JP2003092327A - Aligner and substrate transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the running cost. SOLUTION: An aligner 1 having a load lock room 3 and carrying a wafer 7 from/to a coater developer through the room 3 is provided with an environment control unit 10 capable of setting an arbitrary environment by filling a purge gas into the room 3 through a valve 18, a gas recovery unit 11 for recovering the filled purge gas, and a gas tank 13 for storing the recovered purge gas. In this aligner, before opening the room 3 filled with the purge gas to the atmosphere, the purge gas in the room 3 is recovered by the unit 11 through a valve 19 and is stored in the tank 13 to use as a purge gas in the next substrate transfer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and a substrate loading / unloading apparatus having a load lock chamber for loading / unloading a substrate to / from the outside via the load lock chamber.

[0002]

2. Description of the Related Art In a conventional semiconductor factory, a semiconductor exposure apparatus is generally operated so that a wafer is transferred to and from a device called a coater developer (hereinafter abbreviated as C / D). That is, conventionally, a C / D coats a photosensitive material called a resist on a wafer, puts it in a transfer station called an inline station, and after this wafer is received and exposed by a semiconductor exposure apparatus, it is returned to the inline station. The process of receiving the exposed wafer from the inline station and developing it was repeated.

However, in recent exposure apparatuses using a F ₂ excimer laser as a light source, it is necessary to purge the inside of the exposure apparatus with an inert gas in order to reduce absorption of exposure light by oxygen. is there.

On the other hand, the C / D is a conventional method for coating and developing a photosensitive material in the air, and therefore, when transferring a wafer between an exposure apparatus using an F ₂ excimer laser as a light source and the C / D,
It is common to go through a load lock chamber for adjusting the difference between the environments.

That is, when the wafer is loaded into the exposure apparatus, the door on the exposure machine side of the load lock chamber is closed and C
/ D placed the wafer in the load lock chamber, closed the door on the C / D side, sealed the load lock chamber, and filled the chamber with an inert gas, so that the atmosphere became the same as the inside of the exposure apparatus. After that, the door on the exposure machine side of the load lock chamber is opened, and the wafer is loaded into the exposure apparatus.

When the wafer is unloaded from the exposure apparatus,
The C / D side door of the load lock chamber is closed, the exposure apparatus places the wafer in the load lock chamber, the exposure apparatus side door is closed, the load lock chamber is closed, and the chamber is released to the atmosphere. After the atmosphere becomes the same as C / D, the door on the C / D side of the load lock chamber is opened, and the C / D carries out the wafer.

[0007]

However, in the above-described conventional example, when the wafer is unloaded from the exposure apparatus, the C / D side door of the load lock chamber is closed and the exposure apparatus places the wafer in the load lock chamber. Later, after closing the door on the exposure equipment side and sealing the load lock chamber, the inert gas that had been filled was consumed to release the interior of the load lock chamber to the atmosphere, causing a rise in the running cost of the semiconductor exposure process. Was there. It should be noted that this problem is more remarkable when the exposure apparatus is filled with expensive helium gas.

An object of the present invention is to provide an exposure apparatus which can reduce running costs.

[0009]

In order to solve the above problems and achieve the object, the present invention has a load lock chamber, and carries in a substrate between an external device and a person via the load lock chamber. In the exposure apparatus for discharging, the load lock chamber is equipped with a mechanism for filling the load lock chamber with a purge gas, a mechanism for collecting the filled purge gas, and a mechanism for storing the recovered purge gas, and the load lock chamber filled with the purge gas. Is released to the atmosphere, the purge gas in the load lock chamber is recovered, further stored, and reused as the purge gas at the next substrate loading / unloading.

The present invention also has a load lock chamber,
In an exposure apparatus for loading and unloading a substrate to and from either an external device or a person via the load lock chamber, there are a plurality of load lock chambers, a mechanism for filling purge gas into each load lock chamber, and a filled purge gas By connecting the environment of each load lock chamber with the mechanism that collects and reuses the substrate, the closing means that closes each load lock chamber when the substrates that are loaded and unloaded are placed in each load lock chamber, And a means for adjusting the environment of each load lock chamber to a predetermined environment for loading and unloading the substrate from the averaged state.

The substrate may be a photosensitive substrate or an original plate, and the external device is a resist coating / developing device when the substrate is a photosensitive substrate or an original plate transport device when the substrate is an original plate. either will do.

The present invention will be described in the case where the substrate is a wafer. In the semiconductor exposure apparatus for loading and unloading the wafer with the coater developer via the load lock chamber,
Equipped with a gas recovery device that recovers the purge gas filled in the load lock chamber and returns it to the tank. When the wafer is unloaded from the exposure apparatus, the C / D side door of the load lock chamber must be closed so that the exposure apparatus can After placing the wafer on
After closing the door on the exposure device side and sealing the load lock chamber, the gas recovery device recovered the gas in the load lock chamber before opening the same chamber to the atmosphere or setting it in the same environment as the C / D. Characterized by reusing gas,
This makes it possible to reduce the running cost of the semiconductor exposure process.

Further, according to the present invention, in a substrate loading / unloading device for loading / unloading a substrate to / from an external device or a person via the load lock chamber, the load lock chamber is filled with a purge gas. To a predetermined environment for loading and unloading the substrate, means for releasing the load lock chamber to the atmosphere after loading and unloading the substrate, and before releasing the load lock chamber filled with purge gas to the atmosphere, Means may be provided for collecting the purge gas and reusing it as the purge gas at the time of loading / unloading the substrate next time.

Further, according to the present invention, in a substrate loading / unloading device for loading / unloading a substrate to / from an external device or a person via the load lock chamber, there are a plurality of load lock chambers, and a purge gas is provided in the load lock chamber. And a means for recovering and reusing the filled purge gas, a means for closing each load lock chamber when the substrates to be carried in and out are placed in each load lock chamber, and each load lock chamber Means for adjusting the environment of each load-lock chamber to a predetermined environment for loading and unloading the substrate from a state in which the internal environment is averaged by combining the environments of 1.

Further, according to the present invention, a step of installing a manufacturing apparatus group for various processes including any one of the above-mentioned exposure apparatuses in a semiconductor manufacturing factory, and a semiconductor device is manufactured by a plurality of processes using the manufacturing apparatus group. It is also applicable to a semiconductor device manufacturing method having a process. The method further includes the steps of connecting the manufacturing apparatus group with a local area network, and performing data communication between the local area network and an external network outside the semiconductor manufacturing factory for information regarding at least one of the manufacturing apparatus group. It is desirable to have. A database provided by a vendor or a user of the exposure apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or between the semiconductor manufacturing factory and a semiconductor manufacturing factory different from the semiconductor manufacturing factory. It is preferable to perform production management by data communication via an external network.

Further, according to the present invention, a manufacturing apparatus group for various processes including any one of the above-mentioned exposure apparatuses, a local area network connecting the manufacturing apparatus groups, and an external network outside the factory are accessed from the local area network. It may be a semiconductor manufacturing factory that has a gateway that enables the data communication of information regarding at least one of the manufacturing apparatus group.

Further, the present invention is a maintenance method for any one of the above exposure apparatus installed in the semiconductor manufacturing factory, wherein a vendor or a user of the exposure apparatus is a maintenance database connected to an external network of the semiconductor manufacturing factory. And a step of permitting access to the maintenance database from the semiconductor manufacturing factory via the external network, and maintenance information accumulated in the maintenance database on the semiconductor manufacturing factory side via the external network. And a step of transmitting the information to the user.

The present invention, in any one of the above-mentioned exposure apparatuses, further has a display, a network interface, and a computer that executes network software, and maintenance information of the exposure apparatus is data-communicated via a computer network. It may be characterized in that it is possible to do. The network software is connected to an external network of a factory in which the exposure apparatus is installed and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus. It may be possible to obtain information from the database via.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A semiconductor exposure apparatus according to the first embodiment will be described below, taking as an example the case where there is one load lock chamber and the substrate is a wafer.
This will be described with reference to the drawings. FIG. 1 is a diagram showing the overall configuration of the first embodiment. In the figure, reference numeral 1 denotes an exposure apparatus using F ₂ as a light source, which has a structure for preventing absorption of exposure light by oxygen by purging with an inert gas,
It is possible to expose a fine circuit pattern on the wafer. Reference numeral 2 denotes a C / D (coater / developer), which can apply a resist to a wafer and develop an exposed wafer in an atmospheric environment. Reference numeral 3 is a load lock chamber attached to the exposure apparatus. The load lock chamber 3 includes an exposure apparatus side door 4 and a C / D side door 5. Here, the doors 4 and 5 can be opened and closed by a command from a controller (not shown) of the exposure apparatus 1.

Reference numeral 6 denotes an in-line station provided in the load lock chamber 3 on which a wafer 7 can be placed. Reference numeral 8 denotes a transfer robot in the exposure apparatus 1, which can carry the wafer 7 on the inline station 6 in the load lock chamber 3 into the exposure apparatus 1 when the door 4 of the load lock chamber 3 is open. . Further, when there is no wafer on the inline station 6, the transfer robot 8 can place the exposed wafer processed by the exposure apparatus 1 on the inline station 6.

Reference numeral 9 denotes a transfer robot in the C / D2,
When the door 5 of the load lock chamber 3 is open, the wafer 7 on the inline station 6 in the load lock chamber 3 can be loaded into the C / D 2. Further, when there is no wafer on the inline station 6, the transfer robot 9 can place the resist-coated wafer processed by C / D 2 on the inline station 6.

Reference numeral 10 denotes an environment control device capable of setting an arbitrary environment by filling the load lock chamber 3 with an inert gas and purging air or the like according to a command from the controller of the exposure apparatus 1. Reference numeral 11 denotes a gas recovery device that can recover the inert gas in the load lock chamber 3 according to a command from the controller of the exposure apparatus 1. Reference numeral 12 is a gas purifying device for purifying the gas recovered by the gas recovery device 11, and 13 is a gas tank. This gas tank 13 can store the inert gas used in this step and send it to the environment control device 10, and the gas purification device 1
The gas purified by 2 can be stored again.

Reference numeral 14 denotes a release valve capable of releasing the inside of the load lock chamber 3 to the atmosphere by a command from the controller of the exposure apparatus 1. Reference numeral 18 denotes a valve, which is opened when introducing gas from the gas tank 13 into the load lock chamber 3. Reference numeral 19 is a valve, which is opened when the gas in the load lock chamber 3 is collected.

FIG. 2 is a diagram showing a state where the controller of the exposure apparatus 1 opens the C / D2 side door 5 of the load lock chamber 3 and the C / D2 transfer robot 9 places the wafer 7 on the inline station 6. .

FIG. 3 is a diagram showing a state in which the controller of the exposure apparatus 1 has closed the door 5 of the load lock chamber 3.

FIG. 4 shows a state in which the environment control device 10 sends an inert gas from the gas tank 13 to the load lock chamber 3 through the valve 18 so that the environment in the chamber 3 is adjusted to the environment in the exposure apparatus 1. It is a figure.

In FIG. 5, after the environment in the load lock chamber 3 matches the environment in the exposure apparatus 1, the controller of the exposure apparatus 1 opens the door 4 of the load lock chamber 3, and the transfer robot 8 is inline. FIG. 7 is a diagram showing a state in which the wafer 7 on the station 6 is loaded, exposed, and returned to the inline station 6.

In FIG. 6, after the controller of the exposure apparatus 1 closes the door 4, the gas recovery device 11 recovers the inert gas in the load lock chamber 3, and the recovered gas is purified by the gas cleaning device 12. 3 is a diagram showing a state of being stored in a gas tank 13. FIG.

FIG. 7 is a diagram showing a state in which the release valve 14 is opened and the inside of the load lock chamber 3 is opened to the atmosphere after almost all the inert gas in the load lock chamber 3 is recovered.

In FIG. 8, the controller of the exposure apparatus 1 opens the door 5 of the load lock chamber 3, and the transfer robot 9 of C / D 2 transfers the wafer 7 on the inline station 6 to C / D.
It is a figure showing the state which can be carried in to the 2 side.

In the above structure, the operation of loading / unloading the wafer between the exposure apparatus and the load lock chamber and the loading / unloading of the wafer between the C / D and the load lock chamber will be described in order. First, as shown in FIG. 2, the controller of the exposure apparatus 1 opens the door 5 of the load lock chamber 3, and the C / D 2
The transfer robot 9 places the resist-coated wafer 7 in the inline station 6.

Next, as shown in FIG. 3, the controller of the exposure apparatus 1 closes the door 5 of the load lock chamber 3 to shut off the environment inside the load lock chamber 3 and the environment inside the C / D 2.

Next, as shown in FIG. 4, the environment control device 1
0 sends the inert gas from the gas tank 13 to the load lock chamber 3 through the valve 18 and adjusts the environment in the chamber 3 to the environment in the exposure apparatus 1.

Next, as shown in FIG. 5, after the environment in the load lock chamber 3 matches the environment in the exposure apparatus 1, the controller of the exposure apparatus 1 opens the door 4 of the load lock chamber 3, The transfer robot 8 carries in the wafer 7 on the inline station 6 to the exposure apparatus 1 side and performs the exposure process. After the exposure process is completed, the transfer robot 8 returns the wafer 7 to the inline station 6.

Next, as shown in FIG. 6, the controller of the exposure apparatus 1 closes the door 4, and then the gas recovery device 11 recovers the inert gas in the load lock chamber 3 through the valve 19 and recovers the recovered gas. Is purified by the gas purifier 12 and stored in the gas tank 13.

Next, as shown in FIG. 7, after almost all the inert gas in the load lock chamber 3 is recovered, the release valve 14 is opened to release the inside of the chamber 3 to the atmosphere.

Next, as shown in FIG. 8, the controller of the exposure apparatus 1 closes the release valve 14, and the load lock chamber 3
The door 5 is opened, and the transfer robot 9 for the C / D 2 carries in the wafer 7 on the inline station 6 after the exposure processing to the C / D 2 side.

When loading / unloading the next wafer, the operation from FIG. 2 is repeated.

(Second Embodiment) A semiconductor exposure apparatus according to a second embodiment of the present invention will be described below with reference to the drawings by taking a case where there are two load lock chambers and a substrate is a wafer as an example. To do. FIG. 9 is a diagram showing the overall configuration of the second embodiment. In the figure, 23 is a load lock chamber. The load lock chamber 23 includes an exposure apparatus side door 24 and a C / D2 side door 25. Here, the doors 24 and 25 can be opened and closed by a command from a controller (not shown) of the exposure apparatus 1. Reference numeral 26 is an in-line station provided in the load lock chamber 23, on which the wafer 27 can be placed. Here, the transfer robot 8 can carry the wafer 27 on the inline station 26 in the load lock chamber 23 into the exposure apparatus 1 when the door 24 of the load lock chamber 23 is open. Further, when there is no wafer on the inline station 26, the transfer robot 8 sets the exposed wafer processed by the exposure apparatus 1 to the inline station 2
6 can be placed on top.

The transfer robot 9 in the C / D 2 can carry the wafer 27 on the inline station 26 in the load lock chamber 23 into the C / D 2 when the door 25 of the load lock chamber 23 is open. it can. Further, the transfer robot 9 can place the resist-coated wafer processed by C / D 2 on the inline station 26 when there is no wafer on the inline station 26. 30, the load lock chamber 23 is filled with an inert gas according to a command from the controller of the exposure apparatus 1,
It is an environment control device that can be purged and set to any environment. Reference numeral 21 is a gas recovery device capable of recovering the inert gas in the load lock chamber 23 according to a command from the controller of the exposure apparatus 1, and reference numeral 22 is a gas purification device for purifying the gas recovered by the gas recovery device 21. It is a device. Reference numeral 16 is a connecting pipe for connecting the environment in the load lock chambers 3, 23, and 17 is a part of the connecting pipe 16 which is opened and closed to select whether or not the environment in the load lock chambers 3, 23 is connected. It is a valve that can be opened and closed according to a command from the controller of the exposure apparatus 1. Reference numeral 28 denotes a valve, which is opened when the gas is supplied from the gas tank 13 to the load lock chamber 23. 29
Is a valve, which is opened when the gas in the load lock chamber 23 is collected. Other configurations are the same as those in the first embodiment. The gas tank 13 is one in common.

In FIG. 10, the controller of the exposure apparatus 1 opens the door 5 of the load lock chamber 3 and the door 24 of the load lock chamber 23, and the transfer robot 8 of the exposure apparatus 1 moves the wafer 2 to the wafer 2.
7 is placed in the in-line station 26, and the C / D transfer robot 9 places the wafer 7 in the in-line station 6.
It is a figure showing the state placed.

FIG. 11 is a diagram showing a state in which the controller of the exposure apparatus 1 has closed the door 5 of the load lock chamber 3 and the door 24 of the load lock chamber 23.

FIG. 12 is a diagram showing a state in which the controller of the exposure apparatus 1 opens the valve 17 and connects the environment in the load lock chambers 3, 23 via the connecting pipe 16.

In FIG. 13, the controller of the exposure apparatus 1 closes the valve 17 and shuts off the environment in the load lock chambers 3 and 23, and then opens the valves 18 and 28 so that the environment control apparatus 10 loads the load lock. FIG. 6 is a diagram showing a state in which the environment in the chamber 3 is matched with the environment in the exposure apparatus 1, and the environment control device 30 matches the environment in the load lock chamber 23 with the environment in the C / D 2.

In FIG. 14, the controller of the exposure apparatus 1 opens the door 4 of the load lock chamber 3 and the door 25 of the load lock chamber 23, and the transfer robot 8 of the exposure apparatus 1 carries in the wafer 7 on the inline station 6. It is possible and the C / D transfer robot 9 can be installed in the inline station 2
It is a figure showing the state which can carry in the wafer 27 on 6 to the C / D2 side.

FIG. 15 shows the transfer robot 8 of the exposure apparatus 1.
However, the wafer 7 on the inline station 6 is loaded into the exposure apparatus 1, and the C / D transfer robot 9 finishes loading the wafer 27 on the inline station 26 to the C / D 2 side. It is a figure showing the state which became empty.

In the above structure, the operation of carrying the substrate and the like will be described step by step. First, as shown in FIG. 10, the controller of the exposure apparatus 1 causes the door 5 of the load lock chamber 3 to move.
Then, the door 24 of the load lock chamber 23 is opened, and the transfer robot 8 of the exposure apparatus 1 places the exposed wafer 27 on the inline station 26. At the same timing, the C / D 2 transfer robot 9 places the resist-coated wafer 7 on the inline station 6.

Next, as shown in FIG. 11, the controller of the exposure apparatus 1 closes the door 5 of the load lock chamber 3 and the door 24 of the load lock chamber 23 to determine the environment inside the load lock chamber 3 and C / The environment inside D2 is cut off, and the environment inside the load lock chamber 23 and the environment inside the exposure apparatus 1 are cut off.

Next, as shown in FIG. 12, the controller of the exposure apparatus 1 opens the valve 17 to connect the environments in the load lock chambers 3 and 23 via the connecting pipe 16 and average them. Next, as shown in FIG. 13, after the controller of the exposure apparatus 1 closes the valve 17 to shut off the environment in the load lock chambers 3 and 23, the environment control apparatus 10 causes the valve 18 to operate.
The inert gas from the gas tank 13 is sent to the load lock chamber 3 through the through, and the environment in the chamber 3 is adjusted to the environment in the exposure apparatus 1.

Further, in response to a command from the controller of the exposure apparatus 1, the gas recovery device 21 recovers the inert gas in the load lock chamber 23 through the valve 29, the recovered gas is purified by the gas purification device 22, and the gas tank 13 Store in. Thereafter, the environment control device 30 changes the inside of the load lock chamber 23 to C / D according to a command from the controller of the exposure apparatus 1.
Set the same environment as in 2. At this time, since the environment setting is started from the state where the environment inside the load lock chambers 3, 23 is averaged, the environment setting can be completed in a short time, and the inert gas recovery cycle is provided. Therefore, it is possible to reduce the running cost.

Next, as shown in FIG. 14, the controller of the exposure apparatus 1 opens the door 4 of the load lock chamber 3 and the door 25 of the load lock chamber 23, and then the transfer robot 8 of the exposure apparatus 1 is opened. , The wafer 7 on the inline station 6 is loaded into the exposure apparatus 1, and the transfer robot 9 of the C / D 2 loads the wafer 27 on the inline station 26 to the C / D 2 side. When this is completed, as shown in FIG. 15, the inline stations 6 and 26 are emptied.

When loading / unloading the next wafer, the controller of the exposure apparatus 1 uses the transfer robot 8 to place the exposed wafer on the inline station 6. At the same timing, the transfer robot 9 of the C / D 2 places the resist-coated wafer 27 on the in-line station 26 and performs the same processing as the previous wafer loading / unloading.

The present invention is naturally applicable to the case where the substrate is an original plate such as a reticle, and in the case where a person carries the substrate in and out of the load lock chambers 3, 23 instead of the C / D2. Can also be applied to.

(Embodiment of Semiconductor Production System) Next,
Semiconductor devices (ICs and LSs) using the apparatus according to the present invention
An example of a production system of a semiconductor chip such as I, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc. will be described. This is to perform maintenance services such as troubleshooting of a manufacturing apparatus installed in a semiconductor manufacturing factory, periodic maintenance, or software provision using a computer network outside the manufacturing factory.

FIG. 16 shows the entire system cut out from a certain angle. In the figure, 101 is a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of the manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example, pre-process equipment (exposure apparatus, resist processing apparatus, lithography apparatus such as etching apparatus, heat treatment apparatus, film forming apparatus, flatness apparatus, etc. It is assumed that it will be used as a manufacturing equipment) and post-process equipment (assembly equipment, inspection equipment, etc.). Within the business office 101, a host management system 1 that provides a maintenance database for manufacturing equipment
08, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. The host management system 108 has a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

On the other hand, 102 to 104 are manufacturing plants of a semiconductor manufacturer who is a user of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or may be factories belonging to the same manufacturer (for example, a factory for pre-process, a factory for post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them to construct an intranet, and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
02-104 host management system 107
Is provided with a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, it becomes possible to access the host management system 108 on the side of the business office 101 of the vendor from the LAN 111 of each factory via the Internet 105, and the security function of the host management system 108 allows access to only a limited number of users. . Specifically, each manufacturing apparatus 1 is connected via the Internet 105.
In addition to notifying status information indicating the operating status of 06 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) from the factory side to the vendor side, response information corresponding to the notification (for example, information instructing a troubleshooting method, You can receive maintenance information such as software (data and data for handling), the latest software, and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor's office 101 and data communication via the LAN 111 in each factory. . In addition,
Instead of using the Internet as an external network outside the factory, it is possible to use a leased line network (ISDN or the like) having high security without being accessed by a third party. Further, the host management system is not limited to one provided by a vendor, and a user may construct a database and place it on an external network to permit access from a plurality of factories of the user to the database.

Now, FIG. 17 is a conceptual view showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected by an external network, and production management of each factory or at least one unit is performed via the external network. The information of the manufacturing apparatus was data-communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors and a management system of each vendor of the plurality of manufacturing equipments are connected by an external network outside the factory, and maintenance information of each manufacturing equipment is displayed. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturing maker), and a manufacturing apparatus for performing various processes is installed on a manufacturing line of the factory.
The film forming processing device 204 is introduced. Although only one manufacturing factory 201 is shown in FIG. 17, a plurality of factories are actually networked in the same manner. The respective devices in the factory are connected by a LAN 206 to form an intranet, and the host management system 205 manages the operation of the manufacturing line.

On the other hand, the host management system 21 for remote maintenance of the supplied equipment is provided at each business office of the vendor (apparatus supply manufacturer) such as the exposure equipment manufacturer 210, the resist processing equipment manufacturer 220, the film deposition equipment manufacturer 230.
1, 221, 231, which are provided with the maintenance database and the gateway of the external network as described above. A host management system 205 that manages each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected to each other via the external network 200 such as the Internet or a dedicated line network. In this system, when trouble occurs in any of the series of production equipment on the production line,
Although the operation of the manufacturing line is suspended, it is possible to quickly respond by receiving remote maintenance via the Internet 200 from the vendor of the device in which the trouble has occurred, and the suspension of the manufacturing line can be minimized. .

Each manufacturing apparatus installed in the semiconductor manufacturing factory is provided with a display, a network interface, and a computer that executes network access software and apparatus operating software stored in a storage device. The storage device is a built-in memory, a hard disk, or a network file server. The software for network access includes a dedicated or general-purpose web browser, and provides a user interface of a screen as shown in FIG. 18 on the display. The operator who manages the manufacturing device in each factory refers to the screen and refers to the model 401 of the manufacturing device, the serial number 402, and the subject 4 of the trouble.
03, date of occurrence 404, urgency 405, symptom 406, coping method 407, progress 408, etc. are input to the input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. In addition, the user interface provided by the web browser further includes hyperlink functions 410 to 410 as illustrated.
412 is implemented, the operator can access more detailed information on each item, extract the latest version of software used for the manufacturing equipment from the software library provided by the vendor, and use the operation guide (help Information) can be withdrawn. Here, the maintenance information provided by the maintenance database includes the information about the present invention described above, and the software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 19 shows the flow of the whole manufacturing process of the semiconductor device.
In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step 4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. Including steps. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes and shipped (step 7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Information for production management and device maintenance is also data-communicated between the front-end factory and the back-end factory via the Internet or the leased line network.

FIG. 20 shows the detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and semiconductor devices can be compared to conventional devices. Productivity can be improved.

[0062]

As described above, according to the present invention,
In an exposure apparatus that transfers substrates such as wafers to and from a coater developer or a person via the load lock chamber, a gas recovery device that recovers the purge gas filled in the load lock chamber and returns it to the tank is provided. When the substrate is unloaded, the C / D side door of the load lock chamber is closed, the exposure apparatus places the substrate in the load lock chamber, the exposure apparatus side door is closed, and the load lock chamber is closed. The gas recovery device can recover the gas in the load-lock chamber before making the environment equivalent to the atmosphere, and can reuse the recovered gas, which can reduce the running cost of the semiconductor exposure process. It will be possible.

[Brief description of drawings]

FIG. 1 is a diagram showing an overall configuration of a semiconductor exposure line including an exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an operation of the exposure apparatus according to the first embodiment.

FIG. 3 is a diagram showing an operation of the exposure apparatus according to the first embodiment.

FIG. 4 is a diagram showing an operation of the exposure apparatus according to the first embodiment.

FIG. 5 is a diagram showing an operation of the exposure apparatus according to the first embodiment.

FIG. 6 is a diagram illustrating an operation of the exposure apparatus according to the first embodiment.

FIG. 7 is a diagram illustrating an operation of the exposure apparatus according to the first embodiment.

FIG. 8 is a diagram illustrating an operation of the exposure apparatus according to the first embodiment.

FIG. 9 is a diagram showing an overall configuration of a semiconductor exposure line including an exposure apparatus according to a second embodiment of the present invention.

FIG. 10 is a diagram illustrating an operation of the exposure apparatus according to the second embodiment.

FIG. 11 is a diagram illustrating an operation of the exposure apparatus according to the second embodiment.

FIG. 12 is a diagram showing an operation of the exposure apparatus according to the second embodiment.

FIG. 13 is a diagram illustrating an operation of the exposure apparatus according to the second embodiment.

FIG. 14 is a diagram illustrating an operation of the exposure apparatus according to the second embodiment.

FIG. 15 is a diagram illustrating an operation of the exposure apparatus according to the second embodiment.

FIG. 16 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from an angle.

FIG. 17 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from another angle.

FIG. 18 is a specific example of a user interface.

FIG. 19 is a diagram illustrating a flow of a device manufacturing process.

FIG. 20 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: exposure device, 2: coater developer (C / D), 3:
Load lock chamber, 4: Door of exposure apparatus of load lock chamber 3, 5: Door of coater developer of load lock chamber 3,
6: In-line station, 7: Wafer, 8: Transfer robot in the exposure apparatus 1, 9: Transfer robot in the coater developer 2, 10: Environmental control device, 11: Gas recovery device, 12: Gas purification device, 13: Gas tank , 14: release valve, 16: coupling pipe, 17, 18, 19: valve,
21: Gas recovery device, 22: Gas purification device, 23: Load lock chamber, 24: Door of exposure device of load lock chamber 23, 25: Door of coater developer of load lock chamber 23, 26: In-line station, 27: Wafer .

Claims (15)

[Claims] 1. An exposure apparatus having a load lock chamber, wherein a substrate is carried in and out of either an external device or a person via the load lock chamber, a mechanism for filling the load lock chamber with a purge gas, and a filling mechanism. A mechanism for recovering the purged gas that has been collected and a mechanism for storing the recovered purge gas are provided, and before the load lock chamber filled with the purge gas is released to the atmosphere, the purge gas in the load lock chamber is recovered and further stored. An exposure apparatus which is reused as a purge gas at the next substrate loading / unloading. 2. An exposure apparatus having a load lock chamber, wherein substrates are carried in and out from either an external device or a person via the load lock chamber, wherein there are a plurality of the load lock chambers, and each load lock chamber has a plurality of load lock chambers. A mechanism for filling the purge gas, a mechanism for collecting and reusing the filled purge gas, a closing means for closing each load lock chamber when the substrates to be carried in and out are placed in each load lock chamber, and each An exposure apparatus, comprising means for adjusting the environment of each load lock chamber to a predetermined environment for loading and unloading the substrate from a state in which the internal environment is averaged by combining the environment of the load lock chamber. 3. The exposure apparatus according to claim 1, wherein the substrate is a photosensitive substrate. 4. The exposure apparatus according to claim 1, wherein the substrate is an original plate. 5. The exposure apparatus according to claim 1, 2 or 3, wherein the external equipment is a resist coating / developing apparatus. 6. The exposure apparatus according to claim 1, 2 or 4, wherein the external device is a master plate transporting device. 7. A substrate loading / unloading device for loading / unloading a substrate between an external device and a person via a load lock chamber, wherein the purge gas is filled in the load lock chamber to load / unload the substrate into / from the load lock chamber. Means for releasing the load lock chamber to the atmosphere after loading / unloading the substrate, and collecting the purge gas in the load lock chamber before releasing the load lock chamber filled with purge gas to the atmosphere. A substrate loading / unloading apparatus, comprising means for reusing as purge gas at the next substrate loading / unloading. 8. A substrate loading / unloading device for loading / unloading a substrate to / from an external device or a person via a load lock chamber, wherein there are a plurality of load lock chambers and a means for filling the load lock chamber with purge gas is provided. Combine the environment of each load lock chamber with the means for collecting and reusing the filled purge gas, the means for closing each load lock chamber when the substrates to be carried in and out are placed in each load lock chamber. The substrate loading / unloading device further comprises means for adjusting the environment of each load lock chamber to a predetermined environment for loading / unloading the substrate from a state in which the internal environment is averaged. 9. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 1 in a semiconductor manufacturing factory, and a semiconductor device by a plurality of processes using the manufacturing apparatus group. And a step of manufacturing the semiconductor device. 10. A process of connecting the manufacturing device group with a local area network, and data communication of information about at least one of the manufacturing device group between the local area network and an external network outside the semiconductor manufacturing factory. The method for manufacturing a semiconductor device according to claim 9, further comprising: 11. A database provided by a vendor or a user of the exposure apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory. 11. The production management is performed by performing data communication with the external network via the external network.
A method for manufacturing a semiconductor device according to. 12. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 1, a local area network connecting the manufacturing apparatus group, and an external unit outside the factory from the local area network. A semiconductor manufacturing factory, comprising a gateway that enables access to a network, and enabling data communication of information regarding at least one of the manufacturing apparatus group. 13. The method according to claim 1, which is installed in a semiconductor manufacturing factory.
The maintenance method for the exposure apparatus according to any one of
A vendor or user of the exposure apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing factory, and a step of permitting access to the maintenance database from within the semiconductor manufacturing factory via the external network. And a step of transmitting the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network. 14. The exposure apparatus according to claim 1, further comprising a display, a network interface, and a computer that executes network software, and the exposure apparatus maintenance information is transmitted via a computer network. The exposure apparatus is characterized in that it is possible to perform data communication by using it. 15. The network software comprises:
A user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus, which is connected to an external network of a factory in which the exposure apparatus is installed, is provided on the display, and from the database via the external network. The exposure apparatus according to claim 14, which makes it possible to obtain information.