JP2003082494A - Plated resin article and method of use therefor - Google Patents

Plated resin article and method of use therefor

Info

Publication number
JP2003082494A
JP2003082494A JP2001278631A JP2001278631A JP2003082494A JP 2003082494 A JP2003082494 A JP 2003082494A JP 2001278631 A JP2001278631 A JP 2001278631A JP 2001278631 A JP2001278631 A JP 2001278631A JP 2003082494 A JP2003082494 A JP 2003082494A
Authority
JP
Japan
Prior art keywords
resin
plated
plating
molded product
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001278631A
Other languages
Japanese (ja)
Inventor
Masanori Narutomi
正徳 成富
Naoki Ando
直樹 安藤
Takashi Goto
崇 後藤
Kazuo Otomo
和男 大友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taisei Purasu Co Ltd
Original Assignee
Taisei Purasu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taisei Purasu Co Ltd filed Critical Taisei Purasu Co Ltd
Priority to JP2001278631A priority Critical patent/JP2003082494A/en
Publication of JP2003082494A publication Critical patent/JP2003082494A/en
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a simple method for obtaining a plated resin article in which nonplated faces are partially formed on the surface of a resin molding, and obtaining an integrated article in which the plated resin article and a certain kind of TPE (thermoplastic elastomer) composition are stuck. SOLUTION: Two liquid urethane hardening type ink is printed on the surface of a key top member 2 as a molding obtained by using a thermoplastic resin composition consisting of an ABS (acrylonitrile-butadiene-styrene) resin, and, after that, plating treatment is performed thereto, so that nonplated faces 22 are obtained in the printed parts, and, further, plated faces 21 are obtained in the pars other than the printed parts. Further, the key top member 2 being the plated resin article is inserted into an injection molding die, and a thermoplastic resin composition essentially consisting of polyester based TPE is injected thereto, so that the integrated article 20 in which the poryester based TPE composition 23 is stuck to the printed parts of the key top member 2 is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂加工分野,鍍
金加工分野,機械組立分野,服飾分野等における樹脂鍍
金物とその使用方法に関し、さらに詳しくは、家電機
器,電子機器,医療機器,移動機器,服飾用品等に適用
される樹脂鍍金物とその使用方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-plated product and its use method in the fields of resin processing, plating, machine assembly, clothing, etc. The present invention relates to a resin-plated product applied to equipment, clothing accessories, etc. and its usage.

【0002】[0002]

【従来の技術】従来より、樹脂成形品の表面に金属を鍍
金した樹脂鍍金物は、樹脂加工分野,鍍金加工分野,機
械組立分野,服飾分野等の非常に多くの分野で使用され
ている。このように樹脂成形品を鍍金する目的は、例え
ば外観を金属に変える,デザイン性を高める,耐久性や
耐候性を高める,制電性や通電性や電磁波遮蔽性を付与
する等である。
2. Description of the Related Art Conventionally, a resin-plated product obtained by plating a surface of a resin-molded product with a metal has been used in a great many fields such as a resin processing field, a plating processing field, a machine assembly field, a clothing field and the like. The purpose of plating the resin molded product in this way is to change the appearance to a metal, to enhance designability, to enhance durability and weather resistance, to impart antistatic property, electrical conductivity, and electromagnetic wave shielding property.

【0003】この鍍金用の樹脂成形品に使用される樹脂
としては、アクリロニトリル・ブタジエン・スチレン樹
脂(以下「ABS樹脂」という。)が最も多く使用され
る。この樹脂成形品に対して、洗浄工程,エッチング工
程,触媒付与工程,銅又はニッケルの無電解鍍金工程,
ニッケル又はクロムの電気鍍金工程,及び後処理工程が
順を追って実施されることにより、樹脂成形品の表面に
鍍金面が形成されて、樹脂面が金属面に変えられる。
As the resin used in the resin molding for plating, acrylonitrile-butadiene-styrene resin (hereinafter referred to as "ABS resin") is most often used. For this resin molded product, cleaning process, etching process, catalyst applying process, electroless plating process of copper or nickel,
The electroplating process of nickel or chrome and the post-treatment process are sequentially performed, so that a plating surface is formed on the surface of the resin molded product and the resin surface is changed to a metal surface.

【0004】ここで上記の工程の殆どは湿式工程であ
り、通常は樹脂成形品が鍍金液等の薬液中に完全に浸漬
されるので、樹脂成形品の表面における全面が鍍金され
る。そこで樹脂成形品の表面において部分的に鍍金面を
形成したり部分的に非鍍金面を形成したい場合には、例
えば以下のような方法がある。
Here, most of the above steps are wet steps, and usually the resin molded product is completely immersed in a chemical liquid such as a plating liquid, so that the entire surface of the resin molded product is plated. Therefore, when it is desired to partially form a plated surface or partially form a non-plated surface on the surface of the resin molded product, the following method is available, for example.

【0005】まず第一の方法は、樹脂成形品における鍍
金をしたくない部分にマスキングテープを貼付してから
鍍金処理を行う方法である。この方法によれば、該樹脂
成形品を薬液中に浸漬した場合であっても、マスキング
テープが貼付された部分には薬液が接触することがない
ので、鍍金面が形成されることがない。しかしこの方法
では、長い鍍金処理工程の途中でマスキングテープの貼
付面に薬液が浸透し、最悪の場合にはマスキングテープ
が途中で剥がれてしまうこともあって、中途半端な鍍金
面が形成されることが多く、また少なくとも鍍金面と非
鍍金面との境界線がぼけてしまうという問題があった。
The first method is a method in which a masking tape is attached to a portion of a resin molded product which is not desired to be plated, and then the plating treatment is carried out. According to this method, even when the resin molded article is dipped in a chemical solution, the chemical solution does not come into contact with the portion to which the masking tape is attached, so that the plating surface is not formed. However, in this method, the chemical solution may penetrate into the pasting surface of the masking tape in the middle of a long plating process, and in the worst case, the masking tape may be peeled off in the middle, so that a half-finished plating surface is formed. In many cases, there was a problem that at least the boundary line between the plated surface and the non-plated surface was blurred.

【0006】また第二の方法は、樹脂成形品における鍍
金をしたくない部分に撥水性のマスキング塗材を塗装し
てから鍍金処理を行う方法である。この方法によれば、
該樹脂成形品を薬液中に浸漬した場合であっても、撥水
性のマスキング塗材が塗装された部分には薬液が接触す
ることがないので、鍍金面が形成されることがない。し
かしこの方法では、鍍金処理の終了後において、樹脂成
形品におけるマスキング塗材が塗装された部分の接着活
性が低いので、接着剤を用いた接着,インキを用いた印
刷,塗料を用いた塗装等を行う場合に、前記樹脂成形品
におけるマスキング塗材が塗装された部分を研磨する等
の後処理が必要になるという問題があった。
The second method is a method in which a water-repellent masking coating material is applied to a portion of the resin molded product which is not desired to be plated, and then the plating treatment is carried out. According to this method
Even when the resin molded article is dipped in a chemical solution, the chemical solution does not come into contact with the portion coated with the water-repellent masking coating material, so that the plating surface is not formed. However, in this method, the adhesive activity of the portion of the resin molded product coated with the masking coating material is low after the plating treatment is completed, so that adhesion with an adhesive, printing with an ink, coating with a paint, etc. In the case of carrying out the above, there was a problem that a post-treatment such as polishing of the portion of the resin molded product coated with the masking coating material was required.

【0007】また第三の方法は、ABS樹脂と、該AB
S樹脂の鍍金条件では鍍金面が形成されることがない樹
脂(例えばポリカーボネート樹脂(以下「PC樹脂」と
いう。)とで二色成形した樹脂成形品に鍍金処理を行う
方法である。例えばABS樹脂とPC樹脂の二色成形で
得た樹脂成形品をABS樹脂の鍍金条件で鍍金処理を行
うと、表面がABSである部分には鍍金面が形成される
一方で表面がPCである部分には鍍金面が形成されない
ので、鍍金面と非鍍金面との境界線がはっきり出せると
共に、非鍍金面であるPCの部分は通常のPC樹脂成形
品と同じであるので、接着剤を用いた接着,インキを用
いた印刷,塗料を用いた塗装等を行うことができる。し
かしこの方法では、二色成形用の金型の設計や製作に通
常の金型よりも費用と時間がかかるために二色成形その
ものが高価であると共に、二色成形の形状によっては金
型の製作そのものが不可能な場合もあるという問題があ
った。
The third method is to use an ABS resin and the AB resin.
This is a method of plating a resin molded product that is two-color molded with a resin (for example, a polycarbonate resin (hereinafter referred to as "PC resin")) whose plating surface is not formed under the plating conditions of S resin. When a resin molded product obtained by two-color molding of PC resin is subjected to plating treatment under ABS resin plating conditions, a plating surface is formed on the portion where the surface is ABS, while a plating surface is formed on the portion where the surface is PC. Since the plating surface is not formed, the boundary line between the plating surface and the non-plating surface can be clearly seen, and since the PC portion which is the non-plating surface is the same as a normal PC resin molded product, adhesion using an adhesive, It is possible to print with ink, paint with paint, etc. However, with this method, it is more costly and time-consuming to design and manufacture a mold for two-color molding, and therefore two-color molding is required. Molding itself is expensive Both depending on the shape of the two-color molding there is a problem that sometimes fabrication itself of the mold is not possible.

【0008】このように、樹脂成形品の表面において部
分的に鍍金面を形成したり部分的に非鍍金面を形成した
いという要請は、単にデザイン上の理由のみならず機能
上の理由による場合も多い。この機能上の理由による場
合とは、例えば樹脂成形品の片面は鍍金面とし裏面に樹
脂や木製品を接着剤を使用して接着したい場合,樹脂成
形品の片面は鍍金面とし裏面に樹脂やゴムを加熱接着や
加硫接着したい場合,又は樹脂成形品の片面は鍍金面と
し裏面に樹脂や熱可塑性エラストマーを射出接着したい
場合等である。
As described above, the demand for partially forming the plating surface or partially forming the non-plating surface on the surface of the resin molded product may be due not only to the design reason but also to the functional reason. Many. Due to this functional reason, for example, when one side of a resin molded product is to be plated and the back side is to be bonded with resin or wood products using an adhesive, one side of the resin molded product is to be plated and the back side is made of resin or rubber. For example, when heat bonding or vulcanization bonding is desired, or when one side of the resin molded product is a plating surface and resin or thermoplastic elastomer is injection bonded to the back surface.

【0009】しかしながら鍍金面は、接着剤を用いた接
着には向いていないし、特殊配合した未加硫ゴムを用い
た加硫接着にも適していない。また鍍金された樹脂成形
品を射出成形金型に挿入して熱可塑性樹脂や熱可塑性エ
ラストマ−(Thermo PlasticElastomer。以下「TP
E」という。)を射出しても、鍍金面と熱可塑性樹脂や
TPEとの間で接着力を確保することは難しい。それ故
に、上述の如く、樹脂成形品の表面において部分的に鍍
金面を形成したり部分的に非鍍金面を形成したいという
要請が生じ、かつ非鍍金面も接着等を行うに適した性質
を持つようにしたいという要請が生ずる。
However, the plated surface is not suitable for adhesion using an adhesive, and is not suitable for vulcanization adhesion using unvulcanized rubber that is specially compounded. In addition, a plated resin molded product is inserted into an injection molding die and a thermoplastic resin or a thermoplastic plastic elastomer (Thermo Plastic Elastomer.
"E". ), It is difficult to secure the adhesive force between the plating surface and the thermoplastic resin or TPE. Therefore, as described above, there is a demand for partially forming a plating surface or partially forming a non-plating surface on the surface of the resin molded product, and the non-plating surface also has a property suitable for performing adhesion and the like. There is a desire to have it.

【0010】一方、特開平7−211187号公報等に
おいて開示されているように、TPEを使用したインサ
ート射出成形として、表面に二液性ウレタン硬化型イン
キを印刷したプラスチック成形品を射出成形金型に挿入
してポリエステル系TPE組成物を射出することによ
り、印刷部分とポリエステル系TPE組成物が射出時の
熱と圧力で接着して、プラスチック成形品の印刷部分に
ポリエステル系TPE組成物が接着した一体化品を得る
ことが知られている。
On the other hand, as disclosed in Japanese Unexamined Patent Publication (Kokai) No. 7-212187 or the like, a plastic molded product having a two-component urethane curable ink printed on the surface is used as an injection molding die as insert injection molding using TPE. By inserting the polyester-based TPE composition into the mold, the printed part and the polyester-based TPE composition are bonded by heat and pressure during injection, and the polyester-based TPE composition is bonded to the printed part of the plastic molded product. It is known to obtain an integrated product.

【0011】[0011]

【発明が解決しようとする課題】樹脂成形品の表面にお
いて部分的に鍍金面を形成したり部分的に非鍍金面を形
成したいという要請を最も簡便に満たす方法は、樹脂成
形品における鍍金をしたくない部分にある種のインキを
使用してスクリーン印刷やパッド印刷等の通常の印刷を
行ってから鍍金処理を行う方法であり、この方法によっ
て樹脂成形品の印刷部分に非鍍金面が得られれば好都合
である。
The most simple method for satisfying the demand for partially forming a plated surface or partially forming a non-plated surface on the surface of a resin molded product is to plate the resin molded product. This is a method of performing plating after performing normal printing such as screen printing or pad printing using a certain type of ink on the part that you do not want to print, and by this method, a non-plated surface can be obtained on the printed part of the resin molded product. It would be convenient.

【0012】ただし従来の常識から言えば、鍍金処理に
おけるエッチング工程はクロム酸等を使って反応し易い
有機物を酸化消滅させる工程であるため、有機層である
前記印刷部分も程度は違うが樹脂面と同様に粗化される
と想定され、印刷部分が多少でも粗化されると弱い接着
力かもしれないが印刷部分に鍍金面が形成され、その場
合には印刷部分に中途半端な鍍金面が形成されるという
のが通説であった。
However, according to the conventional wisdom, since the etching step in the plating process is a step of oxidizing organic matter which is easily reacted by using chromic acid or the like, the printed portion which is an organic layer has a different degree to the resin surface. It is assumed that the printed part will be roughened in the same manner as above, and if the printed part is roughened to some extent, it may have weak adhesion, but a plated surface is formed on the printed part.In that case, a half-finished plated surface is formed. It was a common theory that it was formed.

【0013】また樹脂成形品の片面は鍍金面とし裏面に
TPE組成物を射出接着したい場合において、前記の方
法によって得られた前記印刷部分が非鍍金面である樹脂
成形品を射出成形金型に挿入してある種のTPE組成物
を射出することにより、樹脂成形品の印刷部分にTPE
組成物が接着した一体化品が得られれば好都合である。
When one side of the resin molded product is to be plated and the back surface is to be injection-bonded with the TPE composition, the resin molded product obtained by the above-mentioned method is a non-plated surface is used as an injection mold. By injecting a certain TPE composition that has been inserted, the TPE is applied to the printed portion of the resin molded product.
It would be advantageous to have an integrated article with the composition adhered.

【0014】本発明は、上述のような技術背景のもとに
なされたものであり、下記の目的を達成する。本発明の
目的は、簡便な方法で、樹脂成形品の表面において部分
的に非鍍金面が形成された樹脂鍍金物を得ることにあ
る。また本発明の他の目的は、簡便な方法で、該樹脂鍍
金物とある種のTPE組成物が接着した一体化品を得る
ことができる樹脂鍍金物の使用方法を提供することにあ
る。
The present invention has been made under the technical background as described above, and achieves the following objects. An object of the present invention is to obtain a resin-plated product in which a non-plated surface is partially formed on the surface of a resin molded product by a simple method. Another object of the present invention is to provide a method for using a resin-plated product, which is capable of obtaining an integrated product in which the resin-plated product and a certain TPE composition are adhered to each other by a simple method.

【0015】[0015]

【課題を解決するための手段】本発明は、前記目的を達
成するために、次のような手段を採る。本発明に係る樹
脂鍍金物は、主としてABS樹脂よりなる熱可塑性樹脂
組成物を使用して得た樹脂成形品の表面に二液性ウレタ
ン硬化型インキを使用して印刷した後に鍍金処理を行う
ことにより、前記印刷部分に非鍍金面を得ることを特徴
とする。また本発明に係る樹脂鍍金物の使用方法は、前
記樹脂鍍金物を射出成形金型に挿入してポリエステル系
熱可塑性エラストマーを主成分とする熱可塑性樹脂組成
物を射出することにより、樹脂鍍金物の印刷部分にエラ
ストマー組成物が接着した一体化品を得ることを特徴と
する。
The present invention adopts the following means in order to achieve the above object. The resin-plated product according to the present invention is obtained by applying a plating treatment after printing with a two-component urethane curable ink on the surface of a resin molded product obtained by using a thermoplastic resin composition mainly composed of ABS resin. Thus, a non-plated surface is obtained on the printed portion. Further, the method for using the resin-plated product according to the present invention is to insert the resin-plated product into an injection molding die and inject a thermoplastic resin composition containing a polyester-based thermoplastic elastomer as a main component to obtain a resin-plated product. It is characterized in that an integrated product in which the elastomer composition is adhered to the printed portion of is obtained.

【0016】[樹脂成形品]樹脂成形品としては、主と
してABS樹脂よりなる熱可塑性樹脂組成物を使用して
成形されたものが使用できる。この熱可塑性樹脂組成物
中のポリブタジエン含量が大きい方が鍍金をし易いとみ
られる。ここで市販のABS樹脂には、ポリブタジエン
含量が比較的大きい高耐衝撃性タイプのもの,ポリブタ
ジエン含量が比較的小さい高流動性タイプのもの等があ
るが、鍍金処理におけるエッチング工程での処理剤の濃
度や処理時間の微調節によってこれらABS樹脂は鍍金
できるので、汎用ABS樹脂であればそのまま樹脂成形
品の原料として使用することに全く問題はない。またA
BS樹脂に他の樹脂(例えば20%程度のPC樹脂)を
含んでいても鍍金可能である。
[Resin Molded Product] As the resin molded product, a product molded by using a thermoplastic resin composition mainly composed of an ABS resin can be used. It is considered that the larger the polybutadiene content in this thermoplastic resin composition is, the easier the plating is. Commercially available ABS resins include high impact type resins having a relatively high polybutadiene content and high fluidity type resins having a relatively low polybutadiene content. Since these ABS resins can be plated by finely adjusting the concentration and the treatment time, there is no problem in using general-purpose ABS resins as they are as raw materials for resin molded products. Also A
Plating is possible even if the BS resin contains another resin (for example, about 20% PC resin).

【0017】[印刷インキ]印刷インキとしては、二液
性ウレタン硬化型インキが使用できる。この二液性ウレ
タン硬化型インキとしては、主液が塩化ビニル系,アク
リル系,又はポリオール系のポリマーやオリゴマーの溶
液であり、従液がポリイソシアネート化合物であるもの
が好ましく使用でき、特に主液が塩化ビニル系であるも
のが好ましく使用できる。
[Printing Ink] As the printing ink, a two-component urethane curable ink can be used. As the two-component urethane curable ink, those in which the main liquid is a solution of a vinyl chloride-based, acrylic-based, or polyol-based polymer or oligomer and the sub-liquid is a polyisocyanate compound can be preferably used, and particularly the main liquid The vinyl chloride type is preferably used.

【0018】この二液性ウレタン硬化型インキを使用し
て、ABS樹脂成形品の表面に印刷する。印刷方法とし
ては、スクリーン印刷やパッド印刷等の通常の印刷が使
用できるが、印刷の際にピンホールが生ずるとトラブル
の元となるので、二回刷り等により丁寧に印刷する。印
刷後のインキ硬化のために、通常は70〜80℃で1時
間以上加熱し、好ましくは60〜80℃で4〜12時間
加熱して焼付する。この焼付温度は、インキの物性から
言えばもっと高くても良いのだが、成形品の生地がAB
S系樹脂であり焼付温度を高くしすぎると成形品が軟化
して収縮したり変形したりするため、通常のABSを使
用した成形品であれば70℃,耐熱ABSを使用した成
形品であれば80℃が上限と思われる。
This two-component urethane curable ink is used to print on the surface of an ABS resin molded product. As a printing method, ordinary printing such as screen printing or pad printing can be used, but if pinholes occur during printing, it causes trouble, so printing is carefully performed by double printing or the like. In order to cure the ink after printing, it is usually heated at 70 to 80 ° C. for 1 hour or more, and preferably at 60 to 80 ° C. for 4 to 12 hours for printing. This printing temperature may be higher depending on the physical properties of the ink, but the fabric of the molded product is AB
If it is an S-based resin and the baking temperature is too high, the molded product will soften and shrink or deform, so if it is a molded product using ordinary ABS, it may be a molded product using heat resistant ABS at 70 ° C. For example, 80 ° C seems to be the upper limit.

【0019】この二液性ウレタン硬化型インキを使用し
た印刷において、ABS樹脂成形品の表面にキャラクタ
を印刷すると、後述する鍍金処理を行っても該印刷部分
には鍍金が付着しないため、印刷部分にキャラクタが表
示された非鍍金面を得ることができる。このキャラクタ
は、例えば文字,数字,記号,デザイン等である。この
ように表面に非鍍金面のキャラクタが表示されたABS
樹脂成形品は、例えば携帯電話端末のキーボードにおけ
るキートップ部材として好適に使用できる。
In printing using this two-component urethane curable ink, when a character is printed on the surface of the ABS resin molded product, the plating does not adhere to the printed portion even if the plating treatment described later is performed, and therefore the printed portion is not printed. It is possible to obtain the non-plated surface on which the character is displayed. This character is, for example, a letter, number, symbol, design, or the like. ABS with a non-plated character displayed on the surface like this
The resin molded product can be suitably used, for example, as a key top member in a keyboard of a mobile phone terminal.

【0020】[鍍金処理]上述の如く印刷及び焼付が行
われたABS樹脂成形品に鍍金処理が行われる。この鍍
金処理は、前述の如く洗浄工程,エッチング工程,触媒
付与工程,銅又はニッケルの無電解鍍金工程,ニッケル
又はクロムの電気鍍金工程,及び後処理工程が順を追っ
て実施される通常の方法で良い。なおエッチング工程の
進め方は、原料となる樹脂によって変化するが、これは
習熟した鍍金業者の手に委ねられる。この鍍金処理を行
うことにより得られる樹脂鍍金物では、印刷部分に非鍍
金面が得られると共に、印刷部分以外に鍍金面が得られ
る。
[Plating Treatment] The ABS resin molded product that has been printed and baked as described above is subjected to a plating treatment. This plating process is a normal method in which the cleaning process, the etching process, the catalyst application process, the electroless plating process of copper or nickel, the electroplating process of nickel or chromium, and the post-treatment process are sequentially performed as described above. good. The method of proceeding the etching process varies depending on the resin used as the raw material, but this is left to the hand of a well-known plating company. In the resin-plated product obtained by performing this plating treatment, the non-plated surface is obtained in the printed portion and the plated surface is obtained in the portion other than the printed portion.

【0021】[射出成形]前記特開平7−211187
号公報において開示されている方法と同様に、上述の如
く得られた該樹脂鍍金物を射出成形金型に挿入してポリ
エステル系TPE組成物を射出することにより、印刷部
分とポリエステル系TPE組成物が射出時の熱と圧力で
接着して、樹脂鍍金物の印刷部分にポリエステル系TP
E組成物が接着した一体化品を得ることができた。即ち
樹脂鍍金物の非鍍金面である印刷部分には、ポリエステ
ル系TPE組成物の射出に対して接着能力が残されてい
ることが確認できた。
[Injection molding] The above-mentioned Japanese Patent Laid-Open No. 7-211187
In the same manner as the method disclosed in Japanese Patent Laid-Open Publication No. JP-A No. 2004-115, the resin-plated product obtained as described above is inserted into an injection molding die and a polyester-based TPE composition is injected to obtain a printed portion and a polyester-based TPE composition. Is bonded by heat and pressure at the time of injection, and polyester TP is applied to the printed part of the resin-plated product.
An integrated product in which the E composition was adhered could be obtained. That is, it was confirmed that the printed portion, which is the non-plated surface of the resin-plated product, has the adhesive ability to the injection of the polyester-based TPE composition.

【0022】ここでポリエステル系TPEについて述べ
る。ポリエステル系TPEとしては、市販のポリアルキ
レンテレフタレートとポリメチレンエーテルグリコール
テレフタレートのブロックポリマーが使用でき、特にポ
リブチレンテレフタレート(以下「PBT」という。)
とポリテトラメチレンエーテルグリコールテレフタレー
ト(以下「PTMEG」という。)のマルチブロックポ
リマーが好ましく使用できる。
Here, the polyester TPE will be described. As the polyester-based TPE, a commercially available block polymer of polyalkylene terephthalate and polymethylene ether glycol terephthalate can be used, and particularly polybutylene terephthalate (hereinafter referred to as "PBT").
And a polytetramethylene ether glycol terephthalate (hereinafter referred to as “PTMEG”) multiblock polymer can be preferably used.

【0023】なお使用するポリエステル系TPEを主成
分とする熱可塑性樹脂組成物には、ポリエステル系TP
Eの他に軟質ポリマー,可塑剤,結晶化核剤,フィラ
ー,顔料,染料,離型促進剤等を含んでいても良い。軟
質ポリマーとしては、エチレンプロピレンゴム(以下
「EPR」という。),ニトリルゴム(以下「NBR」
という。),スチレンエチレンブチレンスチレンブロッ
クポリマー(以下「SEBS」という。),ポリプロピ
レン樹脂が使用できる。
The thermoplastic resin composition whose main component is the polyester-based TPE used is polyester-based TP.
In addition to E, a soft polymer, a plasticizer, a crystallization nucleating agent, a filler, a pigment, a dye, a mold release accelerator, etc. may be contained. As the soft polymer, ethylene propylene rubber (hereinafter referred to as "EPR"), nitrile rubber (hereinafter referred to as "NBR")
Say. ), Styrene ethylene butylene styrene block polymer (hereinafter referred to as “SEBS”), and polypropylene resin can be used.

【0024】[0024]

【発明の実施の形態】以下、本発明の実施の形態を、実
施例に代えて詳記する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in place of examples.

【0025】[実施例1]まずABS樹脂として「JS
RABS#42(JSR社製)」を使用して、図1に示
すABS樹脂製の樹脂成形品であるキートップ集合体1
を作成した。続いて二液性ウレタン硬化型インキとして
「VIC白(セイコーアドバンス社製)」をメーカー指
定の硬化剤と溶剤を使用して調合し、スクリーン印刷機
にて該二液性ウレタン硬化型インキを使用して、キート
ップ集合体1の各キートップ部材2において、その上面
に携帯電話端末のキーボードに使用される場合を想定し
たキャラクタを印刷すると共に、その下面を全面印刷し
た。そして印刷後のインキ硬化のために、熱風乾燥機に
入れて70℃で4時間加熱して焼付けた。
[Example 1] First, as an ABS resin, "JS
RABS # 42 (manufactured by JSR Corporation) "is used to form the key top assembly 1 which is a resin molded product made of ABS resin shown in FIG.
It was created. Subsequently, "VIC white (manufactured by Seiko Advance Co., Ltd.)" was prepared as a two-component urethane curable ink using a curing agent and a solvent specified by the manufacturer, and the two-component urethane curable ink was used on a screen printing machine. Then, in each of the keytop members 2 of the keytop assembly 1, a character is printed on the upper surface of the keytop member 2, which is supposed to be used for a keyboard of a mobile phone terminal, and the entire lower surface is printed. Then, in order to cure the ink after printing, it was placed in a hot air dryer and heated at 70 ° C. for 4 hours for baking.

【0026】続いてキートップ集合体1の枠部3及びサ
イドゲート4を除去して得たABS樹脂製のキートップ
部材2に対して通常の鍍金処理を行い、その表面に約3
μmの無電解銅鍍金,約6μmのニッケル電気鍍金,及
び約0.5μmのクロム電気鍍金を乗せた。ここでキー
トップ部材2の上面におけるキャラクタ印刷部分,及び
下面における印刷部分には全く鍍金は乗っておらず、そ
れ以外の面はすべて鍍金されていた。
Subsequently, the key top member 2 made of ABS resin obtained by removing the frame portion 3 and the side gate 4 of the key top assembly 1 is subjected to ordinary plating treatment, and the surface thereof is subjected to about 3
The electroless copper plating of μm, the nickel electroplating of about 6 μm, and the chrome electroplating of about 0.5 μm were placed. Here, the character printed portion on the upper surface of the key top member 2 and the printed portion on the lower surface were not plated at all, and the other surfaces were all plated.

【0027】この樹脂鍍金物であるキートップ部材2
を、図2に示す射出成形金型10に挿入して、ポリエス
テル系TPEを主成分とする熱可塑性樹脂組成物として
「プリマロイ1700(三菱化学社製)」を射出した。
なおプリマロイ1700の中身の詳細は公表されていな
いが概要は知られており、PBTとPTMEGのマルチ
ブロックポリマーであるポリエステル系TPEが主成分
で、多少のSEBSを含んでいるとのことである。ただ
し添加されている微量成分については不明である。
The key top member 2 which is this resin-plated product
2 was inserted into the injection molding die 10 shown in FIG. 2, and "Primalloy 1700 (manufactured by Mitsubishi Chemical Corporation)" was injected as a thermoplastic resin composition containing polyester TPE as a main component.
The details of the contents of Primalloy 1700 have not been published, but the outline is known, and it is said that the polyester-based TPE, which is a multi-block polymer of PBT and PTMEG, is the main component and contains some SEBS. However, it is unclear about the minor components added.

【0028】この射出成形では、具体的には、キートッ
プ部材2を可動側型板11の内部に挿入し固定側型板1
2との間で射出成形金型10を閉じて金型温度を30℃
とし、可動側型板11と固定側型板12の間に形成され
るキャビティ部14の内部に射出温度を220℃として
ピンゲート15からポリエステル系TPEを主成分とす
る熱可塑性樹脂組成物を射出し、キートップ部材2とポ
リエステル系TPE組成物が一体化した後に、射出成形
金型10を開けると共にエジェクタピン13で押し出し
て、図3に示す一体化物20を得た。この一体化物20
においては、キートップ部材2の印刷部分である非鍍金
面22にポリエステル系TPE組成物23が強固に接着
していた。
In this injection molding, specifically, the key top member 2 is inserted into the movable side template 11 and the fixed side template 1 is inserted.
2, the injection mold 10 is closed and the mold temperature is 30 ° C.
Then, the thermoplastic resin composition containing polyester-based TPE as a main component is injected from the pin gate 15 into the cavity portion 14 formed between the movable side mold plate 11 and the fixed side mold plate 12 at an injection temperature of 220 ° C. After the key top member 2 and the polyester-based TPE composition were integrated, the injection molding die 10 was opened and extruded with the ejector pin 13 to obtain an integrated product 20 shown in FIG. This integrated object 20
In the above, the polyester-based TPE composition 23 was firmly adhered to the non-plated surface 22 which is the printed portion of the key top member 2.

【0029】[0029]

【発明の効果】以上に詳記したように、本発明に係る樹
脂鍍金物によれば、主としてABS樹脂よりなる熱可塑
性樹脂組成物を使用して得た樹脂成形品の表面に二液性
ウレタン硬化型インキを使用して印刷した後に鍍金処理
を行うという簡便な方法により、前記印刷部分に非鍍金
面を得ることができる。また本発明に係る樹脂鍍金物に
よれば、前記樹脂成形品の表面に二液性ウレタン硬化型
インキを使用してキャラクタを印刷した後に鍍金処理を
行うという簡便な方法により、前記印刷部分に前記キャ
ラクタが表示された非鍍金面を得ることができる。さら
に本発明に係る樹脂鍍金物の使用方法によれば、前記樹
脂鍍金物を射出成形金型に挿入してポリエステル系TP
Eを主成分とする熱可塑性樹脂組成物を射出するという
簡便な方法により、樹脂鍍金物の前記印刷部分にポリエ
ステル系TPE組成物が接着した一体化品を得ることが
できる。
As described above in detail, according to the resin-plated product of the present invention, the two-component urethane is formed on the surface of the resin molded product obtained by using the thermoplastic resin composition mainly composed of ABS resin. The non-plated surface can be obtained in the printed portion by a simple method of performing plating treatment after printing using the curable ink. Further, according to the resin-plated product according to the present invention, a simple method of printing a character on the surface of the resin-molded product using a two-component urethane curable ink and then performing a plating process makes The non-plated surface on which the character is displayed can be obtained. Further, according to the method for using a resin-plated product according to the present invention, the resin-plated product is inserted into an injection molding die to make a polyester-based TP.
By a simple method of injecting a thermoplastic resin composition containing E as a main component, it is possible to obtain an integrated product in which the polyester-based TPE composition is adhered to the printed portion of the resin-plated product.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1(a)はABS樹脂製のキートップ集合体
を表す平面図であり、図1(b)は図1(a)のA−
A’線断面図である。
FIG. 1 (a) is a plan view showing a key top aggregate made of ABS resin, and FIG. 1 (b) is an A- of FIG. 1 (a).
It is an A'line sectional view.

【図2】図2は射出成形金型にABS樹脂製のキートッ
プ部材が挿入された状態を表す正面断面図である。
FIG. 2 is a front sectional view showing a state in which a key top member made of ABS resin is inserted into an injection molding die.

【図3】図3は射出成形により得られたABS樹脂製の
キートップ部材とポリエステル系TPE組成物との一体
化品を表す正面断面図である。
FIG. 3 is a front sectional view showing an integrated product of an ABS resin key top member and a polyester-based TPE composition obtained by injection molding.

【符号の説明】[Explanation of symbols]

1…キートップ集合体 2…(ABS樹脂製の)キートップ部材 3…枠部 4…サイドゲート 10…射出成形金型 11…可動側型板 12…固定側型板 13…エジェクタピン 14…キャビティ部 15…ピンゲート 20…一体化品 21…鍍金面(キャラクタ部分は非鍍金面) 22…非鍍金面 23…ポリエステル系TPE組成物 1 ... Key top assembly 2 ... Key top member (made of ABS resin) 3 ... frame part 4 ... Side gate 10 ... Injection mold 11 ... movable side template 12 ... Fixed side template 13 ... Ejector pin 14 ... Cavity part 15 ... Pin Gate 20 ... Integrated product 21 ... Plating surface (character part is non-plating surface) 22 ... Non-plated surface 23 ... Polyester type TPE composition

───────────────────────────────────────────────────── フロントページの続き (72)発明者 後藤 崇 東京都中央区日本橋本町1丁目1番9号 大成プラス株式会社内 (72)発明者 大友 和男 東京都中央区日本橋本町1丁目1番9号 大成プラス株式会社内 Fターム(参考) 4F100 AB13C AB16C AB17C AK51B AK74A BA03 BA07 BA10C EH71C GB48 HB31B JD08 JG03 JL00 JL09 4K024 AA02 AA03 AB08 BA14 BB21 BC04 FA07 GA02    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takashi Goto             1-9 Nihonbashihonmachi, Chuo-ku, Tokyo             Within Taisei Plus Co., Ltd. (72) Inventor Kazuo Otomo             1-9 Nihonbashihonmachi, Chuo-ku, Tokyo             Within Taisei Plus Co., Ltd. F-term (reference) 4F100 AB13C AB16C AB17C AK51B                       AK74A BA03 BA07 BA10C                       EH71C GB48 HB31B JD08                       JG03 JL00 JL09                 4K024 AA02 AA03 AB08 BA14 BB21                       BC04 FA07 GA02

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】主としてアクリロニトリル・ブタジエン・
スチレン樹脂よりなる熱可塑性樹脂組成物を使用して得
た樹脂成形品の表面に二液性ウレタン硬化型インキを使
用して印刷した後に鍍金処理を行うことにより、前記印
刷部分に非鍍金面を得ることを特徴とする樹脂鍍金物。
1. Mainly acrylonitrile-butadiene-
By printing using a two-component urethane curable ink on the surface of a resin molded product obtained by using a thermoplastic resin composition comprising a styrene resin, and then performing a plating treatment, a non-plated surface is formed on the printed portion. A resin-plated product characterized by being obtained.
【請求項2】請求項1に記載した樹脂鍍金物であって、 前記樹脂成形品の表面に二液性ウレタン硬化型インキを
使用してキャラクタを印刷した後に鍍金処理を行うこと
により、前記印刷部分に前記キャラクタが表示された非
鍍金面を得ることを特徴とする樹脂鍍金物。
2. The resin-plated product according to claim 1, wherein a character is printed on the surface of the resin-molded product using a two-component urethane curable ink, and then a plating process is performed to perform the printing. A resin-plated product, characterized in that a non-plated surface having the character displayed on a portion thereof is obtained.
【請求項3】請求項1に記載した樹脂鍍金物を射出成形
金型に挿入してポリエステル系熱可塑性エラストマーを
主成分とする熱可塑性樹脂組成物を射出することによ
り、前記樹脂鍍金物の前記印刷部分に前記エラストマー
組成物が接着した一体化品を得ることを特徴とする樹脂
鍍金物の使用方法。
3. The resin-plated product obtained by inserting the resin-plated product according to claim 1 into an injection molding die and injecting a thermoplastic resin composition containing a polyester-based thermoplastic elastomer as a main component. A method for using a resin-plated product, which comprises obtaining an integrated product in which the elastomer composition is adhered to a printed portion.
JP2001278631A 2001-09-13 2001-09-13 Plated resin article and method of use therefor Pending JP2003082494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001278631A JP2003082494A (en) 2001-09-13 2001-09-13 Plated resin article and method of use therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001278631A JP2003082494A (en) 2001-09-13 2001-09-13 Plated resin article and method of use therefor

Publications (1)

Publication Number Publication Date
JP2003082494A true JP2003082494A (en) 2003-03-19

Family

ID=19102968

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2003082494A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100431080C (en) * 2005-04-29 2008-11-05 乐金电子(昆山)电脑有限公司 Press button module and its producing method
JP2013194293A (en) * 2012-03-21 2013-09-30 Taiyo Manufacturing Co Ltd Partially plated plastic molding and method for manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929959B1 (en) * 1970-01-20 1974-08-08
JPS58193390A (en) * 1982-05-06 1983-11-11 Mitsubishi Rayon Co Ltd Method of partially plating plastics
JPS58194922A (en) * 1982-05-08 1983-11-14 Pioneer Electronic Corp Partial plating of plastic
JPS59126790A (en) * 1983-01-10 1984-07-21 Kanto Kasei Kogyo Kk Multicolor plating method of plastic molding
JPS59191734A (en) * 1983-04-14 1984-10-30 Takara Seisakusho:Kk Formation of image area on synthetic resin molding
JPH07211187A (en) * 1994-01-10 1995-08-11 Japan Synthetic Rubber Co Ltd Keyboard switch and manufacture thereof
JPH11232959A (en) * 1998-02-12 1999-08-27 Musashi Kako Kk Switch and manufacture thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929959B1 (en) * 1970-01-20 1974-08-08
JPS58193390A (en) * 1982-05-06 1983-11-11 Mitsubishi Rayon Co Ltd Method of partially plating plastics
JPS58194922A (en) * 1982-05-08 1983-11-14 Pioneer Electronic Corp Partial plating of plastic
JPS59126790A (en) * 1983-01-10 1984-07-21 Kanto Kasei Kogyo Kk Multicolor plating method of plastic molding
JPS59191734A (en) * 1983-04-14 1984-10-30 Takara Seisakusho:Kk Formation of image area on synthetic resin molding
JPH07211187A (en) * 1994-01-10 1995-08-11 Japan Synthetic Rubber Co Ltd Keyboard switch and manufacture thereof
JPH11232959A (en) * 1998-02-12 1999-08-27 Musashi Kako Kk Switch and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100431080C (en) * 2005-04-29 2008-11-05 乐金电子(昆山)电脑有限公司 Press button module and its producing method
JP2013194293A (en) * 2012-03-21 2013-09-30 Taiyo Manufacturing Co Ltd Partially plated plastic molding and method for manufacturing the same

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