JP2003080641A - Antistatic multi-layer film and its production method - Google Patents

Antistatic multi-layer film and its production method

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Publication number
JP2003080641A
JP2003080641A JP2001280577A JP2001280577A JP2003080641A JP 2003080641 A JP2003080641 A JP 2003080641A JP 2001280577 A JP2001280577 A JP 2001280577A JP 2001280577 A JP2001280577 A JP 2001280577A JP 2003080641 A JP2003080641 A JP 2003080641A
Authority
JP
Japan
Prior art keywords
antistatic
layer
multilayer film
thermoplastic resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001280577A
Other languages
Japanese (ja)
Inventor
Katsunori Iwasaki
勝則 岩崎
Teru Kobayashi
照 小林
Takumi Maruyama
巧 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamapoly Co Ltd
Original Assignee
Tamapoly Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamapoly Co Ltd filed Critical Tamapoly Co Ltd
Priority to JP2001280577A priority Critical patent/JP2003080641A/en
Publication of JP2003080641A publication Critical patent/JP2003080641A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive antistatic multi-layer thermoplastic resin film which is excellent in antistatic effect and keeps the effect while preventing its change with the passage of time and to provide a method for producing the film. SOLUTION: In the antistatic multi-layer film, on both sides of a thermoplastic resin layer substantially free from an antistatic agent, antistatic layers 3-30 μm in thickness which are thinner than the thermoplastic resin layer and contain a polymeric antistatic agent having specific surface resistance of 10<9> Ω/(square) or below and a half-life shorter than one second are formed. The film is produced by a coextrusion method.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明が属する技術分野】本発明は帯電防止効果、非ブ
リード性(非移行性)、経時変化等に優れた熱可塑性樹
脂の高性能かつ安価な帯電防止フィルムとその製造方法
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-performance and inexpensive antistatic film of a thermoplastic resin which is excellent in antistatic effect, non-bleeding property (non-migrating property), aging and the like, and a method for producing the same.

【0002】[0002]

【従来の技術】従来の熱可塑性樹脂製の帯電防止フィル
ムは、アルキルアミン、グリセリンステアレート、アル
コール等の低分子量の帯電防止剤である界面活性剤を熱
可塑性樹脂に0.25重量%程度練込むことによって得
られ、そのフィルムの表面固有抵抗は、帯電防止剤がフ
ィルムの表面にブリードすることにより、1011〜1
13Ω/□のものが一般的であった。ただし、この帯
電防止効果のレベルでは、埃や粉体等の付着防止には十
分使用に耐えるが、プリント配線板、IC、トランジス
タ、コンデンサー、抵抗器等の電気・電子製品等で静電
気障害に敏感な部品や製品の場合、帯電防止効果及び表
面にブリードした帯電防止剤の移行による汚染等の問題
があり、電気・電子部品包装用としては不十分であり、
食品包装用が主用途であった。
2. Description of the Related Art A conventional antistatic film made of a thermoplastic resin is prepared by kneading a thermoplastic resin with a surfactant, which is a low molecular weight antistatic agent such as alkylamine, glycerin stearate and alcohol, in an amount of about 0.25% by weight. The surface resistivity of the film is 10 11 to 1 by the bleeding of the antistatic agent on the surface of the film.
It was generally 0 13 Ω / □. However, at the level of this antistatic effect, it can withstand the use of dust and powder to prevent it from adhering, but is sensitive to electrostatic damage in electric and electronic products such as printed wiring boards, ICs, transistors, capacitors, and resistors. In the case of various parts and products, there are problems such as antistatic effect and contamination due to migration of antistatic agent bleeding on the surface, which is insufficient for packaging electric and electronic parts.
It was mainly used for food packaging.

【0003】一方、最近ポリマータイプの帯電防止剤が
開発され、熱可塑性樹脂に10〜30重量%添加する事
により表面固有抵抗が10〜1011Ω/□の帯電防
止フィルムの製造が可能となり、このポリマータイプの
帯電防止剤は非ブリード性(非移行性)であるために上
記問題点は解消されたが、表面固有抵抗が10Ω/□
以下で且つ半減期1秒未満の更に高性能な帯電防止フィ
ルムを安価に製造する技術は存在していなかった。
On the other hand, recently, a polymer type antistatic agent has been developed, and by adding 10 to 30% by weight to a thermoplastic resin, it becomes possible to produce an antistatic film having a surface specific resistance of 10 9 to 10 11 Ω / □. , The polymer type antistatic agent has a non-bleeding property (non-migrating property), so the above problems have been solved, but the surface specific resistance is 10 9 Ω / □.
There has been no technology for inexpensively producing a higher-performance antistatic film having the following half-life of less than 1 second.

【0004】[0004]

【発明が解決しようとする課題】発明者等は、上記従来
技術の問題点を解決するために種々検討を重ねた結果、
帯電防止フィルムの性能は大部分が表面部分の帯電防止
性能によって定まり、帯電防止フィルムの内部の帯電防
止性能はほとんど影響を与えないことを見出し、本発明
を完成するに至ったものである。
DISCLOSURE OF THE INVENTION As a result of various investigations by the inventors, in order to solve the above-mentioned problems of the prior art,
The present inventors have completed the present invention by finding that the performance of the antistatic film is largely determined by the antistatic performance of the surface portion, and that the antistatic performance inside the antistatic film has almost no effect.

【0005】すなわち、本発明は、従来技術では製造す
る事ができなかった表面固有抵抗が10Ω/□以下で
且つ半減期1秒未満の安価な熱可塑性樹脂の帯電防止フ
ィルムとその製造方法を提供することを目的とするもの
である。
That is, the present invention provides an inexpensive antistatic film of a thermoplastic resin having a surface resistivity of 10 9 Ω / □ or less and a half-life of less than 1 second, which could not be produced by the prior art, and a method for producing the same. It is intended to provide.

【0006】[0006]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明によれば、帯電防止剤を実質的に含まない
熱可塑性樹脂層の両側の外層として、当該熱可塑性樹脂
層よりも薄く、表面固有抵抗が10Ω/□以下であ
り、半減期が1秒未満であるポリマータイプの帯電防止
剤を含有する厚み3〜30μmの帯電防止層を設けた3
層以上からなる帯電防止多層フィルムが提供される。
In order to achieve the above-mentioned object, according to the present invention, as an outer layer on both sides of a thermoplastic resin layer which does not substantially contain an antistatic agent, the thermoplastic resin layer is more preferable than the thermoplastic resin layer. A thin antistatic layer containing a polymer type antistatic agent having a surface resistivity of 10 9 Ω / □ or less and a half-life of less than 1 second and having a thickness of 3 to 30 μm was provided 3.
An antistatic multilayer film comprising more than one layer is provided.

【0007】本発明の別の態様によれば、前記ポリマー
タイプ帯電防止剤の濃度が50〜100重量%である帯
電防止フィルムが提供される。本発明のさらなる別の態
様によれば、前記帯電防止剤を実質的に含まない熱可塑
性樹脂層の熱可塑性樹脂が各種ポリエチレン、ポリプロ
ピレン、ポリアミド、ポリエチレンテレフタレート(P
ET)及びエチレンビニルアルコール共重合体(EVO
H)又はそれらの配合物である帯電防止フィルムが提供
される。
According to another aspect of the present invention, there is provided an antistatic film in which the concentration of the polymer type antistatic agent is 50 to 100% by weight. According to still another aspect of the present invention, the thermoplastic resin of the thermoplastic resin layer that does not substantially contain the antistatic agent is polyethylene, polypropylene, polyamide, polyethylene terephthalate (P
ET) and ethylene vinyl alcohol copolymer (EVO
H) or blends thereof are provided.

【0008】また、本発明の別の態様では、前記両側の
帯電防止層に含有されるポリマータイプ帯電防止剤の濃
度及び/又は種類がそれぞれ異なり、少なくとも3種類
の層からなる帯電防止多層フィルムが提供される。本発
明のさらなる別の態様によれば前記熱可塑性樹脂層と前
記両側の帯電防止層の少なくとも一方との間に機能性付
与樹脂層を設けた帯電防止多層フィルムが提供される。
さらに、本発明のさらなる別の態様によれば、前記帯電
防止多層フィルムの合計厚みが20〜300μmである
帯電防止フィルムが提供される。
According to another aspect of the present invention, there is provided an antistatic multilayer film comprising at least three kinds of layers, each having a different concentration and / or kind of the polymer type antistatic agent contained in the antistatic layers on both sides. Provided. According to still another aspect of the present invention, there is provided an antistatic multilayer film having a functionalizing resin layer provided between the thermoplastic resin layer and at least one of the antistatic layers on both sides.
Further, according to still another aspect of the present invention, there is provided an antistatic film in which the total thickness of the antistatic multilayer film is 20 to 300 μm.

【0009】さらに、本発明によれば、前記帯電多層防
止フィルムをインフレーション方式又はT−ダイ方式の
共押出し多層フィルム成形法により成形する帯電防止フ
ィルムの製造方法が提供される。
Further, according to the present invention, there is provided a method for producing an antistatic film, wherein the antistatic multilayer film is formed by an inflation type or T-die type coextrusion multilayer film forming method.

【0010】[0010]

【発明の実施の形態】なお、本発明における表面固有抵
抗は、全てJIS−K−6911に基づき、同じく半減
期は全てJIS−L1094に基づき、測定温度:23
℃、測定湿度:50%RHにおいて測定した値を示す。
The surface resistivity in the present invention is based on JIS-K-6911, and the half-life is also based on JIS-L1094. Measured temperature: 23
C, measured humidity: The value measured at 50% RH is shown.

【0011】本発明において、中間層の熱可塑性樹脂層
(以下、「B層」ということがある。)とその両側の帯
電防止層(以下、「A層」又は「C層」ということがあ
る。)の厚み比(B層の厚み/(A層及びC層の厚みの
合計))は1.1〜20好ましくは2〜15であり、且
つ、A層及びC層の厚みの合計は3〜30μm、好まし
くは5〜20μmである。厚み比が1.0以下では単層
フィルムに比べコスト削減効果は小さく、厚み比が20
以上になると多層フィルムの帯電防止効果が低下する。
また、帯電防止層の合計厚みが3μm以下では帯電防止
の安定性に欠け、30μm以上ではオーバースペックで
ありコスト高となり発明の効果が薄れる。
In the present invention, an intermediate thermoplastic resin layer (hereinafter sometimes referred to as "B layer") and antistatic layers on both sides thereof (hereinafter sometimes referred to as "A layer" or "C layer"). .) (The thickness of the B layer / (the total thickness of the A layer and the C layer)) is 1.1 to 20, preferably 2 to 15, and the total thickness of the A layer and the C layer is 3. -30 μm, preferably 5-20 μm. When the thickness ratio is 1.0 or less, the cost reduction effect is smaller than that of the monolayer film, and the thickness ratio is 20.
When it becomes above, the antistatic effect of a multilayer film will fall.
If the total thickness of the antistatic layer is 3 μm or less, the antistatic stability is insufficient, and if the total thickness is 30 μm or more, the specifications are high and the cost is high.

【0012】従来はポリマータイプの帯電防止剤を熱可
塑性樹脂に10〜30重量%練込んだ単層フィルムとし
て使用されており、フィルムコストが高いにもかかわら
ず表面固有抵抗は1010Ω/□が限界であったが、本
発明によれば、中間層は帯電防止剤を無添加にしても単
層フィルムと同等の帯電防止効果を有し、表面固有抵抗
10Ω/□以下で且つ半減期1秒未満の高性能な帯電
防止フィルムを安価に得ることが可能となった。
Conventionally, a polymer type antistatic agent is used as a single layer film in which 10 to 30% by weight of a thermoplastic resin is kneaded, and the surface resistivity is 10 10 Ω / □ even though the film cost is high. However, according to the present invention, the intermediate layer has an antistatic effect equivalent to that of a monolayer film even if an antistatic agent is not added, and has a surface specific resistance of 10 9 Ω / □ or less and a half. It has become possible to inexpensively obtain a high-performance antistatic film having a period of less than 1 second.

【0013】本発明において、これらの熱可塑性樹脂
は、押出成形が可能で用途に適した強度等の樹脂性能を
有していればよく、一般的には次のものが選ばれる。即
ち、各種ポリエチレン及びエチレン系共重合体やポリプ
ロピレン等のポリオレフィンの他にポリアミド、ポリエ
チレンテレフタレート(PET)、エチレンビニルアル
コール共重合体(EVOH)等の熱可塑性樹脂及びそれ
らの配合物が使用できる。
In the present invention, these thermoplastic resins have only to be capable of extrusion molding and have resin properties such as strength suitable for the application, and the following ones are generally selected. That is, in addition to various polyethylenes and polyolefins such as ethylene-based copolymers and polypropylene, thermoplastic resins such as polyamide, polyethylene terephthalate (PET), ethylene vinyl alcohol copolymer (EVOH), and blends thereof can be used.

【0014】本発明で使用するポリマータイプの帯電防
止剤としては、ポリアミドベースの変性樹脂に過塩素酸
ナトリウム・一水化物等の塩を添加した混合物であるチ
バ・スペシャルテイ・ケミカルズ株式会社のIRGAS
TAT(登録商標名)P18や三井・デュポンポリケミ
カル株式会社の金属イオンにカリウムを使用したアイオ
ノマー樹脂に多価アルコールを添加した混合物であるS
D100(商品名)等が好適である。これらは表面固有
抵抗が10〜10Ω/□と良好な帯電防止剤である
が、価格が非常に高いために、従来は、単体として使用
されることはなく、熱可塑性樹脂に20重量%程度ブレ
ンドした単層フィルムとして使用されていた。
The polymer type antistatic agent used in the present invention is a mixture of a polyamide-based modified resin and a salt such as sodium perchlorate and monohydrate, and is an IRGAS manufactured by Ciba Specialty Chemicals Co., Ltd.
It is a mixture of TAT (registered trademark) P18 and Mitsui DuPont Polychemical Co., Ltd., which is an ionomer resin containing potassium as a metal ion and a polyhydric alcohol added thereto.
D100 (trade name) and the like are suitable. These are good antistatic agents with a surface resistivity of 10 7 to 10 9 Ω / □, but since they are very expensive, they have not been used as a single substance until now, and 20 wt% of the thermoplastic resin has been used. It was used as a single-layer film blended by about 100%.

【0015】これらのポリマータイプの帯電防止剤は、
その帯電防止機能を損なわない範囲において、基材との
接着性向上のために、基材である熱可塑性樹脂と配合し
たり、その他の機能性材料を配合しても良い。帯電防止
機能及び経済性の点で適切なポリマータイプの帯電防止
剤の濃度は、50〜100重量%であることが好まし
い。
These polymer type antistatic agents are
As long as the antistatic function is not impaired, the base material may be blended with a thermoplastic resin or other functional material in order to improve the adhesion to the base material. The concentration of the polymer type antistatic agent suitable from the viewpoint of antistatic function and economy is preferably 50 to 100% by weight.

【0016】本発明の実質的に帯電防止剤を含まないB
層の両側に帯電防止層A層及びC層を設けた多層フィル
ムとしては、2種3層又は3種3層の多層フィルムとす
ることができ、前者はA層とC層が同一組成の場合に一
般的に用いられ、後者は帯電防止剤の添加量を変えた
り、ブロッキング防止剤、滑剤、紫外線吸収剤、防錆剤
等の他の機能性を付与する添加剤をA層又はC層に添加
した機能性付与樹脂層とする場合に用いられる。なお、
中間層(B層)とA層及びC層との間に接着樹脂層を必
要とする場合は5層となる。
B containing substantially no antistatic agent of the present invention
The multilayer film in which the antistatic layer A layer and the antistatic layer C are provided on both sides of the layer can be a 2 type 3 layer or a 3 type 3 layer multilayer film. In the former case, the A layer and the C layer have the same composition. The latter is commonly used in the A layer or C layer, and the latter contains various additives such as an antistatic agent, an antiblocking agent, a lubricant, an ultraviolet absorber, and a rust preventive, which impart other functionalities. It is used when the added function-imparting resin layer is formed. In addition,
When an adhesive resin layer is required between the intermediate layer (B layer) and the A and C layers, the number of layers is five.

【0017】また、本発明の帯電防止多層フィルムにガ
スバリヤー性を付与させるために、中間層又は中間層の
熱可塑性樹脂層と両側の帯電防止層の少なくとも一方と
の間にEVOH、ポリアミド等のガスバリヤー性樹脂層
を設けることもできる。ガスバリヤー性樹脂層は一般的
に熱可塑性樹脂層との接着性が良くないために中間に接
着性樹脂層を必要とし、その場合の本発明の多層フィル
ムは、少なくとも4種7層となる。
In order to impart a gas barrier property to the antistatic multilayer film of the present invention, EVOH, polyamide, etc. are provided between the intermediate layer or the thermoplastic resin layer of the intermediate layer and at least one of the antistatic layers on both sides. A gas barrier resin layer can also be provided. Since the gas barrier resin layer generally does not have good adhesiveness with the thermoplastic resin layer, an adhesive resin layer is required in the middle, and in that case, the multilayer film of the present invention has at least 4 layers and 7 layers.

【0018】本発明の帯電防止多層フィルムは、インフ
レーション方式又はT−ダイ方式のいずれかの共押出し
多層フィルム成形方法を採用することができる。成形温
度は、使用樹脂により異なるが、インフレーション方式
の場合、170〜210℃の範囲が、T−ダイ方式の場
合、200〜240℃の範囲が好ましい。
For the antistatic multilayer film of the present invention, either an inflation type or a T-die type coextrusion multilayer film forming method can be adopted. The molding temperature varies depending on the resin used, but is preferably 170 to 210 ° C. for the inflation method and 200 to 240 ° C. for the T-die method.

【0019】以下、本発明の具体例及びその効果を実施
例及び比較例を用いて説明するが、本発明はこれによっ
て限定されるものではない。
Specific examples and effects of the present invention will be described below with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

【0020】[0020]

【実施例1】ダイス直径150mmの3種5層インフレ
ーション成形装置を使用し、外層(A層)にチバ・スペ
シャルテイ・ケミカルズ株式会社製のポリマータイプの
帯電防止剤IRGASTAT P18(共重合ナイロン
ベース)、中間の熱可塑性樹脂層(B層)にMFR2g
/10分、密度0.923g/cmの滑剤無添加の低
密度ポリエチレン(LDPE)、両者の接着性樹脂(C
層)として三井化学株式会社製の無水マレイン酸変性ポ
リエチレンであるアドマーNF300(商品名、MFR
1.3g/分、密度0.94g/cm)を用いた。各
層の厚みは(A層)10μm/(C層)5μm/(B
層)30μm/(C層)5μm/(A層)10μmの合
計膜厚60μmとし、樹脂温度200℃で成形した。こ
の場合の外層と中間層の層比は1:4:1である。
Example 1 A three-type five-layer inflation molding apparatus with a die diameter of 150 mm was used, and the outer layer (A layer) was a polymer type antistatic agent IRGASTAT P18 (copolymerized nylon base) manufactured by Ciba Specialty Chemicals Co., Ltd. , MFR2g in the middle thermoplastic resin layer (B layer)
/ 10 minutes, low-density polyethylene (LDPE) without lubricant with a density of 0.923 g / cm 3 , adhesive resin (C
Admer NF300 (trade name, MFR) which is a maleic anhydride modified polyethylene manufactured by Mitsui Chemicals, Inc.
1.3 g / min, density 0.94 g / cm 3 ) was used. The thickness of each layer is (A layer) 10 μm / (C layer) 5 μm / (B
Layer) 30 μm / (C layer) 5 μm / (A layer) 10 μm with a total film thickness of 60 μm, and molding was performed at a resin temperature of 200 ° C. In this case, the layer ratio of the outer layer to the intermediate layer is 1: 4: 1.

【0021】得られた3種5層フィルムを恒温室(23
℃−50%RH、以下同じ)で7日間状態調節後の表面
固有抵抗は2×10Ω/□、半減期(シシド静電気製
スタチック・オネストメーターH0110型で測定)
0.2秒未満、耐電圧0.01KVであった。
The obtained three-kind five-layer film was placed in a thermostatic chamber (23
Surface resistivity after conditioning for 7 days at ℃ -50% RH, 2 × 10 8 Ω / □, half-life (measured with static Honest meter H0110 manufactured by Shishido Electrostatic)
The withstand voltage was 0.01 KV in less than 0.2 seconds.

【0022】[0022]

【実施例2】ダイス直径150mmの3種3層インフレ
ーション成形装置を使用し、中間層(B層)にMFR
1.5g/10分、密度0.924g/cmの滑剤無
添加の低密度ポリエチレン(LDPE)、両側の外層
(A層)にはチバ・スペシャルテイ・ケミカルズ株式会
社製のポリマータイプの永久帯電防止剤であるIRGA
STAT P18(共重合ナイロンベース)65部に上
記LDPE 30部と目やに改良剤として日本ポリオレ
フィン株式会社のレクスパール(登録商標名)ET18
2(エチレンとアクリル酸エステルと酸無水物の共重合
体、MFR8g/10分、密度0.94)5部添加し、
外層(A層)と中間層(B層)の層比1:4:1(10
μm/40μm/10μm)で合計膜厚60μmのフィ
ルムを樹脂温度200℃にて成形した。
[Example 2] A three-layer, three-layer inflation molding apparatus with a die diameter of 150 mm was used, and the intermediate layer (B layer) was MFR.
Low-density polyethylene (LDPE) with a lubricant of 1.5 g / 10 min and a density of 0.924 g / cm 3 , and the outer layer (A layer) on both sides is a polymer type permanent charge made by Ciba Specialty Chemicals Co., Ltd. IRGA which is an inhibitor
30 parts of the LDPE in 65 parts of STAT P18 (copolymerized nylon base) and Lexpearl (registered trademark) ET18 of Japan Polyolefin Co., Ltd. as an eye improver
5 parts of 2 (copolymer of ethylene, acrylic ester and acid anhydride, MFR 8 g / 10 min, density 0.94) was added,
Layer ratio of outer layer (A layer) to intermediate layer (B layer) 1: 4: 1 (10
(μm / 40 μm / 10 μm) and a total film thickness of 60 μm were molded at a resin temperature of 200 ° C.

【0023】得られた2種3層フィルムは、恒温室7日
間後の表面固有抵抗9×10Ω/□、半減期(シシド
静電気製スタチックオネストメーターで測定)0.3
秒、耐電圧0.03KVであった。また、帯電防止剤は
ポリアミドベースであるが、A層には低密度ポリエチレ
ン(LDPE)を30部、ET182を5部添加してあ
るので中間層のLDPE(B層)と両側のA層との接着
は実用上問題なかった。
The obtained two-kind three-layer film had a surface resistivity of 9 × 10 8 Ω / □ after 7 days in a temperature-controlled room, and a half-life (measured by a static Honest meter manufactured by Shishido Electrostatics) 0.3.
The withstand voltage was 0.03 KV. Although the antistatic agent is a polyamide base, 30 parts of low density polyethylene (LDPE) and 5 parts of ET182 are added to the A layer, so that the LDPE (B layer) of the intermediate layer and the A layers on both sides are Adhesion was not a problem in practical use.

【0024】[0024]

【実施例3】ダイス幅1.5mの3種5層のT−ダイ成
形装置を使用し、外層(A層)にチバ・スペシャルテイ
・ケミカルズ(株)のIRGASTAT P18、中間
層(B層)にMFR3.5g/10分、密度0.930
のシングルサイト系触媒による直鎖状低密度ポリエチレ
ン(LLD)、両者の接着層に日本ポリオレフィン
(株)のアドテックスER507L−5(商品名、MF
R2.8g/10分、密度0.92)を使用し、各層の
厚みは(A層)5μm/(C層)5μm/(B層)50
μm/(C層)5μm/(A層)5μmの合計70μm
とし、樹脂温度220℃で成形した。この場合の外層
(A層)と中間層(B層+C層)の層比は1:12:1
である。得られた3種5層フィルムの恒温室7日間後の
表面固有抵抗は5×10Ω/□、半減期0.3秒、耐
電圧0.03KVであった。
[Example 3] A T-die molding machine of three types and five layers having a die width of 1.5 m was used, and IRGASTAT P18 from Ciba Specialty Chemicals Co., Ltd. as an outer layer (A layer) and an intermediate layer (B layer). MFR 3.5g / 10min, density 0.930
Linear low-density polyethylene (LLD) with a single-site type catalyst of Adtex ER507L-5 (trade name, MF of Japan Polyolefin Co., Ltd.)
R2.8 g / 10 min, density 0.92) is used, and the thickness of each layer is (A layer) 5 μm / (C layer) 5 μm / (B layer) 50
70 μm in total of μm / (C layer) 5 μm / (A layer) 5 μm
And was molded at a resin temperature of 220 ° C. In this case, the layer ratio of the outer layer (A layer) to the intermediate layer (B layer + C layer) is 1: 12: 1.
Is. The surface resistivity of the obtained three-kind five-layer film after 7 days in a constant temperature room was 5 × 10 8 Ω / □, a half-life of 0.3 seconds, and a withstand voltage of 0.03 KV.

【0025】[0025]

【実施例4】ダイス直径150mmの3種3層インフレ
ーション成形装置を使用し、中間層(B層)にMFR
2.0g/10分、密度921g/cmの滑剤入り低
密度ポリエチレン(LDPE)、両側の外層(A層)に
は三井・デュポンポリケミカル株式会社製のカリウムタ
イプのアイオノマーに多価アルコールを添加したポリマ
ータイプの帯電防止剤SD100が60部に上記LDP
E 40部を添加したものを用いた。外層(A層)と中
間層(B層)の層比1:4:1(10μm/40μm/
10μm)で60μmのフィルムを樹脂温度180℃で
成形した。得られた2種3層フィルムの恒温室14日後
の表面固有抵抗は5×10Ω/□、半減期0.2秒未
満、耐電圧0.01KV未満であった。なお、本帯電防
剤は湿度依存性が大きく70%RHの時の表面固有抵抗
は9×10Ω/□であった。
[Example 4] A three-layer three-layer inflation molding apparatus having a die diameter of 150 mm was used, and the intermediate layer (B layer) was MFR.
Low-density polyethylene (LDPE) with a lubricant of 2.0 g / 10 minutes and a density of 921 g / cm 3 , and the outer layer (A layer) on both sides is a polyhydric alcohol added to a potassium type ionomer manufactured by Mitsui DuPont Polychemical Co., Ltd. Polymer type antistatic agent SD100 was added to the above LDP in 60 parts.
The one to which 40 parts of E was added was used. Layer ratio of outer layer (A layer) to intermediate layer (B layer) 1: 4: 1 (10 μm / 40 μm /
A film having a thickness of 10 μm and a thickness of 60 μm was formed at a resin temperature of 180 ° C. The surface resistivity of the obtained two-kind three-layer film after 14 days in a temperature-controlled room was 5 × 10 9 Ω / □, a half-life of less than 0.2 seconds, and a withstand voltage of less than 0.01 KV. The antistatic agent had a large humidity dependency and had a surface specific resistance of 9 × 10 7 Ω / □ at 70% RH.

【0026】[0026]

【比較例1】ダイス直径150mmのインフレーション
成形装置を使用し、ポリマータイプの帯電防止剤IRG
ASTAT P18の60μm単層フィルムを樹脂温度
210℃で成形した。得られた単層フィルムの表面固有
抵抗は3×10Ω/□、半減期0.2秒未満、耐電圧
0.01KVであり、実施例1と同等であった。ただ
し、材料コストは実施例1の2.5倍と非常に高くなり
実用性に欠けたものである。
[Comparative Example 1] A polymer type antistatic agent IRG was used by using an inflation molding apparatus with a die diameter of 150 mm.
A 60 μm single layer film of ASTAT P18 was molded at a resin temperature of 210 ° C. The surface resistivity of the obtained monolayer film was 3 × 10 8 Ω / □, the half-life was less than 0.2 seconds, and the withstand voltage was 0.01 KV, which was the same as in Example 1. However, the material cost was 2.5 times as high as that of Example 1 and was very impractical.

【0027】[0027]

【比較例2】フィルム厚みを70μmにする以外は比較
例1と同一とした。帯電防止効果は実施例3より若干良
好であるが、材料コストは実施例3と比べ5倍も高くな
りまったく実用性に欠ける。
Comparative Example 2 The same as Comparative Example 1 except that the film thickness was 70 μm. The antistatic effect is slightly better than that of Example 3, but the material cost is 5 times higher than that of Example 3 and is completely impractical.

【0028】[0028]

【発明の効果】本発明により、帯電防止効果、非ブリー
ド性(非移行性)、経時変化等に優れた熱可塑性樹脂の
高性能かつ安価な帯電防止多層フィルム及びその製造方
法が提供され、この発明による帯電防止多層フィルム
は、静電気障害を受けるプリント配線板、IC、トラン
ジスタ、コンデンサー、抵抗器等の各種電気・電子製品
の包装用として好適であるばかりか、食品包装用用途に
も使用できるものである。
The present invention provides a high-performance and inexpensive antistatic multilayer film of a thermoplastic resin excellent in antistatic effect, non-bleeding property (non-migrating property), aging and the like, and a method for producing the same. The antistatic multilayer film according to the invention is suitable not only for packaging various electric / electronic products such as printed wiring boards, ICs, transistors, capacitors, resistors, etc., which are subject to electrostatic damage, but can also be used for food packaging applications. Is.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 丸山 巧 東京都豊島区南池袋2−27−9 タマポリ 株式会社内 Fターム(参考) 4F100 AK01A AK01B AK01C AK01H AK04B AK06A AK06C AK07B AK42B AK46B AK69B AR00D BA03 BA04 BA06 BA07 BA10A BA10C BA10D CA22A CA22C EH202 GB15 GB41 JB16A JB16B JB16C JD08 JG03 JG04A JG04C JG04H YY00 YY00A YY00C    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takumi Maruyama             2-27-9 Minamiikebukuro, Toshima-ku, Tokyo Tamapoli             Within the corporation F-term (reference) 4F100 AK01A AK01B AK01C AK01H                       AK04B AK06A AK06C AK07B                       AK42B AK46B AK69B AR00D                       BA03 BA04 BA06 BA07 BA10A                       BA10C BA10D CA22A CA22C                       EH202 GB15 GB41 JB16A                       JB16B JB16C JD08 JG03                       JG04A JG04C JG04H YY00                       YY00A YY00C

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 帯電防止剤を実質的に含まない熱可塑性
樹脂層の両側の外層として、当該熱可塑性樹脂層よりも
薄く、表面固有抵抗が10Ω/□以下であり、半減期
が1秒未満であるポリマータイプの帯電防止剤を含有す
る厚み3〜30μmの帯電防止層を設けた3層以上から
なる帯電防止多層フィルム。
1. An outer layer on both sides of a thermoplastic resin layer that does not substantially contain an antistatic agent, is thinner than the thermoplastic resin layer, has a surface resistivity of 10 9 Ω / □ or less, and has a half-life of 1 or less. An antistatic multilayer film comprising three or more layers, which is provided with an antistatic layer having a thickness of 3 to 30 μm, which contains a polymer type antistatic agent for less than a second.
【請求項2】 前記帯電防止層中のポリマータイプ帯電
防止剤の濃度が50〜100重量%である事を特徴とす
る請求項1に記載の帯電防止多層フィルム。
2. The antistatic multilayer film according to claim 1, wherein the concentration of the polymer type antistatic agent in the antistatic layer is 50 to 100% by weight.
【請求項3】 前記帯電防止剤を実質的に含まない熱可
塑性樹脂層の熱可塑性樹脂が各種ポリエチレン、ポリプ
ロピレン、ポリアミド、ポリエチレンテレフタレート
(PET)及びエチレンビニルアルコール共重合体(E
VOH)又はそれらの配合物であることを特徴とする請
求項1又は2に記載の帯電防止多層フィルム。
3. A thermoplastic resin layer containing substantially no antistatic agent, wherein the thermoplastic resin is polyethylene, polypropylene, polyamide, polyethylene terephthalate (PET) or ethylene vinyl alcohol copolymer (E).
VOH) or their blends, The antistatic multilayer film according to claim 1 or 2.
【請求項4】 前記両側の帯電防止層に含有されるポリ
マータイプ帯電防止剤の濃度及び/又は種類がそれぞれ
異なり、少なくとも3種類の層からなることを特徴とす
る請求項1〜3のいずれかに記載の帯電防止多層フィル
ム。
4. The concentration and / or type of the polymer type antistatic agent contained in the antistatic layers on both sides are different from each other and each layer is composed of at least three types of layers. The antistatic multilayer film according to.
【請求項5】 中間層又は前記熱可塑性樹脂層と前記両
側の帯電防止層の少なくとも一方との間に機能性付与樹
脂層を設けたことを特徴とする請求項1〜4のいずれか
に記載の帯電防止多層フィルム。
5. The function-imparting resin layer is provided between the intermediate layer or the thermoplastic resin layer and at least one of the antistatic layers on both sides of the thermoplastic resin layer. Antistatic multilayer film.
【請求項6】 前記帯電防止多層フィルムの合計厚みが
20〜300μmであることを特徴とする請求項1〜5
のいずれかに記載の帯電防止多層フィルム。
6. The total thickness of the antistatic multilayer film is 20 to 300 μm.
The antistatic multilayer film according to any one of 1.
【請求項7】 請求項1〜6のいずれかに記載の帯電防
止多層フィルムをインフレーション方式又はT−ダイ方
式の共押出多層フィルム成形法により成形することを特
徴とする帯電防止多層フィルムの製造方法。
7. A method for producing an antistatic multilayer film, comprising molding the antistatic multilayer film according to claim 1 by an inflation type or T-die type coextrusion multilayer film forming method. .
JP2001280577A 2001-09-14 2001-09-14 Antistatic multi-layer film and its production method Pending JP2003080641A (en)

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Publication Number Publication Date
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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168607A (en) * 2006-03-22 2008-07-24 Hs Planning:Kk Underlay film for cutting
JP2014128884A (en) * 2012-12-28 2014-07-10 Mitsubishi Plastics Inc Coextruded composite film for retort packaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168607A (en) * 2006-03-22 2008-07-24 Hs Planning:Kk Underlay film for cutting
JP2014128884A (en) * 2012-12-28 2014-07-10 Mitsubishi Plastics Inc Coextruded composite film for retort packaging

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