JP2003096299A5 - Composite molded body - Google Patents
Composite molded body Download PDFInfo
- Publication number
- JP2003096299A5 JP2003096299A5 JP2001290800A JP2001290800A JP2003096299A5 JP 2003096299 A5 JP2003096299 A5 JP 2003096299A5 JP 2001290800 A JP2001290800 A JP 2001290800A JP 2001290800 A JP2001290800 A JP 2001290800A JP 2003096299 A5 JP2003096299 A5 JP 2003096299A5
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- resin
- composite
- composite molded
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 description 6
- 229920000069 poly(p-phenylene sulfide) Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 239000000395 magnesium oxide Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000000805 composite resin Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Description
【特許請求の範囲】
【請求項１】（ａ）ポリフェニレンスルフィド樹脂１００重量部に対して、（ｂ）酸化マグネシウム２．５〜９０重量部を配合してなる、シリコン樹脂複合用樹脂成形体用ポリフェニレンスルフィド樹脂組成物を成形してなる成形品と、（ｃ）シリコン樹脂とが接着して複合されたものである複合成形体。
【請求項２】上記（ｂ）酸化マグネシウムの平均粒子径が２．０μｍ以下である請求項１記載の複合成形体。
【請求項３】上記（ｂ）酸化マグネシウムの純度が９８．５％以上である請求項１または２記載の複合成形体。
【請求項４】上記（ｃ）シリコン樹脂が、白金触媒を含む付加型液状シリコンゴムである請求項１〜３のいずれか記載の複合成形体。
【請求項５】該複合成形体が、電気部品、機械部品、または自動車部品用である請求項４〜６のいずれかに記載の複合成形体。
[Claims]
Respect 1. A (a) polyphenylene sulfide resin 100 parts by weight, the (b) by blending of magnesium oxide 2.5 to 90 parts by weight, silicone resin composite resin molded body polyphenylene sulfide resin composition A composite molded article in which a molded article obtained by molding and (c) a silicone resin are bonded and composited.
2. The composite molded article according to claim 1, wherein said magnesium oxide (b) has an average particle size of 2.0 μm or less.
3. The composite molded article according to claim 1, wherein said magnesium oxide (b) has a purity of 98.5% or more.
4. The composite molded article according to claim 1 , wherein the silicone resin (c) is an addition-type liquid silicone rubber containing a platinum catalyst.
Wherein said composite shaped body, electrical components, mechanical components, or composite molded body according to any one of claims 4-6, which is used for automobile parts.
【０００１】
【発明の属する技術分野】
本発明は、例えばパワーモジュール用部品などのように、シリコン樹脂を用いて部品を接着するため、シリコン良接着性が要求される用途に有用な樹脂成形体用ポリフェニレンスルフィド樹脂組成物からなる複合成形体に関するものである。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a composite molding comprising a polyphenylene sulfide resin composition for a resin molded body useful for applications requiring good silicon adhesion, for example, for bonding components using a silicone resin, such as a power module component. It is about the body .
本発明は、かかる従来技術の背景に鑑み、優れたシリコン接着性を有するシリコン樹脂と複合して用いられる樹脂成形体用ＰＰＳ樹脂組成物からなる成形体を提供せんとするものである。 The present invention, the conventional view of the art of the background, is to St. provide a molded body made of a resin molded body PPS resin composition to be used in combination with silicone resins having excellent silicone adhesive.
【０００８】
【課題を解決するための手段】
本発明は、かかる課題を解決するために、次のような手段を採用するものである。すなわち、本発明は、（ａ）ポリフェニレンスルフィド樹脂１００重量部に対して、（ｂ）酸化マグネシウム２．５〜９０重量部を配合してなる、シリコン樹脂複合用樹脂成形体用ポリフェニレンスルフィド樹脂組成物を成形してなる成形品と、（ｃ）シリコン樹脂とが接着して複合されたものである複合成形体である。
[0008]
[Means for Solving the Problems]
The present invention employs the following means in order to solve such a problem. That is, the present invention provides a polyphenylene sulfide resin composition for a resin molded product for a silicon resin composite, comprising (b) 2.5 to 90 parts by weight of magnesium oxide with respect to (a) 100 parts by weight of a polyphenylene sulfide resin. And (c) a silicone resin bonded and composited.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001290800A JP4997677B2 (en) | 2001-09-25 | 2001-09-25 | Composite molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001290800A JP4997677B2 (en) | 2001-09-25 | 2001-09-25 | Composite molded body |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003096299A JP2003096299A (en) | 2003-04-03 |
| JP2003096299A5 true JP2003096299A5 (en) | 2008-11-13 |
| JP4997677B2 JP4997677B2 (en) | 2012-08-08 |
Family
ID=19113050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001290800A Expired - Lifetime JP4997677B2 (en) | 2001-09-25 | 2001-09-25 | Composite molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4997677B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096298A (en) * | 2001-09-25 | 2003-04-03 | Toray Ind Inc | Polyphenylene sulfide resin composition and condenser part |
| WO2013125495A1 (en) * | 2012-02-23 | 2013-08-29 | 東レ株式会社 | Thermoplastic resin composition and molded article |
| JP6145774B2 (en) * | 2013-08-07 | 2017-06-14 | パナソニックＩｐマネジメント株式会社 | Illumination light source and illumination device |
| DE102014219971A1 (en) * | 2014-10-01 | 2016-04-07 | Albis Plastic Gmbh | Polyphenylene sulfide with high creep resistance |
| CN114630879A (en) * | 2019-10-29 | 2022-06-14 | 迈图高新材料日本合同公司 | Polyorganosiloxane composition for bonding polyphenylene sulfide resin |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3384816B2 (en) * | 1992-03-30 | 2003-03-10 | 株式会社海水化学研究所 | Composite metal oxide-containing resin composition and method for producing the oxide |
| JPH0711136A (en) * | 1993-06-29 | 1995-01-13 | Dainippon Ink & Chem Inc | Polyarylene sulfide resin composition |
| JP3481326B2 (en) * | 1994-11-30 | 2003-12-22 | 松下電工株式会社 | Semiconductor pressure sensor and method of manufacturing the same |
| JP3610990B2 (en) * | 1995-03-31 | 2005-01-19 | 大日本インキ化学工業株式会社 | Polyarylene sulfide with excellent adhesion |
| JP3556996B2 (en) * | 1995-04-03 | 2004-08-25 | 大日本インキ化学工業株式会社 | Polyarylene sulfide with excellent adhesion |
| JP3962119B2 (en) * | 1997-03-31 | 2007-08-22 | 株式会社きもと | Multilayer printed wiring board manufacturing sheet |
| JP3821633B2 (en) * | 1999-08-06 | 2006-09-13 | 協和化学工業株式会社 | Resin composition containing magnesium oxide particles having high acid resistance and high hydration resistance |
-
2001
- 2001-09-25 JP JP2001290800A patent/JP4997677B2/en not_active Expired - Lifetime
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