JP2003080367A - Soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device which improves soldering quality and enhances the efficiency of operation. SOLUTION: A soldering mechanism 20 is disposed on a moving body 18. The moving body 18 is provided with a frame 2001 and the soldering mechanism 20 is constituted by providing a guide 2002 which is perpendicularly supported by the frame 2001 and a supporting body 2004 which is disposed movably in the vertical direction along the guide 2002. A vertical moving rod 2008 is perpendicularly arranged on the frame 2001 and the vertical moving rod 2008 is elevated and lowered by a feed screw mechanism driven by a motor which is not shown in the figure. The supporting body 2004 is disposed so as to move vertically along the guide 2002 in accordance with the vertical movement of the vertical moving rod 2008. A soldering iron 2014 and a needle 2030 which supplies the solder to the solder iron 2014 are attached to the supporting body 2004.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device.

[0002]

2. Description of the Related Art Conventionally, a soldering apparatus has a soldering iron for soldering a land of a work, a solder supplying means for supplying solder to the soldering iron, and the soldering iron for contacting the work. It is configured to include a soldering position for performing the soldering and a moving unit for moving the soldering position between the soldering position separated from the work and the soldering part for mounting the work. The moving means is configured to move the soldering iron by a cylinder. The solder supply means has a needle that pushes out thread-like solder from its tip, and a mechanism for clamping the needle by slitting is used. For cleaning the tip of the soldering iron, a cleaning device in which the tip is slidably contacted with a metal brush is used. A commercially available general-purpose product is used as the soldering iron tip. The work is placed on the soldering portion and soldered, and is transferred from the soldering portion after the completion of soldering.

[0003]

However, in the above-mentioned conventional soldering apparatus, since the soldering iron is moved by the cylinder, it is difficult to control the feed and pulling speeds of the tip with respect to the land. It has been difficult to improve the soldering quality by preventing the generation of solder balls and the horns in the soldered portion. Further, since it takes time to set the work on the soldering portion, work tact loss occurs and work efficiency is poor. The present invention has been made in view of such circumstances, and an object thereof is to provide a soldering device capable of improving soldering quality. Another object of the present invention is to provide a soldering device capable of improving work efficiency.

[0004]

In order to achieve the above object, the present invention provides a soldering iron for soldering a work,
Solder supplying means for supplying solder to the soldering iron, a moving means for moving the soldering iron between a soldering position where the soldering iron is brought into contact with the work for soldering, and a spaced position separated from the work. In the soldering device including the above, the moving means is configured to move the soldering iron by a driving force of a motor. Therefore, according to the present invention, since the driving force of the motor is used as the moving means for moving the soldering iron to the soldering position and the separated position, the feeding and pulling of the soldering iron to the portion to be soldered is performed. The speed can be controlled appropriately.

Further, according to the present invention, a soldering iron for soldering a work, a solder supplying means for supplying solder to the soldering iron, and a soldering iron by contacting the soldering iron with the work are soldered. In a soldering device including a moving unit that moves between a soldering position to be performed and a separated position separated from the work, the work is placed and soldered to the work with the soldering iron. Section, a loading section provided at a location apart from the soldering section, into which a work for placing on the soldering section is loaded, and the work soldered by the soldering section is transferred from the soldering section. A first discharging unit, wherein the charging unit, the soldering unit, and the discharging unit are arranged linearly in this order, and the charging unit moves in a direction in which the charging unit contacts and separates from the soldering unit. The cylinder and the input part are half A second cylinder that moves the work placed on the loading section to the soldering section and a third cylinder that moves the discharging section in a direction of contacting and separating from the soldering section in a state of being close to the soldering section. And a work placed on the soldering part in a state where the discharging part is close to the soldering part, the work placed on the loading part by the operation of the second cylinder is When being transferred to the soldering section, it is transferred by being pushed out to the discharging section by this work. Therefore, according to the present invention, the work placed on the soldering section is the work placed on the soldering section when the work placed on the loading section is transferred to the soldering section by the operation of the second cylinder. Is pushed out to the discharge part.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a soldering device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view showing the configuration of the soldering apparatus of this embodiment, and FIG. 2 is a left side view of FIG. The soldering device 10 includes a soldering mechanism 2
0, a work transfer unit 22, a cleaning unit 24 (corresponding to a cleaning unit in the claims), and the like, and the soldering mechanism 20, the work transfer unit 22, and the cleaning unit 24 are provided on the frame 11 of the soldering apparatus 10. Has been. The frame 11 includes a base 12, a plurality of pillars 14 provided on the upper surface 1202 of the base 12 at a distance from each other in the horizontal direction, and a horizontal support supported on the pillars 14 and extending in the horizontal direction. A guide 16 and a movable body 18 supported by the horizontal guide 16 so as to be movable in the horizontal direction are provided. The soldering mechanism 20 is provided on the movable body 18, and includes the work transfer section 22 and the cleaning section 2.
4 is provided on the upper surface 1202 of the base 12.

The movable body 18 includes a frame 2001, and the soldering mechanism 20 includes a guide 2002 vertically supported by the frame 2001 and the guide 2002.
Support 200 provided to be movable in the vertical direction along the
And 4 are provided. An elevating rod 2008 is vertically arranged on the frame 2001. The elevating rod 2008 is moved up and down by a feed screw mechanism driven by a motor (not shown), and a locking block 2010 is attached to a lower portion of the elevating rod 2008. Has been done. The motor, the feed screw mechanism, and the lifting rod 2008 are housed in a cover 2006 provided so as to cover the frame 2001. The support member 2004 has a locking piece 20.
04A is provided, the lower end of the bolt 2012 screwed to the locking piece 2004A is placed on the upper surface of the locking block 2010, and the support body 2004 follows the guide 2002 along with the lifting / lowering of the lifting rod 2008. It is arranged to move up and down.

As shown in FIG. 3, the support 2004 includes a soldering iron 2014, a cylinder 2016 (corresponding to a needle moving means in claims), and a needle 2030 (patent) for supplying solder to the soldering iron 2014. (Corresponding to the solder supply means in the claims) or the like is attached. The soldering iron 2014 is a body 2014A formed in a shaft shape.
And a tip 2014B provided at the tip of the main body 2014A and having a high temperature.

As shown in FIGS. 4 (A), (B), and (C), the tip 2014B is composed of a pair of first inclined surfaces 2014C approaching each other toward the tip, and the pair of first inclined surfaces 2014C. One inclined surface 2014 of the inclined surface 2014C
A second inclined surface 2014D that further inclines in the axial direction from this inclined surface 2014C is formed at a position near the tip of C. The second inclined surface 2414D is formed so as to form 35 degrees with respect to the direction orthogonal to the axial direction. The dimension W of the first inclined surface 2014C and the second inclined surface 2014D in the direction orthogonal to the axial direction is the land (in this example, 2. W).
The second inclined surface 2014 has the same size as that of the second inclined surface 2014.
The dimension L along the axial direction of D is smaller than the dimension of the land (1 mm in this example).

Further, the mounting of the soldering iron 2014 on the supporting body 2004 is such that the second inclined surface 2014D of the soldering tip 2014 faces the land of the work W placed on the soldering portion 2202 described later. In this state, the second inclined surface 20
14D and the land are substantially parallel to each other. Then, as the lifting rod 2008 moves up and down, the tip 2 of the soldering iron 2014
014 is configured to be moved between a soldering position where the land is brought into contact with the land for soldering and a spaced position separated from the land. Further, the elevating rod 2008 is lowered and the soldering iron 2014 is attached to the work W.
When the bolts 2012 come into contact with each other, the bolt 2012 of the support body 2004 separates from the upper surface of the locking block 2010 of the elevating rod 2008, so that an unreasonable load is not applied to the work W from the soldering iron 2014. ing.

As shown in FIG. 3, the soldering iron 2014 and the needle 2030 are arranged such that their axial centers form an acute angle, and the rod 2016A of the cylinder 2016 expands and contracts, whereby the needle 2030 moves. It is arranged so as to move while keeping the axes parallel to each other and approach the soldering iron 2014 with a distance. A block 2018 is attached to the tip of the rod 2016A, and the block 2018 is provided with a first moving body 2020A that is movable and adjustable in a direction parallel to the axial direction of the soldering iron 2014. For 2020A, the soldering iron 20
A second moving body 2020B is provided so as to be movable and adjusted in a direction in which the second moving body 2020B moves closer to and away from the second moving body 2020B.
A rotary body 2020C that holds the needle 2030 is rotatably adjusted. The movement of the first moving body 2020A is adjusted by operating the screw 2022, and the movement of the second moving body 2020B is adjusted by the screw 2022.
4 is operated, and rotation adjustment of the rotating body 2020C is performed by operating the screw 2028.

[0012] The needle 2030 is formed in a shaft shape and has a solder supply hole penetrating over its entire length, and is configured to send out a thread-shaped solder from a tip portion 2032 of the needle 2030. The needle 203
2 is attached to the rotating body 2020C by the above-mentioned tip portion 2032.
Is carried out so that it is located at a position facing the tip 2014B of the soldering iron 2014, and the screws 2022, 202
4, 2028 by operating the needle 20
The position and orientation of the tip 2032 of the tip 30 with respect to the tip 2014B is finely adjusted. And the needle 20
When the rod 2106 of the cylinder 2016 is contracted, the tip 3020 of the cylinder 30 is moved to a first position where the solder is in contact with the tip 2014B, and the rod 2106 of the cylinder 2016 is expanded. Then, the solder sent from the tip portion 2032 of the needle 2030 is moved to a second position separated from the tip 2014B.

As shown in FIG. 1, the work transfer section 22.
The soldering section 2202, the charging section 2204, and the discharging section 2
206, first cylinder 2208, second cylinder 221
0 and a third cylinder 2212 are provided. The soldering section 2202 has a mounting surface on which the work W is mounted for soldering, and the work W mounted on the soldering section 2202 is soldered by the soldering iron 2014. Be done. The input part 2204 is the soldering part 22.
02 and the soldering portion 2202
Is a place where the work W is loaded in advance before being placed on
The loading unit 2204 is provided with a placement surface on which the work W is placed. The discharging portion 2206 is the soldering portion 2
This is a part for receiving the work W soldered at 202, and the discharging portion 2206 is provided with a mounting surface on which the work W is mounted. These charging section 2204 and soldering section 2
202 and the discharge unit 2206 are arranged in this order in a straight line in the horizontal direction.

The first cylinder 2208 is the base 1
It is attached to the upper surface 1202 of the second unit via a mounting member 2209, and is configured to move the charging unit 2204 in the direction of contacting and separating from the soldering unit 2202. The second cylinder 2210 has an upper surface 22 of the charging unit 2204.
05, and the work W placed on the loading part 2204 is pushed out and transferred to the soldering part 2202 with the loading part 2204 being close to the soldering part 2202. The third cylinder 2212 is attached to the upper surface 1202 of the base 12 via a mounting member 2213, and the discharge portion 2206 is attached.
Is configured to move in the direction in which it comes in contact with and separates from the soldering portion 2202. Then, the work W placed on the soldering portion 2202 in a state where the discharging portion 2206 is close to the soldering portion 2202 is placed on the loading portion 2204 by the operation of the second cylinder 2210. It is configured such that when the work W present therein is transferred to the soldering section 2202, the work W is pushed out by the work W to the discharging section 2206.

As shown in FIG. 1, the cleaning unit 2
4 is provided on the outer side of the discharge part 2206.
FIG. 5 is a front view of the cleaning unit 24, and FIG. 6 is a side view of FIG. 5 viewed from the direction of arrow A. As shown in FIG.
The cleaning unit 24 includes an upper surface 120 of the base 12.
2 is a rectangular plate-shaped housing 2402 that is erected upright, and two motors 240 housed in the mounting member 2402.
4, 2406 and cleaning rollers 24 attached to the drive shafts of the respective motors 2404, 2406 and rotationally driven.
08, 2410, a plate portion 2412 attached to the side portion of the housing 2402, and an air blowing nozzle 2414 provided in the plate portion 2412.

Compressed air is blown out forward from the air blowing nozzle 2414, and the movable member 18 is moved along the horizontal guide 16 to the cleaning unit 2.
4, the lifting rod 2008 descends, and the compressed air is directed toward the tip 2014B with the tip 2014B of the soldering iron 2014 positioned near the front of the air blowing nozzle 2414. By being blown out, the deposits attached to the tip 2014B are removed. Each of the rollers 2408, 24
10, the outer peripheral portion of the solder iron 2014 is made of chamois, and the soldering iron 2014 from which the adhering substances have been removed by the air blowing 2414 is raised by the elevating rod 2008 and is moved to the roller 2408 by the movable body 2008. , The first inclined surface 2014C of the tip 2014B of the soldering iron 2014, which is located above, is brought into contact with the outer peripheral surface of the roller 2408 in a rotated state, and the first inclined surface 20
The 14C deposit is removed. Next, soldering iron 201
Of the four tips 2014B, the first inclined surface 2014C and the second inclined surface 2014D located below are brought into contact with the outer peripheral surface of the roller 2410 in a rotated state, and the first inclined surface 2014.
It is configured such that the C deposits are removed.

In the present embodiment, the motor and the feed screw mechanism constitute the moving means in the claims. In addition, the block 2018 and the first moving body 20
20A, the second moving body 2020B, the rotating body 2020C, and the screws 2022, 2024, 2024 constitute the adjusting means in the claims.

Next, the soldering operation of the soldering device 10 will be described. With the work W placed on the placement surface of the soldering section 2202, the soldering iron 2
014 is moved to the soldering portion 2202 by the movable body 2008, and then moved down from the separated position to the soldering position by the elevating rod 2008, whereby the tip 20
The second inclined surface 2014D of 14 is brought into contact with the land of the work W, and the land is heated. In this state, the needle 2030 is moved from the second position to the first position by the cylinder 2016, so that the needle 203
The solder sent from the tip portion 032 of No. 0 is brought into contact with the tip 2014B and melted. This allows
The melted solder is transferred from the tip 2014B to the land to be soldered. Then, the cylinder 20
By moving the needle 2030 from the first position to the second position by 16, the solder of the tip portion 2032 of the needle 2030 is separated from the tip 2014B. And, the soldering iron 2014 is the lifting rod 2
The tip 2014 is separated from the land of the work by being raised from the soldering position to the separated position by 008. The work W soldered by the work transfer section 22 is transferred to the discharge section 2206, and
The next work W is placed on the soldering section 2202 from the input section 2204, and the same soldering operation is repeated.

As described above, according to the present embodiment, the driving force of the motor is used as the moving means for moving the soldering iron 2014 to the soldering position and the separated position. The feed and pull rates for the land can be controlled appropriately. This allows
It is possible to prevent generation of solder balls and horns at the soldered portion, which is advantageous in improving soldering quality.
In addition, the work W placed on the soldering section 2202 is operated by the second cylinder 2210, and the work W is put into the loading section 2202.
The workpiece W placed on the 204 is the soldering portion 22.
This work W causes the discharge unit 2
Since it is configured to be pushed out by 206, there is no time required to set the work W on the soldering portion, and work tact loss does not occur, which is advantageous in improving work efficiency.

Further, since the position and posture of the solder portion projecting from the tip portion 2032 of the needle 2030 with respect to the tip 2014C can be finely adjusted in the state where the needle 2030 is located at the first position, The supply status of the solder to the tip 2014C can be adjusted, which is advantageous in improving the soldering quality.
Further, since the cleaning unit 24 slides the chamois skin onto the iron tip 2014C of the soldering iron 2014 to remove the deposits, it is possible to prevent the plating of the iron tip from peeling off. Further, the cleaning unit 24 also has a function of removing the adhering matter on the tip 2014C by the compressed air, which is advantageous in efficiently removing the adhering matter. Further, the second inclined surface 2414D of the tip 2014B is 3 in the direction orthogonal to the axial direction.
The second tip of the tip 2014 is formed to form 5 degrees.
Since the soldering is performed in the state where the inclined surface 2014D and the land are substantially parallel to each other, the contact between the tip 2014 and the land is performed in the same state as the manual soldering. It is advantageous in improving. In addition, the first inclined surface 2 of the tip 2014B
014C, the dimension W of the second inclined surface 2014D in the direction orthogonal to the axial direction is configured to be the same as the land, and the dimension L of the second inclined surface 2014D along the axial direction.
Is smaller than the land, so the tip 20
The amount of heat transferred from 14B to the land becomes appropriate,
Solder is surely transferred from the tip 1014B to the land, which is advantageous in improving soldering quality.

In the present embodiment, the soldering iron 2
Although the feed screw mechanism driven by the motor is used as the moving means for moving the 014 between the soldering position and the separated position, a rack driven by the motor is used.
A pinion mechanism can also be used.

[0022]

As described above, according to the soldering apparatus of the present invention, the driving force of the motor is used as the moving means for moving the soldering iron to the soldering position and the separated position. It is advantageous in improving quality. Further, according to the soldering apparatus of the present invention, no time is required for placing the work on the soldering portion and no work takt loss occurs, which is advantageous in improving work efficiency.

[Brief description of drawings]

FIG. 1 is a front view showing a configuration of a soldering device according to an embodiment.

FIG. 2 is a left side view of FIG. Is.

FIG. 3 is a configuration diagram showing a configuration of a soldering mechanism.

4A is a plan view of the tip, FIG. 4B is a side view of the tip, and FIG. 4C is an enlarged view of the tip.

FIG. 5 is a front view of a cleaning unit.

6 is a side view of FIG. 5 viewed from the direction of arrow A. FIG.

[Explanation of symbols]

10 ... Soldering device, 2014 ... Soldering iron, 203
0 ... Needle 2202 ... Soldering part 2204 ...
... input section, 2206 ... discharge section, 2208 ... first cylinder, 2210 ... second cylinder, 2212 ... third cylinder, W ... work.

Claims (5)

[Claims] 1. A soldering iron for soldering a work, a solder supplying means for supplying solder to the soldering iron, and a soldering position for soldering by bringing the soldering iron into contact with the work. And a moving unit that moves between a separated position separated from the work, the moving unit is configured to move the soldering iron by a driving force of a motor, A soldering device characterized in that 2. The soldering iron has a tip for melting the solder when it is heated to a high temperature, and the solder supply means includes a needle for sending a thread-shaped solder from a tip end thereof, and the needle.
The needle moving means for moving the solder between the first position where the solder contacts the tip and the second position where the solder separates from the tip, and the state where the needle is located at the first position. 2. The soldering apparatus according to claim 1, further comprising: an adjusting unit that adjusts a position of a solder portion protruding from the tip of the needle with respect to the tip. 3. The soldering iron is configured to have a high temperature by melting the solder and has a tip, and a cleaning means for removing a deposit on the tip by sliding a chamois skin on the tip. The soldering device according to claim 1, further comprising: 4. A land to be soldered is formed on the work, and the tip is composed of a pair of first inclined surfaces approaching each other toward the tip in the axial direction. A second inclined surface forming 35 degrees with respect to a direction orthogonal to the axial direction is formed near the tip, and the moving means moves the soldering iron to the first position when the soldering iron is moved to the soldering position. 2. The soldering device according to claim 1, wherein the soldering iron is configured so as to support the two inclined surfaces and the land so as to be in contact with each other in a substantially parallel state. 5. A soldering iron for soldering a work, a solder supplying means for supplying solder to the soldering iron, and a soldering position for soldering by bringing the soldering iron into contact with the work. And a moving means for moving the work between a separated position separated from the work, and a soldering section on which the work is placed and soldered to the work with the soldering iron, A loading section provided at a location separated from the soldering section, into which a work to be mounted on the soldering section is loaded, and an ejecting section from which the work soldered by the soldering section is transferred from the soldering section. A first cylinder that is arranged in such a manner that the charging unit, the soldering unit, and the discharging unit are linearly arranged in this order, and that moves the charging unit in a direction toward and away from the soldering unit; Input part is the soldering part A second cylinder for transferring the work placed on the loading part to the soldering part in a contact state, and a third cylinder for moving the discharging part in a direction of contacting with and separating from the soldering part. The work placed on the soldering part in a state where the discharging part is close to the soldering part is the work placed on the inserting part by the operation of the second cylinder. The soldering device is characterized in that the work is pushed out to the discharge part by the work and is transferred.