylic acid condensation polymer). It was made. The obtained oversheet for card was evaluated for tackiness in the same manner as in Example 1. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1.
The same evaluation as was done. The results obtained are shown in Table 1.

(Example 7) A card was used in the same manner as in Example 1 except that the sheet base material was changed to PET-G (trade name "Diafix PG-C" manufactured by Mitsubishi Plastics Co., Ltd.). Created an oversheet for. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed on these. The results obtained are shown in Table 1.

Example 8 In Example 1, the sheet base material is a polymer alloy of polycarbonate and PBT (manufactured by Mitsubishi Plastics Inc., trade name "Diafix PA-C").
An oversheet for a card was prepared in the same manner as in Example 1 except that the above was changed to. Further, using the obtained card oversheet, a card sheet and a test sheet were prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed on these. The results obtained are shown in Table 1.

[0029]

[Table 1]

As is clear from Table 1, in Examples 1 to 8, it was found that good adhesive force was exhibited with respect to the ink such as offset ink and the core sheet, and it was possible to cope with diversification in card design. In addition, Examples 1 to 1
In No. 8, it was found that the tackiness was above the practical level. That is, even if the base material is a vinyl chloride-based material, it is possible to obtain a material having excellent adhesive strength with the offset ink. Further, even when the base material is a non-vinyl chloride-based material such as polyester resin or polycarbonate, it has excellent adhesion to printing ink and the like, and is excellent as a card sheet. On the other hand, in Comparative Example 1, it was found that there was a problem with the adhesive strength with the ink such as the offset ink and the tackiness was also inferior.

Next, the card sheets obtained in Examples 1 to 8 were evaluated for marking suitability. That is,
A card punched into a card shape was engraved with an embosser. At that time, it was observed whether or not whitening or cracking occurred. As for the cards using the card sheets of Examples 1 to 3, 5, 7, and 8, neither whitening nor cracking occurred, which was excellent. It was found that the card obtained from the card sheet of Example 4 showed imprintability and was practically usable although whitening was slightly generated. The card obtained from the card sheet of Example 6 sometimes had whitening or cracks. From this, Examples 1-3, 5, 7, 8
The oversheet for cards obtained in 1. has excellent adhesiveness with inks such as offset inks, does not cause tack even when stacking oversheets for cards, and the obtained cards should be embossed well. I found out that

[0032]

As described above, according to the present invention, it has sufficient adhesive force to both the ink for offset printing and the ink for silk screen printing, and can cope with the diversification of card designs. Thus, it is possible to provide a card oversheet that can simplify the manufacturing process and does not cause tack. Also, by stacking this card oversheet, it is possible to provide a card having excellent adhesion to printing ink.

[Brief description of drawings]

FIG. 1 is a cross-sectional view schematically showing a configuration of one aspect of a card of the present invention.

[Explanation of symbols] 1 core sheet 2 printing layers Oversheet for 3 cards 4 Thermosensitive adhesive layer 5 base materials

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 HA17 KA01 KA07 KA38 KA40                       LA03 LA11                 4J004 AA16 AB01 CA06 CB03 CC02                       FA04 FA05                 4J040 EG021 HA006 JA09 JB09                       KA03 MA10 MB03 NA19 NA20                       PA23

Claims (5)

[Claims] 1. An oversheet for a card having a heat-sensitive adhesive layer on one surface of a base material, the base material being a hard polyvinyl chloride sheet, or a polyester resin, a polycarbonate, and a polyester resin and a polycarbonate. Is a sheet containing as a main component one selected from the group consisting of polymer alloys, wherein the adhesive constituting the heat-sensitive adhesive layer is a polyamide resin obtained by condensation polymerization of dimer acid and diamine as a main component. An oversheet for a card, which comprises an adhesive resin composition contained as. 2. The adhesive constituting the heat-sensitive adhesive layer is made of an adhesive resin composition further containing an inorganic filler having an average particle diameter of 0.2 to 6 μm. Oversheet for cards. 3. The adhesive resin composition contains 1 to 20% by mass of an inorganic filler having an average particle size of 0.2 to 6 μm with respect to 100 parts by mass of the polyamide resin. Or an oversheet for a card according to 2. 4. The adhesive resin composition has a temperature of 40 ° C.,
Storage elastic modulus at 10 Hz is 2 × 10 ⁷ Pa or more, 5
It is x10 < ⁹ > Pa or less, The Claims 1-3 characterized by the above-mentioned.
An oversheet for a card according to any one of 1. 5. A card, wherein at least one surface of a core sheet is printed, and the card oversheet according to any one of claims 1 to 4 is laminated on at least the printed surface.