JP2003094208A - MEMBER CLAD WITH FILM OF TiAl COMPOUND, AND MANUFACTURING METHOD THEREFOR - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a member clad with the film of a TiAl compound more excellent in cutting performance such as wear resistance or the like than a member clad with the film of a conventional TiAl compound since high efficiency in machining has been requested recently. SOLUTION: The film of the TiAl compound is used to clad by making the adjustments on increasing after decreasing the voltage of a base material impressed between a vacuum container and the base material successively and/or stepwise in the range of -20 to -300 V during a process for forming the film of the TiAl compound. The cutting performance, such as wear resistance and chipping resistance, is high in comparison with a conventional product since residual compressive stress and oxidation resistance are high in the member clad with the film of the TiAl compound made in this way and an excellent adherent cladding is used to clad.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a member coated with a TiAl compound film.

[0002]

2. Description of the Related Art To improve the characteristics of tools and wear-resistant parts (T
A hard film coated member in which i, Al) N is formed on a metal material or a cemented carbide is widely used. In recent years, in order to improve the coating properties and the adhesion to a substrate, Japanese Patent Application Laid-Open No. 3-1
88265, JP-A-6-316756, and JP-A-8-267306 are proposed.

[0003]

[Patent Document 1] Japanese Patent Application Laid-Open No. 3-18826
No. 5 discloses that Ti is directed from the surface of the base material toward the surface of the coating layer.
Although a coating layer has been proposed which is changed from the above-mentioned carbide, nitride or carbonitride of Ti to Al alloy Ti _1-x Al _x (0 <x ≤ 0.7), nitride or carbonitride. However, since the residual compressive stress of the coating layer is low, fracture resistance and abrasion resistance cannot be sufficiently secured. Japanese Unexamined Patent Publication No. 6-316756 discloses a TiAlN film having a laminated structure in which the atomic concentration of Al is 0.6 or less and three or more layers of TiAlN films having different Al concentrations are formed. The Al concentration in the intermediate coating is above and below T
A corrosion-resistant and wear-resistant coating characterized by including a layer smaller than the iAlN coating has been proposed, but when used in a cutting tool, the coating is easily peeled off, and thus sufficient performance cannot be obtained. In Japanese Patent Laid-Open No. 8-267306, the TiAl compound layer coated on the surface of the substrate is Ti / A of the TiAl compound layer.
A hard layer-coated cutting tool has been proposed which is characterized in that the l atomic ratio (hereinafter referred to as Ti / Al ratio) changes in a direction parallel to the surface of the base material and is highest at the edge portion. . Although the coating composition of the edge ridge is different from that of the edge ridge in the area exceeding 2 mm width from the edge ridge, when used as a cutting tool, the Ti / Al ratio of the TiAl compound layer is high at the edge ridge where the temperature rises and the coating is oxidized. However, even if the surface of the TiAl compound layer is coated with TiN, the wear resistance of TiN is inferior and Ti / Al
Since the TiAl compound layer having a high ratio is exposed, the problem remains that it is easily oxidized. Therefore, an object of the present invention is to develop a TiAl compound film-covered member having high adhesion and excellent oxidation resistance and hardly chipped, and a method for manufacturing the same.

[0004]

Means for Solving the Problems As a result of various studies on means for increasing the strength and adhesion of a TiAl compound film, the inventor has found that
The TiAl compound film is adjusted by continuously and / or stepwise decreasing and then increasing the substrate voltage applied between the vacuum container and the substrate during the TiAl compound film forming step. It was found that the member coated with shows excellent properties.

The feature of the method for producing a TiAl compound film-coated member of the present invention is to control the substrate voltage during coating of the TiAl compound film, and the TiAl produced under the production conditions of the present invention.
The distribution of the ratio of Ti and Al contained in the compound film is characteristic. At least a first film layer having a maximum Ti / Al ratio when a TiAl compound film is formed on a substrate having a shape having at least one edge ridge and a second film layer having a Ti / Al ratio smaller than that of the first film layer are formed. A TiAl compound film composed of a two-layered multilayer film is formed in the vicinity of the edge ridge, and a TiAl compound film having a constant Ti / Al ratio in the central portion of the surface of the TiAl compound film excluding the vicinity of the edge ridge is formed. It When used as a cutting tool, the TiAl compound film in the vicinity of the edge ridge is composed of three layers in which the first film layer is sandwiched by the second film layer in the film thickness direction. When the Ti / Al atomic ratio of the second film layer is expressed as A and B, 0.90 ≦ A ≦ 2.00 and 0.82 ≦ B
A TiAl compound film coated member with ≦ 1.50 is preferred.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION A shape having at least one edge ridge is, for example, JIS standard B4104-1989,
The standard B4114-1993, the standard B4115-19
93, the standard B4116-1987, the standard B4117
-1991, the standard B4120-1985, the standard B4
121-1985, the standard B4122-1985, and the tools shown in the standard B4123-1985, can manufacturing tools, cold working dies, and hot working dies.

The TiAl compound film is formed by physical vapor deposition (hereinafter PV
It is preferably made by the method D), but PVD
Among the methods, the arc ion plating method is particularly preferable because it has excellent adhesion. Examples of the method for producing the product of the present invention include a method of coating using two or more targets having different compositions and a method of changing the substrate voltage between the vacuum container and the substrate during coating. When producing the product of the present invention by the method, it is necessary to prepare two or more kinds of targets having different compositions,
Since the parameters are frequently changed during coating, the process is complicated and technically very difficult. When the product of the present invention is produced by the method, the product of the present invention can be obtained by controlling the parameters during coating by using a minimum number of targets, basically one type of target.
This is preferable because the process is simplified.

The method will be described in detail. The first step is a PVD coating step in which the base material is placed in a vacuum container in which the gas atmosphere can be adjusted, and the base material is heated by evacuating the vacuum container and then heating the base material. When roughly divided into a second step of etching a surface into a gas atmosphere for forming a film in a vacuum container and a third step of accelerating ions with a high voltage power source in a plasma atmosphere when forming a film, T in the third step
The product of the present invention can be obtained by adjusting the substrate voltage to be continuously and / or stepwise lowered and then raised during the step of coating the iAl compound film.

The coating film produced under the condition that the substrate voltage is increased has a smaller residual compressive stress than the film produced under the condition that the substrate voltage is decreased, and is advantageous for improving the adhesiveness. There is little diffusion and in fact the adhesion is low. When the TiAl compound film of one layer is roughly divided into three parts in the thickness direction, the part close to the base material is the base material side, the part sandwiched vertically is the intermediate part, and the part close to the surface is the front surface side.
When the base material side of the l-compound film is coated under the condition that the base material voltage is low, the coating temperature is high, so that thermal diffusion occurs and it is advantageous for improving the adhesiveness, but it is not preferable because it is easily peeled off due to strong residual compressive stress. In the TiAl compound film coating step of the present invention, when the TiAl compound film is coated on the substrate side, the substrate voltage is set to −20 to −40 V and a film having a small residual compressive stress is coated.

Then, during the step of coating the intermediate portion of the TiAl compound film, the substrate voltage is changed as shown in FIGS.
The voltage is continuously and / or stepwise lowered from 20 to -40V to -200 to -300V. The film produced under the condition of low substrate voltage has a higher residual compressive stress than the film produced under the condition of high substrate voltage. Substrate voltage is -20 to -40V
If the voltage is suddenly or discontinuously reduced to −200 to −300 V, the possibility of peeling between the base material side and the intermediate portion increases. This is considered to be due to the high residual compressive stress in the middle part. As in the present invention, the substrate voltage is -20 to -40V.
From −200 to −300 V continuously and / or stepwise, the residual compressive stress of the TiAl compound film increases continuously and / or stepwise, so that peeling between the base material side and the intermediate portion is difficult. Become. The middle portion of the TiAl compound film having a high residual compressive stress has excellent fracture resistance and wear resistance. Further, when the coating film is coated under the condition that the substrate voltage is low, the kinetic energy of ions increases, so that the coating temperature rises and the ion implantation effect increases. The high temperature and ion implantation effect that occur when coating the intermediate portion of the TiAl compound film is T
It also affects the base material side of the iAl compound film, and the adhesion on the base material side of the TiAl compound film is increased due to the temperature increase and the ion implantation effect. This is called the thermal spike effect.

The substrate voltage also affects the composition of the TiAl compound film. TiAl coated under conditions of high substrate voltage
Although the Ti / Al ratio of the compound film is uniform, when the TiAl compound film is coated under the condition that the base material voltage is low, the T of the TiAl compound film in the region 2 mm beyond the edge ridgeline in the surface direction is
2mm width from edge ridgeline in the surface direction compared to i / Al ratio
The Ti / Al ratio of the TiAl compound film in the region within becomes high. This is called the edge effect. The hardness and oxidation resistance of the TiAl compound film are highest when the Ti / Al ratio is around 0.7, and when it becomes Ti-rich or Al-rich than that, the hardness and oxidation resistance of the TiAl compound film decrease. The Ti / Al ratio of the TiAl compound film of the present invention is 0.7 or more, and as the Ti / Al ratio increases, hardness and oxidation resistance decrease. Therefore, if the substrate voltage is reduced to cover, the width of 2 mm from the edge ridgeline in the surface direction due to the edge effect.
There is a concern that the hardness may decrease due to the increase in the Ti / Al ratio of the TiAl compound film in the area within, but in reality, the residual compressive stress increases, so the apparent hardness increases and the wear resistance improves. . The fracture resistance also improves because the residual compressive stress increases.

Next, the substrate voltage is increased from -200 to -300V to -20 to -40V. The surface side of the TiAl compound film is coated under the condition that the substrate voltage is increased. The surface side of the TiAl compound film where the edge effect has almost disappeared is T
i / Al ratio becomes uniform and width is 2m from edge ridge in the surface direction
Oxidation resistance of the region within m is improved. Further, since the Ti / Al ratio is uniform, the color tone of the surface of the coating becomes uniform and the corners used can be easily identified.

In order to have the above functions, TiAl
During the process of coating the compound film, the substrate voltage is continuously and / or
Or gradually lower it and then raise it. By observing the cross section of the product of the present invention, it can be confirmed that the Ti / Al ratio of the intermediate portion of the TiAl compound film in the region within 2 mm width from the edge ridgeline in the surface direction is high. If the TiAl compound film has a thickness of about several μm, it may be confirmed by optical microscope observation.

When the substrate voltage is less than -20 V, the kinetic energy of the ions decreases, and the adhesion of the TiAl compound film decreases. If the substrate voltage exceeds -300 V, the residual compressive stress of the TiAl compound film becomes too high and chipping easily occurs. Therefore, the range of substrate voltage is -20 to -3
It was set to 00V. The arc voltage is 35 to 45 V, the arc current is 130 to 170 A, and the nitrogen source is N ₂ = 160 to ₂
20 SCCM is preferred. The metal raw material target is better than the Ti target and the Al target separately mounted.
It is preferable to mount a target containing Al and Al at the same time, and the atomic ratio of Ti and Al contained in the target is preferably 0.8 <Ti / Al ratio <1.2.

As described above, Ti / A of the TiAl compound film
The l ratio affects the hardness and oxidation resistance of the coating. Ti
The hardness and oxidation resistance of the Al compound film are such that the Ti / Al ratio is 0.7.
Highest near, Ti-rich or Al higher than that
When the TiAl compound film becomes rich, the hardness and oxidation resistance of the TiAl compound film decrease. If the Ti / Al ratio exceeds 2.00, the desired hardness cannot be obtained, and if the Ti / Al ratio is 0.82 or less, the possibility of forming a TiAl compound film having a low hardness and a hexagonal structure increases. . Therefore, the Ti / Al ratio of the TiAl compound film is preferably 0.82 ≦ Ti / Al ratio ≦ 2.00, and the TiAl compound film in the vicinity of the edge ridge line has the first film layer and the second film layer in the film thickness direction. In the case of a three-layer structure sandwiched by, the first film layer having a high Ti / Al ratio due to the edge effect is preferably 0.90 ≦ Ti / Al ratio ≦ 2.00, and the second film layer which does not cause the edge effect is 0.82 ≦ Ti / Al ratio ≦
1.50 is preferable.

The TiAl compound film is a TiAl compound film containing at least one of nitrides, carbides, carbonitrides, carbon oxides, oxynitrides and carbonitrides containing Ti and Al. Among them, (Ti _x , Al _y ) N _z , x is the atomic ratio of Ti in the metallic element, y is the atomic ratio of Al in the metallic element, and z is the atomic ratio of N with respect to the total of Ti and Al, each of which is x + y. = 1, 0.66 ≧ x ≧ 0.46,
A TiAl compound film satisfying the relations of 0.54 ≧ y ≧ 0.34 and 1.05 ≧ z ≧ 0.7 is preferable. When Z exceeds 1.05, the TiAl compound film includes a coating film having a structure other than the cubic structure, so that the hardness decreases. When Z is less than 0.7, the number of holes in the TiAl compound film increases, so that the hardness decreases.

As the TiAl compound film, (Ti _x , A
l _y ) N _z in addition to the third metal component (Ti _a , A
_Ib , _Mc ) _Nd is also good. Specifically, (Ti _a , Al _b ,
M _c ) N _d , where M is Zr, Hf, V, Nb, Ta,
Cr, Mo, W, Si, B, Mg, Fe, Sn, Mn,
Sc, Y, or at least one of lanthanum rare earth elements, where a is the atomic ratio of Ti to the total of Ti, Al and M, b is the atomic ratio of Al to the total of Ti, Al and M,
c is the atomic ratio of M to the total of Ti, Al and M, and d is T
The atomic ratio of N to the sum of i, Al and M is represented by a + b + c = 1, 0.66 ≧ a ≧ 0.32, 0.5.
4 ≧ b ≧ 0.24, 0.3 ≧ c ≧ 0, 1.05 ≧ d ≧
A TiAl compound film having a relationship of 0.7 is also preferable. Among them, M is V, Nb, Ta, Cr, Mo, W, Y, Mn
Among them, at least one is particularly preferable because it has good wear resistance. When the atomic ratio C of the third metal component exceeds 0.3, the crystallinity of the (Ti _a , Al _b , M _c ) N _d coating decreases, so it was determined that 0.3 ≧ c ≧ 0.

As the base material for coating the TiAl compound film, there is no problem as long as it can be coated by the PVD method.
In particular, it is preferable to coat a ferrous metal material, a non-ferrous metal material, a cemented carbide, a cermet, a ceramics, or an ultra-high pressure sintered body because the abrasion resistance and the oxidation resistance are increased. Among them, the use of cemented carbide or cermet as the base material is more preferable because the base material can have toughness and the TiAl compound film can have abrasion resistance and oxidation resistance. Any shape may be used as long as it is a substrate having at least one edge ridge line, and among them, it is preferable to apply the present invention to a cutting tool such as a throw-away tip, an end mill, a drill or the like, because the effect is high.

When the substrate is coated with the TiAl compound film of the present invention, it may be directly coated, but TiN, TiC, T
(C, N), Ti (C, O), Ti (N, O), Ti
A Ti compound such as (C, N, O) or a metal film such as Ti may be used as the lower layer film, and the TiAl compound film of the present invention may be used as the upper layer film. Further, the TiAl compound film of the present invention may be laminated and covered to form a multilayer film of two or more layers. In addition, in order to improve the appearance color, TiN, TiC,
T (C, N), Ti (C, O), Ti (N, O), Ti
A Ti compound film such as (C, N, O) or a metal film such as Ti may be coated as the outermost layer film.

[0020]

DETAILED DESCRIPTION OF THE INVENTION

[Practice Test 1] A throwaway tip of ISO standard SNGA120408 shape was prepared using WC cemented carbide corresponding to K10 as a base material, and the surface was washed with an alkaline detergent. The throw-away tip was installed in a vacuum furnace and evacuated. When the pressure in the vacuum furnace became 1.33 × 10 ^-2 Pa or less, as shown in Table 1, heating was performed up to a set temperature of 500 ° C. After confirming that the pressure returned to 1.33 × 10 ^-2 Pa or less, the PVD coating treatment was performed by setting the etching and coating conditions shown in Table 1.

[0021]

[Table 1] Note 1) Arc voltage between anode and cathode of evaporation source Note 2) Substrate voltage between substrate and vacuum vessel Note 3) Substrate voltage from -40V to -300V over 50 minutes
Fell continuously until.

TiAl in the target column used is (Ti, A
l) = 50: 50 (atomic ratio) of the target, Ti
Indicates a Ti target. Film thickness of manufactured sample and Ti
The / Al ratio is shown in Table 2.

[0023]

[Table 2]

The produced Examples 1-2 and Comparative Examples 1-3
A scratch test was performed using a Rockwell diamond indenter to measure the critical load (scratch strength) at which the coating near the edge ridge peels off. Further, S48C (HB205 to 223) is used as the work material, and the cutting speed is V
= 150 m / min, incision: d = 1.5 mm, feed: f = 0.3 mm / rev. A cutting test with a lathe was performed for 20 minutes under the cutting conditions of using water-soluble cutting oil. Table 3 shows the scratch strength and the flank wear amount V _B after the cutting test. As shown in Table 3, Examples 1 and 2 have higher scratch strength than Comparative Examples 1 to 3, and the flank wear amount V _B
Is also small. From this, it can be seen that Examples 1 and 2 have higher adhesion between the coating film and the substrate than Comparative Examples 1 to 3 and are less likely to be worn.

[0025]

[Table 3]

[0026]

[Practical test 2] The same test as in practical test 1 was conducted except that TiAlY was used as the target and coating was performed under the conditions shown in Table 4.

[0027]

[Table 4] Note 1) Arc voltage between anode and cathode of evaporation source Note 2) Substrate voltage between substrate and vacuum container Note 3) Substrate voltage from -30V to -200V over 10 minutes
Fell continuously until. Note 4) The substrate voltage was continuously increased from -200V to -30V over 5 minutes.

TiAlY in the target column used is (Ti,
Al, Y) = 45: 45: 10 (atomic ratio) of the target was shown, and Ti was the Ti target. Table 5 shows the film thickness and the Ti / Al ratio of the prepared sample. Note that the atomic ratio of Y was not significantly changed by the substrate voltage in any of the examples and comparative examples. For example, when the intermediate portion (Ti, Al, Y) N film of Example 3 is analyzed, the atomic ratio of metal components in the vicinity of the edge ridge is (Ti, Al, Y) = 50.
4: 39.6: 10, width 2mm from edge ridge in the surface direction
The atomic ratio of metal components in the region exceeding is (Ti, Al, Y) =
47.9: 42.1: 10, and when the intermediate portion (Ti, Al, Y) N film of Comparative Example 4 was analyzed, the metal component atomic ratio in the vicinity of the edge ridgeline was (Ti, Al, Y) = 50.
4: 39.6: 10, width 2mm from edge ridge in the surface direction
The atomic ratio of metal components in the region exceeding is (Ti, Al, Y) =
It was 47.9: 42.1: 10.

[0029]

[Table 5]

Scratch strength measurement and cutting test were performed on Example 3 and Comparative Example 4 in the same manner as in the field test 1, and the results are shown in Table 6.

[0031]

[Table 6]

As shown in Table 6, Examples 3 and 4 have higher scratch strength than Comparative Examples 4 and 5, and the flank wear amount V
_{B is} also small. Therefore, Examples 3 and 4 are Comparative Examples 4 and 5.
It can be seen that the adhesiveness between the coating film and the substrate is higher than that and the abrasion resistance is excellent.

[0033]

[Practical test 3] The same test as in practical test 1 was conducted except that TiAlMnCr was used as the target and coating was performed under the conditions shown in Table 7.

[0034]

[Table 7] Note 1) Arc voltage between anode and cathode of evaporation source Note 2) Substrate voltage between substrate and vacuum vessel Note 3) After lowering substrate voltage from -35V to -70V, hold at -70V for 4 minutes Then, after decreasing from -70V to -100V, it is kept at -100V for 4 minutes, and after decreasing from -100V to -150V, it is kept at -150V for 4 minutes,
After dropping from -150V to -200V, the temperature was kept at -200V for 4 minutes, and after dropping from -200V to -300V, held at -300V for 4 minutes.

TiAlMnCr in the used target column indicates a target of (Ti, Al, Mn, Cr) = 45: 45: 5: 5 (atomic ratio). Film thickness of prepared sample and T
The i / Al ratio is shown in Table 8. When the substrate voltage was lowered, the Mn atomic ratio in the vicinity of the edge ridgeline increased as in Ti, and the Cr atomic ratio in the vicinity of the edge ridge decreased as in Al. For example, when the (Ti, Al, Mn, Cr) N film near the edge ridge line in Example 5 is analyzed in the depth direction, the atomic ratio of metal components on the substrate side is (Ti, Al, M).
n, Cr) = 46.1: 43.9: 4.2: 5.8, the atomic ratio of metal components in the middle part is (Ti, Al, Mn, Cr)
= 51.1: 38.9: 4.6: 5.4, the atomic ratio of metal components on the surface side is (Ti, Al, Mn, Cr) = 46.1:
43.9: 4.2: 5.8, and when the (Ti, Al, Mn, Cr) N film in the vicinity of the edge ridge was analyzed in the depth direction for Comparative Example 6, the metal component atomic ratio was (Ti , A
1, Mn, Cr) = 46.5: 43.5: 4.2: 5.
It was 8.

[0036]

[Table 8]

Scratch strength measurement and cutting test were carried out for Example 5 and Comparative Example 6 in the same manner as in the field test 1, and the results are shown in Table 9.

[0038]

[Table 9]

As shown in Table 9, Example 5 is Comparative Example 6
The scratch strength is higher and the flank wear amount V _B is also smaller. From this, it can be seen that Example 5 has higher adhesion between the coating and the substrate than Comparative Example 6 and is less likely to be worn.

[0040]

The wear resistance of the TiAl compound film coated member,
It was found that the substrate voltage under the TiAl compound film coating condition affects the oxidation resistance and the adhesion. As described above, during the TiAl compound film forming step, the base material voltage applied between the vacuum container and the base material is continuously and / or stepwise lowered in the range of −20 V to −300 V and then adjusted. The TiAl compound film coated member coated with the TiAl compound film is excellent in cutting performance as compared with the conventional TiAl compound film coated member. The cutting tool to which the present invention is applied exhibits the effect of improving cutting performance, particularly wear resistance, oxidation resistance, and adhesion, as compared with conventional cutting tools.

[Brief description of drawings]

FIG. 1 is a substrate voltage adjustment pattern diagram showing that the substrate voltage was continuously adjusted in the (Ti, Al) N coating step of Example 1.

FIG. 2 is a substrate voltage adjustment pattern diagram showing that the substrate voltage is adjusted stepwise in the (Ti, Al) N coating step of Example 2;

FIG. 3 is a substrate voltage adjustment pattern diagram showing that the substrate voltage is continuously adjusted in the (Ti, Al, Y) N coating process of Example 3;

FIG. 4 is a substrate voltage adjustment pattern diagram showing that the substrate voltage is adjusted stepwise in the coating process of Example 5 (Ti, Al, Mn, Cr) N.

Claims (12)

[Claims] 1. A covering member in which a surface of a base material formed in a shape having at least one edge ridge is covered with a film of a single layer film or a multilayer film, the film being a nitride containing Ti and Al, Carbide, carbonitride, carbon oxide, nitric oxide,
A TiAl compound film comprising at least one of carbonitride oxides, and the TiAl compound in the vicinity of the edge ridge.
The compound film has a Ti / Al atomic ratio that maximizes the Ti / Al atomic ratio in the TiAl compound film, and a Ti / Al ratio relative to the first film layer.
The TiAl formed of a multi-layered film of at least two layers including a second film layer having a small atomic ratio, and excluding the vicinity of the edge ridgeline.
The TiAl compound film at the center of the compound film surface is T
A TiAl compound film coating member consisting of a single-layer film having a constant i / Al atomic ratio. 2. The Ti / Al atomic ratio of the first film layer becomes maximum after the Ti / Al atomic ratio continuously and / or stepwise increases from the surface side of the substrate toward the inside of the TiAl compound film, and then becomes maximum. The TiAl compound film coating member according to claim 1, wherein the TiAl compound film coating member decreases toward the front surface side. 3. A portion of the edge ridgeline adjacent to the edge ridgeline has a width of 2 m from the edge ridgeline toward the center of the surface of the TiAl compound film.
TiAl according to claim 1 or 2, which is a region within m.
Compound film coated member. 4. TiAl in the vicinity of the edge ridge
The compound film is composed of three layers in which the first film layer is sandwiched by the second film layers in the thickness direction, and the first film layer and the second film layer have T
When the i / Al atomic ratio is represented by A and B, respectively,
The TiAl compound film coated member according to claim 3, wherein 90 ≦ A ≦ 2.00 and 0.82 ≦ B ≦ 1.50. 5. The TiAl compound film is (Ti _x , Al _y )
_Represented by N _z , x is the atomic ratio of Ti in the metal element, y is the atomic ratio of Al in the metallic element, z is the atomic ratio of N relative to the total of Ti and Al, and x + y = 1, respectively. 0.6
6 ≧ x ≧ 0.46, 0.54 ≧ y ≧ 0.34, 1.05
The TiAl compound film coating member according to any one of claims 1 to 4, which has a relationship of ≧ z ≧ 0.7. 6. The TiAl compound film is formed of (Ti _a , A
l _b, is represented by M _c) N _d, M is Zr, Hf, V, Nb,
Ta, Cr, Mo, W, Si, B, Mg, Fe, Sn,
Mn, Sc, Y, or at least one of lanthanum rare earth elements is represented, and a is Ti with respect to the total of Ti, Al, and M.
Atomic ratio of b, Al atomic ratio of Al to the total of Ti, Al and M, c atomic ratio of M to the total of Ti, Al and M,
d represents the atomic ratio of N to the sum of Ti, Al and M,
A + b + c = 1, 0.66 ≧ a ≧ 0.32,
0.54 ≧ b ≧ 0.24, 0.3 ≧ c ≧ 0, 1.05 ≧
The TiAl compound film coating member according to any one of claims 1 to 4, wherein d ≧ 0.7. 7. The TiAl compound film is formed of (Ti _a , A
l _b, is represented by M _c) N _d, M is V, Nb, Ta, Cr,
Represents at least one of Mo, W, Y and Mn, a is the atomic ratio of Ti to the total of Ti, Al and M, and b is Ti.
And the atomic ratio of Al to the sum of Al and M, c is Ti and A
The atomic ratio of M to the total of l and M, d is the atomic ratio of N to the total of Ti, Al and M, and each is a + b.
+ C = 1, 0.66 ≧ a ≧ 0.32, 0.54 ≧ b ≧
The TiAl compound film coating member according to claim 6, which has a relationship of 0.24, 0.3 ≧ c ≧ 0, and 1.05 ≧ d ≧ 0.7. 8. The coating film includes an underlayer film of at least one of Ti, a carbide of Ti, a nitride, a carbonitride, a carbon oxide, a oxynitride, and a oxycarbonitride, and the underlayer film is the base film. A material is interposed between the material and the TiAl compound film.
The TiAl compound film coating member according to any one of items 1 to 7. 9. The coating comprises, in addition to the TiAl compound film,
An outermost layer made of at least one of Ti, a carbide, a nitride, a carbonitride of Ti, a carbon oxide, a oxynitride, and a oxycarbonitride is included, and the outermost layer is coated on the surface of the TiAl compound film. TiAl according to any one of claims 1 to 8.
Compound film coated member. 10. The substrate according to claim 1, wherein the base material is at least one of a ferrous metal material, a non-ferrous metal material, a cemented carbide, a cermet, a ceramics sintered body, and an ultrahigh pressure sintered body. A TiAl compound film-covered member according to item. 11. The TiAl compound film coated member according to claim 10, wherein the TiAl compound film coated member is a cutting tool. 12. A TiAl compound film forming step in a step of supporting a base material having at least one edge ridge in a vacuum container and coating the surface of the base material with a film of a single layer film or a multilayer film. In the TiAl compound film forming step, the substrate voltage applied between the vacuum container and the substrate is continuously and / or stepwise lowered in the range of −20 V to −300 V, and then increased. A method for producing a TiAl compound film-coated member, which comprises: