JP2003078389A - Surface acoustic wave device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that such a structure that a circuit board is larger than a surface acoustic wave element and hardly made small-sized, and the surface acoustic wave element and board are airtightly sealed with a continuous annular sealing member, makes the external appearance worse and decreases airtightness. SOLUTION: The surface acoustic wave element and circuit board 10 are nearly in the same shape and provided with frame-shaped members 5 and 12 having discontinuous parts 6 and 13 each at leas at one place of the outer circumferential part, and they are put opposite each other and joined and sealed to obtain a surface acoustic wave device in small-sized CSP structure which reduces external appearance defects and has superior airtightness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device used for information communication equipment and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, mobile wireless terminals represented by mobile phones have tended to be light, thin, short and small, and in order to realize this, miniaturization and surface mounting of parts such as surface acoustic wave devices have been demanded. There is.

In order to satisfy this demand, there is known a structure in which a surface acoustic wave element is mounted in a package, wire-bonded, and then sealed by a lid. Since this structure has a structure in which the surface acoustic wave element is built in and sealed in the package, the shape is large, and it is said that it is not suitable for miniaturization.

On the other hand, as a means for solving this problem, the method described in Japanese Patent Laid-Open No. 6-61778 is known. FIG. 5 is a sectional view showing the structure of a conventional surface acoustic wave device.

As shown in FIG. 5, in the conventional surface acoustic wave device, bumps 61 are provided on a surface acoustic wave element 60, a package 62 is mounted facedown, and a sealing member 63 is hermetically sealed to provide a small elastic surface. A method of obtaining a surface wave device has been used.

[0006]

However, as shown in FIG. 5, in the conventional structure in which the bump 61 is provided on the surface acoustic wave element 60, the package 62 is face-down mounted and the sealing member 63 hermetically seals. In addition, the internal pressure of the package 62 increases at the time of sealing, the sealing member 63 bulges outward, and an appearance defect occurs, and the size of the package 62 is inevitably larger than that of the surface acoustic wave element 60. It had the problem of being difficult.

The present invention solves the above-mentioned problems of the prior art, is capable of eliminating a defective appearance due to a sealing member, hermetically sealing, and a small CSP having a shape similar to that of a surface acoustic wave element.
An object of the present invention is to provide a (Chip Size Package) type surface acoustic wave device and a method for manufacturing the same.

[0008]

In order to achieve the above object, the present invention has the following constitution.

According to a first aspect of the present invention, a surface acoustic wave element having a comb-shaped electrode, a reflector electrode, and a first pad electrode provided on a piezoelectric substrate, and the surface acoustic wave element are mounted. A circuit board, the surface acoustic wave element and the circuit board are opposed to each other, a second pad electrode is provided on the circuit board at a position opposed to the first pad electrode, and a comb-shaped electrode on the piezoelectric substrate is provided.
A first frame-shaped member having a discontinuous portion is provided at least at one location on the outer peripheral portions of the reflector electrode and the first pad electrode, and at least one position is provided on the circuit board so as to face the first frame-shaped member. A second frame-shaped member having a discontinuous portion is disposed at the location, and the first pad electrode and the second pad electrode are joined to each other and the first frame-shaped member and the second frame-shaped member are joined to each other. It has a structure in which a vibration space is formed by electrically connecting the surface acoustic wave element and a circuit board by sealing the discontinuous portion of the frame-shaped member. With the CSP type structure, since the discontinuous portion of the frame-shaped member is in the open state, the internal pressure does not rise during sealing, and the frame-shaped member does not bulge outward, so that it is possible to reduce appearance defects,
By surrounding the surface acoustic wave element with the frame-shaped member, it is possible to obtain an operation effect that an influence from the outside world, for example, intrusion of high-frequency electromagnetic noise or the like is blocked and a surface acoustic wave device having excellent airtightness can be obtained.

According to a second aspect of the present invention, a part of the first pad electrode is connected to a first frame-shaped member having a discontinuous portion provided in at least one location provided on the surface acoustic wave element. The internal pressure does not rise at the time of sealing because the discontinuous portion of the frame-shaped member is in an open state.
Since the frame-shaped member does not bulge outward, it is possible to reduce the appearance defect, and thus it is possible to increase the area of the portion connected to the pad electrode. For example, the piezoelectric substrate generates a potential due to the pyroelectric effect. Even if it is done, the potential is shared by the connected electrode portions having a large area, so that it is possible to obtain the effect that it is possible to prevent the destruction due to electrostatic discharge or the like from occurring easily.

According to a third aspect of the present invention, in the surface acoustic wave device, the first pad electrode connected to the first frame-shaped member having at least one discontinuous portion is a surface acoustic wave. It has a structure in which it is connected to the ground terminal of the device, which makes it possible to increase the area of the portion connected to the ground terminal. For example, if the piezoelectric substrate generates a potential due to the pyroelectric effect, By sharing the potential with a common ground having a large area, it is possible to obtain the effect that it is possible to prevent the destruction due to electrostatic discharge or the like from occurring easily.

According to a fourth aspect of the present invention, a part of the second pad electrode is connected to a second frame-shaped member provided on the circuit board and having a discontinuous portion at least at one location. Since the area of the part connected to the ground terminal can be widened by this, even if the piezoelectric substrate generates a potential by the pyroelectric effect, for example, a common ground of a large area can reduce the potential. By sharing the above, it is possible to obtain an effect that it is possible to prevent the destruction due to electrostatic discharge or the like from occurring easily.

According to a fifth aspect of the present invention, the second pad electrode connected to the second frame-shaped member having at least one discontinuous portion provided on the circuit board is connected to the ground terminal. Since the area connected to the ground terminal can be widened by this configuration, even if the piezoelectric substrate generates a potential due to the pyroelectric effect, a large area can be shared. By sharing the potential with the ground, it is possible to obtain the effect that it is possible to prevent the destruction due to electrostatic discharge or the like from occurring easily.

The invention according to claim 6 of the present invention has a structure in which the first and second frame-shaped members are made of metal, which facilitates joining by heating the metal,
The effect that it can be sealed is obtained.

The invention according to claim 7 of the present invention has a structure in which the metal is at least one of Al, Al alloy, and Ti, whereby the comb-teeth-shaped electrode of the surface acoustic wave element and the reflection are formed. It is possible to obtain the function and effect that it can be manufactured at the same time in the same process as that of the container electrode.

The invention according to claim 8 of the present invention has a structure in which the second frame-shaped member is at least W or Ag, and thus can be manufactured simultaneously with the circuit board. The effect is obtained.

The invention according to claim 9 of the present invention has a structure in which the first connecting member is provided on the first pad electrode and the second connecting member is provided on the second pad electrode. As a result, it is possible to obtain the effect that the first and second pad electrodes can be bonded easily and reliably.

The invention according to claim 10 of the present invention is the first
And the second connecting member is made of metal, which allows the metal to be easily joined by heating,
The effect that it can be sealed is obtained.

In the invention according to claim 11 of the present invention, the metal is at least Ni, Au, Au-Sn, Au-Sn-an alloy with another metal, Au-Pt, Au-Pt-with another metal. An elastic surface having excellent weather resistance such as humidity resistance by having a structure of being either an alloy or Pb-Sn solder, and by easily bonding and sealing these metals by heating them. The effect that a wave device can be obtained is obtained.

According to a twelfth aspect of the present invention, the first frame electrode is provided between the first pad electrode of the surface acoustic wave element and the first frame-shaped member having at least one discontinuous portion. The first flow-blocking pattern for stopping the flow of the member is provided, so that even if the first frame-shaped member is melted by the heating at the time of joining and flows. Since it is blocked by the first flow blocking pattern before it reaches the pad electrode of, the first frame-shaped member is present in the peripheral portion of the surface acoustic wave element, and the surface acoustic wave element and the circuit board are joined and sealed. The effect that the property can be enhanced is obtained.

The invention according to claim 13 of the present invention is the first aspect.
Has a structure in which the connecting portions at both ends are narrow and the space between the connecting portions is wide, so that when the first frame-shaped member flows and flows into the first flow inhibiting pattern. , The flow is once diffused to the surroundings by flowing from the narrow portion to the wide portion, and the flow is dammed at the narrowing portion again, so that the molten first frame-shaped member is
It is possible to prevent the inflow to the surface acoustic wave element side from the flow prevention pattern of, and to suppress the characteristic variation of the surface acoustic wave element.

According to a fourteenth aspect of the present invention, there is provided a second flow blocking member for stopping the flow of the first connecting member between the comb-shaped electrode of the surface acoustic wave element and the first pad electrode. It has a structure in which a pattern is provided.
Even if the connecting member is melted and flows due to heating at the time of joining, it is blocked by the first flow prevention pattern before coming into contact with the comb-shaped electrode, so that short circuit and deterioration of characteristics can be eliminated. The effect is obtained.

The invention according to claim 15 of the present invention is the second aspect.
Has a structure in which the connection portions at both ends are narrow and the space between the connection portions is wide, whereby the first frame-shaped member melts and flows into the second flow inhibition pattern. Then, by flowing from the narrow portion to the wide portion, the flow is once diffused to the surroundings, and the flow is dammed at the narrowing portion again, so that the melted first frame-shaped member has an elastic surface more than the second flow blocking pattern. It is possible to prevent the inflow to the wave element side and suppress the characteristic variation of the surface acoustic wave element.

The invention according to claim 16 of the present invention is the first aspect.
The second pad electrode and the first and second frame-shaped members are connected to each other by thermocompression bonding, which makes it possible to surely bond them by a simple method and Since it is a metal-to-metal joint, it is stable, so that the effect of excellent durability and weather resistance can be obtained.

According to a seventeenth aspect of the present invention, one surface acoustic wave element is surrounded by at least one first frame-shaped member having a discontinuous portion, and a plurality of them are combined. Since each surface acoustic wave element is always surrounded by the frame-shaped member, the sealing performance can be improved and electromagnetic waves and noise from the surroundings can be reduced by using the metal frame-shaped member. It is possible to obtain the effect of blocking the invasion into the inside and stabilizing the characteristics.

According to the eighteenth aspect of the present invention, at least one portion provided on at least the piezoelectric substrate and the circuit board has a discontinuous portion, and the discontinuous portion of the first and second frame-shaped members has a third discontinuous portion. It has a structure in which it is connected and sealed by a connecting member, whereby the discontinuous portion of the second frame-shaped member is connected to an external terminal, and for example, it is used as a ground terminal to stabilize the ground state. Therefore, the characteristics can be stabilized, and the sealing performance can be improved by connecting and sealing the discontinuous portion of the second frame-shaped member with the third connecting member, so that the weather resistance can be improved. Thus, the effect of improving durability can be obtained.

The invention according to claim 19 of the present invention is the third aspect.
The connecting member of No. 2 has a structure containing a metal, whereby the discontinuous portion of the second frame-shaped member can be electrically connected and sealed by the third connecting member. -Shaped member and external terminal are electrically connected, weather resistance,
The effect that the durability can be improved can be obtained.

According to a twentieth aspect of the present invention, the metal is Au-Sn, Au-Sn-alloy with other metal, or Au-Sn.
Pt, Au-Pt-an alloy with another metal, or Pb-Sn solder is used, which makes it easy to heat these metals or a metal-containing conductive adhesive, for example. It is possible to obtain a surface acoustic wave device which can be bonded and sealed in a high temperature and is excellent in weather resistance such as moisture resistance.

According to a twenty-first aspect of the present invention, the material of the circuit board is any one of ceramic, glass, and resin, which allows the surface acoustic wave device corresponding to various board materials. It is possible to obtain the action and effect.

According to a twenty-second aspect of the present invention, there is provided a step of providing a comb electrode, a reflector electrode and a first pad electrode on a piezoelectric substrate, a comb electrode and a reflector electrode on the piezoelectric substrate. And a step of forming a first frame-shaped member having a discontinuous portion at least at one location on the outer peripheral portion of the first pad electrode, a step of providing an external electrode on the circuit board, and a first pad electrode on the circuit board. A step of providing a second pad electrode at a position facing the first frame electrode, and a step of providing a second frame-shaped member having a discontinuous portion at least at one position on the circuit board facing the first frame-shaped member, A step of joining the first pad electrode and the second pad electrode, and a step of joining the first frame-shaped member and the second frame-shaped member together, and a step of connecting and sealing the discontinuous portion with the third connecting member. , The process of cutting into individual pieces is included. The surface acoustic wave element and the circuit board are of substantially the same size, and the internal pressure does not rise during sealing because the discontinuous portion of the frame-shaped member is in an open state, and the frame-shaped member may swell outward. Since it is not present, it is possible to obtain the operational effect of reducing the appearance defect and reliably sealing.

The invention according to claim 23 of the present invention is the first aspect.
The method of joining the pad electrode and the second pad electrode of the above, and the method of joining the first frame-shaped member and the second frame-shaped member together has a method of thermocompression bonding, which ensures a simple method. In addition to being capable of joining, the joining state is stable because it is a metal-to-metal joining, so that the operational effect of excellent durability and weather resistance can be obtained.

According to a twenty-fourth aspect of the present invention, a surface acoustic wave element comprising a piezoelectric substrate provided with comb-teeth electrodes, a reflector electrode and a first pad electrode, and a circuit for mounting the surface acoustic wave element. The surface acoustic wave element and the circuit board are opposed to each other, the second pad electrode is provided on the circuit board at a position opposed to the first pad electrode, and the first pad electrode and the second pad electrode are connected to each other. By connecting them, they are electrically connected and form a vibration space, and a continuous third frame-shaped member is provided on the outer periphery of the comb-teeth-shaped electrode, the reflector electrode and the first pad electrode on the piezoelectric substrate. A continuous fourth frame-shaped member is provided on the circuit board at a position facing the third frame-shaped member,
The pad electrode and the second pad electrode, and the third and fourth frame-shaped members are bonded and sealed to each other, whereby the size of the surface acoustic wave element and the circuit board is reduced. Since the CSP structure is of substantially the same small size, and the sealing is performed under reduced pressure, the internal pressure does not rise and the frame-shaped member does not bulge outward. Therefore, it is possible to reduce defective appearance and surely perform sealing. Is obtained.

According to a twenty-fifth aspect of the present invention, a part of the first pad electrode provided on the surface acoustic wave element is connected to a continuous third frame-shaped member. As a result, an electrically stable ground can be obtained by electrically connecting the first pad electrode to the third frame-shaped member and using this as the ground, thereby stabilizing the characteristics. The effect of being able to do is obtained.

In the twenty-sixth aspect of the present invention, of the first pad electrodes provided on the surface acoustic wave element, the first pad electrode connected to the continuous third frame-shaped member is the ground terminal. Since it has a structure of being connected, and thus the grounding portion can be widened, an electrically stable grounding can be obtained, and the characteristic effect can be stabilized.

According to a twenty-seventh aspect of the present invention, a part of the second pad electrode provided on the circuit board is connected to a continuous fourth frame-shaped member provided on the circuit board. Since the second pad electrode is electrically connected to the fourth frame-shaped member and this is grounded, for example, an electrically stable ground can be obtained. It is possible to obtain the operational effect of being able to stabilize.

According to a twenty-eighth aspect of the present invention, among the second pad electrodes provided on the circuit board, the pad electrode connected to the continuous fourth frame member is connected to the ground terminal. With this configuration, since the grounding portion can be expanded, an electrically stable grounding can be obtained, and the characteristic effect can be stabilized.

The invention according to claim 29 of the present invention is the first
The second pad electrode and the third and fourth frame-shaped members are connected to each other by thermocompression bonding, which enables reliable bonding by a simple method and the bonded state. Since it is a metal-to-metal joint, it is stable, so that the effect of excellent durability and weather resistance can be obtained.

The invention according to claim 30 of the present invention is the first
And a structure in which the first connecting member is provided on the second pad electrode, which provides an effect that the first and second pad electrodes can be easily and reliably joined together. To be

The invention according to claim 31 of the present invention is the first aspect.
The connecting member of 1 has a structure of being made of metal, which provides an effect that the metal can be easily joined and sealed by heating.

According to a thirty-second aspect of the present invention, the metal is at least Ni, Au, Au-Sn, Au-Sn-an alloy with another metal, Au-Pt, Au-Pt-with another metal. It has a structure that it is either an alloy or Pb-Sn solder, and by doing so, it is possible to easily join and seal these metals by heating, and elasticity that is excellent in weather resistance such as moisture resistance. The effect that a surface acoustic wave device is obtained can be obtained.

According to a thirty-third aspect of the present invention, the third frame-shaped member for stopping the flow between the third frame-shaped member continuous with the comb-teeth-shaped electrode of the surface acoustic wave element is provided. 3 has a structure in which the flow prevention pattern 3 is provided, so that even if the third frame-shaped member is melted by the heating at the time of joining and flows, Since it is blocked by the flow prevention pattern of No. 3, there is an effect that a short circuit and deterioration of characteristics can be eliminated.

According to a thirty-fourth aspect of the present invention, there is provided a fourth flow blocking means for stopping the flow of the first connecting member between the comb-shaped electrode of the surface acoustic wave element and the first pad electrode. It has a structure in which a pattern is provided.
Even if the connecting member is melted by the heating at the time of joining and flows, since it is blocked by the fourth flow prevention pattern before coming into contact with the comb-shaped electrode, it is possible to eliminate a short circuit and deterioration of characteristics. The effect is obtained.

According to a thirty-fifth aspect of the present invention, one surface acoustic wave element is surrounded by one continuous third frame-shaped member, and a plurality of them are combined together. Since each surface acoustic wave element is always surrounded by a frame-shaped member, it is possible to improve the sealing performance and block electromagnetic waves and noise from the surroundings by using a metal frame-shaped member. However, the effect that the characteristics can be stabilized can be obtained.

According to a thirty-sixth aspect of the present invention, when the first pad electrode and the second pad electrode, and the third and fourth frame-shaped members are bonded and sealed to each other under a reduced pressure. The pressure of is lower than the atmospheric pressure.
As a result, since the sealing is performed under a pressure lower than the atmospheric pressure, the internal pressure does not rise above the atmospheric pressure even when heated, and the frame-shaped member does not bulge outward. The effect of being able to do is obtained.

According to a thirty-seventh aspect of the present invention, the step of providing a comb-tooth electrode, a reflector electrode and a first pad electrode on a piezoelectric substrate, a comb-tooth electrode and a reflector electrode on the piezoelectric substrate And a step of forming a continuous third frame-shaped member on the outer peripheral portion of the first pad electrode, a step of providing an external electrode on the circuit board, and a second step at a position facing the first pad electrode on the circuit board. The step of providing a pad electrode, the step of providing a continuous fourth frame-shaped member at a position facing the third frame-shaped member on the circuit board, and the first pad electrode and the second pad electrode under reduced pressure. The method includes a step of joining and sealing the third frame-shaped member and the fourth frame-shaped member to each other, and a step of cutting the same. Has a small CSP type structure, and the internal pressure is high because it is sealed under reduced pressure. For Razz frame member is prevented from bulging outward, actions and effects that it is possible to securely seal obtained while reducing the appearance defect.

[0046]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) Hereinafter, Embodiment 1 of the present invention will be used to describe claims 1 to 16 and 18 of the present invention.
23 will be described.

FIG. 1 is a perspective view before assembling the surface acoustic wave device according to the first embodiment.

In FIG. 1, 1 is a piezoelectric substrate, 2 is a comb-shaped electrode, 3 is a reflector electrode, 4 is a first pad electrode provided on the piezoelectric substrate 1, and 5 is a first electrode provided on the piezoelectric substrate 1. Frame-shaped member,
6 is a discontinuous portion provided on the first frame member 5, 7 is a first flow blocking pattern, 8 is a second flow blocking pattern, 9 is a first connecting member, 10 is a circuit board, 11 is a first 2 pad electrodes, 12 is a second frame-shaped member, 13 is a second frame-shaped member 12
, 14 is a third flow blocking pattern provided on the circuit board 10, 15 is a second connecting member provided on the second pad electrode 11, 16 is a notch provided on the circuit board 10, Reference numeral 17 is a third connecting member for sealing the discontinuous portions 6 and 13, 18 is an external electrode provided on the circuit board 10, 19
Is a vibration space provided on the circuit board 10.

Note that FIG. 1 schematically shows the configuration of the first embodiment, and does not show the relative relationship between the respective thicknesses and dimensions.

According to the present invention, frame-shaped members 5 and 12 having discontinuous portions 6 and 13 are provided at least at one location on the outer peripheral portion of the piezoelectric substrate 1 and the outer peripheral portion of the circuit board 10 facing the piezoelectric substrate 1.
By sealing the discontinuous portions 6 and 13 after bonding them to each other, the discontinuous portions 6 and 13 of the frame-shaped members 5 and 12 are sealed at the time of sealing.
The internal pressure does not rise because the is open, and the frame-shaped members 5, 1
Since 2 does not swell to the outside, it is possible to reduce the appearance failure and to configure a small CSP type surface acoustic wave device in which the surface acoustic wave element and the circuit board 10 have substantially the same shape. .

Specific manufacturing steps will be described below.

A metal film made of Al or the like is formed on the piezoelectric substrate 1 in the form of a wafer made of LiTaO ₃ or the like to a predetermined thickness by, for example, a sputtering method, a resist is applied on the metal film, and a photolithography method is used. By exposing, developing, and etching the metal film, a desired comb-teeth electrode 2, reflector electrode 3, first pad electrode 4, and at least one discontinuous portion 6 are provided so as to surround them. The frame member 5, the first flow blocking pattern 7,
The second flow blocking pattern 8 is formed.

Further, the first pad electrode 4, the frame-shaped member 5 having the discontinuous portion 6 at least at one place, the first flow blocking pattern 7 and the second flow blocking pattern 8 are formed on the first pad electrode 4 by a method such as sputtering. A first connecting member 9 made of Au-Pt-Cu or the like is provided, and a first pad electrode 4, a frame-shaped member 5 having a discontinuous portion 6 at least at one location, a first flow blocking pattern 7, and a second flow inhibiting pattern 7. The flow blocking pattern 8 is formed to obtain a surface acoustic wave element assembly.

The metal forming the lower parts of the comb-teeth-shaped electrode 2, the reflector electrode 3 and the first pad electrode 4 provided on the piezoelectric substrate 1 is not only Al but Al alloy, or Al and other metals. A mixture or the like may be used in a single layer or a plurality of layers.

The first connecting member 9 is made of metal because it can be easily melted and connected by heating, and Au-Pt-Cu can be used instead of Au-Pt-Cu.
Sn, Au-Sn-alloy with other metal, Au-Pt, A
u-Pt-an alloy with another metal, Pb / Sn solder, or a mixture thereof may be used in a single layer or a plurality of layers.

On the other hand, for example, BaO--Al ₂ O ₃ --SiO ₂
The ceramic composition of the system, the ceramic composition made of a material obtained by adding glass composition of BaO-SiO ₂ -PbO system, for example, a sheet formed by a method such as a doctor blade, and cut into a predetermined shape, a predetermined portion of the sheet A through hole is formed in the sheet by a method such as punching, a conductive paste made of Ag or the like is applied to a predetermined portion of the sheet and the through hole by a method such as printing, and a predetermined number of sheets are laminated and pressed, and a cut portion 16 is formed in the predetermined portion. , The second pad electrode 11, and the second frame-shaped member 1 having the discontinuous portion 13 at least at one location.
2, third flow blocking pattern 14, second pad electrode 1
The circuit board 10 provided with the internal wiring (not shown) connected to the external electrode 18 and the external electrode 18, etc. is provided.

Next, on the second pad electrode 11, the second frame-shaped member 12 having the discontinuous portion 13 at least at one place, and the third flow blocking pattern 14, Ni, Au, Pb.S.
A second frame-shaped member 1 having a second connection member 15 and a second pad electrode 11, at least one of which has a discontinuous portion 13, is formed by sequentially stacking metal films such as n by a method such as plating.
2. A circuit board assembly provided with the third flow blocking pattern 14 is obtained.

The composition of the circuit board 10 is BaO--Al.
₂ O ₃ -SiO ₂ system LTCC (Low Temperature Cofir)
In addition to ed Ceramic) ceramics, Al ₂ O ₃ etc. 16
A composition that is fired at a high temperature of about 00 ° C. may be used.

When a high temperature firing composition such as Al ₂ O ₃ is used, the metal used to form the wiring is, for example, W.
Etc. can be used, and it is necessary to select an appropriate metal composition according to the firing temperature.

A metal is used as the second connecting member 15, but this is because it can be easily melted and connected by heating, and Ni, Au, Pb.Sn are used.
In addition to Au-Sn, Au-Sn-alloys with other metals, A
u-Pt, Au-Pt-an alloy with another metal may be used in a single layer or a plurality of layers.

The circuit board 10 may be cut and then fired.

Further, as the material of the circuit board 10, glass, resin or the like may be used in addition to ceramic.

Next, the obtained surface acoustic wave element assembly and the circuit board assembly are opposed to each other, and the first pad electrode 4 and the first frame-shaped member 5 provided on the surface acoustic wave element assembly and the circuit board. The positions of the second pad electrode 11 and the second frame-shaped member 12 and the positions of the discontinuous portion 6 and the discontinuous portion 13 provided on the aggregate are adjusted so that the surface acoustic wave element aggregate is provided on the circuit board aggregate. Are faced down so as to be in a face-down state, and are pressed with a pressure of about 1 MPa to keep a predetermined distance between the surface acoustic wave element assembly and the circuit board assembly.
The first pad electrode 4 and the second pad electrode 11 and the first frame-shaped member 5 facing each other by heating and curing at 0 ° C. for 5 minutes to melt the first connecting member 9 and the second connecting member 15 And the second frame-shaped member 12 are joined together, and the vibration space 19
And the surface acoustic wave element assembly and the circuit board assembly are integrated.

In this way, the surface acoustic wave element assembly can be formed in a wafer state.

After that, it is cut to a predetermined size by using, for example, a dicing device, and a third connecting member 17 made of a conductive adhesive such as Pb / Sn balls is arranged in the cut portion 16 provided in the circuit board 10. Then, by connecting the discontinuous portion 6 of the first frame-shaped member 5 and the discontinuous portion 13 of the second frame-shaped member 12 and sealing the surface acoustic wave device, the surface acoustic wave element and the circuit board 10 are separated. CS with almost the same shape and size
A P-type surface acoustic wave device is obtained.

The third connecting member 17 is a notch 16 provided on the circuit board 10 before cutting the surface acoustic wave element assembly in a wafer state in which the surface acoustic wave element assembly and the circuit board assembly are integrated. The discontinuous portion 6 of the first frame-shaped member 5 and the discontinuous portion 13 of the second frame-shaped member 12 may be connected and sealed, and then cut.

In the first embodiment, the surface acoustic wave element assembly and the circuit board assembly are integrated in the wafer state.
Either the surface acoustic wave element assembly or the circuit board assembly may be previously cut and integrated. If necessary, both the surface acoustic wave element assembly and the circuit board assembly may be cut in advance and then integrated. The state of integration is determined by the degree of warpage of the circuit board assembly. If the warpage is small, it can be integrated in a large size state such as a wafer state, but if the warpage is large, it will be integrated with the surface acoustic wave element assembly. The circuit board aggregates are not evenly spaced, resulting in variations in connectivity and sealing performance, which makes it difficult to integrate them in a wafer state.

In this case, the warp can be absorbed by cutting and integrating the surface acoustic wave element assembly and / or the circuit board assembly. Warpage of integrated area is 2μ
If it is within m, it can be integrated without cutting.

However, if the surface acoustic wave element assembly or the circuit board assembly is cut and integrated, the mass productivity is impaired. Therefore, in the end, the degree of warpage of the circuit board assembly and the mass productivity should be taken into consideration. It is necessary to decide whether to integrate in such a state.

The method of sealing the discontinuous portions 6 and 13 with the third connecting member 17 may be any method such as sputtering, vapor deposition, printing or coating.
As the material, Au-Sn, Au-Sn-alloy with other metal, Au-Pt, Au-Pt-alloy with other metal, or conductive adhesive may be used.

First pad electrode 4 and second pad electrode 1
By directly joining 1 through the first connecting member 9 and the second connecting member 15, it is not necessary to provide bumps or the like, so that the material cost of bumps or the like and the number of steps for providing bumps or the like on pads or the like are reduced. The manufacturing cost can be reduced.

The material of the first frame member 5 is A
Al alloy, Ti or the like may be used instead of l, and the material of the second frame-shaped member 12 is W instead of Ag.
You may use such as.

The discontinuities 6 and 13 are provided at least at one location on the first and second frame-shaped members 5 and 12 so that the surface acoustic wave element assembly and the circuit board assembly are opposed to each other and sealed. At this time, if the state is hermetically closed from the beginning, the surface acoustic wave device is heated by the heat treatment for sealing to increase the internal pressure, and the melted first connecting member 9 and second connecting member 15 are extruded to the outside. In addition, the bulging state hardens and the appearance becomes poor, and the sealing state becomes poor in a portion where the first and second connecting members 9 and 15 are small, and a case where sealing cannot be performed occurs, and weather resistance such as moisture resistance deteriorates. There are cases.

However, the first and second frame-shaped members 5, 12
By disposing the discontinuous portions 6 and 13 at least at one place in advance, when the surface acoustic wave element assembly and the circuit board assembly are opposed to each other and sealed, they are initially in an open state. The first connection member 9 in which the internal pressure did not rise and was melted
Also, since the second connecting member 15 does not bulge outward, the surface acoustic wave device having excellent weather resistance can be obtained because appearance defects are eliminated and the sealing state is good and sealing is possible.

The discontinuous portions 6 and 13 may be in an open state at the time of sealing, and may be at least one location.

Further, in the first embodiment, the discontinuous portions 6, 1
3 is provided at least at one location on each of the first frame-shaped member 5 and the second frame-shaped member 12, but at least one location may be provided as long as the open state can be secured at the time of sealing. Absent.

Further, in the first embodiment, the discontinuous portion 6 provided on the first frame-shaped member 5 and the discontinuous portion 13 provided on the second frame-shaped member 12 are located at the same position when sealed. However, they may be provided at different positions. However, when they are provided at different positions, it is desirable to provide them at the same position as much as possible because the number of places to be sealed by the third connecting member increases and the number of manufacturing steps increases.

The second frame-shaped member 12 of the circuit board 10
The notch 16 is provided in the vicinity of the discontinuous portion 13 provided in the third connection member 17 when the discontinuous portions 6 and 13 are sealed with the third connection member 17 so that the third connection member 17 does not protrude from the circuit board 10. However, the notch 16 does not necessarily have to be provided.

Further, since the surface acoustic wave element is always surrounded by the frame members 5 and 12 made of metal, it has a shield effect of blocking invasion of electromagnetic waves and noise from the surroundings, and stabilizes the characteristics. Can be converted.

The surface acoustic wave element assembly is provided with the first flow blocking pattern 7 and the third flow blocking pattern 14 connected to the first frame-shaped member 5 and the second frame-shaped member 12. When the body and the circuit board assembly are opposed to each other and sealed, the melted first connecting member 9 on the first frame-shaped member 5 flows into the first pad electrode 4 and the second pad electrode 11 side. This is to prevent this.

The shapes of the first flow blocking pattern 7 and the third flow blocking pattern 14 are such that the connecting portions at both ends are narrow and the space between the connecting portions is wide, whereby the first connecting member melted and flowed in. 9 and the second connecting member 15 spread in the first flow blocking pattern 7 and the third flow blocking pattern 14 and flow once, and then gather and flow again at the ends, so that they flow out. In, the resistance to flow increases, and it becomes difficult to flow beyond the first flow blocking pattern 7 and the third flow blocking pattern 14, and the flow can be stopped.

Similarly, the reason why the second flow blocking pattern 8 is connected to the first pad electrode 4 and the comb-shaped electrode 2 is that the first connection is provided on the first pad electrode 4. The member 9 is for preventing the member 9 from being melted and flowing from the first pad electrode 4 to the comb-shaped electrode 2, and the shape of the second flow blocking pattern 8 is the same as that of the first flow blocking pattern 7 and the first flow blocking pattern 7. It is effective that the connection portions at both ends are narrow and the space between the connection portions is wide as in the case of the flow prevention pattern 14 of FIG.

Further, a part of the first pad electrode 4 is connected to the pad electrode by connecting at least one portion provided in the surface acoustic wave element to the first frame-shaped member 5 having a discontinuous portion. Since the area of the part can be increased,
For example, even if the piezoelectric substrate 1 generates an electric potential by the pyroelectric effect, the connected electrode portions having a large area share the electric potential, so that the destruction due to electrostatic discharge or the like can be made less likely to occur. The first pad electrode 11 is also the first
The same can be said as in the case of the pad electrode 4 of.

Also, the first pad electrode 4 connected to the first frame-shaped member 5 having a discontinuous portion at least at one place provided in the surface acoustic wave element should be connected to the ground terminal of the surface acoustic wave device. As a result, it is possible to increase the area of the portion connected to the ground terminal. Therefore, for example, even if the piezoelectric substrate 1 generates a potential due to the pyroelectric effect, the potential is shared by the common ground having a large area, so that electrostatic discharge can be performed. It is possible to make it less likely to be destroyed by such as. The same applies to the second pad electrode 11 as in the case of the first pad electrode 4.

The vibration space 1 provided in the surface acoustic wave element 1
9 was formed by adjusting the thickness of the first and second frame-shaped members 5 and 12 and the thickness of the first and second pad electrodes 4 and 11.

Further, the sealing and the bonding are performed by heating while pressing so that the distance between the surface acoustic wave element and the circuit board 10 is constant and air bubbles are caught in the bonding surface and sealed. This is to avoid the deterioration of sex.

As described above, according to the first embodiment, the outer peripheral portion of the piezoelectric substrate 1 and the circuit board 1 facing it.
At the time of sealing, by arranging the frame-shaped members 5 and 12 having the discontinuous portions 6 and 13 at least at one location on the outer peripheral portion of 0, and sealing the discontinuous portions 6 and 13 after bonding them to each other. Then, since the discontinuous portions 6 and 13 of the frame-shaped members 5 and 12 are in the open state, the internal pressure does not rise, and the frame-shaped members 5 and 12 do not bulge outward, so that appearance defects can be reduced, and
It is possible to obtain a function and effect that a small CSP type surface acoustic wave device in which the surface acoustic wave element and the circuit board 10 have substantially the same shape can be configured.

(Embodiment 2) Claims 1, 17, 22, and 23 of the present invention will be described below with reference to Embodiment 2 of the present invention. FIG. 2 is a perspective view of a surface acoustic wave element before assembling a surface acoustic wave device according to a second exemplary embodiment of the present invention.

In FIG. 2, the same components as those described in FIG. 1 of the first embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

Note that FIG. 2 schematically shows the configuration, and does not show the relative relationship between the thicknesses and dimensions.

The difference between the second embodiment and the first embodiment is the number of surface acoustic wave elements, the shapes of the first and second frame-shaped members surrounding the surface acoustic wave elements, and the other points. The same operation as in the first embodiment was performed.

That is, in the first embodiment, one surface acoustic wave element is surrounded by the first and second frame members, but in the second embodiment, the same piezoelectric substrate is used. Two surface acoustic wave elements are formed in each of them, each surface acoustic wave element is separately surrounded by one frame-shaped member, and they are combined.

More specifically, the elasticity of the comb-shaped electrode 2, the reflector electrode 3, the first pad electrode 4, the first flow blocking pattern 7, and the second flow blocking pattern 8 on the same piezoelectric substrate 20. One surface acoustic wave element has at least one discontinuous portion 6
Two surface acoustic wave elements surrounded by a third frame-shaped member 21 having the following are provided, and the first pad electrode 4 and the circuit board 10 formed in a shape facing the third frame-shaped member 21 are provided. The surface acoustic wave device is joined and sealed so that the surface acoustic wave device is in a face-down state.

The discontinuous portion 6 provided on the third frame member 21 is provided at a portion other than the portion where the two sets of surface acoustic wave elements are close to each other.

With this structure, the two sets of surface acoustic wave elements are surrounded by the respective metal frame members, so that the surface acoustic wave elements are independently sealed. In addition, it is possible to block the intrusion of electromagnetic waves and noise from the surroundings. Therefore, the durability of each surface acoustic wave element can be enhanced, and even if a failure occurs inside the surface acoustic wave element itself, the effect is confined inside one surface acoustic wave element and the other surface acoustic wave elements are affected. You can avoid it.

As described above, in the second embodiment of the present invention, two surface acoustic wave elements are formed on the same piezoelectric substrate 20,
Each of the surface acoustic wave elements is separately provided as a single frame-shaped member 21.
It is a combination of them,
Compared with the first embodiment, the individual surface acoustic wave elements are more robust and excellent in durability, and a small surface acoustic wave device having stable characteristics can be obtained.

(Third Embodiment) Hereinafter, the third embodiment of the present invention will be used to describe claims 24 to 34, 36 and 37 of the present invention.
Will be described. FIG. 3 is a perspective view of a surface acoustic wave element before assembling a surface acoustic wave device according to a third exemplary embodiment of the present invention.

In FIG. 3, the same components as those described in FIG. 1 of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

Note that FIG. 3 schematically shows the structure, and does not show the relative relationship between the thicknesses and dimensions.

The difference between the third embodiment and the first embodiment is the shape of the first and second frame-shaped members and the construction method, and the other operations are the same as those of the first embodiment. I went.

That is, in the first embodiment, the surface acoustic wave element is configured such that at least one portion is surrounded by the first and second frame-shaped members having discontinuous portions and sealed at atmospheric pressure. However, in the third embodiment, the surface acoustic wave element is surrounded by the continuous third and fourth frame-shaped members and sealed under reduced pressure.

Specifically, the comb-teeth-shaped electrode 3 is formed on the piezoelectric substrate 1.
1, the reflector electrode 32, the first pad electrode 33, the continuous third frame-shaped member 34, the first flow blocking pattern 35, and the second flow blocking pattern 36 are formed in the same manner as in the first embodiment. .

On the circuit board 10, the second pad electrode 41,
The fourth frame member 42 and the third flow blocking pattern 43 that are continuous are formed in the same manner as in the first embodiment.

The surface acoustic wave element assembly thus obtained and the circuit board assembly are opposed to each other, their positions are adjusted, and the surface acoustic wave element assembly is inverted on the circuit board assembly to bring the surface down state. So that they overlap, about 1MP
The surface acoustic wave element assembly and the circuit board assembly are pressed into place with a predetermined pressure so that the surface acoustic wave element assembly and the circuit board assembly are inserted into the closed container.
Reduce the pressure to 10 ³ Pa with a vacuum pump, and then 350
By heating at a temperature of 5 ° C. for 5 minutes, the surface acoustic wave element assembly and the circuit board assembly in which the first connection member 37 and the second connection member 44 are melted and faced each other are sealed. Then, the pressure is returned to atmospheric pressure, and the surface acoustic wave device is cut into pieces each having a predetermined size by using a dicing device or the like.

By enclosing the surface acoustic wave element with a continuous frame-like member, the sealing performance is improved, but if it is sealed as it is, the internal pressure increases and the connecting members 37 and 44 bulge outward, deteriorating the sealing performance. By sealing under reduced pressure, outward expansion of the connection members 37, 44 can be prevented and, at the same time, the sealing performance can be improved.

[0106] Here, the pressure in the pressure reduction is the connecting member 37, 44 when lower than atmospheric pressure may be any pressure since it does not inflate to the outside, since the gas by heating under reduced pressure is generated, the influence 10 ⁴ Pa to avoid
It is desirable to reduce the pressure to some degree.

As described above, the third embodiment of the present invention
According to the first and second flow blocking patterns 35, 36,
By enclosing the surface acoustic wave device provided with the third and fourth frame-shaped members 34 and 42 in succession and sealing under reduced pressure,
Since the connection members 9 and 15 do not swell to the outside and the appearance defect can be reduced, and the sealing performance is improved by surrounding the periphery with the continuous frame-shaped members 34 and 42, the pressure is reduced as compared with the first embodiment. Although a step is required, since the sealing property can be further enhanced, weather resistance such as moisture resistance can be further enhanced.

(Embodiment 4) The claim 35 of the present invention will be described below with reference to Embodiment 4 of the present invention.
FIG. 4 is a perspective view of a surface acoustic wave element before assembling a surface acoustic wave device according to a fourth exemplary embodiment of the present invention. 4, the same components as those described in FIG. 1 of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.
Note that FIG. 4 schematically shows the configuration, and does not show the relative relationship between the thicknesses and dimensions.

The differences between the fourth embodiment and the first embodiment are the number of surface acoustic wave elements, the shapes of the first and second frame members surrounding the surface acoustic wave elements, and the method of sealing. Yes, the other operations were the same as those in the first embodiment.

That is, in the first embodiment, one surface acoustic wave element is surrounded by a frame-shaped member having at least one discontinuous portion, but in the fourth embodiment, it is the same. In this structure, two surface acoustic wave elements are formed on a piezoelectric substrate, each surface acoustic wave element is separately surrounded by a continuous frame-shaped member, which are combined and sealed under reduced pressure.

Specifically, the comb-teeth-shaped electrode 31, the reflector electrode 32, the first pad electrode 33, the first flow blocking pattern 35, and the second flow blocking pattern 3 are formed on the same piezoelectric substrate 51.
Two sets of surface acoustic wave elements each having a surface acoustic wave element made of 6 surrounded by one continuous third frame-shaped member 52 are provided in close proximity,
The surface acoustic wave device is arranged so that the surface acoustic wave device is in a face-down state by facing the circuit board 10 formed in a shape facing the first pad electrode 33 and the third frame-shaped member 52, adjusting their positions, and stacking them. After sealing under reduced pressure, cutting is performed to obtain individual surface acoustic wave devices. The steps after the sealing were performed under the same conditions as in the third embodiment.

As described above, according to the fourth embodiment, two surface acoustic wave elements are formed on the same piezoelectric substrate 51, and each surface acoustic wave element is continuously connected to the frame-shaped member 52. By surrounding them with each other and sealing them under reduced pressure, since two sets of surface acoustic wave elements are surrounded by different metal frame members 52, the respective surface acoustic wave elements are independent. As a result, it is possible to maintain the airtightness and block the invasion of electromagnetic waves and noise from the surroundings.

Further, by sealing under reduced pressure, the connection members 37 and 44 do not swell from the outside and the appearance defect can be reduced. Therefore, compared with the first embodiment, a step of reducing the pressure is required, but the sealing property is reduced. Further, it is possible to obtain a function and effect that each surface acoustic wave element is more robust and has excellent durability, and a small surface acoustic wave device having stable characteristics can be obtained.

[0114]

As described above, according to the present invention, a frame-shaped member having at least one discontinuous portion is provided on the outer peripheral portion of the piezoelectric substrate and the outer peripheral portion of the circuit substrate facing the piezoelectric substrate, and the frame-shaped members are bonded to each other. After that, by sealing the discontinuous portion, the internal pressure does not rise because the discontinuous portion of the frame-shaped member is in an open state at the time of sealing, and the frame-shaped member does not bulge outward, thereby reducing appearance defects. In addition, it is possible to obtain a small CSP type surface acoustic wave device in which the surface acoustic wave element and the circuit board have substantially the same shape.

[Brief description of drawings]

FIG. 1 is a perspective view before assembling a surface acoustic wave device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a surface acoustic wave element before assembling a surface acoustic wave device according to a second embodiment of the present invention.

FIG. 3 is a perspective view before assembling the surface acoustic wave device according to the third embodiment of the present invention.

FIG. 4 is a perspective view of a surface acoustic wave element before assembling a surface acoustic wave device according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view of a surface acoustic wave device in a conventional example.

[Explanation of symbols]

1 Piezoelectric substrate 2 Comb-shaped electrodes 3 reflector electrode 4 First pad electrode 5 First frame-shaped member 6 discontinuities 7 First flow blocking pattern 8 Second flow blocking pattern 9 First connection member 10 circuit board 11 Second pad electrode 12 Second frame-shaped member 13 discontinuous part 14 Third flow blocking pattern 15 Second connection member 16 notch 17 Third Connection Member 18 External electrode 19 vibration space 20 Piezoelectric substrate 21 Third Frame Member 31 Comb-shaped electrode 32 reflector electrode 33 Third pad electrode 34 Third Frame Member 35 First flow blocking pattern 36 Second flow blocking pattern 37 First Connection Member 41 Fourth pad electrode 42 Fourth Frame Member 43 Third Flow Blocking Pattern 44 Second Connection Member 45 External electrode 46 Vibration space

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/08 H01L 23/08 C H03H 3/08 H03H 3/08

Claims (37)

[Claims] 1. A surface acoustic wave device comprising a piezoelectric substrate provided with comb-teeth-shaped electrodes, a reflector electrode and a first pad electrode, and a circuit board on which the surface acoustic wave device is mounted. The element and the circuit board are opposed to each other, a second pad electrode is provided on the circuit board at a position opposed to the first pad electrode, and a comb-shaped electrode, a reflector electrode and a first pad on the piezoelectric substrate are provided. A first frame-shaped member having at least one discontinuous portion is provided on the outer peripheral portion of the electrode, and at least one position has a discontinuous portion at a position facing the first frame-shaped member on the circuit board. A second frame-shaped member is provided, and the first pad electrode and the second pad electrode are electrically connected to each other, and the first frame-shaped member and the second frame-shaped member are electrically connected to each other. It connects to form a vibration space and seals the discontinuous part of the frame-shaped member. Stopped surface acoustic wave device. 2. The surface acoustic wave according to claim 1, wherein a part of the first pad electrode is connected to a first frame-shaped member having a discontinuous portion provided in at least one location provided on the surface acoustic wave element. apparatus. 3. The first pad electrode connected to a first frame-shaped member having a discontinuity at least at one location provided on the surface acoustic wave element is connected to a ground terminal. Surface acoustic wave device. 4. The surface acoustic wave according to claim 1, wherein a part of the second pad electrode is connected to a second frame-shaped member provided on the circuit board and having at least one discontinuous portion. apparatus. 5. The second pad electrode, which is connected to a second frame-shaped member having a discontinuous portion at least at one place provided on the circuit board, is connected to a ground terminal. Surface acoustic wave device. 6. The surface acoustic wave device according to claim 1, wherein the first and second frame-shaped members are made of metal. 7. The first frame-shaped member is at least Al, Al
The surface acoustic wave device according to claim 6, which is one of an alloy and Ti. 8. The surface acoustic wave device according to claim 6, wherein the second frame-shaped member is at least W or Ag. 9. The surface acoustic wave device according to claim 1, wherein the first connecting member is provided on the first pad electrode, and the second connecting member is provided on the second pad electrode. 10. The surface acoustic wave device according to claim 9, wherein the first connecting member and the second connecting member are made of metal. 11. The metal is at least Ni, Au, Au--.
Sn, Au-Sn-alloy with other metal, Au-Pt, A
The surface acoustic wave device according to claim 10, wherein the surface acoustic wave device is u-Pt-an alloy with another metal or Pb-Sn solder. 12. A first pad electrode of a surface acoustic wave element and a first frame-shaped member having a discontinuous portion at least at one location are provided between the first pad electrode and the first frame-shaped member for stopping the flow of the first frame-shaped member. The surface acoustic wave device according to claim 1, wherein the flow prevention pattern is provided. 13. The first flow-preventing pattern has a narrow connecting portion at both ends and a wide connecting portion.
The surface acoustic wave device according to. 14. The second flow blocking pattern for stopping the flow of the first connecting member is provided between the comb-teeth-shaped electrode of the surface acoustic wave element and the first pad electrode. Surface acoustic wave device. 15. The second flow-preventing pattern has a narrow connecting portion at both ends and a wide connecting portion.
The surface acoustic wave device according to. 16. The first and second pad electrodes and the first and second frame-shaped members are connected to each other by thermocompression bonding.
The surface acoustic wave device according to. 17. The surface acoustic wave device according to claim 1, wherein one surface acoustic wave element is surrounded by one first frame-shaped member having a discontinuous portion at least at one location, and a plurality of them are combined. 18. A first and a second having at least one discontinuous portion provided on at least a piezoelectric substrate and a circuit substrate.
The surface acoustic wave device according to claim 1, wherein the discontinuous portion of the frame-shaped member is connected and sealed by a third connecting member. 19. The surface acoustic wave device according to claim 18, wherein the third connecting member contains a metal. 20. The metal is any one of Au—Sn, Au—Sn—an alloy with another metal, Au—Pt, Au—Pt—an alloy with another metal, and Pb—Sn solder. The surface acoustic wave device described. 21. The surface acoustic wave device according to claim 1, wherein the material of the circuit board is ceramic, glass, or resin. 22. A step of providing a comb-teeth electrode, a reflector electrode and a first pad electrode on a piezoelectric substrate, and an outer peripheral portion of the comb-teeth electrode, the reflector electrode and the first pad electrode on the piezoelectric substrate. A step of forming a first frame-shaped member having a discontinuous portion at least at one position, a step of providing an external electrode on the circuit board, and a step of forming a second electrode on the circuit board at a position facing the first pad electrode. The step of providing a pad electrode, the step of providing a second frame-shaped member having a discontinuous portion at least at one position on the circuit board, the position facing the first frame-shaped member, and the first pad. A step of joining the electrodes and the second pad electrodes to each other and the first frame-shaped member and the second frame-shaped members to each other; a step of connecting and sealing the discontinuous portion with a third connecting member; A method of manufacturing a surface acoustic wave device, comprising the step of cutting into pieces. 23. The surface acoustic wave according to claim 22, wherein the method of joining the first pad electrode and the second pad electrode together and the method of joining the first frame member and the second frame member together is thermocompression bonding. Device manufacturing method. 24. A surface acoustic wave element comprising a piezoelectric substrate provided with comb-teeth electrodes, a reflector electrode, and a first pad electrode.
A circuit board on which the surface acoustic wave element is mounted, the surface acoustic wave element and the circuit board are opposed to each other, and a second pad electrode is provided on the circuit board at a position opposed to the first pad electrode. The first pad electrode and the second pad electrode are joined to electrically connect to each other to form a vibrating space, and the comb-teeth electrode, the reflector electrode, and the outer periphery of the first pad electrode on the piezoelectric substrate are formed. A continuous third frame-shaped member, and a continuous fourth frame-shaped member on the circuit board at a position facing the third frame-shaped member. Between the first pad electrode and the second pad electrode,
A surface acoustic wave device in which the third and fourth frame-shaped members are mutually joined and sealed. 25. The surface acoustic wave device according to claim 24, wherein a part of the first pad electrode provided on the surface acoustic wave element is connected to a continuous third frame-shaped member. 26. Of the first pad electrodes provided on the surface acoustic wave element, the first pad electrode connected to a continuous third frame member is connected to a ground terminal.
The surface acoustic wave device according to. 27. The surface acoustic wave device according to claim 24, wherein a part of the second pad electrode provided on the circuit board is connected to a continuous fourth frame-shaped member provided on the circuit board. 28. Of the second pad electrodes provided on the circuit board, the second pad electrodes connected to a continuous fourth frame-shaped member.
The surface acoustic wave device according to claim 24, wherein the pad electrode is connected to a ground terminal. 29. The first and second pad electrodes and the third and fourth frame members are connected to each other by thermocompression bonding.
4. The surface acoustic wave device according to item 4. 30. The surface acoustic wave device according to claim 24, wherein the first connection member is provided on the first pad electrode, and the second connection member is provided on the second pad electrode. 31. The surface acoustic wave device according to claim 30, wherein the first and second connecting members are made of metal. 32. The metal is at least Ni, Au, Au-.
Sn, Au-Sn-alloy with other metal, Au-Pt, A
32. The surface acoustic wave device according to claim 31, which is one of u-Pt-an alloy with another metal and Pb-Sn solder. 33. A third flow blocking pattern for stopping the flow of the third frame-shaped member is provided between the comb-shaped electrode of the surface acoustic wave element and the third frame-shaped member continuous with the electrode. Item 2
4. The surface acoustic wave device according to item 4. 34. The fourth flow blocking pattern for stopping the flow of the first connecting member is provided between the comb-teeth-shaped electrode of the surface acoustic wave element and the first pad electrode. Surface acoustic wave device. 35. The surface acoustic wave device according to claim 24, wherein one surface acoustic wave element is surrounded by one continuous third frame-shaped member, and a plurality of them are combined. 36. The pressure for bonding and sealing the first pad electrode and the second pad electrode, and the third and fourth frame-shaped members to each other under reduced pressure is set to be lower than atmospheric pressure. The surface acoustic wave device according to claim 24. 37. A step of providing a comb-teeth electrode, a reflector electrode, and a first pad electrode on a piezoelectric substrate, and an outer peripheral portion of the comb-teeth electrode, the reflector electrode, and the first pad electrode on the piezoelectric substrate. A step of forming a continuous third frame-shaped member, a step of providing an external electrode on the circuit board, and a step of providing a second pad electrode on the circuit board at a position facing the first pad electrode. Providing a continuous fourth frame-shaped member at a position facing the third frame-shaped member on the circuit board; and, under reduced pressure, the first pad electrode and the second pad electrode, and the third pad electrode. A method for manufacturing a surface acoustic wave device, comprising: a step of joining and sealing the frame-shaped member and the fourth frame-shaped member together; and a step of cutting.